CN114937680A - Display panel, preparation method and display device - Google Patents
Display panel, preparation method and display device Download PDFInfo
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- CN114937680A CN114937680A CN202210449378.4A CN202210449378A CN114937680A CN 114937680 A CN114937680 A CN 114937680A CN 202210449378 A CN202210449378 A CN 202210449378A CN 114937680 A CN114937680 A CN 114937680A
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- adhesive layer
- display substrate
- protective film
- display
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The disclosure provides a display panel, a preparation method and a display device. The display panel includes: the display substrate, the adhesive layer and the protective film are sequentially stacked; wherein the adhesiveness of at least one side edge of the adhesive layer perpendicular to the surface of the display substrate close to the protective film is smaller than that of the other part of the adhesive layer. The side contamination of the display panel can be suppressed.
Description
Technical Field
The disclosure belongs to the technical field of display, and particularly relates to a display panel, a preparation method and a display device.
Background
This section is intended to provide a background or context to the embodiments recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.
In the related art, Micro light emitting diodes (Micro-LED, Mini-LED) are transferred onto a glass substrate. The chip size of the Mini-LED is between 100 μm and 200 μm. The Micro-LEDs are smaller in size than the Mini LEDs, typically between 1 μm and 100 μm. The above two types of light emitting diodes are collectively referred to as micro light emitting diodes in this disclosure. In the related art, a larger size light emitting diode is transferred to a substrate to form a display panel. The micro-light emitting diode based display panel has the advantages of high brightness, high contrast, fast response and low power consumption. In the related art, after the transfer process of the micro light emitting diode is completed, the micro light emitting diode is covered by the adhesive material, thereby completing the packaging of the micro light emitting diode display panel.
Disclosure of Invention
The disclosure provides a display panel, a preparation method and a display device.
The present disclosure provides the following technical solutions: a display panel, comprising: the display substrate comprises a substrate and a light-emitting device arranged on the substrate, and the adhesive layer covers the light-emitting device;
wherein at least one side edge of the adhesive layer perpendicular to the surface of the display substrate has a lower adhesiveness than other portions of the adhesive layer.
In some embodiments, the at least one side edge of the adhesive layer is provided with a photosensitive unit configured to reduce the adhesiveness of the at least one side edge of the adhesive layer under irradiation of light of a preset wavelength.
In some embodiments, an orthographic projection of at least a portion of the light sensitive cells on the display substrate falls within the display substrate.
In some embodiments, the size of the photosensitive unit is 5um to 20um in a direction parallel to a surface of the display substrate near the protective film.
In some embodiments, the material of the photoactive unit includes a photoinitiator.
In some embodiments, the photoinitiator is incorporated into the glue of the adhesive layer, or the photoinitiator is separate from the glue of the adhesive layer and is located on a side of the glue of the adhesive layer.
In some embodiments, the at least one side edge of the adhesive layer is flush with the display substrate perpendicular to the display substrate.
In some embodiments, the adhesive layer includes a black adhesive layer and a transparent adhesive layer stacked in a direction perpendicular to a surface of the display substrate close to the protective film.
In some embodiments, an orthographic projection of the light sensing unit on the substrate base does not cover an orthographic projection of the plurality of light emitting devices on the substrate base.
In some embodiments, the display panel further comprises a protective film disposed on a side of the adhesive layer remote from the display substrate.
In some embodiments, the light emitting device comprises a micro light emitting diode.
The present disclosure provides the following technical solutions: a method for manufacturing a display panel, comprising:
providing a display substrate, wherein the display substrate comprises a substrate and a light-emitting device arranged on the substrate;
forming an adhesive layer over the display substrate, the adhesive layer covering the light emitting device;
wherein at least one side edge of the adhesive layer perpendicular to the surface of the display substrate has a lower adhesiveness than other portions of the adhesive layer.
