CN206469096U - A kind of LED for plant illumination - Google Patents
A kind of LED for plant illumination Download PDFInfo
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- CN206469096U CN206469096U CN201621411965.0U CN201621411965U CN206469096U CN 206469096 U CN206469096 U CN 206469096U CN 201621411965 U CN201621411965 U CN 201621411965U CN 206469096 U CN206469096 U CN 206469096U
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- led
- silicon rubber
- rubber layer
- packaging silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Abstract
The utility model is related to a kind of LED for plant illumination, including lamp holder, lampshade, driving power supply, radiator and LED/light source, LED/light source includes aluminum nitride ceramic substrate, blue-light LED chip, first packaging silicon rubber layer, full-spectrum LED phosphor powder layer and the second packaging silicon rubber layer, aluminum nitride ceramic substrate connects driving power supply through radiator, blue-light LED chip is fixed on aluminum nitride ceramic substrate, first packaging silicon rubber layer is coated on blue-light LED chip, full-spectrum LED phosphor powder layer is coated on the first packaging silicon rubber layer, second packaging silicon rubber layer is coated on full-spectrum LED phosphor powder layer.The LED for plant illumination that the utility model is provided, the fluorescent lamp or high-pressure mercury lamp of original plant illumination can be directly replaced, energy-saving effect is obvious, service life overlength, and close to full spectral illumination, the lighting requirements of plant growth are met well.
Description
Technical field
The utility model is related to LED/light source technical field, specifically a kind of LED for plant illumination.
Background technology
Traditional LED/light source can only accomplish the spectroscopic data specified, and fractional object is fond of women under traditional LED illumination to be present
Certain distortion phenomenon;And traditional LED often can not meet some printing houses, the factory that dyes cloth, also have plant growth factory
Demand.
Utility model content
In order to overcome the defect of above-mentioned prior art, technical problem to be solved in the utility model is to provide a kind of close
In full spectral illumination, illumination patterns are uniform, luminous intensity is high, the LED for plant illumination of service life length.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of LED for plant illumination, including lamp holder, lampshade, driving power supply, radiator and LED/light source, the lamp
Cover is fixed on lamp holder, and the driving power supply is arranged in lampshade close to one end of lamp holder, and the LED/light source is made pottery including aluminium nitride
Porcelain substrate, blue-light LED chip, the first packaging silicon rubber layer, full-spectrum LED phosphor powder layer and the second packaging silicon rubber layer, the nitridation
Aluminium ceramic substrate is provided with the circuit being engaged with blue-light LED chip, and the aluminum nitride ceramic substrate is connected through radiator and driven
Power supply, the blue-light LED chip is fixed on aluminum nitride ceramic substrate by crystal-bonding adhesive, and the first packaging silicon rubber layer is coated on
On blue-light LED chip, the full-spectrum LED phosphor powder layer is coated on the first packaging silicon rubber layer, the second packaging silicon rubber layer
It is coated on full-spectrum LED phosphor powder layer.
Wherein, first packaging silicon rubber layer is in segment shape, the central angle of the arc surface of the first packaging silicon rubber layer for 120~
140 degree, the full-spectrum LED phosphor powder layer is evenly coated on the first packaging silicon rubber layer, and the second packaging silicon rubber layer is uniform
It is coated on full-spectrum LED phosphor powder layer, the thickness of the second packaging silicon rubber layer is 1~5mm.
The beneficial effects of the utility model are:
(1) the utility model can directly replace the fluorescent lamp or high-pressure mercury lamp of original plant illumination, energy-conservation effect
Fruit substantially, due to using blue-light LED chip with full-spectrum LED phosphor powder layer coordinating, therefore can obtain shining close to full spectrum
The LED for plant illumination that bright, colour rendering is high, illumination patterns are uniform, luminous intensity is high, preferably meets the light of plant growth
According to demand, promote the growth of plant;
(2) full-spectrum LED phosphor powder layer of the present utility model is arranged on the first packaging silicon rubber layer and the second packaging silicon rubber layer
Between, with being set directly on blue-light LED chip or compared with packaging silicon rubber is mixed and made into after fluorescent glue again mode for dispensing glue, both
The usage amount of fluorescent material can be greatly reduced, production cost, and it is possible to prevente effectively from the heat that blue-light LED chip work is produced is reduced
Amount is direct or is closely transmitted to fluorescent material and causes fluorescent material to be damaged, so as to reduce the optical attenuation of light source, improves production
The light emission rate and service life of product;
(3) the utility model uses the AIN ceramic wafers (i.e. aluminum nitride ceramic substrate) with high heat conduction, high temperature tolerance energy to enter
Row encapsulation, the heatproof for solving traditional material is not enough, the problem of thermal conductivity factor is low, and aluminum nitride ceramic substrate connects through radiator
Driving power supply is connect, fast and effeciently can be distributed heat, therefore substantially increases the luminous efficiency of product and uses the longevity
Life, with it is extremely low power consumption extra long life the features such as.
Brief description of the drawings
Fig. 1 show the structural representation of the LED for plant illumination of the utility model embodiment.
Label declaration:
1- lamp holders;2- lampshades;3- driving power supplies;4- radiators;5- aluminum nitride ceramic substrates;
6- blue-light LED chips;The packaging silicon rubbers of 7- first layer;8- full-spectrum LED phosphor powder layers;
The packaging silicon rubbers of 9- second layer.
Embodiment
To describe technology contents of the present utility model, the objects and the effects in detail, below in conjunction with embodiment and match somebody with somebody
Accompanying drawing is closed to be explained.
It refer to shown in Fig. 1, the LED of the present utility model for plant illumination, including lamp holder 1, lampshade 2, driving electricity
Source 3, radiator 4 and LED/light source, the lampshade 2 are fixed on lamp holder 1, and the driving power supply 3 is arranged in lampshade 2 close to lamp
First 1 one end, the LED/light source includes aluminum nitride ceramic substrate 5, blue-light LED chip 6, the first packaging silicon rubber layer 7, full spectrum
LED fluorescent powder layer 8 and the second packaging silicon rubber layer 9, the aluminum nitride ceramic substrate 5 is provided with what is be engaged with blue-light LED chip 6
Circuit, the aluminum nitride ceramic substrate 5 connects driving power supply 3 through radiator 4, and the blue-light LED chip 6 is fixed by crystal-bonding adhesive
On aluminum nitride ceramic substrate 5, the first packaging silicon rubber layer 7 is coated on blue-light LED chip 6, the full-spectrum LED fluorescence
Bisque 8 is coated on the first packaging silicon rubber layer 7, and the second packaging silicon rubber layer 9 is coated on full-spectrum LED phosphor powder layer 8.
In the above-described embodiments, radiator 4 is metal heat sink, and its material can be aluminum/copper etc., radiator 4
One end connects driving power supply 3, and other end connection aluminum nitride ceramic substrate 5 fast and effeciently can distribute heat.Driving
The connection aluminum nitride ceramic substrate 5 of power supply 3 is supplied power for, and driving power supply 3 is that input voltage is 85-265V, is output as 27-30V's
Voltage, lamp holder 1 is general international standard E27 structures, and lampshade 2 is glass blister.
In the above-described embodiments, blue-light LED chip 6 can be one or more, and multiple blue-light LED chips 6 are uniformly distributed
It is fixed on aluminum nitride ceramic substrate 5 and by crystal-bonding adhesive on aluminum nitride ceramic substrate 5, the crystal-bonding adhesive is preferably to be added with
The conducting resinl of silver powder.
In the above-described embodiments, the full-spectrum LED fluorescent material that full-spectrum LED phosphor powder layer 8 is used is existing material, tool
Body can using the full-spectrum LED fluorescent material disclosed in Patent No. CN104263359A, accordingly, blue-light LED chip 6 it is specific
The record that wavelength can refer to embodiment 1 to the embodiment 4 of the patent is arranged in pairs or groups, so as to obtain close to full spectral illumination, show
Color is high, the LED for plant illumination that illumination patterns are uniform, luminous intensity is high.
LED/light source used in LED of the present utility model for plant illumination, substantially can refer to following technological process life
Production is obtained:
Aluminum nitride ceramic substrate 5 is put into automatic die bond equipment, die bond automatic equipment is to crystal-bonding adhesive is put on substrate, then
Blue-light LED chip 6 is solid to the substrate relevant position for having put crystal-bonding adhesive by automatic die bond equipment, complete after die bond operation
It is put into oven device and carries out baking-curing;
After the completion of solidification, packaging silicon rubber is coated on blue-light LED chip 6 by dispensing operation and forms the first packaging silicon rubber
Layer 7, forms full-spectrum LED phosphor powder layer 8 on the first packaging silicon rubber layer 7 by the uniform spreading of full-spectrum LED fluorescent material, then dries
Roasting solidification;
Finally, packaging silicon rubber is coated on full-spectrum LED phosphor powder layer 8 by dispensing operation and forms the second packaging silicon rubber
Layer 9, then baking-curing;
Go out after baking and carry out finished product detection, packaging and storage.
Technological process:
Die bond --- --- --- dry for first time dispensing, spreading fluorescent material for baking by baking --- second of dispensing ---
Roasting --- spectrophotometric test --- detection storage.
It was found from foregoing description, the beneficial effects of the utility model are:
(1) the utility model can directly replace the fluorescent lamp or high-pressure mercury lamp of original plant illumination, energy-conservation effect
Fruit substantially, due to using blue-light LED chip with full-spectrum LED phosphor powder layer coordinating, therefore can obtain shining close to full spectrum
The LED for plant illumination that bright, colour rendering is high, illumination patterns are uniform, luminous intensity is high, preferably meets the light of plant growth
According to demand, promote the growth of plant;
(2) full-spectrum LED phosphor powder layer of the present utility model is arranged on the first packaging silicon rubber layer and the second packaging silicon rubber layer
Between, with being set directly on blue-light LED chip or compared with packaging silicon rubber is mixed and made into after fluorescent glue again mode for dispensing glue, both
The usage amount of fluorescent material can be greatly reduced, production cost, and it is possible to prevente effectively from the heat that blue-light LED chip work is produced is reduced
Amount is direct or is closely transmitted to fluorescent material and causes fluorescent material to be damaged, so as to reduce the optical attenuation of light source, improves production
The light emission rate and service life of product;
(3) the utility model uses the AIN ceramic wafers (i.e. aluminum nitride ceramic substrate) with high heat conduction, high temperature tolerance energy to enter
Row encapsulation, the heatproof for solving traditional material is not enough, the problem of thermal conductivity factor is low, and aluminum nitride ceramic substrate connects through radiator
Driving power supply is connect, fast and effeciently can be distributed heat, therefore substantially increases the luminous efficiency of product and uses the longevity
Life, with it is extremely low power consumption extra long life the features such as.
Further, the outer surface of the second packaging silicon rubber layer 9 is frosting.
It was found from foregoing description, the beneficial effects of the utility model are:By by the second packaging silicon rubber layer outer surface
Frosting is designed as, the light guide of product can be made more uniform soft, the illuminating effect of product is improved.
Further, the first packaging silicon rubber layer 7 is in segment shape, the central angle of the arc surface of the first packaging silicon rubber layer 7
For 120~140 degree, the full-spectrum LED phosphor powder layer 8 is evenly coated on the first packaging silicon rubber layer 7, the second encapsulation silicon
Glue-line 9 is evenly coated on full-spectrum LED phosphor powder layer 8, and the thickness of the second packaging silicon rubber layer 9 is 1~5mm.
It was found from foregoing description, the beneficial effects of the utility model are:Using said structure design, be conducive to improving and produce
The luminous efficiency and irradiating angle of product, reduce light loss.
It refer to shown in Fig. 1, embodiment one of the present utility model is:
A kind of LED for plant illumination, including lamp holder 1, lampshade 2, driving power supply 3, radiator 4 and LED/light source, institute
State lampshade 2 to be fixed on lamp holder 1, the driving power supply 3 is arranged in lampshade 2 close to one end of lamp holder 1, the LED/light source bag
Include aluminum nitride ceramic substrate 5, blue-light LED chip 6, the first packaging silicon rubber layer 7, the encapsulation silicon of full-spectrum LED phosphor powder layer 8 and second
Glue-line 9, the aluminum nitride ceramic substrate 5 is provided with the circuit being engaged with blue-light LED chip 6, the aluminum nitride ceramic substrate 5
Driving power supply 3 is connected through radiator 4, the blue-light LED chip 6 is fixed on aluminum nitride ceramic substrate 5 by crystal-bonding adhesive, described
First packaging silicon rubber layer 7 is coated on blue-light LED chip 6, and the full-spectrum LED phosphor powder layer 8 is coated on the first packaging silicon rubber
On layer 7, the second packaging silicon rubber layer 9 is coated on full-spectrum LED phosphor powder layer 8.The appearance of the second packaging silicon rubber layer 9
Face is frosting.First packaging silicon rubber layer 7 is in segment shape, the central angle of the arc surface of the first packaging silicon rubber layer 7 for 120~
140 degree, the full-spectrum LED phosphor powder layer 8 is evenly coated on the first packaging silicon rubber layer 7, and the second packaging silicon rubber layer 9 is equal
Even to be coated on full-spectrum LED phosphor powder layer 8, the thickness of the second packaging silicon rubber layer 9 is 1~5mm.
In summary, the LED for plant illumination that the utility model is provided, can directly replace original plant illumination
Fluorescent lamp or high-pressure mercury lamp, energy-saving effect are obvious, and equal close to full spectral illumination, colour rendering height, illumination patterns
Even, luminous intensity is high, and the lighting requirements of plant growth are met well, may advantageously facilitate the growth of plant, and fluorescent material is used
Amount is low, is difficult heat damage, light loss is few, and light emission rate is high, and perfect heat-dissipating, light guide is uniform, soft, good illumination effect,
Service life is long.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalents made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in the technology neck of correlation
Domain, is similarly included in scope of patent protection of the present utility model.
Claims (2)
1. a kind of LED for plant illumination, it is characterised in that:Including lamp holder, lampshade, driving power supply, radiator and LED light
Source, the lampshade is fixed on lamp holder, and the driving power supply is arranged in lampshade close to one end of lamp holder, the LED/light source bag
Include aluminum nitride ceramic substrate, blue-light LED chip, the first packaging silicon rubber layer, full-spectrum LED phosphor powder layer and the second packaging silicon rubber
Layer, the aluminum nitride ceramic substrate is provided with the circuit being engaged with blue-light LED chip, and the aluminum nitride ceramic substrate is through radiating
Device connects driving power supply, and the blue-light LED chip is fixed on aluminum nitride ceramic substrate by crystal-bonding adhesive, the first encapsulation silicon
Glue-line is coated on blue-light LED chip, and the full-spectrum LED phosphor powder layer is coated on the first packaging silicon rubber layer, and described second
Packaging silicon rubber layer is coated on full-spectrum LED phosphor powder layer.
2. the LED according to claim 1 for plant illumination, it is characterised in that:First packaging silicon rubber layer is in
Segment shape, the central angle of the arc surface of the first packaging silicon rubber layer is 120~140 degree, and the full-spectrum LED phosphor powder layer is uniformly wrapped
Overlay on the first packaging silicon rubber layer, the second packaging silicon rubber layer is evenly coated on full-spectrum LED phosphor powder layer, the second encapsulation
The thickness of layer of silica gel is 1~5mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621411965.0U CN206469096U (en) | 2016-12-20 | 2016-12-20 | A kind of LED for plant illumination |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621411965.0U CN206469096U (en) | 2016-12-20 | 2016-12-20 | A kind of LED for plant illumination |
Publications (1)
Publication Number | Publication Date |
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CN206469096U true CN206469096U (en) | 2017-09-05 |
Family
ID=59711047
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Application Number | Title | Priority Date | Filing Date |
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CN201621411965.0U Expired - Fee Related CN206469096U (en) | 2016-12-20 | 2016-12-20 | A kind of LED for plant illumination |
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CN (1) | CN206469096U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109644718A (en) * | 2018-11-22 | 2019-04-19 | 杭州汉徽光电科技有限公司 | Plant light compensation LED light source and the lamps and lanterns for using the light source |
-
2016
- 2016-12-20 CN CN201621411965.0U patent/CN206469096U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109644718A (en) * | 2018-11-22 | 2019-04-19 | 杭州汉徽光电科技有限公司 | Plant light compensation LED light source and the lamps and lanterns for using the light source |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170905 Termination date: 20171220 |
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CF01 | Termination of patent right due to non-payment of annual fee |