CN218985310U

CN218985310U - Dispensing structure

Info

Publication number: CN218985310U
Application number: CN202222927684.2U
Authority: CN
Inventors: 李贵阳; 吴广忠; 张凯; 陈大浩
Original assignee: Yancheng Gaoce New Energy Technology Co ltd; Qingdao Gaoce Technology Co Ltd
Current assignee: Yancheng Gaoce New Energy Technology Co ltd; Qingdao Gaoce Technology Co Ltd
Priority date: 2022-11-03
Filing date: 2022-11-03
Publication date: 2023-05-09
Anticipated expiration: 2032-11-03

Abstract

The embodiment of the application provides a dispensing structure, include: two end point gum trails and a first middle point gum trails. The two end dispensing tracks are respectively arranged at two ends of the bonding surface along the length direction. The first middle point gum track sets up between two tip point gum tracks, and first middle point gum track includes a plurality of first drainage track sections, and each first drainage track section sets up along the length direction of bonding face at intervals in proper order, and adjacent first drainage track section passes through the second drainage track section to be connected, and first drainage track section extends along the width direction of bonding face, and second drainage track section extends along the length direction of bonding face. The point glued structure of this application has arranged tip point glued orbit and first middle part point glued orbit, and first middle part point glued orbit has arranged first drainage orbit section and the second drainage orbit section of alternate distribution, and messenger's glue solution that can be better evenly distributes full bonding face and bubble-free can obtain stably, and the better bonding quality of intensity has improved production efficiency.

Description

Dispensing structure

Technical Field

The application relates to the technical field of bonding of silicon rods and resin plates, in particular to a dispensing structure.

Background

The prior procedure of bonding the resin plate and the silicon rod together through the glue solution is the slicing procedure of the silicon rod, and at present, the glue solution is mostly manually smeared in the bonding process of the resin plate and the silicon rod, the glue spreading track is unreasonable, and the phenomena of edge breakage, sheet falling and the like of the silicon rod in the slicing process are easily caused. The glue spreading track is unreasonable, and in the compression process of the bonding surface, the phenomenon that glue solution cannot be uniformly distributed on the whole bonding surface or the glue discharging speed is asynchronous and the glue overflowing amount is large occurs, so that the stable bonding quality with high strength is difficult to obtain, and the production efficiency is not beneficial to improvement.

Disclosure of Invention

The embodiment of the application provides a point gum structure to solve traditional manual glue spreading orbit and distribute unreasonably, at the compress tightly in-process of bonding face, the unable whole bonding face of full uniform distribution of glue solution or go out the asynchronous and excessive problem of glue volume of glue speed.

The embodiment of the application provides a point gum structure, include:

two end point glue tracks which are respectively arranged at two ends of the bonding surface along the length direction;

the first middle point gum track, first middle point gum track sets up in two between the tip point gum track, first middle point gum track includes a plurality of first drainage track sections, each first drainage track section sets up along the length direction of bonding face at intervals in proper order, and adjacent first drainage track section passes through second drainage track section and connects, first drainage track section extends along the width direction of bonding face, second drainage track section extends along the length direction of bonding face.

By adopting the technical scheme, the embodiment of the application has the following technical effects:

the point glued structure of this application has arranged tip point glued orbit and first middle part point glued orbit, and first middle part point glued orbit has arranged first drainage orbit section and the second drainage orbit section of alternate distribution, and messenger's glue solution that can be better evenly distributes full bonding face and bubble-free can obtain stably, and the better bonding quality of intensity has improved production efficiency.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:

fig. 1 is a schematic view showing a state in which a glue solution is applied to a resin plate by a glue application device;

FIG. 2 is a schematic view of a pressing mechanism for pressing a silicon rod and a resin plate;

FIG. 3 is a state diagram showing the mutual extrusion of a silicon rod and a resin plate;

fig. 4 is a schematic diagram of a dispensing structure provided in an embodiment of the present application;

fig. 5 is a schematic diagram illustrating division of a dispensing control area on a dispensing structure according to an embodiment of the present disclosure;

fig. 6 is a spray coating step diagram of the dispensing structure provided in the embodiment of the present application;

FIG. 7 is a state diagram showing that the glue solution automatically flows on the resin plate to fill gaps among tracks after the glue dispensing is finished;

fig. 8 is a schematic view showing the spreading of the dope when the silicon rod and the resin plate are extruded.