In some embodiments, forming an adhesive layer and a protective film over the display substrate comprises:
forming an adhesive layer and a protective film over the display substrate; wherein an orthographic projection of the display substrate on the protective film covers a portion of an orthographic projection of the adhesive layer on the protective film and a portion of the protective film;
cutting the adhesive layer and the protective film so that the at least one side edge of the remaining adhesive layer is positioned inside a corresponding side edge of the display substrate perpendicular to the surface of the display substrate close to the protective film;
forming a photosensitive unit at the at least one side edge of the adhesive layer; wherein the photosensitive unit is configured to reduce the viscosity of the at least one side edge of the adhesive layer under the irradiation of light with a preset wavelength.
In some embodiments, forming an adhesive layer and a protective film over the display substrate comprises:
forming an adhesive layer and a protective film over the display substrate; wherein the orthographic projection of the display substrate on the protective film covers a part of the orthographic projection of the adhesive layer on the protective film and a part of the protective film, the adhesive layer is positioned on one side of the protective film facing the display substrate, at least one side edge of the adhesive layer is provided with a photosensitive unit, and the orthographic projection of at least part of the photosensitive unit on the display substrate falls within the range of the display substrate;
and cutting the adhesive layer and the protective film so that the at least one side edge of the residual adhesive layer is flush with the corresponding side edge of the display substrate, which is perpendicular to the surface of the display substrate close to the protective film.
The present disclosure provides the following technical solutions: a display device comprises the display panel.
The adhesiveness of the edge area of the adhesive layer is reduced, which makes the side of the adhesive layer less prone to adhere dirt such as dust, thereby improving the appearance of the product and the display effect.
Drawings
Fig. 1 is a schematic structural diagram of a micro led display panel in the related art.
Fig. 2 is a schematic structural diagram of a micro led display panel according to an embodiment of the disclosure.
Fig. 3 is a schematic structural diagram of a micro led display panel according to another embodiment of the disclosure.
Fig. 4 is a schematic flow chart diagram illustrating a method for manufacturing a micro light emitting diode display panel according to an embodiment of the disclosure.
Fig. 5 is a detailed flowchart illustrating a part of the steps of a method for manufacturing a micro led display panel according to an embodiment of the disclosure.
Fig. 6a to 6d are schematic diagrams illustrating intermediate states of a micro light emitting diode display panel according to an embodiment of the disclosure in a manufacturing process.
Fig. 7 is a detailed flowchart illustrating a part of the steps of a method for manufacturing a micro light emitting diode display panel according to an embodiment of the disclosure.
Fig. 8a is a schematic diagram of fig. 8d showing an intermediate state of a micro led display panel according to another embodiment of the disclosure during a manufacturing process.
The display device comprises a display substrate, a first substrate, a second substrate and a first substrate, wherein 1, the display substrate; 11. a substrate base plate; 12. a light emitting device; 3. an adhesive layer; 31. a black glue layer; 32. a transparent adhesive layer; 33. the photosensitive unit is irradiated by light with preset wavelength; 33', a photosensitive unit before the irradiation of the light with the preset wavelength; 4. and (5) protecting the film.
Detailed Description
The present disclosure is further described below with reference to the embodiments shown in the drawings.
FIG. 1 is a schematic diagram of a Micro light emitting diode (Mini-LED/Micro-LED) display panel according to the related art. The display substrate 1 includes a glass substrate 11 and a light emitting device 12 (specifically, a micro light emitting diode chip) disposed on the glass substrate 11. The light emitting device 12 is encapsulated by the adhesive layer 3 comprising the black glue layer 31 and the transparent glue layer 32. The protective film 4 is covered on the adhesive layer 3.
The inventors of the present disclosure have found that since the adhesive layer 3 has exposed and adhesive side surfaces, i.e., the surface of the adhesive layer 3 perpendicular to the display substrate 1 near the protective film 4 is exposed and adhesive, dirt such as dust is easily adhered to these surfaces, thereby affecting the appearance of the product and the display effect.
In view of this, referring to fig. 2 and 3, an embodiment of the present disclosure provides a display panel including: a display substrate 1, an adhesive layer 3, and a protective film 4 which are stacked;
wherein, the adhesiveness of at least one side edge of the adhesive layer 3 perpendicular to the surface of the display substrate 1 near the protective film 4 is smaller than that of the other part of the adhesive layer 3.
