TW202008494A - Transport mechanism, electronic component manufacturing device and method for manufacturing electronic component comprising a holding mechanism, a first camera, a second camera, and an arithmetic unit - Google Patents

Abstract

The present invention provides a transport mechanism, an electronic component manufacturing device, and a method for manufacturing electronic components. The transport mechanism includes a holding mechanism that is configured to hold and move an object to be transported, a light source, and an optical mark forming section capable of optically forming an optical mark; a first camera, including a first photographing element that is configured to capture the optical mark and a target transport position of the object to be transported; a second camera, including a second photographing element that is configured to capture the target transport position of the object to be transported and the optical mark, wherein the object to be transported is held by the holding mechanism; and an arithmetic unit that is configured to correct a moving distance of the object to be transported to the target transport position based on a relative position offset between the first camera and the second camera.

Description

Carrying mechanism, electronic parts manufacturing device, and electronic parts manufacturing method

The invention relates to a conveying mechanism, an electronic parts manufacturing device and a manufacturing method of electronic parts.

Patent Document 1 (Japanese Patent Laid-Open No. 7-7028) describes a chip bonding apparatus including: a first recognition camera to perform substrate position recognition; and a second recognition camera to perform semiconductor wafer Position recognition; and a correction mechanism for setting the reference position of the first recognition camera and the second recognition camera.

In the wafer bonding apparatus described in Patent Document 1, the reference positions of the first recognition camera and the second recognition camera are set as follows. First, the rod of the correction mechanism is extended to bring the target to a predetermined position and stop. The target is provided with a specific mark of a cross pattern at the same position on both sides of the front and back. The stop position of the target is set as follows: the center intersection of the specific mark reaches below the center of the second recognition camera.

Next, the first recognition camera is moved so that a specific mark, that is, the center intersection of the cross figure is located at the center of the first recognition camera. Thus, the intersection of the center of the first recognition camera, the center of the second recognition camera, and the center of the specific mark is on the same axis. The X-axis position and the Y-axis position at this time are recorded in the memory device as the reference positions of the first recognition camera, the second recognition camera, and the target.

Then, after wafer bonding is performed a predetermined number of times, or after a predetermined time has passed, the relative displacement of the first recognition camera from the reference position and the relative displacement of the second recognition camera from the reference position are detected. Based on these detected relative offsets, the relative offsets of the first recognition camera and the second recognition camera are calculated. Considering that the calculated relative offset is used as a correction amount, the positional relationship between the substrate and the semiconductor wafer is corrected, and wafer bonding is restarted.

However, in the wafer bonding apparatus described in Patent Document 1, it is necessary to provide a movement space including a correction mechanism including a rod member and a target in the setting of the reference positions of the first recognition camera and the second recognition camera, so there is The issue of large-scale installations.

In addition, in the wafer bonding apparatus described in Patent Document 1, the correction mechanism must also be attached to the apparatus, so there is also a problem that the structure of the apparatus is complicated.

According to the embodiments disclosed herein, it is possible to provide a transport mechanism including: a holding mechanism configured to be able to hold the object to be transported and movable; a light source; and an optical mark forming portion that can be optically positioned in the optical path of light emitted from the light source An optical mark is formed on the first camera; the first camera includes a first imaging element, the first imaging element is configured to be capable of photographing an optical mark and a transport target portion of the object to be transported; the second camera includes a second imaging element, the second The imaging element is configured to be able to photograph the conveyed object and the optical mark, the conveyed object is held in the holding mechanism; and the computing mechanism is configured to be corrected to the conveyance target location based on the relative positional offset of the first camera and the second camera The travel distance of the object to be transported.

According to the embodiments disclosed herein, it is possible to provide a transport mechanism including: a holding mechanism configured to be able to hold the object to be transported and movable; a light source; and an optical mark forming portion that can be optically positioned in the optical path of light emitted from the light source An optical mark is formed on the surface; a surface provided with a non-optical mark; a first camera, including a first imaging element, the first imaging element is configured to be able to photograph a transport target portion of the object to be transported, and a non-optical mark; a second camera, including A second imaging element configured to be capable of imaging the conveyed object and the optical mark, the conveyed object is held in the holding mechanism; a third camera including a third imaging element, the third imaging element is configured In order to be able to take an optical mark and a non-optical mark; and a calculation mechanism, it is possible to correct the moving distance of the object to be transported to the target position based on the relative positional offset of the first camera and the second camera.

According to the embodiments disclosed herein, it is possible to provide an electronic part manufacturing apparatus including the conveying mechanism.

According to the embodiments disclosed herein, a method for manufacturing an electronic part can be provided, which includes the steps of: a step of holding a conveyed object by a holding mechanism; a step of optically forming an optical mark; a first imaging using a first camera The step of photographing the optical mark by the element; the step of photographing the optical mark by the second imaging element of the second camera; the step of photographing the carried object by the second imaging element, the carried object is held in the holding mechanism; the photographing by the first imaging element The step of transporting the target part of the object to be transported; the step of calculating the relative positional offset of the first camera and the second camera; based on the relative positional offset, correcting the movement distance of the object to be transported to the target target; and The step of placing the transported object on the transport target.

According to the embodiments disclosed herein, a method for manufacturing an electronic part can be provided, which includes the steps of: a step of holding a conveyed object by a holding mechanism; a step of optically forming an optical mark; a first imaging using a first camera The step of photographing the non-optical mark by the element; The step of photographing the optical mark by the second imaging element of the second camera; The step of photographing the non-optical mark by the third imaging element of the third camera mounted on the holding mechanism; The second imaging element The step of photographing the object to be transported, which is held in the holding mechanism; the step of photographing the transport target part of the object to be transported using the first imaging element; the step of calculating the relative positional offset of the first camera and the second camera A step of correcting the moving distance of the object to be transported to the target position based on the amount of relative position deviation; and a step of placing the object to be transported on the target position of transport.

According to the embodiments disclosed herein, it is possible to provide a conveyance mechanism, an electronic component manufacturing apparatus, and a manufacturing method of an electronic component that can suppress the enlargement of the device and the complexity of the device structure.

The above-mentioned object and other objects, features, aspects, and advantages of the present invention will be clarified by the following detailed description of the present invention understood in association with the drawings.

Hereinafter, the embodiment will be described. In the drawings for explaining the embodiments, the same reference symbols indicate the same parts or corresponding parts.

<Embodiment 1> FIG. 1 shows a schematic plan view of the electronic component manufacturing apparatus of the first embodiment. The electronic component manufacturing apparatus of Embodiment 1 shown in FIG. 1 includes a substrate supply mechanism A, a substrate cutting mechanism B, a washing mechanism C, and a transport mechanism D.

As shown in FIG. 1, the substrate supply mechanism A includes: a substrate loading portion 1 for loading a semiconductor package substrate 5; a substrate supply stage 7 for placing the semiconductor package substrate 5 taken out from the substrate loading portion 1; a package A package in loader 6 is provided for holding the semiconductor package substrate 5 and supplied to the substrate cutting mechanism B; and a rail 6a is provided for the package loading loader 6 to move to the substrate cutting mechanism B.

2 and 3 show schematic side views illustrating an example of the operation of the substrate supply mechanism A. The substrate supply mechanism A operates, for example, as follows. First, as shown in FIG. 2, the semiconductor package substrate 5 loaded on the substrate loading portion 1 is pushed out in the X-axis direction by the substrate pushing member 2 and placed on the substrate supply stage 7. Next, the package located above the semiconductor package substrate 5 in the Z-axis direction is placed in the loader 6 to hold the semiconductor package substrate 5 on the substrate supply table 7. Next, as shown in FIG. 1, the package loading loader 6 moves to the substrate cutting mechanism B along the rail 6 a in the X-axis direction while holding the semiconductor package substrate 5. Then, as shown in FIG. 3, the semiconductor package substrate 5 is placed on the cut table 8 of the substrate cutting mechanism B of the loader 6 below the Z-axis direction. Thus, the operation of the substrate supply mechanism A is completed.

