TWI819335B - Circuit board and method for manufacturing the same - Google Patents

Abstract

A method for manufacturing a circuit board, comprising providing an inner circuit board. Forming a first intermediate circuit substrate and a second intermediate circuit substrate on the inner circuit substrate. The first intermediate circuit substrate includes a first intermediate circuit layer. The first intermediate circuit layer includes a carrying portion and a connecting portion. Forming a through hole penetrating through the first intermediate circuit substrate, the inner layer circuit substrate, and the second intermediate circuit substrate. The carrying portion protrudes from the through hole. Putting a ceramic sheet in the through hole and on the carrying portion. Putting an electronic component in the through hole and on the ceramic sheet. Forming a first outer circuit substrate on the first intermediate circuit substrate. Forming a second outer layer circuit substrate. Forming a connecting block on the first outer layer circuit substrate, and forming a connecting conductive hole on the second outer layer circuit substrate. The present disclosure also provides a circuit board.

Description

Circuit board manufacturing method and circuit board

The present application relates to the field of circuit board manufacturing, and in particular to a circuit board manufacturing method and circuit board.

As people's demand for various electronic products such as computers, consumer electronics, and communications increases, and as the functions of electronic products become diversified, the electronic components in electronic products are becoming more and more centralized. As the circuit board serves as the support and carrier for the electrical connection of electronic components, heat dissipation has become a huge problem faced by the circuit board industry.

Due to limitations in the manufacturing process of existing circuit boards with embedded components, the heat dissipation performance of the embedded electronic components is poor.

Therefore, it is necessary to provide a circuit board manufacturing method and circuit board with good heat dissipation performance to solve the above problems.

A method of manufacturing a circuit board, including the following steps: providing an inner circuit substrate; forming a first intermediate circuit substrate and a second intermediate circuit substrate on opposite surfaces of the inner circuit substrate, the first intermediate circuit substrate It includes a first intermediate circuit layer, the first intermediate circuit layer includes a carrying part and a connecting part connected to the carrying part; formed through the first intermediate circuit base The through holes of the board, the inner circuit substrate and the second intermediate circuit substrate, the bearing part protrudes from the through hole; a ceramic piece is provided, placed in the through hole and placed on the bearing part; a ceramic piece is provided, Electronic components are placed in the through holes and on the ceramic sheet; a first outer circuit substrate is formed on the surface of the first intermediate circuit substrate, and the first outer circuit substrate covers the ceramic sheet; a second outer circuit substrate is formed An outer circuit substrate is on the surface of the second intermediate circuit substrate, and the second outer circuit substrate covers the electronic components; a connecting block connecting the ceramic sheets is formed on the first outer circuit substrate, and the second outer circuit substrate is formed on the first outer circuit substrate. Conductive holes connecting the electronic components are formed on the two outer circuit substrates.

In some embodiments, the step of forming the first intermediate circuit substrate and the second intermediate circuit substrate includes: providing a first copper-clad board and a second copper-clad board, the first copper-clad board including a stacked first inner layer. a dielectric layer and a first copper layer, and the second copper-clad laminate includes a stacked second inner dielectric layer and a second copper layer; the first copper-clad laminate and the second copper-clad laminate are respectively covered on Two opposite surfaces of the inner circuit substrate are formed; blind holes are formed through the first copper-clad board; circuit production is performed on the first copper layer to form the first intermediate circuit layer, and the second copper layer is Conduct circuit fabrication to form a second intermediate circuit layer; the first intermediate circuit layer fills the blind hole to form the connecting portion and forms the carrying portion protruding from the connecting portion.

In some embodiments, the first outer circuit substrate includes a first outer dielectric layer and a first outer circuit layer, and the connecting block penetrates the first outer dielectric layer and is electrically connected to the first outer layer. Circuit layer; the second outer circuit substrate includes a second outer dielectric layer and a second outer circuit layer, and the conductive holes penetrate the second outer dielectric layer and are electrically connected to the second outer circuit layer.

