CN112638053B - Solder mask patterning method and device and circuit board - Google Patents
Solder mask patterning method and device and circuit board Download PDFInfo
- Publication number
- CN112638053B CN112638053B CN201910906079.7A CN201910906079A CN112638053B CN 112638053 B CN112638053 B CN 112638053B CN 201910906079 A CN201910906079 A CN 201910906079A CN 112638053 B CN112638053 B CN 112638053B
- Authority
- CN
- China
- Prior art keywords
- solder resist
- light
- pattern layer
- transmitting substrate
- resist ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a solder mask patterning method and device and a circuit board, and relates to the technical field of electronic circuit manufacturing. The solder mask patterning method comprises the following steps: selecting a light-transmitting substrate; the first surface of the light-transmitting substrate is provided with a pattern layer made of non-light-transmitting materials; coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate; the solder resist ink is a photo-curing material; providing a curing light source, wherein light rays of the curing light source penetrate through the light-transmitting substrate from the second surface of the light-transmitting substrate and irradiate on the first solder resist ink which is not shielded by the pattern layer on the first surface of the light-transmitting substrate; and after the first solder resist ink is cured, removing uncured second solder resist ink which covers the pattern layer to obtain a patterned solder resist layer after the first solder resist ink is cured. Compared with the traditional solder resist process, the embodiment of the invention does not need to pre-cure the solder resist, reduces the complexity of the solder resist process, improves the efficiency of the solder resist process and reduces the preparation cost.
Description
Technical Field
The invention belongs to the technical field of electronic circuit manufacturing, and particularly relates to a solder mask patterning method and device and a circuit board.
Background
Printed Circuit Boards (PCBs) are the core foundation of modern industrial products, and the production of conventional Printed circuit boards includes tens of processes, and the processes related to the solder resist layer at least include solder resist (green oil), film offset, exposure, development, etc., wherein, in order to avoid adhesion between the film offset and the solder resist, the solder resist needs to be pre-cured before the film offset is placed; an operator is required to perform manual alignment in the process of placing the film offset plate, so that errors between the solder mask and the circuit pad in the subsequent exposure and development processes are avoided; furthermore, the pre-cured solder resist needs to be coated with a special chemical (Na)2CO3) Cleaning; in summary, the solder mask layer in the prior art has a complicated manufacturing process, and a corresponding film offset plate needs to be manufactured before manufacturing, so that the manufacturing period is long, the efficiency is low, and the cost is high.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a solder mask patterning method to solve the problem of the prior art that the solder mask manufacturing process is complicated.
In some illustrative embodiments, the solder resist layer patterning method includes: selecting a light-transmitting substrate; the first surface of the light-transmitting substrate is provided with a pattern layer made of non-light-transmitting materials; coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate; the solder resist ink is a photo-curing material; providing a curing light source, wherein light rays of the curing light source penetrate through the light-transmitting substrate from the second surface of the light-transmitting substrate and irradiate on the first solder resist ink which is not shielded by the pattern layer on the first surface of the light-transmitting substrate; and after the first solder resist ink is cured, removing uncured second solder resist ink which covers the pattern layer to obtain a patterned solder resist layer after the first solder resist ink is cured.
In some optional embodiments, before coating the solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate, the method further includes: and forming a circuit made of non-light-transmitting materials on the first surface of the light-transmitting substrate to serve as the pattern layer.
In some alternative embodiments, the circuit pattern is formed using a low melting point metal fabrication having a melting point below 300 ℃.
In some alternative embodiments, the low melting point metal is a metal having a melting point in the range of 50 ℃ to 300 ℃.
In some optional embodiments, the pattern layer is a mask separable from the transparent substrate; after the first solder resist ink is cured, removing uncured second solder resist ink covering the pattern layer to obtain a patterned solder resist layer after the first solder resist ink is cured, specifically comprising: and removing the mask to obtain the patterned solder mask layer after the first solder mask ink is cured.
