CN115740675A - Auxiliary welding method for PCB and electronic device plug by using white vinegar - Google Patents
Auxiliary welding method for PCB and electronic device plug by using white vinegar Download PDFInfo
- Publication number
- CN115740675A CN115740675A CN202211482927.4A CN202211482927A CN115740675A CN 115740675 A CN115740675 A CN 115740675A CN 202211482927 A CN202211482927 A CN 202211482927A CN 115740675 A CN115740675 A CN 115740675A
- Authority
- CN
- China
- Prior art keywords
- white vinegar
- electronic device
- device plug
- pcb
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an auxiliary welding method for a PCB and an electronic device plug by using white vinegar, which comprises the following steps: immersing the electronic device plug into the white vinegar, and maintaining for a preset time to remove an oxide layer on the surface of the metal contact pin of the electronic device plug; wherein the white vinegar is edible white vinegar; and spraying soldering flux on the surface of the metal contact pin of the electronic device plug and then welding the metal contact pin with the PCB. This application will eat white vinegar and use in the welding machine technology the inside of PCB board and electron device plug, get rid of the back through edible white vinegar to the metal contact pin surface oxide layer of electron device plug, weld again, can promote the welding quality and the reliability of electron device plug and PCB board by a wide margin, reduce the finished product disability rate, promote enterprise economic benefits. The white vinegar is edible white vinegar, is a food seasoning, is safe and nontoxic to people, is easy to obtain, has low cost, and reduces the environmental protection risk of enterprises when in use.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) welding, in particular to an auxiliary welding method for a PCB and an electronic device plug by using white vinegar.
Background
When the PCB and the electronic device with the plug are welded, the plug of the electronic device is generally sprayed with the lead-free rosin soldering flux, and then the plug and the PCB are welded together to produce an electronic control component product. In specific production, metal pins of an electronic device plug are oxidized frequently, and then soldering without tin soldering or with little tin soldering occurs when rosin soldering flux is used for soldering, so that the problems of performance quality reduction and reliability reduction of an electric control part product occur, and a finished product which cannot meet the soldering quality requirement can only be scrapped, thereby causing direct economic loss.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an auxiliary welding method for a PCB and an electronic device plug by using white vinegar.
The invention discloses a method for auxiliary welding of a PCB (printed circuit board) and an electronic device plug by using white vinegar, which comprises the following steps:
immersing the electronic device plug into the white vinegar, and maintaining for a preset time to remove an oxide layer on the surface of the metal contact pin of the electronic device plug; wherein the white vinegar is edible white vinegar;
and spraying soldering flux on the surface of the metal contact pin of the electronic device plug and then welding the metal contact pin with the PCB.
According to an embodiment of the present invention, the predetermined time is 7 to 15 minutes.
According to an embodiment of the present invention, the predetermined time is 10 minutes.
According to one embodiment of the present invention, the following reaction occurs when the oxide layer on the surface of the metal pin of the electronic device plug is immersed in the white vinegar: cuO +2 (CH) 3 COOH)＝Cu(CH 3 COO) 2 +H 2 O。
According to one embodiment of the present invention, the flux is a lead-free rosin-based flux.
According to one embodiment of the invention, the filling rate of the welding between the electronic device plug and the PCB is more than or equal to 75%.
According to an embodiment of the present invention, the method for removing the oxide layer on the surface of the metal pin of the electronic device plug comprises the following steps:
obtaining white vinegar, and placing the white vinegar in a vessel.
According to an embodiment of the present invention, the metal pins of the electronic device plug are immersed in white vinegar for a length greater than the thickness of the PCB board.
The beneficial effect of this application lies in: the edible white vinegar is applied to the welding machine process of the PCB and the electronic device plug, and after the surface oxide layer of the metal contact pin of the electronic device plug is removed through the edible white vinegar, the welding is carried out again, so that the welding quality and reliability of the electronic device plug and the PCB can be greatly improved, the rejection rate of finished products is reduced, and the economic benefit of enterprises is improved. The white vinegar is edible white vinegar, is a food seasoning, is safe and nontoxic to people, is easy to obtain, has low cost, and reduces the environmental protection risk of enterprises when in use.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a flow chart of a method for auxiliary soldering of a PCB and an electronic device plug by using white vinegar in the embodiment;
FIG. 2 is a schematic view showing a metal pin of the electronic device plug in an embodiment immersed in white vinegar;
FIG. 3 is an appearance view of a PCB board without using white vinegar for soldering in the embodiment;
FIG. 4 is a sectional view of a real PCB after soldering without using white vinegar in the example;
FIG. 5 is an observation view of a solid slice of a PCB soldered by white vinegar in the example.
