CN219163423U

CN219163423U - Display module packaging structure

Info

Publication number: CN219163423U
Application number: CN202320050830.XU
Authority: CN
Inventors: 洪温振; 黄志强; 李超; 叶润健; 尤元; 洪小芳
Original assignee: Dongguan HCP Technology Co Ltd
Current assignee: Dongguan HCP Technology Co Ltd
Priority date: 2023-01-05
Filing date: 2023-01-05
Publication date: 2023-06-09
Anticipated expiration: 2033-01-05

Abstract

The utility model discloses a display module packaging structure which comprises a substrate, a plurality of light-emitting chips arranged on the front surface of the substrate, a film protection layer attached to and integrally coated on the front surface of the substrate and the outer surfaces of the light-emitting chips, and a protection membrane adhered to the outer surface of the film protection layer through an adhesive layer, wherein the bottom surface of the protection membrane is the adhesive layer, the thickness of the adhesive layer is larger than the height of the light-emitting chips, the adhesive layer contacts the film protection layer and covers the front surface of the substrate and the outer surfaces of the light-emitting chips, part of the adhesive layer is filled in a gap between the adjacent light-emitting chips, and the top surface of the protection membrane is a plane. Compared with the prior art, the display module is convenient to repair and low in repair cost.

Description

Display module packaging structure

Technical Field

The present disclosure relates to display modules, and particularly to packaging of display modules.

Background

Mini/Micro LED display is a novel small-space high-definition display technology which is currently and mainly popularized, and is particularly widely applied to indoor large-screen high-definition display, such as application scenes of command centers, conference centers, security monitoring, household large-screen televisions and the like. The Mini/Micro LED display screen is formed by splicing a plurality of Mini/Micro LED display modules.

The Mini/Micro LED display module performs display control by fixing RGB Mini/Micro LED chips (hereinafter referred to as LED chips) to one surface of a circuit substrate and by driving ICs on the other surface. After the LED chip is fixed, an encapsulation layer is generally required to be formed on the surface of the LED chip, the encapsulation layer can prevent the LED chip from being directly impacted by external force, and the LED chip is prevented from being damaged due to short circuit caused by contact of water and oxygen, so that the protection effect is achieved. The packaging layer is mainly formed by adding packaging materials mainly made of epoxy resin on the surface of the LED chip array, and the packaging material is formed into a shape with a flat surface in a film pressing mode. The packaging protection mode has the defects that the packaging layer is of an integrated structure, when the LED chip breaks down, a notch is needed to be broken on the packaging layer for digging glue and replacing the failed LED chip, then packaging materials are added and flattened, the repairing is difficult, and the maintenance cost is high.

Therefore, there is an urgent need for a display module that can solve the above problems.

Disclosure of Invention

The utility model aims to provide a display module packaging structure which is convenient to repair and low in repair cost.

In order to achieve the above purpose, the utility model discloses a display module packaging structure, which comprises a substrate, a plurality of light-emitting chips arranged on the front surface of the substrate, a film protection layer adhered to and integrally coated on the front surface of the substrate and the outer surfaces of the light-emitting chips, and a protection membrane adhered to the film protection layer through an adhesive layer, wherein the bottom surface of the protection membrane is the adhesive layer, the thickness of the adhesive layer is larger than the height of the light-emitting chips, the adhesive layer contacts the film protection layer and covers the front surface of the substrate and the outer surfaces of the light-emitting chips, part of the adhesive layer is filled in a gap between the adjacent light-emitting chips, and the top surface of the protection membrane is a plane.

Preferably, the film protection layer is a resin film layer or a polyurethane film layer.

Specifically, the film protective layer is an epoxy resin layer, a silicone resin layer, an acrylic resin layer or a polyurethane layer.

Preferably, the thickness of the thin film protective layer is in the range of 15-40 μm, preferably 20 μm.

Preferably, the adhesive layer is a pressure sensitive adhesive layer.

Preferably, the adhesive layer is a soft rubber curing layer.

Specifically, the adhesive layer is OCA (Optically Clear Adhesive) cured adhesive layer. Of course, the adhesive layer may be formed by curing other soft adhesives.

Preferably, the thickness of the adhesive layer is 100 μm or more. The thickness of the adhesive layer is 150 μm, and of course, the thickness may be appropriately reduced or increased depending on the size of the light emitting chip.

Preferably, the protective film comprises a transparent layer formed on the adhesive layer and an ink layer formed on the transparent layer; alternatively, the protective film includes a carbon black layer on the adhesive layer and a transparent layer formed on the carbon black layer.

Specifically, the transparent layer is a PET layer.

Specifically, the protective film further includes an AG, AR, or AF layer on the top layer.

