CN114974004A - High-density patch type dot matrix nixie tube with novel structure - Google Patents
High-density patch type dot matrix nixie tube with novel structure Download PDFInfo
- Publication number
- CN114974004A CN114974004A CN202210667802.2A CN202210667802A CN114974004A CN 114974004 A CN114974004 A CN 114974004A CN 202210667802 A CN202210667802 A CN 202210667802A CN 114974004 A CN114974004 A CN 114974004A
- Authority
- CN
- China
- Prior art keywords
- light
- substrate
- dot matrix
- density patch
- type dot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 230000001012 protector Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-density patch type dot matrix nixie tube with a new structure, which comprises: the light-emitting device comprises a first substrate, a second substrate and a plurality of light-emitting elements, wherein conductive circuits are formed on the first substrate, a plurality of through holes are formed in the second substrate, the second substrate is arranged on the first substrate in a stacked mode and is provided with the light-emitting elements, the light-emitting elements are arrayed on the first substrate and are electrically connected with the corresponding conductive circuits, the light-emitting elements are located in the corresponding through holes, and light-emitting element protection devices are arranged at the through holes. The invention has the beneficial effects that: the product thickness of 0.8mm is only 1/4 of the thickness of the mainstream product in the market; the substrate is fast and convenient to process, a special die is not needed for molding, and the die cost is saved; the existing mainstream product is limited by the molding capability of a mold, the minimum distance between the centers of all the light-emitting elements is 2.5mm, which is far more than the distance within 1.4mm (inclusive); under the same light-emitting area, the presented light-emitting effect is more detailed, and the displayed information content is more diversified; in addition, the product is of a patch type packaging structure, and compared with a plug-in structure, the assembly efficiency in the use process is greatly improved.
Description
Technical Field
The invention relates to the technical field of nixie tubes, in particular to a high-density patch type dot matrix nixie tube with a novel structure.
Background
Dot matrix LEDs and nixie tubes are very mature products and widely used in the field of image and text display and indication, such as elevator travel direction and floor display, escalator travel direction and status display, robot display, billboards, etc. Referring to fig. 9A to 9C, the conventional dot matrix LED has the following problems: 1. in the manufacturing process, the reflection cover is required to separate each array type light-emitting element to achieve the functions of displaying character or symbol information and avoiding light channeling, and the manufacturing of the reflection cover needs a specific forming die and has the problems of high cost, complex process, time consumption and the like; 2. the minimum center distance of each light-emitting element can only reach 2mm due to the limitation of the molding capability of a mold, and the display effect is greatly limited due to the insufficient density of the existing dot matrix light source; 3. the existing dot matrix nixie tubes are packaged in a plug-in form with pins, so that the dot matrix nixie tubes are inconvenient to assemble; 4. the thickness of the existing dot matrix nixie tube is more than 4mm, so that too much space is occupied, and the correspondingly used product is large and heavy in size.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention aims to overcome at least part of the defects in the prior art and provide a high-density patch type dot matrix nixie tube with a novel structure.
The technical scheme of the invention is as follows: the invention provides a high-density patch type dot matrix nixie tube with a new structure, which comprises: the LED lamp comprises a first substrate, a second substrate and a plurality of light-emitting elements, wherein conductive circuits are formed on the first substrate, the second substrate is arranged on the first substrate in a stacking mode, a plurality of through holes are formed in the second substrate, the light-emitting elements are arranged on the first substrate in an array mode and are electrically connected with the corresponding conductive circuits, the light-emitting elements are located in the corresponding through holes, and light-emitting element protection devices are arranged at the positions of the through holes.
Further, the light emitting element is an LED wafer particle or an LED package light source.
Further, the light-emitting element protection device comprises silica gel, epoxy resin, teflon, a film or a glass sheet.
Further, two conductive pins of the light-emitting element are respectively disposed on the corresponding conductive circuit through a conductive adhesive, wherein the conductive adhesive includes a silver-containing conductive adhesive, a solder paste or a soldering flux.
Furthermore, the light-emitting element is electrically connected with the conductive circuit in a conductive adhesive or gold wire bonding mode.