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. It should be understood, however, that these implementation details should not be taken to limit the invention. That is, in some embodiments of the invention, such practical details are not necessary. In addition, for the purpose of simplifying the drawings, certain well-known and conventional structures and components are shown in the drawings in a simplified schematic manner.
It should be noted that all the directional indicators in the embodiment of the present invention, such as up, down, left, right, front, and back … …, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawing, if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to order or sequence, and do not limit the present invention, but only distinguish the elements or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings:
referring to fig. 1, fig. 1 is a flow chart illustrating a method for auxiliary soldering of a PCB board and an electronic device plug by using white vinegar in an embodiment. The method for auxiliary welding of the white vinegar for the PCB and the electronic device plug in the embodiment comprises the following steps:
and S0, obtaining white vinegar, and placing the white vinegar in a vessel.
S1, immersing the electronic device plug into white vinegar, and maintaining for a preset time to remove an oxide layer on the surface of a metal contact pin of the electronic device plug.
And S2, spraying soldering flux on the surface of the metal pin of the electronic device plug and then welding the metal pin with the PCB.
The white vinegar in this embodiment is edible white vinegar
The edible white vinegar is creatively applied to the welding machine process of the PCB and the electronic device plug, and the edible white vinegar is used for removing the oxide layer on the surface of the metal contact pin of the electronic device plug and then welding, so that the welding quality and reliability of the electronic device plug and the PCB can be greatly improved, the rejection rate of finished products is reduced, and the economic benefit of enterprises is improved. The white vinegar is edible white vinegar, is a food seasoning, is safe and nontoxic to people, is easy to obtain, has low cost, and reduces the environmental protection risk of enterprises when in use.
That is to say, the application of edible white vinegar in the welding machine technology of PCB board and electron device plug has not only solved the problem that welding quality and reliability are low of electron device plug and PCB board, can not cause the harm to the workman of operation moreover, can also reduce the environmental protection risk of enterprise, when giving consideration to enterprise economic benefits, still pay attention to workman's personal safety and environmental protection, is the creative new application of edible white vinegar.
Referring to fig. 2, fig. 2 is a schematic view illustrating a metal pin of an electronic device plug of an embodiment immersed in white vinegar. In step S0, the metal pins 11 of the electronic device plug 1 are L-shaped, the edible white vinegar 100 is placed in the vessel 2, when the tail end of the L-shaped metal pin 11 of the electronic device plug 1 is immersed below the liquid level of the white vinegar 100, and the metal pin 11 of the electronic device plug 1 is immersed in the edible white vinegar 100, the length of the metal pin 11 is greater than the thickness of the PCB, that is, the length of the tail end of the L-shaped metal pin 11 of the electronic device plug 1 immersed below the liquid level of the white vinegar 100 is greater than the thickness of the PCB to be welded, so that when the tail end of the L-shaped metal pin 11 of the electronic device plug 1 is inserted into the welding hole of the PCB, the metal pin 11 with the removed surface oxide layer is in contact with the hole wall of the welding hole of the PCB, and the subsequent welding quality is ensured. In a specific application, the vessel 2 can be an existing vessel for containing white vinegar, and the details are not repeated herein. The action that the end of the L-shaped metal pin 11 of the electronic device plug 1 is immersed in the white vinegar 100 can be realized by the cooperation of manpower and tooling, for example, the tooling is provided with a high platform with a designed height, a vessel is placed under the high platform, and a worker only needs to place the electronic device plug 1 on the high platform, so that the end of the metal pin 11 is immersed in the white vinegar 100.
In step S1, the preset time is 7-15 minutes. Preferably, the predetermined time is 10 minutes. The specific selection of the preset time can be adjusted according to the thickness of the oxide layer on the surface of the metal pin 11 until the oxide layer on the surface of the metal pin 11 is completely removed.