Preferably, the substrate includes a PCB substrate or a glass substrate.

The film protective layer is sprayed and formed, and the thickness is 15-40 mu m, preferably 20 mu m.

Compared with the prior art, in the display module, the thin film protection layer is directly arranged on the substrate on which the light-emitting chip is mounted to protect the LED chip, the protective film is adhered, the display module is packaged through the protective film, the adhesive layer at the bottom of the protective film is used for filling gaps between the light-emitting chips, packaging glue is not needed, packaging is convenient, production efficiency is high, when the display module is repaired, the packaging layer is not needed to be broken, only the protective film is needed to be torn off, the packaging layer is not needed to be filled during repair, and the surface of the repaired display module is still a uniform thin film protection layer, and the ink color is consistent. In addition, the front surfaces of the light-emitting chip and the substrate are fully covered with the film protection layer, so that a layer of protection layer is formed on the surface of the light-emitting chip, the sealing performance and the heat conduction performance are strong, the light-emitting chip can be prevented from being directly contacted with water and oxygen in the air, the sealing performance and the heat conduction performance of the display module can be enhanced, the LED chip can be effectively protected when the protective film is torn off, and other light-emitting chips are prevented from being influenced.

Drawings

Fig. 1 is a block diagram of a display module according to a first embodiment of the present utility model.

Fig. 2 is a block diagram of a display module according to a second embodiment of the present utility model.

Fig. 3 is a block diagram of a display module according to a third embodiment of the present utility model.

Detailed Description

In order to describe the technical content, the constructional features, the achieved objects and effects of the present utility model in detail, the following description is made in connection with the embodiments and the accompanying drawings.

Referring to fig. 1, in a first embodiment of the present utility model, a display module 100 is disclosed, including a substrate 11, a plurality of light emitting chips 12 mounted on the front surface of the substrate 11, a film protection layer 13 'attached to and wrapping the front surface of the substrate 11 and the outer surfaces of the light emitting chips 12, and a protective film 20 adhered to the outer surface of the film protection layer 13' through an adhesive layer 21', wherein the bottom surface of the protective film 20 is the adhesive layer 21', the thickness of the adhesive layer 21 'is greater than the height of the light emitting chips 12, the adhesive layer 21' contacts the film protection layer 13 'and covers the front surface of the substrate 11 and the outer surfaces of the light emitting chips 12, a part of the adhesive layer 21' is filled in a gap between adjacent light emitting chips 12, and the top surface of the protective film 20 is a plane. In this embodiment, the light emitting chip 12 is fixed on the front surface pad by reflow soldering or laser soldering. The substrate 11 may be a PCB substrate, a glass substrate, or the like.

In this embodiment, the film protection layer 13' is a resin film layer or a polyurethane film layer. Specifically, the film protective layer 13' is an epoxy resin layer, a silicone resin layer, an acrylic resin layer, or a polyurethane layer. The film protective layer 13' may also be made of a mixture of a resin film and polyurethane, and its manufacturing material may include one or more of an epoxy resin layer, a silicone resin layer, an acrylic resin layer, and a polyurethane layer. The thin film protective layer 13' covers the upper and side surfaces of the light emitting chips 12 and the front surface of the substrate 11 (the position between adjacent light emitting chips 12) from the front surface of the substrate 11. Preferably, the thin film protection layer 13 'is further uniformly mixed with silicon dioxide material, the thin film protection layer 13' is formed by spraying thin film protection material, and the spraying effect is more uniform due to the silicon dioxide mixture. The thin film protective layer 13 'is attached to the front surface of the substrate 11 and the outer surface of the light emitting chip 12 after being spray-cured in this embodiment, so the thin film protective layer 13' integrally covers the front surface of the substrate 11 and the outer surface of the light emitting chip. The film protection layer 13 'has the function of forming a layer of protection layer on the surface of the light-emitting chip 12, and the cured film protection layer 13' has strong sealing property and heat conduction property, so that the light-emitting chip 12 can be prevented from being directly contacted with water and oxygen in the air; if the display module needs to be reworked, when the protective film 20 is torn off, the film protective layer 13' can protect the light-emitting chip 12 to avoid damage or even direct falling off along with the tearing of the protective film 20, and then the damaged light-emitting chip 12 is reworked, and a new protective film 20 is attached again after the repair.

In this embodiment, the thickness of the thin film protection layer 13 'is 15-40 μm, preferably 20 μm, wherein the thin film protection layer 13' is formed by spraying the corresponding thin film protection material, preferably 15-40 μm, and preferably 20 μm.

