CN107132608A - A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie - Google Patents
A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie Download PDFInfo
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- CN107132608A CN107132608A CN201710399286.9A CN201710399286A CN107132608A CN 107132608 A CN107132608 A CN 107132608A CN 201710399286 A CN201710399286 A CN 201710399286A CN 107132608 A CN107132608 A CN 107132608A
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- layer
- base material
- counterdie
- circuit
- conductive silver
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- 230000003287 optical effect Effects 0.000 title claims abstract description 12
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 60
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000001828 Gelatine Substances 0.000 claims abstract description 17
- 229920000159 gelatin Polymers 0.000 claims abstract description 17
- 235000019322 gelatine Nutrition 0.000 claims abstract description 17
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 208000003443 Unconsciousness Diseases 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000010030 laminating Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 76
- 239000000976 ink Substances 0.000 description 36
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 206010054949 Metaplasia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Planar Illumination Modules (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The processing method of a kind of public integrated guide optical mode group counterdie of the present invention, guide-lighting module and counterdie, counterdie includes base material and connection strap, connection strap is wholely set with base material, conductive silver slurry layer is provided with base material front and connection strap, the circuit that conductive silver slurry layer corresponds to lighting circuit is set, connection-peg is provided with connection strap tip position, base material front is provided with reflective ink layer, reflective ink layer is not provided with the pad locations of the circuit of conductive silver slurry layer formation, it is provided with the pad locations of the circuit of conductive silver slurry layer formation above LED, reflective ink layer and is provided with gelatine layer.Of the invention that circuit and LED are directly set on counterdie, the step of can saving laminating FPC lamp bars is adapted to mechanization production, can not only reduce material cost, can also reduce cost of labor, production efficiency improved, at the same time it can also improve product quality.
Description
Technical field
The present invention disclose a kind of integrated guide optical mode group, particularly a kind of guide-lighting module counterdie, leaded light module and counterdie
Processing method.
Background technology
Guide-lighting module is the essential accessory such as mobile phone, illuminated keyboard, tablet personal computer, and it can be mobile phone, tablet personal computer
Deng display screen backlight is provided, or illuminated keyboard etc. provides backlight.The structure of guide-lighting module generally includes counterdie（Also referred to as
For reflective membrane）, light guiding film, photomask and FPC lamp bars, counterdie, light guiding film and photomask be installed together, and forms guide-lighting mould
Group, FPC lamp bars are mounted on the outside of guide-lighting module, provide light source, such a structure for guide-lighting module, it is necessary to which FPC lamp bars are made
It is long, it is approximately equivalent to the length of whole guide-lighting module, on the one hand, the processing cost of FPC lamp bars is very high, and the price of lamp bar in itself is held high
It is expensive, so that so that the cost of whole leaded light module is very high, and cost is not easily controlled；On the other hand, FPC lamp bars need artificial hand
It is dynamic to be fitted, it is fit together with guide-lighting module, due to laminating when FPC lamp bars on LED will with guide-lighting module
Hole position alignment, so more time-consuming during laminating, cost of labor remains high, and production efficiency is relatively low.
The content of the invention
The shortcoming of manual assembly FPC lamp bars is needed for guide-lighting module of the prior art mentioned above, the present invention is carried
For the processing method of a kind of integrated guide optical mode group counterdie, guide-lighting module and counterdie, its is set directly on counterdie circuit with
LED, the step of laminating FPC lamp bars can be saved.
The present invention solve its technical problem use technical scheme be：A kind of integrated guide optical mode group counterdie, counterdie includes
Base material and connection strap, connection strap are wholely set with base material, and conductive silver slurry layer, conductive silver are provided with base material front and connection strap
The circuit that pulp layer corresponds to lighting circuit is set, and connection-peg is provided with connection strap tip position, and base material front is provided with reflective ink
Reflective ink layer, the weldering of the circuit of conductive silver slurry layer formation are not provided with layer, the pad locations of the circuit of conductive silver slurry layer formation
Pan Weizhichu is provided with above LED, reflective ink layer and is provided with gelatine layer.
A kind of guide-lighting module, guide-lighting module includes counterdie described above, light guide plate and photomask, and counterdie is bonded with light guide plate
Together, being fixedly installed above light guide plate on photomask, photomask needs printing opacity position to be provided with hollow out.