In some embodiments, the first outer circuit substrate includes a first outer dielectric layer and a third copper layer, and the second outer circuit substrate includes a second outer dielectric layer and a fourth copper layer; the manufacturing method It also includes: performing circuit fabrication on the third copper layer to form a first outer circuit layer and the connecting block passing through the first outer dielectric layer, and performing circuit fabrication on the fourth copper layer to form a second outer circuit layer. The outer circuit layer and the conductive hole penetrated through the second outer dielectric layer.

In some embodiments, after the step of providing at least one ceramic sheet and placing it in the through hole and on the bearing part, the method further includes the step of: coating a surface of the ceramic sheet away from the first intermediate circuit layer. Cover with thermal paste.

A circuit board includes a first outer circuit substrate, a first intermediate circuit substrate, an inner circuit substrate, a second intermediate circuit substrate and a second outer circuit substrate stacked in sequence. The circuit board also includes at least one ceramic sheet and at least An electronic component, the ceramic sheet is stacked with the electronic component and penetrates the first intermediate circuit substrate, the inner circuit substrate and the second intermediate circuit substrate, the ceramic sheet is located close to the first middle circuit substrate One side of the circuit substrate is electrically connected to the first outer circuit substrate through a connecting block, and the electronic component is located on a side close to the second intermediate circuit substrate and is electrically connected to the second outer circuit substrate through conductive holes. ; Wherein, the circuit board also includes thermally conductive silicone surrounding at least part of the periphery of the ceramic sheet and the electronic component, the first intermediate circuit substrate includes a first intermediate circuit layer, and the first intermediate circuit layer includes A connecting part and a bearing part connected to the connecting part, the bearing part and the connecting part are connected to the ceramic piece, and the connecting part is connected to the thermally conductive silicone.

In some embodiments, the circuit board further includes thermally conductive glue located between the ceramic sheet and the electronic component.

In some embodiments, the first intermediate circuit substrate includes a stacked first intermediate dielectric layer and the first intermediate circuit layer; the second intermediate circuit substrate includes a stacked second intermediate dielectric layer and The second intermediate circuit layer.

In some embodiments, the first outer circuit substrate includes a stacked first outer dielectric layer and a first outer circuit layer, and the connecting block is disposed through the first outer dielectric layer and electrically connected to the first outer dielectric layer. a first outer circuit layer; the second outer circuit substrate includes a stacked second outer dielectric layer and a second outer circuit layer, and the conductive holes penetrate the second outer dielectric layer and are electrically connected to the The second outer circuit layer.

In some embodiments, the connecting part and the carrying part are perpendicular to each other.

The circuit board manufacturing method provided by this application can embed interconnected ceramic sheets and electronic components at the same time. The ceramic sheets and the electronic components are embedded in the circuit board at a high density. The ceramic sheets are used for The heat generated by the electronic components is quickly transferred out, that is, while the density of the embedded components is increased, the heat dissipation rate is also effectively increased; by arranging a first intermediate circuit substrate including a load-bearing part and a connection part connected to the load-bearing part, it is possible to Preventing the tendency of the first intermediate circuit layer and the first intermediate dielectric layer to separate; the carrying portion and the connecting portion are directly connected to the surface of the ceramic sheet, which can increase the contact area, thereby effectively improving the heat dissipation efficiency.

100:Circuit board

10: Inner circuit substrate

11: Inner dielectric layer

12: First inner circuit layer

13: The second inner circuit layer

30: First intermediate circuit substrate

31: First intermediate dielectric layer

32: First intermediate line layer

322:Connection part

324: Bearing part

35: The first copper clad laminate

352: First copper layer

355:Blind hole

40: Second intermediate circuit substrate

41: Second intermediate dielectric layer

42: Second intermediate line layer

45: Second copper clad plate

452: Second copper layer

50:Through hole

52:ceramic piece

54:Electronic components

56: Thermal conductive glue

60: First outer circuit substrate

61: First outer dielectric layer

62: First outer circuit layer

65: The third copper layer

70: Second outer circuit substrate

71: Second outer dielectric layer

72: Second outer circuit layer

75:The fourth copper layer

85: Connected block

86:Conductive hole

Figure 1 is a schematic cross-sectional view of an inner circuit substrate provided by an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of the first copper-clad laminate and the second copper-clad laminate respectively stacked on two opposite surfaces of the inner circuit substrate shown in FIG. 1 .