The semiconductor package substrate 5 is finally a cut object that is cut into a plurality of semiconductor packages 5a. The semiconductor package substrate 5 may include, for example, a base material, including a substrate or a lead frame, a semiconductor wafer-like component, respectively mounted on a plurality of areas included in the base material, and a sealing resin to uniformly cover the base material Contains multiple areas. In the first embodiment, as an example, a case where the semiconductor package substrate 5 including the base material 3 and the sealing resin 4 on which a plurality of semiconductor wafer-like components are mounted will be described.

As shown in FIG. 1, the substrate cutting mechanism B includes: a cutting table 8 for placing the semiconductor package substrate 5 before cutting or the semiconductor package 5a after cutting; a rotating mechanism 8a for rotating the cutting table 8 ; A moving mechanism (not shown) for moving the cutting platform 8 and the rotating mechanism 8a; aiming at the camera 8b for confirming the position of the semiconductor package substrate 5 on the cutting platform 8; a rotating shaft 9, including a blade The blade is used to cut off the semiconductor package substrate 5; the washing water spray member 11 is used to spray the washing water to the semiconductor package 5a; and the air spraying member 12 is used to spray the washing water sprayed to the semiconductor package 5a dry.

1 and 4 to 6 show schematic side views illustrating an example of the operation of the substrate cutting mechanism B. The substrate cutting mechanism B operates as follows, for example. First, as shown in FIG. 1, the dicing stage 8 and the rotation mechanism 8 a are moved in the Y-axis direction by a moving mechanism (not shown), and the dicing stage 8 mounts the semiconductor package substrate 5 before cutting. At this time, the position of the semiconductor package substrate 5 on the dicing table 8 is confirmed using the alignment camera 8b.

Next, as shown in FIG. 1, the dicing stage 8 and the rotation mechanism 8 a on which the semiconductor package substrate 5 is placed are moved to the rotation axis 9 in the X-axis direction, and the semiconductor package substrate 5 is rotated by the rotation mechanism 8 a. Next, as shown in FIG. 4, by rotating the rotary shaft 9 to rotate the blade 10, the semiconductor package substrate 5 on the dicing table 8 is cut. Thus, the semiconductor package substrate 5 is singulated to obtain a plurality of semiconductor packages 5a. Each semiconductor package 5a may have a structure including, for example, a base material 3 on which each semiconductor wafer-shaped component is mounted, and a sealing resin 4 covering the semiconductor wafer-shaped component.

Next, as shown in FIG. 5, the washing water spray member 11 is used to spray the washing water onto the substrate 3 side of the singulated semiconductor package 5 a on the dicing table 8. Next, as shown in FIG. 6, by spraying air from the air injection member 12, the washing water sprayed to the base material 3 side of the semiconductor package 5 a is blown off to dry the semiconductor package 5 a. Then, the semiconductor package 5a on the dicing table 8 is moved to the washing mechanism C. Thus, the operation of the substrate cutting mechanism B is completed.

As shown in FIG. 1, the washing mechanism C includes: a package unloader 13 for holding the semiconductor package 5a; a sponge roller 16 for washing the sealing resin 4 side of the semiconductor package 5a; And the air ejection member 17 for drying the semiconductor package 5a.

1, 7 and 8 show schematic side views illustrating an example of the operation of the washing mechanism C. The washing mechanism C operates as described above, for example. First, as shown in FIG. 7, the package unloader 13 holds the semiconductor package 5 a and is pulled up from the dicing table 8 to the Z-axis direction upward. Next, as shown in FIG. 1, the package unloader 13 moves the semiconductor package 5 a in the X-axis direction and moves it upward in the Z-axis direction of the sponge roller 16 and the air injection member 17. Then, as shown in FIG. 8, the sponge roller 16 cleans the sealing resin 4 side of the semiconductor package 5a, and the air injection member 17 sprays air, thereby drying the semiconductor package 5a. Thus, the operation of the washing mechanism C is completed.

As shown in FIG. 1, the transport mechanism D includes: a mark inspection camera 18 for inspecting marks, the mark being the sealing resin 4 printed on the semiconductor package 5 a; and a package inspection camera 19 for inspecting the semiconductor package Base material 3 of 5a; flipper 14 for holding and reversing the semiconductor package 5a; rail 14a for moving the flipper 14; index table 15 for placing borrowed The semiconductor package 5a reversed by the flipper 14; and a moving mechanism (not shown) for moving the indexing table 15.

The transport mechanism D further includes: a holding mechanism 21 for holding and transporting the semiconductor package 5a; a placement member 23 for placing the semiconductor package 5a; a platform 22 for placing the placement member 23; and a moving mechanism (not shown) ) For moving the platform 22; the placement member loader 24 for holding the placement member 23 on which the semiconductor package 5a is placed; the track 25 for moving the placement member loader 24; the placement member loading section 26 for The placement member 23 on which the semiconductor package 5a is loaded is loaded; and the calculation mechanism 27 is configured to be able to correct the semiconductor package 5a that is the object to be transported to the opening 23a of the placement member 23 that is the destination of transportation as described later. Relative movement.

In the first embodiment, as the holding mechanism 21, for example, a suction mechanism that sucks, holds, and transports the semiconductor package 5a can be used. Furthermore, as the arrangement member 23, for example, an adhesive member including a support base such as a metal stencil provided with a plurality of openings 23a and a resin sheet on the support base can be used.

When a suction mechanism is used as the holding mechanism 21, a suction head may be used as a holding member for holding the semiconductor package 5a. At this time, for example, by sucking the gas in the hollow suction head using a vacuum pump (not shown), the semiconductor package 5a can be sucked and held on the end surface of the suction head where the opening is provided.

As the resin sheet used for the adhesive member, for example, a sheet including a resin-made sheet-like base material and an adhesive layer (adhesive layer) including the coating applied to the sheet can be used Adhesive on at least one side of the substrate. As the adhesive, for example, an adhesive (pressure sensitive adhesive) can be used. As the resin sheet, for example, a resin sheet coated with a silicone adhesive on both sides of the polyimide film can be used. Here, in the resin sheet, an adhesive may be applied to at least the surface of the sheet-like substrate on the side where the semiconductor package 5a is adhered to form an adhesive layer, but the sheet-like substrate on the side where the semiconductor package 5a is adhered may also be formed The surface of the material and the surface of the sheet-like substrate on the opposite side are coated with an adhesive to form an adhesive layer. As described above, since the adhesive layer (adhesive layer) is provided on at least the arrangement surface of the semiconductor package 5a of the resin sheet, the semiconductor package 5a can be adhered to the arrangement member 23 as the adhesion member.

Hereinafter, referring to FIGS. 9 to 19 and FIGS. 24( a) to 24 (d ), an example of the operation of the transport mechanism D will be illustrated. First, as shown in the schematic side view of FIG. 9, the package unloader 13 holds the semiconductor package 5 a and moves it up to the Z-axis direction of the mark inspection camera 18 using the sponge roller 16. The semiconductor package after washing and drying by the air injection member 17. Next, the mark inspection camera 18 confirms whether the mark of the sealing resin 4 printed on the semiconductor package 5a is appropriate.

Next, as shown in the schematic side view of FIG. 10, the package unloader 13 moves in the X-axis direction and moves up to the Z-axis direction of the flipper 14, and the semiconductor package 5a is lowered downward in the Z-axis direction. It is placed on the flipper 14. Next, as shown in the schematic side view of FIG. 11, the semiconductor package 5 a is reversed by rotating the inverter 14. At this time, the inverter 14 holds the semiconductor package 5a so that the base 3 side of the semiconductor package 5a faces downward in the Z-axis direction.

