CN102254907B - LED (light-emitting diode) and packaging method thereof - Google Patents

LED (light-emitting diode) and packaging method thereof Download PDF

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Publication number
CN102254907B
CN102254907B CN2010102968409A CN201010296840A CN102254907B CN 102254907 B CN102254907 B CN 102254907B CN 2010102968409 A CN2010102968409 A CN 2010102968409A CN 201010296840 A CN201010296840 A CN 201010296840A CN 102254907 B CN102254907 B CN 102254907B
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cavity
led
led chip
colloid
substrate
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CN102254907A (en
Inventor
孙平如
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Shenzhen Jufei Optoelectronics Co Ltd
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Shenzhen Jufei Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

The invention discloses an LED (light-emitting diode) and a packaging method thereof. The LED comprises a substrate and a plurality of first concave chambers which are arranged on the substrate at intervals; an LED chip is displaced at the bottom of each of the first chambers; a second concave chamber which is communicated with the first chamber is further arranged above the first chamber; glues are filled in the first chambers and the second chambers; and a light exit surface is formed at the concave port of the second chamber. The LED with the structure can provide an area source with high luminous intensity and uniform illuminant color. In the packaging method of the LED, a test and after-sale service step is added to the LED chip after glue injection to the first chambers is finished, so that yield of the LEDs is increased and production cost is saved.