The main component of the edible white vinegar in the embodiment is acetic acid, and the whole edible white vinegar is white and transparent, has no other impurities, and cannot cause color pollution. When the oxide layer on the surface of the metal pin 11 of the electronic device plug 1 is immersed into the white vinegar 100, the following reaction occurs: cuO +2 (CH) 3 COOH)＝Cu(CH 3 COO) 2 +H 2 And O. That is, the acetic acid reacts with the copper oxide, thereby removing the oxide layer on the surface of the metal pin 11.
In step S2, flux is sprayed on the surface of the metal pins 11, and then the metal pins 11 of the electronic device plug 1 are inserted into the soldering holes of the PCB to complete the soldering operation. The soldering flux used in the embodiment is lead-free rosin soldering flux, and the soldering mode is wave soldering. The specific spraying and welding processes can be found in the prior art and are not described in detail herein.
Referring to fig. 3 to 5 together, fig. 3 is an appearance view of the PCB panel without the white vinegar soldering in the embodiment; FIG. 4 is a view showing a cut of a solid PCB board soldered without using white vinegar in the example; FIG. 5 is an observation view of a solid slice of a PCB soldered by white vinegar in the example. The experiment in this embodiment was performed based on the existing soldering process of the PCB board and the plug pin of the electronic device, and the conditions were the same except for the white vinegar soaking operation. Namely, the existing welding process without using white vinegar and the welding process with the white vinegar soaking action of the invention are adopted, after the same specification of PCB boards with the same conditions are adopted for welding, slicing observation is carried out on the appearance and the welding position, and the following conditions can be obviously seen: in the appearance observation of fig. 3, as shown by an arrow, after the PCB and the pin which are not soaked in the white vinegar are soldered, the solder on the soldered portion of the PCB is insufficient, and the appearance shows a position with less solder, and in the material slice observation diagram of fig. 4, as shown by an arrow, the soldered portion of the metal pin 11 of the electronic device plug 1 and the PCB is not soldered, and a complete alloy layer is not formed. In the material object slice observation diagram of fig. 5, as shown in a box, after the PCB and the contact pin soaked with the white vinegar are welded, the solder on the welding position of the PCB is sufficient, the position with no tin on the upper and lower surfaces is not present, the solder on the welding position of the metal contact pin 11 of the electronic device plug 1 and the PCB after being sliced is provided, and the filling rate of the welding of the sub-device plug and the PCB is more than or equal to 75%, which meets the IPC-1610-a welding standard.
To sum up: the edible white vinegar is creatively applied to the welding process of the PCB and the electronic device plug, and the edible white vinegar is used for removing the oxide layer on the surface of the metal contact pin of the electronic device plug and then welding, so that the welding quality and reliability of the electronic device plug and the PCB can be greatly improved, the rejection rate of finished products is reduced, and the economic benefit of enterprises is improved. The white vinegar is edible white vinegar, is a food seasoning, is safe and nontoxic to people, is easy to obtain, has low cost, and reduces the environmental protection risk of enterprises when in use.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (8)
1. The method for auxiliary welding of the PCB and the electronic device plug by using the white vinegar is characterized by comprising the following steps of:
immersing the electronic device plug into white vinegar, and maintaining for a preset time to remove an oxide layer on the surface of a metal contact pin of the electronic device plug; wherein the white vinegar is edible white vinegar;
and spraying soldering flux on the surface of the metal contact pin of the electronic device plug and then welding the metal contact pin with the PCB.
2. The method for auxiliary soldering of PCB and plug of electronic device using white vinegar as claimed in claim 1, wherein the predetermined time is 7-15 minutes.
3. The method for auxiliary soldering of PCB and plug of electronic device using white vinegar as claimed in claim 1, wherein the preset time is 10 minutes.
4. The method for assisting in soldering of the PCB and the electronic device plug by using the white vinegar as claimed in claim 1, wherein the following reaction occurs when the oxide layer on the surface of the metal pin of the electronic device plug is immersed in the white vinegar: cuO +2 (CH) 3 COOH)＝Cu(CH 3 COO) 2 +H 2 O。
5. The method for assisting in soldering of a PCB and an electronic device plug by using the white vinegar as claimed in claim 1, wherein the flux is a lead-free rosin-based flux.
6. The method for assisting in welding the PCB and the electronic device plug by using the white vinegar as claimed in claim 1, wherein the filling rate of the welding of the electronic device plug and the PCB is not less than 75%.
