CN111105723A - Manufacturing method of special-shaped transparent display screen - Google Patents

Abstract

The invention belongs to the technical field of display screen processing, and particularly relates to a method for manufacturing a special-shaped transparent display screen, the parallelogram must be supplemented into rectangle for processing, the supplementing direction is selected to avoid bad connection caused by the same line being divided into different laser heads for processing, when the parallelogram is supplemented, the direction is noticed, when a patch diagram is designed, an etching diagram is used as a reference for designing, laminating and cutting are carried out, the supplemented rectangle is required to be cut under the limitation of the working principle of a bonding machine (only the range of 3-5mm of the glass edge can be processed, the advancing direction is a straight line), the FPCB edge is made into a glass edge for processing, in order to protect the pasted LED CHIP from being damaged, an adhesive tape and a film are adopted to cover the part above the FPCB line for cutting and breaking off the CHIP, the subsequent processing is carried out until the binding is finished, and the differentiated production of the parallelogram and the standard product is completely finished.

Description

Manufacturing method of special-shaped transparent display screen

Technical Field

The invention belongs to the technical field of display screen processing, and particularly relates to a manufacturing method of a special-shaped transparent display screen.

Background

Today, the requirement on media hardware is higher and higher, the traditional LED screen cannot meet the diversified requirements of the market on beauty, transparency, intelligence and the like, and thus various transparent screens come along. Like lamp area grid product, utilize the size that reduces the lamp pearl, suitably increase the distance between the lamp pearl and form the space to form transparent sense in the vision. However, the product can not be directly applied to the outer wall of a building because the lamp beads are exposed outside, and has great disadvantages in the aspects of convenience and rapidness in construction, attractiveness and durability.

In order to solve the technical problems, the company develops the transparent LED photoelectric glass which is made by taking the transparent ITO conductive glass as a carrier, the construction method of the transparent LED photoelectric glass is consistent with that of the traditional curtain wall method, two functions of a facade and media hardware can be realized by sequential construction, and the building has strong integral sense and strong durability.

However, due to the limitation of the traditional processing equipment and the factor of the ITO conductive film conducting principle, only rectangular glass can be manufactured according to the traditional manufacturing process, and the requirements of various building facades such as triangles, parallelograms and the like in the current market cannot be met.

Disclosure of Invention

The invention provides a method for manufacturing a special-shaped transparent display screen, which aims to solve the problem that the special-shaped transparent display screen cannot be manufactured by the traditional manufacturing process proposed in the background technology.

The technical problem solved by the invention is realized by adopting the following technical scheme:

a manufacturing method of a special-shaped transparent display screen comprises the following steps:

firstly, cutting design and etching design of ITO glass and COVER glass;

during cutting design, the principle of minimizing the residual amount is taken into consideration, the size of glass is taken into consideration, the optimal etching design is carried out while the resistivity is taken into consideration on the premise of providing uniform voltage for an LED chip, the size of the glass left after cutting is taken into consideration as much as possible when a glass cutting mode is designed, and the glass is convenient to reuse, and the cutting design is 1mm larger than the original design size in the vertical and horizontal directions due to the fact that 1mm of the edge needs to be consumed during cutting;

during etching design, designing the etching design according to the light modulator and the respective control mode;

when designing the parallelogram, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, firstly, the processed glass is positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, then, an optical camera is used for taking a picture for fine positioning, therefore, the parallelogram must be supplemented into a rectangle for processing, the supplementing direction is selected, in order to avoid bad connection caused by the fact that the same line is divided into different laser heads for processing, the direction is required to be noticed when supplementing the parallelogram, and when designing a chip mounting diagram, the etching diagram is used as a reference for designing;

when designing a triangle, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, the processed glass is firstly positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, and then an optical camera is used for taking a picture for fine positioning, so that the triangle is required to be supplemented into a rectangle for processing; selecting a filling direction, wherein the direction should be noticed when the triangle is filled, the non-FPCB side should be the Y-axis direction during filling, the LED CHIP direction should be parallel to and perpendicular to the four sides of the filled rectangle, designing a patch drawing, and designing by taking an etching drawing as a reference;

