CN112654134A

CN112654134A - Heat sensor substrate and heat sensor

Info

Publication number: CN112654134A
Application number: CN202011250632.5A
Authority: CN
Inventors: 徐纯刚; 吴付领; 李强
Original assignee: Shenzhen Kerui High Tech Materials Co ltd
Current assignee: Shenzhen Kerui High Tech Materials Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-04-13

Abstract

The invention discloses a heat sensor substrate, which comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating layer and a conducting layer, the heat sensor substrate also comprises a heat conducting plate, the heat conducting plate is provided with an installation groove, the shape of the copper-clad plate is the same as that of the installation groove, the copper-clad plate is embedded in the installation groove to form a composite plate, the surface of the composite plate is provided with an electroplated layer, an electronic circuit is formed on the electroplated layer and the conducting layer, through the design, a heat sensitive element is welded and fixed on a welding disc formed by the electroplated layer, the heat sensitive element is directly communicated with a heat path of the heat conducting plate through the electroplated layer, the heat conducting plate. The invention also relates to a thermal sensor comprising the thermal sensor substrate.

Description

Heat sensor substrate and heat sensor

Technical Field

The present invention relates to a thermal sensor, and more particularly, to a thermal sensor substrate.

Background

At present, the commonly used heat sensor substrate is made by adopting an insulation PCB copper clad laminate or a metal core PCB copper clad laminate such as FR4 and BT and the like through PCB design and production process. The insulating PCB copper clad plates such as FR4 and BT have lower comprehensive thermal conductivity due to the base material being a resin composite material, and the manufactured thermal sensor has lower thermal sensitivity; the metal core PCB copper-clad plate, because metal core PCB copper-clad plate core is the metal, therefore synthesize insulating PCB copper-clad plate such as thermal conductivity FR4, BT, etc., great promotion, the thermal sensitivity of the heat sensor of preparation is higher, but the thermal sensitivity still can not reach the high sensitive requirement of cell-phone heat sensor capture temperature.

Disclosure of Invention

In order to overcome the disadvantages of the prior art, an object of the present invention is to provide a thermal sensor substrate with high sensitivity for capturing temperature.

In order to overcome the disadvantages of the prior art, it is another object of the present invention to provide a thermal sensor with high sensitivity for capturing temperature.

One of the purposes of the invention is realized by adopting the following technical scheme:

the heat sensor substrate comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating layer and a conducting layer, the heat sensor substrate further comprises a heat conducting plate, the heat conducting plate is provided with an installation groove, the shape of the copper-clad plate is the same as that of the installation groove, the copper-clad plate is embedded in the installation groove to form a composite plate, an electroplated layer is arranged on the surface of the composite plate, and the electroplated layer and the conducting layer are manufactured into an electronic circuit.

Further, the plating layer is a copper layer.

Further, the thickness of the electroplated layer is more than 2 um.

Further, the heat conducting plate is a copper plate.

Further, the conducting layer is a copper foil.

Further, the copper plate and the copper foil of the conductive layer are integrated by the plating layer.

Furthermore, the surface of the copper clad plate and the surface of the heat conducting plate are positioned on the same plane.

Further, the electronic circuit of the thermal sensor substrate is a single-sided electronic circuit.

Further, the electronic circuit of the thermal sensor substrate is a double-sided electronic circuit.

The second purpose of the invention is realized by adopting the following technical scheme:

a heat sensor comprises a heat-sensitive element and a heat sensor substrate, wherein the heat-sensitive element is welded and fixed on a bonding pad formed by an electroplating layer on a metal heat-conducting plate.

Compared with the prior art, the heat sensor substrate further comprises a heat conducting plate, the heat conducting plate is provided with an installation groove, the shape of the copper-clad plate is the same as that of the installation groove, the copper-clad plate is inlaid in the installation groove to form a composite plate, an electroplated layer is arranged on the surface of the composite plate, an electronic circuit is formed on the electroplated layer and the conductive layer, through the design, the heat sensitive element is welded and fixed on a welding disc formed by the electroplated layer, the heat sensitive element is directly communicated with a heat path of the heat conducting plate through the electroplated layer, the heat conducting plate can quickly transfer the surrounding temperature to the heat sensitive element.

Drawings

FIG. 1 is a schematic structural view of a thermal sensor according to the present invention;

FIG. 2 is a schematic structural view of a heat conductive plate of the thermal sensor of FIG. 1;

FIG. 3 is a schematic structural diagram of a copper-clad plate of the thermal sensor of FIG. 1;

fig. 4 is a schematic structural view of the copper clad plate of fig. 3 laminated on a heat conducting plate to form a composite plate.

In the figure: 10. a heat conducting plate; 11. mounting grooves; 20. copper-clad plate; 30. electroplating layer; 40. a thermosensitive element; 50. an electronic circuit.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1 shows a thermal sensor of the present invention, which includes a thermal sensor substrate and a thermosensitive element 40 fixed to the thermal sensor substrate.

The thermal sensor substrate includes a heat-conducting plate 10, a copper-clad plate 20, and an electroplated layer 30.