FIG. 3 is a schematic cross-sectional view after blind holes are formed on the surface of the first copper-clad plate shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view after the first copper layer and the second copper layer shown in FIG. 3 are respectively formed into a first intermediate circuit layer and a second intermediate circuit layer.

FIG. 5 is a schematic cross-sectional view after forming through holes through the first intermediate circuit substrate, the inner circuit substrate and the second intermediate circuit substrate shown in FIG. 4 .

FIG. 6 is a schematic cross-sectional view of a ceramic sheet installed in the through hole shown in FIG. 5 .

FIG. 7 is a schematic cross-sectional view after coating the surface of the ceramic sheet shown in FIG. 6 with thermally conductive adhesive.

FIG. 8 is a schematic cross-sectional view after electronic components are installed on the surface of the thermally conductive adhesive shown in FIG. 7 .

FIG. 9 is a schematic cross-sectional view of the first outer circuit substrate and the second outer circuit substrate respectively stacked on the surfaces of the first intermediate circuit substrate and the second intermediate circuit substrate shown in FIG. 8 .

Figure 10 is a cross-section of a circuit board obtained after forming connecting blocks connecting the ceramic sheets on the first outer circuit substrate shown in Figure 9 and forming conductive holes connecting the electronic components on the second outer circuit substrate Schematic diagram.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific implementation modes. It should be noted that, as long as there is no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Many specific details are set forth in the following description to facilitate a full understanding of the present application. The described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing specific embodiments only and is not intended to limit the application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In the various embodiments of the present application, in order to facilitate the description but not to limit the present application, the term "connection" used in the specification and scope of the patent application is not limited to physical or mechanical connection, whether direct or indirect. of. "Up", "Down", "Above", "Down", "Left", "Right", etc. are only used to express relative positional relationships. When the absolute position of the described object changes, the relative positional relationship will also change accordingly. change.

Referring to Figures 1 to 10, an embodiment of the present application provides a method for manufacturing a circuit board, which includes the following steps:

Step S1: Referring to Figure 1, an inner circuit substrate 10 is provided.

The inner circuit substrate 10 includes an inner dielectric layer 11, a first inner circuit layer 12 and a second inner circuit layer 13 located on opposite surfaces of the inner dielectric layer 11. Part of the inner dielectric layer 11 is exposed on the surfaces of the first inner circuit layer 12 and the second inner circuit layer 13 . The inner circuit substrate 10 further includes conductive holes (not shown) for electrically connecting the first inner circuit layer 12 and the second inner circuit layer 13 .

Step S2: Referring to FIGS. 2 to 4 , a first intermediate circuit substrate 30 and a second intermediate circuit substrate 40 are respectively formed on two opposite surfaces of the inner circuit substrate 10 . The first intermediate circuit substrate 30 includes a first intermediate circuit substrate 30 and a second intermediate circuit substrate 40 . The first intermediate circuit layer 32 includes a carrying portion 324 and a connecting portion 322 connected to the carrying portion 324 .

The steps of forming the first intermediate circuit substrate 30 and the second intermediate circuit substrate 40 may include steps S21-S24.

Step S21: Please refer to FIG. 2 to provide a first copper-clad plate 35 and a second copper-clad plate 45. The first copper-clad plate 35 includes a first intermediate dielectric layer 31 and a first copper layer 352 arranged in a stack. The copper clad laminate 45 includes a stacked second intermediate dielectric layer 41 and a second copper layer 452 .

The first copper clad laminate 35 and the second copper clad laminate 45 are both single-sided copper clad laminates.

Step S22: Cover the first copper clad laminate 35 and the second copper clad laminate 45 on two opposite surfaces of the inner circuit substrate 10, and the first intermediate dielectric layer 31 covers the inner dielectric layer. 11 and the first inner circuit layer 12 , the second intermediate dielectric layer 41 covers the inner dielectric layer 11 and the second inner circuit layer 13 .

