CN115696765A - Manufacturing method for improving precision and pull-off strength of PCB bonding pad - Google Patents

Abstract

The application discloses a manufacturing method for improving precision and pull-off strength of a PCB (printed circuit board) bonding pad, which comprises the following steps: cutting → inner layer → AOI → pressing → drilling → electroplating → outer layer → etching → AOI → solder mask → text → surface treatment → molding → electrical testing. The invention has the following beneficial effects: the requirement of customer high accuracy pad size can be realized to promote product pad and pull out intensity, avoid pasting the back components and parts plug and take place the obscission, promote the product yield.

Description

Manufacturing method for improving precision and pull-off strength of PCB bonding pad

Technical Field

The application belongs to the technical field of PCBs, and particularly relates to a manufacturing method for improving PCB bonding pad precision and pull-off strength.

Background

With the development of light, thin, short and small electronic products, the products need to integrate more components in the smallest space, so as to realize more product functions; the size precision of the bonding pad can influence the mounting precision of components, and the phenomena of component falling and plug-in resistance are caused by the size design problem of the bonding pad, so that products are scrapped;

at present, the bonding pad is manufactured in a mode of etching windowing limitation in the industry, and the size of the bonding pad is adjusted through engineering data precompensation; however, the size of the bonding pad is affected by the uniformity of copper thickness in the electroplating process, and after the isolated bonding pad is mounted on a connector, the tensile strength is weak, and the phenomenon of component falling is easy to occur.

Disclosure of Invention

The embodiment of the application aims to provide a manufacturing method for improving the precision and the pull-off strength of a PCB (printed circuit board), wherein the size control process of a bonding pad is adjusted from etching to resistance welding, the size of the bonding pad can be controlled to +/-1 mil by utilizing the high precision of resistance welding development so as to meet the size requirement of +/-2 mil of a customer, the influence of the thickness uniformity difference of electroplated copper on etching is reduced, and the influence of the thickness uniformity difference of the electroplated copper on the size of the bonding pad is avoided; the pad and the substrate at the plug component position are connected with the copper sheet to increase the design, so that the small and isolated pad is avoided, the pull-off strength of the pad is increased, the product yield and the performance are improved, and the technical problem related to the background art can be solved.

In order to solve the technical problem, the present application is implemented as follows:

a manufacturing method for improving the precision and the pull-off strength of a PCB bonding pad comprises the following steps:

cutting → inner layer → AOI → pressing → drilling → electroplating → outer layer → etching → AOI → solder mask → text → surface treatment → molding → electrical testing.

As a preferable improvement of the present invention, the outer side includes:

when the outer layer data is designed, the size of the bonding pad required by a customer is increased by spreading a copper sheet, and the connection position with the periphery is widened and increased.

As a preferable improvement of the present invention, the etching includes:

the customer-required pad size need not be regulated.

As a preferable improvement of the present invention, the solder resist includes:

printing, baking, exposing and developing the PCB;

wherein the exposed data is compensated for the pad during design and the size of the pad is monitored during development.

As a preferable improvement of the invention, after the electrical measurement, a general inspection package is also included.

The invention has the following beneficial effects: the requirement of customer high accuracy pad size can be realized to promote product pad and pull out intensity, avoid pasting the back components and parts plug and take place the obscission, promote the product yield.

Drawings

FIG. 1 is a design drawing of a PCB with pad accuracy requirement provided in example 1;

FIG. 2 is a pad solder mask layout.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The manufacturing method for improving the accuracy and the pull-off strength of the PCB pad provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

The embodiment of the application provides a manufacturing method for improving the precision and the pull-off strength of a PCB (printed circuit board) bonding pad, which comprises the following steps:

cutting → inner layer → AOI → pressing → drilling → electroplating → outer layer → etching → AOI → solder mask → text → surface treatment → molding → electrical test → general inspection packaging.

The outer side comprises a copper sheet which is paved on the bonding pad required by a customer for increasing the size during the design of outer-layer data, and the connecting position with the periphery is widened and increased.

The etching includes not necessarily governing customer demand pad size.

The solder resist comprises printing, baking, exposing and developing the PCB; wherein the exposed data is compensated for the pad during design and the size of the pad is monitored during development. Therefore, the size precision of the bonding pad is improved by utilizing the high-precision stability of solder mask development; the copper sheet at the bottom of the bonding pad is enlarged, so that the contact area is increased, the bonding force is improved, the pulling-out strength is improved, and the components are prevented from falling off.

The following describes in detail a method for manufacturing a PCB pad with improved accuracy and pull-off strength in accordance with the present application in embodiment 1.

Example 1

Referring to fig. 1 and 2, in fig. 1, S1 is a module containing a pad requirement of a customer, S2 is a pad, and S3 is a gold finger of another pad of a part; FIG. 2 is an enlarged view of the design of the solder mask design with pads, i.e., the S2 module, S4 is the exposed pads of the solder mask windowing design, and S5 is the solder mask ink area.

The size of the S4 bonding pad required by a customer is increased during outer layer data design, so that the influence of etching is avoided; covering by using solder resist ink S5, windowing and designing a pad part S4 really required by a customer, and exposing and developing to expose; the size precision of the bonding pad is improved through the high precision of exposure and development, so that the contact area of the bonding pad and the base material is increased, and the pulling-off strength of the product is improved.

The invention has the following beneficial effects: the requirement of customer high accuracy pad size can be realized to promote product pad and pull out intensity, avoid pasting the back components and parts plug and take place the obscission, promote the product yield.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (5)

1. A manufacturing method for improving the precision and the pull-off strength of a PCB bonding pad is characterized by comprising the following steps:

cutting → inner layer → AOI → pressing → drilling → electroplating → outer layer → etching → AOI → solder mask → text → surface treatment → molding → electrical testing.

2. The method of claim 1, wherein the outer side comprises:

when outer layer data is designed, the size of a bonding pad required by a customer is increased by paving a copper sheet, and the connection position with the periphery is widened and increased.

3. The method of claim 2, wherein the etching comprises:

the customer-required pad size need not be regulated.

4. The method of claim 1, wherein the solder mask comprises:

printing, baking, exposing and developing the PCB;

wherein the exposed data is compensated for the pad during design and the size of the pad is monitored during development.

5. The method of claim 1, further comprising, after the electrical measurements, a master check package.

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