CN105206734A - LED support and manufacturing method thereof - Google Patents
LED support and manufacturing method thereof Download PDFInfo
- Publication number
- CN105206734A CN105206734A CN201510570597.8A CN201510570597A CN105206734A CN 105206734 A CN105206734 A CN 105206734A CN 201510570597 A CN201510570597 A CN 201510570597A CN 105206734 A CN105206734 A CN 105206734A
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- layer circuit
- top layer
- led support
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses an LED support and a manufacturing method thereof. The LED support comprises a top layer circuit substrate and a bottom layer circuit substrate. A through hole is drilled in the top layer circuit substrate, LED wafer die bonding circuits are formed on the front side and the back side of the bottom layer circuit substrate in an etching and electroplating mode, and the top layer circuit substrate is bonded to the front side of the bottom layer circuit substrate. The LED support is formed by the top layer circuit substrate and the bottom layer circuit substrate in a bonding mode, mold fee is very low, and manufacturing cost is low. Besides, no gap exists between the top layer circuit substrate and the bottom layer circuit substrate, no moisture enters and makes contact with an LED wafer, work of the LED wafer can not be affected, waterproof processing is not needed, and use cost is low. By means of the manufacturing method of the LED support, production efficiency is high, the quality uniformity of the manufactured LED support is good, and the yield is high.
Description
Technical field
The present invention relates to technical field of semiconductor illumination, be specifically related to the manufacture method of a kind of LED support and this LED support.
Background technology
Current existing LED support is generally made up of metal terminal and plastic layer, and metal terminal is wrapped in plastic layer by the mode of injection moulding by plastic layer, and during encapsulation, LED wafer die bond bonding wire is electrically connected with metal terminal, then drips rubber seal dress; But the LED support of this kind of structure not only die sinking is costly, and in the external force situation such as to expand with heat and contract with cold, easily produce gap between metal terminal and plastic layer, moisture during use in air can enter contact LED wafer by this gap, causes LED wafer not work; The LED support waterproof ability of said structure is also very poor, needs to do water-proofing treatment separately to it during use, adds use cost.
The LED support of said structure is produced and is comprised procedure of processings such as rushing metal terminal, plating, injection-molded plastic layer and folding pin, needs various processing equipment to coordinate, the finished product consistency produced is poor, yields is low, production efficiency is also low.
Summary of the invention
For the deficiencies in the prior art, the present invention aims to provide a kind of low cost of manufacture, without the need to doing water-proofing treatment, production efficiency is high, moisture cannot enter affects the LED support formed by two-tier circuit base plate bonding of LED wafer work and the manufacture method of this LED support.
For achieving the above object, the present invention adopts following technical scheme:
A kind of LED support, comprise top layer circuit substrate and bottom circuit substrate, described top layer circuit substrate is drilled with through hole, and described bottom circuit substrate front and back etching plating is formed with LED wafer die bond circuit, and top layer circuit substrate is bonded in the front of bottom circuit substrate.
Further, the edge markedness of described top layer circuit substrate.
Further, described top layer circuit substrate front is printed with coating.
A manufacture method for LED support, comprises the following steps:
A, on top layer circuit substrate, get out through hole by rig, and be provided with the mark being convenient to identify at the edge of top layer circuit substrate;
B, front and back etching plating LED wafer die bond circuit in bottom circuit substrate;
C, by top layer circuit substrate by binder adhesive on the front of bottom circuit substrate, formed LED support.
The present invention has following beneficial effect:
LED support of the present invention is bonded by top layer circuit substrate and bottom circuit substrate and is formed, bottom circuit substrate etching is electroplate with LED wafer die bond circuit, top layer circuit substrate is drilled with through hole, not only die sinking expense is very low, low cost of manufacture, and it is very close to each other between top layer circuit substrate and bottom circuit substrate, can not affect LED wafer work because moisture enters contact LED wafer, also without the need to doing water-proofing treatment, use cost is low; The manufacture method of LED support of the present invention, production efficiency finished product LED support quality conformance that is high, that produce is good, yields is high.
Accompanying drawing explanation
Fig. 1 is the left surface structural representation of a kind of LED support of the present invention;
Fig. 2 is the finished product front schematic view of a kind of LED support of the present invention;
Fig. 3 is the structural representation of the top layer circuit substrate of a kind of LED support of the present invention;
Fig. 4 is the Facad structure schematic diagram of the bottom circuit substrate of a kind of LED support of the present invention;
Fig. 5 is the structure schematic diagram of the bottom circuit substrate of a kind of LED support of the present invention.
In figure: 1, top layer circuit substrate; 2, bottom circuit substrate; 11, through hole; 12, mark; 21, LED wafer die bond circuit.