Further, the substrate comprises an aluminum substrate, a glass fiber board or a flexible circuit board.
Further, the second substrate uses a PCB board with a light blocking component or a light blocking design structure is provided on an inner wall of the through hole of the second substrate.
Furthermore, a plurality of bonding pads are formed on the back surface of the first substrate, and the bonding pads are electrically connected with the corresponding conductive circuits.
Further, the center-to-center distance between the adjacent light emitting elements is 0.5mm to 1.4 mm.
Furthermore, the thickness of the high-density patch type dot matrix nixie tube with the new structure is 0.8 mm-1.6 mm.
By adopting the scheme, the invention has the beneficial effects that: 1. the thickness of the product is only about 0.8mm, and the thickness of the product is only 1/4 of the thickness of the mainstream product in the market; 2. the processing of the substrate is quick and convenient, and a special die is not needed for molding, so that the die cost is saved; 3. the existing mainstream product is limited by the forming capability of a mold, the minimum center distance of each light-emitting element is 2.5mm, and the product is not limited by the forming capability of the mold, so that the center distance of each light-emitting element can be within 1.4mm (inclusive), the display effect can be greatly improved, and under the same light-emitting area, a more detailed light-emitting effect is presented, and more diversified information contents are displayed; 4. this product is paster type packaging structure, compares in the plug-in components type structure of taking many pins on the current market, has improved the assembly efficiency in the use by a wide margin.
Drawings
Fig. 1 is an exploded view of the structure of the present invention.
Fig. 2 is a schematic structural diagram of a first substrate according to the present invention.
Fig. 3 is an enlarged view of a portion a in fig. 2.
FIG. 4 is a schematic view of a backside structure of a first substrate according to the present invention.
Fig. 5 is a schematic structural diagram of a second substrate according to the present invention.
Fig. 6 is a schematic view of an arrangement structure of the light emitting element of the first alternative embodiment.
Fig. 7 is a schematic view of an arrangement structure of a light emitting element according to a second alternative embodiment.
Fig. 8 is a schematic view of an arrangement structure of a light emitting element according to a third alternative embodiment.
Fig. 9A to 9C are schematic diagrams illustrating a structure and a size of a conventional plug-in nixie tube.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
Referring to fig. 1 and 5, in this embodiment, the present invention provides a high-density patch-type dot matrix digital tube with a new structure, which includes: the light-emitting diode comprises a first substrate 1, a second substrate 3 and a plurality of light-emitting elements 2, wherein a conductive circuit 11 is formed on the first substrate 1, the second substrate 3 is arranged on the first substrate 1 in a stacked mode, a plurality of through holes 31 are formed in the second substrate 3, the light-emitting elements 2 are arranged on the first substrate 1 in an array mode and are electrically connected with the corresponding conductive circuit 11, the light-emitting elements 2 are located in the corresponding through holes 31, and light-emitting element protection devices (not shown) are arranged at the positions of the through holes 31. In this scheme, the first substrate 1 and the second substrate 2 are PCB boards, which may be aluminum substrates, glass fiber boards, or flexible circuit boards (or other types of substrates).
Further, the light emitting element 1 is an LED wafer particle or an LED package light source.
Further, the material of light-emitting element protection device is silica gel or epoxy, can be for filling the curing shaping obtains in the through-hole 32, light-emitting element protection device also can be silica gel, epoxy, teflon, film or glass piece (also can be other materials), adopts the mode of glue bonding to fix the surface of second base plate 3.
Optionally, referring to fig. 8, the two conductive pins of the light emitting device 2 are respectively disposed on the corresponding conductive traces 11 by a conductive adhesive 5 in a reflow soldering or heating baking manner, and the conductive adhesive 5 may be a solder paste, a conductive adhesive containing silver, or a flux.
Optionally, referring to fig. 6, one conductive pin of the light emitting device 2 is disposed on the corresponding conductive trace 11 through a conductive adhesive 5, and the other conductive pin is connected to the corresponding conductive trace 11 through a connection line 6, where the connection line is made of a metal material.