Reference numerals:

1. an end dispensing track; 2. a first middle dispensing track; 21a, a first side track; 21b, a second side track; 211. a first drainage track segment; 212. a second drainage track segment; 3. a second middle dispensing track; 6. a gluing device; 61. a base; 62. a six-axis robot; 63. dispensing valve; 64. a glue spraying head; 7. a conveying line; 71. stick sticking tool; 72. a resin plate; 73. a crystal support; 8. a compressing mechanism; 9. a silicon rod; a. an adhesive surface; b. a first region; c. a second region; d. a third region; e. and (5) glue solution.

Detailed Description

In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of exemplary embodiments of the present application is given with reference to the accompanying drawings, and it is apparent that the described embodiments are only some of the embodiments of the present application and not exhaustive of all the embodiments. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

The utility model concept of the application is to design a glue dispensing structure, see fig. 2, and is characterized in that an end glue dispensing track 1 and a first middle glue dispensing track 2 are arranged, the first middle glue dispensing track 2 is provided with a first drainage track section 211 and a second drainage track section 212 which are alternately distributed, the second drainage track section 212 can drain glue solution e in the length direction of a bonding surface a, the first drainage track section 211 can drain glue solution e in the width direction of the bonding surface a, in the pressing process of the bonding surface a, the first drainage track section 211 can diffuse the glue solution e to two sides of the bonding surface a in the length direction, the glue solution e can be well distributed on the whole bonding surface a uniformly, no bubbles are generated, stable bonding quality with better strength can be obtained, and production efficiency is improved.

Referring to fig. 4, an embodiment of the present application provides a dispensing structure. Referring to fig. 3, the spot gluing structure is used to glue the resin plate 72 and the silicon rod 9 together. The surface where the resin plate 72 and the silicon rod 9 are bonded is referred to as bonding surface a, and the dispensing structure includes a first middle dispensing trace 2 and two end dispensing traces 1. The two end dispensing tracks 1 are respectively arranged at two ends of the bonding surface a along the length direction. The first middle dispensing track 2 is arranged between the two end dispensing tracks 1, the first middle dispensing track 2 comprises a plurality of first drainage track sections 211, each first drainage track section 211 is sequentially arranged at intervals along the length direction of the bonding surface a, adjacent first drainage track sections 211 are connected through second drainage track sections 212, the first drainage track sections 211 extend along the width direction of the bonding surface a, and the second drainage track sections 212 extend along the length direction of the bonding surface a.

In this embodiment, the end dispensing tracks 1 are distributed at two ends of the bonding surface a along the length direction, and the middle dispensing track is located between the two end dispensing tracks 1, so that the glue solution e is distributed in the length direction of the whole bonding surface a. In this embodiment, the first middle dispensing track 2 is provided with the first drainage track sections 211 and the second drainage track sections 212 which are alternately distributed, the second drainage track sections 212 can drain and distribute the glue solution e in the length direction of the bonding surface a, and the first drainage track sections 211 drain the glue solution e in the width direction of the bonding surface a. Referring to fig. 8, in the pressing process of the bonding surface a, the first drainage track section 211 can drain to the width direction of the bonding surface a, and can diffuse the glue solution e to two sides of the length direction of the bonding surface a, so that the glue solution e can be uniformly distributed on the whole bonding surface a and has no bubbles, stable bonding quality with better strength can be obtained, and the production efficiency is improved.