Description

A kind of LED and method for packing thereof
Technical field
The present invention relates to lighting field, especially a kind of light-emitting diode and method for packing thereof.
Background technology
A kind of existing multi-chip LED, as openly day is on August 10th, 2005, publication number is the Chinese utility model patent of CN2717026Y, a kind of multichip packaging structure light-emitting diode is disclosed, this structure comprises substrate, more than one recessed cup is set on the substrate, places more than one tube core in each recessed cup, each tube core electrode connects the back with gold thread and inject transparent colloid in recessed cup.
The light-emitting diodes light of this structure has that structure is small and exquisite, the integrated level advantages of higher.But also have following defective: this encapsulating structure provides the light emitting array of being made up of a plurality of LED point-source of lights, rather than a complete area source; Compare with area source, the brightness of the LED that the prior art provides is relatively low.
Another kind of existing multi-chip LED arranges a spill cavity 2 at substrate 1 as shown in Figure 1, places a plurality of led chips 4 in cavity 2, and the spacing of adjacent LED chip 4 equates, injects colloid in the cavity 2, colloid one of spill interruption-forming level and smooth go out light source.Though the LED of this structure can form an area source, because cavity 2 volumes are big, the volume of the colloid of injection is also big, also big with the bonded area of substrate 1, cause the bond strength of colloid and substrate 1 low, in the use, colloid comes unstuck easily, and it is bright to cause a certain or a few LEDs chip 4 to lack; And, because the light that each led chip 4 sends is gone up the luminous intensity maximum in normal direction (gravity direction), light intensity minimum between each led chip 4, and this structure is if the colloid of filling in cavity 2 is fluorescent glue 31, fluorescent material distributes few in led chip 4 normal directions, the fluorescent material that distributes between each led chip 4 is more, causes the glow color of LED inhomogeneous.
Summary of the invention
The main technical problem to be solved in the present invention is, a kind of LED is provided, and this LED forms a brightness height, the uniform area source of glow color at exiting surface; Simultaneously, the present invention also provides the method for packing of a kind of this LED, adopts the method can improve the yields of LED, saves cost.
For solving the problems of the technologies described above, the invention provides a kind of:
A kind of LED, comprise substrate and led chip, first cavity of at least two spills is set on the substrate, led chip is placed in the bottom of each first cavity, simultaneously, also is provided with second cavity of spill on the substrate, second cavity is positioned at first cavity top, and connect with first cavity, fill colloid in first cavity and second cavity, colloid forms exiting surface in the spill outlet of second cavity.
In a kind of execution mode, the colloid of filling in first cavity is fluorescent glue, and the colloid of filling in second cavity is transparent adhesive tape.
In a kind of execution mode, first cavity has at least three, and the spacing between adjacent first cavity is progressively increased progressively by edge to the center of substrate.
In a kind of execution mode, the position of second cavity bottom between adjacent first cavity is provided with reinforcement.
In a kind of execution mode, on substrate bottom surface, also be provided with at least two heat sink, heat sink position is corresponding one by one with the position of first cavity.Further, heat sink area is greater than the bottom area of first cavity corresponding with it.
In a kind of execution mode, first cavity has at least four, and each first cavity bottom is placed a led chip, and each led chip adopts the matrix form electric connection structure.
The method for packing of a kind of LED comprises the steps:
Steps A: performance parameter from each led chip of energising test behind the colloid to first cavity that inject;
Step B: if the performance parameter of led chip meets the requirements, then behind the colloid of oven dry first cavity, inject colloid to second cavity, if the performance parameter of led chip is undesirable, then after oven dry, reprocess, after meeting the requirements, the performance parameter of led chip injects colloid to second cavity.
In a kind of execution mode, in steps A, the performance parameter of led chip comprises glow color uniformity and/or luminosity.
In the execution mode, in steps A, colloid is fluorescent glue in another kind, and adopts full-automatic quantitatively point gum machine disposable injection fluorescent glue in first cavity.
The invention has the beneficial effects as follows: a plurality of first cavitys are set on the substrate, are used for placing led chip; The top of first cavity arranges second cavity that connects with first cavity; Simultaneously, in first cavity and second cavity, fill colloid, make substrate form the area source of being formed by a plurality of led chips, compare with the light emitting array that a plurality of point-source of lights in the prior art are formed, or compare with the area source that all luminescence chips share same cavity, LED of the present invention has stronger brightness and uniform more color.
LED method for packing of the present invention, after finishing to the first cavity injecting glue, just can carry out the chip performance test, namely can judge the non-defective unit situation of led chip, if test shows that led chip is undesirable, then can reprocess at this moment, after the led chip The performance test results meets the requirements, just carry out to the step of the second cavity injecting glue.The step that this method is reprocessed by test has improved the yields of LED, has saved cost.
Description of drawings
Figure 1 shows that a kind of LED of the prior art;
Fig. 2 is the LED of an embodiment of the present invention;
Fig. 3 is the LED schematic diagram that connects by matrix form in one embodiment of the present invention.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail below by embodiment.
Embodiment 1:
Please refer to Fig. 2, LED, light-emitting diode just, comprise substrate 1 and led chip 4, be arranged at intervals with first cavity 21 of a plurality of spills in substrate 1, led chip 4 is placed in each first cavity, 21 bottom, second cavity 22 of spill is set on the top of these first cavitys 21, this second cavity 22 and first cavity 21 connect, and fill colloid in first cavity 21 and second cavity 22, and colloid is at the exiting surface that goes out interruption-forming LED of second cavity 22.
Substrate 1 can be the good substrates of heat dispersion such as metal substrate, ceramic substrate or silicon substrate, when being metal substrate, can be aluminium base or copper base.Usually, in order to improve the integral heat sink performance, the bottom surface of substrate 1 also is provided with one and covers the heat sink of whole base plate bottom surface, such as, heat sink 11 among Fig. 1, usually this heat sink 11 with 1 contacted of substrate generally can electrogilding or the metal of high thermal conductivities such as silver, improved heat dispersion although it is so greatly, but because heat sink 11 areas are big, it is also big to electroplate area, has increased production cost.Therefore, in one embodiment of the invention, heat sink to be divided into polylith heat sink with a monoblock of the prior art, every heat sink 11 bottom surface that is arranged on substrate 1, the position of corresponding first cavity, 21 bottoms, be that every heat sink 11 bottom with each first cavity 21 is corresponding one by one, and, every heat sink 11 area is slightly larger than the bottom area of the first corresponding with it cavity 21, like this when improving heat dispersion, save heat sink 11 area and electroplated area, thereby when having improved heat dispersion, saved cost.
That substrate 1 can be is square, circular or other shapes, and first cavity 21 can be evenly distributed on the substrate 1, and a kind of preferred set-up mode is, to core, the distance between adjacent first cavity 21 increases progressively successively from the edge of substrate 1.For example shown in Fig. 2, d1＜d2, d1 represents the center distance near the adjacent LED chip 4 of substrate 1 marginal position, d2 represents adjacent LED chip 4 center distance near the substrate center position, this kind set-up mode can increase the heat radiation uniformity of led chip 4, if adopt the mode of now using the spaced set in the technology, as shown in Figure 1, d1=d2, during owing to led chip 4 electrified light emittings, most of electric energy is converted into heat energy, heat energy to around scatter, it is maximum to the heat energy of substrate 1 center to loose, and the temperature that is embodied in substrate 1 center is higher than the temperature of substrate 1 marginal position, has directly had influence on light efficiency and the life-span of centre led chip 4.And the present invention, set-up mode by increasing progressively to center distance from the edge (d1＜d2), make the closer to the center, the heat dissipation path of led chip 4 is longer, that is to say, the led chip radiating rate of core is faster than the led chip at edge, thereby makes that the heat radiation of the led chip on the whole base plate is more even, reduced the inhomogeneous influence to led chip light efficiency and life-span of dispelling the heat.