In other words, the adhesiveness of the edge area of the adhesive layer 3 is reduced, which makes the side of the adhesive layer 3 less prone to adhere dirt such as dust, thereby improving the appearance of the product and the display effect.
In other embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is non-adhesive. The protective film 4 is an optional layer structure.
In other embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is adhered to another structure.
The material of the protective film 4 includes polyethylene terephthalate (PET).
The display substrate 1 includes a base substrate 11, a driving circuit layer (not shown) disposed on the base substrate 11, and a light emitting device 12 disposed on the driving circuit layer. The driving circuit layer typically includes transistors and traces to drive the light emitting device 12 to emit light. The traces include, for example, gate lines, data lines, power lines, ground lines, and the like. The Transistor is, for example, a Thin Film Transistor (TFT) or the like. The present disclosure does not limit the details of the structure of the display substrate 1, and those skilled in the art can arrange the display substrate according to the prior art.
In some embodiments, at least one side edge of the adhesive layer 3 is provided with a photosensitive unit 33 configured to reduce the adhesiveness of at least one side edge of the adhesive layer 3 under irradiation of light of a preset wavelength. The light of the predetermined wavelength is, for example, ultraviolet light (UV light).
In some embodiments, the photosensitive unit 33 includes a photoinitiator that is independent of the glue of the adhesive layer 3. The photoinitiators are, for example: 1173 (2-hydroxy-2-methyl-1-phenylpropanone), 907 (2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone), TPO (2,4, 6-trimethylbenzoyl-diphenylphosphine oxide), TPO-L ( ethyl 2,4, 6-trimethylbenzoylphenylphosphonate), etc. For example, after the adhesive material of the adhesive layer 3 is formed, a photoinitiator is coated or sprayed on an edge area of the surface of the adhesive material of the adhesive layer 3. And then laminating the multiple layers of rubber materials or laminating the rubber materials and the protective film 4. In these embodiments, the photosensitive unit 33 includes one or more layers of glue and a photoinitiator having an overlapping area with the glue.
In other embodiments, the photoinitiator is incorporated into the glue of the adhesive layer 3. For example, after the adhesive 3 is formed, the photo initiator is penetrated into the edge area of the adhesive layer 3 by a penetration method.
Under the stimulation of specific light, the photoinitiator catalyzes the non-polyester in the adjacent glue material to be converted into polyester, so that the viscosity of the edge area of the adhesive layer 3 is reduced.
In other embodiments, the light sensitive unit 33 is independent of the glue layer in the adhesive layer 3. The light sensitive unit 33 is, for example, a UV glue coated on the side surface of the glue layer in the adhesive layer 3. The UV paste itself is cured by irradiation of ultraviolet light, thereby reducing the tackiness at the side surface of the adhesive layer 3.
In other embodiments, at least one side edge of adhesive layer 3 is naturally air dried to reduce tackiness. At least one side edge of the adhesive layer 3 is formed of a fluorinating agent, for example.
In some embodiments, referring to fig. 2 and 3, the orthographic projection of at least a portion of the light sensitive cells 33 on the display substrate 1 falls within the display substrate 1.
In the embodiment shown in fig. 2, the orthographic projection of the protective film 4 on the display substrate 1 covers the orthographic projection of the photosensitive unit 33 on the display substrate 1.
In some variations, the orthographic projection of the photosensitive unit 33 on the display substrate 1 exceeds the orthographic projection of the protective film 4 on the display substrate 1.
In the embodiment shown in fig. 3, the orthographic projection of the protective film 4 on the display substrate 1 does not overlap with the orthographic projection of the photosensitive unit 33 on the display substrate 1.
In some embodiments, the size of the photosensitive unit 33 is 5um to 20um in a direction parallel to the surface of the display substrate 1 near the protective film 4.
The too small size of the photosensitive unit 33 in a direction parallel to the surface of the display substrate 1 near the protective film 4 is not effective enough to reduce the side contamination of the adhesive layer 3. The oversized photosensitive unit 33 increases the size of the display panel in a direction parallel to the surface of the display substrate 1 near the protective film 4.