Next, as shown in FIG. 1, the flipper 14 moves along the rail 14 a in the X-axis direction, and as shown in the schematic side view of FIG. 12, the semiconductor package 5 a is transported above the Z-axis direction of the camera 19 for package inspection until. Next, the camera 19 for package inspection inspects the base material 3 of the semiconductor package 5 a. When the base material 3 is, for example, a substrate, the camera 19 for package inspection checks, for example, the position, number, and shape of solder balls. In addition, when the base material 3 is, for example, a lead frame, the camera 19 for package inspection checks the position, number, and shape of the leads, for example. Next, as shown in FIG. 1, the flipper 14 moves along the rail 14 a in the X-axis direction up to the Z-axis direction of the indexing table 15, and as shown in the schematic side view of FIG. 13, the semiconductor package 5 a is loaded. Place on the indexing platform 15.

Next, as shown in FIG. 1, the calculation mechanism 27 moves the indexing table 15 on which the semiconductor package 5 a is mounted to the holding mechanism 21 side in the Y-axis direction, and moves the holding mechanism 21 to the indexing direction in the X-axis direction. Platform 15 side. Thus, as shown in the schematic side view of FIG. 14, the holding mechanism 21 is located above the semiconductor package 5 a on the index table 15 in the Z-axis direction. In the X-axis direction of the index table 15, the second camera 102 including the second imaging element 41 is arranged. In the X-axis direction of the second camera 102, the arrangement member 23 is arranged. The first camera 101 including the first imaging element 31 is mounted on the holding mechanism 21. In addition, in Embodiment 1, as the arrangement member 23, a sheet is used that includes a resin-made sheet-like base material 72 and an adhesive layer (adhesive layer) 71, and the adhesive layer (adhesive layer) 71 is an adhesive agent coated on at least one side of the sheet-like substrate 72. In the arrangement member 23, an opening 23a is provided, and the opening 23a becomes a transport target site in the first embodiment.

Next, as shown in the schematic side view of FIG. 15, the arithmetic mechanism 27 moves the holding head 21 a of the holding mechanism 21 downward in the Z-axis direction and causes the holding head 21 a to hold the semiconductor package 5 a, which in the embodiment 1 becomes the object to be transported. Then, as shown in FIG. 14, the calculation mechanism 27 causes the holding head 21 a to pull the semiconductor package 5 a upward in the Z-axis direction. In addition, for convenience of explanation, FIG. 14 shows the case where the holding mechanism 21 holds only one semiconductor package 5a, but it is not limited to the above case, and as shown in FIG. 15, it is also possible to hold multiple semiconductor packages at the same time.体5a。 5a.

Next, as shown in the schematic side view of FIG. 16, the calculation mechanism 27 moves the holding mechanism 21 holding the semiconductor package 5 a from the Z axis direction upward of the semiconductor package 5 a toward the Z axis direction upward of the arrangement member 23 in the X axis Move in the direction. At this time, for example, as shown in the schematic side view of FIG. 16, the computing mechanism 27 causes the second imaging element 41 of the second camera 102 to capture the semiconductor package 5a held by the holding mechanism 21 from below in the Z-axis direction to obtain Image of the semiconductor package 5a. The arithmetic unit 27 sends the data of the image of the semiconductor package 5 a captured by the second imaging element 41 to the arithmetic unit 27.

Next, as shown in the schematic side view of FIG. 17, the calculation mechanism 27 moves the holding mechanism 21 in the X-axis direction from above the Z-axis direction of the first imaging element 41 toward above the Z-axis direction of the arrangement member 23. Then, for example, the calculation mechanism 27 causes the first imaging element 31 of the first camera 101 attached to the holding mechanism 21 to capture the opening 23a from above the Z-axis direction, and acquires an image of the opening 23a. The arithmetic unit 27 also sends the data of the image of the opening 23 a acquired by the first imaging element 31 to the arithmetic unit 27.

In the above, the case has been described in which the arithmetic unit 27 acquires the image of the opening 23a using the first imaging element 31 of the first camera 101 after acquiring the image of the semiconductor package 5a using the second imaging element 41 of the second camera 102 Like, but it is also possible to reverse the order of acquiring images of the first imaging element 31 and the second imaging element 41, after acquiring the image of the opening 23a using the first imaging element 31, then acquiring the semiconductor package 5a using the second imaging element 41 Image.

Next, the arithmetic unit 27 calculates the amount of positional deviation between the second camera 102 and the semiconductor package 5a based on the image of the semiconductor package 5a captured by the second imaging element 41, and based on the opening 23a captured by the first imaging element 31 Image, the amount of positional deviation between the first camera 101 and the opening 23a is calculated.

The calculation of the positional offset of the second camera 102 and the semiconductor package 5a can be performed by, for example, the following method: calculating, for example, the center between the light incident portion of the second camera 102 and the center of the semiconductor package 5a as The distance in the X-axis direction of the first direction and, for example, the distance in the Y-axis direction as a second direction different from the first direction, the semiconductor package 5a is photographed from below the Z-axis direction by the second imaging element 41 .

The calculation of the positional offset of the first camera 101 and the opening 23a can be performed, for example, by calculating the distance in the X-axis direction between the center of the light incident portion of the first camera 101 and the center of the opening 23a And the distance in the Y-axis direction, the opening 23a is imaged from above in the Z-axis direction by the first imaging element 31.

Next, the calculation mechanism 27 uses the positional shift amounts of the second camera 102 and the semiconductor package 5 a calculated in the X-axis direction and the Y-axis direction, and the first camera 101 and the opening 23 a at the X The amount of positional displacement in the axial direction and the Y-axis direction, for example, corrects the design movement distances in the X-axis direction and the Y-axis direction from the semiconductor package 5a to the opening 23a, and calculates the X-axis direction and the Y-axis direction respectively The actual moving distance in the Y-axis direction. In addition, the design movement distances of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction can be, for example, the following calculations in the X-axis direction and the Y-axis direction, respectively. The moving distance is considered to be a moving distance necessary for accurately placing the center of the semiconductor package 5a as the object to be conveyed in the center of the opening 23a as the target portion of the conveyance. Furthermore, instead of using the design movement distance for correction, for example, based on the values measured in advance by the first camera 101 and the second camera 102 (for example, from the center of the holding head 21a before holding the semiconductor package 5a to The moving distance to the center of the opening 23a, or the moving distance calculated in the previous measurement, etc.) corrects the moving distances of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction, respectively.

Next, the calculation mechanism 27 moves the semiconductor package 5a in the X-axis direction and the Y-axis direction only by the following movement distance by the holding mechanism 21, that is, the movement calculated in the X-axis direction and the Y-axis, respectively, as described above The actual moving distance in the direction, as shown in the schematic side view of FIG. 18, moves above the Z axis direction of the opening 23a.

For example, when the semiconductor package 5a is a ball grid array (BGA) semiconductor package, and a ball electrode (not shown) is provided on one surface of the semiconductor package 5a, the one close to the semiconductor package 5a A ball electrode is provided at the periphery, so that the distance from the ball electrode of the semiconductor package 5a to the periphery may become very short. In this case, the ball electrode must be accommodated in the opening 23a, and the short distance from the ball electrode to the periphery of the semiconductor package 5a must be provided outside the opening 23a. Case.

Then, for example, as shown in the schematic cross-sectional view of FIG. 19, the calculation mechanism 27 lowers the semiconductor package 5 a held by the holding head 21 a downward in the Z-axis direction so that the semiconductor package 5 a is accommodated in the opening 23 a. This completes the transportation of the semiconductor package 5a to the opening 23a.

