CN202025753U - LED (light-emitting diode) module - Google Patents
LED (light-emitting diode) module Download PDFInfo
- Publication number
- CN202025753U CN202025753U CN2011200238492U CN201120023849U CN202025753U CN 202025753 U CN202025753 U CN 202025753U CN 2011200238492 U CN2011200238492 U CN 2011200238492U CN 201120023849 U CN201120023849 U CN 201120023849U CN 202025753 U CN202025753 U CN 202025753U
- Authority
- CN
- China
- Prior art keywords
- led module
- led
- wiring board
- module
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The embodiment of the utility model relates to an LED module, a preset quantity of packaging adhesive is injected into adhesive cavities on a holddown by the method of adhesive dispensing, and sequentially passes through first adhesive inlets on the holddown and second adhesive inlets on a circuit board to get into lamp cups of a cover, and first vent holes on the holddown and second vent holes on the circuit board are used for carrying out an auxiliary exhaust function. In addition, the embodiment of the utility model also provides the corresponding LED module and the holddown and the circuit board of the LED module. When the embodiment of the utility model is adopted, the packaging quantity of the adhesive needed by the packaging of the LED module can be controlled in order to carry out the packaging of the LED module, consequently, the waste of the packaging adhesive on the LED module is prevented, a great deal of packaging adhesive for packaging is saved, and thereby the cost of the LED module is greatly reduced.
Description
Technical field
The utility model relates to the LED field, relates in particular to a kind of LED module and pressing plate thereof, wiring board, glue sealing method.
Background technology
(Light Emitting Diode, LED) module is that LED is encapsulated by certain regularly arranged together again to light-emitting diode, adds the product that some water-proofing treatment are formed.The LED module is to use product more widely in the LED product, and there is very big difference in it aspect configuration aspects and electronics, and the LED module generally includes wiring board and the shell that the LED luminescence chip is housed.
LED integrated form module is a kind of as the LED module, it mainly has application at various information display boards, display screen etc., its the most basic feature be with some LED luminescence chip integrated grounds on the wiring board of certain specification through series of processes such as solid crystalline substance, bonding wire, test, sealing and curing after, be packaged into one and satisfy the unified LED module that electrically requires, it generally is made up of the wiring board that has the LED luminescence chip, plastic face mask, packing colloid etc.When the good plastic face mask of secure fit and wiring board are carried out the sealing operation, LED integrated form module mainly adopts the method for encapsulating, earlier a large amount of packing colloids is poured into the cavity in the plastic face mask, this cavity is that some Lamp cups of furnace charge face shield are sealed to form by the high temperature gummed tape stickup, after deaeration (colloid must vacuumizing and defoaming), soak plate operations such as (wiring board soak into acetone), then wiring board is implanted in the packing colloid in the plastic face mask cavity, for avoiding secondary to produce bubble, must cover wiring board fully with abundant packing colloid.
Utility model people is in implementing the utility model process, find that there is following technical problem at least in prior art: owing to adopt the method for above-mentioned encapsulating that LED integrated form module is carried out sealing, it needs a large amount of packing colloids just can finish this procedure, and packing colloid price general charged costliness, the packing colloid that is covered on the wiring board has caused waste, causes the cost of whole LED integrated form module significantly to improve; In addition, the method for above-mentioned encapsulating generally is only applicable to have the wiring board of PIN pin, and it is further integrated that the spacing of PIN pin requires directly to have limited the LED module, so the method for LED encapsulating obviously is not suitable for the LED module of high integration.
The utility model content
The utility model embodiment technical problem to be solved is, a kind of LED module is provided, and significantly to save the used packing colloid of sealing, significantly reduces the cost of LED module, and promotes the integrated of LED module.