the trapezoid processing mode is actually an integrated reference of the processing methods of the parallelogram and the triangle;

secondly, cutting, edging and polishing the ITO glass and the COVER glass, cutting the supplemented rectangles designed in the step, and cutting the rectangles;

thirdly, cleaning and drying the ITO glass and the COVER glass, cleaning the attachments on the surface of the glass by using cleaning liquid, and simultaneously drying for about 4 minutes at 42 ℃;

detecting the ITO glass and the COVER glass to detect whether bubbles, foreign matters, scratches and cracks exist or not, and directly visually inspecting by using a fluorescent lamp, a mirror and a convex mirror/magnifier for defect-free inspection by inspectors;

fifthly, etching the ITO glass by using laser, sending the prepared glass to an etching machine, adjusting X, Y, Z axes, finding an original point which is easiest to start, and then etching, wherein the same etching work can be carried out twice in order to prevent etching errors;

sixthly, throwing epoxy resin and silver colloid to the ITO glass, pasting, placing the etched ITO glass on a pasting machine, adjusting the X, Y and Z positions, operating in cooperation with the position of an etching loop, after confirming an operation starting point, starting to place a chip on the actual position of the etching loop, using epoxy resin without conductivity for bonding the LED chip, using silver colloid with conductivity for electrifying the LED chip, pasting the chip at the position where the epoxy resin and the silver colloid are put, and respectively arranging electrodes for providing a positive power supply for the LED in the process of pasting the LED;

seventhly, after the chip is pasted, the ITO glass is cut for the second time, the ITO glass is cut into a required special-shaped shape according to the initial design, the second time is cut into a film covering and cutting, namely, a waterproof adhesive tape and a film are adopted to cover the FPCB circuit, and the purpose of protecting the LED chip from being damaged is achieved;

eighthly, performing thermal curing, namely improving the viscosity generated in the process of mounting the sheet by using the ITO glass subjected to the sheet mounting through a thermal curing project, wherein the thermal curing temperature is 92 ℃;

ninth, electrode adhesion detection is carried out, the ITO glass after being pasted with the sheet is checked by using a mirror and an electric lamp, and firstly, whether the electrodes of the LED Chip are normally connected and whether the adhesive points of the epoxy resin and the silver adhesive are normally adhered are carried out;

the tenth step, the installation of FPCB silver paper tinsel, FPCB and PCB DRIVER are connected the back and are carried out the detection, will be connected through the ITO glass of thermosetting and FPCB: cleaning the contact surface of the FPCB and the ITO glass, tearing off a paper adhesive tape on the wide surface of the FPCB, bonding the FPCB with the glass from head to tail on the surface of the FPCB adhered with a conductive adhesive to form an adhesive number, carefully pressing the FPCB flat and tightly by hands, connecting the FPCB with the ITO glass, connecting the FPCB with a drive to provide a power supply for the LED, confirming the work of the next process, detecting whether each point is normal after the LED is powered on, observing whether the LED is simultaneously bright after the LED is powered on, observing whether the brightness of the LED is consistent after the LED is powered on, and adhering a silver foil adhesive tape on the upper section of the contact surface of the ITO glass and the FPCB after the LED is powered on;

the eleventh step, after electricity work, carry out once ageing, whether the process of lighting on and turning off the light is carried out according to the flashing light procedure of input to the detection product after supplying power for the product, when once ageing, the main items that need confirm: the lamp is turned on and off, whether the brightness is uniform when the lamp is turned on or not, whether the lamp is turned on and off and whether the lamp is turned on for a long time are carried out according to the program sequence or not, and the aging time is 8-12 hours;

step ten, after the double-sided adhesive tape, the dust removal, the adhesive pad and the common glass are laminated, detecting the state of foreign matters and the laminated sheet, under the condition of no abnormality, after the power supply is cut off, sticking the double-sided adhesive tape according to the upper, lower, left and right (four-side) edges, at the moment, the whole double sides are not completely connected, providing convenience for the next glue injection process, sticking a plastic film at the set position, pressing the upper and lower surfaces of the double-sided adhesive tape by using an operating tool at the position where a double-sided adhesive tape protective layer is removed, electrifying the product again after the process is finished, confirming whether a luminous point normally emits light again, and when the luminous point is detected, shaking the stuck FPCB to detect whether the light spot of the LED is normal;

