CN112885818A - Novel Mini LED packaging process - Google Patents
Novel Mini LED packaging process Download PDFInfo
- Publication number
- CN112885818A CN112885818A CN202110035124.3A CN202110035124A CN112885818A CN 112885818 A CN112885818 A CN 112885818A CN 202110035124 A CN202110035124 A CN 202110035124A CN 112885818 A CN112885818 A CN 112885818A
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- China
- Prior art keywords
- light
- adhesive product
- packaging process
- carrier plate
- transmittance
- Prior art date
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- 238000012858 packaging process Methods 0.000 title claims abstract description 23
- 238000002834 transmittance Methods 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 claims abstract description 41
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000001723 curing Methods 0.000 claims abstract description 6
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000012788 optical film Substances 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 4
- 239000002313 adhesive film Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000005282 brightening Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000005507 spraying Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a novel Mini LED packaging process, which comprises the following steps: after the Mini substrate is pasted with the wafer, a carrier plate is formed, and a high-light-transmittance adhesive product is cut to the size of the corresponding Mini substrate and comprises a surface B and a surface A provided with a first protective film; after tearing off the first protective film on the surface A of the high-light-transmittance adhesive product, attaching the surface A of the high-light-transmittance adhesive product to the front surface of the support plate; carrying out vacuum defoaming on the attached carrier plate to extract the attached rubber surface and the bubbles in the carrier plate; and carrying out UV curing on the carrier plate to enable the bonded rubber surface to be combined with the carrier plate in a curing manner. According to the invention, after the high-transmittance adhesive product is attached to the carrier plate, vacuum defoaming and UV curing are carried out, so that the production time of the whole Mini lamp panel is reduced, the problem of low yield caused by complex process is solved, the problem of high waste cost of the adhesive in the packaging process is solved, the mold opening is not needed, and the surface thickness consistency can be within 0.01 mm.
Description
Technical Field
The invention relates to a packaging process, in particular to a novel packaging process for a Mini LED.
Background
The existing Mini LED packaging process comprises die pressing and glue spraying, wherein the die pressing process is die pressing on a Mini LED substrate, the dead lamp rate of the formed plate is high due to the fact that the substrate is heated and has larger thermal expansion, the consistency of the glue added in batches is poor due to proportioning, the plate is deformed due to thermosetting after packaging, the cost of a die is high, the thickness tolerance of a finished product is large after the mechanical die is pressed, and the packaging process is complex. The glue spraying process is that glue is proportioned and then is filled into a needle tube of a glue spraying machine, the glue is sprayed onto the Mini LED substrate by a high-speed injection valve and then is baked at high temperature, the glue spraying uniformity of a glue surface is low in the manufacturing process, the glue surface can flow in the glue curing process, and glue stem protrusion is caused by the glue pulling phenomenon on the periphery.
Disclosure of Invention
In order to solve the above problems, the present invention provides a novel Mini LED packaging process, which is implemented by the following technical scheme:
a novel packaging process of a Mini LED comprises the following steps:
step 1): after a wafer is well mounted on a Mini substrate, a carrier plate is formed, and a high-light-transmittance adhesive product is cut to the size of the corresponding Mini substrate and comprises a surface B and a surface A provided with a first protective film;
step 2): after the first protective film on the surface A of the high-light-transmittance adhesive product is torn off, the surface A of the high-light-transmittance adhesive product is attached to the front surface of the support plate;
step 3): performing vacuum defoaming on the attached carrier plate to extract the attached glue surface and the bubbles in the carrier plate;
step 4): and carrying out UV curing on the carrier plate to enable the bonded rubber surface to be combined with the carrier plate in a curing manner.
Furthermore, an optical PET film is arranged on the surface B of the high-light-transmittance adhesive product.
Further, a second protective film is arranged on the surface B of the high-light-transmittance adhesive product, after the step 2) is implemented and before the step 3) is performed, the second protective film on the surface B of the high-light-transmittance adhesive product is torn off, and an optical film brightness enhancement film is attached to the surface B of the high-light-transmittance adhesive product.
Furthermore, the high-light-transmittance adhesive product is an OCA adhesive film or an adhesive tape.
Furthermore, the Mini substrate is FPC, BT, FR-4, glass or aluminum plate.
Further, after the step 1) is carried out, furnace treatment is carried out before the step 2).
Further, the up-down and left-right fitting precision of the surface A of the high-transmittance adhesive product and the front surface of the carrier plate in the step 2) is 0.8 +/-0.2 mm, and the 30pcs CPK is more than or equal to 1.33.
