CN114050139A - Double-base-island double-cooling-fin double-drive chip SOP packaging structure and lead frame thereof - Google Patents
Double-base-island double-cooling-fin double-drive chip SOP packaging structure and lead frame thereof Download PDFInfo
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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Abstract
The invention provides a double-base-island double-cooling-fin double-drive chip SOP packaging structure and a lead frame thereof, wherein the lead frame comprises a first base island and a second base island which are adjacently arranged at intervals, the first base island and the second base island both comprise cooling fins, and more than three supporting rods which form a zigzag shape with the cooling fins are uniformly arranged at intervals on the edges of the first base island and the second base island except for the adjacent positions of the first base island and the second base island. The SOP packaging structure comprises two driving chips which are respectively arranged on a first base island and a second base island of the double-base-island double-radiating-fin double-driving chip SOP packaging lead frame and packaged into a whole by adopting a plastic packaging material. The supporting rods of the double-base island are evenly distributed, so that the phenomenon that the heat radiating fins shrink inwards and overflow when the die is closed at a single side or a single angle is avoided, the area of the double-base island is enough to enable the double-base island to contain the heat radiating fins, a drive chip can be used for replacing an MOS chip, the upper limit of the performance and the application range of an SOP packaging product are improved, and the breakthrough of the SOP packaging product is realized.
Description
Technical Field
The invention relates to the technical field of SOP packaging, in particular to a double-base-island double-cooling-fin double-drive chip SOP packaging structure and a lead frame thereof.
Background
SOP (Small Out-Line Package) is a very common form of component. One of the surface mount packages, as shown in fig. 10-12, the lead frame 1 of the prior SOP package has a MOS chip mounting position 18 and a first base island 11, wherein the first base island 11 is used for mounting a driver chip, i.e. only a single driver chip, leads 14 are led out from both sides of the package in the shape of gull wing (L-shape), and the SOP package material includes both plastic and ceramic. The SOP reduces the connection among all functional parts, so that various losses and interferences among the connections are reduced to the minimum, and simultaneously, a plurality of process technologies such as microelectronics, solid electronics and the like are comprehensively utilized, and the advantages of various processes are fully exerted. Thereby improving the overall performance of the system. Small volume, light weight and high packing density. Due to the adoption of the volume structure, components in the package can be embedded and can be integrated or stacked, the development is carried out towards the 3D direction, the space is fully utilized, the system volume and the weight are both greatly reduced, and the packaging density is effectively improved. Low production cost and short market release period. Each functional module can be designed in advance respectively, and the existing general integrated chips and modules can be adopted in a large quantity, so that the cost is effectively reduced, the design period is shortened, and the market putting speed is high.
However, the semiconductor packaging industry is still lacking an SOP package type (model number) of a dual-base-island dual-heat-sink dual-drive chip, which reduces the application range and functional expansion of high-demand components such as SOP (SOP-7/8/14/16L and the like), and an important branch type for SOP packages is lacking. The problem lies in that the design of current structure has 2 technical difficulties not solved, leads to realizing two base island + two fin structure frames:
1. because the SOP packaging needs to be concave and sunken to a large extent, the periphery of the supporting rod cannot be uniformly distributed, glue overflow is caused, and products are scrapped.
2. No one has currently attempted to implement the dual island + dual heat sink type on SOP packages because the industry SOP package deboss angle is 60 ° maximum and the dual heat sink pitch needs to be large enough to avoid the SMT attach risk, which results in a smaller bottom heat sink area.
Disclosure of Invention
In order to solve the technical problem, the invention provides a double-base-island double-cooling-fin double-drive chip SOP packaging lead frame, which comprises a first base island and a second base island which are adjacently arranged at intervals, wherein the first base island and the second base island both comprise cooling fins, and more than three supporting rods which form a zigzag shape with the cooling fins are uniformly arranged at intervals on the edges of the first base island and the second base island except for the adjacent positions of the first base island and the second base island.
Optionally, the edges of the heat sinks at the first base island and the second base island are provided with stepped mode locking structures.
Optionally, the first base island and the second base island are adjacently spaced by a distance not less than 0.6 mm.
