CN111935917A - Product glue filling auxiliary device and glue filling method - Google Patents
Product glue filling auxiliary device and glue filling method Download PDFInfo
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- CN111935917A CN111935917A CN202010902024.1A CN202010902024A CN111935917A CN 111935917 A CN111935917 A CN 111935917A CN 202010902024 A CN202010902024 A CN 202010902024A CN 111935917 A CN111935917 A CN 111935917A
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- glue
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- glue filling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a product glue filling auxiliary device and a glue filling method, wherein the product glue filling auxiliary device comprises a support plate main body and a heating part arranged on the support plate main body; the PCB to be filled with glue is positioned on the carrier plate main body, and the glue filling position of a product to be filled with glue on the PCB to be filled with glue corresponds to the position of the heating part; the heating part is used for heating the glue filling position in the glue filling process. The invention can prevent the generation of air bubbles in the colloid and improve the quality and performance of the product in glue filling.
Description
Technical Field
The invention relates to the technical field of product production and processing, in particular to a product glue filling auxiliary device and a glue filling method.
Background
With the development of society, electronic products are closely related to human lives, and the requirements of people on the quality of products are higher and higher. At present, electronic products with chips or waterproof performance are usually designed by adopting glue for sealing, for example, when a barometer needs to meet certain waterproof performance requirements, the chips inside the barometer are usually wrapped by adopting a glue filling mode. The glue for encapsulation can not only prevent the chip from being damaged by water, but also ensure that the external air pressure can be accurately and timely transmitted to the chip. These two requirements make the potting process important in the manufacturing process of waterproof electronic products.
When the glue for encapsulation needs to transmit external signals to the chip, it is necessary to ensure that there is no factor inside the glue that can block or interfere with the transmission of signals (such as air pressure). At present, factors influencing the quality of glue mainly comprise foreign matters in the glue and bubbles in the glue; if the foreign matter is larger in size or is positioned right above the chip, the change of the air pressure received by the chip can be influenced under certain conditions; and the air bubbles in the glue can bulge under a certain pressure state, so that the air pressure sensed by the chip is abnormal.
The above mentioned change caused by the foreign matter in the glue and the air bubble in the glue is not the change of the external air pressure itself, but the change is caused by the non-excellent state of the glue, which has a certain influence on the product performance.
At present, the foreign matters in the glue can be solved by controlling the workshop environment in the product manufacturing process and carrying out foreign matter inspection after the manufacturing is finished. Bubbles in the glue are difficult to solve, and because the glue has certain viscosity, the final forming of the glue is influenced by the speed, the position, the curing condition and the like of glue dispensing in the glue filling process of a product, namely whether the bubbles exist in the final glue is influenced; in addition, the bubbles in the glue are difficult to handle during final inspection of the product.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide an auxiliary device and a method for filling glue into a product, so as to solve the problems that the glue filling of the existing product is easy to generate bubbles, which affects the product performance.
The invention provides a product glue filling auxiliary device, which comprises a carrier plate main body and a heating part arranged on the carrier plate main body; the PCB to be filled with glue is positioned on the carrier plate main body, and the glue filling position of a product to be filled with glue on the PCB to be filled with glue corresponds to the position of the heating part; the heating part is used for heating the glue filling position in the glue filling process.
In addition, the preferred technical scheme is that the heating part is a protruding structure corresponding to the shape of the glue filling position.
In addition, a preferable technical proposal is that an avoidance groove is arranged in the heating part; the chip position of the product to be glue-poured corresponds to the position of the avoiding groove.
In addition, the preferable technical scheme is that a positioning column is arranged on the main body of the support plate, and a positioning hole corresponding to the positioning column is arranged on the PCB to be glue-poured; the positioning column is matched with the positioning hole to limit the PCB to be glue-poured and the support plate main body.
In addition, the preferable technical scheme is that at least two positioning holes are arranged; and, contain at least one in the locating hole and prevent slow-witted hole.
In addition, the preferable technical proposal is that the heating part is of an annular structure, and the avoiding groove is of a circular structure; or the heating part is of a polygonal structure, and the avoidance groove is of a polyhedral structure.
In addition, the preferable technical proposal is that the carrier plate main body is connected with an external heating device and a temperature control device; the temperature control device is used for controlling the heating device to heat the heating part.
