CN101677120A - Method of producing light emitting diode - Google Patents
Method of producing light emitting diode Download PDFInfo
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- CN101677120A CN101677120A CN200810215592A CN200810215592A CN101677120A CN 101677120 A CN101677120 A CN 101677120A CN 200810215592 A CN200810215592 A CN 200810215592A CN 200810215592 A CN200810215592 A CN 200810215592A CN 101677120 A CN101677120 A CN 101677120A
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Abstract
The invention relates to a method of producing a light emitting diode, comprising the steps of solidifying crystal, injecting glue point by point, baking, sorting light color and packaging. The methodof producing the light emitting diode is mainly characterized in that after injecting the glue point by point for the first time in the processing of producing the light emitting diode, the light color of the semi-finished product is detected; if the droppoint of a light color coordinate shifts, the semi-finished product can be subjected to the glue injecting point by point again to achieve the effect of mending the light color coordinate; and after the semi-finished product is subjected to the baking and the optical processing, the light emitting diode with accurate light color is produced.The light color distribution of the monomeric light emitting diode produced with the method tends to be stable and accurate, thus the light emitting diode has higher yield during production.
Description
Technical field
The present invention relates to a kind of method for manufacturing light-emitting, carry out testing the look program after particularly a kind of some glue program in manufacturing process to promote the whole method for manufacturing light-emitting of making acceptance rate.
Background technology
Increase along with development of science and technology and photoelectric cell demand, light-emitting diode progressively replaces the luminescence unit on the market at present, and the associated electronic components of further arranging in pairs or groups, meet the electrooptical device of demand, for example ultraviolet germicidal lamp, infrared ray indicator light, illuminating apparatus etc. with manufacturing.According to different light demands, during manufacturing, then need select the light-emitting diode of different optical wavelength sections.Light-emitting diode mainly is to produce photochromicly when utilizing chip light emitting, and the chip of different materials can produce the light (photochromic) of different-waveband, and can be further with luminescence chip as light source, take fluorescent material again, to produce the effect of colour mixture with unlike material.The blue light that is sent with the GaAs chip for example, collocation fluorescent material so that the blue light that the GaAs chip sends, and produces white light after the fluorescent material colour mixture, promptly is a kind of application of colour mixture.Can also utilize and to send different photochromic multicore sheets respectively, carry out the light colour mixture.For example utilize the chip of red (R), green (G), blue (B) three kinds of colors, it is packaged into a light-emitting diode monomer after, can utilize the modulation of voltage, make it produce the effect of mixed light.
The application of light-emitting diode, the accuracy photochromic with it has absolute relation, and when especially large-area laying and application, photochromic distribution then can be too much because of colo(u)r bias as if inhomogeneous, causes the not good problem of photochromic distribution.Figure 1 shows that a kind of existing light-emitting diode, light-emitting diode 10 as shown in FIG., its mainly be by a base 101, a luminescence chip 102, a plain conductor 103, and optics cover 104 structure of organizing form, wherein, base 101 is plastic electrode (1011,1012) to be arranged, so that the light-emitting diode 10 of monomer can be arranged in the relevant electronic circuit.After luminescence chip 102 is as shown in FIG. finished routing (Bonding) operation, generally be to carry out a glue operation, be covered in luminescence chip 102 with epoxy resin, so that it is protected.And usually if after will making light-emitting diode 10 luminous, effect with mixed light then can add fluorescent material in the epoxy resin in manufacturing process, utilize the operation of some glue, make the mixture (jelly 105) of fluorescent material and epoxy resin, be covered in luminescence chip 102, so, the light that luminescence chip 102 is sent, when appearing jelly 105, produce mixed light, and then send when using needed photochromic.