In some optional embodiments, the mask is a removable non-light transmissive coating.
In some optional embodiments, after removing the mask, further comprising: and forming a circuit consistent with the pattern of the pattern layer on the first surface of the light-transmitting substrate.
In some optional embodiments, after the removing the uncured second solder resist ink covering the pattern layer, further comprising: and forming a circuit consistent with the pattern of the pattern layer on the pattern layer.
Another object of the present invention is to provide a solder mask patterning apparatus to solve the problems of the prior art.
In some illustrative embodiments, the solder resist layer patterning device comprises: the first printing module is used for forming a pattern layer made of non-light-transmitting materials on the first surface of the light-transmitting substrate; the second printing module is used for coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate; and the curing light source is arranged on one side of the second surface of the light-transmitting substrate.
It is still another object of the present invention to provide a circuit board prepared by using the solder resist patterning method as described in any one of the above.
Compared with the prior art, the invention has the following advantages:
in the embodiment of the invention, the light-transmitting substrate is selected, the solder resist is irradiated in a reverse light-supplying mode, and in the irradiation process, due to the shielding effect of the pattern layer made of the non-light-transmitting material on light, only the solder resist which is not shielded by the pattern layer is cured, but the solder resist which is shielded by the pattern layer is not cured, so that the patterning of the solder resist is realized, and compared with the traditional solder resist process, the pre-curing of the solder resist is not needed, the complexity of the solder resist process is reduced, the solder resist process efficiency is improved, and the preparation cost is reduced.
Drawings
Fig. 1 is a flow chart of a solder mask patterning method in an embodiment of the present invention;
fig. 2 is a process diagram of a solder mask patterning method in an embodiment of the invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
In the embodiment of the invention, a method for patterning a solder mask layer is disclosed, and specifically, as shown in fig. 1-2, fig. 1 is a flow chart of the method for patterning the solder mask layer in the embodiment of the invention; fig. 2 is a process diagram of a solder mask patterning method according to an embodiment of the present invention. The solder mask patterning method comprises the following steps:
step S11, selecting a transparent substrate 1; a pattern layer 2 made of non-light-transmitting material is formed on the first surface of the light-transmitting substrate 1;
the transparent substrate can be made of transparent or semitransparent materials, and in some embodiments, the substrate can also have colors, and the colors do not absorb or slightly absorb light rays emitted by the curing light source, so that the curing molding of the subsequent solder resist is prevented from being influenced. The pattern layer in the embodiment of the present invention may be the circuit line itself, or may be a mask, a coating, or the like with a consistent circuit pattern.
Step S12, coating solder mask ink 3 covering the pattern layer 2 on the first surface of the light-transmitting substrate 1; the solder resist ink is a photo-curing material;
the solder resist ink made of the photo-curing material may be any one of products on the market, and the color of the solder resist ink may be black, yellow, green, blue, and the like, which is not limited in the present invention. The solder resist ink in this embodiment is applied to the first surface of the light-transmitting substrate by imposition while covering the surface of the pattern layer. Specifically, the coating method may be selected from printing, brushing, spraying, dipping, and the like, but it is not excluded that the coating method may be performed by printing.
Step S13, providing a curing light source 4, wherein light from the curing light source 4 is transmitted through the transparent substrate 1 from the second surface of the transparent substrate 1 and is irradiated on the first solder resist ink 31 on the first surface of the transparent substrate 1, which is not blocked by the pattern layer 2;
wherein, the curing light source, such as ultraviolet light source, UV curing lamp, etc., is selected according to the selected solder resist ink.
Step S14, after the first solder resist ink 31 is cured, removing the uncured second solder resist ink 32 covering the pattern layer 2, so as to obtain a solder resist layer patterned by the cured first solder resist ink 31.