Step S23: Referring to FIG. 3 , a blind hole 355 is formed through the first copper layer 352 and the first intermediate dielectric layer 31 .

Step S24: Referring to FIG. 4 , circuit fabrication is performed on the first copper layer 352 to form the first intermediate circuit layer 32 , and circuit fabrication is performed on the second copper layer 452 to form the second intermediate circuit layer 42 ; The first intermediate circuit layer 32 fills the blind holes 355 to form all the connections connecting the first intermediate dielectric layer 31 The connecting portion 322, the first intermediate circuit layer 32 also includes a bearing portion 324 protruding from the connecting portion 322, the protruding direction of the bearing portion 324 has a certain angle with the extending direction of the connecting portion 322, For example, right angle.

Step S3: Referring to FIG. 5 , a through hole 50 is formed through the first intermediate circuit substrate 30 , the inner circuit substrate 10 and the second intermediate circuit substrate 40 , and the connecting portion 322 is exposed to the through hole 50 , the carrying portion 324 protrudes from the through hole 50 .

Hole opening processing is performed to form the through holes 50 . Wherein, along the circuit substrate stacking direction, the surface of the connecting part 322 is exposed to the through hole 50 , and the carrying part 324 connected to the connecting part 322 protrudes from the through hole 50 .

Step S4: Referring to FIG. 6 , a ceramic piece 52 is provided, placed in the through hole 50 and placed on the carrying part 324 .

The bearing portion 324 and the connecting portion 322 form a bearing structure for bearing the ceramic sheet 52. At least part of the ceramic sheet 52 is connected to the bearing portion 324. The bearing portion 324 can be used to support the ceramic sheet 52. The ceramic piece 52 prevents the ceramic piece 52 from falling off from the through hole 50; in the process of supporting the ceramic piece 52 by the bearing portion 324, it can also avoid the first intermediate circuit layer 32 and the third intermediate circuit layer 32 when the force is too large. An intermediate dielectric layer 31 has a tendency to separate, and the connecting portion 322 can contact the ceramic sheet 52 to prevent the first intermediate circuit layer 32 from being separated from the first intermediate dielectric layer 31 .

Step S5: Referring to FIGS. 7 to 8 , an electronic component 54 is provided, placed in the through hole 50 and placed on the ceramic sheet 52 .

The electrical connection end of the electronic component 54 is disposed toward one side of the second intermediate circuit layer 42 to facilitate subsequent electrical connection with the second intermediate circuit layer 42 .

Referring to FIG. 7 , in some embodiments, before placing the electronic component 54 on the ceramic sheet 52 , it may also include placing a surface on the ceramic sheet 52 away from the first intermediate circuit layer 32 Apply thermal paste 56. The thermally conductive glue 56 is used to bond the ceramic sheet 52 and the electronic components. 54; The thermally conductive glue 56 has a thermal conductive effect, so as to quickly transfer the heat generated by the electronic component 54 to the ceramic piece 52, so that the ceramic piece 52 plays a heat dissipation effect; at the same time, the thermally conductive glue 56 solidifies It also has a certain degree of flexibility and has a buffering effect to prevent damage caused by rigid contact between the ceramic sheet 52 and the electronic component 54 .

Step S6: Referring to FIG. 9, a first outer circuit substrate 60 is formed on the surface of the first intermediate circuit substrate 30, and the first outer circuit substrate 60 covers the ceramic sheet 52; a second outer circuit substrate 70 is formed on the surface of the first intermediate circuit substrate 30. The second outer circuit substrate 70 covers the surface of the second intermediate circuit substrate 40 and the electronic component 54 .

In this embodiment, the first outer circuit substrate 60 may include a first outer dielectric layer 61 and a third copper layer 65. The third copper layer 65 may form a first outer circuit layer 62 in subsequent processing; The second outer circuit substrate 70 may include a second outer dielectric layer 71 and a fourth copper layer 75. The fourth copper layer 75 may form a second outer circuit layer 72 in subsequent processing. That is, the first outer circuit substrate 60 and the second outer circuit substrate 70 are both single-sided copper clad laminates.