In some embodiments, referring to fig. 2 and 3, at least one side edge of the adhesive layer 3 is flush with a corresponding side edge of the display substrate 1 perpendicular to the surface of the display substrate 1 near the protective film 4. This is advantageous for reducing the display panel layer size. When the display panel is used as a display panel for splicing, the size of the joint can be reduced.
In some embodiments, referring to fig. 2 and 3, the adhesive layer 3 includes a transparent adhesive layer 32 and a black adhesive layer 31 stacked in a direction perpendicular to the surface of the display substrate 1 adjacent to the protective film 4.
The transparent Adhesive layer 32 is, for example, an Optical Clear Adhesive (OCA). The Black glue layer 31 is, for example, an optical Black glue (optical Black Adhesive).
Optical black paste is usually coated in the gaps between the micro light emitting diodes and on the surfaces of the micro light emitting diodes, so that the optical black paste contacts with the side surfaces and the surfaces of the micro light emitting diodes, thereby improving the contrast of the display substrate by using the optical black paste, and encapsulating and protecting the micro light emitting diodes.
When the micro led does not emit light, the black glue layer 31 can absorb the ambient light irradiated to the inside of the display substrate, thereby reducing the black state brightness of the display substrate and improving the display contrast.
The transparent adhesive layer 32 generally plays a role in protection, and the material of the transparent adhesive layer 32 may include, but is not limited to, materials with better transparency, such as silicone, acrylic, and epoxy.
In specific implementation, the light adjusting layers (i.e., the encapsulating film layers such as black glue and transparent glue) can be manufactured above the light emitting diode 102 in several times; alternatively, each light ray adjustment layer may be first fabricated as a laminated composite film layer, and then the composite film layer may be directly bonded to the side of the display substrate having the light emitting diodes 102.
In these embodiments, the light emitting direction of the display panel is a direction from the adhesive layer 3 to the display substrate 1.
In other embodiments, the adhesive layer 3 includes a transparent glue layer 32, and does not include a black glue layer 31. In these embodiments, the light-emitting direction of the display panel is a direction from the display substrate 1 to the adhesive layer 3.
In other embodiments, the adhesive layer 2 includes a black glue layer 31 and glue layers of other colors. The black glue layer 31 covers the light emitting devices 12 and fills gaps between the light emitting devices 12. The black glue layer 31 may be replaced with a glue layer of another color. Other colored glue layers are for example grey, white, etc.
In some embodiments, referring to fig. 2 and 3, the display substrate 1 includes a substrate 11 and a plurality of light emitting devices 12 disposed on the substrate 11; wherein the orthographic projection of the photosensitive unit 33 on the substrate base plate 11 does not cover the orthographic projection of the plurality of light emitting devices 12 on the substrate base plate 11.
The base substrate 11 is, for example, a glass substrate. The light-emitting device 12 is, for example, a Micro light-emitting diode chip (Mini-LED or Micro-LED). The existing packaging methods of the micro light emitting diode include plastic packaging (molding), pressing, ink jet printing and the like. The micro-leds are transferred from the initial substrate to the base substrate 11 by a transfer process.
Based on the same inventive concept, referring to fig. 4, an embodiment of the present disclosure also provides a method for manufacturing a display panel, including the following steps.
The display substrate 1 further includes a driving circuit layer (not shown) that drives the light emitting device 12. The driving circuit layer typically includes transistors and traces to drive the light emitting device 12 to emit light. The traces include, for example, gate lines, data lines, power lines, ground lines, and the like. The Transistor is, for example, a Thin Film Transistor (TFT). And a bonding pad for receiving the micro light-emitting diode is formed above the driving circuit layer. The present disclosure does not limit the details of the structure of the display substrate 1, and those skilled in the art can arrange the display substrate according to the prior art.
The light-emitting device 12 is, for example, a micro light-emitting diode chip. After the micro light emitting diode chip is fabricated, the micro light emitting diode chip is transferred from the initial substrate onto the substrate base 11 through a transfer process. The micro light emitting diodes form an array, thereby enabling the display substrate to display an image.