Wherein, only a wiping process can be adopted for removing the second solder resist ink without applying a specific cleaning agent (such as Na) to the second solder resist ink2CO3) However, in other embodiments, the present invention does not preclude the removal of the second solder mask ink by the application of a cleaner to obtain a stably cured first solder mask ink. In other embodiments of the present invention, the second solder resist ink covering the pattern layer may also be removed simultaneously by removing the pattern layer.
In the embodiment of the invention, the light-transmitting substrate is selected, the solder resist is irradiated in a reverse light-supplying mode, and in the irradiation process, due to the shielding effect of the pattern layer made of the non-light-transmitting material on light, only the solder resist which is not shielded by the pattern layer is cured, but the solder resist which is shielded by the pattern layer is not cured, so that the patterning of the solder resist is realized, and compared with the traditional solder resist process, the pre-curing of the solder resist is not needed, the complexity of the solder resist process is reduced, the solder resist process efficiency is improved, and the preparation cost is reduced.
In some embodiments, the solder resist layer patterning method in embodiments of the present invention may further include:
step S10, a pattern layer of non-transparent material is formed on the first surface of the transparent substrate. The manufacturing can be realized by printing, attaching and the like, for example, the pattern layer is a coating layer of a non-light-transmitting material with a specific pattern formed by the printing/printing method; for example, the pattern layer is a mask made of a non-light-transmitting material and having a specific pattern, and the mask is fixed on the first surface of the light-transmitting substrate by mounting or other fixing methods. The pattern layer is a circuit of an actual circuit pattern, and the material of the pattern layer can be copper foil, aluminum foil, conductive ink, and the conductive ink can also be conductive copper paste, conductive silver paste, conductive aluminum paste, low-melting point metal, and the like.
Preferably, step S10 includes: and forming a circuit with a circuit pattern made of non-light-transmitting material on the first surface of the light-transmitting substrate to serve as the pattern layer.
The low-melting-point metal in the embodiment of the invention can adopt a low-melting-point metal simple substance or alloy with a melting point not higher than 300 ℃, wherein the melting point temperature of the low-melting-point metal can be selected from 12 +/-2 ℃, 17 +/-2 ℃, 29 +/-2 ℃, 65 +/-2 ℃, 80 +/-98 +/-2 ℃, 120 +/-2 ℃, 180 +/-2 ℃, 220 +/-2 ℃, 232 +/-2 ℃, 260 +/-2 ℃, 288 +/-2 ℃ and 298 +/-2 ℃. Such as one or more of mercury, gallium, indium, elemental tin, gallium-indium alloy, gallium-indium-tin alloy, gallium-zinc alloy, gallium-indium-zinc alloy, gallium-tin-cadmium alloy, gallium-zinc-cadmium alloy, bismuth-indium alloy, bismuth-tin alloy, bismuth-indium-zinc alloy, bismuth-tin-zinc alloy, bismuth-indium-tin-zinc alloy, tin-lead alloy, tin-copper alloy, tin-zinc-copper alloy, tin-silver-copper alloy, and bismuth-lead-tin alloy.
In some embodiments, the low melting point metal in the embodiments of the present invention may be mixed with one or more of conductive particles, non-conductive particles, and polymer resin, so as to achieve one or more of the functional effects of adjusting conductivity, viscosity, surface tension, adhesion, and the like of the low melting point metal.
Specifically, the embodiment of the present invention further provides a method for manufacturing a printed circuit board based on the above method for patterning a solder resist layer, including:
step S21, providing a transparent substrate;
step S22, forming a circuit with a circuit pattern on the first surface of the transparent substrate as a pattern layer of non-transparent material; (the circuit can be made by using the conductive ink)
Step S23, coating solder mask ink on the first surface of the transparent substrate, the solder mask ink simultaneously covering the first surface of the transparent substrate and the circuit attached on the first surface; wherein the solder resist ink covering the circuit is used as a second solder resist ink, and the rest is the first solder resist ink;
and step S24, providing a curing light source on the other side of the transparent substrate, wherein the curing light source irradiates the first solder resist ink from the side through the transparent substrate. And the second solder resist ink is shielded by the circuit and cannot receive curing light, so that the second solder resist ink cannot be cured.