In some embodiments, the first outer circuit substrate 60 further includes a plurality of metal thermal vias (not shown), and each of the carrying portions 324 is connected to the third copper layer 65 through at least one metal thermal via. To enhance the heat dissipation capability of the circuit board 100 .

In other embodiments, the first outer circuit substrate 60 may also include a first outer dielectric layer 61 and a first outer circuit layer 62; the second outer circuit substrate 70 may also include a second outer dielectric layer. 71 and the second outer circuit layer 72.

The first outer dielectric layer 61 is connected to the first intermediate circuit substrate 30 and covers the ceramic sheet 52; the second outer dielectric layer 71 is connected to the second intermediate circuit substrate 40 and covers the Electronic components 54.

Step S7: Referring to Figure 10, a connecting block 85 connected to the ceramic sheet 52 is formed on the first outer circuit substrate 60, and a conductive hole connected to the electronic component 54 is formed on the second outer circuit substrate 70. 86.

Please refer to Figure 10 again. This application also provides a circuit board 100. The circuit board 100 includes a first outer circuit substrate 60, a first intermediate circuit substrate 30, an inner circuit substrate 10, and a second intermediate circuit substrate stacked in sequence. 40 and the second outer circuit substrate 70. The circuit board 100 also includes at least one ceramic sheet 52 and at least one that penetrates the first intermediate circuit substrate 30, the inner circuit substrate 10 and the second intermediate circuit substrate 40. An electronic component 54, the ceramic sheet 52 is located on a side close to the first intermediate circuit substrate 30, the electronic component 54 is located on a side close to the second intermediate circuit substrate 40, the ceramic sheet 52 and the The first outer circuit substrate 60 is connected to facilitate rapid heat conduction, and the electronic component 54 is electrically connected to the second outer circuit substrate 70 through the conductive holes 86 .

The inner circuit substrate 10 includes an inner dielectric layer 11 , a first inner circuit layer 12 and a second inner circuit layer 13 located on opposite surfaces of the inner dielectric layer 11 . The ceramic sheet 52 and/or the electronic component 54 penetrates the first inner circuit layer 12 , the inner dielectric layer 11 , and the second inner circuit layer 13 .

The first intermediate circuit substrate 30 includes a stacked first intermediate dielectric layer 31 and a first intermediate circuit layer 32. The first intermediate dielectric layer 31 connects the inner dielectric layer 11 and the first intermediate circuit layer 32. Inner circuit layer 12, the first intermediate circuit layer 32 is located on the surface of the first intermediate dielectric layer 31 facing away from the inner circuit substrate 10. The first intermediate circuit layer 32 includes a connecting portion 322 and a bearing portion 324 connected to the connecting portion 322. The connecting portion 322 is penetrated through the first intermediate dielectric layer 31 and connected to the ceramic sheet 52, so The bearing portion 324 is located at the peripheral edge of the ceramic sheet 52 away from the electronic component 54 and supports the ceramic sheet 52; the connecting portion 322 and the bearing portion 324 are both connected to the ceramic sheet 52, thereby further improving the ceramic sheet. 52 thermal conductivity.

The second intermediate circuit substrate 40 includes a stacked second intermediate dielectric layer 41 and a second intermediate circuit layer 42. The second intermediate dielectric layer 41 connects the inner dielectric layer 11 and the second intermediate circuit layer 42. The inner circuit layer 13 and the second intermediate circuit layer 42 are located on the surface of the second intermediate dielectric layer 41 facing away from the inner circuit substrate 10 .

The first outer circuit substrate 60 includes a stacked first outer dielectric layer 61 and a first outer circuit layer 62. The first outer dielectric layer 61 connects the first intermediate dielectric layer 31 and the first outer circuit layer 62. An intermediate circuit layer 32 , the first outer circuit layer 62 is located on the surface of the first outer dielectric layer 61 facing away from the first intermediate circuit substrate 30 .

The second outer circuit substrate 70 includes a stacked second outer dielectric layer 71 and a second outer circuit layer 72. The second outer dielectric layer 71 connects the second intermediate dielectric layer 41 and the second outer circuit layer 72. Two intermediate circuit layers 42 , the second outer circuit layer 72 is located on the surface of the second outer dielectric layer 71 facing away from the second intermediate circuit substrate 40 .