As mentioned above, what produced behind the mixed light is photochromic, be absolute relation to be arranged with the original optical wavelength of sending of luminescence chip, the optical wavelength of refraction that fluorescent material produces, furthermore, even use the luminescence chip of same light wavelength, when the material during as if its fluorescent material allotment, mixed proportion, injecting glue amount etc. are different, result behind its mixed light still can be different, again furthermore, in the manufacturing process, there are many factors can influence the photochromic coordinate that is produced behind the mixed light.Figure 2 shows that the manufacturing flow chart of existing light-emitting diode, as shown in FIG., main manufacturing process 20 can comprise:
Gu brilliant 201: a luminescence chip is fixed in a base body, it generally is material behavior according to luminescence chip, utilize elargol, conducting resinl etc. as sticker, make chip after adhesion, be fixed in the recessed cup of the plane of base body or its moulding, if do not need the Chip Packaging form of metal wire, the bottom of luminescence chip then, be to form electrode of opposite portion, so that after it finishes adhesion, be with the electrode of base body and electrically conduct;
Routing (Bonding) 2011: if need metal wire to finish the packing forms of electric wire conducting, then as shown in Figure 1, after solid crystalline substance 201 is finished, carry out metal wire is finished the operation of connection again, so that the two ends of the line of metal are connected to the electrode of luminescence chip and base body;
Point glue 202: with the jelly (being generally the mixture of epoxy resin and fluorescent material) that allotment is finished, point injects base body, makes it be covered in luminescence chip;
Baking 203: after finishing a glue operation, semi-finished product are sent into baking box toast, so that jelly solidifies;
Optical treatment 204: above chip, ejection formation one optics cover forms such as () concave, convex lens, so that the light that luminescence chip sent can produce relativity according to the design of optics cover, the optically focused of astigmatism, special angle etc. for example;
Color separation ordering (Sorting) 205: finish the finished product after the optical treatment, carry out the color separation ordering via a color scanner.This color scanner is that the manufactured goods coverlet is lighted, and to photochromic detection the after lighting, again according to the result's (photochromic coordinate) after detecting, with the monomer of light-emitting diode, ordering (color separation) is to the barrel of different photochromic scopes one by one;
Packing 206: the goods of coincidence detection are packaged in strip.
Figure 3 shows that the photochromic distribution schematic diagram of using the made light-emitting diode manufactured goods of existing manufacturing process.Photochromic coordinate with a collection of manufactured goods should drop on the b point between the c point ideally, and a point is between the b point, and the c point then is defective products, faulty materials or standby to the manufactured goods between the d point.As previously mentioned, even if all processing and material condition homogeneous cause in manufacturing process, the photochromic distribution of its manufactured goods still can be variant, if the consistency of each processing and material condition is higher, then its photochromic difference amplitude can be dwindled.As shown in this figure, generally speaking, be the longitudinal axis as if quantity with manufactured goods, the zone of its photochromic distribution is a transverse axis, then its result is normal distribution as shown in FIG..Under processing and material conditional stability, the photochromic distribution of most manufactured goods can drop on the b point between the c point, and a point is between the b point, and the c point then is the manufactured goods that photochromic coordinate has skew between the d point.
As mentioned above as can be known, if in manufacture process, colo(u)r bias produces, and that is to say, in the existing manufacturing process, be when light-emitting diode is manufactured goods, carry out the operation of color separation ordering (Sorting) again, to this stage, colo(u)r bias is if be tested to have, have only screening to fall this a kind of mode, if the quantity that a point is ordered to b point and c point to d is excessive, certainty significantly influence the acceptance rate that it is made like this.And about this problem, with regard to present manufacturing process technology, still for solving, the generation of its proportionality of only leaving so, has not only reduced the acceptance rate of producing, and is relative, also improved many manufacturing costs.
Summary of the invention
Because above-mentioned problem, the present inventor is material behavior, manufacturing process and the checkout procedure at light-emitting diode, analysis of being correlated with and research, and according to the experience of being engaged in related industry and product design for many years, expectation can be found out suitable solution; Thus, the main purpose of the present invention is to provide a kind of photochromic coordinate that makes the light-emitting diode of making to distribute to tend towards stability and accurately, with the manufacture method of the production acceptance rate that promotes light-emitting diode.
The invention provides a kind of method for manufacturing light-emitting, comprise solid crystalline substance, some glue, baking, color separation ordering (Sorting) and packing, particularly after a glue program, at first carry out testing the look program, it tests the look result for the NG state, then needs to put glue again, and is photochromic to supply, finish put glue again after, test look once more.Test the look result and be the YES state, then toast.