Optionally, referring to fig. 7, two conductive pins of the light emitting device 2 are respectively connected to the corresponding conductive traces 11 through corresponding connecting wires 6, the light emitting device 2 is fixed on the conductive traces 11 through an adhesive 7, and the adhesive 7 may be solder paste, conductive adhesive containing silver, flux, insulating adhesive, or the like.
Further, the second substrate 3 has a light blocking function, and optional embodiments include: 1. adding a light filtering dye into the second substrate 3, so that the material of the second substrate 3 can block the penetration of visible light; 2. a light-blocking coating (such as a metal coating) is disposed on the hole wall of the through hole 32 of the second substrate 3, and a chemical plating manner, a physical connection manner, or a direct spraying manner may be adopted, where the chemical plating manner may specifically be: the front surface and the back surface of the second substrate 3 are both provided with conductive metal, after the through hole 3 meeting the requirements is processed by drilling, a metal ring 4 which has a certain thickness and can isolate optical interference is formed around the hole wall by adopting a chemical method. The above modes can be selected together or alternatively.
Further, referring to fig. 1 to 5, a plurality of pads are formed on the back surface of the first substrate 1, and the pads are electrically connected to the corresponding conductive traces 11 through via holes, so that the product of the present disclosure can be mounted in a patch manner, and the mounting manner is more convenient.
Further, the center-to-center distance between the adjacent light emitting elements 2 may be 0.5mm to 1.4mm, and in this embodiment, 1.4 mm.
Further, the thickness of the dot matrix nixie tube is 0.8mm to 1.6mm, and in this embodiment, the thickness may be 1.2 mm. It should be noted that the thickness can be thinner, but in consideration of the light emitting effect, the problem of light crosstalk between adjacent light emitting points caused by the fact that the second substrate is too thin is avoided, and the thickness is generally 0.8 mm.
To sum up, this scheme's beneficial effect lies in: 1. the thickness of the product can reach only about 0.8mm, and the thickness of the product is only 1/4 of the thickness of the mainstream product in the market; 2. the processing of the substrate is quick and convenient, and a special die is not needed for molding, so that the die cost is saved; 3. the existing mainstream product is limited by the forming capability of a mold, the minimum center distance of each light-emitting element is 2.5mm, and the product is not limited by the capability of the mold, so that the center distance of each light-emitting element can be within 1.4mm (inclusive), the display effect can be greatly improved, and under the same light-emitting area, a more detailed light-emitting effect is presented, and more diversified information contents are displayed; 4. this product is paster type packaging structure, compares in the plug-in components type structure of taking many pins on the current market, has improved the assembly efficiency in the use by a wide margin.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A high-density patch type dot matrix nixie tube with a new structure is characterized by comprising: the LED lamp comprises a first substrate, a second substrate and a plurality of light-emitting elements, wherein conductive circuits are formed on the first substrate, the second substrate is arranged on the first substrate in a stacking mode, a plurality of through holes are formed in the second substrate, the light-emitting elements are arranged on the first substrate in an array mode and are electrically connected with the corresponding conductive circuits, the light-emitting elements are located in the corresponding through holes, and light-emitting element protection devices are arranged at the positions of the through holes.
2. The new structure high density patch type dot matrix digital tube as claimed in claim 1, wherein the light emitting device is an LED wafer pellet or an LED package light source.
3. The new structure high density patch type dot matrix digital tube as claimed in claim 1, wherein said light emitting element protector comprises silica gel, epoxy resin, teflon, film or glass sheet.
4. The new-structure high-density patch-type dot matrix nixie tube as claimed in claim 1, wherein two conductive pins of the light-emitting device are disposed on the corresponding conductive traces respectively by conductive adhesives, such as silver-containing conductive glue, solder paste or soldering flux.
5. The new-structure high-density patch-type dot matrix nixie tube as claimed in claim 1, wherein the light-emitting elements are electrically connected to the conductive traces by means of conductive adhesive or wire bonding.
6. The new-structure high-density patch-type dot matrix digital tube as claimed in claim 1, wherein the substrate comprises an aluminum substrate, a glass fiber board or a flexible circuit board.
7. The new-structure high-density patch-type dot matrix digital tube as claimed in any one of claims 1 to 6, wherein the second substrate is a PCB board with a light-blocking component or a light-blocking design structure is provided on the inner wall of the through hole of the second substrate.