A kind of processing method of guide-lighting module counterdie described above, this method comprises the steps：
（1）, get the raw materials ready：Base material is used as from resistant to elevated temperatures PET material；
（2）, printing black ink：Printing on substrates is provided with black-out ink layer；
（3）Print conductive silver paste：Conductive silver slurry layer is provided with base material and connection strap front, conductive silver slurry layer is according to circuit line
Road is set；
（4）Printing white printing ink：Reflective ink layer is provided with base material front, when reflective ink layer is set, is avoided on circuit
Pad locations；
（5）Print gelatine layer：Gelatine layer is set on reflective ink layer, when glue is set, the pad locations on circuit are avoided；
（6）It is punched profile：Base material punching and shaping after glue will be printed using bicker；
（7）Point conducting resinl：Conducting resinl is set at pad locations on the line；
（8）LED is installed：LED is set on pad；
（9）Dry：The base material installed after LED is dried, LED is fixedly installed togather with base material.
The technical scheme that the present invention solves the use of its technical problem further comprises：
Black-out ink layer is provided with described base material.
Described black-out ink layer is arranged on substrate backside.
Described LED is bonded in pad locations by conducting resinl.
Off-style paper layer is provided with above described gelatine layer.
Conductive carbon paste layer is provided with the outside of circuit at described connection-peg position.
Setting conductive carbon paste layer at the connection-peg position of connection strap is additionally included in after printing conductive silver paste.
One layer of off-style paper layer is covered after drying on substrate upper surface, off-style paper layer is pasted onto above gelatine layer.
The beneficial effects of the invention are as follows：It is of the invention that circuit and LED are directly set on counterdie, laminating FPC lamp bars can be saved
The step of, it is adapted to mechanization production, can not only reduces material cost, cost of labor can also be reduced, improves production efficiency, together
When, product quality can also be improved.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Brief description of the drawings
Fig. 1 is counterdie part section structural representation of the present invention.
Fig. 2 is structural representation after process second step of the present invention.
Fig. 3 is structural representation after the step of process the 3rd of the present invention.
Fig. 4 is structural representation after the step of process the 4th of the present invention.
Fig. 5 is structural representation after the step of process the 6th of the present invention.
Fig. 6 is structural representation after the step of process the 8th of the present invention.
In figure, 1- base materials, 2- black ink layers, 3- silver slurry layers, 4- white inks layer, 5- gelatine layers, 6- off-style paper layers, 7-
Connection strap, 8- connection-pegs, 9- structure holes.
Embodiment
The present embodiment is the preferred embodiment for the present invention, and other all its principle and basic structure are identical or near with the present embodiment
As, within the scope of the present invention.
The counterdie that refer in accompanying drawing 1, the present invention mainly includes base material 1 and connection strap 7, and connection strap 7 is integrally set with base material 1
Put, black ink layer 2 is provided with base material 1（That is black-out ink layer, when it is implemented, black-out ink layer can also select other
Suitable color）, in the present embodiment, black ink layer 2 is arranged on the back side of base material 1（In the present invention, by light extraction one side on base material 1
Base material front is defined as, another side is then defined as substrate backside）, when it is implemented, black ink layer 2 can also be arranged on into base
In the front of material 1, the present embodiment, black ink layer 2 is arranged on base material 1 by the way of printing, when it is implemented, base material 1 is just
Conductive silver slurry layer 3 is provided with face and connection strap 7, the circuit that conductive silver slurry layer 3 corresponds to lighting circuit is set, connection strap 7
Connection-peg 8 is provided with tip position, conductive silver slurry layer 3 is arranged on base material 1 using mode of printing, when the front of base material 1 is provided with black
During color ink layer 2, the front of base material 1 is provided with white ink layer 4（I.e. reflective ink layer, when it is implemented, reflective ink layer can also
From other suitable colors）, white ink layer 4 covers the front of whole base material 1, includes the conductive silver slurry layer 3 of circuit, but
It is that white ink layer 4, that is, when printing conductive silver slurry layer 3, weldering are not provided with the pad locations of the circuit of the formation of conductive silver slurry layer 3
Pan Weizhichu is vacated, and LED is provided with LED, the pad locations of the circuit of the formation of conductive silver slurry layer 3 in order to install, for shining
Bright, in the present embodiment, LED is bonded at pad locations by conducting resinl, in the present embodiment, and the top of white ink layer 4 is provided with water
Glue-line 5, the top of gelatine layer 5 is provided with off-style paper layer 6, for protecting counterdie.