The first outer circuit layer 62 is also connected to the connecting block 85. The connecting block 85 is passed through the first outer dielectric layer 61. The connecting block 85 is directly connected to the ceramic sheet 52, so The connecting block 85 is also directly connected to the first outer circuit substrate 60, so that the heat generated by the electronic component 54 can be quickly transferred to the first outer circuit substrate 60 through the ceramic sheet 52, thereby quickly dissipating the heat. The second outer circuit layer 72 is also connected to the conductive hole 86, which penetrates the second outer dielectric layer 71. The conductive hole 86 is electrically connected to the electronic component 54, so The conductive holes 86 are also electrically connected to the second intermediate circuit substrate 40 .

The circuit board 100 further includes a thermally conductive adhesive 56 located between the ceramic sheet 52 and the electronic component 54 . The thermally conductive adhesive 56 is used to bond the ceramic sheet 52 and the electronic component 54; the thermally conductive adhesive 56 also has a certain degree of flexibility and has a buffering effect to prevent damage to the ceramic sheet 52 and the electronic component 54. .

The inner dielectric layer 11, the first middle dielectric layer 31, the second middle dielectric layer 41, the first outer dielectric layer 61 and the second outer dielectric layer 71 can all be selected from polypropylene, epoxy resin , at least one of polyurethane, phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin, unsaturated resin, polyimide and other materials.

The manufacturing method of the circuit board 100 provided by this application can embed interconnected ceramic sheets 52 and electronic components 54 at the same time. The ceramic sheets 52 and the electronic components 54 are embedded in the circuit board 100 at a high density. The ceramic sheet 52 is used to quickly transfer the heat generated by the electronic component 54 , that is, while increasing the density of the embedded components, it also effectively increases the heat dissipation rate; The first intermediate circuit substrate 30 of the connecting portion 322 can prevent the first intermediate circuit layer 32 from being separated from the first intermediate dielectric layer 31; the carrying portion 324 and the connecting portion 322 are directly connected to the surface of the ceramic sheet 52 , can increase the contact area, thereby effectively improving heat dissipation efficiency.

The above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced. None should deviate from the spirit and scope of the technical solution of this application.

100:Circuit board

10: Inner circuit substrate

11: Inner dielectric layer

12: First inner circuit layer

13: The second inner circuit layer

30: First intermediate circuit substrate

31: First intermediate dielectric layer

32: First intermediate line layer

322:Connection part

324: Bearing part

40: Second intermediate circuit substrate

41: Second intermediate dielectric layer

42: Second intermediate line layer

52:ceramic piece

54:Electronic components

56: Thermal conductive glue

60: First outer circuit substrate

61: First outer dielectric layer

62: First outer circuit layer

70: Second outer circuit substrate

71: Second outer dielectric layer

72: Second outer circuit layer

85: Connected block

86:Conductive hole

Claims (9)

