CN206425182U - A kind of point glue equipment - Google Patents
A kind of point glue equipment Download PDFInfo
- Publication number
- CN206425182U CN206425182U CN201621330166.0U CN201621330166U CN206425182U CN 206425182 U CN206425182 U CN 206425182U CN 201621330166 U CN201621330166 U CN 201621330166U CN 206425182 U CN206425182 U CN 206425182U
- Authority
- CN
- China
- Prior art keywords
- boss
- scaling powder
- groove
- dispensing
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
A kind of point glue equipment, including cylinder and the more than one dispensing platform being arranged on cylinder, the end face of the dispensing platform, which is provided between the spaced boss of two or more, adjacent lands, forms groove.Utility model works principle：Groove composition Glue dripping head between boss and boss, Glue dripping head not only can cover fluxing agent in lacquer disk(-sc) after viscose glue on the surface of boss, and can also have in groove scaling powder, and scaling powder viscosity is smaller；When the lower end millet cake of Glue dripping head is on substrate, part scaling powder spilling is had on boss, because the scaling powder in the solder resist and groove of boss surface is interconnected, so the solder resist on boss can be involved by the scaling powder in groove, be not in a large amount of scaling powder spillovers, so as to which dispensing is more uniform, because the scaling powder in groove can be used as supplement, it is ensured that die bond region has uniform and enough scaling powder.
Description
Technical field
The utility model is related to LED device, especially a kind of point glue equipment.
Background technology
As shown in figure 1, for the less glue of viscosity or scaling powder, existing LED point glue equipments include cylinder 1, are arranged on
Dispensing platform 2 and the lug boss 3 being arranged on dispensing platform 2 on cylinder 1.Glue dripping head is put into viscose glue in lacquer disk(-sc) during dispensing, then
By the Glue dripping head point after viscose glue on the die bond region of substrate, Glue dripping head is contacted with substrate during due to dispensing, so that being bonded at
Scaling powder on Glue dripping head outwards overflows, so as to the uneven phenomenon of dispensing easily occur；In addition, having put after scaling powder, lift
When Glue dripping head leaves substrate, because the contact area of Glue dripping head is big, the scaling powder of attachment is more and adhesive force is larger, Glue dripping head meeting
The scaling powder of a part is taken away, the scaling powder for finally resulting in die bond region on substrate is on the low side, has a strong impact on follow-up die bond technique
Quality.
The content of the invention
Technical problem to be solved in the utility model is to provide a kind of point glue equipment, and what is overflowed during reduction dispensing helps weldering
Agent, reduces the scaling powder that Glue dripping head is taken away, it is ensured that die bond region has uniform and enough scaling powder.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of point glue equipment, including cylinder and setting
More than one dispensing platform on cylinder, the end face of the dispensing platform is provided with the spaced boss of two or more, adjacent convex
Groove is formed between platform.Utility model works principle：Groove composition Glue dripping head between boss and boss, Glue dripping head is in lacquer disk(-sc)
After middle viscose glue, fluxing agent can be not only covered on the surface of boss, and can also have in groove scaling powder, and scaling powder is glutinous
Degree is smaller；When the lower end millet cake of Glue dripping head is on substrate, part scaling powder spilling is had on boss, due to the resistance of boss surface
Solder flux is interconnected with the scaling powder in groove, so the solder resist on boss can be involved by the scaling powder in groove, no
A large amount of scaling powder spillovers occur, so that dispensing is more uniform, because the scaling powder in groove can be used as supplement, it is ensured that
Die bond region has uniform and enough scaling powder.
Separation trough is formed as an improvement, being provided with altogether between two symmetrically arranged dispensing platforms, two dispensing platforms on cylinder.
As an improvement, the end face of the dispensing platform is rectangle, the boss is elongated and along dispensing platform length direction
Set.
As an improvement, altogether provided with two boss on the end face of dispensing platform.
As an improvement, the height of the boss is identical with the thickness of lacquer disk(-sc).
The beneficial effect that the utility model is brought compared with prior art is：
Due in the scaling powder and groove of boss surface scaling powder be interconnected and scaling powder viscosity it is smaller, so convex
Scaling powder on platform can be involved by the scaling powder in groove, be not in a large amount of scaling powder spillovers, so that dispensing is more
Plus it is uniform, because the scaling powder in groove can be used as supplement, it is ensured that die bond region has uniform enough scaling powders.