Optionally, the first base island and the second base island are both square, one side of each of the first base island and the second base island is adjacent to one side of each of the first base island and the second base island, and at least one support rod is arranged on the other three sides of each of the first base island and the second base island.
Optionally, the pins and the support rods of the first base island and the second base island are alternately arranged at intervals.
Optionally, the first base island and the second base island are formed by debossing, and the debossing angle is not more than 60 °.
The invention also provides a double-base-island double-cooling-fin double-drive chip SOP packaging structure, wherein two drive chips are respectively arranged on the first base island and the second base island of the double-base-island double-cooling-fin double-drive chip SOP packaging lead frame and are packaged into a whole by adopting a plastic packaging material.
Optionally, the heat sink is exposed on the surface of the package; the driving chip is electrically connected with the pins.
Optionally, the driving chip is mounted on the first base island and the second base island by mounting adhesive, including:
and (3) dispensing chip mounting glue at the first base island and the second base island, pasting the driving chip on the chip mounting glue, and baking according to a set temperature curve.
Optionally, the packaging method is as follows:
after the two driving chips are respectively arranged on the upper end surfaces of the first base island and the second base island of the lead frame, the lead frame is placed in the lower die, and the lower end surface of the radiating fin, which is far away from the driving chips, is attached to the bottom of the lower die;
covering an upper die on the upper end of a lower die, forming a packaging space between the upper die and the lower die, and wrapping a first base island, a second base island and two driving chips in the packaging space;
and injecting a soft colloidal plastic packaging material which is heated into the packaging space, cooling and forming, and taking out from the upper die and the lower die to finish packaging.
The SOP packaging structure of the double-base-island double-radiating-fin double-drive chip and the lead frame thereof realize the breakthrough of an SOP packaging product without a double-base-island and double radiating fins in the semiconductor packaging industry; the SOP packaging lead frame can enable the selection of the SOP packaging concave angle to be as close to the upper limit value as possible, so that the areas of the first base island and the second base island are enough to enable the first base island and the second base island to respectively contain the radiating fins, and the two base islands have good radiating performance; the driving chips with better performance and higher power can be assembled according to the MOS chips, the heat dissipation requirement of assembling the driving chips with higher heat productivity can be met, and the performance upper limit and the application range of the SOP packaging product are greatly improved. The structural design of the lead frame of the SOP double-base island and double radiating fins is reasonable, and the processing difficulty of a lead frame factory is not increased; the double-base island is centrally arranged in the whole position, the supporting rods are evenly distributed, the supporting force is balanced, the single edge or single corner of a radiating fin is prevented from shrinking inwards when the die is closed, no glue overflow is ensured, and the chip mounting, wire welding and plastic packaging operability is good; the edge of the double-base island can be provided with a step mode locking structure (MOLD LOCK), so that good air tightness and strong practicability and reliability can be ensured; the edge distance of the double-base island is not less than 0.60mm, the SMT safety distance is enough, and the tin-connecting short circuit risk can be avoided.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic plane view of a SOP package lead frame of a dual-base-island dual-heat-sink dual-drive chip according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view A-A of the SOP package lead frame of the dual-island dual-heat spreader dual-driver chip of the present invention according to the embodiment of FIG. 1;
FIG. 3 is a schematic cross-sectional view B-B of the dual-island dual-heat sink dual-drive chip SOP package lead frame of the embodiment of FIG. 1;
FIG. 4 is a schematic cross-sectional view of the dual-island dual-heat sink dual-drive chip SOP package lead frame of the embodiment of FIG. 1, taken along line C-C;
FIG. 5 is a cross-sectional view of a portion D of the dual-island dual-heat sink dual-drive chip SOP package lead frame of the embodiment of FIG. 1;
FIG. 6 is a top view of an embodiment of a dual-island dual-heat sink dual-drive chip SOP package structure according to the present invention;
FIG. 7 is a side view of the SOP package structure of dual-base dual-heat sink dual-drive chip of the present invention in FIG. 6;
FIG. 8 is a bottom view of the SOP package structure of dual-island dual-heat sink dual-drive chip of the present invention in FIG. 6;
FIG. 9 is a schematic two-dimensional view of an embodiment of a dual-island dual-heat sink dual-drive chip SOP package lead frame according to the present invention;
FIG. 10 is a schematic plan view of a prior art SOP package lead frame of a single base island, single heat sink, and single driver chip;
FIG. 11 is a cross-sectional schematic view of the prior art A '-A', B '-B' and C '-C' of the embodiment of FIG. 10 of a SOP package lead frame of a single base island single heat sink single driver chip;
fig. 12 is a bottom view of a SOP package structure of a single-base island single-heat-sink single-driver chip in the prior art.