Embodiment
Below in conjunction with drawings and the specific embodiments, the invention will be further described, understands the technological thought of application claims protection so that clearer.
A kind of LED support of the present invention as Figure 1-5, comprise top layer circuit substrate 1 and bottom circuit substrate 2, top layer circuit substrate 1 is drilled with through hole 11, the edge markedness 12 of top layer circuit substrate 1, top layer circuit substrate 1 front is printed with coating, bottom circuit substrate 2 front and back etching plating is formed with LED wafer die bond circuit 21, and top layer circuit substrate 1 is bonded in the front of bottom circuit substrate 2.
A manufacture method for LED support, comprises the following steps:
A, on top layer circuit substrate 1, get out through hole 11 by rig, and be provided with the mark 12 being convenient to identify at the edge of top layer circuit substrate 1;
B, front and back etching plating LED wafer die bond circuit 21 in bottom circuit substrate 2;
C, by top layer circuit substrate 1 by binder adhesive on the front of bottom circuit substrate 2, formed LED support.
Operation principle of the present invention is: LED support is bonded by top layer circuit substrate 1 and bottom circuit substrate 2 and formed, bottom circuit substrate 2 etching is electroplate with LED wafer die bond circuit 21, top layer circuit substrate 1 is drilled with through hole 11, not only die sinking expense is very low, low cost of manufacture, very close to each other between top layer circuit substrate 1 and bottom circuit substrate 2, can not affect LED wafer work because moisture enters contact LED wafer, also without the need to doing water-proofing treatment, use cost is low; The manufacture method of LED support of the present invention, coordinates processing without the need to too many process equipment, production efficiency finished product LED support quality conformance that is high, that produce is good, yields is high.
For a person skilled in the art, according to technical scheme described above and design, other various corresponding change and distortion can be made, and all these change and distortion all should belong within the protection range of the claims in the present invention.
Claims (4)
1. a LED support, it is characterized in that: comprise top layer circuit substrate (1) and bottom circuit substrate (2), described top layer circuit substrate (1) is drilled with through hole (11), described bottom circuit substrate (2) front and back etching plating is formed with LED wafer die bond circuit (21), and top layer circuit substrate (1) is bonded in the front of bottom circuit substrate (2).
2. a kind of LED support as claimed in claim 1, is characterized in that: the edge markedness (12) of described top layer circuit substrate (1).
3. a kind of LED support as claimed in claim 1 or 2, is characterized in that: described top layer circuit substrate (1) front is printed with coating.
4. the manufacture method of a kind of LED support as claimed in claim 1, comprises the following steps:
A, on top layer circuit substrate (1), get out through hole (11) by rig, and be provided with the mark (12) being convenient to identify at the edge of top layer circuit substrate (1);
B, bottom circuit substrate (2) front and back etching plating LED wafer die bond circuit (21);
C, by top layer circuit substrate (1) by binder adhesive on the front of bottom circuit substrate (2), formed LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510570597.8A CN105206734A (en) | 2015-09-09 | 2015-09-09 | LED support and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510570597.8A CN105206734A (en) | 2015-09-09 | 2015-09-09 | LED support and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105206734A true CN105206734A (en) | 2015-12-30 |
Family
ID=54954284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510570597.8A Pending CN105206734A (en) | 2015-09-09 | 2015-09-09 | LED support and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105206734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112331091A (en) * | 2020-04-28 | 2021-02-05 | 广东三橙电子科技有限公司 | LED module packaging method and LED module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101410997A (en) * | 2006-04-04 | 2009-04-15 | 日立协和技术工程公司 | Submount and its manufacturing method |
| CN101617413A (en) * | 2007-02-28 | 2009-12-30 | Koa株式会社 | Luminous component and manufacture method thereof |
| CN101641802A (en) * | 2007-05-09 | 2010-02-03 | 昭和电工株式会社 | Illuminating device and its manufacturing method |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
| CN205211793U (en) * | 2015-09-09 | 2016-05-04 | 梁高华 | LED support |
-
2015
- 2015-09-09 CN CN201510570597.8A patent/CN105206734A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101410997A (en) * | 2006-04-04 | 2009-04-15 | 日立协和技术工程公司 | Submount and its manufacturing method |
| CN101617413A (en) * | 2007-02-28 | 2009-12-30 | Koa株式会社 | Luminous component and manufacture method thereof |
| CN101641802A (en) * | 2007-05-09 | 2010-02-03 | 昭和电工株式会社 | Illuminating device and its manufacturing method |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
| CN205211793U (en) * | 2015-09-09 | 2016-05-04 | 梁高华 | LED support |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112331091A (en) * | 2020-04-28 | 2021-02-05 | 广东三橙电子科技有限公司 | LED module packaging method and LED module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151230 |