For solving the problems of the technologies described above, a kind of LED module is provided, comprise the wiring board that is provided with some LED luminescence chips, cover at described wiring board one side and be provided with the cover body of some Lamp cups, described LED module also comprises the pressing plate that is arranged at described wiring board opposite side, offer some appearance glue chambeies that are used for ccontaining packing colloid on the described pressing plate, bottom surface, described appearance glue chamber is provided with corresponding at least one pixel and is used to guide described packing colloid to enter first glue feeding opening and the first corresponding steam vent thereof of described Lamp cup by described wiring board; Offer second glue feeding opening corresponding on the described wiring board with described first glue feeding opening, and second steam vent corresponding with described first steam vent.
Further, around forming, each holds the glue chamber corresponding to 4 pixels by annular wall in described appearance glue chamber, and its bottom surface is provided with 4 first glue feeding openings and its annular wall outside offers 4 first steam vents.
Further, bottom surface, the described appearance glue chamber tapered projection that makes progress.
Further, described pressing plate is a plastic material.
Further, described wiring board is soft base plate, aluminium base or pcb board.
Further, described LED module is a LED integrated form module, and described cover body is a plastic face mask, and perhaps, described LED module is a LED leaded light module, and described cover body is a light guide plate.
Technique scheme has following beneficial effect at least: by a kind of LED module is provided, can realize to preset quantitative packing colloid and inject appearance glue chamber on the pressing plate in a glue mode, make packing colloid successively by first glue feeding opening on the pressing plate, second glue feeding opening on the wiring board reaches in the Lamp cup of cover body, and finish the auxiliary exhaust function by first steam vent on the pressing plate and second steam vent on the wiring board, like this, may command is to satisfy the required colloid encapsulation amount of LED module sealing, finish the sealing of LED module, thereby avoided on the LED module, producing the waste of packing colloid, significantly save the used packing colloid of sealing, and then significantly reduced the cost of LED module; In addition, adopt the mode of some glue to finish the sealing of LED module, make the LED module can adopt the wiring board of soft base plate, thereby avoided the integrated limited problem of LED module brought because of the requirement of PIN pin spacing, promoted the integrated of LED module greatly.
Description of drawings
Fig. 1 is the plane graph of the LED integrated form module center platen 4 of the utility model embodiment.
Fig. 2 is the profile of Fig. 1 center platen 4 along BB ' line.
Fig. 3 is the plane graph of wiring board 1 of the LED integrated form module of the utility model embodiment.
Fig. 4 is the plane graph of plastic face mask 3 of the LED integrated form module of the utility model embodiment.
Embodiment
As shown in Figures 1 to 4, the utility model embodiment provides a kind of LED integrated form module, it comprises that mainly the wiring board 1(LED luminescence chip that is provided with some LED luminescence chips does not illustrate in the drawings), the pressing plate 4 that covers at wiring board 1 one sides and be provided with the plastic face mask 3 of some Lamp cups 2 and be arranged at wiring board 1 opposite side, offer some appearance glue chambeies 5 that are used for ccontaining packing colloid on the pressing plate 4, appearance 5 bottom surfaces, glue chamber are provided with corresponding to 4 pixels and are used to guide packing colloid to enter first glue feeding opening 6 and the first corresponding steam vent 7 thereof of Lamp cup 2 by wiring board 1; Offer second glue feeding opening 8 corresponding on the wiring board 1 with first glue feeding opening 6, and second steam vent 9 corresponding with first steam vent 7.
With reference to Fig. 2, appearance glue chamber 5 is centered on by annular wall 10 and forms, each holds glue chamber 5 corresponding to 4 pixels (shown in 4 Lamp cups 2 of broken circle correspondence among Fig. 4), and each holds, and 5 bottom surfaces, glue chamber are provided with 4 first glue feeding openings 6 and its annular wall 10 outsides offer 4 first steam vents 7 one to one.