In one possible embodiment, as shown in connection with fig. 4 and 6, the first drainage track section 211 has an outer end facing away from the second drainage track section 212, the distance between the outer end and the second drainage track section 212 being greater than the distance between the outer end and the length of the adhesive surface a.

In this embodiment, the extension length of each first drainage track section 211 in the width direction of the bonding surface a is longer and is greater than the distance from the end of the first drainage track section 211 to the length edge of the bonding surface a, so that the glue solution e is favorably drained to the length edge of the bonding surface a in the pressing process of the bonding surface a, the glue solution e can be better distributed on the whole bonding surface a uniformly and has no bubbles, and the bonding quality with stable and better strength can be obtained.

In one possible embodiment, the first drainage track segment 211 is any one of a broken line, a straight line, and an arc. The second drainage track segment 212 is a straight line. When the first drainage track section 211 is a broken line, the first drainage track section 211 has two oblique lines, one ends of the two oblique lines are connected to form the outer end portion, the other ends of the two oblique lines are separated, and are respectively connected to the two second drainage track sections 212, and the first drainage track section 211 presents a triangle shape. Referring to fig. 7, before the silicon rod 9 is placed on the bonding surface of the resin plate, the glue solution e will flow on the bonding surface a, so that the gap between two oblique lines is filled, and the glue solution e is uniformly dispersed in the subsequent process of pressing the bonding surface a.

In a possible embodiment, as shown in fig. 4 and fig. 6, the first drainage track sections 211 are disposed at two ends of the first middle dispensing track 2, the first drainage track sections 211 at the end positions are directly connected to the end dispensing track 1, and no second drainage track section is disposed between the first drainage track sections 211 at the end and the end dispensing track 1.

In this embodiment, referring to fig. 4 and 5, the end dispensing trace 1 is used to control the amount of glue in the first region b, and at least one first drainage trace segment 211 of the first middle dispensing trace 2 near the end position of the bonding surface a in the length direction is used to control the amount of glue in the second region c. The other parts of the first middle dispensing trace 2 can control the glue amount of the third area d.

The aim of controlling the adjustment of the glue amount in the corresponding area can be achieved by changing the length and the position size of each glue track. Because the end point glue track 1, the first middle point glue track 2 and the other parts of the first drainage track sections 211 and the first middle point glue track 2, which are close to the end position of the bonding surface a in the length direction, are respectively in corresponding relation with the first area b, the second area c and the third area d, the glue quantity adjustment is relatively quick and simple, and finally, the purposes of ensuring that the glue solution e is paved on the whole bonding surface, avoiding the phenomenon of empty glue, controlling the quantity of glue overflow and controlling the glue quantity are achieved.

In one possible embodiment, the extension direction of the end dispensing trace 1 and the extension direction of the first drainage trace section 211 have an angle.

In this embodiment, the first drainage track section 211 extends along the width direction of the bonding surface a, and the included angle between the extending direction of the end dispensing track 1 and the extending direction of the first drainage track section 211 may be an acute angle, and the end dispensing track 1 extends towards the corner point of the bonding surface a, so that during the pressing process of the bonding surface a, the two sides of the end dispensing track 1 along the vertical extending direction diffuse, so that the glue solution e can be uniformly distributed on the corner point of the bonding surface a.

In a possible embodiment, as shown in fig. 4 and fig. 6, the dispensing structure further includes a second middle dispensing trace 3, where the second middle dispensing trace 3 is disposed between the two end dispensing traces 1, the second middle dispensing trace 3 is disposed at a middle position of the bonding surface a along the width direction, the second middle dispensing trace 3 extends along the length direction of the bonding surface a, and the second drainage trace section 212 is parallel to the second middle dispensing trace 3.

The arrangement of the second middle dispensing trace 3 increases the amount of glue at the middle position of the bonding surface a, and the second middle dispensing trace 3 is positioned between the two end dispensing traces 1 and at the middle position of the bonding surface a along the width direction. In the pressing process of the bonding surface a, the second middle dispensing track 3 supplements the glue amount in the middle of the bonding surface a, is beneficial to filling the glue solution e in the middle of the bonding surface a, and prevents the phenomenon of empty glue in the middle of the bonding surface a.