In some embodiments, the micro-leds are controlled to dip solder, and the solder-dipped micro-leds are then fixed to pads on the display substrate by the solder. The cathode and the anode of the micro light emitting diode chip in the embodiment of the present disclosure are formed on the same side surface of the micro light emitting diode chip.
Wherein at least one side edge of the adhesive layer 3 perpendicular to the surface of the display substrate 1 has a lower adhesiveness than the other portions of the adhesive layer 3.
The adhesiveness of the edge area of the adhesive layer 3 is reduced, which makes the side of the adhesive layer 3 less prone to adhere dirt such as dust, thereby improving the appearance of the product and the display effect.
In some embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is non-adhesive. In these embodiments, the protective film 4 is a layer structure that can be omitted.
In some embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is adhered to another structure. For example, a touch function layer is provided on the surface of the adhesive layer 3 facing away from the display substrate 1. In other embodiments, a touch functional layer is disposed on a surface of the display substrate 1 opposite to the adhesive layer 3.
In some embodiments, referring to fig. 5, forming adhesive layer 3 over display substrate 1 includes the following steps.
Specifically, referring to fig. 6a and 6b, the adhesive layer 3 is bonded to the protective film 4, and then the adhesive layer 3 is pressed toward the surface to be encapsulated (the surface on which the light emitting device 12 is formed) of the display substrate 1. The material of the protective film 4 includes polyethylene terephthalate (PET).
Referring to fig. 6c, a laser cutting process may be used to remove portions of both the adhesive layer 3 and the protective film 4 beyond the display substrate 1. After the cutting is completed, the corresponding side edge of the display substrate 1 is exposed.
Referring to fig. 6d, a photosensitive cell 33 'is coated on at least one side edge of the adhesive layer 3, and then the photosensitive cell 33' is irradiated with light so that the adhesive property of the photosensitive cell 33 is reduced.
In other embodiments, referring to fig. 7, forming adhesive layer 3 over display substrate 1 includes the following steps.
Specifically, referring to fig. 8a and 8b, the adhesive layer 3 and the protective film 4 are bonded together, and then the adhesive layer 3 is pressed toward the surface to be encapsulated (the surface on which the light emitting device 12 is formed) of the display substrate 1. The edge area of the adhesive layer 3 is formed by the light-sensitive cells 33'.
In a subsequent step, referring to fig. 8d, the light sensitive cells 33' may be illuminated (e.g. UV illumination) to reduce the viscosity of the light sensitive cells 33.
In some embodiments, the photosensitive unit 33 is formed from a photoinitiator that is independent of the glue of the adhesive layer 3. The photoinitiators are, for example: 1173 (2-hydroxy-2-methyl-1-phenylpropanone), 907 (2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone), TPO (2,4, 6-trimethylbenzoyl-diphenylphosphine oxide), TPO-L ( ethyl 2,4, 6-trimethylbenzoylphenylphosphonate), etc. For example, after the adhesive material of the adhesive layer 3 is formed, a photoinitiator is coated or sprayed on an edge area of the surface of the adhesive material of the adhesive layer 3. And then laminating the multiple layers of rubber materials or laminating the rubber materials and the protective film 4.
In other embodiments, the photoinitiator is incorporated into the glue of the adhesive layer 3. For example, after the adhesive 3 is formed, the photo initiator is penetrated into the edge area of the adhesive layer 3 by a penetration method.
Under the stimulation of specific light, the photoinitiator catalyzes the non-polyester in the adjacent glue material to be converted into polyester, so that the viscosity of the edge area of the adhesive layer 3 is reduced.
Based on the same inventive concept, embodiments of the present disclosure also provide a display device, including the aforementioned display panel.
In this disclosure, a display device is a device or a product having a display function. The display device is, for example, a display module, a display, a tablet computer, a mobile phone, an electronic billboard, etc.
The embodiments in the disclosure are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments.
