CN105938870A - Wafer-level packaging method for LED lamp bead used for display screen - Google Patents
Wafer-level packaging method for LED lamp bead used for display screen Download PDFInfo
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- CN105938870A CN105938870A CN201610298332.1A CN201610298332A CN105938870A CN 105938870 A CN105938870 A CN 105938870A CN 201610298332 A CN201610298332 A CN 201610298332A CN 105938870 A CN105938870 A CN 105938870A
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- display screen
- lamp bead
- led lamp
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- 239000011324 bead Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000012216 screening Methods 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000009954 braiding Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 230000000007 visual effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a wafer-level packaging method for an LED lamp bead used for a display screen. The wafer-level packaging method comprises the steps of putting into production, die bonding, wire welding, adhesive dispensing, beam splitting and band braiding, wherein in the step of putting into production, the supplied material chips are screened and put into production in batches; the standard in screening the supplied material chips is as follows: the wavelength difference value of the blue chips of the same batch put into production is less than or equal to 5nm; the light intensity ratio of the blue chips of the same batch put into production is less than or equal to 1 to 1.5; the difference value of the standard difference of the blue chips of the same batch put into production is less than 2.5; the wavelength difference value of the green chips of the same batch put into production is less than or equal to 12nm; the light intensity ratio of the green chips of the same batch put into production is less than or equal to 1 to 1.4; and the difference value of the standard difference of the green chips of the same batch put into production is less than 3.5. The LED lamp bead produced by the method is relatively high in light color consistency, high in antistatic capability and can be widely applied to the LED packaging field for the display screen.
Description
Technical field
The invention belongs to the technical field of LED encapsulation, be specifically related to the wafer-level encapsulation method of a kind of display screen LED lamp bead.
Background technology
LED display (LED display): a kind of flat faced display, is made up of LED lamp bead one by one, and each lamp bead is a pixel.LED lamp bead affects, on LED display, the components and parts that LED lamp bead is the highest as LED display cost, consumption is maximum, and the qualitative effects for LED display plays mastery reaction.The most critical parts of full-color LED display screen are LED lamp bead, and reason has three:
First, LED are the Primary Components that in full-color screen complete machine, usage quantity is most, and every square metre can use thousand of to several ten thousand LED；
Second, LED are the main bodys determining whole screen optics display performance, directly affect spectators' evaluation to display screen；
3rd, LED proportion in display screen holistic cost is maximum, from 40% to 70%.
The visual angle of LED display is decided by the visual angle of LED lamp bead.Outdoor display screen selects the oval LED of 50 °, vertical angle of view, 100 °, horizontal view angle mostly at present, and indoor display screen then selects the paster LED that horizontal vertical is 120 °；Visual angle and brightness contradiction each other, big visual angle will necessarily reduce brightness；The needs that select at visual angle determine according to concrete purposes.
LED lamp bead brightness is the important determiner of brightness of display screen.LED lamp bead brightness is the highest, and the surplus using electric current is the biggest, and to saving energy, keeping, LED is stably beneficial to.LED lamp bead has different angle values, and in the case of chip brightness is fixed, angle is the least, and LED is the brightest, but the visual angle of display screen is the least.Typically should select the visual angle enough to ensure display screen for LED of 100 degree.For difference spacing and the display screen of different sighting distance, an equilibrium point should be found in brightness, angle and price.
The pixel being made up of three kinds of LED of even hundreds of thousands group red, green, blue up to ten thousand due to full color display forms, and the inefficacy of arbitrary color LED all can affect display screen entirety visual effect.In general, by industry experience, start the crash rate before being assembled to shipment in aging 72 hours at LED display and should be not higher than 3/10000ths (referring to the inefficacy that the reason of LED lamp bead own causes).
LED lamp bead is semiconductor device, to electrostatic sensitive, easily causes that electrostatic lost efficacy, therefore antistatic effect is most important to the life-span of display screen.In general, static electricity on human body's pattern test failure voltage of LED is not lower than 2000V.
The theoretical life-span of LED component is 100,000 hours, working life much larger than other parts of LED display, therefore as long as LED component quality guarantee, operating current are suitable, PCB heat dissipation design is reasonable, display screen production technology is rigorous, LED component will be one of parts the most durable in display screen complete machine.