step thirteen, injecting glue, performing UV curing, injecting glue into the assembly glass bonded by the Cover glass and the ITO glass, lifting the operating platform to ensure that the glass integrally forms an inclined angle, wherein the operating angle is 15-30 degrees, and during glue injection, after the size of the assembly glass is input into a glue injection machine, inserting a double-sided adhesive part without edge sealing on the upper section of the glue injection machine into a rubber tube for glue injection;

fourteenth, detecting bubble foreign matters, brightness and size of luminous points after the PCB DRIVER, the electrical appliance and the communication accessories are installed;

fifthly, assembling the Frame, and carrying out a second aging test, namely inputting a program to detect whether the LED normally emits light for 2-3 days when the product is electrified;

sixthly, finally checking the flash, brightness, image playing, size and Frame appearance.

The PCB DRIVER is a connecting device which is connected with the FPCB and respectively controls different LED chips when supplying power to the LEDs attached to the ITO glass.

The invention has the beneficial effects that:

the technical scheme can realize the manufacture of the transparent display screen with other irregular planes except the circular plane, breaks through the processing principle limitation of an etching machine and a CHIP mounter of core equipment, forms the design and the manufacture method of the glass with other irregular shapes except the circular plane, firstly carries out primary positioning (intelligent positioning rectangle) on the processed glass through a physical positioning rod during the design, then carries out fine positioning by using an optical camera to shoot, when laminating and cutting, is limited by the working principle of a binding machine (only the range of 3-5mm of the edge of the glass can be processed, and the advancing direction is a straight line), the supplemented rectangle is cut, the edge of the FPCB is made into a glass edge for processing, in order to protect the pasted LED CHIP from being damaged, the waterproof adhesive tape and a film are adopted to cover the part above the FPCB circuit and then carry out secondary cutting, and the glass is cut into the required special-shaped shape, then the sheet is broken off and processed subsequently until the binding is finished, and the whole manufacturing process is reasonable in design, safe and reliable and has ideal implementation effect.

Drawings

FIG. 1 is a schematic representation of a parallelogram design of the present invention;

FIG. 2 is a schematic diagram of the triangular design of the present invention;

Detailed Description

A manufacturing method of a special-shaped transparent display screen comprises the following steps:

firstly, cutting design and etching design of ITO glass and COVER glass;

during cutting design, the principle of minimizing the residual amount is taken into consideration, the size of glass is taken into consideration, the optimal etching design is carried out while the resistivity is taken into consideration on the premise of providing uniform voltage for an LED chip, the size of the glass left after cutting is taken into consideration as much as possible when a glass cutting mode is designed, and the glass is convenient to reuse, and the cutting design is 1mm larger than the original design size in the vertical and horizontal directions due to the fact that 1mm of the edge needs to be consumed during cutting;

during etching design, designing the etching design according to the light modulator and the respective control mode;

when designing the parallelogram, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, firstly, the processed glass is positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, then, an optical camera is used for taking a picture for fine positioning, therefore, the parallelogram must be supplemented into a rectangle for processing, the supplementing direction is selected, in order to avoid bad connection caused by the fact that the same line is divided into different laser heads for processing, the direction is required to be noticed when supplementing the parallelogram, and when designing a chip mounting diagram, the etching diagram is used as a reference for designing;

when designing a triangle, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, the processed glass is firstly positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, and then an optical camera is used for taking a picture for fine positioning, so that the triangle is required to be supplemented into a rectangle for processing; selecting a filling direction, wherein the direction should be noticed when the triangle is filled, the non-FPCB side should be the Y-axis direction during filling, the LED CHIP direction should be parallel to and perpendicular to the four sides of the filled rectangle, designing a patch drawing, and designing by taking an etching drawing as a reference;

the trapezoid processing mode is actually an integrated reference of the processing methods of the parallelogram and the triangle;

secondly, cutting, edging and polishing the ITO glass and the COVER glass, cutting the supplemented rectangles designed in the step, and cutting the rectangles;