In the figure: 1-lead frame, 11-first base island, 12-second base island, 13-support rod, 14-lead, 15-radiating fin, 16-step mode locking structure, 17-concave angle, 18-MOS chip mounting position and 2-plastic package material.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 1 to 9, an embodiment of the present invention provides a dual-base-island dual-heat-sink dual-drive chip SOP package lead frame, where the lead frame 1 includes a first base island 11 and a second base island 12 that are arranged at an interval, the first base island 11 and the second base island 12 both include heat sinks 15, and three or more support bars 13 that form a zigzag shape with the heat sinks 15 are uniformly arranged at intervals on the edge of the first base island 11 and the second base island 12 except for adjacent positions.
The working principle and the beneficial effects of the technical scheme are as follows: the double-base island (the first base island and the second base island) is arranged in the middle, the supporting rods are evenly distributed, the supporting force is balanced, the single-side or single-angle inward shrinkage of the radiating fin is avoided when the die is closed, the glue is not overflowed, and the chip mounting, welding line and plastic package operability is good; the SOP packaging lead frame can enable the selection of the SOP packaging concave angle to be as close to the upper limit value as possible, so that the areas of the first base island and the second base island are enough to enable the first base island and the second base island to respectively contain radiating fins, the edge distance of the double base islands can be ensured to be not less than 0.60mm, the SMT safety distance is enough, and the tin connection short circuit risk can be avoided; the two base islands have good heat dissipation performance; the heat dissipation requirement for assembling the driving chip with higher heating value can be met, the driving chip with better performance and higher power can be assembled into the MOS chip, the driving chip not only has all functions of the MOS chip, but also has other more functions, and the performance upper limit and the application range of the SOP packaging product are greatly improved; the SOP double-base island and double-radiating fin lead frame structure is reasonable in design, and the processing difficulty of a lead frame factory is not increased, so that the breakthrough of an SOP packaging product without a double-base island and a double-radiating fin in the semiconductor packaging industry is realized.
In one embodiment, as shown in fig. 1, 4, 5 and 9, the edges of the heat sink 15 at the first and second base islands 11 and 12 are provided with a step-mode-locking structure 16.
The working principle and the beneficial effects of the technical scheme are as follows: the stepped mode locking structure (MOLD LOCK) is arranged at the edge of the radiating fin at the double-base island (the first base island and the second base island), so that during die assembly, the phenomenon that the radiating fin contracts inwards at a single side or a single corner during die assembly can be further avoided, no glue overflow is ensured, and the chip mounting, wire welding and plastic packaging operability is good; can ensure good air tightness and strong practicability and reliability.
In one embodiment, as shown in fig. 1, 4 and 9, the first base island 11 and the second base island 12 are adjacently spaced apart by a distance of not less than 0.6 mm.
The working principle and the beneficial effects of the technical scheme are as follows: this scheme is because two base island (first base island and second base island) overall position are arranged between two parties, bracing piece evenly distributed, and the holding power is balanced, makes SOP encapsulation pin frame can let the selection of SOP encapsulation angle of dishing be close to the upper limit value as far as possible, ensures the area at first base island and second base island position, thereby can guarantee that two base island edge distances are not less than 0.60mm, lets SMT have sufficient safe distance, can avoid the short circuit risk of continuous tin.
In one embodiment, as shown in fig. 1 and 9, the first base island 11 and the second base island 12 are both square and have one side adjacent to each other, and at least one support bar 13 is disposed on the other three sides of each of the two.