In addition, the preferable technical scheme is that the heating temperature range of the heating part is 50-100 ℃.
In addition, the preferred technical scheme is that the carrier plate main body is a metal plate or a heat conduction and insulation rubber plate.
According to another aspect of the invention, a method for filling glue into a product is provided, which comprises the following steps: positioning a PCB to be glue-poured on a carrier plate main body of a product glue-pouring auxiliary device; heating the carrier plate main body through a heating device; when the temperature of the carrier plate main body reaches a preset range, performing glue filling operation on a product to be glue filled on the PCB to be glue filled through a glue filling device; wherein, the product encapsulating auxiliary device is as above.
By utilizing the product glue filling auxiliary device and the glue filling method, the glue filling position of the product is heated through the support plate main body, air bubbles in glue are discharged in the glue filling process of the product, the quality of finally-formed glue is ensured, and the stable performance of the product is further ensured.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a top view of a product glue fill assist device according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic structural diagram of a PCB to be glue-poured according to an embodiment of the invention;
fig. 4 is a flowchart of a product glue filling method according to an embodiment of the invention.
Wherein the reference numerals include: the carrier plate comprises a carrier plate main body 1, a heating part 2, a first positioning column 31, a second positioning column 32, an avoiding groove 4, a PCB5 to be filled with glue, a first positioning hole 61, a second positioning hole 62, a shell 71, a chip 72 and a glue filling position 73.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In order to describe the glue filling auxiliary device and the glue filling method of the product in detail, the following will describe in detail a specific embodiment of the invention with reference to the accompanying drawings.
Fig. 1 and 2 show schematic structures of a product glue filling assist device according to an embodiment of the present invention from different angles, respectively.
As shown in fig. 1 and fig. 2, the auxiliary device for glue filling of a product according to an embodiment of the present invention includes a carrier plate body 1 and a plurality of heating portions 2 disposed on the carrier plate body 1; wherein, treat that encapsulating PCB fixes a position on support plate main part 1, treat that the encapsulating position of treating the encapsulating product on the encapsulating PCB is corresponding with the position of heating portion 2 on support plate main part 1, at the encapsulating in-process, heat the encapsulating position through heating portion 2, the indirect heating that realizes the glue of pouring into in treating the encapsulating product, and then the bubble discharge in the glue.
Wherein, heating portion 2 on the support plate main part 1 can set up to the protruding structure corresponding with encapsulating position shape, heats alone the encapsulating position of product (waiting to encapsulate the product) through protruding structure to prevent to influence the performance of other subassemblies in the product among the heating process.
For preventing that heating portion 2 from bringing the influence to other subassemblies of product inside, set up in the inside of heating portion 2 and dodge groove 4, treat that the chip position of encapsulating product or other can not carry out the subassembly positions that heat and dodge groove 4's position corresponding, at the heating encapsulating in-process, subassembly such as chip dodge in dodging groove 4, only heat the encapsulating position through heating portion 2.
Specifically, the heating portion 2 may be configured as an annular structure as shown in the figure, and the corresponding avoidance groove 4 is a circular structure; alternatively, the heating part 2 may be provided in a polygonal structure corresponding to the shape of the potting region of the product, and the corresponding avoidance groove 4 may be provided in a polyhedral structure, but the heating part 2 may be provided in other shapes, and the shape of the corresponding avoidance groove 4 may be adjusted according to the structure of the product or the heating requirement.
Fig. 3 shows a schematic structure of a PCB to be potted according to an embodiment of the present invention.
As shown in fig. 1 to fig. 3, a plurality of products to be glue-poured are regularly distributed on a PCB5 to be glue-poured, each product to be glue-poured includes a housing 71, a chip 72 disposed in the housing 71, and a glue-pouring position 73 or a glue-pouring area surrounded by the housing 71, and the arrangement position and number of the heating portions 2 on the carrier main body 1 can be adjusted according to a specific PCB, and are not limited to the structure shown in the drawings.