In this embodiment, the adhesive layer 21' is a pressure sensitive adhesive layer, but may be other curable and elastic adhesive. Specifically, the adhesive layer 21 'is an OCA cured adhesive layer, and is formed by curing OCA soft adhesive, the bottom layer of the unused protective film 20 is a soft adhesive layer, when the protective film 20 is adhered to the film protective layer 13' on the front surface of the substrate 11, the adhesive of the soft adhesive layer will elastically fill into the gap between the adjacent light emitting chips 12 and contact with the film protective layer 13 'in the gap, and after the adhesive is adhered, the adhesive of the soft adhesive layer is cured into an adhesive layer 21', after the curing, part of the area of the adhesive layer 21 'is filled into the gap between the adjacent light emitting chips 12 to fill the gap, and other protective parts on the adhesive layer 21' of the protective film 20 are supported on the substrate 11, so that the top surface of the protective film 20 is a plane.

Wherein the thickness of the adhesive layer 21' is 100 μm or more. The thickness of the adhesive layer 21' is 150 μm, and of course, the thickness may be appropriately reduced or increased depending on the size of the light emitting chip 12.

Preferably, the adhesive layer 21' is mixed with a diffusion powder material for converting the spot-like light spot of the light emitting chip into a planar light spot. Wherein the diffusion powder material is a silicon dioxide material.

Referring to fig. 1, in the present embodiment, the protective film 20 further includes a transparent layer formed on the adhesive layer 21', and an ink layer formed on the transparent layer. The transparent layer is a PET layer.

Referring to fig. 2, in the second embodiment of the present utility model, the protective film 20 further includes a functional layer 26 formed on the ink layer 23. The functional layer 26 is an AG layer, an AR layer, an AF layer, or the like. Wherein the AR (Anti-Reflection) layer is an Anti-Reflection film layer or glass, the AG (Anti-Glare) layer is an Anti-Glare film layer or glass, and the AF (Anti-Fingerprint) layer is an Anti-Fingerprint film layer or glass. The functional layer 26 further ensures that the top of the protective film 20 remains planar after the protective film is attached to the substrate 11 to compensate for the gap between the light emitting chips 12.

Referring to fig. 3, in a third embodiment of the present utility model, the protective film 20 includes a carbon black layer 24 formed on the adhesive layer 21', and a PET transparent layer 25 formed on the carbon black layer 24. Of course, other ink materials may be used to make the ink instead of the carbon black layer 24, and are not limited to carbon black materials. Of course, other transparent insulating materials may be used to make the transparent layer instead of the PET transparent layer 25, not limited to PET materials.

Preferably, the protective film 20 further includes a functional layer 26 formed on the PET transparent layer 25. The functional layer 26 is an AG layer, an AR layer, an AF layer, or the like.

The foregoing description of the preferred embodiments of the present utility model is not intended to limit the scope of the claims, which follow, as defined in the claims.

Claims

1. A display module assembly packaging structure is characterized in that: the light-emitting diode display device comprises a substrate, a plurality of light-emitting chips arranged on the front surface of the substrate, a film protection layer attached to and integrally coated on the front surface of the substrate and the outer surfaces of the light-emitting chips, and a protection membrane adhered to the outer surface of the film protection layer through an adhesive layer, wherein the bottom surface of the protection membrane is the adhesive layer, the thickness of the adhesive layer is larger than the height of the light-emitting chips, the adhesive layer contacts the film protection layer and covers the front surface of the substrate and the outer surfaces of the light-emitting chips, part of the adhesive layer is filled in a gap between the adjacent light-emitting chips, and the top surface of the protection membrane is a plane.

2. The display module assembly package structure of claim 1, wherein: the film protective layer is a resin film layer or a polyurethane film layer.

3. The display module assembly package structure of claim 1, wherein: the thickness of the film protective layer ranges from 15 mu m to 40 mu m.

4. The display module assembly package structure of claim 1, wherein: the adhesive layer is a pressure-sensitive adhesive layer.

5. The display module assembly package structure of claim 1, wherein: the adhesive layer is a soft rubber curing layer.

6. The display module assembly package of claim 4 or 5, wherein: the adhesive layer is an OCA curing adhesive layer.

7. The display module assembly package structure of claim 1, wherein: the thickness of the adhesive layer is 100 μm or more.

8. The display module assembly package structure of claim 1, wherein: the protective film also comprises a transparent layer formed on the adhesive layer and an ink layer formed on the transparent layer; alternatively, the protective film further includes a carbon black layer on the adhesive layer and a transparent layer formed on the carbon black layer.

9. The display module assembly package structure of claim 8, wherein: the transparent layer is a PET layer.

10. The display module assembly package structure of claim 1, wherein: the protective film also includes an AG, AR, or AF layer on top of the layer.