The working principle and the beneficial effects of the technical scheme are as follows: double-base island (first base island and second base island) in this scheme adopts squarely, both are adjacent and overall position arranges placed in the middle, the bracing piece sets up respectively on non-adjacent limit, and whole evenly distributed, make the holding power balanced, consequently, SOP encapsulation angle of dishing of SOP encapsulation pin frame can select as far as near upper limit value, make the total area at first base island and second base island position as big as possible, let double-base island have space difference fin, the heat dissipation of the great dual drive chip of guarantee calorific capacity.
In one embodiment, as shown in fig. 1 and 9, the pins 14 of the first and second base islands 11 and 12 are alternately spaced apart from the support bars 13.
The working principle and the beneficial effects of the technical scheme are as follows: the pins and the supporting rods of the double-base island (the first base island and the second base island) are alternately arranged at intervals, the interference of the pins on the arrangement of the supporting rods is reduced, the supporting rods can be uniformly distributed on the whole, the supporting force is balanced, therefore, the SOP packaging concave angle of the SOP packaging pin frame can be selected to be close to the upper limit value as far as possible, the total area of the first base island and the second base island is as large as possible, the double-base island is provided with the space-based radiating fins, and the radiating of a double-drive chip with large heat productivity is guaranteed.
In one embodiment, the first base island 11 and the second base island 12 are formed by debossing, as shown in fig. 3, with a debossing angle 17 of not more than 60 °; a choice may be made between 45 deg. -60 deg., for example a 50 deg., 55 deg. or 60 deg. set angle may be used.
The working principle and the beneficial effects of the technical scheme are as follows: the double-base island (the first base island and the second base island) in the scheme provides the range of the SOP packaging concave angle of the SOP packaging lead frame, and during actual selection, the position close to the upper limit value of 60 degrees can be selected as far as possible, so that the total area of the first base island and the second base island is as large as possible, the double-base island is provided with the space-based radiating fins, and the heat radiation of the double-drive chip with larger heat productivity is guaranteed.
As shown in fig. 6 to 8, an embodiment of the invention provides a dual-base-island dual-heat-sink dual-drive chip SOP package structure, in which two drive chips (not shown in the figures) are respectively mounted on the first base island 11 and the second base island 12 of the lead frame, and are packaged into a whole by using a plastic package material 2.
The working principle and the beneficial effects of the technical scheme are as follows: the SOP packaging structure adopts the pin frame, the whole positions of the double-base island are arranged in the middle, the supporting rods are evenly distributed, the supporting force is balanced, the single-side or single-angle inward shrinkage of the radiating fin is avoided when a die is assembled, the glue overflow is avoided, and the chip assembling, welding line and plastic packaging operability are good; the SOP packaging lead frame can enable the selection of the SOP packaging concave angle to be as close to the upper limit value as possible, so that the areas of the first base island and the second base island are enough to enable the first base island and the second base island to respectively contain a radiating fin, and the two base islands have good radiating performance; the heat dissipation requirement of assembling a driving chip with higher heating value can be met, the driving chip with better performance and higher power of an MOS chip can be assembled, and the upper performance limit and the application range of an SOP packaging product are greatly improved; the SOP double-base island and double-radiating fin lead frame structure is reasonable in design, and the processing difficulty of a lead frame factory is not increased, so that the breakthrough of an SOP packaging product without a double-base island and a double-radiating fin in the semiconductor packaging industry is realized.
In one embodiment, as shown in FIG. 8, the heat sink 15 is exposed at the surface of the package; the driver chip is electrically connected to the pins 14.
The working principle and the beneficial effects of the technical scheme are as follows: the double-base island (the first base island and the second base island) is respectively provided with the radiating fins, and the radiating fins are exposed on the surface after packaging, so that the two base islands have good radiating performance; the heat dissipation requirement for assembling the driving chip with higher heating value can be met, the driving chip with better performance and higher power can be assembled into the MOS chip, the driving chip not only has all functions of the MOS chip, but also has other more functions, and the performance upper limit and the application range of the SOP packaging product are greatly improved; the driving chip is electrically connected with the pins, so that smooth signal transmission is guaranteed, and the use function of the driving chip can be realized.
In one embodiment, the driving chip is mounted on the first base island 11 and the second base island 12 by using a die bonding adhesive, and includes:
and (3) dispensing chip mounting glue at the first base island 11 and the second base island 12, pasting the driving chip on the chip mounting glue, and baking according to a set temperature curve.