However, due to the temperature environment of the electronic component manufacturing apparatus and the transport mechanism D, the processing variation of each component, and the assembly variation of the component, etc., a relative positional shift may occur between the first camera 101 and the second camera 102. Therefore, in order to more accurately align the position of the semiconductor package 5a with respect to the opening 23a, there may be a case where the relative positional offset between the first camera 101 and the second camera 102 must be further considered.

Hereinafter, referring to FIGS. 20 to 23, an example of a method of calculating the relative positional offset between the first camera 101 and the second camera 102 in Embodiment 1 will be described. First, as shown in the schematic side view of FIG. 20, the arithmetic mechanism 27 moves the holding mechanism 21 upward in the Z-axis direction of the platform 22 on which the placement member 23 is placed.

As shown in the schematic partial perspective side view of FIG. 20, the first camera 101 is mounted on the holding mechanism 21. The first camera 101 includes, for example, a first imaging element 31, a first light source 32, an optical mark forming portion 33 including a light-transmitting portion 33a and a light-shielding portion 33b, a first lens 34 with a unit conjugate ratio design, a second lens 35, and a half镜(half mirror)36. As the optical mark forming portion 33, for example, a member having a circular hole in the center can be used. In addition, the unit conjugate ratio design refers to a design in which light emitted from an object located at a finite position that is not infinity is collected at a certain point through an optical system.

The computing mechanism 27 can cause the first light source 32 to emit light 38. The light 38 emitted from the first light source 32 passes through the optical mark forming portion 33, is reflected by the half mirror 36 to the side of the platform 22, and enters the surface 22a of the platform 22 through the first lens 34. At this time, the optical mark 37 is optically formed on the surface 22a of the platform 22 that becomes the optical path of the light 38.

The optical mark forming unit 33 is, for example, arranged to be movable within the first camera 101 along the optical path of the light 38 emitted from the first light source 32. Therefore, by moving the optical mark forming unit 33 by the arithmetic mechanism 27, the first imaging element 31 can capture the optical mark 37 with the center of the optical mark 37 in focus, for example. In other words, by moving the optical mark forming unit 33, the focus adjustment (focusing) of the optical mark 37 can be performed.

The arithmetic mechanism 27 causes the first imaging element 31 to pass through the first lens 34, the half mirror 36, and the second lens 35 to capture the optical mark 37 to obtain an image of the optical mark 37, which is optically formed on the platform 22的面22a。 22 face 22a. The arithmetic unit 27 sends the data of the image of the optical mark 37 acquired by the first imaging element 31 to the arithmetic unit 27. Furthermore, in the electronic component manufacturing apparatus of the first embodiment, the optical system as the optical path of the light 38 includes the half mirror 36, the first lens 34, and the second lens 35.

In FIG. 21, a schematic plan view showing an example of the image of the optical mark 37 captured by the first imaging element 31. As shown in FIG. 21, the optical mark 37 includes a bright part 39 and a dark part 40. The bright portion 39 has a shape corresponding to the shape of the light-transmitting portion 33 a that transmits the light 38 of the optical mark forming portion 33. The dark portion 40 has a shape corresponding to the shape of the light shielding portion 33b, which is a portion that blocks the light 38 of the optical mark forming portion 33. By using the first lens 34 designed with a unit conjugate ratio, the boundary between the bright portion 39 and the dark portion 40 of the optical mark forming portion 33 can be made clear.

Then, based on the image of the optical mark 37 captured by the first imaging element 31, the arithmetic unit 27 calculates the first positional offset amount, which is the amount of positional offset between the first camera 101 and the optical mark 37. The first position offset between the first camera 101 and the optical mark 37 can be calculated, for example, by calculating the X between the center of the light incident portion 101a of the first camera 101 and the center of the optical mark 37 For the distance in the axis direction and the distance in the Y axis direction, the optical mark 37 is captured by the first imaging element 31 from above in the Z axis direction.

Next, as shown in the partial perspective side view of FIG. 22, the arithmetic mechanism 27 moves the holding mechanism 21 to which the first camera 101 is mounted upward in the Z-axis direction of the second camera 102. The second camera 102 includes, for example, a second imaging element 41, a third lens 42, a fourth lens 43, a mirror 44 and an illumination 45.

Next, the arithmetic unit 27 causes the first light source 32 of the first camera 101 to emit light, and optical marks 37 are optically formed in the optical path between the first camera 101 and the second camera 102.

Next, as shown in FIG. 22, the arithmetic unit 27 causes the second imaging element 41 of the second camera 102 to capture the optical mark 37 from below the Z-axis direction.

That is, the light 38 emitted from the first light source 32 passes through the optical mark forming portion 33, is reflected by the half mirror 36 to the second camera 102 side, and passes through the first lens 34 to form the optical mark 37 optically. Then, the light 38 enters the reflecting mirror 44 from the light incident portion 102 a of the second camera 102 and reflects to the second imaging element 41 side, passes through the fourth lens 43 and the third lens 42, and enters the second imaging element 41. Thus, the second imaging element 41 captures the optical mark 37 from below the Z-axis direction, and acquires an image of the optical mark 37, which is optically in the optical path between the first camera 101 and the second camera 102 form. The arithmetic unit 27 sends the data of the image of the optical mark 37 acquired by the second imaging element 41 to the arithmetic unit 27. Furthermore, in the electronic component manufacturing apparatus of the first embodiment, the optical system in the optical path of the light 38 includes the half mirror 36, the first lens 34, the reflecting mirror 44, the fourth lens 43, and the third lens 42.

FIG. 23 is a schematic plan view showing an example of the image of the optical mark 37 captured by the second imaging element 41. As shown in FIG. 23, the optical mark 37 includes a bright part 46 and a dark part 47. The bright portion 46 has a shape corresponding to the shape of the light transmitting portion 33a of the optical mark forming portion 33. The dark portion 47 has a shape corresponding to the shape of the light shielding portion 33b of the optical mark forming portion 33.

Next, based on the image of the optical mark 37 captured by the second imaging element 41, the arithmetic unit 27 calculates the second positional offset amount, which is the amount of positional offset between the second camera 102 and the optical mark 37. The second position offset of the second camera 102 and the optical mark 37 can be calculated, for example, by calculating the center of the light incident portion 102a of the second camera 102 and the optical mark 37 captured by the second imaging element 41 The distance in the X axis direction and the distance in the Y axis direction between the centers of.

Next, the arithmetic unit 27 calculates the difference between the first camera 101 and the second camera 102 based on the first positional offset between the first camera 101 and the optical mark 37 and the second positional offset between the second camera 102 and the optical mark 37. Relative position offset.

Furthermore, when the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 captured by the second imaging element 41 do not exist on the coaxial axis extending in the Z-axis direction, it is preferable that the first camera 101 moves so that these centers are on the same axis. At this time, the second positional offset between the second camera 102 and the optical mark 37 can be set to zero. Therefore, the relative positional offset between the first camera 101 and the second camera 102 calculated by the calculation mechanism 27 can be equal to the first The first position offset of the camera 101 and the optical mark 37. The position of the first camera 101 when the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 exist on the coaxial axis extending in the Z-axis direction as described above can be used as a temporary reference position to be described later. Correction of the moving distance of the object to be transported to the target location.

FIG. 24( a) shows an example of a state where the first camera 101 and the second camera 102 are located at the temporary reference position. First, the arithmetic unit 27 moves the first camera 101 and the second camera 102 to the temporary reference position. The temporary reference position is, for example, the design in the X-axis direction when the center of the light incident portion 101a of the first camera 101 and the center of the light incident portion 102a of the second camera 102 exist on the coaxial 103 extending in the Z-axis direction s position. At the temporary reference position in the first embodiment, actually, the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 are not located on the coaxial 103 extending in the Z-axis direction, and the calculation mechanism 27 calculates The relative positional offset of the first camera 101 and the second camera 102 in the X-axis direction is ΔX ₀ . Let the position in the X-axis direction of the center of the light incident portion 101a of the first camera 101 at the temporary reference position be P ₁ X. Furthermore, in this example, the holding mechanism 21 has pulled up from the indexing table 15 and held the semiconductor package 5a.