Like this, the glue sealing method of corresponding LED integrated form module, structure based on the LED integrated form module of above-mentioned the utility model embodiment, this method mainly is to be attached to Lamp cup 2 outsides with high temperature gummed tape earlier, to preset quantitative packing colloid again and inject appearance glue chamber 5 from Lamp cup 2 opposite sides in a glue mode, so that packing colloid is once by first glue feeding opening 6, second glue feeding opening 8 reaches in the Lamp cup 2, and finish the auxiliary exhaust function by first steam vent 7 and second steam vent 9, be that equilibrium air pressure makes packing colloid be injected Lamp cup 2, the adhesive tape of tearing after colloid to be packaged solidifies gets final product.
Packing colloid is faster to be injected in 4 Lamp cups 2 that hold glue chamber 5 correspondences more equably in order to make, can design holding 5 bottom surfaces, glue chamber, hold 5 bottom surfaces, the glue chamber tapered projection that makes progress, like this, packing colloid can fast speed be uniformly scattered onto each first glue feeding opening 6 from protrusion tip.
In order to control to satisfy the required colloid encapsulation amount of LED module sealing, finish the sealing of LED module, the default of packing colloid quantitatively is the required minimum colloid encapsulation amount of 4 pixels of holding glue chamber 5 correspondences, like this, avoid on the LED module, producing the waste of packing colloid, significantly saved the used packing colloid of sealing, and then significantly reduced the cost of LED module, especially, when adopting expensive more colloid such as fluorescent glue as packing colloid, the rate of cost reduction is more considerable.
Because LED integrated form module increases pressing plate 4 as one of its parts, therefore, the selection of pressing plate 4 also is directly connected to LED module cost, usually, the pressing plate 4 general plastic materials that adopt, and, therefore, can not cause LED module cost significantly to change even increase pressing plate 4 because plastic material generally likens to the silica gel of packing colloid is cheaply a lot of yet.
As a kind of execution mode, the utility model embodiment carries the LED module and not only is above-mentioned LED integrated form module, it can also be LED leaded light module, LED leaded light module can comprise the structure of above-mentioned similar wiring board 1, pressing plate 4, can also comprise light guide plate in addition as cover body, different is, set LED luminescence chip should be arranged at the edge of LED leaded light module on the wiring board 1, and correspondingly on the light guide plate is provided with the Lamp cup that several are used for the spaced point light source.
As a kind of execution mode, above-mentioned wiring board 1 can be the soft base plate that does not adopt the PIN pin, like this, soft base plate can be derived by flexible wire, thereby avoided the integrated limited problem of LED module brought because of the requirement of PIN pin spacing, promoted the integrated of LED module greatly, certainly, wiring board 1 can also be aluminium base, pcb board or other plate matter.
As a kind of execution mode, above-mentioned pressing plate 4 can be fixed by the fastening mode of screw, or plastic face mask 3 fixes with the mode that pressing plate 4 rivet hots are closed, but is not limited only to this.
Need to prove, the structure of above-mentioned pressing plate 4 can change according to actual needs, for example, it holds 5 bottom surfaces, glue chamber and can first glue feeding opening 6 and first steam vent 7 be provided with corresponding to the pixel of 1,2 or other numbers, accordingly, second glue feeding opening 8 on the wiring board 1 and second steam vent 9 are also corresponding is provided with.
The above is an embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.
Claims (6)
1. LED module, comprise the wiring board that is provided with some LED luminescence chips, cover at described wiring board one side and be provided with the cover body of some Lamp cups, it is characterized in that, described LED module also comprises the pressing plate that is arranged at described wiring board opposite side, offer some appearance glue chambeies that are used for ccontaining packing colloid on the described pressing plate, bottom surface, described appearance glue chamber is provided with corresponding at least one pixel and is used to guide described packing colloid to enter first glue feeding opening and the first corresponding steam vent thereof of described Lamp cup by described wiring board; Offer second glue feeding opening corresponding on the described wiring board with described first glue feeding opening, and second steam vent corresponding with described first steam vent.
