CN205828426U - A kind of full spectrum SMD type LED light source - Google Patents
A kind of full spectrum SMD type LED light source Download PDFInfo
- Publication number
- CN205828426U CN205828426U CN201620480573.3U CN201620480573U CN205828426U CN 205828426 U CN205828426 U CN 205828426U CN 201620480573 U CN201620480573 U CN 201620480573U CN 205828426 U CN205828426 U CN 205828426U
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- Prior art keywords
- silicon rubber
- spectrum
- full
- rubber layer
- light
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
This utility model relates to a kind of full spectrum SMD type LED light source, including SMD support, blue-light LED chip, first packaging silicon rubber layer, full-spectrum LED phosphor powder layer and the second packaging silicon rubber layer, blue-light LED chip is fixed on SMD support by crystal-bonding adhesive, the positive pole gold thread of blue-light LED chip is welded on the positive pole of circuit layer, the negative pole gold thread of blue-light LED chip is welded on the negative pole of circuit layer, first packaging silicon rubber layer is coated on blue-light LED chip, full-spectrum LED phosphor powder layer is coated on the first packaging silicon rubber layer, second packaging silicon rubber layer is coated on full-spectrum LED phosphor powder layer.The full spectrum SMD type LED light source that this utility model provides, spectrum seriality is good, color rendering properties is high, light efficiency is good, meet the lighting demand of different field well, and fluorescent material consumption is low, being susceptible to cause thermal damage, light decay is few, light emission rate is high, light guide is uniform, soft, good illumination effect, and service life is long.
Description
Technical field
This utility model relates to LED light source technical field, a kind of full spectrum SMD type LED light source.
Background technology
Traditional LED light source can only accomplish the spectroscopic data specified, and fractional object is existence fond of women under traditional LED illumination
Certain distortion phenomenon；And traditional LED often can not meet some printing houses, the factory that dyes cloth, also has plant growing factory
Demand.
Utility model content
In order to overcome the defect of above-mentioned prior art, technical problem to be solved in the utility model is to provide a kind of full light
Spectrum SMD type LED light source.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of full spectrum SMD type LED light source, including the SMD support containing circuit layer, blue-light LED chip, the first encapsulation silicon
Glue-line, full-spectrum LED phosphor powder layer and the second packaging silicon rubber layer, described blue-light LED chip is fixed on SMD support by crystal-bonding adhesive
On, the positive pole gold thread of blue-light LED chip is welded on the positive pole of circuit layer, and the negative pole gold thread of blue-light LED chip is welded on circuit
On the negative pole of layer, described first packaging silicon rubber layer is coated on blue-light LED chip, and described full-spectrum LED phosphor powder layer is coated on
On first packaging silicon rubber layer, described second packaging silicon rubber layer is coated on full-spectrum LED phosphor powder layer.
Wherein, the outer surface of described second packaging silicon rubber layer is frosting.
Wherein, described first packaging silicon rubber layer is segment shape, the central angle of the arc surface of the first packaging silicon rubber layer be 120～
140 degree, described full-spectrum LED phosphor powder layer is evenly coated on the first packaging silicon rubber layer, and described second packaging silicon rubber layer is uniform
Being coated on full-spectrum LED phosphor powder layer, the thickness of the second packaging silicon rubber layer is 1～5mm.
The beneficial effects of the utility model are: by using blue-light LED chip to coordinate with full-spectrum LED phosphor powder layer,
The full spectrum SMD type LED light source that spectrum seriality is good, color rendering properties is high, light efficiency is good can be obtained, meet different field well
Lighting demand；Full-spectrum LED phosphor powder layer is arranged between the first packaging silicon rubber layer and the second packaging silicon rubber layer, and directly sets
Put on blue-light LED chip or be mixed with packaging silicon rubber after fluorescent glue compared with mode the most for dispensing glue, both can greatly reduce
The usage amount of fluorescent material, reduces production cost, can be prevented effectively from again heat that blue-light LED chip work produces directly or low coverage
Liftoff be transmitted to fluorescent material and cause fluorescent material impaired, thus decrease the optical attenuation of light source, improve product light emission rate and
Service life.
Accompanying drawing explanation
Fig. 1 show the structural representation of the full spectrum SMD type LED light source of this utility model embodiment.
Label declaration:
1-contains the SMD support of circuit layer；2-blue-light LED chip；3-the first packaging silicon rubber layer；4-full-spectrum LED fluorescence
Bisque；5-the second packaging silicon rubber layer；6-crystal-bonding adhesive；20-positive pole gold thread；21-negative pole gold thread.
Detailed description of the invention
By describing technology contents of the present utility model in detail, being realized purpose and effect, below in conjunction with embodiment and join
Conjunction accompanying drawing is explained.