The scope of the present disclosure is not limited to the above-described embodiments, and it is apparent that various modifications and variations can be made to the present disclosure by those skilled in the art without departing from the scope and spirit of the present disclosure. It is intended that the present disclosure also cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (14)
1. A display panel, comprising: the display substrate comprises a substrate and a light-emitting device arranged on the substrate, and the adhesive layer covers the light-emitting device;
wherein at least one side edge of the adhesive layer perpendicular to the surface of the display substrate has a lower adhesiveness than other portions of the adhesive layer.
2. The display panel according to claim 1, wherein the at least one side edge of the adhesive layer is provided with a photosensitive unit configured to reduce the adhesiveness of the at least one side edge of the adhesive layer under irradiation of light of a preset wavelength.
3. The display panel according to claim 2, wherein an orthographic projection of at least a portion of the photosensitive cells on the display substrate falls within the display substrate.
4. The display panel according to claim 2, wherein the size of the photosensitive unit is 5um to 20um in a direction parallel to a surface of the display substrate near the protective film.
5. The display panel according to claim 2, wherein the material of the photosensitive unit comprises a photoinitiator.
6. The display panel according to claim 5, wherein the photoinitiator is incorporated in the glue of the adhesive layer, or is independent of the glue of the adhesive layer and is located on a side of the glue of the adhesive layer.
7. The display panel of claim 1, wherein the at least one side edge of the adhesive layer is flush with the display substrate.
8. The display panel according to claim 1, wherein the adhesive layer comprises a black adhesive layer and a transparent adhesive layer stacked in a direction perpendicular to the display substrate.
9. The display panel of claim 1, wherein an orthographic projection of the photosensitive unit on the substrate base does not cover an orthographic projection of the plurality of light emitting devices on the substrate base.
10. The display panel according to claim 1, wherein the display panel further comprises a protective film disposed on a side of the adhesive layer remote from the display substrate.
11. A method for manufacturing a display panel, comprising:
providing a display substrate, wherein the display substrate comprises a substrate and a light-emitting device arranged on the substrate;
forming an adhesive layer over the display substrate, the adhesive layer covering the light emitting device;
wherein at least one side edge of the adhesive layer perpendicular to the surface of the display substrate has a lower adhesiveness than other portions of the adhesive layer.
12. A method for manufacturing a display device according to claim 11, wherein forming an adhesive layer over the display substrate comprises:
forming an adhesive layer and a protective film over the display substrate; wherein an orthographic projection of the display substrate on the protective film covers a portion of an orthographic projection of the adhesive layer on the protective film and a portion of the protective film;
cutting the adhesive layer and the protective film so that the at least one side edge of the remaining adhesive layer is positioned inside a corresponding side edge of the display substrate perpendicular to the surface of the display substrate close to the protective film;
forming a photosensitive unit at the at least one side edge of the adhesive layer; wherein the photosensitive unit is configured to reduce the viscosity of the at least one side edge of the adhesive layer under the irradiation of light with a preset wavelength.
13. A method for manufacturing a display device according to claim 11, wherein forming an adhesive layer over the display substrate comprises:
forming an adhesive layer and a protective film over the display substrate; wherein the orthographic projection of the display substrate on the protective film covers a part of the orthographic projection of the adhesive layer on the protective film and a part of the protective film, the adhesive layer is positioned on one side of the protective film facing the display substrate, at least one side edge of the adhesive layer is provided with a photosensitive unit, and the orthographic projection of at least part of the photosensitive unit on the display substrate falls within the range of the display substrate;
and cutting the adhesive layer and the protective film so that the at least one side edge of the residual adhesive layer is flush with the corresponding side edge of the display substrate, which is perpendicular to the surface of the display substrate close to the protective film.
14. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210449378.4A CN114937680A (en) | 2022-04-26 | 2022-04-26 | Display panel, preparation method and display device |
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| CN202210449378.4A CN114937680A (en) | 2022-04-26 | 2022-04-26 | Display panel, preparation method and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230165035A1 (en) * | 2019-09-02 | 2023-05-25 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing display panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230165035A1 (en) * | 2019-09-02 | 2023-05-25 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing display panel |
| US11925050B2 (en) * | 2019-09-02 | 2024-03-05 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing display panel |
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