thirdly, cleaning and drying the ITO glass and the COVER glass, cleaning the attachments on the surface of the glass by using cleaning liquid, and simultaneously drying for about 4 minutes at 42 ℃;

detecting the ITO glass and the COVER glass to detect whether bubbles, foreign matters, scratches and cracks exist or not, and directly visually inspecting by using a fluorescent lamp, a mirror and a convex mirror/magnifier for defect-free inspection by inspectors;

fifthly, etching the ITO glass by using laser, sending the prepared glass to an etching machine, adjusting X, Y, Z axes, finding an original point which is easiest to start, and then etching, wherein the same etching work can be carried out twice in order to prevent etching errors;

sixthly, throwing epoxy resin and silver colloid to the ITO glass, pasting, placing the etched ITO glass on a pasting machine, adjusting the X, Y and Z positions, operating in cooperation with the position of an etching loop, after confirming an operation starting point, starting to place a chip on the actual position of the etching loop, using epoxy resin without conductivity for bonding the LED chip, using silver colloid with conductivity for electrifying the LED chip, pasting the chip at the position where the epoxy resin and the silver colloid are put, and respectively arranging electrodes for providing a positive power supply for the LED in the process of pasting the LED;

seventhly, after the chip is pasted, the ITO glass is cut for the second time, the ITO glass is cut into a required special-shaped shape according to the initial design, the second time is cut into a film covering and cutting, namely, a waterproof adhesive tape and a film are adopted to cover the FPCB circuit, and the purpose of protecting the LED chip from being damaged is achieved;

eighthly, performing thermal curing, namely improving the viscosity generated in the process of mounting the sheet by using the ITO glass subjected to the sheet mounting through a thermal curing project, wherein the thermal curing temperature is 92 ℃;

ninth, electrode adhesion detection is carried out, the ITO glass after being pasted with the sheet is checked by using a mirror and an electric lamp, and firstly, whether the electrodes of the LED Chip are normally connected and whether the adhesive points of the epoxy resin and the silver adhesive are normally adhered are carried out;

the tenth step, the installation of FPCB silver paper tinsel, FPCB and PCB DRIVER are connected the back and are carried out the detection, will be connected through the ITO glass of thermosetting and FPCB: cleaning the contact surface of the FPCB and the ITO glass, tearing off a paper adhesive tape on the wide surface of the FPCB, bonding the FPCB with the glass from head to tail on the surface of the FPCB adhered with a conductive adhesive to form an adhesive number, carefully pressing the FPCB flat and tightly by hands, connecting the FPCB with the ITO glass, connecting the FPCB with a drive to provide a power supply for the LED, confirming the work of the next process, detecting whether each point is normal after the LED is powered on, observing whether the LED is simultaneously bright after the LED is powered on, observing whether the brightness of the LED is consistent after the LED is powered on, and adhering a silver foil adhesive tape on the upper section of the contact surface of the ITO glass and the FPCB after the LED is powered on;

the eleventh step, after electricity work, carry out once ageing, whether the process of lighting on and turning off the light is carried out according to the flashing light procedure of input to the detection product after supplying power for the product, when once ageing, the main items that need confirm: the lamp is turned on and off, whether the brightness is uniform when the lamp is turned on or not, whether the lamp is turned on and off and whether the lamp is turned on for a long time are carried out according to the program sequence or not, and the aging time is 8-12 hours;

step ten, after the double-sided adhesive tape, the dust removal, the adhesive pad and the common glass are laminated, detecting the state of foreign matters and the laminated sheet, under the condition of no abnormality, after the power supply is cut off, sticking the double-sided adhesive tape according to the upper, lower, left and right (four-side) edges, at the moment, the whole double sides are not completely connected, providing convenience for the next glue injection process, sticking a plastic film at the set position, pressing the upper and lower surfaces of the double-sided adhesive tape by using an operating tool at the position where a double-sided adhesive tape protective layer is removed, electrifying the product again after the process is finished, confirming whether a luminous point normally emits light again, and when the luminous point is detected, shaking the stuck FPCB to detect whether the light spot of the LED is normal;