The working principle and the beneficial effects of the technical scheme are as follows: the driving chip is mounted on the substrate by adopting mounting glue; the mounting adhesive can select the type with the expansion coefficient basically consistent with that of the lead frame, and the mounting adhesive still has certain elasticity after being baked, so that certain stress change can be absorbed, and adverse effects on product performance can be avoided; baking is carried out after the chips are mounted, and the baking is carried out by adopting a set temperature curve for temperature control, so that the process temperature control precision can be improved, the product quality can be favorably ensured, and the consistency of the product performance can be realized.
In one embodiment, the packaging is as follows:
after two driving chips are respectively arranged on the upper end faces of a first base island 11 and a second base island 12 of a lead frame 1, the lead frame 1 is placed in a lower die, and the lower end face, away from the driving chips, of a radiating fin 15 is attached to the bottom of the lower die;
covering an upper die on the upper end of a lower die, forming a packaging space between the upper die and the lower die, wherein the packaging space wraps a first base island 11, a second base island 12 and two driving chips;
and injecting a soft colloidal plastic packaging material 2 which is heated into the packaging space, cooling and forming, and taking out from the upper die and the lower die to finish packaging.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, an upper die and a lower die are matched for SOP packaging to form a corresponding packaging space, and the first base island, the second base island and the two driving chips are arranged in the packaging space, so that the lead frame is small in deformation during packaging, and the size precision after packaging is high; the soft colloidal plastic packaging material is formed by injecting and heating the plastic packaging material into the packaging space, and the plastic packaging material is taken out after cooling and molding, so that the shape and the size of the packaged product can be better solidified, the consistency of the packaged product is guaranteed, and the yield is improved.
In one embodiment, when the driver chip is mounted, the baking temperature control method according to the set temperature curve is as follows:
establishing a simulation function T ═ f (T) of a set temperature curve, wherein the simulation function is conductive in a temperature control period, and calculating the transmission heat by adopting the following formula:
in the above formula, QtjRepresenting the heat of transmission at the jth timing moment; t represents a temperature value during a temperature control period; t represents the timing instant within the temperature control period, tjRepresents the jth timing instant within the temperature control period; t is tj+1Represents the j +1 th timing point within the temperature control period; n represents the amount of the substance in the temperature controlled space; ciRepresenting the specific heat of the i-th substance present in the temperature controlled space; miRepresenting the mass of the ith substance present in the temperature controlled space; f. of′(tj+1) The derivative of the expression function representing the set temperature curve at the j +1 th timing instant;
heat transmission is carried out in the temperature control space according to the calculation result, and if the calculation result is a positive value, transmission heat is provided for the temperature control space to be heated; if the calculation result is negative, the transmitted heat is sucked away from the control space to the temperature for cooling.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the temperature in the driver chip mounting process is controlled according to the mode, a corresponding simulation function is established according to a set temperature curve, optimization and adjustment are carried out to enable the simulation function to be conductive in a temperature control time period, then the transmission heat is calculated according to the formula, and the temperature in a temperature control space is adjusted according to the transmission heat; the derivative of the analog function of the set temperature curve is introduced into the formula, the derivative value of the next timing moment (namely, the j +1 th timing moment) is taken, the transmission heat quantity required by the current timing moment (namely, the j timing moment) is calculated, and the derivative value of the next timing moment (namely, the tangent slope of the timing moment point on the temperature curve) can better reflect the prediction of the temperature change trend, so that the heat quantity transmission can be accurately controlled, the accurate control of the temperature is realized, the problem of product quality caused by inaccurate process temperature control is avoided, the waste can be avoided, and the energy conservation is realized.