The quantity of second cavity 22 can be set to one or more as required, is provided with under the situation of second cavity 22, and all first cavitys 21 connect on this second cavity 22 and the substrate 1; Be provided with under the situation of a plurality of second cavitys 22, each second cavity 22 connects with substrate 1 last branch first cavity 21.
First cavity 21 or second cavity, 22 sidewalls can be inclined-plane or parabola face, also can be the side of other shape, such as the side with certain gradient, at all right electroplated metal layer in the side and bottom surface of spill cavity, strengthen conduction, heat conduction and the reflective function of substrate.
Can place a plurality of led chips 4 in each first cavity 21, preferred mode is that 21 of each first cavitys are placed one or two led chip 4, and the mode of this led chip 4 usefulness welding or FLIP CHIP (flip-chip) is placed on the center of first cavity 21.When placing a plurality of led chip 4 in same first cavity 21, can adopt serial or parallel connection or series-parallel mode to be electrically connected between each led chip 4.And, also can adopt parallel connection or series connection or series-parallel mode to be electrically connected between the led chip 4 in each first cavity 21.A kind of preferred mode as shown in Figure 3, place one or two or a plurality of led chip 4 in each first cavity 21, when the number of first cavity 21 at four when above, each first cavity 21 adopts the arrangement mode of matrix form, then the led chip between first cavity 21 4 adopts the electric connection mode of matrix form, the benefit of She Zhiing is like this, can control each by the high-frequency scan mode has only a led chip 4 in first cavity 21 to light constantly, light all led chips 4 in all first cavitys 21 successively, like this in the requirement that reduces power supply, because human eye has eye storage characteristic, the led chip of seeing 4 is all lighted, thereby when realizing illumination, the power consumption of having saved led chip 4.
Second cavity 22 with all first cavitys, 21 perforations, in its position between adjacent first cavity 21, bottom irregular strengthening rib strip is set, be used for strengthening the intensity of substrate, when especially filling colloid to second cavity 22, the concaveconvex structure of reinforcement can be strengthened the adhesion of colloid and substrate, effectively prevents degumming phenomenon.
When in first cavity 21 and second cavity 22, filling colloid, preferred embodiment in, for white light LEDs, the colloids of filling in first cavity 21 are that the colloids of filling in fluorescent glue 31, the second cavitys 22 are transparent adhesive tape 32.In the LED machining process of this embodiment, at first the form of led chip 4 usefulness welding or upside-down mounting is fixed on the bottom of first cavity 21 after, fill first cavity 21 with fluorescent glue 31.Fluorescent glue 31 is made by fluorescent material mixing glue, can adopt full-automatic quantitatively point gum machine once to fill fluorescent glue 31 for each first cavity 21, like this fluorescence glue-line of Xing Chenging make fluorescent material be evenly distributed on led chip 4 around, the more even light emission of led chip 4, simultaneously, compare with the mode of in first cavity of a plurality of perforations, filling fluorescent glue in the prior art, reduced the packing volume of fluorescent glue, not only be convenient to once fill, and by reducing the bonded area of fluorescence glue-line and substrate, improved bond strength, when substrate 1 is subjected to external force deformation or expands with heat and contract with cold etc. to influence, be not prone to the fluorescent glue delamination, thereby avoided led chip 4 to lack bright situation.After in first cavity 21, filling fluorescent glue 31, after treating fluorescent glue 31 dryings, in second cavity 22, fill transparent adhesive tape 32, transparent adhesive tape 32 is filled whole second cavity 22, because the effect of the bottom reinforcement of second cavity 22, substratum transparent 32 and substrate 1 firm combining, and at the light-emitting window of the planar shaped of spill interruption-forming of second cavity 22, after the fluorescence glue-line 31 of light in first cavity 21 that led chip 4 is sent makes color evenly, the light-emitting window place of the substratum transparent 32 in second cavity 22 forms an area source, be understandable that, even all fill fluorescent glue 31 or transparent adhesive tape 32 at first cavity 21 and second cavity 22, even in first cavity 31, fill transparent adhesive tape 32, in second cavity, fill fluorescent glue 32, also can form an area source at the exiting surface of second cavity 22, can improve the inhomogeneity effect of glow color equally.Especially be transparent adhesive tape 32 when what in first cavity 21, fill, fill in second cavity 22 be fluorescent glue 31 time, though fluorescent glue 31 is similar with structure shown in Figure 1, has big filled chamber, packing volume is big, also big with the bonded area of substrate, but owing in second cavity 22 led chip 4 is not set, so fluorescent material can be evenly distributed in second cavity 22, effect may be not as good as fill fluorescent glue 31 in first cavity 21, in second cavity 22, fill the mode of transparent adhesive tape 32, but compare prior art shown in Figure 1, have better glow color uniformity.
Usually, the exiting surface of second cavity 22 is planes, to form a brightness height, the uniform exiting surface of color.In order to strengthen luminous directive property, the convex lens shape of the exiting surface of second cavity 22 being made a sphere also is understandable but sometimes.
Embodiment 2:
At the LED among the embodiment 1, the present invention also provides a kind of LED method for packing, and this method is after finishing to the first cavity injecting glue, increased the step of test led chip performance, according to test result, decision is to reprocess led chip, still continue next step operation, thereby improved the yields of LED.This method specifically comprises step:
1), solid brilliant technology: the mode of employing bonding wire and the mode of flip-chip are fixed on led chip the bottom of first cavity;
2), energising test for the first time: the luminous situation of energising test led chip;
3), quantitatively inject colloid in first cavity, such as with full-automatic quantitatively point gum machine disposable injection fluorescent glue in first cavity.Fluorescent glue can be the mixture of yellow, red, green, fluorescent orange powder or its composition and epoxy or silica gel or silicones.
4), energising test for the second time: the performance parameter of energising test led chip, performance parameter mainly comprises luminosity or glow color uniformity, can also be power consumption, lighting angle etc.If performance parameter meets the requirements, then forward step 6) to; If undesirable, then forward step 5) to;
5), reprocess: after treating the interior colloid oven dry of first cavity, divest colloid, repair or replace led chip, test again, injecting glue is tested again again, forwards step 6) to after the led chip performance parameter meets the requirements;
6), the baking colloid, after colloid dried, in second cavity, inject colloid, this colloid can be transparent adhesive tape, this transparent adhesive tape can be silica gel or silicon gum, after injecting glue is finished, the energising test.
LED method for packing provided by the invention, it is even to have encapsulated out a kind of glow color, the LED that luminous intensity is high.And in whole encapsulation process, design feature based on the multi-cavity body, behind the first cavity injecting glue, increased the step that test is reprocessed, thereby improved the yields of led chip, be difficult for appearing at encapsulation and finish the back because of scarce former thereby the situation that whole base plate is scrapped such as bright of a certain or a few LEDs chip, thereby saved cost.
Above content be in conjunction with concrete execution mode to further describing that the present invention does, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.