Next, as shown in FIG. 24( b ), the calculation mechanism 27 moves the first camera 101 from the temporary reference position in the X-axis direction by only the distance L1. The distance L1 is, for example, the design distance in the X-axis direction from the temporary reference position to the design position such that the center of the light incident portion 102a of the second camera 102 is as shown in FIG. 24(b ) Shows the center of the central semiconductor package 5a on the coaxial axis extending in the Z-axis direction. If the position in the X-axis direction of the center of the light incident portion 101a of the first camera 101 at this time is P ₂ X, the equation of P ₂ X=P ₁ X+L1 holds.

At this time, the second imaging element 41 of the second camera 102 photographs the semiconductor package 5a held by the holding mechanism 21 from the Z-axis direction downward. The data of the image of the semiconductor package 5 a captured by the second imaging element 41 is sent to the arithmetic unit 27. Thereby, the arithmetic unit 27 can calculate the position in the X-axis direction of the center of the light incident portion 102a of the second camera 102 and the center of the semiconductor package 5a from the image of the semiconductor package 5a captured by the second imaging element 41 Offset ΔX ₁ . Thereby, the calculation mechanism 27 can grasp the actual center position of the semiconductor package 5a (object to be conveyed).

Next, as shown in FIG. 24( c ), the calculation mechanism 27 moves the first camera 101 from the temporary reference position in the X-axis direction to a position at a distance L2. The distance L2 is, for example, the design distance from the temporary reference position to the design position in the X-axis direction such that the center of the light incident portion 101a of the first camera 101 is designed The center of the opening 23a shown in FIG. 24(c) exists on the same axis extending in the Z-axis direction. If the position of the center of the light incident portion 101a of the first camera 101 in the X-axis direction at this time is P ₃ X, then the equation of P ₃ X=P ₁ X+L2 holds.

At this time, the first imaging element 31 of the first camera 101 captures an opening 23a from above the Z-axis direction, which is an example of the transport target portion of the semiconductor package 5a, which is an example of the object to be transported. The data of the image of the opening 23a captured by the first imaging element 31 is sent to the arithmetic unit 27. Therefore, the computing mechanism 27 can calculate the positional deviation amount ΔX ₂ in the X-axis direction of the center of the light incident portion 101 a of the first camera 101 and the center of the opening 23 a from the image of the opening 23 a captured by the first imaging element 31. . In addition, from this, the calculation mechanism 27 can grasp the actual center position of the opening 23 a (transport target portion).

Next, as shown in FIG. 24( d ), the arithmetic mechanism 27 moves the semiconductor package 5 a from the temporary reference position to a distance of only L3 in the X-axis direction by the holding mechanism 21 on which the first camera 101 is mounted position.

Here, the calculation mechanism 27 calculates the distance L3 as follows, for example. By adding the distance L1 and the distance L2, the design moving distance L3' in the X-axis direction from the semiconductor package 5a as the object to be transported at the temporary reference position to the opening 23a is calculated (=L1+L2), said opening 23a becomes a conveyance target part. The design moving distance L3' is, for example, the design moving distance from the temporary reference position to the following design position in the X-axis direction, which is shown in FIG. 24 ( The center of the central semiconductor package 5a shown in b) and the center of the opening 23a shown in FIG. 24(c) exist on the same axis extending in the Z-axis direction.

Then, the relative displacement amount ΔX ₀ , the displacement amount ΔX ₁ and the displacement amount ΔX ₂ calculated above are respectively added or divided to correct the designed moving distance L3 ′. Thereby, the actual movement distance L3 in the X-axis direction of the semiconductor package 5a as the object to be transported at the temporary reference position in the X-axis direction to the opening 23a, which becomes the transfer target site, can be calculated. In other words, it is possible to calculate the moving distance until the semiconductor package 5a (object to be transported) captured by the second camera 102 moves to the opening 23a which is the transport target.

By moving the semiconductor package 5a to the following position, it is possible to achieve a more accurate positional alignment of the semiconductor package 5a as the object to be transported in the X-axis direction with respect to the opening 23a to be the transfer target portion, the position being A position separated from the temporary reference position in the X-axis direction by the actual movement distance L3 calculated only as described above. By performing the same operation in the Y-axis direction as in the X-axis direction, a more accurate positional alignment of the semiconductor package 5a in the Y-axis direction relative to the opening 23a can be achieved. After the alignment as described above, by actually placing the semiconductor package 5a in the opening 23a, the semiconductor package 5a can be placed in a more accurate position of the opening 23a. In addition, the openings of the semiconductor package and the arrangement member held by the holding mechanism other than the semiconductor package 5a and the opening 23a may be treated in the same manner, and the corresponding semiconductor packages may be placed on Accurate location.

Then, as shown in FIG. 1, the stage 22 moves in the Y-axis direction, and the arrangement member 23 in a state where the semiconductor package 5 a is placed in each of the plurality of openings 23 a moves to the arrangement member loader 24. The placement member loader 24 moves in the X-axis direction along the rail 25 while holding the placement member 23, and the placement member 23 on which the semiconductor package 5 a is placed is placed in the placement member loading portion 26. In addition, the above is the correction of the moving distance of the conveyed object to the conveying target part based on the designed moving distance, position, etc., but it is not limited to this, for example, it may be based on the first camera 101 and the second The value measured by the camera 102 (for example, the center of the light incident portion 101a of the first camera 101 and the center of the light incident portion 102a of the second camera 102 exist at the actually measured position on the coaxial extending in the Z-axis direction, from the holding semiconductor package The distance from the center of the holding head 21a before the body 5a to the opening 23a, or the position and distance calculated in the previous measurement, etc.) are corrected for the moving distance of the object to be transported to the transport target.

As described above, in the electronic component manufacturing apparatus of the first embodiment, the optical mark 37 formed optically is used for aligning the position of the semiconductor package 5a and the opening 23a. Therefore, in the electronic component manufacturing apparatus of the first embodiment, for example, it is not necessary to provide a moving space of a jig such as a correction mechanism such as a rod and a target in the transport path of the object to be transported in the apparatus, so it is possible to suppress the enlargement of the apparatus . In addition, in the electronic component manufacturing apparatus of the first embodiment, it is not necessary to attach a jig including a correction mechanism including a rod and a target to the device, and therefore, it is possible to suppress the complexity of the structure of the device.

<Embodiment 2> The electronic component manufacturing apparatus of Embodiment 2 is characterized by including a third camera including a third imaging element 51 in addition to the first camera 201 including the first imaging element 31 and the second camera 202 including the second imaging element 41 203. Hereinafter, an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus according to Embodiment 2 will be described with reference to the schematic plan views of FIGS. 25 to 29.

FIG. 25 shows the basic structure of the transport mechanism of the electronic component manufacturing apparatus according to the second embodiment. In the holding mechanism 21, in addition to the first camera 201, a third camera 203 is installed. The holding mechanism 21 can move in the X-axis direction as the first direction. In addition, the holding mechanism 21 includes a holding head 21a configured to be able to hold the semiconductor package 5a.

The second camera 202 can move in the Y-axis direction as the second direction. The second camera 202 can be located coaxially with the third camera 203 extending in the Z-axis direction, but due to limitations of the device, it cannot be located coaxially with the first camera 201 extending in the Z-axis direction. In addition, the platform 22 can only move in the Y-axis direction, and a non-optical mark 48 is provided on the surface 22 a of the platform 22 on the side where the placement member 23 is placed.