2. LED module as claimed in claim 1 is characterized in that, around forming, each holds the glue chamber corresponding to 4 pixels by annular wall in described appearance glue chamber, and its bottom surface is provided with 4 first glue feeding openings and its annular wall outside offers 4 first steam vents.
3. LED module as claimed in claim 2 is characterized in that, bottom surface, the described appearance glue chamber tapered projection that makes progress.
4. LED module as claimed in claim 1 is characterized in that, described pressing plate is a plastic material.
5. LED module as claimed in claim 1 is characterized in that, described wiring board is soft base plate, aluminium base or pcb board.
6. as each described LED module in the claim 1 to 5, it is characterized in that described LED module is a LED integrated form module, described cover body is a plastic face mask, and perhaps, described LED module is a LED leaded light module, and described cover body is a light guide plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200238492U CN202025753U (en) | 2011-01-25 | 2011-01-25 | LED (light-emitting diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200238492U CN202025753U (en) | 2011-01-25 | 2011-01-25 | LED (light-emitting diode) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025753U true CN202025753U (en) | 2011-11-02 |
Family
ID=44850695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200238492U Expired - Fee Related CN202025753U (en) | 2011-01-25 | 2011-01-25 | LED (light-emitting diode) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025753U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461658A (en) * | 2018-03-01 | 2018-08-28 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED encapsulation laminating apparatus and its pressure plate structure |
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
| WO2022188610A1 (en) * | 2021-03-09 | 2022-09-15 | 西安青松光电技术有限公司 | Cob module processing method, cob module, and cob display screen |
-
2011
- 2011-01-25 CN CN2011200238492U patent/CN202025753U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461658A (en) * | 2018-03-01 | 2018-08-28 | 深圳市华星光电半导体显示技术有限公司 | A kind of OLED encapsulation laminating apparatus and its pressure plate structure |
| WO2022188610A1 (en) * | 2021-03-09 | 2022-09-15 | 西安青松光电技术有限公司 | Cob module processing method, cob module, and cob display screen |
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20070117865A (en) | Apparatus and method for manufacturing light emitting unit | |
| CN203311766U (en) | Novel LED nixie tube | |
| CN202025753U (en) | LED (light-emitting diode) module | |
| CN104798214A (en) | Light-emitting device and electronic apparatus including same | |
| CN205881367U (en) | Integrated encapsulation LED display element's packaging hardware | |
| CN102142490B (en) | Method for gluing LED module | |
| CN110600463A (en) | Integrated packaging LED display panel based on chip stacking | |
| CN108417699A (en) | The plastic package die of LED light source | |
| CN103165797A (en) | Preformed phosphor thin film for white light-emitting diode (LED) thin film packaging and preparation method for thin film | |
| CN110808244A (en) | LED display unit surface packaging method based on modeling technology | |
| KR101636516B1 (en) | method of manufacturing LED module having lens | |
| CN202025754U (en) | Circuit board for LED (Light Emitting Diode) module | |
| CN202025752U (en) | Pressure plate used for LED module group | |
| CN104538316B (en) | COB soft packaging method based on multi-chip ultrathin flexible circuit board | |
| CN210628304U (en) | Integrated packaging LED display panel based on chip stacking | |
| CN209133532U (en) | LED encapsulation module | |
| CN201611657U (en) | Encapsulation structure of LED integrated module | |
| CN208570651U (en) | A kind of SMD white light lamp bead structure suitable for outdoor display screen | |
| CN202308062U (en) | Glue injection equipment for light-emitting diode (LED) packaging | |
| CN203839411U (en) | Molding die for carrying out die pressing and integrated packaging on LED light source | |
| CN114334935A (en) | LED backlight source and manufacturing method thereof | |
| CN108269793A (en) | The encapsulating structure of optical module | |
| KR101589700B1 (en) | Method for fabricating Light emitting diode package | |
| CN204834668U (en) | LED support | |
| CN111933759A (en) | Method for preparing surface light source COB by adopting two-color CSP chip and surface light source COB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20130125 |