Claims (9)

1. LED, comprise substrate and led chip, first cavity of at least three spills is set on the described substrate, described led chip is placed in the bottom of each first cavity, it is characterized in that the spacing between adjacent first cavity is progressively increased progressively by edge to the center of described substrate; Also be provided with second cavity of spill on the described substrate, described second cavity is positioned at described first cavity top, and connect with described first cavity, be injected with colloid in described first cavity and second cavity, described colloid forms exiting surface in the outlet of described second cavity.
2. LED as claimed in claim 1 is characterized in that, the colloid of filling in described first cavity is fluorescent glue, and the colloid of filling in described second cavity is transparent adhesive tape.
3. LED as claimed in claim 1 is characterized in that, the position of described second cavity bottom between adjacent described first cavity is provided with reinforcement.
4. LED as claimed in claim 1 is characterized in that, comprises that also at least two of being arranged on the described substrate bottom surface are heat sink, and described heat sink position is corresponding one by one with the position of described first cavity.
5. LED as claimed in claim 4 is characterized in that, described heat sink area is greater than the bottom area of first cavity corresponding with it.
6. LED as claimed in claim 1 is characterized in that, described first cavity has at least four, and each first cavity bottom is placed at least one led chip, and described led chip adopts the matrix form electric connection structure.
7. the method for packing as each described LED in the claim 1 to 6 is characterized in that, comprises the steps:
Steps A: performance parameter from each led chip of energising test behind the colloid to first cavity that inject;
Step B: if the performance parameter of described led chip meets the requirements, then behind the colloid of oven dry first cavity, inject colloid to second cavity, if the performance parameter of led chip is undesirable, then after oven dry, reprocess, after the performance parameter of led chip meets the requirements, inject colloid to second cavity.
8. method as claimed in claim 7 is characterized in that, in the steps A, the performance parameter of described led chip comprises glow color uniformity and/or luminosity.
9. method as claimed in claim 7 is characterized in that, in the steps A, described colloid is fluorescent glue, and adopts full-automatic quantitatively point gum machine disposable injection fluorescent glue in first cavity.
CN2010102968409A 2010-09-29 2010-09-29 LED (light-emitting diode) and packaging method thereof Active CN102254907B (en)

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CN102738370B (en) * 2012-07-04 2015-03-18 深圳市聚飞光电股份有限公司 Led packaging method
CN104882439B (en) * 2012-09-29 2019-01-15 四川新力光源股份有限公司 LED component
CN106876557A (en) * 2017-01-18 2017-06-20 东洋工业照明（广东）有限公司 A kind of manufacture method of multi-colored led module
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CN101523620A (en) * 2006-09-29 2009-09-02 罗姆股份有限公司 Semiconductor light emitting device
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