CN104183584A - LED array light source structure - Google Patents
LED array light source structure Download PDFInfo
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- CN104183584A CN104183584A CN201410409588.6A CN201410409588A CN104183584A CN 104183584 A CN104183584 A CN 104183584A CN 201410409588 A CN201410409588 A CN 201410409588A CN 104183584 A CN104183584 A CN 104183584A
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- array light
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- led array
- source structure
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Abstract
The invention discloses an LED array light source structure. The LED array light source structure comprises an insulating substrate, a plurality of bonding pads, through holes, metal pins, a heat dissipation layer, a plurality of LED chips and an optical element. The bonding pads are distributed on the front face of the insulating substrate in an array mode and are connected through metal wires to fall into multiple rows and multiple lines. The through holes are formed in the insulating substrate. The metal wires through which the bonding pads in each row and the bonding pads in each line are connected are led to the back face of the insulating substrate through the through holes. The metal pins are arranged on the back face of the insulating substrate, electrically connected with the metal wires led to the back face of the insulating substrate, and used for being connected with a driving element. The heat dissipation layer is arranged on the side wall and/or the back face of the insulating substrate and used for heat dissipation. The LED chips are fixed to the bonding pads. The optical element is used for packaging the LED chips and used for protecting the LED chips and conducting secondary light distribution. By means of the LED array light source structure, an LED array light source is packaged in a more integrated and miniaturized mode, the packaging process is simplified, and packaging cost is reduced.
Description
Technical field
The invention belongs to technical field of semiconductors, particularly relate to a kind of LED array light-source structure.
Background technology
Development along with LED technology, LED range of application is also in continuous expansion, the light source based on LED array particularly, not only be used to make lighting and LCD backlight, for example, in special lighting field (animals and plants cultivation), active Display Technique, projection light source, the fields such as adjustable spectral illumination and visible light communication are also applied gradually.In order to meet different occasion needs, give full play to the characteristic of LED, promote the output spectrum of LED array light source and the degree of freedom of light intensity, need to modulate the every LEDs in LED array.Along with technological progress, need the encapsulation of LED array light source constantly integrated simultaneously, miniaturization, and packaging technology and step are optimized, reduce costs.Therefore being necessary to design a kind of LED array light-source structure on the basis of LED Wafer level packaging meets the demand of various occasions to LED array light source.
Summary of the invention
For problems of the prior art, the object of the present invention is to provide a kind of LED array light-source structure.
The invention provides a kind of LED array light-source structure, comprising:
Insulated substrate;
A plurality of pads, its array distribution is positive at insulated substrate, between them, by metal wire, connects into many rows and multiple row;
Through hole, it is opened on insulated substrate, and the metal wire that connects each row and the pad of each row is directed to the insulated substrate back side by described through hole;
Metal pin, it is arranged on the insulated substrate back side, and is electrically connected to the metal wire that causes the insulated substrate back side, for connecting driving element;
Heat dissipating layer, it is arranged on insulated substrate sidewall and/or the back side, for heat radiation;
A plurality of LED chips, it is fixed on described pad;
Optical element, it is for encapsulating described LED chip, for the protection of LED chip and secondary light-distribution.
This method has been optimized the electric connection of inner each LED chip of LED array, utilize conductive through hole simultaneously, metallic circuit is imported to the back side of substrate, through electrode, distribute again and form the pin of LED array light source, that has realized on the one hand the output spectrum of any LEDs chip in LED array light source and even array and light intensity can modularity, flexibility ratio and the degree of freedom of the output of LED array light source light have been increased, met special lighting (animals and plants cultivation), active Display Technique, projection light source, adjustable spectral illumination is to the spectrum of light emitting diode matrix and brightness requirement, on the other hand, make the encapsulation of LED array light source more integrated, miniaturization, simplified packaging technology, reduced packaging cost.
Accompanying drawing explanation
Fig. 1 a is the front schematic view (before die bond) of the light-source structure of LED array described in the present invention;
Fig. 1 b is the front schematic view (after die bond) of the light-source structure of LED array described in the present invention;
Fig. 2 is the schematic rear view of the light-source structure of LED array described in the present invention;
Fig. 3 is the generalized section of the light-source structure of LED array described in the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in further detail.