Refer to shown in Fig. 1, full spectrum SMD type LED light source of the present utility model, including the SMD support containing circuit layer
1, blue-light LED chip the 2, first packaging silicon rubber layer 3, full-spectrum LED phosphor powder layer 4 and the second packaging silicon rubber layer 5, described blue light
LED chip 2 is fixed on SMD support by crystal-bonding adhesive 6, and the positive pole gold thread 20 of blue-light LED chip 2 is welded on the positive pole of circuit layer
On, the negative pole gold thread 21 of blue-light LED chip 2 is welded on the negative pole of circuit layer, and described first packaging silicon rubber layer 3 is coated on blue light
In LED chip 2, described full-spectrum LED phosphor powder layer 4 is coated on the first packaging silicon rubber layer 3, described second packaging silicon rubber layer 5
It is coated on full-spectrum LED phosphor powder layer 4.
In the above-described embodiments, the full-spectrum LED fluorescent material that full-spectrum LED phosphor powder layer 4 is used is existing material, tool
Body can use the full-spectrum LED fluorescent material disclosed in Patent No. CN104263359A, accordingly, and blue-light LED chip 2 concrete
Wavelength can refer to the embodiment 1 of this patent and arranges in pairs or groups to the record of embodiment 4, thus obtains that spectrum seriality is good, color rendering properties
The full spectrum SMD type LED light source high, light efficiency is good.
Full spectrum SMD type LED light source of the present utility model, substantially can refer to following technological process production and obtains:
Being put on automatic die bond equipment by SMD support 1 containing circuit layer, die bond automatic equipment is carried out on SMD support
Put crystal-bonding adhesive 6, then blue-light LED chip 2 is consolidated to the backing positions having put crystal-bonding adhesive 6 by automatic die bond equipment, complete
Put into oven device after becoming die bond operation and carry out baking-curing；
Solidified and by inspection after, by bonding equipment, the positive pole gold thread 20 of blue-light LED chip 2 is welded to circuit
On the positive pole of layer, the negative pole gold thread 21 of blue-light LED chip 2 is welded on the positive pole of circuit layer；
After bonding wire completes, packaging silicon rubber is coated on blue-light LED chip 2 by a glue operation and forms the first packaging silicon rubber
Layer 3, is sprinkling upon full-spectrum LED fluorescent material uniform spreading on the first packaging silicon rubber layer 3 formation full-spectrum LED phosphor powder layer 4, then dries
Roasting solidification；
Packaging silicon rubber is coated on full-spectrum LED phosphor powder layer 4 by a glue operation and forms the second packaging silicon rubber layer 5,
Then baking-curing；
Go out and after baking, carry out finished product detection, packaging warehouse-in.
Technological process:
Die bond baking bonding wire point glue for the first time, spreading fluorescent material baking second time point
Glue baking spectrophotometric test detection warehouse-in.
Knowable to foregoing description, the beneficial effects of the utility model are: by using blue-light LED chip and full spectrum
LED fluorescent powder layer coordinates, and can obtain the full spectrum SMD type LED light source that spectrum seriality is good, color rendering properties is high, light efficiency is good, very well
Meet the lighting demand of different field；Full-spectrum LED phosphor powder layer is arranged on the first packaging silicon rubber layer and the second encapsulation silicon
Between glue-line, be set directly on blue-light LED chip or be mixed and made into fluorescent glue with packaging silicon rubber after mode phase the most for dispensing glue
Ratio, both can greatly reduce the usage amount of fluorescent material, reduces production cost, can be prevented effectively from again blue-light LED chip work and produce
Raw heat directly or is closely transmitted to fluorescent material and causes fluorescent material impaired, thus decreases the optical attenuation of light source, carries
The light emission rate of high product and service life.
Further, the outer surface of described second packaging silicon rubber layer 5 is frosting.
Knowable to foregoing description, the beneficial effects of the utility model are: by the outer surface by the second packaging silicon rubber layer
Being designed as frosting, the light guide that can make product is the most even soft, improves the illuminating effect of product.
Further, described first packaging silicon rubber layer 3 in segment shape, the central angle of the arc surface of the first packaging silicon rubber layer 3
Being 120～140 degree, described full-spectrum LED phosphor powder layer 4 is evenly coated on the first packaging silicon rubber layer 3, described second encapsulation silicon
Glue-line 5 is evenly coated on full-spectrum LED phosphor powder layer 4, and the thickness of the second packaging silicon rubber layer 5 is 1～5mm.
Knowable to foregoing description, the beneficial effects of the utility model are: use said structure design, be conducive to improving product
The luminous efficiency of product, irradiating angle and heat dispersion.