7. The method for assisting in soldering of a PCB and an electronic device plug by using white vinegar as claimed in claim 1, wherein the electronic device plug is immersed in the white vinegar for a predetermined time to remove the oxide layer on the surface of the metal pin of the electronic device plug, and comprises the following steps:
obtaining the white vinegar, and placing the white vinegar in a vessel.
8. The method for assisting in soldering of a PCB and an electronic device plug by using white vinegar as claimed in claim 1, wherein the metal pins of the electronic device plug are immersed in the white vinegar for a length greater than the thickness of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211482927.4A CN115740675A (en) | 2022-11-24 | 2022-11-24 | Auxiliary welding method for PCB and electronic device plug by using white vinegar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211482927.4A CN115740675A (en) | 2022-11-24 | 2022-11-24 | Auxiliary welding method for PCB and electronic device plug by using white vinegar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115740675A true CN115740675A (en) | 2023-03-07 |
Family
ID=85337083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211482927.4A Pending CN115740675A (en) | 2022-11-24 | 2022-11-24 | Auxiliary welding method for PCB and electronic device plug by using white vinegar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115740675A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030034381A1 (en) * | 2001-08-01 | 2003-02-20 | Tetsuya Nakatsuka | Packaging method using lead-free solder |
| CN106211629A (en) * | 2016-08-30 | 2016-12-07 | 无锡市同步电子制造有限公司 | The method carrying out high-temperature soldering in printed circuit board (PCB) processing |
| US20170011905A1 (en) * | 2015-07-08 | 2017-01-12 | Freescale Semiconductor, Inc. | Method of making a packaged semiconductor device |
| CN111155120A (en) * | 2019-12-31 | 2020-05-15 | 中山市皓祥模具五金有限公司 | Surface treatment method of corrosion-resistant alloy part |
| CN112911826A (en) * | 2021-01-14 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
-
2022
- 2022-11-24 CN CN202211482927.4A patent/CN115740675A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030034381A1 (en) * | 2001-08-01 | 2003-02-20 | Tetsuya Nakatsuka | Packaging method using lead-free solder |
| US20170011905A1 (en) * | 2015-07-08 | 2017-01-12 | Freescale Semiconductor, Inc. | Method of making a packaged semiconductor device |
| CN106211629A (en) * | 2016-08-30 | 2016-12-07 | 无锡市同步电子制造有限公司 | The method carrying out high-temperature soldering in printed circuit board (PCB) processing |
| CN111155120A (en) * | 2019-12-31 | 2020-05-15 | 中山市皓祥模具五金有限公司 | Surface treatment method of corrosion-resistant alloy part |
| CN112911826A (en) * | 2021-01-14 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4960236A (en) | Manufacture of printed circuit board assemblies | |
| CA1213073A (en) | Method of manufacturing printed wiring boards | |
| US2777192A (en) | Method of forming a printed circuit and soldering components thereto | |
| EP1088615B1 (en) | Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same | |
| US6428911B2 (en) | Soldering method and soldered joint | |
| JP2008266791A (en) | Method of preliminary plating for coil end | |
| CN107186387A (en) | A kind of cleaning-free lead-free solder soldering fluid and preparation method thereof | |
| CA2099038C (en) | Low bridging soldering process | |
| CN115740675A (en) | Auxiliary welding method for PCB and electronic device plug by using white vinegar | |
| KR937000248A (en) | Use of Organic Acids in Low Residue Solder Pastes | |
| Thwaites | Soldering technology—decade of developments | |
| JP4654895B2 (en) | Formation method of lead-free plating film | |
| US3372474A (en) | System for weldable circuits | |
| US5340013A (en) | Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process | |
| US5330801A (en) | Process for tinning electrically conductive wire | |
| US5377406A (en) | Process for producing a printed circuit board | |
| Bilotta | Connections in electronic assemblies | |
| CN114390783A (en) | Circuit board manufacturing method and circuit board | |
| JP2003193289A (en) | Method of heat treating electroplated film | |
| JP3520457B2 (en) | Tin-coated metal sheet and method for producing the same | |
| CN204397183U (en) | A kind of solder stick of environment protection soldering fluid | |
| JP2006083410A (en) | Method for manufacturing electronic part | |
| DE60224050T2 (en) | Method for producing a ceramic sound board | |
| DE3224825A1 (en) | Ceramic copper solder joints | |
| JPH1076389A (en) | Solder with both thermal impact resistance and oxidation resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |