CN109686833B - Secondary sealing method for luminous ring - Google Patents
Secondary sealing method for luminous ring Download PDFInfo
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- CN109686833B CN109686833B CN201811571531.0A CN201811571531A CN109686833B CN 109686833 B CN109686833 B CN 109686833B CN 201811571531 A CN201811571531 A CN 201811571531A CN 109686833 B CN109686833 B CN 109686833B
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- Prior art keywords
- frame
- epoxy resin
- luminous
- ring
- luminous ring
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000007789 sealing Methods 0.000 title claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 238000007689 inspection Methods 0.000 claims abstract description 21
- 239000012535 impurity Substances 0.000 claims abstract description 13
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 239000002390 adhesive tape Substances 0.000 claims abstract description 9
- 239000000047 product Substances 0.000 claims description 41
- 239000011265 semifinished product Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 5
- 238000004382 potting Methods 0.000 claims description 4
- 230000000007 visual effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000003292 glue Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 244000144992 flock Species 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C7/00—Sorting by hand only e.g. of mail
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a method for manufacturing a display element. The method can find whether quality flaws exist in the sealing process, so that the quality inspection work is moved forward; so as to reduce the generation of unqualified products as much as possible, improve the product percent of pass and reduce the production cost. The technical scheme is as follows: the secondary sealing method of the luminous ring comprises the following steps: 1) after the frame of the luminous ring is subjected to impurity removal treatment, a high-temperature adhesive tape is pasted and encapsulated on the front side of the frame, and then the back side of the frame is upward and is horizontally placed on a workbench; 2) injecting epoxy resin for the first time from the back of the frame, wherein the injection amount is 30-35% of the volume of the reflection cavity of the frame, then carrying out defoaming treatment, and then baking to solidify the epoxy resin to form a luminous surface on the front of the luminous ring, thus obtaining an initial product; 3) and performing first quality inspection on the primary product, namely, rejecting part of the primary product containing impurities aiming at the appearance inspection of the light-emitting area.
Description
Technical Field
The invention relates to a preparation method of a display element, in particular to a method for secondary sealing glue of a luminous ring.
Background
The display element is an important part in various electronic products, and plays a key role in real-time display of various data information images of the electronic products and decoration modeling of the outside of the products. With the rapid development of technological progress, various new electronic products are emerging continuously, and more display elements are needed to be correspondingly matched. However, the problem of minute foreign materials encountered in the manufacturing process of the display element has become a factor affecting the quality of the product. Because the manufacturing process of the light-emitting element needs to adopt the epoxy resin to carry out one-time sealing on the PCB and the electronic element, if the materials are mixed with attachments, dust in the air, hair scraps brought by human bodies, fine particles and other sundries generated in the manufacturing process of the product during the sealing, corresponding black spots, silk-like objects, fine points and the like can be generated on the light-emitting surface of the display element during the electrification inspection, and the light-emitting effect and the product image are seriously influenced. Especially, the whole annular front surface of the annular display element such as a luminous ring is a luminous surface, and the visual effect of the product is seriously affected as long as foreign matters are brought into one position, so that the product (including the annular PCB plate) can only be scrapped. At this point, the entire manufacturing process of the product is complete and all of the early investment is wasted.
Disclosure of Invention
The invention aims to overcome the defects in the background technology and provides a secondary sealing method for a luminous ring, which can find whether quality defects exist in the sealing process so as to move the quality inspection forward; so as to reduce and avoid the generation of unqualified products as much as possible, improve the product percent of pass and reduce the production cost.
The technical scheme provided by the invention is as follows:
the secondary sealing method of the luminous ring comprises the following steps:
1) after the frame of the luminous ring is subjected to impurity removal treatment, a high-temperature adhesive tape is pasted and encapsulated on the front side of the frame, and then the back side of the frame is upward and is horizontally placed on a workbench;
2) injecting epoxy resin for the first time from the back of the frame, wherein the injection amount is 30-35% of the volume of the reflection cavity of the frame, then carrying out defoaming treatment, and then baking to solidify the epoxy resin to form a luminous surface on the front of the luminous ring, thus obtaining an initial product;
3) performing first quality inspection on the primary product, namely, rejecting part of the primary product containing impurities aiming at the appearance inspection of a light-emitting area;
4) placing the qualified primary product on a workbench with the back facing upwards, injecting epoxy resin for the second time, and then performing defoaming treatment;
5) pressing the PCB (7) and electronic elements communicated with the PCB into the epoxy resin layer one by one to enable the epoxy resin to cover the back of the PCB, completely filling a gap between the PCB and the light emitting surface of the primary product, and baking to enable the epoxy resin to be cured to obtain a semi-finished product;
6) tearing off the semi-finished product of the potting high-temperature adhesive tape, and then carrying out secondary quality inspection, including photoelectric property and appearance inspection; and sending the qualified semi-finished product to the next working procedure.
And 3) performing the first quality inspection in the step 3), and removing the primary products with visible impurities by adopting a visual observation mode.
Injecting epoxy resin for the second time in the step 4), wherein the injection amount is 45-50% of the volume of the frame reflection cavity; then, defoaming treatment is performed.
And the second quality inspection in the step 6) is to conduct the power on to the luminous ring to emit light, and then to inspect the whole luminous effect of the luminous ring.
The defoaming treatment in the step 2) and the step 4) is carried out in a vacuum oven.
The invention has the beneficial effects that:
the method provided by the invention can remove the primary product with sundries in the luminous surface of the luminous ring, thereby greatly reducing the probability of sundries in the luminous surface of the finished product and also obviously improving the qualification rate of the product (according to measurement and calculation, the qualification rate of the product is improved by about 15%); and the rejected primary products do not contain high-value PCB (printed circuit board) and related electronic components (such as LED light-emitting components), so that the loss is extremely low (only a few low-value frames and epoxy resin glue), the production cost is greatly reduced, and the economic benefit is remarkable.
Drawings
Fig. 1 is a schematic front view of a light emitting ring frame according to the present invention.
Fig. 2 is a schematic top view (sectional view) of the light emitting ring frame according to the present invention.
Fig. 3 is a right-view structural schematic diagram (sectional structure) of the light emitting ring frame of the present invention.
Fig. 4 is a front view structural diagram of the luminous ring frame after the first epoxy resin injection in the present invention.
Fig. 5 is a schematic top view of the luminous ring frame after the first epoxy resin injection.
Fig. 6 is a schematic front view of the luminous ring frame after the second epoxy resin injection.
Fig. 7 is a schematic top view of the luminous ring frame after the second epoxy resin injection.
Detailed Description
The present invention will be further described with reference to the drawings attached to the specification, but the present invention is not limited to the following examples.
The luminous ring frame shown in fig. 1 to 3 includes an inner ring 3 and an outer ring 1 which are different in size and coaxially arranged, and a plurality of reinforcing ribs 2 which are radially arranged between the inner ring and the outer ring and connect the inner ring and the outer ring into a whole; the figure also shows that: the reinforcing ribs are positioned in the middle of the light-emitting ring frame in the axial direction, so that a space between the inner ring and the outer ring forms a reflecting cavity of the light-emitting ring frame. After the reflection cavity is sealed by epoxy resin, all the reinforcing ribs in the reflection cavity are coated by the epoxy resin.
In view of the defects of the existing one-time epoxy resin sealing method for the luminous ring, the invention adopts the following secondary sealing method:
1) firstly, dedusting a frame of the luminous ring; then, a high-temperature adhesive tape is pasted and encapsulated on the front side of the frame, and then the frame is horizontally placed on a workbench with the back side facing upwards (as shown in figure 2; the encapsulation adhesive tape is omitted in the figure); the front of the luminous ring needs to be kept flat, so that the back of the luminous ring frame adhered with the potting adhesive tape can be flatly placed on a flat plate with proper size (the flat plate is placed on a workbench) to facilitate the movement of the luminous ring frame (such as baking in an oven).
2) Injecting first epoxy resin (first sealing glue) from the back of the frame, wherein the injection amount is 30-35% of the volume of the frame reflection cavity; and then, the frame is sent into a vacuum oven for defoaming treatment and baking, so that the epoxy resin is solidified to form a first sealant layer 5 (namely, a luminous surface positioned on the front surface of the luminous ring), and a primary product is obtained (see fig. 4 and 5).
3) Performing primary quality inspection on the primary product, and removing part of the primary product containing impurities; the secondary quality inspection can adopt a visual observation mode to remove primary products with visible impurities (the impurities comprise fine attachments of materials falling into colloid, dust in air, flock brought by human bodies, fine particles generated in the manufacturing process of products and the like; and the influence of fine invisible impurities on the luminous surface can be almost ignored).
4) And (3) flatly placing the rest qualified initial products on a workbench with the back faces upward, injecting epoxy resin (sealing glue for the second time) for the second time from the back faces of the qualified initial products, and then conveying the frame into a vacuum oven for defoaming treatment and baking.