Refer to shown in Fig. 1, embodiment one of the present utility model is:
Full spectrum SMD type LED light source, including the SMD support 1 containing circuit layer, blue-light LED chip the 2, first packaging silicon rubber
Layer 3, full-spectrum LED phosphor powder layer 4 and the second packaging silicon rubber layer 5, described blue-light LED chip 2 is fixed on SMD by crystal-bonding adhesive 6
On support, the positive pole gold thread 20 of blue-light LED chip 2 is welded on the positive pole of circuit layer, the negative pole gold thread 21 of blue-light LED chip 2
Being welded on the negative pole of circuit layer, described first packaging silicon rubber layer 3 is coated on blue-light LED chip 2, and described full-spectrum LED is glimmering
Light bisque 4 is coated on the first packaging silicon rubber layer 3, and described second packaging silicon rubber layer 5 is coated on full-spectrum LED phosphor powder layer 4.
The outer surface of described second packaging silicon rubber layer 5 is frosting.Described first packaging silicon rubber layer 3 in segment shape, the first packaging silicon rubber
The central angle of the arc surface of layer 3 is 120～140 degree, and described full-spectrum LED phosphor powder layer 4 is evenly coated at the first packaging silicon rubber
On layer 3, described second packaging silicon rubber layer 5 is evenly coated on full-spectrum LED phosphor powder layer 4, the thickness of the second packaging silicon rubber layer 5
It is 1～5mm.
In sum, the full spectrum SMD type LED light source that this utility model provides, spectrum seriality is good, color rendering properties is high, light
Imitating, meet the lighting demand of different field well, and fluorescent material consumption is low, be susceptible to cause thermal damage, light decay is few, goes out light
Rate is high, and light guide is uniform, soft, good illumination effect, and service life is long.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every
Utilize the equivalents that this utility model description and accompanying drawing content are made, or be directly or indirectly used in relevant technology neck
Territory, is the most in like manner included in scope of patent protection of the present utility model.
Claims (3)
1. a full spectrum SMD type LED light source, it is characterised in that: include the SMD support containing circuit layer, blue-light LED chip,
First packaging silicon rubber layer, full-spectrum LED phosphor powder layer and the second packaging silicon rubber layer, described blue-light LED chip is solid by crystal-bonding adhesive
Being scheduled on SMD support, the positive pole gold thread of blue-light LED chip is welded on the positive pole of circuit layer, the negative pole gold thread of blue-light LED chip
Being welded on the negative pole of circuit layer, described first packaging silicon rubber layer is coated on blue-light LED chip, described full-spectrum LED fluorescence
Bisque is coated on the first packaging silicon rubber layer, and described second packaging silicon rubber layer is coated on full-spectrum LED phosphor powder layer.
Full spectrum SMD type LED light source the most according to claim 1, it is characterised in that: outside described second packaging silicon rubber layer
Surface is frosting.
Full spectrum SMD type LED light source the most according to claim 1, it is characterised in that: described first packaging silicon rubber layer is ball
Lacking shape, the central angle of the arc surface of the first packaging silicon rubber layer is 120～140 degree, and described full-spectrum LED phosphor powder layer is uniformly coated with
On the first packaging silicon rubber layer, described second packaging silicon rubber layer is evenly coated on full-spectrum LED phosphor powder layer, the second encapsulation silicon
The thickness of glue-line is 1～5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620480573.3U CN205828426U (en) | 2016-05-24 | 2016-05-24 | A kind of full spectrum SMD type LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620480573.3U CN205828426U (en) | 2016-05-24 | 2016-05-24 | A kind of full spectrum SMD type LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205828426U true CN205828426U (en) | 2016-12-21 |
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ID=57558518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620480573.3U Expired - Fee Related CN205828426U (en) | 2016-05-24 | 2016-05-24 | A kind of full spectrum SMD type LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205828426U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435999A (en) * | 2019-08-26 | 2021-03-02 | 中国科学院半导体研究所 | Surface-mounted LED packaging light source and preparation method |
| CN113036025A (en) * | 2021-04-06 | 2021-06-25 | 中国地质大学（北京） | Optical application device for packaging whitlockite type fluorescent powder and application |
| CN115440868A (en) * | 2022-08-15 | 2022-12-06 | 上海应用技术大学 | Quasi-sunlight/full-spectrum LED based on single-component full-spectrum fluorescent powder packaging |
-
2016
- 2016-05-24 CN CN201620480573.3U patent/CN205828426U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435999A (en) * | 2019-08-26 | 2021-03-02 | 中国科学院半导体研究所 | Surface-mounted LED packaging light source and preparation method |
| CN113036025A (en) * | 2021-04-06 | 2021-06-25 | 中国地质大学（北京） | Optical application device for packaging whitlockite type fluorescent powder and application |
| CN115440868A (en) * | 2022-08-15 | 2022-12-06 | 上海应用技术大学 | Quasi-sunlight/full-spectrum LED based on single-component full-spectrum fluorescent powder packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20170524 |
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| CF01 | Termination of patent right due to non-payment of annual fee |