Before the product is filled with glue, firstly, the PCB5 to be filled with glue and the carrier plate main body 1 are positioned, so that the heating part 2 on the carrier plate main body 1 is aligned to the glue filling position 73 of the product to be filled with glue in the PCB above; in order to ensure the position accuracy of the glue filling position 73 and the heating portion 2, a positioning column may be disposed on the carrier main body 1, a positioning hole corresponding to the positioning column may be disposed on the PCB5 to be glue filled, and the PCB5 to be glue filled and the carrier main body 1 may be accurately limited by the cooperation of the positioning column and the positioning hole.
In an embodiment of the invention, in order to prevent the PCB5 to be glue-poured from being positioned on the carrier body 1 in the opposite direction, at least two positioning holes may be provided, and at least one fool-proof hole is included in the positioning hole, and the number and position of the positioning posts are adjusted according to the positioning holes. For example, the distance from the first positioning hole 61 to the edge of the carrier body 1 and the distance from the second positioning hole 62 to the edge of the carrier body 1 are set to be different, so as to prevent the PCB5 to be filled from having a wrong direction during the positioning process, and the positions of the corresponding first positioning column 31 and second positioning column 32 correspond to the positions of the corresponding positioning holes.
It should be noted that, the carrier plate main body 1 is connected to an external heating device and a temperature control device during the heating process, and the temperature control device controls parameters such as heating time and temperature of the heating unit 2 by the heating device, wherein the heating device or the temperature control device may be of an existing device structure.
As a specific example, the heating temperature of the heating part 2 is 50 to 100 ℃, and the specific temperature can be adjusted according to the type of the colloid to be poured into the product or the production requirement. In addition, in order to improve the heating efficiency of the carrier body 1, the carrier body 1 may be made of a metal plate, a heat conductive insulating rubber plate, or a silicon plate, which has a good heat conductive effect.
Corresponding to the auxiliary device for filling the glue into the product, the invention also provides a method for filling the glue into the product.
Specifically, fig. 4 shows a flow of a product glue filling method according to an embodiment of the present invention.
As shown in fig. 4, the glue filling method of the product of the embodiment of the invention includes the following steps:
s110: and positioning the PCB to be glue-poured on the carrier plate main body of the product glue-pouring auxiliary device.
Before the glue filling of the product to be glue filled, the PCB to be glue filled is positioned on the support plate main body through the mutual matching of the positioning column and the positioning hole, and the glue filling position of the product is ensured to be vertically corresponding to the position of the heating part.
S120: and heating the carrier plate main body by a heating device.
In this step, the carrier body is heated and temperature-controlled by the cooperation of an external heating device and a temperature control device.
S130, when the temperature of the carrier plate main body reaches a preset range, glue filling operation is carried out on a product to be glue filled on the PCB to be glue filled through the glue filling device.
Wherein the preset range can be adjusted according to the type of the colloid to be poured or the production requirement.
It should be noted that, the embodiment of the method for filling adhesive of the product of the present invention may refer to the description of the embodiment of the auxiliary device for filling adhesive of the product, and details are not repeated here.
According to the auxiliary device and the glue filling method for the product, provided by the invention, the glue filling positions of a plurality of products to be glue filled on the PCB are simultaneously heated through the support plate main body, so that bubbles in glue filled into the product can be discharged and exhausted on the premise of ensuring the performance of other components of the product, and the device is simple in structure, high in glue filling quality of the product and stable in performance.
The product glue filling assist device and the glue filling method according to the present invention are described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the auxiliary glue filling device and the glue filling method of the product proposed by the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A product glue filling auxiliary device is characterized by comprising a carrier plate main body and a heating part arranged on the carrier plate main body; wherein the content of the first and second substances,
the PCB to be subjected to glue pouring is positioned on the carrier plate main body, and the glue pouring position of a product to be subjected to glue pouring on the PCB to be subjected to glue pouring corresponds to the position of the heating part;
the heating part is used for heating the glue filling position in the glue filling process.
2. The product glue filling assist device of claim 1,
the heating part is a protruding structure corresponding to the shape of the glue filling position.
3. A product glue filling aid as claimed in claim 1 or 2,
an avoidance groove is formed in the heating part;
and the position of the chip of the product to be glue-poured corresponds to the position of the avoiding groove.