5) Pressing the PCB 7 and electronic components (PCB shown in figure 7, electronic components are omitted) connected with the PCB into the epoxy resin liquid 6 according to the conventional process requirements, and positioning the electronic components on the epoxy resin layer of the primary product one by one; the epoxy resin liquid layer completely covers the upper surface and the lower surface of the PCB, and a gap between the annular PCB 7 and the light-emitting surface of the primary product is completely filled; and finally, baking to cure the epoxy resin to form a second adhesive layer 6, so as to obtain a semi-finished product (see fig. 6 and 7).
6) Tearing off the semi-finished product of the potting high-temperature adhesive tape, and then carrying out secondary quality inspection; the second quality inspection is to connect the luminous ring with a power supply to make the luminous ring emit light, and to inspect the whole luminous effect of the luminous ring; can be visually inspected by an inspector. In the second sealing, even if fine attachments, dust in the air, flock brought by human bodies, fine particles generated in the product manufacturing process and other impurities existing in the material fall into the colloid, the display effect of the product is slightly influenced.
A small amount of unqualified products are removed, and the qualified semi-finished products are sent to the next working procedure.
In fig. 2, 5, and 7, the front of the light emitting ring frame faces downward.
Finally, it should be noted that the above-mentioned list is only a specific embodiment of the present invention. It is obvious that the present invention is not limited to the above embodiments, but many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the present invention are to be considered within the scope of the invention.
Claims (4)
1. The secondary sealing method of the luminous ring comprises the following steps:
1) after the frame of the luminous ring is subjected to impurity removal treatment, a high-temperature adhesive tape is pasted and encapsulated on the front side of the frame, and then the back side of the frame is upward and is horizontally placed on a workbench;
2) injecting epoxy resin for the first time from the back of the frame, wherein the injection amount is 30-35% of the volume of the reflection cavity of the frame; then defoaming, and baking to solidify the epoxy resin to form a luminous surface on the front side of the luminous ring to obtain an initial product;
3) performing first quality inspection on the primary product, namely, rejecting part of the primary product containing impurities aiming at the appearance inspection of a light-emitting area;
4) placing the qualified primary product on a workbench with the back facing upwards, injecting epoxy resin for the second time, and then performing defoaming treatment;
5) pressing the PCB (7) and electronic elements communicated with the PCB into the epoxy resin layer one by one to enable the epoxy resin to cover the back of the PCB, completely filling a gap between the PCB and the light emitting surface of the primary product, and baking to enable the epoxy resin to be cured to obtain a semi-finished product;
6) tearing off the semi-finished product of the potting high-temperature adhesive tape, and then carrying out secondary quality inspection, including photoelectric property and appearance inspection; sending the qualified semi-finished product to the next working procedure;
and 3) performing the first quality inspection in the step 3), and removing the primary products with visible impurities by adopting a visual observation mode.
2. The secondary sealing method for light-emitting ring of claim 1, wherein: injecting epoxy resin for the second time in the step 4), wherein the injection amount is 45-50% of the volume of the frame reflection cavity; then, defoaming treatment is performed.
3. The secondary sealing method for light-emitting ring of claim 2, wherein: and the second quality inspection in the step 6) is to conduct the power on to the luminous ring to emit light, and then to inspect the whole luminous effect of the luminous ring.
4. The secondary sealing method for light-emitting ring of claim 3, wherein: the defoaming treatment in the step 2) and the step 4) is carried out in a vacuum oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571531.0A CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571531.0A CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109686833A CN109686833A (en) | 2019-04-26 |
| CN109686833B true CN109686833B (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811571531.0A Active CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Country Status (1)
| Country | Link |
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| CN (1) | CN109686833B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270901A (en) * | 2001-03-12 | 2002-09-20 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
| JP2007109911A (en) * | 2005-10-14 | 2007-04-26 | Renesas Technology Corp | Light emitting diode and its manufacturing method |
| CN100583473C (en) * | 2007-07-27 | 2010-01-20 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN101457905A (en) * | 2007-12-14 | 2009-06-17 | 启萌科技有限公司 | Luminous unit |
| CN101799135A (en) * | 2010-02-21 | 2010-08-11 | 迪亚士照明有限公司 | Process for manufacturing flexible lamp belts |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
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2018
- 2018-12-21 CN CN201811571531.0A patent/CN109686833B/en active Active
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| CN109686833A (en) | 2019-04-26 |
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Effective date of registration: 20200908 Address after: No. 1418-27, Moganshan Road, Hangzhou, Zhejiang Province Applicant after: HANGZHOU SANGAO OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: The City Industrial Park, No. 1418-27 Hangzhou City, Zhejiang province Gongshu District Moganshan Road 310000 Applicant before: Pang Bo |
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