LED display there will be brightness decline and the inconsistent phenomenon of display screen color after working long hours, causes mainly due to the brightness decay of LED component.The decay of LED luminance can cause display screen whole screen luminance-reduction.The inconsistent meeting of red, green, blue LED luminance attenuation amplitude causes the inconsistent of LED display color, it is simply that the phenomenon that the display screen that we often say has been spent.The LED component of high-quality can control brightness decay amplitude well.Lighting 20mA standard by 1000 hours room temperature, red decay should be less than 2%, and decay blue, green should be less than 10%, therefore blue, green LED tries not to use 20mA electric current when design of LED, the most only with 70% to 80% rated current.
The pixel that full color display is made up of numerous red, green, blue LED is combined into, and the brightness of each color LED, the concordance of wavelength determine the brightness uniformity of whole display screen, white balance concordance, colourity concordance.In general, display screen producer requires that device supplier provides the wave-length coverage of 5nm and the LED of the brightness range of 1:1.3, and these indexs can be carried out classification by device supplier by light-splitting color-separating machine and reach.The concordance of voltage does not the most do requirement.
LED disk is without classification, and all grades all also focus on a piece of, and this product, after cutting, splitting (doing micro-expansion sometimes, allow crystal grain with die separation), screens without SORTER, because slice, thin piece is rounded, therefore claims disk.Because disk screens without SORTER, its photoelectric parameter scope is big, general wavelength blue light: 10nm, green glow: 15nm, light intensity blue light: 1:1.9, green glow: 1:1.6.IR is bad accounts for 0.5% ~ 1%.Owing to concordance and the antistatic effect of LED lamp bead directly determine display screen quality, it requires that the encapsulation lamp bead using LED disk possesses good concordance and antistatic effect.
Summary of the invention
The present invention overcomes the deficiency that prior art exists, technical problem to be solved to be: provide the method for packing of a kind of display screen LED disk lamp bead possessing good concordance and antistatic effect.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is: the wafer-level encapsulation method of a kind of display screen LED lamp bead, including step: operation, die bond, bonding wire, some glue, light splitting and braid, it is characterized in that, during described operation, going into operation in batches after screening supplied materials chip, the standard screening supplied materials chip is: blue chip wavelength difference is less than or equal to 5nm, blue chip light intensity ratio is less than or equal to 1:1.5, and the standard deviation difference of blue chip is less than 2.5；Green glow chip wavelength difference is less than or equal to 12nm, and green glow chip light intensity ratio is less than or equal to 1:1.4, and the standard deviation difference of green glow chip is less than 3.5.
Further, during described light splitting, the standard carrying out light splitting is: blue chip wavelength difference and green glow chip wavelength difference are less than 5nm, and light intensity ratio is less than or equal to 1:1.3, voltage 0.4V stepping, and IR test is backward voltage 10V, and electric current is less than 1 μ A.
Further, after described light splitting, after the full 3KK of material, carry out equal BIN.
Further, the standard of described equal BIN is: all BIN machine rotating speeds are 70 ~ 80 turns/min, and the equal BIN time is 15min；
Further, after described equal BIN completes, take out the material after 1.5KK material, remaining 1.5KK material and light splitting next time and again carry out equal BIN.
The present invention compared with prior art has the advantages that
Existing LED packaging technology includes operation, die bond, bonding wire, some glue, light splitting and these steps of braid, and the present invention during the chip select of existing operation technique, goes into operation the most in batches after first screening supplied materials chip, improves the concentration degree of supplied materials chip；Aforesaid operations is in the case of holistic cost is cheap, it is ensured that the concordance of chip, and then makes finished product lamp bead have higher concordance and higher antistatic effect.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, technical scheme is clearly and completely described, it is clear that, described embodiment is a part of embodiment of the present invention rather than whole embodiments；Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
The wafer-level encapsulation method of a kind of display screen LED lamp bead, including step: operation, die bond, bonding wire, some glue, light splitting and braid, during described operation, goes into operation after screening supplied materials chip in batches.