In one embodiment, the minimum dimension of the cross-section of the support bar complies with the following formula:
in the above formula, DminThe minimum size of the cross section of the supporting rod is shown, if the cross section of the supporting rod is circular, the minimum size of the cross section of the supporting rod is the diameter of the circle, and if the cross section of the supporting rod is square, the minimum size of the cross section of the supporting rod is the side length of the shortest side of the square; gamma represents the coefficient of thermal expansion of the support rod; l represents the recessing depth of the SOP package; θ represents the debossing angle of the SOP package; Δ t represents the temperature rise of the support rod during welding or heating, and is determined according to the process; and delta represents the maximum deformation amount allowed by the supporting rod, and is determined according to the requirement during design.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the relation between the section size of the support rod and the recessing depth is quantized through a formula to ensure the strength of the support rod, so that the support rod can keep the original shape when the temperature is changed in the process, the influence on the reliability of electric connection and the quality of a product due to the deformation of the support rod is prevented, and the support rod generally adopts a square section form; the formula fully considers the temperature change of the support rod possibly caused by welding or other processes in the manufacturing process and the temperature characteristic condition of the support rod material, thereby improving the process precision and ensuring the consistency of the product quality.
The double-base island and double-radiating fin packaging structure and the lead frame thereof have breakthrough significance for SOP packaging types: the type vacancy of the dual-drive chip packaged by the SOP is filled; the SOP package can meet the product requirements of higher performance and higher power; the newly designed pin frame is reasonable in design, good in operability, high in practicability and high in reliability.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The double-base-island double-cooling-fin double-drive chip SOP packaging lead frame is characterized by comprising a first base island and a second base island which are arranged adjacently at intervals, wherein the first base island and the second base island both comprise cooling fins, and more than three supporting rods which form a zigzag shape with the cooling fins are uniformly arranged at the edges of the first base island and the second base island except for the adjacent positions of the first base island and the second base island at intervals.
2. The dual-base-island dual-heat-sink dual-drive chip SOP package lead frame of claim 1, wherein the edges of the heat sinks at the first base island and the second base island are provided with stepped mode locking structures.
3. The dual-base-island dual-heat-sink dual-drive chip SOP package lead frame of claim 1, wherein the first base island and the second base island are adjacently spaced by a distance of not less than 0.6 mm.
4. The dual-base-island dual-heat-sink dual-drive chip SOP package lead frame of claim 1, wherein the first base island and the second base island are square and have one side adjacent to each other, and at least one support bar is arranged on the other three sides of each base island and each base island.
5. The dual-base-island dual-heat-sink dual-drive chip SOP package lead frame of claim 1, wherein the leads and support bars of the first and second base islands are alternately spaced.
6. The dual-base-island dual-heat-sink dual-drive chip SOP package lead frame of claim 1, wherein the first base island and the second base island are formed by recessing, and the angle of the recessing is not more than 60 °.
7. A dual-base island dual-cooling fin dual-drive chip SOP packaging structure is characterized in that two drive chips are respectively arranged on a first base island and a second base island of the dual-base island dual-cooling fin dual-drive chip SOP packaging lead frame in claim 1 and packaged into a whole by adopting a plastic package material.
8. The dual-base-island dual-heat-sink dual-drive chip SOP packaging structure of claim 7, wherein the heat sink is exposed on the surface after packaging; the driving chip is electrically connected with the pins.
9. The dual-base-island dual-heat-sink dual-drive chip SOP packaging structure of claim 7, wherein the drive chip is mounted on the first base island and the second base island by using a die attach adhesive, comprising:
and (3) dispensing chip mounting glue at the first base island and the second base island, pasting the driving chip on the chip mounting glue, and baking according to a set temperature curve.
10. The dual-base-island dual-heat-sink dual-drive chip SOP packaging structure of claim 7, wherein the packaging mode is as follows:
after the two driving chips are respectively arranged on the upper end surfaces of the first base island and the second base island of the lead frame, the lead frame is placed in the lower die, and the lower end surface of the radiating fin, which is far away from the driving chips, is attached to the bottom of the lower die;
covering an upper die on the upper end of a lower die, forming a packaging space between the upper die and the lower die, and wrapping a first base island, a second base island and two driving chips in the packaging space;
and injecting a soft colloidal plastic packaging material which is heated into the packaging space, cooling and forming, and taking out from the upper die and the lower die to finish packaging.
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| CN116613131A (en) * | 2023-06-02 | 2023-08-18 | 上海类比半导体技术有限公司 | Integrated circuit package frame |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613131A (en) * | 2023-06-02 | 2023-08-18 | 上海类比半导体技术有限公司 | Integrated circuit package frame |
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