Further, the temperature of vacuum defoaming in the step 3) is 35 +/-15 ℃, the pressure is 5 +/-2 Kg, and the time is 20 +/-2 min.
Further, the energy required for curing in step 4): 3350 and 3850 mj/cm, the temperature in the aging furnace is less than or equal to 60 degrees, and the service life of the lamp tube is less than or equal to 10000H.
Furthermore, the upper, lower, left and right gluing precision of the optical film brightness enhancement film and the surface B of the high-transmittance glue product is 0.4 +/-0.2 mm, and the 30pcs CPK is more than or equal to 1.33.
The invention has the beneficial effects that:
according to the invention, after the high-transmittance adhesive product is attached to the carrier plate, vacuum defoaming and UV curing are carried out, so that the production time of the whole Mini lamp panel is reduced, the problem of low yield caused by complex process is solved, the problem of high waste cost of the adhesive in the packaging process is solved, the mold opening is not needed, and the surface thickness consistency can be within 0.005 mm.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of a carrier according to the present invention;
FIG. 2 is a schematic structural diagram of a high transmittance adhesive product of the present invention provided with a first protective film and an optical PET film;
fig. 3 is a schematic structural diagram of the high transmittance adhesive product of the present invention, which is provided with a first protective film and a second protective film.
The reference numbers in the figures illustrate:
1. mini base plate, 2, wafer, 3, high light transmittance glue product, 4, first protection film, 5, second protection film, 6, optical PET membrane.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example 1
Referring to fig. 1 and 2, a novel Mini LED packaging process includes the following steps:
step 1): after the Mini substrate 1 is pasted with the wafer 2, a carrier plate is formed, the high-light-transmittance adhesive product 3 is cut to the size of the corresponding Mini substrate 1, the high-light-transmittance adhesive product 3 cannot overload the appearance of the plate, and the high-light-transmittance adhesive product 3 comprises a surface B provided with an optical PET film 6 and a surface A provided with a first protection film 4;
step 2): after the first protective film 4 on the surface A of the high-light-transmittance adhesive product 3 is torn off, the surface A of the high-light-transmittance adhesive product 3 is attached to the front surface of the carrier plate, the accuracy of the upper, lower, left and right attachment is 0.8 +/-0.2 mm, the CPK (30 pcs) is not less than 1.33, and no large bubbles can be attached;
step 3): performing vacuum defoaming on the attached carrier plate to ensure that the attached glue surface and the air bubbles in the carrier plate are extracted, wherein the temperature of the vacuum defoaming is 35 +/-15 ℃, the pressure is 5 +/-2 Kg, and the time is 20 +/-2 min;
step 4): carrying out UV solidification with the support plate, the gluey face that makes the laminating combines with the support plate solidification, the energy that the solidification needs: 3350 and 3850 mj/cm, the temperature in the aging furnace is less than or equal to 60 degrees, and the service life of the lamp tube is less than or equal to 10000H.
Example 2
Referring to fig. 1 and 3, a novel Mini LED packaging process includes the following steps:
step 1): after the Mini substrate 1 is pasted with the wafer 2, a carrier plate is formed, the high-light-transmittance adhesive product 3 is cut to the size of the corresponding Mini substrate 1, the high-light-transmittance adhesive product 3 cannot overload the appearance of the plate, and the high-light-transmittance adhesive product 3 comprises a surface B provided with a second protective film 5 and a surface A provided with a first protective film 4;
step 2): after the first protective film 4 on the surface A of the high-light-transmittance adhesive product 3 is torn off, the surface A of the high-light-transmittance adhesive product 3 is attached to the front surface of the carrier plate, the accuracy of the upper, lower, left and right attachment is 0.8 +/-0.2 mm, the CPK (30 pcs) is not less than 1.33, and no large bubbles can be attached;
tearing off the second protective film 5 on the B surface of the high-light-transmittance adhesive product 3, pasting an optical film brightness enhancement film on the B surface of the high-light-transmittance adhesive product 3, wherein the pasting precision of the upper side, the lower side, the left side and the right side is 0.4 +/-0.2 mm, 30pcs CPK is more than or equal to 1.33, and no large bubbles can be generated during pasting;
step 3): performing vacuum defoaming on the attached carrier plate to ensure that the attached glue surface and the air bubbles in the carrier plate are extracted, wherein the temperature of the vacuum defoaming is 35 +/-15 ℃, the pressure is 5 +/-2 Kg, and the time is 20 +/-2 min;
step 4): carrying out UV solidification with the support plate, the gluey face that makes the laminating combines with the support plate solidification, the energy that the solidification needs: 3350 and 3850 mj/cm, the temperature in the aging furnace is less than or equal to 60 degrees, and the service life of the lamp tube is less than or equal to 10000H.