Specifically, the standard screening supplied materials chip is: blue chip wavelength difference is less than or equal to 5nm, and blue chip light intensity ratio is less than or equal to 1:1.5, and the standard deviation difference (STD) of blue chip is less than 2.5；Green glow chip wavelength difference is less than or equal to 12nm, and green glow chip light intensity ratio is less than or equal to 1:1.4, and the standard deviation difference of green glow chip is less than 3.5；
Further, during described light splitting, the standard carrying out light splitting is: blue chip wavelength difference and green glow chip wavelength difference are less than 5nm, and light intensity ratio is less than or equal to 1:1.3, voltage 0.4V stepping, and IR test is backward voltage 10V, and electric current is less than 1 μ A；
Further, after described light splitting, after the full 3KK of material, carry out equal BIN；
Further, described equal BIN condition be equal BIN machine rotating speed be 70 ~ 80 turns/min, the equal BIN time is 15min；
Further, the material after described equal BIN takes out 1.5KK, residue 1.5KK material and light splitting next time after completing carries out equal BIN again.
LED lamp bead is as the core devices of display screen, and in display screen holistic cost, proportion is maximum, and from 40% to 70%, and LED chip accounts for the 50 to 60% of LED lamp bead cost, so the height of LED chip price directly influences the cost of display screen.LED disk is compared to LED square piece cost savings 40% to 50%, and display screen cost can reduce by 10% to 20%, and beneficially display applications is promoted, thus promotes LED lamp bead demand.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to foregoing embodiments, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or the most some or all of technical characteristic is carried out equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (4)
1. the wafer-level encapsulation method of a display screen LED lamp bead, including step: operation, die bond, bonding wire, some glue, light splitting and braid, it is characterized in that, during described operation, go into operation in batches after supplied materials chip is screened, the standard screening supplied materials chip is: blue chip wavelength difference is less than or equal to 5nm, and blue chip light intensity ratio is less than or equal to 1:1.5, and the standard deviation difference of blue chip is less than 2.5；Green glow chip wavelength difference is less than or equal to 12nm, and green glow chip light intensity ratio is less than or equal to 1:1.4, and the standard deviation difference of green glow chip is less than 3.5.
The wafer-level encapsulation method of a kind of display screen LED lamp bead the most according to claim 1, it is characterized in that, during described light splitting, the standard carrying out light splitting is: blue chip wavelength difference and green glow chip wavelength difference are less than 5nm, light intensity ratio is less than or equal to 1:1.3, voltage 0.4V stepping, IR test is backward voltage 10V, and electric current is less than 1 μ A.
The wafer-level encapsulation method of a kind of display screen LED lamp bead the most according to claim 1, it is characterised in that after described light splitting, carries out equal BIN after the full 3KK of material.
The wafer-level encapsulation method of a kind of display screen LED lamp bead the most according to claim 3, it is characterised in that the standard of described equal BIN is: all BIN machine rotating speeds are 70 ~ 80 turns/min, and the equal BIN time is 15min；
The wafer-level encapsulation method of a kind of display screen LED lamp bead according to claim 3, it is characterised in that after described equal BIN completes, takes out the material after 1.5KK material, remaining 1.5KK material and light splitting next time and again carries out equal BIN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610298332.1A CN105938870A (en) | 2016-05-06 | 2016-05-06 | Wafer-level packaging method for LED lamp bead used for display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610298332.1A CN105938870A (en) | 2016-05-06 | 2016-05-06 | Wafer-level packaging method for LED lamp bead used for display screen |
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| Publication Number | Publication Date |
|---|---|
| CN105938870A true CN105938870A (en) | 2016-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610298332.1A Pending CN105938870A (en) | 2016-05-06 | 2016-05-06 | Wafer-level packaging method for LED lamp bead used for display screen |
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| CN (1) | CN105938870A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928126A (en) * | 2020-08-19 | 2020-11-13 | 临海市大为光电科技有限公司 | LED lamp string with anti-interference voltage-stabilizing conduction performance |
| CN114664704A (en) * | 2022-03-18 | 2022-06-24 | 东莞市中麒光电技术有限公司 | LED chip screening method and display screen |
-
2016
- 2016-05-06 CN CN201610298332.1A patent/CN105938870A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928126A (en) * | 2020-08-19 | 2020-11-13 | 临海市大为光电科技有限公司 | LED lamp string with anti-interference voltage-stabilizing conduction performance |
| CN114664704A (en) * | 2022-03-18 | 2022-06-24 | 东莞市中麒光电技术有限公司 | LED chip screening method and display screen |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160914 |
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| WD01 | Invention patent application deemed withdrawn after publication |