The described look program of testing is to test the look machine by one respectively these light-emitting diode semi-finished product of putting glue and finishing are tested look, make after respectively these semi-finished product are subjected to current lead-through, generation is lighted, and the photochromic look of testing when lighting simultaneously is to detect the photochromic coordinate of this semi-finished product present situation when lighting.Describedly test the comparison function that look machine itself promptly has photochromic coordinate.
Carry out the main purpose that this tests the look program, promptly be to make light-emitting diode in half-finished stage,, still can put the program of glue again and carry out photochromic reinforcement if having under the situation of photochromic deficiency or photochromic skew.So, the interval of photochromic skew of the light-emitting diode of stage and semi-finished product is significantly dwindled, to promote the precision of its photochromic coordinate requirement.And, mainly be to be to make manufacturing process with littler photochromic gap interval, carry out secondary color separation ordering (Sorting) again.So, the photochromic classification of sorted manufactured goods is then more accurate, the requirement of all right more effective its photochromic distribution of control.After implementing according to this, can effectively reduce and do over again and the ratio of defective products.
After described solid brilliant program is finished, can carry out the program of a routing (Bonding), finish the packing forms of electric wire conducting if promptly need metal wire, after solid crystalline substance is finished, carry out metal wire is finished the operation of connection again, so that the two ends of the line of metal are connected to the electrode of luminescence chip and base body.
In addition, after the program of described baking is finished, can carry out the program of an optical treatment.This program is mainly above chip, organize structure one optics cover again or claim optical mirror slip (LENS), so that finished product of LED luminous meets user demand, the mode of its group structure can be preformed optical mirror slip, finish mutual group of structure with light-emitting diode, or directly in modes such as sizing material ejection formations.If adopt mode, then need to carry out again the baking second time with the sizing material ejection formation.
The present invention compares with existing manufacturing process method, its beneficial effect is: in manufacturing process, the technology of look is tested in utilization, make the semi-finished product after a glue is finished test look earlier, so that the photochromic coordinate glue program of putting again devious, to carry out the baking program again behind its photochromic coordinate of revisal, so, the photochromic coordinate of the light-emitting diode made is distributed tend towards stability and accurately, promoting the production acceptance rate of light-emitting diode, relative reduction many manufacturing costs.
Description of drawings
Fig. 1 is a kind of existing light-emitting diode;
Fig. 2 is the manufacturing flow chart of existing light-emitting diode;
Fig. 3 is for using the photochromic distribution schematic diagram of the made light-emitting diode manufactured goods of existing manufacturing process;
Fig. 4 is a method for manufacturing light-emitting flow chart of the present invention;
Fig. 5 is the photochromic coordinate distribution schematic diagram of the light-emitting diode manufactured goods behind enforcement the present invention.
Description of reference numerals: 10-light-emitting diode; The 101-base; The 1011-electrode; The 1012-electrode; The 102-luminescence chip; The 103-plain conductor; 104-optics cover; The 105-jelly; The 20-manufacturing process; 201-is solid brilliant; The 2011-routing; 202-point glue; The 203-baking; The 204-optical treatment; 205-color separation ordering; The 206-packing; The 30-manufacture method; 301-is solid brilliant; The 3011-routing; 302-puts glue for the first time; 303-tests look; 3031-puts glue again; The 304-baking; The 305-optical treatment; 306-color separation ordering; The 307-packing.
Embodiment
Below in conjunction with accompanying drawing, be described in more detail with other technical characterictic and advantage the present invention is above-mentioned.