A method for manufacturing a circuit board, the improvement of which is that it includes the following steps: providing an inner circuit substrate; forming a first intermediate circuit substrate and a second intermediate circuit substrate on two opposite surfaces of the inner circuit substrate, and the third intermediate circuit substrate An intermediate circuit substrate includes a first intermediate circuit layer, and the first intermediate circuit layer includes a carrying part and a connecting part connected to the carrying part; it is formed through the first intermediate circuit substrate, the inner layer circuit substrate and the third Two through holes of the intermediate circuit substrate, the carrying part protrudes from the through hole; a ceramic piece is provided, placed in the through hole and placed on the carrying part; an electronic component is provided, placed in the through hole holes and placed on the ceramic sheet; forming a first outer circuit substrate on the surface of the first intermediate circuit substrate, the first outer circuit substrate covering the ceramic sheet; forming a second outer circuit substrate on the second The surface of the intermediate circuit substrate, the second outer circuit substrate covers the electronic component; and a connecting block connecting the ceramic sheet is formed on the first outer circuit substrate, and a connection is formed on the second outer circuit substrate Conductive holes of the electronic components. The manufacturing method of a circuit board according to claim 1, wherein the step of forming the first intermediate circuit substrate and the second intermediate circuit substrate includes: providing a first copper clad laminate and a second copper clad laminate, the first The copper-clad board includes a stacked first inner dielectric layer and a first copper layer, and the second copper-clad board includes a stacked second inner dielectric layer and a second copper layer; the first copper-clad board and The second copper-clad board respectively covers two opposite surfaces of the inner circuit substrate; blind holes are formed through the first copper-clad board; and Conduct circuit fabrication on the first copper layer to form the first intermediate circuit layer, conduct circuit fabrication on the second copper layer to form a second intermediate circuit layer; the first intermediate circuit layer fills the blind holes to form the second intermediate circuit layer. The connecting part forms the carrying part protruding from the connecting part. The manufacturing method of a circuit board according to claim 1, wherein the first outer circuit substrate includes a first outer dielectric layer and a first outer circuit layer, and the connecting block is disposed through the first outer dielectric layer. layer and is electrically connected to the first outer circuit layer; the second outer circuit substrate includes a second outer dielectric layer and a second outer circuit layer, and the conductive holes are penetrated through the second outer dielectric layer and are electrically connected Connect the second outer circuit layer. The manufacturing method of a circuit board according to claim 1, wherein the first outer circuit substrate includes a first outer dielectric layer and a third copper layer, and the second outer circuit substrate includes a second outer dielectric layer and The fourth copper layer; the manufacturing method further includes: performing circuit fabrication on the third copper layer to form a first outer circuit layer and the connecting block passing through the first outer dielectric layer; Four copper layers are used for circuit fabrication to form a second outer circuit layer and the conductive holes that penetrate the second outer dielectric layer. The manufacturing method of a circuit board as claimed in claim 1, wherein after the step of providing at least one ceramic sheet and placing it in the through hole and on the bearing part, the method further includes the step of: placing the ceramic sheet away from the The surface of the first intermediate circuit layer is coated with thermal conductive glue. A circuit board, which is improved in that it includes a first outer circuit substrate, a first intermediate circuit substrate, an inner circuit substrate, a second intermediate circuit substrate and a second outer circuit substrate stacked in sequence, and the circuit board further includes at least one A ceramic sheet and at least one electronic component. The ceramic sheet is stacked with the electronic component and penetrates the first intermediate circuit substrate, the inner circuit substrate and the second intermediate circuit substrate. The ceramic sheet is located close to the One side of the first intermediate circuit substrate is electrically connected to the first outer circuit substrate through a connecting block, and the electronic component is located on a side close to the second intermediate circuit substrate and is connected to the second outer layer through conductive holes. The circuit substrate is electrically connected; the first outer circuit substrate includes It includes a stacked first outer dielectric layer and a first outer circuit layer, the connecting block is disposed in the first outer dielectric layer and is electrically connected to the first outer circuit layer; the second outer circuit substrate It includes a stacked second outer dielectric layer and a second outer circuit layer, the conductive hole is disposed in the second outer dielectric layer and is electrically connected to the second outer circuit layer; wherein the circuit board further It includes thermally conductive silicone surrounding at least part of the periphery of the ceramic sheet and the electronic component. The first intermediate circuit substrate includes a first intermediate circuit layer. The first intermediate circuit layer includes a connecting portion and a connecting portion with the connecting portion. A connected bearing part, the bearing part and the connecting part are connected to the ceramic piece, and the connecting part is connected to the thermally conductive silicone. The circuit board according to claim 6, wherein the circuit board further includes thermally conductive glue, and the thermally conductive glue is located between the ceramic sheet and the electronic component. The circuit board of claim 6, wherein the first intermediate circuit substrate includes a stacked first intermediate dielectric layer and the first intermediate circuit layer; the second intermediate circuit substrate includes a stacked first intermediate circuit layer. two intermediate dielectric layers and the second intermediate circuit layer. The circuit board according to claim 6, wherein the connecting part and the carrying part are perpendicular to each other.

Images