In one possible embodiment, the first middle dispensing trace 2 includes a first side trace 21a and a second side trace 21b, the first side trace 21a and the second side trace 21b are respectively disposed on two sides of the second middle dispensing trace 3 along the width direction, the first side trace 21a and the second side trace 21b each have a plurality of first drainage trace sections 211, each of the first drainage trace sections 211 is disposed in sequence along the length direction of the bonding surface, the first drainage trace section 211 on the first side trace 21a extends toward one length side of the bonding surface a, and the first drainage trace section 211 on the second side trace 21b extends toward the other length side of the bonding surface. Thus, in the process of compacting the bonding surface a, the first drainage track sections 211 on the two side tracks will drain the glue solution e to the two length edges of the bonding surface a, so as to be beneficial to uniformly distributing the glue solution e on the bonding surface a.

In one possible embodiment, the second middle dispensing trace 3 comprises two parallel flat lines, the two flat lines being connected, the flat lines being parallel to the second drainage trace section 212.

In this embodiment, the second middle dispensing track 3 includes two spaced flat lines, the two flat lines are parallel to each second drainage track segment 212 on the two side tracks, each second drainage track segment 212 is discontinuous, the glue solution amount is limited, the glue solution amount at the middle position of the bonding surface a is increased by arranging two flat lines between the two side tracks, and in the pressing process of the bonding surface a, the glue solution e can be uniformly distributed at the middle position of the bonding surface a by expanding the two flat lines in the width direction of the bonding surface a, so that the glue solution e is uniformly distributed on the bonding surface a.

In one possible embodiment, the end dispensing trace 1 includes two end folding lines disposed along the width direction of the bonding surface a, and two ends of each end folding line are respectively connected with a corresponding flat straight line and a corresponding side trace.

In this embodiment, as shown in fig. 6, the sharp corner of the end folding line extends toward the corner tip of the bonding surface a, and the end folding line includes two oblique lines connected at one end near the corner tip of the bonding surface a and separated at one end far from the corner tip of the bonding surface a. The two end fold lines are respectively connected with the corresponding straight lines and the corresponding side tracks, so that a closed track is formed by enclosing, after dispensing is finished, the glue solution e is fully dispersed in the closed track, and the glue solution can be quickly and uniformly dispersed to the peripheral side in the pressing process of the bonding surface a.

In a possible embodiment, referring to fig. 6, the first middle dispensing trace 2 is respectively connected to the two end dispensing traces 1, the second middle dispensing trace 3 is respectively connected to the two end dispensing traces 1, and the first middle dispensing trace, the second middle dispensing trace 3 and the end dispensing trace 1 are connected to form a closed trace loop.

In this embodiment, the glued structure of point is closed loop structure, and the gluey head of spouting of gluing equipment 6 moves in-process relative bonding face a, keeps spouting the gluey state, need not interrupt spouting gluey, has simplified spouting gluey action, and is showing the improvement spraying efficiency, and the point of drawing glues the orbit more accurate.

In this way, in the glue spraying operation, the glue spraying device 6 can control the glue spraying head to move according to the set closed track, and meanwhile, the glue solution e flows out according to a certain flow in the moving process to form a complete glue dispensing track. The movement sequence of the movement track is shown in fig. 6, the start point and the end point of the dispensing track are at the same position, the start point can be determined according to the track parameters, the dispensing drawing part of the end dispensing track and one side track (such as the first side track 21 a) are firstly drawn by dispensing on one side in the width direction, and then the dispensing part of the end dispensing track and the other side track (such as the second side track 21 b) are drawn by moving to the other side in the width direction of the bonding surface. And finally dispensing the second middle dispensing track at the middle position, finally returning to the initial point position through reciprocating dispensing, and ending the dispensing process. After the spot gluing of the bundles, the glue e will flow itself on the resin plate 72 to fill the gaps between the tracks before placing the silicon rod 9, see fig. 7. The silicon rod 9 is placed on the resin plate 72 after dispensing, and is pressurized, so that the glue solution e mainly flows from the middle position to the periphery, and finally the whole bonding surface is paved, thereby achieving the design purpose.