And step S25, after the first solder resist ink is solidified, wiping off the second solder resist ink on the surface of the circuit to obtain the printed circuit board with the circuit exposed and the solder resist ink around the circuit.
In the embodiment, when the low-melting-point metal is selected to manufacture the circuit, the low-melting-point metal with the melting point of 50-300 ℃ can be selected, so that the circuit is ensured to be in a solid state in the manufacturing process, and the problem of mixing with solder resist ink is avoided.
In the embodiment of the present invention, based on the above solder resist patterning method, another method for manufacturing a printed circuit board is provided, including:
step S31, providing a transparent substrate;
step S32, attaching a mask for forming a circuit pattern on the first surface of the transparent substrate as a pattern layer of the non-transparent material;
step S33 of coating solder resist ink on the first surface of the light-transmitting substrate, the solder resist ink simultaneously covering the first surface of the light-transmitting substrate and the mask attached on the first surface thereof; wherein the solder resist ink covered on the mask is used as a second solder resist ink, and the rest is the first solder resist ink;
and step S34, providing a curing light source on the other side of the transparent substrate, wherein the curing light source irradiates the first solder resist ink from the side through the transparent substrate. Wherein the second solder resist ink is shielded by the mask and cannot receive curing light, so that the second solder resist ink is not cured.
Step S35, after the first solder resist ink is solidified, removing the mask to obtain the first surface of the light-transmitting substrate exposed and consistent with the mask pattern and the solder resist layer around the first surface;
and step S36, printing/coating conductive ink on the first surface of the transparent substrate, so that the conductive ink is attached to the first surface of the transparent substrate instead of the solder mask layer, and obtaining the printed circuit board.
In this embodiment, when a low-melting-point metal is selected to manufacture the circuit, the low-melting-point metal with a melting point of 300 ℃, especially the low-melting-point metal in a liquid state at room temperature, can be selected and is suitable for manufacturing the flexible printed circuit board.
The embodiment of the invention also provides a manufacturing method of a printed circuit board based on the solder mask patterning method, which comprises the following steps:
step S41, providing a transparent substrate;
step S42, printing a coating layer for forming a circuit pattern on the first surface of the light-transmitting substrate as a pattern layer of a non-light-transmitting material; preferably, the coating is an adhesive film layer, and release paper is attached to the adhesive film layer;
step S43, coating solder mask ink on the first surface of the light-transmitting substrate, wherein the solder mask ink covers the first surface of the light-transmitting substrate and the release paper attached to the first surface of the light-transmitting substrate at the same time; wherein the solder resist ink covered on the coating is used as a second solder resist ink, and the rest is the first solder resist ink;
and step S44, providing a curing light source on the other side of the transparent substrate, wherein the curing light source irradiates the first solder resist ink from the side through the transparent substrate. Wherein, the second solder resist ink can not receive curing light because of being shielded by the coating (or the release paper), so the second solder resist ink can not be cured.
S45, after the first solder resist ink is solidified, removing the release paper to expose the lower coating of the release paper, and obtaining a coating and a solder resist layer around the coating;
and step S46, printing/coating conductive ink on the first surface of the transparent substrate, so that the conductive ink is attached to the coating layer instead of the solder mask layer, and obtaining the printed circuit board.
In the embodiment, when the low-melting-point metal is selected to manufacture the circuit, the low-melting-point metal with the melting point of 300 ℃, especially the low-melting-point metal in a room-temperature liquid state, can be selected, and the coating can further improve the adhesive force of the low-melting-point metal on the light-transmitting substrate, reduce the selectivity of the surface adhesive force of the light-transmitting substrate, and is suitable for manufacturing the flexible printed circuit board.