step thirteen, injecting glue, performing UV curing, injecting glue into the assembly glass bonded by the Cover glass and the ITO glass, lifting the operating platform to ensure that the glass integrally forms an inclined angle, wherein the operating angle is 15-30 degrees, and during glue injection, after the size of the assembly glass is input into a glue injection machine, inserting a double-sided adhesive part without edge sealing on the upper section of the glue injection machine into a rubber tube for glue injection;

fourteenth, detecting bubble foreign matters, brightness and size of luminous points after the PCB DRIVER, the electrical appliance and the communication accessories are installed;

fifthly, assembling the Frame, and carrying out a second aging test, namely inputting a program to detect whether the LED normally emits light for 2-3 days when the product is electrified;

sixthly, finally checking the flash, brightness, image playing, size and Frame appearance.

The PCB DRIVER is a connecting device which is connected with the FPCB and respectively controls different LED chips when supplying power to the LEDs attached to the ITO glass.

Although the embodiments of the present invention have been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the invention, and all equivalent changes and modifications made within the scope of the present invention should be covered by the claims of the present invention.

Claims (2)

1. A manufacturing method of a special-shaped transparent display screen is characterized in that:

the method comprises the following steps:

firstly, cutting design and etching design of ITO glass and COVER glass;

during cutting design, the principle of minimizing the residual amount is taken into consideration, the size of glass is taken into consideration, the optimal etching design is carried out while the resistivity is taken into consideration on the premise of providing uniform voltage for an LED chip, the size of the glass left after cutting is taken into consideration as much as possible when a glass cutting mode is designed, and the glass is convenient to reuse, and the cutting design is 1mm larger than the original design size in the vertical and horizontal directions due to the fact that 1mm of the edge needs to be consumed during cutting;

during etching design, designing the etching design according to the light modulator and the respective control mode;

when designing the parallelogram, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, firstly, the processed glass is positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, then, an optical camera is used for taking a picture for fine positioning, therefore, the parallelogram must be supplemented into a rectangle for processing, the supplementing direction is selected, in order to avoid bad connection caused by the fact that the same line is divided into different laser heads for processing, the direction is required to be noticed when supplementing the parallelogram, and when designing a chip mounting diagram, the etching diagram is used as a reference for designing;

when designing a triangle, in order to ensure the processing precision (error is +/-50 mu m) of an etching machine and a chip mounter, a physical and optical double positioning mode is adopted during equipment design, the processed glass is firstly positioned once (intelligent positioning rectangle) through a physical positioning rod according to the size of CAD drawing glass, and then an optical camera is used for taking a picture for fine positioning, so that the triangle is required to be supplemented into a rectangle for processing; selecting a filling direction, wherein the direction should be noticed when the triangle is filled, the non-FPCB side should be the Y-axis direction during filling, the LED CHIP direction should be parallel to and perpendicular to the four sides of the filled rectangle, designing a patch drawing, and designing by taking an etching drawing as a reference;

the trapezoid processing mode is actually an integrated reference of the processing methods of the parallelogram and the triangle;

secondly, cutting, edging and polishing the ITO glass and the COVER glass, cutting the supplemented rectangles designed in the step, and cutting the rectangles;

thirdly, cleaning and drying the ITO glass and the COVER glass, cleaning the attachments on the surface of the glass by using cleaning liquid, and simultaneously drying for about 4 minutes at 42 ℃;

detecting the ITO glass and the COVER glass to detect whether bubbles, foreign matters, scratches and cracks exist or not, and directly visually inspecting by using a fluorescent lamp, a mirror and a convex mirror/magnifier for defect-free inspection by inspectors;

fifthly, etching the ITO glass by using laser, sending the prepared glass to an etching machine, adjusting X, Y, Z axes, finding an original point which is easiest to start, and then etching, wherein the same etching work can be carried out twice in order to prevent etching errors;

sixthly, throwing epoxy resin and silver colloid to the ITO glass, pasting, placing the etched ITO glass on a pasting machine, adjusting the X, Y and Z positions, operating in cooperation with the position of an etching loop, after confirming an operation starting point, starting to place a chip on the actual position of the etching loop, using epoxy resin without conductivity for bonding the LED chip, using silver colloid with conductivity for electrifying the LED chip, pasting the chip at the position where the epoxy resin and the silver colloid are put, and respectively arranging electrodes for providing a positive power supply for the LED in the process of pasting the LED;