In the second embodiment, too, first, similar to the first camera 101 in the first embodiment, the calculation mechanism 27 moves the third camera 203 upward in the Z-axis direction of the stage 22 to form an optical mark 37 on the surface 22 a of the stage 22. Next, the arithmetic unit 27 causes the third imaging element 51 of the third camera 203 to capture the optical mark 37 to obtain an image of the optical mark 37. Next, the arithmetic unit 27 sends the data of the image of the optical mark 37 acquired by the third imaging element 51 to the arithmetic unit 27. Then, based on the image of the optical mark 37 acquired by the third imaging element 51, the arithmetic unit 27 calculates the first positional offset amount, which is the amount of positional offset between the third camera 203 and the optical mark 37.

Next, as shown in FIG. 26, the arithmetic mechanism 27 moves the third camera 203 in the X-axis direction and moves the second camera 202 in the Y-axis direction so that the third camera 203 is positioned above the second camera 202 in the Z-axis direction. In this case, the moving distance of the third camera 203 in the X-axis direction and the moving distance of the second camera 202 in the Y-axis direction can be, for example, the following design distances, which become the third camera 203 The center of the light incident portion of φ and the center of the light incident portion of the second camera 202 exist on coaxial positions extending in the Z-axis direction.

Next, similarly to the first camera 101 and the second camera 102 of the first embodiment, the arithmetic unit 27 optically forms an optical mark 37 on the optical path between the third camera 203 and the second camera 202 to make the second camera 202 The second imaging element 41 captures the optical mark 37 from below the Z-axis direction, thereby acquiring data of the image of the optical mark 37. Next, the arithmetic unit 27 sends the data of the image of the optical mark 37 acquired by the second imaging element 41 to the arithmetic unit 27. Then, based on the image of the optical mark 37 acquired by the second imaging element 41, the arithmetic unit 27 calculates the second positional offset amount, which is the amount of positional offset between the second camera 202 and the optical mark 37.

By calculating the first position shift amount and the second position shift amount by the arithmetic unit 27, it can be determined that the center of the light incident portion of the third camera 203 and the center of the light incident portion of the second camera 202 exist in the Z-axis direction The extended coaxial position is the position of the third camera 203 in the X-axis direction and the actual position of the second camera 202 in the Y-axis direction.

Next, as shown in FIG. 27, the calculation mechanism 27 moves the stage 22 in the Y-axis direction and moves the first camera 201 in the X-axis direction so that the first camera 201 is positioned above the Z-axis direction of the non-optical mark 48. The non-optical mark 48 is provided on the surface 22 a of the platform 22. At this time, the moving distance of the platform 22 in the Y-axis direction and the moving distance of the first camera 201 in the X-axis direction may be, for example, the following design distances, which become the light of the first camera 201 The center of the incident portion and the center of the non-optical mark 48 exist on the coaxial axis extending in the Z-axis direction, and the non-optical mark 48 is provided on the surface 22 a of the platform 22.

Next, the arithmetic unit 27 captures the image of the non-optical mark 48 by causing the first imaging element 31 of the first camera 201 to capture the non-optical mark 48 from above the Z-axis direction. Next, the arithmetic unit 27 sends the data of the image of the non-optical mark 48 acquired by the first imaging element 31 to the arithmetic unit 27. Then, based on the image of the non-optical mark 48 acquired by the first imaging element 31, the arithmetic unit 27 calculates the third positional deviation between the first camera 201 and the non-optical mark 48. In other words, the computing mechanism 27 calculates the position of the first camera 201 in the X-axis direction and the actual position of the stage 22 in the Y-axis direction, and the position of the first camera 201 in the X-axis direction and the stage 22 in the Y-axis direction The actual position of is the position where the center of the light incident portion of the first camera 201 and the center of the non-optical mark 48 exist on the same axis extending in the Z-axis direction.

Next, as shown in FIG. 28, the calculation mechanism 27 moves the stage 22 in the Y-axis direction and moves the third camera 203 in the X-axis direction so that the third camera 203 is positioned above the Z-axis direction of the non-optical mark 48. The non-optical mark 48 is provided on the surface 22 a of the platform 22. At this time, the moving distance of the platform 22 in the Y-axis direction and the moving distance of the third camera 203 in the X-axis direction can be, for example, the following design distances, which are the distances of the third camera 203 The center of the light incident portion and the center of the non-optical mark 48 exist on the coaxial position extending in the Z-axis direction.

Next, the arithmetic unit 27 captures the image of the non-optical mark 48 by causing the third imaging element 51 of the third camera 203 to capture the non-optical mark 48 from above the Z-axis direction. Next, the arithmetic unit 27 sends the data of the image of the non-optical mark 48 acquired by the third imaging element 51 to the arithmetic unit 27. Then, the arithmetic unit 27 calculates the fourth positional offset of the third camera 203 and the non-optical mark 48 from the image of the non-optical mark 48 acquired by the third imaging element 51. In other words, the computing mechanism 27 calculates the position of the third camera 203 in the X-axis direction and the actual position of the stage 22 in the Y-axis direction, and the position of the third camera 203 in the X-axis direction and the stage 22 in the Y-axis direction The actual position of is the position where the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48 exist on the same axis extending in the Z-axis direction.

The arithmetic unit 27 can calculate the relative positional relationship between the first camera 201 and the third camera 203 based on the third positional deviation amount and the fourth positional deviation amount calculated as described above. For example, by acquiring the position of the first camera 201 in the X-axis direction and the position of the stage 22 in the Y-axis direction, and the position of the third camera 203 in the X-axis direction and the position of the stage 22 in the Y-axis direction Difference, the calculation mechanism 27 can calculate the distance in the X axis direction and the distance in the Y axis direction between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the third camera 203. The position in the X axis direction and the position in the Y axis direction of the stage 22 become the positions where the center of the light incident portion of the first camera 201 and the center of the non-optical mark 48 exist on the coaxial axis extending in the Z axis direction, The position of the third camera 203 in the X axis direction and the position of the stage 22 in the Y axis direction become the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48 exist on the coaxial axis extending in the Z axis direction s position.

In addition, when the computing mechanism 27 can calculate the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the third camera 203, the first camera can be calculated The relative positional offset between the center of the light incident portion of 201 and the center of the light incident portion of the second camera 202 in the X-axis direction and the Y-axis direction with respect to the design position, respectively. That is, in Embodiment 2, the arithmetic unit 27 can perform the position alignment of the first camera 201 and the second camera 202 by performing the position alignment of the second camera 202 and the third camera 203.

As described above, the calculation mechanism 27 calculates the relative positional deviation between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202 in the X-axis direction and the Y-axis direction, respectively After the measurement, the relative movement distance between the semiconductor package 5a, which is the object to be transported, and the opening 23a, which is the destination of the transfer, in the X-axis direction and the Y-axis direction is corrected. Thus, in the second embodiment, the semiconductor package 5a can be more accurately aligned with the opening 23a.

As shown in FIG. 29, the second imaging element 41 of the second camera 202 can capture the holding head 21 a of the holding mechanism 21 from below in the Z-axis direction. This means that the second imaging element 41 of the second camera 202 can photograph the semiconductor package 5a held by the holding head 21a of the holding mechanism 21 from below the Z-axis direction. In addition, the first imaging element 31 of the first camera 201 is configured to be capable of imaging the opening 23 a as a conveyance target portion of the object to be conveyed together with the non-optical mark 48 from above in the Z-axis direction.

Therefore, in the second embodiment as well, the relative positions of the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202 in the X-axis direction and the Y-axis direction can be shifted, respectively. In addition to the amount, the positional offset in the X-axis direction and the Y-axis direction between the center of the light incident portion of the second camera 202 and the center of the semiconductor package 5a, and the light incidence of the first camera 201 are also considered Between the center of the portion and the opening 23a in the X-axis direction and the Y-axis direction, respectively, to correct the design of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction, respectively Moving distance.

The description of Embodiment 2 other than the above is the same as that of Embodiment 1, and therefore the description is omitted.

<Embodiment 3> The electronic component manufacturing apparatus of Embodiment 3 is characterized by including the first camera 301, which shows a schematic partial perspective side view in FIGS. 30 and 31. The first camera 301 of Embodiment 3 includes a second light source 65 in addition to the first light source 32.

When the electronic component manufacturing apparatus of Embodiment 3 is in the state of FIG. 30, light is emitted from the first light source 32, and on the other hand, light is not emitted from the second light source 65. At this time, the optical mark 37 is formed using the light emitted from the first light source 32. The schematic plan view of FIG. 32 shows an example of the image of the optical mark 37 captured by the first imaging element 31 of the first camera 301 at this time.

When the electronic component manufacturing apparatus of Embodiment 3 is in the state of FIG. 31, no light is emitted from the first light source 32, and on the other hand, light is emitted from the second light source 65. At this time, only the light emitted from the second light source 65 and passing through the half mirror 64 is irradiated to the surface, so the optical mark 37 is not formed, but the irradiation surface is brightly irradiated. The schematic plan view in FIG. 33 shows an example of the image of the surface captured by the first imaging element 31 of the first camera 301 at this time. When the electronic component manufacturing apparatus of Embodiment 3 is in the state of FIG. 33, it is possible to perform imaging with a wider field of view than when the optical mark 37 is formed. That is, it is set to the state of FIG. 30 when the camera needs to be aligned, and is set to the state of FIG. 31 when shooting the opening or the like, whereby the opening and the like can be captured with a wide field of view. That is, in Embodiment 3, the electronic component manufacturing apparatus can be used according to the situation by performing the following steps including switching the light source 32 including the optical mark forming portion 33 and the second without the optical mark forming portion 33 Steps of the light source 65.

In addition, the optical mark forming portion 33 is arranged in an adapter 62 and fixes its position, but, for example, as shown in the schematic side perspective view of FIG. 34, a set screw that fixes the adapter 62 (set screw ) 63 is released to change the position of the adapter 62 to, for example, the Z-axis direction upward, and the optical mark forming unit 33 can be moved. Furthermore, the fastening screw 61 fixes the first light source 32 to the adapter 62.

The first camera 301 of the electronic component manufacturing apparatus of the third embodiment having the above-described structure can also be applied to any of the first camera 101 of the first embodiment and the first camera 201 of the second embodiment.

The description of Embodiment 3 other than the above is the same as that of Embodiment 1 or Embodiment 2, and therefore its description is omitted.

In addition, in Embodiments 1 to 3, the electronic component manufacturing apparatus is not limited to this, and may be a cutting apparatus, for example.

The embodiment of the present invention has been described, but it should be considered that the embodiment disclosed this time is an example in all aspects and does not play a limiting role. The scope of the present invention is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the embodiments.

1‧‧‧Substrate loading part 2‧‧‧Substrate ejection member 3‧‧‧Base material 4‧‧‧Sealing resin 5‧‧‧Semiconductor package substrate 5a‧‧‧Semiconductor package 6‧‧‧Package placement and loading Machine 6a ‧ ‧ ‧ track 7 ‧ ‧ ‧ substrate supply table 8 ‧ ‧ ‧ cutting platform 8a ‧ ‧ ‧ rotating mechanism 8b ‧ ‧ ‧ alignment camera 9 ‧ ‧ ‧ shaft 10 ‧ ‧ ‧ blade 11 ‧ ‧ wash water spray member 12‧‧‧Air injection member 13‧‧‧Package unloader 14‧‧‧Inverter 14a‧‧‧Track 15‧‧‧ Indexing platform 16‧‧‧Sponge roller 17‧‧‧Air injection member 18‧‧‧ Mark inspection camera 19‧‧‧Camera inspection package 21‧‧‧ Holding mechanism 21a‧‧‧ Holding head 22‧‧‧Platform 22a‧‧‧Face 23‧‧‧Configuration member 23a‧‧‧Opening 24‧‧‧ Configuration component loader 25‧‧‧ track 26‧‧‧ configuration component loading part 27‧‧‧ arithmetic mechanism 31‧‧‧ first imaging element 32‧‧‧ first light source 33‧‧‧ optical mark forming part 33a‧‧‧ Transmitting part 33b‧‧‧Shading part 34‧‧‧First lens 35‧‧‧Second lens 36‧‧‧Half mirror 37‧‧‧Optical mark 38‧‧‧Light 39‧‧‧Bright part 40‧‧‧ Dark part 41‧‧‧ Second imaging element 42‧‧‧ Third lens 43‧‧‧ Fourth lens 44‧‧‧Reflector 45‧‧‧ Illumination 46‧‧‧ Bright part 47‧‧‧Dark part 48‧‧‧Non Optical mark 51‧‧‧ Third imaging element 61‧‧‧Clamping screw 62‧‧‧Adapter 63‧‧‧Clamping screw 64‧‧‧Half mirror 65‧‧‧Second light source 71‧‧‧ Adhesive layer ( Adhesive layer) 72‧‧‧Flake-shaped substrates 101, 201, 301‧‧‧ First camera 101a‧‧‧Light incident section 102, 202‧‧‧ Second camera 102a‧‧‧Light incident section 103‧‧‧Coaxial 203‧‧‧ Third camera A‧‧‧Substrate supply mechanism B‧‧‧Substrate cutting mechanism C‧‧‧ Washing mechanism D‧‧‧Transport mechanism L1, L2, L3‧‧‧Distance ΔX ₀ ‧‧‧Relative position Offset ΔX ₁ ‧‧‧Position offset ΔX ₂ ‧‧‧Position offset P ₁ X, P ₂ X, P ₃ X‧‧‧Position X, Y, Z‧‧‧Coordinate axis direction

FIG. 1 is a schematic plan view of the electronic component manufacturing apparatus of Embodiment 1. FIG. 2 is a schematic side view illustrating an example of the operation of the substrate supply mechanism A. 3 is a schematic side view illustrating an example of the operation of the substrate supply mechanism A. 4 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. 5 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. 6 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. 7 is a schematic side view illustrating an example of the operation of the washing mechanism C. FIG. 8 is a schematic side view illustrating an example of the operation of the washing mechanism C. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. 10 is a schematic side view illustrating an example of the operation of the transport mechanism D. 11 is a schematic side view illustrating an example of the operation of the transport mechanism D. 12 is a schematic side view illustrating an example of the operation of the transport mechanism D. 13 is a schematic side view illustrating an example of the operation of the transport mechanism D. 14 is a schematic side view illustrating an example of an operation of the holding mechanism to hold the semiconductor package. 15 is a schematic cross-sectional view illustrating another example of the operation of the holding mechanism holding the semiconductor package. 16 is a schematic side view illustrating an example of the operation of the second imaging element photographing the semiconductor package from below in the Z-axis direction, the semiconductor package being held by the holding mechanism. FIG. 17 is a schematic side view illustrating an example of an operation of the first imaging element to image the opening of the arrangement member from above the Z-axis direction. FIG. 18 is a schematic cross-sectional view illustrating an example of an operation for performing positional alignment of a semiconductor package. 19 is a schematic cross-sectional view illustrating an example of an operation of arranging a semiconductor package. FIG. 20 is a schematic partial perspective side view illustrating an example of an operation of the first imaging element to photograph an optical mark formed optically. 21 is a schematic plan view of an example of an image of an optical mark optically formed by the first imaging element. FIG. 22 is a schematic partial perspective side view illustrating an example of an operation of the second imaging element to photograph an optical mark formed optically. 23 is a schematic plan view of an example of an image of an optical mark optically formed by the second imaging element. 24( a) to 24 (d) are schematic side views illustrating an example of the operation of the transport mechanism D. 25 is a schematic plan view illustrating an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus of Embodiment 2. FIG. 26 is a schematic plan view illustrating an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus of Embodiment 2. FIG. 27 is a schematic plan view illustrating an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus of the second embodiment. 28 is a schematic plan view illustrating an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus of the second embodiment. 29 is a schematic plan view illustrating an example of the operation of the conveyance mechanism of the electronic component manufacturing apparatus according to the second embodiment. 30 is a schematic partial perspective side view of an example of the first camera of the electronic component manufacturing apparatus of Embodiment 3. FIG. 31 is a schematic partial perspective side view of an example of the first camera of the electronic component manufacturing apparatus of Embodiment 3. FIG. 32 is a schematic plan view of an example of an image of an optical mark captured by the first imaging element of the first camera in the state shown in FIG. 30. 33 is a schematic plan view of an example of the image of the surface captured by the first imaging element of the first camera in the state shown in FIG. 31. 34 is a schematic partial perspective side view of another example of the first camera of the electronic component manufacturing apparatus of Embodiment 3. FIG.