The heat-conducting plate 10 is constructed as shown in fig. 2, and the heat-conducting plate 10 is provided with mounting grooves 11. The heat-conducting plate 10 is a metal plate having a thermal conductivity of 200W/m.k or more, such as an aluminum plate or a copper plate (preferably, a copper plate having a thermal conductivity of 380W/m.k or more).

The structure of the copper-clad plate 20 is shown in fig. 3, and the copper-clad plate 20 includes an insulating layer and a conductive layer. In this embodiment, the conductive layer is a copper foil. The shape of the copper-clad plate 20 corresponds to the shape of the mounting groove 11, and the thickness of the copper-clad plate 20 is the same as the depth of the mounting groove 11.

When the heat sensor substrate is manufactured, the copper-clad plate 20 is manufactured into small pieces, the copper-clad plate 20 is embedded into the mounting groove 11 of the heat conducting plate 10, and a pressing mold is adopted to press and flatten the copper-clad plate 20 and the heat conducting plate 10 to form a composite plate, as shown in figure 4. At this time, the upper surface of the copper-clad plate 20 and the upper surface of the exposed heat-conducting plate 10 are in the same plane. In the present embodiment, the copper clad plate 20 is mounted on both sides of the heat conducting plate 10. According to the subsequent heat sensor circuit, a splicing hole is drilled in the copper-clad plate 20 area of the composite plate, and the splicing hole penetrates through the copper-clad plate 20 and the heat-conducting plate 10. And thoroughly removing dirt and burrs from the composite board after drilling, then thoroughly cleaning the composite board, and electroplating a copper foil layer with the thickness of 18-25 um on the surface of the composite board by adopting a copper deposition and copper electroplating process to form an electroplated layer 30 on the surface of the composite board. The electroplated layer 30 covers and combines the heat conducting plate 10 area of the composite plate surface and the conducting layer area of the copper-clad plate 20 together, so that the heat conducting plate 10 area of the composite plate surface, the conducting layer area of the copper-clad plate 20 and the electroplated layer 30 form a whole. And (3) manufacturing a single-sided or double-sided electronic circuit 50 on the surface of the composite board by adopting the manufacturing process of the PCB according to the circuit required by the subsequent heat sensor after electroplating, and finishing manufacturing the substrate of the heat sensor.

The pins of the thermal element 40 are arranged in the plug holes, and the thermal element 40 is welded and fixed on the bonding pads formed by the electroplated layer 30 to form the thermal sensor. Because the heat conducting plate 10 area of the composite plate surface, the conducting layer area of the copper-clad plate 20 and the electroplated layer 30 form a whole, the heat-sensitive element 40 is directly communicated with the heat path of the heat conducting plate 10 through the electroplated layer 30, the heat conducting plate 10 can quickly transfer the surrounding temperature to the heat-sensitive element 40, so that the sensitivity of the heat sensor manufactured by the heat sensor substrate for capturing the temperature is high, the heat sensitivity greatly exceeds that of the heat sensor manufactured by an insulated PCB (printed circuit board) copper-clad plate or a metal core PCB copper-clad plate such as FR4 and BT, and the like, and the reliable guarantee is provided for the high-sensitivity capturing temperature.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the spirit of the invention, and all equivalent modifications and changes can be made to the above embodiments according to the essential technology of the invention, which falls into the protection scope of the invention.

Claims

1. The heat sensor substrate comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating layer and a conducting layer, and is characterized in that: the heat sensor substrate further comprises a heat conducting plate, the heat conducting plate is provided with a mounting groove, the shape of the copper-clad plate is the same as that of the mounting groove, the copper-clad plate is embedded in the mounting groove to form a composite plate, an electroplated layer is arranged on the surface of the composite plate, and the electroplated layer and the conductive layer are manufactured into an electronic circuit.

2. The thermal sensor substrate according to claim 1, wherein: the electroplated layer is a copper layer.

3. The thermal sensor substrate according to claim 2, wherein: the thickness of the electroplated layer is more than 2 um.

4. The thermal sensor substrate according to claim 2, wherein: the heat conducting plate is a copper plate.

5. The thermal sensor substrate according to claim 4, wherein: the conducting layer is a copper foil.

6. The thermal sensor substrate according to claim 5, wherein: the copper plate and the copper foil of the conductive layer are integrated through the plating layer.

7. The thermal sensor substrate according to claim 1, wherein: the surface of the copper clad plate and the surface of the heat conducting plate are positioned on the same plane.

8. The thermal sensor substrate according to claim 1, wherein: the electronic circuit of the thermal sensor substrate is a single-sided electronic circuit.

9. The thermal sensor substrate according to claim 1, wherein: the electronic circuit of the thermal sensor substrate is a double-sided electronic circuit.

10. A thermal sensor comprising a thermally sensitive element, characterized in that: the thermal sensor further comprises a thermal sensor substrate according to any one of claims 1 to 9, the heat-sensitive element being solder-fixed to a pad formed of an electroplating layer on the metal heat-conducting plate.