Further, the high-transmittance adhesive product 3 is an OCA adhesive film or tape.
Furthermore, the Mini substrate 1 is FPC, BT, FR-4, glass or aluminum plate.
Further, after the step 1) is carried out, the carrier plate is subjected to furnace treatment before the step 2).
The above is only a preferred embodiment of the invention and is not intended to limit the invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A novel Mini LED packaging process is characterized by comprising the following steps:
step 1): a carrier plate is formed after a chip (2) is mounted on a Mini substrate (1), a high-light-transmittance adhesive product (3) is cut to the size of the corresponding Mini substrate (1), and the high-light-transmittance adhesive product (3) comprises a surface B and a surface A provided with a first protective film (4);
step 2): after the first protective film (4) on the surface A of the high-light-transmittance adhesive product (3) is torn off, the surface A of the high-light-transmittance adhesive product (3) is attached to the front surface of the support plate;
step 3): performing vacuum defoaming on the attached carrier plate to extract the attached glue surface and the bubbles in the carrier plate;
step 4): and carrying out UV curing on the carrier plate to enable the bonded rubber surface to be combined with the carrier plate in a curing manner.
2. The novel Mini LED packaging process of claim 1, wherein: and an optical PET film (6) is arranged on the surface B of the high-light-transmittance adhesive product (3).
3. The novel Mini LED packaging process of claim 1, wherein: the surface B of the high-light-transmittance adhesive product (3) is provided with a second protective film (5), after the step 2) is implemented and before the step 3) is carried out, the surface B of the high-light-transmittance adhesive product (3) is torn off, and an optical film brightening film is attached to the surface B of the high-light-transmittance adhesive product (3).
4. The novel Mini LED packaging process of claim 2 or 3, wherein: the high-light-transmittance adhesive product (3) is an OCA adhesive film or an adhesive tape.
5. The novel Mini LED packaging process of claim 4, wherein: the Mini substrate (1) is FPC, BT, FR-4, glass or aluminum plate.
6. The novel Mini LED packaging process of claim 5, wherein: after the step 1) is carried out, furnace treatment is carried out before the step 2).
7. The novel Mini LED packaging process of claim 6, wherein: in the step 2), the up-down and left-right fitting precision of the surface A of the high-light-transmittance adhesive product (3) and the front surface of the carrier plate is 0.8 +/-0.2 mm, and the 30pcs CPK is more than or equal to 1.33.
8. The novel Mini LED packaging process of claim 7, wherein: the temperature of vacuum defoaming in the step 3) is 35 +/-15 ℃, the pressure is 5 +/-2 Kg, and the time is 20 +/-2 min.
9. The novel Mini LED packaging process of claim 8, wherein: energy required for curing in step 4): 3350 and 3850 mj/cm, the temperature in the aging furnace is less than or equal to 60 degrees, and the service life of the lamp tube is less than or equal to 10000H.
10. The novel Mini LED packaging process of claim 3, wherein: the upper, lower, left and right gluing precision of the optical film brightness enhancement film and the surface B of the high-transmittance glue product (3) is 0.4 +/-0.2 mm, and 30pcs CPK is more than or equal to 1.33.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110035124.3A CN112885818A (en) | 2021-01-12 | 2021-01-12 | Novel Mini LED packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110035124.3A CN112885818A (en) | 2021-01-12 | 2021-01-12 | Novel Mini LED packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112885818A true CN112885818A (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110035124.3A Pending CN112885818A (en) | 2021-01-12 | 2021-01-12 | Novel Mini LED packaging process |
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| Country | Link |
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| CN (1) | CN112885818A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113916343A (en) * | 2021-09-15 | 2022-01-11 | 惠州市开蒙医疗科技有限公司 | Method for connecting transparent glass scale surface and metal decorative sheet for electronic scale and electronic scale |
-
2021
- 2021-01-12 CN CN202110035124.3A patent/CN112885818A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113916343A (en) * | 2021-09-15 | 2022-01-11 | 惠州市开蒙医疗科技有限公司 | Method for connecting transparent glass scale surface and metal decorative sheet for electronic scale and electronic scale |
| CN113916343B (en) * | 2021-09-15 | 2023-12-22 | 惠州市开蒙医疗科技有限公司 | Method for connecting transparent glass scale surface and metal decorative sheet for electronic scale and electronic scale |
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