Figure 4 shows that the manufacturing method for LED flow chart that the present invention is alleged, the flow process of its manufacture method 30 mainly comprises:
Gu brilliant 301: a chip is fixed in an in type base body, generally be chip to be adhered on the plane of base body with a jelly, or adhere in the recessed cup that takes shape in the base body plane, it is effectively fixing that chip is subjected to, and finish electrically connect with the conducting position (electrode) of base body;
Routing (Bonding) 3011: if the form of encapsulation is to need metal wire as the medium that electrically conducts, then after above-mentioned solid brilliant 301 programs are finished, then carry out the operation of routing 3011, the packing forms of this type, the last plane of chip is to be formed with more than one electrode, so that an end of metal wire is adhered to electrode, the other end then can be adhered to the conducting position (electrode) on the base body;
Point glue 302: will allocate the jelly of finishing (colloidal mixture of epoxy resin and fluorescent material), and flow into the chip top, and make it comply with suitable dosage, the covering that chip is complete by point glue equipment;
Test look 303: test the look machine by one the semi-finished product of putting glue and finishing are tested look 303, be after each light-emitting diode of single is subjected to current lead-through, generation is lighted, the photochromic look 303 of testing when lighting simultaneously, to detect the photochromic coordinate of this single light-emitting diode present situation when lighting, and test the comparison function that look machine itself promptly has photochromic coordinate, after testing look 303 and finishing, promptly further test value and photochromic preset value are compared, common photochromic preset value is one effectively interval (is among Fig. 5 b point to the c point), test value is the light-emitting diode in the valid interval scope of preset value not, it is tested the look result and is the NG state, then needs to carry out the program of complementary color.The light-emitting diode of test value in the valid interval scope of preset value, it is tested the look result and is the YES state;
Put glue 3031 again: test the light-emitting diode of look result for the NG state, need put glue 3031 programs again, photochromic to supply, put the dosage of glue 3031 again, then can by point gum machine built-in program carry out the adjusting of dosage, experimental data before this part can be arranged in pairs or groups and be produced obtains, finish put glue 3031 again after, then test look 303 once more;
Baking 304: testing look 303 results for the YES state, then toast 304, mainly is to be solid state after jelly (colloidal mixture of epoxy resin and fluorescent material) is toasted;
Optical treatment 305: this program is mainly above chip, organize structure one optics cover again or claim optical mirror slip (LENS), so that finished product of LED luminous meets user demand, the mode of its group structure can be preformed optical mirror slip, finish mutual group of structure with light-emitting diode, or directly in modes such as sizing material ejection formations.If adopt mode, then need to carry out again toasting 304 the second time with the sizing material ejection formation.In addition, this optical treatment 305 is not a necessary program, is the demand that produces this procedure according to the design of light-emitting diode itself;
Color separation ordering (Sorting) 306: be manufactured goods to be tested look with color scanner, it is to make the manufactured goods of each light-emitting diode after current lead-through, light test to obtain its photochromic coordinate, carry out the color separation ordering according to detected value (the photochromic coordinate figure after promptly detecting) again;
Packing 307: the manufactured goods that will finish after color separation is sorted are packed.
Figure 5 shows that the photochromic coordinate distribution schematic diagram of implementing behind the present invention of manufactured goods.After implementing the present invention, mainly be to make the semi-finished product of script a point, after putting glue again to b point section, make its photochromic distribution be modified to the a1 point to the b point, can be modified to the c point to the d1 point with originally being distributed in the semi-finished product of c point equally, so that the whole acceptance rate of manufactured goods improves to d point section.
In sum, method for manufacturing light-emitting of the present invention mainly is in manufacturing process, promptly carry out the look of testing of light-emitting diode in stage and semi-finished product,, then put the reinforcement of glue program again if deficiency is arranged, to revise the skew of photochromic coordinate, can significantly dwindle the distributed area of photochromic coordinate, that is to say, can make the interval of the photochromic coordinate distribution of manufactured goods, relatively significantly dwindle, to improve the precision that the photochromic coordinate of manufactured goods requires.Therefore, after manufacturing method for LED of the present invention was implemented according to this, can reach really provided a kind of photochromic coordinate that makes the light-emitting diode made to distribute more to tend towards stability and accurately, with the purpose of the production acceptance rate that promotes light-emitting diode.
The above is just illustrative for the purpose of the present invention, and nonrestrictive, and those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited, can make many modifications, change; or equivalence, but all will fall within the scope of protection of the present invention.
Claims (10)
1. method for manufacturing light-emitting, comprise solid crystalline substance, some glue, baking, color separation ordering and packing, it is characterized in that: after a glue program, at first carry out testing the look program, it tests the look result for the NG state, then needs to put glue again, and is photochromic to supply, finish put glue again after, test look once more.