4. The product glue filling assist device of claim 1,
a positioning column is arranged on the support plate main body, and a positioning hole corresponding to the positioning column is arranged on the PCB to be glue-poured;
the positioning column is matched with the positioning hole to limit the PCB to be glue-poured and the support plate main body.
5. The product glue filling assist device of claim 4,
at least two positioning holes are arranged; and the number of the first and second electrodes,
the positioning hole comprises at least one fool-proof hole.
6. The product glue filling assist device of claim 1,
the heating part is of an annular structure, and the avoidance groove is of a circular structure; alternatively, the first and second electrodes may be,
the heating part is of a polygonal structure, and the avoidance groove is of a polyhedral structure.
7. The product glue filling assist device of claim 1,
the carrier plate main body is connected with an external heating device and a temperature control device;
the temperature control device is used for controlling the heating device to heat the heating part.
8. The product glue filling assist device of claim 1,
the heating temperature range of the heating part is 50-100 ℃.
9. The product glue filling assist device of claim 1,
the carrier plate main part is a metal plate or a heat conduction insulating rubber plate.
10. A method of glue pouring a product, the method comprising:
positioning a PCB to be glue-poured on a carrier plate main body of a product glue-pouring auxiliary device;
heating the carrier plate main body through a heating device;
when the temperature of the carrier plate main body reaches a preset range, performing glue filling operation on a product to be glue filled on the PCB to be glue filled through a glue filling device; wherein the content of the first and second substances,
the product glue pouring auxiliary device is as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010902024.1A CN111935917B (en) | 2020-09-01 | 2020-09-01 | Product glue filling auxiliary device and glue filling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010902024.1A CN111935917B (en) | 2020-09-01 | 2020-09-01 | Product glue filling auxiliary device and glue filling method |
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| Publication Number | Publication Date |
|---|---|
| CN111935917A true CN111935917A (en) | 2020-11-13 |
| CN111935917B CN111935917B (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010902024.1A Active CN111935917B (en) | 2020-09-01 | 2020-09-01 | Product glue filling auxiliary device and glue filling method |
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| CN103700596A (en) * | 2013-12-09 | 2014-04-02 | 宁波市鄞州科启动漫工业技术有限公司 | Compression mold packaging method and device for reducing bubbles in mold packaging colloid |
| CN205217259U (en) * | 2015-12-19 | 2016-05-11 | 江西合力泰科技有限公司 | Point gum machine workstation |
| CN206425182U (en) * | 2016-12-06 | 2017-08-22 | 鸿利智汇集团股份有限公司 | A kind of point glue equipment |
| CN107399478A (en) * | 2017-08-17 | 2017-11-28 | 江苏瑞合硕电子科技有限公司 | Glue pouring machine heating system |
| CN108417699A (en) * | 2018-05-18 | 2018-08-17 | 深圳市德彩光电有限公司 | The plastic package die of LED light source |
| CN108724566A (en) * | 2018-05-04 | 2018-11-02 | 深圳市德彩光电有限公司 | The encapsulating die and glue-pouring method of LED light source |
| CN208930567U (en) * | 2018-08-15 | 2019-06-04 | 深圳市科普特电子有限公司 | A kind of encapsulating die |
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2020
- 2020-09-01 CN CN202010902024.1A patent/CN111935917B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700596A (en) * | 2013-12-09 | 2014-04-02 | 宁波市鄞州科启动漫工业技术有限公司 | Compression mold packaging method and device for reducing bubbles in mold packaging colloid |
| CN205217259U (en) * | 2015-12-19 | 2016-05-11 | 江西合力泰科技有限公司 | Point gum machine workstation |
| CN206425182U (en) * | 2016-12-06 | 2017-08-22 | 鸿利智汇集团股份有限公司 | A kind of point glue equipment |
| CN107399478A (en) * | 2017-08-17 | 2017-11-28 | 江苏瑞合硕电子科技有限公司 | Glue pouring machine heating system |
| CN108724566A (en) * | 2018-05-04 | 2018-11-02 | 深圳市德彩光电有限公司 | The encapsulating die and glue-pouring method of LED light source |
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| CN208930567U (en) * | 2018-08-15 | 2019-06-04 | 深圳市科普特电子有限公司 | A kind of encapsulating die |
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| CN111935917B (en) | 2021-02-26 |
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