Refer to shown in Fig. 1 a, 1b to Fig. 3, the invention provides a kind of LED array light source, comprising:
Insulated substrate 10, described insulated substrate 10 can be individual layer, bilayer or multi-layer sheet, insulated substrate 10 can be PCB substrate, ceramic substrate, sapphire substrate, organic material substrate, glass substrate or High Resistivity Si, insulation property are good;
A plurality of pads 101 and metallic circuit 102, described a plurality of pad 101 array distribution, in the front of insulated substrate, laterally or are vertically passed through metallic circuit 102 interconnected between them;
Through hole 103, it is opened in the edge of insulated substrate 10, for being connected by metal wire 102 with horizontal or vertical connected pad 101; Each row horizontal or that vertically connect or the tail end of each row pad are connected in one of them through hole 103; Described through hole 103 is circular hole or groove, can utilize chemical corrosion, etching, the technique such as laser, machine drilling or and process combination process, in through hole 103, be filled with conducting metal 107, the conducting metal 107 of filling in described through hole 103 can be all fill or be partially filled, described in be partially filled and refer to and on the sidewall of through hole 103, fill one deck conducting metal;
Metal pin 104, metallic circuit 102 is directed to the back side of insulated substrate 10 through through hole 103, carry out electrode distribution design again, form the metal pin 104 of LED array light source, by metal pin 104, be connected with driving element, also be beneficial to a plurality of described LED array light-source structure splicings, form more large-area LED array structure; Described metal pin 104 is when splicing or being connected driving element with other LED array light-source structures, from lsi internal circuit, draw the wiring with peripheral circuit, some similar and pad, can adopt pressure welding, the modes such as Reflow Soldering realize and being connected of other circuit, and prerequisite is that other circuit or element also have corresponding pin;
Heat dissipating layer 105, it is arranged on sidewall and/or the back side of insulated substrate 10, for effectively reducing the working temperature of LED chip 106, i.e. heat radiation;
Metallic circuit 102 surfaces are through protectiveness coating processing, avoid being subject to the intrusion of machinery, steam, dust and pernicious gas, for example cover silicon dioxide, polyimides or insulating cement or and combination, simultaneously, in any two metallic traces 102 intersection regions, be prepared with insulating barrier, as coating polyimide, silicon dioxide etc., avoid any two metallic traces short circuits of opposed polarity or any two metallic traces of polarity of the same race to be communicated with, realize the independent of any LEDs chip in LED array controlled;
A plurality of LED chips 106, it is connected on pad 101, described LED chip 106 can be vertical, formal dress or inverted structure, and according to above-mentioned three kinds of different structure kinds, by LED chip by pressure welding, ball bonding technique is connected on corresponding pad, or by prepare anisotropic-electroconductive adhesive on pad, realize and being electrically connected, for simplifying technique, reduce costs, also can utilize anisotropic-electroconductive adhesive (being to be dispersed with conductive particle in adhesive to form by the epoxy that contains epoxy compounds curing agent) to replace planting ball step in bond technology, by the anisotropic-electroconductive adhesive for preparing on pad 101 as dielectric layer, LED chip 106 is fixed on substrate 10, while is due to the characteristic of anisotropic-electroconductive adhesive, realize and being electrically connected.Described LED chip 106 can be of the same race or have the combination of the LED chip of not photochromic output of the same race, and as required, can be at LED chip 106 surface-coated fluorescence transition materials 108, or monolithic molding after utilizing LED plastic packaging (molding) technique that fluorescence transition material 108 is mixed with silica gel, cover on LED chip 106, adjust its photochromic output;
Optical element 107, it is as the shell of LED chip, for packaging LED chips 106; Described optical element 107 can be silica gel, resin or glass, or and combination, LED chip 106 is played to protection and the effect of secondary light-distribution; Wherein, once light-distribution refers to the encapsulation of LED, because encapsulation affects amount of light; After having encapsulated, just have secondary light-distribution, that is exactly change the direction of illumination of LED and irradiate uniformity by the combination of LED or by other optical elements, and this is secondary light-distribution.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a LED array light-source structure, comprising:
Insulated substrate;
A plurality of pads, its array distribution is positive at insulated substrate, between them, by metal wire, connects into many rows and multiple row;
Through hole, it is opened on insulated substrate, and the metal wire that connects each row and the pad of each row is directed to the insulated substrate back side by described through hole;
Metal pin, it is arranged on the insulated substrate back side, and is electrically connected to the metal wire that causes the insulated substrate back side, for connecting driving element;
Heat dissipating layer, it is arranged on insulated substrate sidewall and/or the back side, for heat radiation;
A plurality of LED chips, it is fixed on described pad;
Optical element, it is for encapsulating described LED chip, for the protection of LED chip and secondary light-distribution.
2. LED array light-source structure as claimed in claim 1, wherein, described metal pin is also electrically connected to other array light source structures, to splice a plurality of LED array light-source structures.