seventhly, after the chip is pasted, the ITO glass is cut for the second time, the ITO glass is cut into a required special-shaped shape according to the initial design, the second time is cut into a film covering and cutting, namely, a waterproof adhesive tape and a film are adopted to cover the FPCB circuit, and the purpose of protecting the LED chip from being damaged is achieved;

eighthly, performing thermal curing, namely improving the viscosity generated in the process of mounting the sheet by using the ITO glass subjected to the sheet mounting through a thermal curing project, wherein the thermal curing temperature is 92 ℃;

ninth, electrode adhesion detection is carried out, the ITO glass after being pasted with the sheet is checked by using a mirror and an electric lamp, and firstly, whether the electrode of LEDChip is normally connected or not and whether the sticking point of epoxy resin and silver adhesive is normally adhered or not are carried out;

the tenth step, the installation of FPCB silver paper tinsel, FPCB and PCB DRIVER are connected the back and are carried out the detection, will be connected through the ITO glass of thermosetting and FPCB: cleaning the contact surface of the FPCB and the ITO glass, tearing off a paper adhesive tape on the wide surface of the FPCB, bonding the FPCB with the glass from head to tail on the surface of the FPCB adhered with a conductive adhesive to form an adhesive number, carefully pressing the FPCB flat and tightly by hands, connecting the FPCB with the ITO glass, connecting the FPCB with a drive to provide a power supply for the LED, confirming the work of the next process, detecting whether each point is normal after the LED is powered on, observing whether the LED is simultaneously bright after the LED is powered on, observing whether the brightness of the LED is consistent after the LED is powered on, and adhering a silver foil adhesive tape on the upper section of the contact surface of the ITO glass and the FPCB after the LED is powered on;

the eleventh step, after electricity work, carry out once ageing, whether the process of lighting on and turning off the light is carried out according to the flashing light procedure of input to the detection product after supplying power for the product, when once ageing, the main items that need confirm: the lamp is turned on and off, whether the brightness is uniform when the lamp is turned on or not, whether the lamp is turned on and off and whether the lamp is turned on for a long time are carried out according to the program sequence or not, and the aging time is 8-12 hours;

step ten, after the double-sided adhesive tape, the dust removal, the adhesive pad and the common glass are laminated, detecting the state of foreign matters and the laminated sheet, under the condition of no abnormality, after the power supply is cut off, sticking the double-sided adhesive tape according to the upper, lower, left and right (four-side) edges, at the moment, the whole double sides are not completely connected, providing convenience for the next glue injection process, sticking a plastic film at the set position, pressing the upper and lower surfaces of the double-sided adhesive tape by using an operating tool at the position where a double-sided adhesive tape protective layer is removed, electrifying the product again after the process is finished, confirming whether a luminous point normally emits light again, and when the luminous point is detected, shaking the stuck FPCB to detect whether the light spot of the LED is normal;

step thirteen, injecting glue, performing UV curing, injecting glue into the assembly glass bonded by the Cover glass and the ITO glass, lifting the operating platform to ensure that the glass integrally forms an inclined angle, wherein the operating angle is 15-30 degrees, and during glue injection, after the size of the assembly glass is input into a glue injection machine, inserting a double-sided adhesive part without edge sealing on the upper section of the glue injection machine into a rubber tube for glue injection;

fourteenth, detecting bubble foreign matters, brightness and size of luminous points after the PCB DRIVER, the electrical appliance and the communication accessories are installed;

fifthly, assembling the Frame, and carrying out a second aging test, namely inputting a program to detect whether the LED normally emits light for 2-3 days when the product is electrified;

sixthly, finally checking the flash, brightness, image playing, size and Frame appearance.

2. The method for manufacturing the special-shaped transparent display screen according to claim 1, wherein the method comprises the following steps: the PCB DRIVER is a connecting device which is connected with the FPCB and respectively controls different LED chips when supplying power to the LEDs attached to the ITO glass.

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