2. method for manufacturing light-emitting according to claim 1, it is characterized in that the described look program of testing is to test the look machine by one respectively these light-emitting diode semi-finished product of putting glue and finishing are tested look, make after respectively these semi-finished product are subjected to current lead-through, generation is lighted, the photochromic look of testing when lighting simultaneously is to detect the photochromic coordinate of this semi-finished product present situation when lighting.
3. method for manufacturing light-emitting according to claim 1 is characterized in that in the described program of testing look the process of the comparison of a photochromic coordinate being arranged.
4. method for manufacturing light-emitting according to claim 1 is characterized in that the described look result that tests is YES, then directly toasts.
5. method for manufacturing light-emitting according to claim 1, after it is characterized in that described solid brilliant program is finished, carry out a routing, promptly if need metal wire to finish the packing forms of electric wire conducting, after solid brilliant program is finished, carry out metal wire is finished the operation of connection again, so that the two ends of the line of metal are connected to the electrode of luminescence chip and base body.
6. method for manufacturing light-emitting according to claim 1 after the program that it is characterized in that described baking is finished, carries out the program of an optical treatment.
7. method for manufacturing light-emitting according to claim 6 is characterized in that the program of described optical treatment is group structure one preformed optical mirror slip.
8. method for manufacturing light-emitting according to claim 6, the program that it is characterized in that described optical treatment is the operation of an ejection formation.
9. method for manufacturing light-emitting according to claim 8 after the operation that it is characterized in that described ejection formation is finished, carries out the program of baking for the second time.
10. method for manufacturing light-emitting according to claim 6, after the program that it is characterized in that described optical treatment is finished, the program of carrying out color separation ordering.
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| CN200810215592A CN101677120A (en) | 2008-09-16 | 2008-09-16 | Method of producing light emitting diode |
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| CN200810215592A CN101677120A (en) | 2008-09-16 | 2008-09-16 | Method of producing light emitting diode |
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| CN102254907A (en) * | 2010-09-29 | 2011-11-23 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) and packaging method thereof |
| CN102751396A (en) * | 2011-04-22 | 2012-10-24 | 展晶科技(深圳)有限公司 | Method for manufacturing LED (light emitting diode) packaging structures |
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- 2008-09-16 CN CN200810215592A patent/CN101677120A/en active Pending
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| CN102254907A (en) * | 2010-09-29 | 2011-11-23 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) and packaging method thereof |
| CN102254907B (en) * | 2010-09-29 | 2013-07-10 | 深圳市聚飞光电股份有限公司 | LED (light-emitting diode) and packaging method thereof |
| CN102751396A (en) * | 2011-04-22 | 2012-10-24 | 展晶科技(深圳)有限公司 | Method for manufacturing LED (light emitting diode) packaging structures |
| CN102751396B (en) * | 2011-04-22 | 2015-03-18 | 赛恩倍吉科技顾问（深圳）有限公司 | Method for manufacturing LED (light emitting diode) packaging structures |
| CN102227007A (en) * | 2011-05-18 | 2011-10-26 | 泉州市金太阳电子科技有限公司 | Method for screening LEDs (light-emitting diodes) |
| CN103545428A (en) * | 2012-07-13 | 2014-01-29 | 铼钻科技股份有限公司 | White light LED |
| CN103441206A (en) * | 2013-08-22 | 2013-12-11 | 中山市光圣半导体科技有限责任公司 | Method for improving color consistency of white-light LED devices |
| CN105304804A (en) * | 2015-11-12 | 2016-02-03 | 深圳莱特光电股份有限公司 | LED light source module capable of splitting light in advance, and preparation method for LED light source module |
| CN105304804B (en) * | 2015-11-12 | 2018-09-14 | 深圳莱特光电股份有限公司 | A kind of LED light source module and preparation method thereof of leading portion light splitting |
| CN109950181A (en) * | 2019-03-28 | 2019-06-28 | 黄山美太电子科技有限公司 | A kind of LED charactrons production and processing technology process |
| CN109950181B (en) * | 2019-03-28 | 2021-05-11 | 黄山美太电子科技有限公司 | Production and processing technological process of LED nixie tube |
| CN110052379A (en) * | 2019-04-28 | 2019-07-26 | 深圳市万禾自动化设备有限公司 | A kind of lamp bar method for dispensing glue and control device |
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Open date: 20100324 |