3. LED array light-source structure as claimed in claim 1, wherein, described metallic circuit surface is through protectiveness coating processing, and is prepared with insulating barrier in any two metallic traces intersection regions.
4. LED array light-source structure as claimed in claim 1, wherein, described LED chip is connected on corresponding pad by pressure welding, ball bonding technique, or by prepare anisotropic-electroconductive adhesive on pad, realizes and being electrically connected.
5. LED array light-source structure as claimed in claim 1, wherein, described through hole is circular hole or groove, is filled with conducting metal in through hole.
6. LED array light-source structure as claimed in claim 1, wherein, described a plurality of LED chips comprise having the of the same race or LED chip of photochromic output of the same race not.
7. LED array light-source structure as claimed in claim 1, wherein, described LED chip surface-coated has fluorescence transition material, or is coated with that fluorescence transition material mixes with silica gel and integrally formed material.
8. LED array light-source structure as claimed in claim 1, wherein, described LED chip comprises vertically, formal dress or inverted structure, and is fixed on corresponding pad according to these three kinds of different structure kinds.
9. LED array light-source structure as claimed in claim 1, wherein, described optical element is one or more the combination in silica gel, resin, glass.
10. LED array light-source structure as claimed in claim 3, wherein, described metallic circuit surface refers to that through protectiveness coating processing its surface coverage has one or more the combination in silicon dioxide, polyimides, insulating cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410409588.6A CN104183584A (en) | 2014-08-19 | 2014-08-19 | LED array light source structure |
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| CN201410409588.6A CN104183584A (en) | 2014-08-19 | 2014-08-19 | LED array light source structure |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
| CN105720182A (en) * | 2015-09-27 | 2016-06-29 | 重庆品鉴光电工程有限公司 | Novel LED sapphire support |
| CN107132608A (en) * | 2017-05-31 | 2017-09-05 | 深圳市汇创达科技股份有限公司 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
| CN107843277A (en) * | 2017-12-25 | 2018-03-27 | 上海恩弼科技有限公司 | Optical encoder and preparation method thereof |
| CN109585636A (en) * | 2018-12-05 | 2019-04-05 | 中山市华南理工大学现代产业技术研究院 | A kind of encapsulating structure of visible light communication LED chip array |
| CN110323250A (en) * | 2018-03-30 | 2019-10-11 | 同泰电子科技股份有限公司 | Encapsulating structure for display |
| CN111343794A (en) * | 2018-12-19 | 2020-06-26 | 同扬光电（江苏）有限公司 | Flexible circuit board structure and manufacturing method thereof |
| CN112435999A (en) * | 2019-08-26 | 2021-03-02 | 中国科学院半导体研究所 | Surface-mounted LED packaging light source and preparation method |
| CN112712764A (en) * | 2019-10-24 | 2021-04-27 | 深圳市百柔新材料技术有限公司 | Method for manufacturing display panel |
| CN114974004A (en) * | 2022-06-14 | 2022-08-30 | 深圳市稳耀半导体科技有限公司 | High-density patch type dot matrix nixie tube with novel structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
| CN105720182A (en) * | 2015-09-27 | 2016-06-29 | 重庆品鉴光电工程有限公司 | Novel LED sapphire support |
| CN107132608A (en) * | 2017-05-31 | 2017-09-05 | 深圳市汇创达科技股份有限公司 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
| CN107843277A (en) * | 2017-12-25 | 2018-03-27 | 上海恩弼科技有限公司 | Optical encoder and preparation method thereof |
| CN110323250A (en) * | 2018-03-30 | 2019-10-11 | 同泰电子科技股份有限公司 | Encapsulating structure for display |
| CN109585636A (en) * | 2018-12-05 | 2019-04-05 | 中山市华南理工大学现代产业技术研究院 | A kind of encapsulating structure of visible light communication LED chip array |
| CN111343794A (en) * | 2018-12-19 | 2020-06-26 | 同扬光电（江苏）有限公司 | Flexible circuit board structure and manufacturing method thereof |
| CN112435999A (en) * | 2019-08-26 | 2021-03-02 | 中国科学院半导体研究所 | Surface-mounted LED packaging light source and preparation method |
| CN112712764A (en) * | 2019-10-24 | 2021-04-27 | 深圳市百柔新材料技术有限公司 | Method for manufacturing display panel |
| CN112712764B (en) * | 2019-10-24 | 2022-09-02 | 深圳市百柔新材料技术有限公司 | Method for manufacturing display panel |
| CN114974004A (en) * | 2022-06-14 | 2022-08-30 | 深圳市稳耀半导体科技有限公司 | High-density patch type dot matrix nixie tube with novel structure |
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Application publication date: 20141203 |