21‧‧‧ Keep the organization

31‧‧‧The first camera element

32‧‧‧First light source

33‧‧‧ Optical Mark Forming Department

33a‧‧‧Transparent

33b‧‧‧Shade

34‧‧‧First lens

35‧‧‧Second lens

36‧‧‧Half mirror

37‧‧‧Optical logo

38‧‧‧ light

41‧‧‧Second camera element

42‧‧‧third lens

43‧‧‧ fourth lens

44‧‧‧Reflecting mirror

45‧‧‧ Lighting

101‧‧‧ First camera

101a‧‧‧Light Incident Department

102‧‧‧Second camera

102a‧‧‧Light Incident Department

X, Y, Z‧‧‧Coordinate axis direction

Claims (18)

A handling mechanism, including: The holding mechanism is configured to be able to hold the object to be transported and move; light source; An optical mark forming part capable of optically forming an optical mark in the optical path of light emitted from the light source; A first camera, including a first imaging element, the first imaging element being configured to be able to photograph the optical mark and the transport target part of the object to be transported; A second camera including a second imaging element configured to be able to photograph the object to be transported and the optical mark, and the object to be transported is held by the holding mechanism; and The arithmetic unit is configured to be able to correct the movement distance of the object to be transported to the transportation target part based on the relative positional deviation of the first camera and the second camera. The transport mechanism as described in item 1 of the patent application scope, where The computing mechanism can calculate the relative position offset based on the first position offset between the first camera and the optical mark and the second position offset between the second camera and the optical mark The first camera and the optical mark are calculated based on the image of the optical mark captured by the first imaging element, the second camera and the optical mark Is calculated based on the image of the optical mark captured by the second imaging element. The handling mechanism as described in item 2 of the scope of patent application also includes: Surface, configured to optically form the optical mark; and The first imaging element acquires an image of the optical mark by photographing the optical mark, and the optical mark is optically formed on the surface. The transport mechanism as described in item 1 of the patent application scope, where The calculation mechanism can correct the movement based on at least one of a positional offset between the second camera and the object to be transported, and a positional offset between the first camera and the transport target site The distance, the amount of positional deviation between the second camera and the object to be transported is calculated based on the image of the object to be transported captured by the second imaging element, the first camera to the transport target The positional shift amount of the part is calculated based on the image of the transport target part captured by the first imaging element. The transport mechanism as described in item 1 of the patent application scope, where The optical mark forming portion is configured to be movable. The transport mechanism as described in item 1 of the patent application scope, where The optical mark forming section includes: A light shielding portion configured to block the light; and The light-transmitting portion is configured to transmit the light. The transport mechanism as described in item 1 of the patent application scope, where An optical system is also included in the optical path. The handling mechanism as described in item 1 of the patent application scope also includes: A second light source, excluding the optical mark forming portion; and The light source and the second light source are used in a switched manner. A handling mechanism, including: The holding mechanism is configured to be able to hold the object to be transported and move; light source; An optical mark forming part capable of optically forming an optical mark in the optical path of light emitted from the light source; Surface, set with non-optical signs; A first camera, including a first imaging element, the first imaging element being configured to be able to photograph the transport target part of the object and the non-optical mark; The second camera includes a second imaging element configured to be able to photograph the object to be transported and the optical mark, and the object to be transported is held by the holding mechanism; A third camera, including a third imaging element, the third imaging element being configured to be able to photograph the optical mark and the non-optical mark; and The arithmetic unit is configured to be able to correct the movement distance of the object to be transported to the transportation target part based on the relative positional deviation of the first camera and the second camera. The handling mechanism as described in item 9 of the patent application scope, where The computing mechanism is: The second camera and the third can be calculated based on the first position offset between the third camera and the optical mark, and the second position offset between the second camera and the optical mark A first relative positional offset of the camera, the first positional offset of the third camera and the optical mark is calculated based on the data of the image of the optical mark captured by the third imaging element, The second positional offset of the second camera and the optical mark is calculated based on the image of the optical mark captured by the second imaging element, The first camera and the third camera can be calculated based on the image of the non-optical mark captured by the first imaging element and the image of the non-optical mark captured by the third imaging element The distance between the cameras in the first direction and the distance in the second direction different from the first direction. The handling mechanism as described in item 9 of the patent application scope, where The calculation mechanism can correct the movement based on at least one of a positional offset between the second camera and the object to be transported, and a positional offset between the first camera and the transport target site The distance, the amount of positional deviation between the second camera and the object to be transported is calculated based on the image of the object to be transported captured by the second imaging element, the first camera to the transport target The positional shift amount of the part is calculated based on the image of the transport target part captured by the first imaging element. The handling mechanism as described in item 9 of the patent application scope, where The optical mark forming portion is configured to be movable. The handling mechanism as described in item 9 of the patent application scope, where The optical mark forming section includes: A light shielding portion configured to block the light; and The light-transmitting portion is configured to transmit the light. The handling mechanism as described in item 9 of the patent application scope, where An optical system is also included in the optical path. The handling mechanism as described in item 9 of the patent application scope also includes: A second light source, excluding the optical mark forming portion; and The light source and the second light source are used in a switched manner. An electronic parts manufacturing device, including: The conveying mechanism as described in any one of items 1 to 15 of the patent application scope. An electronic part manufacturing method includes the following steps: The steps of using the holding mechanism to hold the carried objects; Steps to form optical marks optically; The step of photographing the optical mark with the first imaging element of the first camera; The step of photographing the optical mark with the second imaging element of the second camera; The step of photographing the object to be transported by the second imaging element, the object to be transported is held by the holding mechanism; The step of photographing the transport target part of the object by using the first imaging element; The step of calculating the relative position offset of the first camera and the second camera; The step of correcting the moving distance of the conveyed object to the conveying target site based on the relative positional deviation; and The step of placing the object to be transported on the transport target portion. An electronic part manufacturing method includes the following steps: The steps of using the holding mechanism to hold the carried objects; Steps to form optical marks optically; The step of photographing the non-optical mark with the first imaging element of the first camera; The step of photographing the optical mark with the second imaging element of the second camera; The step of photographing the non-optical mark with the third imaging element of the third camera mounted on the holding mechanism; The step of photographing the object to be transported by the second imaging element, the object to be transported is held by the holding mechanism; The step of photographing the transport target part of the object by using the first imaging element; The step of calculating the relative position offset of the first camera and the second camera; The step of correcting the moving distance of the conveyed object to the conveying target site based on the relative positional deviation; and The step of placing the object to be transported on the transport target portion.

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