In the present embodiment, on the outside of the circuit at the position of connection-peg 8（At golden finger position）Provided with conductive carbon paste layer,
Layer protective layer is formed by printing conductive carbon paste, to increase its hardness and wearability.
In the present embodiment, base material 1 uses high temperature resistant（Tolerable temperature is more than 200 DEG C）PET material be made.
The present invention protects a kind of guide-lighting module for including above-mentioned counterdie simultaneously, and it mainly includes counterdie, light guide plate and shading
Film, counterdie is bonded together with light guide plate, and being fixedly installed above light guide plate on photomask, photomask needs printing opacity position to be provided with
Hollow out.
The present invention also protects a kind of processing method of above-mentioned counterdie, and this method mainly comprises the steps：
（1）, get the raw materials ready：In the present embodiment, from high temperature resistant（Tolerable temperature is more than 200 DEG C）PET material be used as base material 1；
（2）, printing black ink：Accompanying drawing 2 is refer to, prints and is provided with black ink layer 2, the present embodiment on base material 1, is printed
Printed during black ink layer 2 using 250 mesh half tones, in the present embodiment, black ink layer 2 is arranged on the back side of base material 1, specifically
During implementation, black ink layer 2 can also be arranged on to the front of base material 1, so as to make the light guide film group after assembling from outer surface
See in black, to reach more preferable shaded effect；
（3）Print conductive silver paste：Accompanying drawing 3 is refer to, printing is provided with conductive silver slurry layer 3 on base material 1 and the front of connection strap 7,
Conductive silver slurry layer 3 prints according to circuit-line, in the present embodiment, is printed during printing conductive silver slurry layer 3 using 250 mesh half tones
In brush, the present embodiment, conductive silver paste forms electricity using the model 8400FL of upper Hypon silver production silver paste by conductive silver paste
In line circuit, the present embodiment, conductive silver slurry layer thickness is 0.10-0.015mm；
（4）Printing white printing ink：Accompanying drawing 4 is refer to, printing is provided with white ink layer 4 on the front of base material 1, has reached reflective
Effect, during printing white ink layer 4, avoids the pad locations on circuit, i.e., vacates pad locations, in the present embodiment, printing
Printed during white ink layer 4 using 250 mesh half tones；
（5）Print gelatine layer：Printing is provided with gelatine layer 5 on white ink layer 4, for being bonded with light guiding film, the present embodiment
In, gelatine layer uses model 3M-SP7533 3M glues, during printing glue, avoids the pad locations on circuit, i.e., by pad
Position is vacated, in the present embodiment, is printed during printing glue using 100 mesh half tones；
（6）It is punched profile：Accompanying drawing 5 is refer to, the punching and shaping of base material 1 after glue will be printed using bicker, during punching, including
The punching of outline die and internal fabrication hole, structure hole etc.；
（7）Point conducting resinl：Conducting resinl is set at pad locations on the line, for pasting the conducting resinl in LED, the present embodiment
The model TK112 produced using Tai Ke new materials Science and Technology Ltd. of Shenzhen conducting resinl, conducting resinl can use point gum machine
Carry out dispensing setting, it would however also be possible to employ screen painting form carries out printing setting；
（8）LED is installed：Accompanying drawing 6 is refer to, LED is set on pad using SMT processing equipments, i.e., LED etc. is arranged on circuit
On pad locations at；
（9）Dry：The base material installed after LED is dried, in the present embodiment, using it is baked by the way of Reflow Soldering
Dry, baking temperature is 150-200 DEG C, and baking time is 10-20 minutes, conducting resinl is dried, you can fix LED with base material 1
It is installed together.
In the present embodiment, one layer of off-style paper layer 6 can be covered on the upper surface of base material 1 after drying, to be protected to it,
Off-style paper layer 6 is pasted onto the top of gelatine layer 5.