Referring to fig. 1 to 3, a dispensing operation is generally performed by using a glue dispensing device 6, where the glue dispensing device 6 includes a base 61 and a six-axis robot 62 mounted on the base 61, a glue valve 63 and a glue nozzle 64 are mounted on the front end of the six-axis robot 62, and glue e flows out from the glue nozzle 64 during dispensing. Before the dispensing operation starts, the die holder 73 and the resin plate 72 are positioned and fixed by the stick adhering tool 71 and the positioning device on the conveyor line 7. The track motion of the six-axis robot 62 forms a dispensing track on the upper surface of the resin plate 72, then the six-axis robot 62 places the silicon rod 9 above, and the glue solution e is uniformly spread on the whole bonding surface a through the pressing mechanism 8.

In the description of the present application and its embodiments, it should be understood that the terms "top," "bottom," "height," and the like indicate an orientation or positional relationship based on that shown in the drawings, and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.

In this application and in its embodiments, the terms "disposed," "mounted," "connected," "secured," and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed, unless otherwise explicitly stated and defined as such; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application and in its embodiments, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the present application. The components and arrangements of specific examples are described above in order to simplify the disclosure of this application. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims

1. A dispensing structure, comprising:

2. The dispensing structure of claim 1 wherein the first drainage track segment has an outer end facing away from the second drainage track segment, a distance between the outer end and the second drainage track segment being greater than a distance between the outer end and a length edge of the bonding surface.

3. The dispensing structure of claim 1, wherein the first drainage track segments are disposed at two ends of the first middle dispensing track, and the first drainage track segments at the end positions are directly connected to the end dispensing track.

4. The dispensing structure of claim 1, wherein the direction of extension of the end dispensing trace and the direction of extension of the first drainage trace segment have an included angle.

5. The dispensing structure of claim 1, further comprising a second middle dispensing trace, the second middle dispensing trace being disposed between two of the end dispensing traces, the second middle dispensing trace being disposed at a middle position of the bonding surface along a width direction, the second middle dispensing trace extending along a length direction of the bonding surface;

the second drainage track section is parallel to the second middle dispensing track.

6. The dispensing structure of claim 5, wherein the first middle dispensing trace comprises a first side trace and a second side trace, the first side trace and the second side trace are partially disposed on two sides of the second middle dispensing trace along the width direction, the first side trace and the second side trace each have a plurality of first drainage trace segments, each first drainage trace segment is sequentially disposed along the length direction of the bonding surface, the first drainage trace segment on the first side trace extends toward one length side of the bonding surface, and the first drainage trace segment on the second side trace extends toward the other length side of the bonding surface.

7. The dispensing structure of claim 6, wherein the second central dispensing trace comprises two parallel straight lines, the two straight lines being connected, the straight lines being parallel to the second drainage trace section.

8. The dispensing structure of claim 7, wherein the end dispensing trace includes two end folding lines disposed along a width direction of the bonding surface, and two ends of each of the end folding lines are respectively connected to a corresponding flat straight line and a corresponding side trace.

9. The dispensing structure of claim 5, wherein the first middle dispensing trace is connected to two of the end dispensing traces, the second middle dispensing trace is connected to two of the end dispensing traces, and the first middle dispensing trace, the second middle dispensing trace, and the end dispensing trace are connected to form a closed trace loop.

10. The dispensing structure of claim 1, wherein the first drainage track segment is any one of a fold line, a straight line, and an arc;

the second drainage track section is a straight line.