Another object of the present invention is to provide a solder mask patterning apparatus to solve the problems of the prior art. The solder resist patterning device includes: the first printing module is used for forming a pattern layer made of non-light-transmitting materials on the first surface of the light-transmitting substrate; the second printing module is used for coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate; and the curing light source is arranged on one side of the second surface of the light-transmitting substrate.
The first printing module can select equipment with corresponding functions, such as a printer, spraying equipment, mounting equipment and the like, according to different pattern layers. The second printing module may be selected from a printer, a painting device, and the like. Preferably, the solder resist patterning device is conveyed by a belt and/or a roller set using a line process.
It is still another object of the present invention to provide a circuit board prepared by using the solder resist patterning method as described in any one of the above.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. A solder resist patterning method, comprising:
selecting a light-transmitting substrate;
the first surface of the light-transmitting substrate is provided with a pattern layer made of non-light-transmitting materials; wherein the pattern layer is consistent with a target circuit pattern;
coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate; the solder resist ink is a photo-curing material;
providing a curing light source, wherein light rays of the curing light source penetrate through the light-transmitting substrate from the second surface of the light-transmitting substrate and irradiate on the first solder resist ink which is not shielded by the pattern layer on the first surface of the light-transmitting substrate;
and after the first solder resist ink is cured, removing uncured second solder resist ink which covers the pattern layer to obtain a solder resist layer which is patterned after the first solder resist ink is cured and does not cover the pattern layer.
2. A method of patterning a solder resist layer according to claim 1, further comprising, before coating the solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate:
and forming a circuit made of non-light-transmitting materials on the first surface of the light-transmitting substrate to serve as the pattern layer.
3. A solder resist patterning method according to claim 2, characterized in that the circuit pattern is formed by making use of a low melting point metal having a melting point of 300 ℃ or less.
4. A method of patterning a solder resist according to claim 3, characterized in that the low melting point metal is one having a melting point in the range of 50-300 ℃.
5. A solder resist layer patterning method according to claim 1, characterized in that the pattern layer is a mask separable from the light-transmitting substrate;
after the first solder resist ink is cured, removing uncured second solder resist ink covering the pattern layer to obtain a patterned solder resist layer after the first solder resist ink is cured, specifically comprising:
and removing the mask to obtain the patterned solder mask layer after the first solder mask ink is cured.
6. A method of patterning a solder resist according to claim 5, wherein the mask is a removable non-light transmissive paint.
7. A solder resist layer patterning method according to claim 5, characterized by further comprising, after removing the mask:
and forming a circuit consistent with the pattern of the pattern layer on the first surface of the light-transmitting substrate.
8. A method of patterning a solder resist layer according to claim 1, characterized by further comprising, after said removing of the uncured second solder resist ink covering said pattern layer:
and forming a circuit consistent with the pattern of the pattern layer on the pattern layer.
9. A solder resist patterning apparatus used for the solder resist patterning method described in any one of claims 1 to 8, characterized by comprising:
the first printing module is used for forming a pattern layer made of non-light-transmitting materials on the first surface of the light-transmitting substrate;
the second printing module is used for coating solder resist ink covering the pattern layer on the first surface of the light-transmitting substrate;
and the curing light source is arranged on one side of the second surface of the light-transmitting substrate.