In the present embodiment, also include a step after printing conductive silver paste, that is, print conductive carbon paste layer, conductive carbon paste
Layer is arranged at the position of connection-peg 8 of connection strap 7, and to increase hardness and wearability at the position of connection-peg 8, connection-peg 8 is suitable
In golden finger position.
Of the invention that circuit and LED are directly set on counterdie, the step of can saving laminating FPC lamp bars is adapted to machinery metaplasia
Production, can not only reduce material cost, can also reduce cost of labor, production efficiency be improved, at the same time it can also improve product matter
Amount.
Claims (10)
1. a kind of integrated guide optical mode group counterdie, it is characterized in that：Described counterdie includes base material and connection strap, connection strap and base material
It is wholely set, conductive silver slurry layer is provided with base material front and connection strap, conductive silver slurry layer corresponds to the circuit of lighting circuit
Set, connection-peg is provided with connection strap tip position, base material front is provided with reflective ink layer, the circuit of conductive silver slurry layer formation
It is not provided with that LED, reflective ink are installed at reflective ink layer, the pad locations of the circuit of conductive silver slurry layer formation at pad locations
Layer top is provided with gelatine layer.
2. integrated guide optical mode group counterdie according to claim 1, it is characterized in that：Shading oil is provided with described base material
Layer of ink.
3. integrated guide optical mode group counterdie according to claim 2, it is characterized in that：Described black-out ink layer is arranged on base
The material back side.
4. integrated guide optical mode group counterdie according to claim 1, it is characterized in that：Described LED passes through conductive glue bond
In pad locations.
5. integrated guide optical mode group counterdie according to claim 1, it is characterized in that：Provided with release above described gelatine layer
Ply of paper.
6. integrated guide optical mode group counterdie according to claim 1, it is characterized in that：Circuit at described connection-peg position
Outside is provided with conductive carbon paste layer.
7. a kind of guide-lighting module, it is characterized in that：Described guide-lighting module is included as described in any one in claim 1 to 6
Counterdie, light guide plate and photomask, counterdie are bonded together with light guide plate, and photomask, photomask are fixedly installed above light guide plate
On need printing opacity position be provided with hollow out.
8. a kind of processing method of guide-lighting module counterdie as described in any one in claim 1 to 6, it is characterized in that：It is described
Method comprise the steps：
（1）, get the raw materials ready：Base material is used as from resistant to elevated temperatures PET material；
（2）, printing black ink：Printing on substrates is provided with black-out ink layer；
（3）Print conductive silver paste：Conductive silver slurry layer is provided with base material and connection strap front, conductive silver slurry layer is according to circuit line
Road is set；
（4）Printing white printing ink：Reflective ink layer is provided with base material front, when reflective ink layer is set, is avoided on circuit
Pad locations；
（5）Print gelatine layer：Gelatine layer is set on reflective ink layer, when glue is set, the pad locations on circuit are avoided；
（6）It is punched profile：Base material punching and shaping after glue will be printed using bicker；
（7）Point conducting resinl：Conducting resinl is set at pad locations on the line；
（8）LED is installed：LED is set on pad；
（9）Dry：The base material installed after LED is dried, LED is fixedly installed togather with base material.
9. processing method according to claim 8, it is characterized in that：Connection strap is additionally included in after printing conductive silver paste
Conductive carbon paste layer is set at connection-peg position.
10. processing method according to claim 8, it is characterized in that：A leafing is covered after drying on substrate upper surface
Type ply of paper, off-style paper layer is pasted onto above gelatine layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710399286.9A CN107132608A (en) | 2017-05-31 | 2017-05-31 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710399286.9A CN107132608A (en) | 2017-05-31 | 2017-05-31 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
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| Publication Number | Publication Date |
|---|---|
| CN107132608A true CN107132608A (en) | 2017-09-05 |
Family
ID=59735141
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710399286.9A Pending CN107132608A (en) | 2017-05-31 | 2017-05-31 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110831342A (en) * | 2019-11-15 | 2020-02-21 | 上海摩软通讯技术有限公司 | Preparation method of miniLED backlight module |
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Application publication date: 20170905 |