8. The new-structure high-density patch-type dot matrix digital tube as claimed in any one of claims 1 to 6, wherein a plurality of pads are formed on the back surface of the first substrate, and the pads are electrically connected to the corresponding conductive traces.
9. The new-structure high-density patch-type dot matrix nixie tube as claimed in any one of claims 1 to 6, wherein the center-to-center distance between adjacent light-emitting elements is 0.5mm to 1.4 mm.
10. The new-structure high-density patch-type dot matrix nixie tube as claimed in any one of claims 1 to 6, wherein the thickness is 0.8mm to 1.6 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210667802.2A CN114974004A (en) | 2022-06-14 | 2022-06-14 | High-density patch type dot matrix nixie tube with novel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210667802.2A CN114974004A (en) | 2022-06-14 | 2022-06-14 | High-density patch type dot matrix nixie tube with novel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114974004A true CN114974004A (en) | 2022-08-30 |
Family
ID=82960751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210667802.2A Pending CN114974004A (en) | 2022-06-14 | 2022-06-14 | High-density patch type dot matrix nixie tube with novel structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114974004A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183584A (en) * | 2014-08-19 | 2014-12-03 | 中国科学院半导体研究所 | LED array light source structure |
| CN207896114U (en) * | 2018-01-17 | 2018-09-21 | 深圳市瑞丰光电子股份有限公司 | A kind of LED light emission device |
| CN114300450A (en) * | 2021-12-31 | 2022-04-08 | 深圳市恒耀达科技有限公司 | LED module for realizing smaller light source spacing through process optimization |
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
-
2022
- 2022-06-14 CN CN202210667802.2A patent/CN114974004A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183584A (en) * | 2014-08-19 | 2014-12-03 | 中国科学院半导体研究所 | LED array light source structure |
| CN207896114U (en) * | 2018-01-17 | 2018-09-21 | 深圳市瑞丰光电子股份有限公司 | A kind of LED light emission device |
| CN114300450A (en) * | 2021-12-31 | 2022-04-08 | 深圳市恒耀达科技有限公司 | LED module for realizing smaller light source spacing through process optimization |
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101036239B (en) | Chip component type light emitting device and wiring board for the same | |
| US20160245491A1 (en) | Transparent light emitting apparatus | |
| JP5989388B2 (en) | Package and package manufacturing method | |
| CN210167054U (en) | LED lamp bead and transparent LED display screen | |
| TW584972B (en) | Optical device module and method of fabrication | |
| CN100379036C (en) | A surface mounting type light emitting diode | |
| JP2015111620A (en) | Light emitting device and manufacturing method of the same | |
| CN106531730B (en) | LED package assembling and its manufacturing method | |
| JP2011151239A (en) | Lead frame for led and method for manufacturing led module | |
| CN213546315U (en) | Light-emitting unit | |
| CN210052758U (en) | Molded LED display module | |
| US4538143A (en) | Light-emitting diode displayer | |
| CN112331639B (en) | Substrate for manufacturing LED light source, manufacturing method and LED light source assembly | |
| US10219376B2 (en) | Light-emitting diode apparatus and method for manufacturing a light-emitting diode apparatus | |
| CN112735286A (en) | LED lamp bead | |
| CN113394329A (en) | LED display module, LED display module processing method and LED display screen | |
| CN114974004A (en) | High-density patch type dot matrix nixie tube with novel structure | |
| CN114122221B (en) | LED display module and manufacturing method thereof | |
| CN214312473U (en) | LED lamp bead | |
| CN214848669U (en) | High-contrast LED display device and module | |
| CN114300450A (en) | LED module for realizing smaller light source spacing through process optimization | |
| CN216288500U (en) | Full-color display screen SMD LED device | |
| CN215008265U (en) | LED packaging assembly | |
| CN109424864B (en) | Light source structure, electronic device and light source structure manufacturing method | |
| CN216873463U (en) | Pad structure of PCB circuit board and PCB circuit board comprising same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220830 |
|
| RJ01 | Rejection of invention patent application after publication |