Brief description of the drawings
Fig. 1 is prior art point glue equipment structural representation.
Fig. 2 is the utility model structural representation.
Fig. 3 is the schematic diagram after Glue dripping head viscose glue.
Fig. 4 is Glue dripping head distribution schematic diagram.
Embodiment
With reference to Figure of description, the utility model is described in further detail.
As shown in Fig. 2 a kind of point glue equipment, including cylinder 1, the more than one dispensing platform 2 that is arranged on cylinder 1 and set
Put the spaced boss 4 of two or more on the lower surface of dispensing platform 2.Point mucilage binding of the present embodiment mainly for a scaling powder
Put and illustrate, it is low that this point glue equipment can be used for viscosity（Viscosity is less than 18 handkerchiefs glue per second such as at 25 DEG C）Glue
Dispensing operation, altogether provided with two symmetrically arranged dispensing platforms 2 on the cylinder 1 of the present embodiment, two dispensing platforms 2 are arranged on post
Separation trough 7 is formed between the marginal position of body 1, two dispensing platforms 2.As shown in figure 4, the end face of the dispensing platform 2 is rectangle,
Altogether provided with two boss 4 on the end face of dispensing platform 2, the boss 4 is elongated and is set along the length direction of dispensing platform 2, phase
The groove 5 of accommodating crystal-bonding adhesive is formed between adjoint point glue platform 2, groove 5 is elongated, and the groove 5 between boss 4 and boss 4 is constituted
Glue dripping head, two die bond regions of each Glue dripping head correspondence of the present embodiment.The height of the boss 4 is identical with the thickness of lacquer disk(-sc),
Glue dripping head in lacquer disk(-sc) toward during viscose glue, can filling up glue amount in groove 5.
Utility model works principle：As shown in figure 3, Glue dripping head is in lacquer disk(-sc) after viscose glue, not only can be on the surface of boss 4
Fluxing agent is covered, and can also have in groove 5 scaling powder；When the lower end millet cake of Glue dripping head is on substrate, on boss 4
Part scaling powder spilling is had, because scaling powder and the scaling powder in groove 5 on the surface of boss 4 are interconnected, so on boss 4
Glue amount can be involved by the scaling powder in groove 5, be not in a large amount of scaling powder spillovers, so that dispensing is more equal
It is even, because the scaling powder in groove 5 can be used as supplement, it is ensured that die bond region has uniform enough scaling powders.
Claims (5)
1. a kind of point glue equipment, including cylinder and the more than one dispensing platform being arranged on cylinder, it is characterised in that：The point
Jiao Tai end face is provided between the spaced boss of two or more, adjacent lands and forms containing groove.
2. a kind of point glue equipment according to claim 1, it is characterised in that：It is symmetrically arranged provided with two altogether on cylinder
Separation trough is formed between dispensing platform, two dispensing platforms.
3. a kind of point glue equipment according to claim 1, it is characterised in that：The end face of the dispensing platform is rectangle, institute
State boss it is elongated and along dispensing platform length direction set.
4. a kind of point glue equipment according to claim 1, it is characterised in that：It is convex provided with two altogether on the end face of dispensing platform
Platform.
5. a kind of point glue equipment according to claim 1, it is characterised in that：The height of the boss and the thickness phase of lacquer disk(-sc)
Together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621330166.0U CN206425182U (en) | 2016-12-06 | 2016-12-06 | A kind of point glue equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621330166.0U CN206425182U (en) | 2016-12-06 | 2016-12-06 | A kind of point glue equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206425182U true CN206425182U (en) | 2017-08-22 |
Family
ID=59586315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621330166.0U Expired - Fee Related CN206425182U (en) | 2016-12-06 | 2016-12-06 | A kind of point glue equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206425182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935917A (en) * | 2020-09-01 | 2020-11-13 | 潍坊歌尔微电子有限公司 | Product glue filling auxiliary device and glue filling method |
-
2016
- 2016-12-06 CN CN201621330166.0U patent/CN206425182U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111935917A (en) * | 2020-09-01 | 2020-11-13 | 潍坊歌尔微电子有限公司 | Product glue filling auxiliary device and glue filling method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170822 Termination date: 20201206 |