10. A circuit board characterized by being produced by the solder resist layer patterning method as described in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906079.7A CN112638053B (en) | 2019-09-24 | 2019-09-24 | Solder mask patterning method and device and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910906079.7A CN112638053B (en) | 2019-09-24 | 2019-09-24 | Solder mask patterning method and device and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112638053A CN112638053A (en) | 2021-04-09 |
| CN112638053B true CN112638053B (en) | 2022-04-29 |
Family
ID=75283207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910906079.7A Active CN112638053B (en) | 2019-09-24 | 2019-09-24 | Solder mask patterning method and device and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112638053B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4260675A (en) * | 1979-05-10 | 1981-04-07 | Sullivan Donald F | Photoprinting plate and method of preparing printed circuit board solder masks therewith |
| WO1997022235A2 (en) * | 1995-12-11 | 1997-06-19 | Alliedsignal Inc. | Solder mask for manufacture of printed circuit boards |
| CN101888745A (en) * | 2009-05-12 | 2010-11-17 | 日立电线株式会社 | Printed wiring board and manufacturing method of the same |
| CN103379967A (en) * | 2010-12-13 | 2013-10-30 | 太阳化学公司 | A method for applying and exposing coating or ink compositions on substrates to radiation and the product thereof |
| CN108738234A (en) * | 2018-07-31 | 2018-11-02 | 北京梦之墨科技有限公司 | A kind of low-melting-point metal circuit board and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040104144A (en) * | 2003-06-03 | 2004-12-10 | 삼성전기주식회사 | Method of forming solder resist pattern |
-
2019
- 2019-09-24 CN CN201910906079.7A patent/CN112638053B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4260675A (en) * | 1979-05-10 | 1981-04-07 | Sullivan Donald F | Photoprinting plate and method of preparing printed circuit board solder masks therewith |
| WO1997022235A2 (en) * | 1995-12-11 | 1997-06-19 | Alliedsignal Inc. | Solder mask for manufacture of printed circuit boards |
| CN101888745A (en) * | 2009-05-12 | 2010-11-17 | 日立电线株式会社 | Printed wiring board and manufacturing method of the same |
| CN103379967A (en) * | 2010-12-13 | 2013-10-30 | 太阳化学公司 | A method for applying and exposing coating or ink compositions on substrates to radiation and the product thereof |
| CN108738234A (en) * | 2018-07-31 | 2018-11-02 | 北京梦之墨科技有限公司 | A kind of low-melting-point metal circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112638053A (en) | 2021-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107493662B (en) | Method for manufacturing carbon oil with low resistance value and thickness of more than or equal to 25um on printed circuit board | |
| KR101901429B1 (en) | Photoimaging | |
| CN103547081B (en) | Resistance welding processing method, system and the circuit board of a kind of super thick copper foil circuit board | |
| CN105208791B (en) | A kind of production method of printed circuit board character | |
| CN103096633A (en) | Solder resisting method for circuit board | |
| US20140231127A1 (en) | Multi-Finish Printed Circuit Board | |
| US20170150611A1 (en) | Method for silkscreen printing during manufacture of printed circuit board | |
| US10426039B2 (en) | Method for stencil printing during manufacture of printed circuit board | |
| CN102625590A (en) | Soldering-resistant processing method for circuit board | |
| KR100765146B1 (en) | Solder paste and method of forming solder bumps using the same | |
| CN112638053B (en) | Solder mask patterning method and device and circuit board | |
| CN106061128A (en) | Printed circuit board and method of coating white oil on surface | |
| CN109109481B (en) | Printing method of solder paste | |
| CN100524675C (en) | Method for forming metal projection | |
| JP2022096004A (en) | Manufacturing method of printed wiring board and printed wiring board | |
| KR101238631B1 (en) | Aluminum plate for psr printing, method of manufacturing the same and method of psr printing using the same | |
| CN113438816B (en) | PCB processing method | |
| JP3473401B2 (en) | Manufacturing method of printed wiring board | |
| JP5768574B2 (en) | Method for manufacturing printed wiring board | |
| CN110430689B (en) | Manufacturing method of double-sided ink for through hole of thin plate | |
| CN114666994A (en) | Circuit board and manufacturing method thereof | |
| JP4316270B2 (en) | Solder resist film-formed circuit board and manufacturing method thereof | |
| KR20210053596A (en) | Recessed stretchable electrode and manufacturing method | |
| WO2023123804A1 (en) | Conductive pattern and method for forming same | |
| CN114613741B (en) | Conductive structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |