WO2023037671A1 - Maintenance method and method for manufacturing electronic component - Google Patents

Maintenance method and method for manufacturing electronic component Download PDF

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Publication number
WO2023037671A1
WO2023037671A1 PCT/JP2022/021903 JP2022021903W WO2023037671A1 WO 2023037671 A1 WO2023037671 A1 WO 2023037671A1 JP 2022021903 W JP2022021903 W JP 2022021903W WO 2023037671 A1 WO2023037671 A1 WO 2023037671A1
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WIPO (PCT)
Prior art keywords
camera
electronic component
optical inspection
inspection camera
inspection
Prior art date
Application number
PCT/JP2022/021903
Other languages
French (fr)
Japanese (ja)
Inventor
一美 中村
貴俊 尾関
航希 坂田
直己 藤原
創 渡辺
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020247007600A priority Critical patent/KR20240046214A/en
Priority to CN202280051099.0A priority patent/CN117730399A/en
Publication of WO2023037671A1 publication Critical patent/WO2023037671A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

Definitions

  • the present invention relates to a maintenance method and an electronic component manufacturing method.
  • Patent Document 1 discloses an inspection method for measuring the pixel size of imaging means included in a processing apparatus.
  • an inspection jig is used to measure the pixel size.
  • a pattern and a two-dimensional barcode recording the width of the pattern are formed on the surface of the inspection jig.
  • the pattern formed on the surface of the inspection jig is imaged, and the number of pixels corresponding to the width of the pattern is measured.
  • the pixel size is calculated by dividing the width of the pattern read from the two-dimensional barcode by the number of pixels corresponding to the width of the pattern (see Patent Document 1).
  • a cutting apparatus that manufactures electronic components by cutting package substrates may perform a visual inspection of the electronic components.
  • the appearance inspection of electronic components is performed, for example, by taking an image of the electronic components placed on the inspection table with a camera. If a long period of time elapses after starting to use the cutting device, the quality of the appearance inspection may deteriorate.
  • Patent Literature 1 does not disclose a technique for continuously maintaining the quality of appearance inspection.
  • the present invention has been made to solve such problems, and an object of the present invention is to provide a maintenance method for continuously maintaining the quality of appearance inspection of electronic parts in a cutting apparatus, and a method for manufacturing electronic parts. to provide a method.
  • a maintenance method is a cutting device maintenance method.
  • the cutting device is configured to manufacture electronic components by cutting the package substrate, and to perform visual inspection of the electronic components based on the first image data.
  • the first image data is generated by capturing an electronic component placed on the table with a camera.
  • This maintenance method includes the steps of capturing an image of a standard test piece placed on a table with a camera to generate second image data, calculating the length of the standard test piece based on the second image data, and calculating the length of the standard test piece based on the second image data. comparing the length of the standard test piece with a reference value for the length of the standard test piece stored in the cutting device, and determining whether or not adjustment for visual inspection is necessary based on the comparison result.
  • a method of manufacturing an electronic component according to another aspect of the present invention is a method of manufacturing an electronic component using the above maintenance method.
  • This electronic component manufacturing method includes a step of manufacturing the electronic component by cutting the package substrate after using the maintenance method.
  • FIG. 4 is a diagram schematically showing inspection by a second optical inspection camera; It is a figure which shows the hardware constitutions of a computer typically.
  • FIG. 10 is a diagram schematically showing the second optical inspection camera when imaging the calibration plate;
  • FIG. 4 is a perspective view schematically showing an example of a jig for calibration;
  • FIG. 4 is a diagram schematically showing a plane of a calibration plate;
  • FIG. 10 is a diagram schematically showing the second optical inspection camera when imaging a standard test piece;
  • FIG. 4 is a perspective view schematically showing an example of a jig for maintenance; It is a figure which shows an example of a pattern part typically.
  • FIG. 4 is a diagram schematically showing an example of a pattern on a lead surface of a QFN package;
  • FIG. 4 is a diagram schematically showing an example of the ball surface pattern of the BGA package;
  • FIG. 4 is a diagram schematically showing an example of a pattern on a mold surface of a package;
  • 4 is a flow chart showing an operation procedure performed after the cutting device is assembled;
  • 4 is a flow chart showing an operation procedure performed at the timing of maintenance of the cutting device;
  • this embodiment an embodiment according to one aspect of the present invention (hereinafter also referred to as “this embodiment”) will be described in detail with reference to the drawings.
  • the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.
  • each drawing is schematically drawn by appropriately omitting or exaggerating objects for easy understanding.
  • FIG. 1 is a plan view schematically showing a cutting device 1 used in the maintenance method according to this embodiment.
  • the cutting device 1 is configured to separate a package substrate (object to be cut) into a plurality of electronic components (package components) by cutting the package substrate.
  • a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed.
  • package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, QFN (Quad Flat No-lead ) package substrates.
  • the cutting device 1 is configured to inspect each of the plurality of individualized electronic components.
  • an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as "non-defective" or "defective.”
  • a package substrate P1 is used as an object to be cut, and the cutting device 1 separates the package substrate P1 into a plurality of electronic components S1.
  • the resin-sealed surface is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a ball/lead surface.
  • the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components.
  • the cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1.
  • the inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.
  • the cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a transport section 7.
  • the substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the magazine M1 that stores the plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball/lead surface facing upward.
  • the positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 on the rail portions 4a. After that, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5 .
  • the cutting table 5 holds the package substrate P to be cut.
  • a cutting device 1 having a twin-cut table configuration having two cutting tables 5 is illustrated.
  • the cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c.
  • the holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below.
  • the rotating mechanism 5b can rotate the holding member 5a in the ⁇ 1 direction in the drawing.
  • the moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.
  • the spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1.
  • a twin-spindle cutting device 1 having two spindles 6 is illustrated.
  • the spindle part 6 is movable along the X-axis and Z-axis of the figure. Note that the cutting device 1 may have a single spindle configuration having one spindle portion 6 .
  • FIG. 2 is a side view schematically showing the spindle section 6.
  • the spindle portion 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.
  • the blade 6a rotates at a high speed to cut the package substrate P1 and singulate the package substrate P1 into a plurality of electronic components S1.
  • the blade 6a is attached to the rotary shaft 6c while being sandwiched between one flange (first flange) 6d and the other flange (second flange) 6e.
  • the first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by a fastening member 6f such as a nut.
  • the first flange 6d is also called an inner flange
  • the second flange 6e is also called an outer flange.
  • the spindle portion 6 has a cutting water nozzle for injecting cutting water toward the blade 6a rotating at high speed, a cooling water nozzle for injecting cooling water, and a washing water nozzle for injecting washing water for washing cutting chips and the like. Nozzles (none of which are shown) and the like are provided.
  • the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed.
  • Confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1.
  • the mark indicates, for example, the cutting position of the package substrate P1.
  • the cutting table 5 moves toward the spindle section 6 along the Y-axis in the figure.
  • the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle section 6.
  • FIG. After that, the package substrate P1 is imaged by the second position confirmation camera 6b as necessary, and the position and the like of the package substrate P1 are confirmed. Confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.
  • the cutting table 5 moves away from the spindle section 6 along the Y-axis in the drawing while sucking the plurality of individualized electronic components S1.
  • the first cleaner 5e cleans and dries the upper surface (ball/lead surface) of the electronic component S1.
  • the transport unit 7 sucks the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection/storage module B1. During this transfer process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1.
  • the inspection/storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement section 14, and an extraction section 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1.
  • the inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1.
  • the inspection table 11 is movable along the X-axis of the figure. Also, the inspection table 11 can be turned upside down.
  • the inspection table 11 is provided with a holding member that holds the electronic component S1 by sucking the electronic component S1.
  • the first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball/lead surface and mold surface) of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the electronic component S1 are performed. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 so as to capture an upper image.
  • the first optical inspection camera 12 is provided with an illumination device 12a
  • the second optical inspection camera 13 is provided with an illumination device 13a.
  • the illumination device 12 a is configured to irradiate the inspection table 11 with light during inspection by the first optical inspection camera 12
  • the illumination device 13 a is configured to irradiate the inspection table 11 with light during inspection by the second optical inspection camera 13 .
  • the first optical inspection camera 12 images the mold surface of the electronic component S1 transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the electronic component S ⁇ b>1 on the holding member of the inspection table 11 . After the holding member sucks the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13 and the ball/lead surface of the electronic component S1 is imaged by the second optical inspection camera 13 . As an example, inspection by the second optical inspection camera 13 will be described below.
  • FIG. 3 is a diagram schematically showing inspection by the second optical inspection camera 13.
  • FIG. 3 the inspection by the second optical inspection camera 13 is performed in a state where the inspection table 11 holding the electronic component S1 on its lower surface is positioned above the second optical inspection camera 13.
  • image data is generated by imaging the electronic component S1 held on the inspection table 11 by the second optical inspection camera 13, and the ball/lead surfaces of the electronic component S1 are detected based on the generated image data.
  • a visual inspection is performed. As described above, the visual inspection of the mold surface of electronic component S1 is performed by first optical inspection camera 12 .
  • an inspected electronic component S1 is placed in the placement section 14 .
  • the placement unit 14 is movable along the Y-axis of the drawing.
  • the inspection table 11 arranges the inspected electronic component S ⁇ b>1 in the arrangement section 14 .
  • the extraction unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray.
  • the electronic parts S1 are sorted into “non-defective products” or “defective products” based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13 .
  • the extraction unit 15 transfers each electronic component S1 to the non-defective product tray 15a or the defective product tray 15b based on the sorting result. Namely, non-defective products are stored in the non-defective product tray 15a, and defective products are stored in the defective product tray 15b. When each of the non-defective product tray 15a and the defective product tray 15b is filled with electronic components S1, it is replaced with a new tray.
  • the cutting device 1 further includes a computer 50 and a monitor 20.
  • Monitor 20 is configured to display an image.
  • the monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.
  • the computer 50 controls the operation of each section of the cutting module A1 and the inspection/storage module B1.
  • the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction Operations of the unit 15 and the monitor 20 are controlled.
  • the computer 50 also performs various inspections of the electronic component S1 based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example. Next, computer 50 will be described in detail.
  • FIG. 4 is a diagram schematically showing the hardware configuration of the computer 50.
  • the computer 50 includes an arithmetic unit 70, an input/output I/F (interface) 90, and a storage unit 80, each of which is electrically connected via a bus. .
  • the computing unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like.
  • the calculation unit 70 is configured to control each component in the computer 50 and each component in the cutting apparatus 1 according to information processing.
  • the input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via signal lines.
  • the input/output I/F 90 is used for transmitting data from the computer 50 to each component within the cutting device 1 and for receiving data transmitted from each component within the cutting device 1 to the computer 50 .
  • the storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or solid state drive.
  • the storage unit 80 is configured to store a control program 81, for example.
  • the storage unit 80 may store inspection data generated through inspection using the first optical inspection camera 12 and the second optical inspection camera 13 .
  • a visual inspection (hereinafter also referred to as a "first visual inspection") of the mold surface of the electronic component S1 is performed based on the image captured by the first optical inspection camera 12. 2 Based on the image captured by the optical inspection camera 13, a visual inspection of the ball/lead surface of the electronic component S1 (hereinafter also referred to as a "second visual inspection”) is performed.
  • pixel size information of each camera (hereinafter also referred to as “pixel size information”) is used.
  • Pixel size image resolution refers to the actual length of the imaged object corresponding to one side of each pixel of the camera. For example, if the length of one side of an imaging target imaged by one pixel of the camera is 1 mm, the pixel size is 1 mm.
  • the pixel size of each camera is calculated during calibration of each camera. Calibration of each camera is performed, for example, after installation of the cutting device 1 .
  • the calibration of the first optical inspection camera 12 is performed by taking an image of the calibration plate 130 (described later) held by the transport unit 7 with the first optical inspection camera 12 .
  • calibration of the second optical inspection camera 13 is performed by imaging the calibration plate 130 held on the inspection table 11 with the second optical inspection camera 13 . Camera calibration will be explained in detail later.
  • the quality of the first visual inspection is affected by the accuracy of the pixel size information of the first optical inspection camera 12.
  • the quality of the second visual inspection is affected by the accuracy of the pixel size information of the second optical inspection camera 13 .
  • the accuracy of the pixel size information of the first optical inspection camera 12 is affected by the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyor 7) when calibrating the first optical inspection camera 12. receive.
  • the accuracy of the pixel size information of the second optical inspection camera 13 depends on the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) when calibrating the second optical inspection camera 13. affected by When calibrating the second optical inspection camera 13, the closer the optical axis of the second optical inspection camera 13 is to the calibration plate 130, the higher the accuracy of the pixel size information of the second optical inspection camera 13.
  • the quality of the first visual inspection is affected by, for example, the relative tilt between the first optical inspection camera 12 and the electronic component S1 (conveyor 7) during the first visual inspection of the electronic component S1.
  • the quality of the second visual inspection is affected by, for example, the relative tilt between the second optical inspection camera 13 and the electronic component S1 (inspection table 11) during the second visual inspection of the electronic component S1.
  • the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyance unit 7) is calculated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. Calculation of the relative tilt between the first optical inspection camera 12 and the calibration plate 130 and calculation of the relative tilt between the second optical inspection camera 13 and the calibration plate 130 are performed by substantially the same method. done. Here, a representative method for calculating the relative tilt between the second optical inspection camera 13 and the calibration plate 130 will be described.
  • FIG. 5 is a diagram schematically showing the second optical inspection camera 13 when imaging the calibration plate 130.
  • the inspection table 11 is positioned above the second optical inspection camera 13 when the calibration plate 130 is imaged by the second optical inspection camera 13 .
  • a jig 100 is arranged on the lower surface of the inspection table 11 .
  • the jig 100 is fixed at a predetermined position on the lower surface of the inspection table 11 with a fixing member such as a screw. Since the jig 100 is fixed to the inspection table 11 by the fixing member, the position of the jig 100 on the inspection table 11 is a predetermined position. For example, at a predetermined position, the center position of the jig 100 and the center position of the inspection table 11 match.
  • FIG. 6 is a perspective view schematically showing an example of the jig 100 for calibration.
  • jig 100 includes base 110, holding plate 120, and calibration plate .
  • Each of the base 110, the holding plate 120, and the calibration plate 130 is a plate-like member having a rectangular shape in plan view.
  • the calibration plate 130 is placed in a recess 124 formed in the holding plate 120 , and is fixed to the holding plate 120 by pressing the vicinity of each of the four corners of the calibration plate 130 with the head bearing surfaces of the screws 122 . ing.
  • FIG. 7 is a diagram schematically showing the plane of the calibration plate 130.
  • a predetermined pattern is formed on the calibration plate 130 .
  • a predetermined pattern is formed on the calibration plate 130 by, for example, printing or cutting.
  • a plurality of dots D1 are printed on the calibration plate 130.
  • FIG. Information about the predetermined pattern is stored in advance in the storage unit 80 (FIG. 4), for example.
  • An example of the information about the predetermined pattern is the diameter of the dots D1 and the length between the dots D1.
  • holding plate 120 is fixed to base 110 by pressing members 114 in the vicinity of each of the four corners of holding plate 120 .
  • Each pressing member 114 includes a first surface portion 114a, a bent portion 114b, and a second surface portion 114c.
  • the bent portion 114b is bent with respect to each of the first surface portion 114a and the second surface portion 114c.
  • the first surface portion 114a and the second surface portion 114c extend in opposite directions from the bent portion 114b.
  • the second surface portion 114c is fixed to the base 110 by screws 116, and the first surface portion 114a presses the holding plate 120 toward the base 110. As shown in FIG.
  • the holding plate 120 is thereby fixed to the base 110 .
  • a plurality of screw holes 112 are formed in the base 110 .
  • the jig 100 is fixed at a predetermined position on the inspection table 11 by passing screws through the screw holes 112 .
  • the center position of the calibration plate 130 is, for example, the same as the center position of the electronic component S1 during the second visual inspection.
  • the second optical inspection camera 13 images the calibration plate 130 included in the jig 100 and generates image data.
  • the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated based on the generated image data.
  • relative inclinations in each of the ⁇ 1 direction, ⁇ 2 direction, and ⁇ 3 direction in the figure are calculated.
  • the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated, for example, based on the degree of distortion of the pattern (for example, multiple dots D1) of the calibration plate 130 in the captured image.
  • the relative tilt between the first optical inspection camera 12 and the calibration plate 130 is calculated before the first optical inspection camera 12 is calibrated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting apparatus 1, since each camera is calibrated after confirming that there is no problem with the relative inclination between each camera and the calibration plate 130, the accuracy of the calibration of each camera is guaranteed. can do. As a result, according to the cutting device 1, it is possible to ensure the quality of each appearance inspection.
  • the relative tilt between each camera and the transport section 7 or the inspection table 11 may change. In such a case, the quality of visual inspection deteriorates. In addition to this, there are cases where the quality of the appearance inspection deteriorates due to various factors.
  • the cutting device 1 maintenance is performed to suppress quality deterioration in appearance inspection. When it is determined through maintenance that various adjustments for appearance inspection are necessary, the necessary adjustments are made. Maintenance is performed by imaging standard specimens 210 (described below) with each camera. Since the maintenance methods using the first optical inspection camera 12 and the second optical inspection camera 13 are substantially the same, the maintenance method using the second optical inspection camera 13 will be described as a representative here. .
  • FIG. 8 is a diagram schematically showing the second optical inspection camera 13 during imaging of the standard test piece 210.
  • the inspection table 11 is positioned above the second optical inspection camera 13 when the standard test piece 210 is imaged by the second optical inspection camera 13 .
  • a jig 200 is arranged on the lower surface of the inspection table 11 .
  • the jig 200 is fixed at a predetermined position on the lower surface of the inspection table 11 with a fixing member such as a screw. Since the jig 200 is fixed to the inspection table 11 by the fixing member, the position of the jig 200 on the inspection table 11 is a predetermined position. For example, at a predetermined position, the center position of the jig 200 and the center position of the inspection table 11 match.
  • FIG. 9 is a perspective view schematically showing an example of a jig 200 for maintenance.
  • jig 200 includes base 110 and standard test piece 210 .
  • the standard test piece 210 is a plate-like member having a rectangular shape in plan view.
  • a pattern portion 220 is formed on the standard test piece 210 .
  • the patterned portion 220 is formed on the standard test piece 210 by, for example, printing or cutting.
  • the standard test piece 210 is pressed by the pressing member 114 at two locations (four locations in total) near each long side, and is pressed at three locations (six locations in total) near each long side by screws 212. It is fixed to the base 110 by being screwed. As described above, the base 110 has a plurality of screw holes 112 formed therein. The jig 200 is fixed at a predetermined position on the inspection table 11 by passing screws through the screw holes 112 .
  • FIG. 10 is a diagram schematically showing an example of the pattern section 220.
  • the pattern section 220 includes QFN patterns 221-225, BGA patterns 231-235, and mark patterns 241-244.
  • Each of the QFN patterns 221-225, the BGA patterns 231-235 and the mark patterns 241-244 includes patterns of a plurality of packages of the same type.
  • the pattern on each package indicates, for example, a package without appearance defects.
  • the size of each of the QFN patterns 221-225, the BGA patterns 231-235 and the mark patterns 241-244 is equal to or larger than the size of the imaging range of each of the first optical inspection camera 12 and the second optical inspection camera 13. .
  • Each of QFN patterns 221-225 includes patterns of a plurality of QFN packages.
  • the QFN package pattern included in each of QFN patterns 221-225 indicates the lead surface of the QFN package.
  • FIG. 11 is a diagram schematically showing an example of the pattern of the lead surface of the QFN package. As shown in FIG. 11, pattern 229 indicates the lead surface of the QFN package.
  • each of the QFN patterns 221-225 includes patterns of a plurality of QFN packages of the same size.
  • the QFN patterns 221, 222, 223, 224, and 225 include, for example, 2 mm square, 3 mm square, 5 mm square, 7 mm square, and 9 mm square QFN package patterns.
  • Information about the length of each side of each pattern is stored in advance in the storage unit 80 (FIG. 4), for example.
  • Each of the BGA patterns 231-235 includes patterns of a plurality of BGA packages.
  • the BGA package pattern included in each of the BGA patterns 231-235 indicates the ball surface of the BGA package.
  • FIG. 12 is a diagram schematically showing an example of the ball surface pattern of the BGA package. As shown in FIG. 12, pattern 239 indicates the ball surface of the BGA package.
  • each of the BGA patterns 231-235 includes patterns of a plurality of BGA packages of the same size.
  • the BGA patterns 231, 232, 233, 234, and 235 include, for example, 2 mm square, 4 mm square, 8 mm square, 10 mm square, and 12 mm square BGA package patterns. Information about the length of each side of each pattern is stored in advance in the storage unit 80, for example.
  • Each of the mark patterns 241-244 includes patterns of a plurality of packages.
  • the pattern of the package contained in each of the mark patterns 241-244 indicates the mold surface of the package.
  • the pattern of each package includes a mark including letters and the like.
  • FIG. 13 is a diagram schematically showing an example of the pattern on the mold surface of the package. As shown in FIG. 13, pattern 249 indicates the mold side of the package. A mark including, for example, letters "ABC" is formed on the mold surface.
  • each of the mark patterns 241-244 includes patterns of a plurality of packages of the same size.
  • the mark patterns 241, 242, 243, and 244 include, for example, patterns of packages of 3 mm square, 4 mm square, 7 mm square, and 12 mm square, respectively.
  • Information about the length of each side of each pattern is stored in advance in the storage unit 80, for example.
  • the second optical inspection camera 13 is positioned below the pattern to be imaged among the multiple patterns included in the standard test piece 210 .
  • the second optical inspection camera 13 is positioned below the QFN pattern 221 of the standard test piece 210 . In this state, the second optical inspection camera 13 images the standard test piece 210 and generates image data.
  • the length of one side of the imaged QFN package pattern is calculated based on the generated image data. Specifically, the length of one side of the QFN package pattern is calculated by multiplying the number of pixels corresponding to one side of the QFN package pattern in the captured image by the pixel size calculated when the second optical inspection camera 13 is calibrated. is calculated. Based on the difference between the calculated length of one side and the length of one side (reference value) stored in the storage unit 80, it is determined whether or not various adjustments for visual inspection are necessary.
  • the accuracy of the pixel size information is confirmed during maintenance.
  • the visual inspection of the electronic component S1 is performed after confirming that there is no problem with the accuracy of the pixel size information during maintenance, so the quality of the visual inspection of the electronic component S1 is continuously ensured. be able to.
  • the operation of the cutting device 1 will be described in detail below.
  • FIG. 14 is a flow chart showing the operation procedure performed after the cutting device 1 is assembled.
  • the operator assembles calibration plate 130 (jig 100) at a predetermined position on inspection table 11 (step S100).
  • the computer 50 controls the second optical inspection camera 13 to image the calibration plate 130 fixed to the inspection table 11 (step S105).
  • the computer 50 calculates the relative tilt between the second optical inspection camera 13 and the calibration plate 130 based on the image data generated by the second optical inspection camera 13 (step S110).
  • the computer 50 controls the monitor 20 to display the calculated tilt information (step S115). After that, it is determined whether or not the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is within a predetermined range. This determination is made, for example, by an operator.
  • step S120 If it is determined that the relative tilt is not within the predetermined range (NO in step S120), the tilt of at least one of the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is adjusted (step S125). This inclination adjustment is manually performed by an operator, for example.
  • the computer 50 controls the second optical inspection camera to image the calibration plate 130 fixed to the inspection table 11. 13 (step S130).
  • the computer 50 performs calibration processing of the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 (step S135).
  • the computer 50 calculates the pixel size of the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 and the information on the predetermined pattern of the calibration plate 130 stored in the storage unit 80. Calculate Thereby, the second optical inspection camera 13 is calibrated.
  • the computer 50 controls the monitor 20 to display the calibration result (for example, the pixel size of the second optical inspection camera 13) (step S140). After that, the need for recalibration of the second optical inspection camera 13 is determined (step S145). For example, if the calculated pixel size does not meet the standard, it is determined that recalibration is necessary, and if the calculated pixel size meets the standard, it is determined that recalibration is unnecessary. This determination is made, for example, by an operator.
  • step S145 If it is determined that recalibration of the second optical inspection camera 13 is necessary (YES in step S145), the assembly of the cutting device 1 may be the cause, so the cutting device 1 is reassembled (step S150). Reassembly of the cutting device 1 is performed by, for example, an operator.
  • step S145 When it is determined that recalibration of the second optical inspection camera 13 is unnecessary (NO in step S145), and the calibration of the first optical inspection camera 12 is also completed, the electronic component S1 in the cutting device 1 is Manufacturing is started (step S155). Note that the first optical inspection camera 12 also performs operations corresponding to steps S100 to S150 in the same manner as the second optical inspection camera 13 does.
  • the relative tilt between the first optical inspection camera 12 and the calibration plate 130 is calculated before the first optical inspection camera 12 is calibrated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting apparatus 1, since each camera is calibrated after confirming that there is no problem with the relative inclination between each camera and the calibration plate 130, the accuracy of the calibration of each camera is guaranteed. can do. As a result, according to the cutting device 1, it is possible to ensure the quality of each appearance inspection.
  • FIG. 15 is a flow chart showing an operation procedure performed at the timing of maintenance of the cutting device 1.
  • the operator assembles standard test piece 210 (jig 200) at a predetermined position on inspection table 11 (step S200).
  • the computer 50 controls the second optical inspection camera 13 to image the standard test piece 210 fixed on the inspection table 11 (step S205).
  • the computer 50 calculates the length of the target area of the standard test piece 210 based on the image data generated by the second optical inspection camera 13 (step S210).
  • the computer 50 calculates, for example, the length of one side of the pattern (package pattern) to be imaged.
  • the computer 50 compares the calculated length of one side with the length of one side of the pattern to be imaged (reference value) stored in advance in the storage unit 80 (step S215).
  • the computer 50 determines whether adjustment for visual inspection is necessary based on the comparison result (step S220). For example, if the difference between the calculated length of one side and the reference value is greater than or equal to the first predetermined value, it is determined that adjustment for appearance inspection is necessary, and the difference between the calculated length of one side and the reference value is determined. If the difference is less than the first predetermined value, it is determined that adjustment for visual inspection is unnecessary.
  • step S250 the manufacturing of the electronic component S1 in the cutting device 1 is completed. is started (step S250). Note that the operations corresponding to steps S200 to S240 are performed for the first optical inspection camera 12 as well as for the second optical inspection camera 13. FIG.
  • step S225 the computer 50 determines whether calibration of the second optical inspection camera 13 is necessary (step S225). For example, if the difference between the calculated length of one side and the reference value is greater than or equal to a second predetermined value (second predetermined value>first predetermined value), it is determined that calibration of the second optical inspection camera 13 is necessary. If the difference between the calculated length of one side and the reference value is less than the second predetermined value, it is determined that calibration of the second optical inspection camera 13 is unnecessary.
  • step S225 When it is determined that calibration of the second optical inspection camera 13 is necessary (YES in step S225), for example, the operation (calibration flow) shown in the flowchart of FIG. 14 is performed (step S230). On the other hand, if it is determined that calibration of second optical inspection camera 13 is unnecessary (NO in step S225), various parameters that affect appearance inspection are adjusted.
  • An example of various parameters is a parameter related to the illuminance of the illumination device 13a. Various parameters are adjusted, for example, by an operator.
  • step S240 it is determined whether or not adjustment for visual inspection is necessary again. This determination is made, for example, by an operator. If it is determined that readjustment is necessary (YES in step S240), the operation of step S200 is performed again. On the other hand, if it is determined that readjustment is unnecessary (NO in step S240), and if the adjustment of the first optical inspection camera 12 has been completed, the manufacturing of the electronic component S1 in the cutting device 1 is started. (step S250).
  • the accuracy of the pixel size information is confirmed during maintenance, and the necessity of recalibration of each camera is determined.
  • the visual inspection of the electronic component S1 is performed after confirming that there is no problem with the accuracy of the pixel size information during maintenance, so the quality of the visual inspection of the electronic component S1 is continuously ensured. be able to.
  • the cutting device 1 is an example of the "cutting device” in the present invention.
  • Each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of a “camera” in the present invention.
  • the package substrate P1 is an example of a "package substrate” in the present invention.
  • the electronic component S1 is an example of the "electronic component” in the present invention.
  • Each of the transport section 7 and the inspection table 11 is an example of the “table” in the present invention.
  • the standard test piece 210 is an example of the "standard test piece” in the present invention.
  • the relative tilt between the first optical inspection camera 12 and the calibration plate 130 is calculated before calibrating the first optical inspection camera 12, and the second optical inspection camera
  • the relative tilt between the second optical inspection camera 13 and the calibration plate 130 was calculated before performing the calibration of 13.
  • the process of calculating these relative inclinations is not necessarily required. At least, it is sufficient if the need for adjustment for visual inspection is determined during maintenance of the cutting device 1 .
  • the relative tilt between the calibration plate 130 and the first optical inspection camera 12 is calculated before calibrating the first optical inspection camera 12, and before calibrating the second optical inspection camera 13 A relative tilt between the calibration plate 130 and the second optical inspection camera 13 was calculated.
  • the relative tilt between the camera and the calibration plate 130 need not necessarily be calculated before calibrating each camera. For at least one of the cameras, the relative tilt between the camera and the calibration plate 130 should be calculated before calibrating the camera.
  • the accuracy of the pixel size information in each of the first optical inspection camera 12 and the second optical inspection camera 13 was confirmed during maintenance of the cutting device 1 .
  • the configuration may be such that the accuracy of the pixel size information is confirmed for either one of the first optical inspection camera 12 and the second optical inspection camera 13 .
  • the calibration of each camera may include calculating the size of the imaging range (view size) of each camera.
  • the corner portion of the electronic component S1 may be detected.
  • the detection of the corner portion of the electronic component S1 may be detected based on the amount of change in luminance in the captured image.
  • the parameters to be adjusted in step S235 of FIG. 15 may include a luminance change amount threshold value for detecting corners of the electronic component S1.
  • the standard test piece 210 had a rectangular package pattern.
  • the pattern shape formed on the standard test piece 210 is not limited to a rectangle.
  • the standard test strip 210 may be patterned with a special shape such as micro SD (registered trademark), for example.
  • the standard test piece 210 may have patterns of packages other than the QFN package and the BGA package (LGA package, CSP package, etc.).

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Abstract

Provided is a maintenance method for a cutting device. The cutting device is configured to manufacture an electronic component by cutting a package substrate, and to perform visual inspection of the electronic component on the basis of first image data. The first image data is generated by imaging the electronic component disposed on a table with a camera. The maintenance method comprises: a step for imaging a standard test piece disposed on the table with the camera to generate second image data; a step for calculating a length of the standard test piece on the basis of the second image data; and a step for comparing the calculated length of the standard test piece with a standard value pertaining to the length of the standard test piece stored in the cutting device, to determine if it is necessary to make an adjustment for the visual inspection on the basis of a comparison result.

Description

メンテナンス方法、及び電子部品の製造方法Maintenance method and electronic component manufacturing method
　本発明は、メンテナンス方法、及び電子部品の製造方法に関する。 The present invention relates to a maintenance method and an electronic component manufacturing method.
　特開２０１９－２０１１４３号公報（特許文献１）は、加工装置に含まれる撮像手段のピクセルサイズを測定するための検査方法を開示する。この検査方法においては、ピクセルサイズを測定するために、検査治具が用いられる。この検査治具の表面には、パターンと、該パターンの幅を記録した二次元バーコードとが形成されている。この検査方法においては、検査治具の表面に形成されたパターンの撮像が行なわれ、該パターンの幅に対応するピクセル数が測定される。そして、二次元バーコードから読み取られた該パターンの幅を該パターンの幅に対応するピクセル数で割ることによって、ピクセルサイズが算出される（特許文献１参照）。 Japanese Patent Laying-Open No. 2019-201143 (Patent Document 1) discloses an inspection method for measuring the pixel size of imaging means included in a processing apparatus. In this inspection method, an inspection jig is used to measure the pixel size. A pattern and a two-dimensional barcode recording the width of the pattern are formed on the surface of the inspection jig. In this inspection method, the pattern formed on the surface of the inspection jig is imaged, and the number of pixels corresponding to the width of the pattern is measured. Then, the pixel size is calculated by dividing the width of the pattern read from the two-dimensional barcode by the number of pixels corresponding to the width of the pattern (see Patent Document 1).
特開２０１９－２０１１４３号公報JP 2019-201143 A
　パッケージ基板を切断することによって電子部品を製造する切断装置において、電子部品の外観検査が行なわれることがある。電子部品の外観検査は、例えば、検査テーブルに配置された電子部品をカメラで撮像することによって行なわれる。切断装置の使用を開始してから長期間が経過すると、外観検査の品質が低下する可能性がある。しかしながら、上記特許文献１においては、外観検査の品質を継続的に維持するための技術が開示されていない。 A cutting apparatus that manufactures electronic components by cutting package substrates may perform a visual inspection of the electronic components. The appearance inspection of electronic components is performed, for example, by taking an image of the electronic components placed on the inspection table with a camera. If a long period of time elapses after starting to use the cutting device, the quality of the appearance inspection may deteriorate. However, Patent Literature 1 does not disclose a technique for continuously maintaining the quality of appearance inspection.
　本発明は、このような問題を解決するためになされたものであって、その目的は、切断装置における電子部品の外観検査の品質を継続的に維持するためのメンテナンス方法、及び電子部品の製造方法を提供することである。 SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and an object of the present invention is to provide a maintenance method for continuously maintaining the quality of appearance inspection of electronic parts in a cutting apparatus, and a method for manufacturing electronic parts. to provide a method.
　本発明のある局面に従うメンテナンス方法は、切断装置のメンテナンス方法である。切断装置は、パッケージ基板を切断することによって電子部品を製造し、第１画像データに基づいて電子部品の外観検査を行なうように構成されている。第１画像データは、テーブルに配置された電子部品をカメラで撮像することによって生成される。このメンテナンス方法は、テーブルに配置された標準試験片をカメラで撮像し、第２画像データを生成するステップと、第２画像データに基づいて標準試験片の長さを算出するステップと、算出された標準試験片の長さと切断装置において記憶されている標準試験片の長さに関する基準値とを比較し、比較結果に基づいて外観検査のための調整の要否を判定するステップとを含む。 A maintenance method according to one aspect of the present invention is a cutting device maintenance method. The cutting device is configured to manufacture electronic components by cutting the package substrate, and to perform visual inspection of the electronic components based on the first image data. The first image data is generated by capturing an electronic component placed on the table with a camera. This maintenance method includes the steps of capturing an image of a standard test piece placed on a table with a camera to generate second image data, calculating the length of the standard test piece based on the second image data, and calculating the length of the standard test piece based on the second image data. comparing the length of the standard test piece with a reference value for the length of the standard test piece stored in the cutting device, and determining whether or not adjustment for visual inspection is necessary based on the comparison result.
　本発明の他の局面に従う電子部品の製造方法は、上記メンテナンス方法を使用する、電子部品の製造方法である。この電子部品の製造方法は、上記メンテナンス方法の使用後に、パッケージ基板を切断することによって電子部品を製造するステップを含む。 A method of manufacturing an electronic component according to another aspect of the present invention is a method of manufacturing an electronic component using the above maintenance method. This electronic component manufacturing method includes a step of manufacturing the electronic component by cutting the package substrate after using the maintenance method.
　本発明によれば、切断装置における電子部品の外観検査の品質を継続的に維持するためのメンテナンス方法、及び電子部品の製造方法を提供することができる。 According to the present invention, it is possible to provide a maintenance method and an electronic component manufacturing method for continuously maintaining the quality of appearance inspection of electronic components in a cutting device.
切断装置を模式的に示す平面図である。It is a top view which shows a cutting device typically. スピンドル部を模式的に示す側面図である。It is a side view which shows a spindle part typically. 第２光学検査カメラによる検査の様子を模式的に示す図である。FIG. 4 is a diagram schematically showing inspection by a second optical inspection camera; コンピュータのハードウェア構成を模式的に示す図である。It is a figure which shows the hardware constitutions of a computer typically. 校正用プレートの撮像時における第２光学検査カメラを模式的に示す図である。FIG. 10 is a diagram schematically showing the second optical inspection camera when imaging the calibration plate; 校正用の治具の一例を模式的に示す斜視図である。FIG. 4 is a perspective view schematically showing an example of a jig for calibration; 校正用プレートの平面を模式的に示す図である。FIG. 4 is a diagram schematically showing a plane of a calibration plate; 標準試験片の撮像時における第２光学検査カメラを模式的に示す図である。FIG. 10 is a diagram schematically showing the second optical inspection camera when imaging a standard test piece; メンテナンス用の治具の一例を模式的に示す斜視図である。FIG. 4 is a perspective view schematically showing an example of a jig for maintenance; パターン部の一例を模式的に示す図である。It is a figure which shows an example of a pattern part typically. ＱＦＮパッケージのリード面の模様の一例を模式的に示す図である。FIG. 4 is a diagram schematically showing an example of a pattern on a lead surface of a QFN package; ＢＧＡパッケージのボール面の模様の一例を模式的に示す図である。FIG. 4 is a diagram schematically showing an example of the ball surface pattern of the BGA package; パッケージのモールド面の模様の一例を模式的に示す図である。FIG. 4 is a diagram schematically showing an example of a pattern on a mold surface of a package; 切断装置の組み付け後に行なわれる動作手順を示すフローチャートである。4 is a flow chart showing an operation procedure performed after the cutting device is assembled; 切断装置のメンテナンスのタイミングで行なわれる動作手順を示すフローチャートである。4 is a flow chart showing an operation procedure performed at the timing of maintenance of the cutting device;
　以下、本発明の一側面に係る実施の形態（以下、「本実施の形態」とも称する。）について、図面を用いて詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。また、各図面は、理解の容易のために、適宜対象を省略又は誇張して模式的に描かれている。 Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated. In addition, each drawing is schematically drawn by appropriately omitting or exaggerating objects for easy understanding.
　［１．構成］
　＜１－１．切断装置の全体構成＞
　図１は、本実施の形態に従うメンテナンス方法に用いられる切断装置１を模式的に示す平面図である。切断装置１は、パッケージ基板（切断対象物）を切断することによって、該パッケージ基板を複数の電子部品（パッケージ部品）に個片化するように構成されている。パッケージ基板においては、半導体チップが装着された基板又はリードフレームが樹脂封止されている。 [1. composition]
<1-1. Overall Configuration of Cutting Device>
FIG. 1 is a plan view schematically showing a cutting device 1 used in the maintenance method according to this embodiment. The cutting device 1 is configured to separate a package substrate (object to be cut) into a plurality of electronic components (package components) by cutting the package substrate. In a package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed.
　パッケージ基板の一例としては、ＢＧＡ（Ball Grid Array）パッケージ基板、ＬＧＡ（Land Grid Array）パッケージ基板、ＣＳＰ（Chip Size Package）パッケージ基板、ＬＥＤ（Light Emitting Diode）パッケージ基板、ＱＦＮ（Quad Flat No-leaded）パッケージ基板が挙げられる。 Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, QFN (Quad Flat No-lead ) package substrates.
　また、切断装置１は、個片化された複数の電子部品の各々を検査するように構成されている。切断装置１においては、各電子部品の画像が撮像され、該画像に基づいて各電子部品の検査が行なわれる。該検査を通じて検査データが生成され、各電子部品は「良品」又は「不良品」に分類される。 In addition, the cutting device 1 is configured to inspect each of the plurality of individualized electronic components. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as "non-defective" or "defective."
　この例においては、切断対象物としてパッケージ基板Ｐ１が用いられ、切断装置１によってパッケージ基板Ｐ１が複数の電子部品Ｓ１に個片化される。以下では、パッケージ基板Ｐ１の両面のうち、樹脂封止された面をモールド面と称し、モールド面と反対の面をボール／リード面と称する。 In this example, a package substrate P1 is used as an object to be cut, and the cutting device 1 separates the package substrate P1 into a plurality of electronic components S1. Hereinafter, of both surfaces of the package substrate P1, the resin-sealed surface is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a ball/lead surface.
　図１に示されるように、切断装置１は、構成要素として、切断モジュールＡ１と、検査・収納モジュールＢ１とを含んでいる。切断モジュールＡ１は、パッケージ基板Ｐ１を切断することによって複数の電子部品Ｓ１を製造するように構成されている。検査・収納モジュールＢ１は、製造された複数の電子部品Ｓ１の各々を検査し、その後、電子部品Ｓ１をトレイに収納するように構成されている。切断装置１において、各構成要素は、他の構成要素に対して着脱可能かつ交換可能である。 As shown in FIG. 1, the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1. The inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.
　切断モジュールＡ１は、主として、基板供給部３と、位置決め部４と、切断テーブル５と、スピンドル部６と、搬送部７とを含んでいる。 The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a transport section 7.
　基板供給部３は、複数のパッケージ基板Ｐ１を収容するマガジンＭ１からパッケージ基板Ｐ１を１つずつ押し出すことによって、パッケージ基板Ｐ１を１つずつ位置決め部４へ供給する。このとき、パッケージ基板Ｐ１は、ボール／リード面を上に向けて配置されている。 The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the magazine M1 that stores the plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball/lead surface facing upward.
　位置決め部４は、基板供給部３から押し出されたパッケージ基板Ｐ１をレール部４ａ上に配置することによって、パッケージ基板Ｐ１の位置決めを行う。その後、位置決め部４は、位置決めされたパッケージ基板Ｐ１を切断テーブル５へ搬送する。 The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 on the rail portions 4a. After that, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5 .
　切断テーブル５は、切断されるパッケージ基板Ｐを保持する。この例においては、２個の切断テーブル５を有するツインカットテーブル構成の切断装置１が例示されている。切断テーブル５は、保持部材５ａと、回転機構５ｂと、移動機構５ｃとを含んでいる。保持部材５ａは、位置決め部４によって搬送されたパッケージ基板Ｐ１を下方から吸着することによって、パッケージ基板Ｐ１を保持する。回転機構５ｂは、保持部材５ａを図のθ１方向に回転させることが可能である。移動機構５ｃは、保持部材５ａを図のＹ軸に沿って移動させることが可能である。 The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 having a twin-cut table configuration having two cutting tables 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below. The rotating mechanism 5b can rotate the holding member 5a in the θ1 direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.
　スピンドル部６は、パッケージ基板Ｐ１を切断することによって、パッケージ基板Ｐ１を複数の電子部品Ｓ１に個片化する。この例においては、２個のスピンドル部６を有するツインスピンドル構成の切断装置１が例示されている。スピンドル部６は、図のＸ軸及びＺ軸に沿って移動可能である。なお、切断装置１は、一個のスピンドル部６を有するシングルスピンドル構成としてもよい。 The spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. In this example, a twin-spindle cutting device 1 having two spindles 6 is illustrated. The spindle part 6 is movable along the X-axis and Z-axis of the figure. Note that the cutting device 1 may have a single spindle configuration having one spindle portion 6 .
　図２は、スピンドル部６を模式的に示す側面図である。図２に示されるように、スピンドル部６は、ブレード６ａと、回転軸６ｃと、第１フランジ６ｄと、第２フランジ６ｅと、締結部材６ｆとを含んでいる。 FIG. 2 is a side view schematically showing the spindle section 6. FIG. As shown in FIG. 2, the spindle portion 6 includes a blade 6a, a rotating shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.
　ブレード６ａは、高速回転することによって、パッケージ基板Ｐ１を切断し、パッケージ基板Ｐ１を複数の電子部品Ｓ１に個片化する。ブレード６ａは、一方のフランジ（第１フランジ）６ｄ及び他方のフランジ（第２フランジ）６ｅにより挟持された状態で、回転軸６ｃに装着される。第１フランジ６ｄ及び第２フランジ６ｅは、ナット等の締結部材６ｆによって回転軸６ｃに固定される。第１フランジ６ｄは奥フランジとも称され、第２フランジ６ｅは外フランジとも称される。 The blade 6a rotates at a high speed to cut the package substrate P1 and singulate the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotary shaft 6c while being sandwiched between one flange (first flange) 6d and the other flange (second flange) 6e. The first flange 6d and the second flange 6e are fixed to the rotating shaft 6c by a fastening member 6f such as a nut. The first flange 6d is also called an inner flange, and the second flange 6e is also called an outer flange.
　スピンドル部６には、高速回転するブレード６ａに向かって切削水を噴射する切削水用ノズル、冷却水を噴射する冷却水用ノズル、及び、切断屑等を洗浄する洗浄水を噴射する洗浄水用ノズル（いずれも不図示）等が設けられる。 The spindle portion 6 has a cutting water nozzle for injecting cutting water toward the blade 6a rotating at high speed, a cooling water nozzle for injecting cooling water, and a washing water nozzle for injecting washing water for washing cutting chips and the like. Nozzles (none of which are shown) and the like are provided.
　再び図１を参照して、切断テーブル５がパッケージ基板Ｐ１を吸着した後、第１位置確認カメラ５ｄによってパッケージ基板Ｐ１が撮像され、パッケージ基板Ｐ１の位置が確認される。第１位置確認カメラ５ｄを用いた確認は、例えば、パッケージ基板Ｐ１上に設けられたマークの位置の確認である。該マークは、例えば、パッケージ基板Ｐ１の切断位置を示す。 Referring to FIG. 1 again, after the cutting table 5 sucks the package substrate P1, the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. Confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark indicates, for example, the cutting position of the package substrate P1.
　その後、切断テーブル５は、図のＹ軸に沿いスピンドル部６に向かって移動する。切断テーブル５がスピンドル部６の下方に移動した後、切断テーブル５とスピンドル部６とを相対的に移動させることによって、パッケージ基板Ｐ１が切断される。その後、必要に応じて第２位置確認カメラ６ｂによってパッケージ基板Ｐ１が撮像され、パッケージ基板Ｐ１の位置等が確認される。第２位置確認カメラ６ｂを用いた確認は、例えば、パッケージ基板Ｐ１の切断位置及び切断幅の確認である。 After that, the cutting table 5 moves toward the spindle section 6 along the Y-axis in the figure. After the cutting table 5 moves below the spindle section 6, the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle section 6. FIG. After that, the package substrate P1 is imaged by the second position confirmation camera 6b as necessary, and the position and the like of the package substrate P1 are confirmed. Confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.
　切断テーブル５は、パッケージ基板Ｐ１の切断が完了した後、個片化された複数の電子部品Ｓ１を吸着した状態で、図のＹ軸に沿ってスピンドル部６から離れる方向に移動する。この移動過程において、第１クリーナ５ｅによって、電子部品Ｓ１の上面（ボール／リード面）の洗浄及び乾燥が行なわれる。 After the cutting of the package substrate P1 is completed, the cutting table 5 moves away from the spindle section 6 along the Y-axis in the drawing while sucking the plurality of individualized electronic components S1. In this moving process, the first cleaner 5e cleans and dries the upper surface (ball/lead surface) of the electronic component S1.
　搬送部７は、切断テーブル５に保持された電子部品Ｓ１を上方から吸着し、電子部品Ｓ１を検査・収納モジュールＢ１の検査テーブル１１へ搬送する。この搬送過程において、第２クリーナ７ａによって、電子部品Ｓ１の下面（モールド面）の洗浄及び乾燥が行なわれる。 The transport unit 7 sucks the electronic component S1 held on the cutting table 5 from above and transports the electronic component S1 to the inspection table 11 of the inspection/storage module B1. During this transfer process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1.
　検査・収納モジュールＢ１は、主として、検査テーブル１１と、第１光学検査カメラ１２と、第２光学検査カメラ１３と、配置部１４と、抽出部１５とを含んでいる。なお、第１光学検査カメラ１２は、切断モジュールＡ１に設けられていてもよい。 The inspection/storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement section 14, and an extraction section 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1.
　検査テーブル１１は、電子部品Ｓ１の光学的な検査のために、電子部品Ｓ１を保持する。検査テーブル１１は、図のＸ軸に沿って移動可能である。また、検査テーブル１１は、上下反転することができる。検査テーブル１１には、電子部品Ｓ１を吸着することによって電子部品Ｓ１を保持する保持部材が設けられている。 The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis of the figure. Also, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by sucking the electronic component S1.
　第１光学検査カメラ１２及び第２光学検査カメラ１３は、電子部品Ｓ１の両面（ボール／リード面及びモールド面）を撮像する。第１光学検査カメラ１２及び第２光学検査カメラ１３によって生成された画像データに基づいて、電子部品Ｓ１の各種検査が行なわれる。第１光学検査カメラ１２及び第２光学検査カメラ１３の各々は、検査テーブル１１の近傍において、上方を撮像するように配置されている。 The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball/lead surface and mold surface) of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the electronic component S1 are performed. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 so as to capture an upper image.
　第１光学検査カメラ１２には照明装置１２ａが設けられ、第２光学検査カメラ１３には照明装置１３ａが設けられている。照明装置１２ａは、第１光学検査カメラ１２による検査時に、検査テーブル１１に光を照射するように構成されている。照明装置１３ａは、第２光学検査カメラ１３による検査時に、検査テーブル１１に光を照射するように構成されている。 The first optical inspection camera 12 is provided with an illumination device 12a, and the second optical inspection camera 13 is provided with an illumination device 13a. The illumination device 12 a is configured to irradiate the inspection table 11 with light during inspection by the first optical inspection camera 12 . The illumination device 13 a is configured to irradiate the inspection table 11 with light during inspection by the second optical inspection camera 13 .
　第１光学検査カメラ１２は、搬送部７によって検査テーブル１１へ搬送される電子部品Ｓ１のモールド面を撮像する。その後、搬送部７は、検査テーブル１１の保持部材上に電子部品Ｓ１を載置する。保持部材が電子部品Ｓ１を吸着した後、検査テーブル１１は上下反転する。検査テーブル１１は第２光学検査カメラ１３の上方へ移動し、電子部品Ｓ１のボール／リード面が第２光学検査カメラ１３によって撮像される。一例として、第２光学検査カメラ１３による検査について次に説明する。 The first optical inspection camera 12 images the mold surface of the electronic component S1 transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the electronic component S<b>1 on the holding member of the inspection table 11 . After the holding member sucks the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13 and the ball/lead surface of the electronic component S1 is imaged by the second optical inspection camera 13 . As an example, inspection by the second optical inspection camera 13 will be described below.
　図３は、第２光学検査カメラ１３による検査の様子を模式的に示す図である。図３に示されるように、第２光学検査カメラ１３による検査は、電子部品Ｓ１を下面に保持する検査テーブル１１が第２光学検査カメラ１３の上方に位置する状態で行なわれる。具体的には、検査テーブル１１に保持された電子部品Ｓ１が第２光学検査カメラ１３により撮像されることによって画像データが生成され、生成された画像データに基づいて電子部品Ｓ１のボール／リード面の外観検査が行なわれる。上述のように、電子部品Ｓ１のモールド面の外観検査は、第１光学検査カメラ１２によって行なわれる。 FIG. 3 is a diagram schematically showing inspection by the second optical inspection camera 13. FIG. As shown in FIG. 3, the inspection by the second optical inspection camera 13 is performed in a state where the inspection table 11 holding the electronic component S1 on its lower surface is positioned above the second optical inspection camera 13. As shown in FIG. Specifically, image data is generated by imaging the electronic component S1 held on the inspection table 11 by the second optical inspection camera 13, and the ball/lead surfaces of the electronic component S1 are detected based on the generated image data. A visual inspection is performed. As described above, the visual inspection of the mold surface of electronic component S1 is performed by first optical inspection camera 12 .
　再び図１を参照して、配置部１４には、検査済みの電子部品Ｓ１が配置される。配置部１４は、図のＹ軸に沿って移動可能である。検査テーブル１１は、検査済みの電子部品Ｓ１を配置部１４に配置する。 With reference to FIG. 1 again, an inspected electronic component S1 is placed in the placement section 14 . The placement unit 14 is movable along the Y-axis of the drawing. The inspection table 11 arranges the inspected electronic component S<b>1 in the arrangement section 14 .
　抽出部１５は、配置部１４に配置された電子部品Ｓ１をトレイに移送する。電子部品Ｓ１は、第１光学検査カメラ１２及び第２光学検査カメラ１３を用いた検査の結果に基づいて、「良品」又は「不良品」に分別される。抽出部１５は、分別の結果に基づいて、各電子部品Ｓ１を良品用トレイ１５ａ又は不良品用トレイ１５ｂに移送する。すなわち、良品は良品用トレイ１５ａに収納され、不良品は不良品用トレイ１５ｂに収納される。良品用トレイ１５ａ及び不良品用トレイ１５ｂの各々は、電子部品Ｓ１で満たされると、新たなトレイに取り換えられる。 The extraction unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray. The electronic parts S1 are sorted into “non-defective products” or “defective products” based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13 . The extraction unit 15 transfers each electronic component S1 to the non-defective product tray 15a or the defective product tray 15b based on the sorting result. Namely, non-defective products are stored in the non-defective product tray 15a, and defective products are stored in the defective product tray 15b. When each of the non-defective product tray 15a and the defective product tray 15b is filled with electronic components S1, it is replaced with a new tray.
　切断装置１は、さらにコンピュータ５０とモニタ２０とを含んでいる。モニタ２０は、画像を表示するように構成されている。モニタ２０は、例えば、液晶モニタ又は有機ＥＬ（Electro Luminescence）モニタ等の表示デバイスで構成される。 The cutting device 1 further includes a computer 50 and a monitor 20. Monitor 20 is configured to display an image. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.
　コンピュータ５０は、例えば、切断モジュールＡ１及び検査・収納モジュールＢ１の各部の動作を制御する。コンピュータ５０によって、例えば、基板供給部３、位置決め部４、切断テーブル５、スピンドル部６、搬送部７、検査テーブル１１、第１光学検査カメラ１２、第２光学検査カメラ１３、配置部１４、抽出部１５及びモニタ２０の動作が制御される。 The computer 50, for example, controls the operation of each section of the cutting module A1 and the inspection/storage module B1. By the computer 50, for example, the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction Operations of the unit 15 and the monitor 20 are controlled.
　また、コンピュータ５０は、例えば、第１光学検査カメラ１２及び第２光学検査カメラ１３によって生成された画像データに基づいて、電子部品Ｓ１の各種検査を行なう。次に、コンピュータ５０について詳細に説明する。 The computer 50 also performs various inspections of the electronic component S1 based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example. Next, computer 50 will be described in detail.
　＜１－２．コンピュータのハードウェア構成＞
　図４は、コンピュータ５０のハードウェア構成を模式的に示す図である。図４に示されるように、コンピュータ５０は、演算部７０と、入出力Ｉ／Ｆ（interface）９０と、記憶部８０とを含み、各構成は、バスを介して電気的に接続されている。 <1-2. Computer hardware configuration>
FIG. 4 is a diagram schematically showing the hardware configuration of the computer 50. As shown in FIG. As shown in FIG. 4, the computer 50 includes an arithmetic unit 70, an input/output I/F (interface) 90, and a storage unit 80, each of which is electrically connected via a bus. .
　演算部７０は、ＣＰＵ（Central Processing Unit）７２、ＲＡＭ（Random Access Memory）７４及びＲＯＭ（Read Only Memory）７６等を含んでいる。演算部７０は、情報処理に応じて、コンピュータ５０内の各構成要素及び切断装置１内の各構成要素を制御するように構成されている。 The computing unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The calculation unit 70 is configured to control each component in the computer 50 and each component in the cutting apparatus 1 according to information processing.
　入出力Ｉ／Ｆ９０は、信号線を介して、切断装置１に含まれる各構成要素と通信するように構成されている。入出力Ｉ／Ｆ９０は、コンピュータ５０から切断装置１内の各構成要素へのデータの送信、切断装置１内の各構成要素からコンピュータ５０へ送信されるデータの受信に用いられる。 The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input/output I/F 90 is used for transmitting data from the computer 50 to each component within the cutting device 1 and for receiving data transmitted from each component within the cutting device 1 to the computer 50 .
　記憶部８０は、例えば、ハードディスクドライブ、ソリッドステートドライブ等の補助記憶装置である。記憶部８０は、例えば、制御プログラム８１を記憶するように構成されている。記憶部８０は、第１光学検査カメラ１２及び第２光学検査カメラ１３を用いた検査を通じて生成された検査データを記憶してもよい。 The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or solid state drive. The storage unit 80 is configured to store a control program 81, for example. The storage unit 80 may store inspection data generated through inspection using the first optical inspection camera 12 and the second optical inspection camera 13 .
　［２．外観検査の品質担保］
　上述のように、切断装置１においては、第１光学検査カメラ１２の撮像画像に基づいて電子部品Ｓ１のモールド面の外観検査（以下、「第１外観検査」とも称する。）が行なわれ、第２光学検査カメラ１３の撮像画像に基づいて電子部品Ｓ１のボール／リード面の外観検査（以下、「第２外観検査」とも称する。）が行なわれる。各外観検査においては、例えば、各カメラのピクセルサイズの情報（以下、「ピクセルサイズ情報」とも称する。）が用いられる。ピクセルサイズ（画像分解能）とは、カメラの各画素の一辺に対応する撮像対象の実際の長さのことをいう。例えば、カメラの１画素によって撮像される撮像対象の一辺の長さが１ｍｍである場合には、ピクセルサイズが１ｍｍとなる。 [2. Quality Assurance of Appearance Inspection]
As described above, in the cutting device 1, a visual inspection (hereinafter also referred to as a "first visual inspection") of the mold surface of the electronic component S1 is performed based on the image captured by the first optical inspection camera 12. 2 Based on the image captured by the optical inspection camera 13, a visual inspection of the ball/lead surface of the electronic component S1 (hereinafter also referred to as a "second visual inspection") is performed. In each visual inspection, for example, pixel size information of each camera (hereinafter also referred to as “pixel size information”) is used. Pixel size (image resolution) refers to the actual length of the imaged object corresponding to one side of each pixel of the camera. For example, if the length of one side of an imaging target imaged by one pixel of the camera is 1 mm, the pixel size is 1 mm.
　各カメラのピクセルサイズは、各カメラの校正（キャリブレーション）時に算出される。各カメラの校正は、例えば、切断装置１の設置後に行なわれる。第１光学検査カメラ１２の校正は、搬送部７に保持された校正用プレート１３０（後述）を第１光学検査カメラ１２で撮像することによって行なわれる。また、第２光学検査カメラ１３の校正は、検査テーブル１１に保持された校正用プレート１３０を第２光学検査カメラ１３で撮像することによって行なわれる。カメラの校正については、後程詳しく説明する。 The pixel size of each camera is calculated during calibration of each camera. Calibration of each camera is performed, for example, after installation of the cutting device 1 . The calibration of the first optical inspection camera 12 is performed by taking an image of the calibration plate 130 (described later) held by the transport unit 7 with the first optical inspection camera 12 . Further, calibration of the second optical inspection camera 13 is performed by imaging the calibration plate 130 held on the inspection table 11 with the second optical inspection camera 13 . Camera calibration will be explained in detail later.
　第１外観検査の品質は、第１光学検査カメラ１２のピクセルサイズ情報の精度の影響を受ける。第１光学検査カメラ１２のピクセルサイズ情報の精度が高い程、第１外観検査の品質は高くなる。また、第２外観検査の品質は、第２光学検査カメラ１３のピクセルサイズ情報の精度の影響を受ける。第２光学検査カメラ１３のピクセルサイズ情報の精度が高い程、第２外観検査の品質は高くなる。 The quality of the first visual inspection is affected by the accuracy of the pixel size information of the first optical inspection camera 12. The higher the accuracy of the pixel size information of the first optical inspection camera 12, the higher the quality of the first visual inspection. Also, the quality of the second visual inspection is affected by the accuracy of the pixel size information of the second optical inspection camera 13 . The higher the accuracy of the pixel size information of the second optical inspection camera 13, the higher the quality of the second visual inspection.
　第１光学検査カメラ１２のピクセルサイズ情報の精度は、第１光学検査カメラ１２の校正時における第１光学検査カメラ１２と校正用プレート１３０（搬送部７）との間の相対的な傾きの影響を受ける。第１光学検査カメラ１２の校正時に、第１光学検査カメラ１２の光軸が校正用プレート１３０に対して垂直に近い程、第１光学検査カメラ１２のピクセルサイズ情報の精度は高くなる。 The accuracy of the pixel size information of the first optical inspection camera 12 is affected by the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyor 7) when calibrating the first optical inspection camera 12. receive. When calibrating the first optical inspection camera 12, the closer the optical axis of the first optical inspection camera 12 is perpendicular to the calibration plate 130, the higher the accuracy of the pixel size information of the first optical inspection camera 12 is.
　また、第２光学検査カメラ１３のピクセルサイズ情報の精度は、第２光学検査カメラ１３の校正時における第２光学検査カメラ１３と校正用プレート１３０（検査テーブル１１）との間の相対的な傾きの影響を受ける。第２光学検査カメラ１３の校正時に、第２光学検査カメラ１３の光軸が校正用プレート１３０に対して垂直に近い程、第２光学検査カメラ１３のピクセルサイズ情報の精度は高くなる。 Also, the accuracy of the pixel size information of the second optical inspection camera 13 depends on the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) when calibrating the second optical inspection camera 13. affected by When calibrating the second optical inspection camera 13, the closer the optical axis of the second optical inspection camera 13 is to the calibration plate 130, the higher the accuracy of the pixel size information of the second optical inspection camera 13.
　さらに、第１外観検査の品質は、例えば、電子部品Ｓ１の第１外観検査時における第１光学検査カメラ１２と電子部品Ｓ１（搬送部７）との間の相対的な傾きの影響を受ける。第１外観検査時に、第１光学検査カメラ１２の光軸が電子部品Ｓ１に対して垂直に近い程、第１外観検査の品質は高くなる。また、第２外観検査の品質は、例えば、電子部品Ｓ１の第２外観検査時における第２光学検査カメラ１３と電子部品Ｓ１（検査テーブル１１）との間の相対的な傾きの影響を受ける。第２外観検査時に、第２光学検査カメラ１３の光軸が電子部品Ｓ１に対して垂直に近い程、第２外観検査の品質は高くなる。 Furthermore, the quality of the first visual inspection is affected by, for example, the relative tilt between the first optical inspection camera 12 and the electronic component S1 (conveyor 7) during the first visual inspection of the electronic component S1. During the first visual inspection, the closer the optical axis of the first optical inspection camera 12 is to the electronic component S1, the higher the quality of the first visual inspection. Also, the quality of the second visual inspection is affected by, for example, the relative tilt between the second optical inspection camera 13 and the electronic component S1 (inspection table 11) during the second visual inspection of the electronic component S1. During the second visual inspection, the closer the optical axis of the second optical inspection camera 13 is perpendicular to the electronic component S1, the higher the quality of the second visual inspection.
　このように、第１外観検査の品質を担保するためには、第１光学検査カメラ１２と搬送部７との間の相対的な傾きを管理する必要がある。また、第２外観検査の品質を担保するためには、第２光学検査カメラ１３と検査テーブル１１との間の相対的な傾きを管理する必要がある。 Thus, in order to ensure the quality of the first visual inspection, it is necessary to manage the relative tilt between the first optical inspection camera 12 and the transport section 7. Also, in order to ensure the quality of the second appearance inspection, it is necessary to manage the relative inclination between the second optical inspection camera 13 and the inspection table 11 .
　切断装置１においては、第１光学検査カメラ１２の校正を行なう前に、第１光学検査カメラ１２及び校正用プレート１３０（搬送部７）間における相対的な傾きが算出される。また、第２光学検査カメラ１３の校正を行なう前に、第２光学検査カメラ１３及び校正用プレート１３０（検査テーブル１１）間における相対的な傾きが算出される。第１光学検査カメラ１２及び校正用プレート１３０間における相対的な傾きの算出と、第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きの算出とは、実質的に同一の方法で行なわれる。ここでは代表的に、第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きの算出方法について説明する。 In the cutting device 1, before calibrating the first optical inspection camera 12, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyance unit 7) is calculated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. Calculation of the relative tilt between the first optical inspection camera 12 and the calibration plate 130 and calculation of the relative tilt between the second optical inspection camera 13 and the calibration plate 130 are performed by substantially the same method. done. Here, a representative method for calculating the relative tilt between the second optical inspection camera 13 and the calibration plate 130 will be described.
　図５は、校正用プレート１３０の撮像時における第２光学検査カメラ１３を模式的に示す図である。図５に示されるように、第２光学検査カメラ１３による校正用プレート１３０の撮像時に、検査テーブル１１は、第２光学検査カメラ１３の上方に位置している。検査テーブル１１の下面には治具１００が配置されている。治具１００は、ネジ等の固定部材によって、検査テーブル１１の下面の所定位置に固定されている。固定部材によって治具１００が検査テーブル１１に固定されるため、検査テーブル１１における治具１００の位置は予め決められた所定位置となる。例えば、所定位置において、治具１００の中心位置と検査テーブル１１の中心位置とは一致している。 FIG. 5 is a diagram schematically showing the second optical inspection camera 13 when imaging the calibration plate 130. FIG. As shown in FIG. 5 , the inspection table 11 is positioned above the second optical inspection camera 13 when the calibration plate 130 is imaged by the second optical inspection camera 13 . A jig 100 is arranged on the lower surface of the inspection table 11 . The jig 100 is fixed at a predetermined position on the lower surface of the inspection table 11 with a fixing member such as a screw. Since the jig 100 is fixed to the inspection table 11 by the fixing member, the position of the jig 100 on the inspection table 11 is a predetermined position. For example, at a predetermined position, the center position of the jig 100 and the center position of the inspection table 11 match.
　図６は、校正用の治具１００の一例を模式的に示す斜視図である。図６に示されるように、治具１００は、ベース１１０と、保持プレート１２０と、校正用プレート１３０とを含んでいる。ベース１１０、保持プレート１２０及び校正用プレート１３０の各々は、平面視矩形状の板状部材である。校正用プレート１３０は、保持プレート１２０に形成された凹部１２４内に配置され、校正用プレート１３０の四隅の各々の近傍がネジ１２２の頭部座面で押圧されることによって保持プレート１２０に固定されている。 FIG. 6 is a perspective view schematically showing an example of the jig 100 for calibration. As shown in FIG. 6, jig 100 includes base 110, holding plate 120, and calibration plate . Each of the base 110, the holding plate 120, and the calibration plate 130 is a plate-like member having a rectangular shape in plan view. The calibration plate 130 is placed in a recess 124 formed in the holding plate 120 , and is fixed to the holding plate 120 by pressing the vicinity of each of the four corners of the calibration plate 130 with the head bearing surfaces of the screws 122 . ing.
　図７は、校正用プレート１３０の平面を模式的に示す図である。図７に示されるように、校正用プレート１３０には所定のパターンが形成されている。所定のパターンは、例えば、印刷又は切削によって校正用プレート１３０に形成される。この例においては、校正用プレート１３０に複数のドットＤ１が印刷されている。所定パターンに関する情報は、例えば、記憶部８０（図４）に予め記憶されている。所定パターンに関する情報の一例としては、ドットＤ１の直径及びドットＤ１間の長さが挙げられる。 FIG. 7 is a diagram schematically showing the plane of the calibration plate 130. FIG. As shown in FIG. 7, a predetermined pattern is formed on the calibration plate 130 . A predetermined pattern is formed on the calibration plate 130 by, for example, printing or cutting. In this example, a plurality of dots D1 are printed on the calibration plate 130. FIG. Information about the predetermined pattern is stored in advance in the storage unit 80 (FIG. 4), for example. An example of the information about the predetermined pattern is the diameter of the dots D1 and the length between the dots D1.
　再び図６を参照して、保持プレート１２０は、保持プレート１２０の四隅の各々の近傍が押さえ部材１１４で押圧されることによって、ベース１１０に固定されている。各押さえ部材１１４は、第１面部１１４ａと、屈曲部１１４ｂと、第２面部１１４ｃとを含んでいる。屈曲部１１４ｂは、第１面部１１４ａ及び第２面部１１４ｃの各々に対して屈曲している。押さえ部材１１４の平面視において、第１面部１１４ａ及び第２面部１１４ｃは、屈曲部１１４ｂから互いに反対方向に延びている。第２面部１１４ｃはネジ１１６によってベース１１０に固定されており、第１面部１１４ａは保持プレート１２０をベース１１０方向に押圧している。これにより、保持プレート１２０がベース１１０に固定されている。ベース１１０には、複数のネジ穴１１２が形成されている。ネジ穴１１２にネジを通すことによって、治具１００が検査テーブル１１の所定位置に固定される。治具１００が検査テーブル１１の所定位置に固定された状態において、校正用プレート１３０の中心位置は、例えば、第２外観検査時における電子部品Ｓ１の中心位置と同一である。 Referring to FIG. 6 again, holding plate 120 is fixed to base 110 by pressing members 114 in the vicinity of each of the four corners of holding plate 120 . Each pressing member 114 includes a first surface portion 114a, a bent portion 114b, and a second surface portion 114c. The bent portion 114b is bent with respect to each of the first surface portion 114a and the second surface portion 114c. In a plan view of the pressing member 114, the first surface portion 114a and the second surface portion 114c extend in opposite directions from the bent portion 114b. The second surface portion 114c is fixed to the base 110 by screws 116, and the first surface portion 114a presses the holding plate 120 toward the base 110. As shown in FIG. The holding plate 120 is thereby fixed to the base 110 . A plurality of screw holes 112 are formed in the base 110 . The jig 100 is fixed at a predetermined position on the inspection table 11 by passing screws through the screw holes 112 . With the jig 100 fixed at a predetermined position on the inspection table 11, the center position of the calibration plate 130 is, for example, the same as the center position of the electronic component S1 during the second visual inspection.
　再び図５を参照して、第２光学検査カメラ１３は、治具１００に含まれる校正用プレート１３０を撮像し、画像データを生成する。切断装置１においては、生成された画像データに基づいて、第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きが算出される。切断装置１においては、例えば、図のθ１方向、θ２方向及びθ３方向の各々における相対的な傾きが算出される。第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きは、例えば、撮像画像における校正用プレート１３０のパターン（例えば、複数のドットＤ１）の歪具合に基づいて算出される。 Referring to FIG. 5 again, the second optical inspection camera 13 images the calibration plate 130 included in the jig 100 and generates image data. In the cutting device 1, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated based on the generated image data. In the cutting device 1, for example, relative inclinations in each of the θ1 direction, θ2 direction, and θ3 direction in the figure are calculated. The relative tilt between the second optical inspection camera 13 and the calibration plate 130 is calculated, for example, based on the degree of distortion of the pattern (for example, multiple dots D1) of the calibration plate 130 in the captured image.
　このように、切断装置１においては、第１光学検査カメラ１２の校正を行なう前に、第１光学検査カメラ１２及び校正用プレート１３０（搬送部７）間における相対的な傾きが算出される。また、第２光学検査カメラ１３の校正を行なう前に、第２光学検査カメラ１３及び校正用プレート１３０（検査テーブル１１）間における相対的な傾きが算出される。切断装置１によれば、各カメラと校正用プレート１３０との間における相対的な傾きに問題がないことが確認された上で各カメラの校正が行なわれるため、各カメラの校正の精度を担保することができる。その結果、切断装置１によれば、各外観検査の品質を担保することができる。 Thus, in the cutting device 1, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyance unit 7) is calculated before the first optical inspection camera 12 is calibrated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting apparatus 1, since each camera is calibrated after confirming that there is no problem with the relative inclination between each camera and the calibration plate 130, the accuracy of the calibration of each camera is guaranteed. can do. As a result, according to the cutting device 1, it is possible to ensure the quality of each appearance inspection.
　切断装置１の使用を開始して長期間が経過すると、例えば、各カメラと搬送部７又は検査テーブル１１との間の相対的な傾きが変化する場合がある。このような場合には、外観検査の品質が低下する。この他にも様々な要因によって、外観検査の品質が低下する場合がある。切断装置１においては、外観検査の品質低下を抑制するためのメンテナンスが行なわれる。メンテナンスを通じて外観検査のための各種調整が必要であると判定されると、必要な調整が行なわれる。メンテナンスは、各カメラで標準試験片２１０（後述）を撮像することによって行なわれる。第１光学検査カメラ１２及び第２光学検査カメラ１３の各々を用いたメンテナンスの方法は実質的に同一であるため、ここでは代表的に第２光学検査カメラ１３を用いたメンテナンスの方法について説明する。 When a long period of time elapses after starting to use the cutting device 1, for example, the relative tilt between each camera and the transport section 7 or the inspection table 11 may change. In such a case, the quality of visual inspection deteriorates. In addition to this, there are cases where the quality of the appearance inspection deteriorates due to various factors. In the cutting device 1, maintenance is performed to suppress quality deterioration in appearance inspection. When it is determined through maintenance that various adjustments for appearance inspection are necessary, the necessary adjustments are made. Maintenance is performed by imaging standard specimens 210 (described below) with each camera. Since the maintenance methods using the first optical inspection camera 12 and the second optical inspection camera 13 are substantially the same, the maintenance method using the second optical inspection camera 13 will be described as a representative here. .
　図８は、標準試験片２１０の撮像時における第２光学検査カメラ１３を模式的に示す図である。図８に示されるように、第２光学検査カメラ１３による標準試験片２１０の撮像時に、検査テーブル１１は、第２光学検査カメラ１３の上方に位置している。検査テーブル１１の下面には治具２００が配置されている。治具２００は、ネジ等の固定部材によって、検査テーブル１１の下面の所定位置に固定されている。固定部材によって治具２００が検査テーブル１１に固定されるため、検査テーブル１１における治具２００の位置は予め決められた所定位置となる。例えば、所定位置において、治具２００の中心位置と検査テーブル１１の中心位置とは一致している。 FIG. 8 is a diagram schematically showing the second optical inspection camera 13 during imaging of the standard test piece 210. FIG. As shown in FIG. 8 , the inspection table 11 is positioned above the second optical inspection camera 13 when the standard test piece 210 is imaged by the second optical inspection camera 13 . A jig 200 is arranged on the lower surface of the inspection table 11 . The jig 200 is fixed at a predetermined position on the lower surface of the inspection table 11 with a fixing member such as a screw. Since the jig 200 is fixed to the inspection table 11 by the fixing member, the position of the jig 200 on the inspection table 11 is a predetermined position. For example, at a predetermined position, the center position of the jig 200 and the center position of the inspection table 11 match.
　図９は、メンテナンス用の治具２００の一例を模式的に示す斜視図である。図９に示されるように、治具２００は、ベース１１０と、標準試験片２１０とを含んでいる。標準試験片２１０は、平面視矩形状の板状部材である。標準試験片２１０には、パターン部２２０が形成されている。パターン部２２０は、例えば、印刷又は切削によって標準試験片２１０に形成される。 FIG. 9 is a perspective view schematically showing an example of a jig 200 for maintenance. As shown in FIG. 9, jig 200 includes base 110 and standard test piece 210 . The standard test piece 210 is a plate-like member having a rectangular shape in plan view. A pattern portion 220 is formed on the standard test piece 210 . The patterned portion 220 is formed on the standard test piece 210 by, for example, printing or cutting.
　標準試験片２１０は、各長辺付近において２か所ずつ（計４か所）が押さえ部材１１４で押圧され、かつ、各長辺付近において３か所ずつ（計６か所）がネジ２１２によってネジ止めされることによってベース１１０に固定されている。上述のように、ベース１１０には、複数のネジ穴１１２が形成されている。ネジ穴１１２にネジを通すことによって、治具２００が検査テーブル１１の所定位置に固定される。 The standard test piece 210 is pressed by the pressing member 114 at two locations (four locations in total) near each long side, and is pressed at three locations (six locations in total) near each long side by screws 212. It is fixed to the base 110 by being screwed. As described above, the base 110 has a plurality of screw holes 112 formed therein. The jig 200 is fixed at a predetermined position on the inspection table 11 by passing screws through the screw holes 112 .
　図１０は、パターン部２２０の一例を模式的に示す図である。図１０に示されるように、パターン部２２０は、ＱＦＮパターン２２１－２２５と、ＢＧＡパターン２３１－２３５と、マークパターン２４１－２４４とを含んでいる。ＱＦＮパターン２２１－２２５、ＢＧＡパターン２３１－２３５及びマークパターン２４１－２４４の各々には、複数の同種類のパッケージの模様が含まれている。各パッケージの模様は、例えば、外観不良のないパッケージを示す。また、ＱＦＮパターン２２１－２２５、ＢＧＡパターン２３１－２３５及びマークパターン２４１－２４４の各々の大きさは、第１光学検査カメラ１２及び第２光学検査カメラ１３の各々の撮像範囲の大きさ以上である。 FIG. 10 is a diagram schematically showing an example of the pattern section 220. FIG. As shown in FIG. 10, the pattern section 220 includes QFN patterns 221-225, BGA patterns 231-235, and mark patterns 241-244. Each of the QFN patterns 221-225, the BGA patterns 231-235 and the mark patterns 241-244 includes patterns of a plurality of packages of the same type. The pattern on each package indicates, for example, a package without appearance defects. Also, the size of each of the QFN patterns 221-225, the BGA patterns 231-235 and the mark patterns 241-244 is equal to or larger than the size of the imaging range of each of the first optical inspection camera 12 and the second optical inspection camera 13. .
　ＱＦＮパターン２２１－２２５の各々には、複数のＱＦＮパッケージの模様が含まれている。ＱＦＮパターン２２１－２２５の各々に含まれているＱＦＮパッケージの模様は、ＱＦＮパッケージのリード面を示す。 Each of QFN patterns 221-225 includes patterns of a plurality of QFN packages. The QFN package pattern included in each of QFN patterns 221-225 indicates the lead surface of the QFN package.
　図１１は、ＱＦＮパッケージのリード面の模様の一例を模式的に示す図である。図１１に示されるように、模様２２９は、ＱＦＮパッケージのリード面を示す。 FIG. 11 is a diagram schematically showing an example of the pattern of the lead surface of the QFN package. As shown in FIG. 11, pattern 229 indicates the lead surface of the QFN package.
　再び図１０を参照して、ＱＦＮパターン２２１－２２５の各々には、複数の同じサイズのＱＦＮパッケージの模様が含まれている。ＱＦＮパターン２２１，２２２，２２３，２２４，２２５には、例えば、２ｍｍ角、３ｍｍ角、５ｍｍ角、７ｍｍ角、９ｍｍ角のＱＦＮパッケージの模様がそれぞれ含まれている。各模様の各辺の長さに関する情報は、例えば、記憶部８０（図４）に予め記憶されている。 Referring again to FIG. 10, each of the QFN patterns 221-225 includes patterns of a plurality of QFN packages of the same size. The QFN patterns 221, 222, 223, 224, and 225 include, for example, 2 mm square, 3 mm square, 5 mm square, 7 mm square, and 9 mm square QFN package patterns. Information about the length of each side of each pattern is stored in advance in the storage unit 80 (FIG. 4), for example.
　ＢＧＡパターン２３１－２３５の各々には、複数のＢＧＡパッケージの模様が含まれている。ＢＧＡパターン２３１－２３５の各々に含まれているＢＧＡパッケージの模様は、ＢＧＡパッケージのボール面を示す。 Each of the BGA patterns 231-235 includes patterns of a plurality of BGA packages. The BGA package pattern included in each of the BGA patterns 231-235 indicates the ball surface of the BGA package.
　図１２は、ＢＧＡパッケージのボール面の模様の一例を模式的に示す図である。図１２に示されるように、模様２３９は、ＢＧＡパッケージのボール面を示す。 FIG. 12 is a diagram schematically showing an example of the ball surface pattern of the BGA package. As shown in FIG. 12, pattern 239 indicates the ball surface of the BGA package.
　再び図１０を参照して、ＢＧＡパターン２３１－２３５の各々には、複数の同じサイズのＢＧＡパッケージの模様が含まれている。ＢＧＡパターン２３１，２３２，２３３，２３４，２３５には、例えば、２ｍｍ角、４ｍｍ角、８ｍｍ角、１０ｍｍ角、１２ｍｍ角のＢＧＡパッケージの模様がそれぞれ含まれている。各模様の各辺の長さに関する情報は、例えば、記憶部８０に予め記憶されている。 Referring again to FIG. 10, each of the BGA patterns 231-235 includes patterns of a plurality of BGA packages of the same size. The BGA patterns 231, 232, 233, 234, and 235 include, for example, 2 mm square, 4 mm square, 8 mm square, 10 mm square, and 12 mm square BGA package patterns. Information about the length of each side of each pattern is stored in advance in the storage unit 80, for example.
　マークパターン２４１－２４４の各々には、複数のパッケージの模様が含まれている。マークパターン２４１－２４４の各々に含まれているパッケージの模様は、パッケージのモールド面を示す。各パッケージの模様には、文字等を含むマークが含まれている。 Each of the mark patterns 241-244 includes patterns of a plurality of packages. The pattern of the package contained in each of the mark patterns 241-244 indicates the mold surface of the package. The pattern of each package includes a mark including letters and the like.
　図１３は、パッケージのモールド面の模様の一例を模式的に示す図である。図１３に示されるように、模様２４９は、パッケージのモールド面を示す。モールド面には、例えば、「ＡＢＣ」という文字を含むマークが形成されている。 FIG. 13 is a diagram schematically showing an example of the pattern on the mold surface of the package. As shown in FIG. 13, pattern 249 indicates the mold side of the package. A mark including, for example, letters "ABC" is formed on the mold surface.
　再び図１０を参照して、マークパターン２４１－２４４の各々には、複数の同じサイズのパッケージの模様が含まれている。マークパターン２４１，２４２，２４３，２４４には、例えば、３ｍｍ角、４ｍｍ角、７ｍｍ角、１２ｍｍ角のパッケージの模様がそれぞれ含まれている。各模様の各辺の長さに関する情報は、例えば、記憶部８０に予め記憶されている。 Again referring to FIG. 10, each of the mark patterns 241-244 includes patterns of a plurality of packages of the same size. The mark patterns 241, 242, 243, and 244 include, for example, patterns of packages of 3 mm square, 4 mm square, 7 mm square, and 12 mm square, respectively. Information about the length of each side of each pattern is stored in advance in the storage unit 80, for example.
　再び図８を参照して、第２光学検査カメラ１３は、標準試験片２１０に含まれる複数のパターンのうち撮像対象のパターンの下方に位置する。例えば、切断装置１によって製造される電子部品が２ｍｍ角のＱＦＮパッケージである場合に、第２光学検査カメラ１３は、標準試験片２１０のうちＱＦＮパターン２２１の下方に位置する。この状態で、第２光学検査カメラ１３は、標準試験片２１０を撮像し、画像データを生成する。 Referring to FIG. 8 again, the second optical inspection camera 13 is positioned below the pattern to be imaged among the multiple patterns included in the standard test piece 210 . For example, when the electronic component manufactured by the cutting apparatus 1 is a 2 mm square QFN package, the second optical inspection camera 13 is positioned below the QFN pattern 221 of the standard test piece 210 . In this state, the second optical inspection camera 13 images the standard test piece 210 and generates image data.
　切断装置１においては、生成された画像データに基づいて、例えば、撮像されたＱＦＮパッケージの模様の一辺の長さが算出される。具体的には、撮像画像におけるＱＦＮパッケージの模様の一辺に対応するピクセル数と、第２光学検査カメラ１３の校正時に算出されたピクセルサイズとを積算することによって、ＱＦＮパッケージの模様の一辺の長さが算出される。算出された一辺の長さと記憶部８０に記憶されている一辺の長さ（基準値）との差に基づいて、外観検査のための各種調整が必要であるか否かが判定される。 In the cutting device 1, for example, the length of one side of the imaged QFN package pattern is calculated based on the generated image data. Specifically, the length of one side of the QFN package pattern is calculated by multiplying the number of pixels corresponding to one side of the QFN package pattern in the captured image by the pixel size calculated when the second optical inspection camera 13 is calibrated. is calculated. Based on the difference between the calculated length of one side and the length of one side (reference value) stored in the storage unit 80, it is determined whether or not various adjustments for visual inspection are necessary.
　このように、切断装置１においては、メンテナンス時にピクセルサイズ情報の精度が確認される。切断装置１によれば、メンテナンス時にピクセルサイズ情報の精度に問題がないことが確認された上で電子部品Ｓ１の外観検査が行なわれるため、電子部品Ｓ１の外観検査の品質を継続的に担保することができる。以下、切断装置１の動作について詳細に説明する。 Thus, in the cutting device 1, the accuracy of the pixel size information is confirmed during maintenance. According to the cutting apparatus 1, the visual inspection of the electronic component S1 is performed after confirming that there is no problem with the accuracy of the pixel size information during maintenance, so the quality of the visual inspection of the electronic component S1 is continuously ensured. be able to. The operation of the cutting device 1 will be described in detail below.
　［３．電子部品の製造動作］
　＜３－１．切断装置の組み付け後における動作＞
　図１４は、切断装置１の組み付け後に行なわれる動作手順を示すフローチャートである。図１４を参照して、作業者は、検査テーブル１１の所定位置に校正用プレート１３０（治具１００）を組み付ける（ステップＳ１００）。コンピュータ５０は、検査テーブル１１に固定された校正用プレート１３０を撮像するように第２光学検査カメラ１３を制御する（ステップＳ１０５）。コンピュータ５０は、第２光学検査カメラ１３によって生成された画像データに基づいて、第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きを算出する（ステップＳ１１０）。 [3. Electronic component manufacturing operation]
<3-1. Operation after assembling the cutting device>
FIG. 14 is a flow chart showing the operation procedure performed after the cutting device 1 is assembled. Referring to FIG. 14, the operator assembles calibration plate 130 (jig 100) at a predetermined position on inspection table 11 (step S100). The computer 50 controls the second optical inspection camera 13 to image the calibration plate 130 fixed to the inspection table 11 (step S105). The computer 50 calculates the relative tilt between the second optical inspection camera 13 and the calibration plate 130 based on the image data generated by the second optical inspection camera 13 (step S110).
　コンピュータ５０は、算出された傾き情報を表示するようにモニタ２０を制御する（ステップＳ１１５）。その後、第２光学検査カメラ１３及び校正用プレート１３０間における相対的な傾きが所定範囲に収まっているか否かが判断される。この判断は、例えば、作業者によって行なわれる。 The computer 50 controls the monitor 20 to display the calculated tilt information (step S115). After that, it is determined whether or not the relative tilt between the second optical inspection camera 13 and the calibration plate 130 is within a predetermined range. This determination is made, for example, by an operator.
　相対的な傾きが所定範囲に収まっていないと判断されると（ステップＳ１２０においてＮＯ）、第２光学検査カメラ１３及び校正用プレート１３０（検査テーブル１１）の少なくとも一方の傾きが調整される（ステップＳ１２５）。この傾きの調整は、例えば、作業者によって手動で行なわれる。 If it is determined that the relative tilt is not within the predetermined range (NO in step S120), the tilt of at least one of the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is adjusted (step S125). This inclination adjustment is manually performed by an operator, for example.
　一方、相対的な傾きが所定範囲に収まっていると判断されると（ステップＳ１２０においてＹＥＳ）、コンピュータ５０は、検査テーブル１１に固定された校正用プレート１３０を撮像するように第２光学検査カメラ１３を制御する（ステップＳ１３０）。コンピュータ５０は、第２光学検査カメラ１３によって生成された画像データに基づいて、第２光学検査カメラ１３の校正処理を行なう（ステップＳ１３５）。例えば、コンピュータ５０は、第２光学検査カメラ１３によって生成された画像データ、及び、記憶部８０に記憶された校正用プレート１３０の所定パターンに関する情報に基づいて、第２光学検査カメラ１３のピクセルサイズを算出する。これにより、第２光学検査カメラ１３の校正が行なわれる。 On the other hand, if it is determined that the relative tilt is within the predetermined range (YES in step S120), the computer 50 controls the second optical inspection camera to image the calibration plate 130 fixed to the inspection table 11. 13 (step S130). The computer 50 performs calibration processing of the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 (step S135). For example, the computer 50 calculates the pixel size of the second optical inspection camera 13 based on the image data generated by the second optical inspection camera 13 and the information on the predetermined pattern of the calibration plate 130 stored in the storage unit 80. Calculate Thereby, the second optical inspection camera 13 is calibrated.
　コンピュータ５０は、校正結果（例えば、第２光学検査カメラ１３のピクセルサイズ）を表示するようにモニタ２０を制御する（ステップＳ１４０）。その後、第２光学検査カメラ１３の再校正の必要性が判断される（ステップＳ１４５）。例えば、算出されたピクセルサイズが規格を満たしていない場合に再校正が必要であると判断され、算出されたピクセルサイズが規格を満たしている場合に再校正が不要であると判断される。この判断は、例えば、作業者によって行なわれる。 The computer 50 controls the monitor 20 to display the calibration result (for example, the pixel size of the second optical inspection camera 13) (step S140). After that, the need for recalibration of the second optical inspection camera 13 is determined (step S145). For example, if the calculated pixel size does not meet the standard, it is determined that recalibration is necessary, and if the calculated pixel size meets the standard, it is determined that recalibration is unnecessary. This determination is made, for example, by an operator.
　第２光学検査カメラ１３の再校正が必要であると判断されると（ステップＳ１４５においてＹＥＳ）、切断装置１の組み付けに原因がある可能性があるため、切断装置１が組付けなおされる（ステップＳ１５０）。切断装置１の組付けなおしは、例えば、作業者によって行なわれる。 If it is determined that recalibration of the second optical inspection camera 13 is necessary (YES in step S145), the assembly of the cutting device 1 may be the cause, so the cutting device 1 is reassembled ( step S150). Reassembly of the cutting device 1 is performed by, for example, an operator.
　第２光学検査カメラ１３の再校正が不要であると判断された場合に（ステップＳ１４５においてＮＯ）、第１光学検査カメラ１２の校正も完了しているときは、切断装置１における電子部品Ｓ１の製造が開始される（ステップＳ１５５）。なお、第１光学検査カメラ１２についても、第２光学検査カメラ１３と同様、ステップＳ１００－Ｓ１５０に対応する動作が行なわれる。 When it is determined that recalibration of the second optical inspection camera 13 is unnecessary (NO in step S145), and the calibration of the first optical inspection camera 12 is also completed, the electronic component S1 in the cutting device 1 is Manufacturing is started (step S155). Note that the first optical inspection camera 12 also performs operations corresponding to steps S100 to S150 in the same manner as the second optical inspection camera 13 does.
　このように、切断装置１においては、第１光学検査カメラ１２の校正を行なう前に、第１光学検査カメラ１２及び校正用プレート１３０（搬送部７）間における相対的な傾きが算出される。また、第２光学検査カメラ１３の校正を行なう前に、第２光学検査カメラ１３及び校正用プレート１３０（検査テーブル１１）間における相対的な傾きが算出される。切断装置１によれば、各カメラと校正用プレート１３０との間における相対的な傾きに問題がないことが確認された上で各カメラの校正が行なわれるため、各カメラの校正の精度を担保することができる。その結果、切断装置１によれば、各外観検査の品質を担保することができる。 Thus, in the cutting device 1, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyance unit 7) is calculated before the first optical inspection camera 12 is calibrated. Also, before calibrating the second optical inspection camera 13, the relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) is calculated. According to the cutting apparatus 1, since each camera is calibrated after confirming that there is no problem with the relative inclination between each camera and the calibration plate 130, the accuracy of the calibration of each camera is guaranteed. can do. As a result, according to the cutting device 1, it is possible to ensure the quality of each appearance inspection.
　＜３－２．メンテナンスのタイミングにおける動作＞
　図１５は、切断装置１のメンテナンスのタイミングで行なわれる動作手順を示すフローチャートである。図１５を参照して、作業者は、検査テーブル１１の所定位置に標準試験片２１０（治具２００）を組み付ける（ステップＳ２００）。コンピュータ５０は、検査テーブル１１に固定された標準試験片２１０を撮像するように第２光学検査カメラ１３を制御する（ステップＳ２０５）。 <3-2. Operation at timing of maintenance>
FIG. 15 is a flow chart showing an operation procedure performed at the timing of maintenance of the cutting device 1. As shown in FIG. Referring to FIG. 15, the operator assembles standard test piece 210 (jig 200) at a predetermined position on inspection table 11 (step S200). The computer 50 controls the second optical inspection camera 13 to image the standard test piece 210 fixed on the inspection table 11 (step S205).
　コンピュータ５０は、第２光学検査カメラ１３によって生成された画像データに基づいて、標準試験片２１０の対象領域の長さを算出する（ステップＳ２１０）。コンピュータ５０は、例えば、撮像対象である模様（パッケージの模様）の一辺の長さを算出する。コンピュータ５０は、算出された一辺の長さと、記憶部８０に予め記憶されている撮像対象の模様の一辺の長さ（基準値）とを比較する（ステップＳ２１５）。 The computer 50 calculates the length of the target area of the standard test piece 210 based on the image data generated by the second optical inspection camera 13 (step S210). The computer 50 calculates, for example, the length of one side of the pattern (package pattern) to be imaged. The computer 50 compares the calculated length of one side with the length of one side of the pattern to be imaged (reference value) stored in advance in the storage unit 80 (step S215).
　コンピュータ５０は、比較結果に基づいて外観検査のための調整の要否を判定する（ステップＳ２２０）。例えば、算出された一辺の長さと基準値との差が第１所定値以上である場合には外観検査のための調整が必要であると判定され、算出された一辺の長さと基準値との差が第１所定値未満である場合には外観検査のための調整が不要であると判定される。 The computer 50 determines whether adjustment for visual inspection is necessary based on the comparison result (step S220). For example, if the difference between the calculated length of one side and the reference value is greater than or equal to the first predetermined value, it is determined that adjustment for appearance inspection is necessary, and the difference between the calculated length of one side and the reference value is determined. If the difference is less than the first predetermined value, it is determined that adjustment for visual inspection is unnecessary.
　外観検査のための調整が不要であると判定された場合に（ステップＳ２２０においてＮＯ）、第１光学検査カメラ１２に関する調整等も完了しているときは、切断装置１における電子部品Ｓ１の製造が開始される（ステップＳ２５０）。なお、第１光学検査カメラ１２についても、第２光学検査カメラ１３と同様、ステップＳ２００－Ｓ２４０に対応する動作が行なわれる。 When it is determined that adjustment for visual inspection is not necessary (NO in step S220), and the adjustment of the first optical inspection camera 12 and the like are also completed, the manufacturing of the electronic component S1 in the cutting device 1 is completed. is started (step S250). Note that the operations corresponding to steps S200 to S240 are performed for the first optical inspection camera 12 as well as for the second optical inspection camera 13. FIG.
　一方、外観検査のための調整が必要であると判定されると（ステップＳ２２０においてＹＥＳ）、コンピュータ５０は、第２光学検査カメラ１３の校正の要否を判定する（ステップＳ２２５）。例えば、算出された一辺の長さと基準値との差が第２所定値（第２所定値＞第１所定値）以上である場合には第２光学検査カメラ１３の校正が必要であると判定され、算出された一辺の長さと基準値との差が第２所定値未満である場合には第２光学検査カメラ１３の校正が不要であると判定される。 On the other hand, when it is determined that adjustment for visual inspection is necessary (YES in step S220), the computer 50 determines whether calibration of the second optical inspection camera 13 is necessary (step S225). For example, if the difference between the calculated length of one side and the reference value is greater than or equal to a second predetermined value (second predetermined value>first predetermined value), it is determined that calibration of the second optical inspection camera 13 is necessary. If the difference between the calculated length of one side and the reference value is less than the second predetermined value, it is determined that calibration of the second optical inspection camera 13 is unnecessary.
　第２光学検査カメラ１３の校正が必要であると判定されると（ステップＳ２２５においてＹＥＳ）、例えば、図１４のフローチャートに示される動作（校正フロー）が行なわれる（ステップＳ２３０）。一方、第２光学検査カメラ１３の校正が不要であると判定されると（ステップＳ２２５においてＮＯ）、外観検査に影響を与える各種パラメータの調整が行なわれる。各種パラメータの一例としては、照明装置１３ａの照度に関するパラメータが挙げられる。各種パラメータの調整は、例えば、作業者によって行なわれる。 When it is determined that calibration of the second optical inspection camera 13 is necessary (YES in step S225), for example, the operation (calibration flow) shown in the flowchart of FIG. 14 is performed (step S230). On the other hand, if it is determined that calibration of second optical inspection camera 13 is unnecessary (NO in step S225), various parameters that affect appearance inspection are adjusted. An example of various parameters is a parameter related to the illuminance of the illumination device 13a. Various parameters are adjusted, for example, by an operator.
　その後、外観検査のための調整が再度必要か否かの判断が行なわれる（ステップＳ２４０）。この判断は、例えば、作業者によって行なわれる。再度の調整が必要であると判断されると（ステップＳ２４０においてＹＥＳ）、再びステップＳ２００の動作が行なわれる。一方、再度の調整が不要であると判断された場合に（ステップＳ２４０においてＮＯ）、第１光学検査カメラ１２に関する調整等も完了しているときは、切断装置１における電子部品Ｓ１の製造が開始される（ステップＳ２５０）。 After that, it is determined whether or not adjustment for visual inspection is necessary again (step S240). This determination is made, for example, by an operator. If it is determined that readjustment is necessary (YES in step S240), the operation of step S200 is performed again. On the other hand, if it is determined that readjustment is unnecessary (NO in step S240), and if the adjustment of the first optical inspection camera 12 has been completed, the manufacturing of the electronic component S1 in the cutting device 1 is started. (step S250).
　このように、切断装置１においては、メンテナンス時にピクセルサイズ情報の精度が確認され、各カメラの再校正の必要性等が判断される。切断装置１によれば、メンテナンス時にピクセルサイズ情報の精度に問題がないことが確認された上で電子部品Ｓ１の外観検査が行なわれるため、電子部品Ｓ１の外観検査の品質を継続的に担保することができる。 Thus, in the cutting device 1, the accuracy of the pixel size information is confirmed during maintenance, and the necessity of recalibration of each camera is determined. According to the cutting apparatus 1, the visual inspection of the electronic component S1 is performed after confirming that there is no problem with the accuracy of the pixel size information during maintenance, so the quality of the visual inspection of the electronic component S1 is continuously ensured. be able to.
　［４．特徴］
　以上のように、切断装置１においては、メンテナンス時にピクセルサイズ情報の精度が確認される。切断装置１によれば、メンテナンス時にピクセルサイズ情報の精度に問題がないことが確認された上で電子部品Ｓ１の外観検査が行なわれるため、電子部品Ｓ１の外観検査の品質を継続的に担保することができる。 [4. feature]
As described above, in the cutting device 1, the accuracy of the pixel size information is confirmed during maintenance. According to the cutting apparatus 1, the visual inspection of the electronic component S1 is performed after confirming that there is no problem with the accuracy of the pixel size information during maintenance, so the quality of the visual inspection of the electronic component S1 is continuously ensured. be able to.
　なお、切断装置１は、本発明における「切断装置」の一例である。第１光学検査カメラ１２及び第２光学検査カメラ１３の各々は、本発明における「カメラ」の一例である。パッケージ基板Ｐ１は、本発明における「パッケージ基板」の一例である。電子部品Ｓ１は、本発明における「電子部品」の一例である。搬送部７及び検査テーブル１１の各々は、本発明における「テーブル」の一例である。標準試験片２１０は、本発明のおける「標準試験片」の一例である。 The cutting device 1 is an example of the "cutting device" in the present invention. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of a "camera" in the present invention. The package substrate P1 is an example of a "package substrate" in the present invention. The electronic component S1 is an example of the "electronic component" in the present invention. Each of the transport section 7 and the inspection table 11 is an example of the "table" in the present invention. The standard test piece 210 is an example of the "standard test piece" in the present invention.
　［５．他の実施の形態］
　上記実施の形態の思想は、以上で説明された実施の形態に限定されない。以下、上記実施の形態の思想を適用できる他の実施の形態の一例について説明する。 [5. Other embodiments]
The idea of the above embodiments is not limited to the embodiments described above. An example of another embodiment to which the concept of the above embodiment can be applied will be described below.
　＜５－１＞
　上記実施の形態においては、第１光学検査カメラ１２の校正を行なう前に第１光学検査カメラ１２及び校正用プレート１３０（搬送部７）間における相対的な傾きが算出され、第２光学検査カメラ１３の校正を行なう前に第２光学検査カメラ１３及び校正用プレート１３０（検査テーブル１１）間における相対的な傾きが算出された。しかしながら、これら相対的な傾きを算出する処理は必ずしも必要ではない。少なくとも、切断装置１のメンテナンス時に外観検査のための調整の要否が判断されていればよい。 <5-1>
In the above embodiment, the relative tilt between the first optical inspection camera 12 and the calibration plate 130 (conveyor 7) is calculated before calibrating the first optical inspection camera 12, and the second optical inspection camera The relative tilt between the second optical inspection camera 13 and the calibration plate 130 (inspection table 11) was calculated before performing the calibration of 13. However, the process of calculating these relative inclinations is not necessarily required. At least, it is sufficient if the need for adjustment for visual inspection is determined during maintenance of the cutting device 1 .
　＜５－２＞
　また、上記実施の形態においては、第１光学検査カメラ１２の校正前に校正用プレート１３０及び第１光学検査カメラ１２間における相対的な傾きが算出され、第２光学検査カメラ１３の校正前に校正用プレート１３０及び第２光学検査カメラ１３間における相対的な傾きが算出された。しかしながら、必ずしも各カメラの校正前にカメラ及び校正用プレート１３０間における相対的な傾きが算出されなくてもよい。少なくとも一方のカメラに関して、カメラの校正前にカメラ及び校正用プレート１３０間における相対的な傾きが算出されていればよい。 <5-2>
In the above embodiment, the relative tilt between the calibration plate 130 and the first optical inspection camera 12 is calculated before calibrating the first optical inspection camera 12, and before calibrating the second optical inspection camera 13 A relative tilt between the calibration plate 130 and the second optical inspection camera 13 was calculated. However, the relative tilt between the camera and the calibration plate 130 need not necessarily be calculated before calibrating each camera. For at least one of the cameras, the relative tilt between the camera and the calibration plate 130 should be calculated before calibrating the camera.
　＜５－３＞
　また、上記実施の形態においては、切断装置１のメンテナンス時に、第１光学検査カメラ１２及び第２光学検査カメラ１３の各々におけるピクセルサイズ情報の精度が確認された。しかしながら、必ずしも第１光学検査カメラ１２及び第２光学検査カメラ１３の両方についてピクセルサイズ情報の精度が確認される必要はない。例えば、第１光学検査カメラ１２及び第２光学検査カメラ１３のいずれか一方についてピクセルサイズ情報の精度が確認されるような構成であってもよい。 <5-3>
Further, in the above embodiment, the accuracy of the pixel size information in each of the first optical inspection camera 12 and the second optical inspection camera 13 was confirmed during maintenance of the cutting device 1 . However, it is not necessary to confirm the accuracy of the pixel size information for both the first optical inspection camera 12 and the second optical inspection camera 13 . For example, the configuration may be such that the accuracy of the pixel size information is confirmed for either one of the first optical inspection camera 12 and the second optical inspection camera 13 .
　＜５－４＞
　また、各カメラの校正には、各カメラの撮像範囲の大きさ（視野サイズ）を算出することが含まれていてもよい。 <5-4>
Further, the calibration of each camera may include calculating the size of the imaging range (view size) of each camera.
　＜５－５＞
　また、電子部品Ｓ１の外観検査においては、電子部品Ｓ１のカド部が検出されてもよい。この場合に、電子部品Ｓ１のカド部の検出が、撮像画像における輝度の変化量に基づいて検出されてもよい。図１５のステップＳ２３５において調整されるパラメータには、電子部品Ｓ１のカド部を検出するための輝度の変化量の閾値が含まれてもよい。 <5-5>
Moreover, in the visual inspection of the electronic component S1, the corner portion of the electronic component S1 may be detected. In this case, the detection of the corner portion of the electronic component S1 may be detected based on the amount of change in luminance in the captured image. The parameters to be adjusted in step S235 of FIG. 15 may include a luminance change amount threshold value for detecting corners of the electronic component S1.
　＜５－６＞
　また、図１４及び図１５のフローチャートにおける一部の動作は作業者（人）によって行なわれた。しかしながら、各動作が切断装置１によって自動的に行なわれてもよい。例えば、各判断が作業者ではなくコンピュータ５０によって行なわれてもよい。 <5-6>
Also, some of the operations in the flowcharts of FIGS. 14 and 15 were performed by an operator (person). However, each operation may be performed automatically by the cutting device 1 . For example, each determination may be made by the computer 50 instead of the operator.
　＜５－７＞
　また、標準試験片２１０には、矩形状のパッケージの模様が形成されていた。しかしながら、標準試験片２１０に形成される模様の形状は矩形に限られない。標準試験片２１０には、例えば、micro SD（登録商標）のような特殊な形状の模様が形成されてもよい。また、標準試験片２１０には、ＱＦＮパッケージ及びＢＧＡパッケージ以外のパッケージ（ＬＧＡパッケージ、ＣＳＰパッケージ等）の模様が形成されてもよい。 <5-7>
Also, the standard test piece 210 had a rectangular package pattern. However, the pattern shape formed on the standard test piece 210 is not limited to a rectangle. The standard test strip 210 may be patterned with a special shape such as micro SD (registered trademark), for example. Also, the standard test piece 210 may have patterns of packages other than the QFN package and the BGA package (LGA package, CSP package, etc.).
　以上、本発明の実施の形態について例示的に説明した。すなわち、例示的な説明のために、詳細な説明及び添付の図面が開示された。よって、詳細な説明及び添付の図面に記載された構成要素の中には、課題解決のために必須でない構成要素が含まれることがある。したがって、それらの必須でない構成要素が詳細な説明及び添付の図面に記載されているからといって、それらの必須でない構成要素が必須であると直ちに認定されるべきではない。 The embodiment of the present invention has been exemplified above. Accordingly, the detailed description and accompanying drawings have been disclosed for the purpose of illustrative description. Therefore, the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, the inclusion of such non-essential elements in the detailed description and accompanying drawings should not be construed as immediately identifying them as essential.
　また、上記実施の形態は、あらゆる点において本発明の例示にすぎない。上記実施の形態は、本発明の範囲内において、種々の改良や変更が可能である。すなわち、本発明の実施にあたっては、実施の形態に応じて具体的構成を適宜採用することができる。 Also, the above-described embodiment is merely an example of the present invention in all respects. Various improvements and modifications can be made to the above embodiment within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.
　１　切断装置、３　基板供給部、４　位置決め部、４ａ　レール部、５　切断テーブル、５ａ　保持部材、５ｂ　回転機構、５ｃ　移動機構、５ｄ　第１位置確認カメラ、５ｅ　第１クリーナ、６　スピンドル部、６ａ　ブレード、６ｂ　第２位置確認カメラ、６ｃ　回転軸、６ｄ　第１フランジ、６ｅ　第２フランジ、６ｆ　締結部材、７　搬送部、７ａ　第２クリーナ、１１　検査テーブル、１２　第１光学検査カメラ、１２ａ，１３ａ　照明装置、１３　第２光学検査カメラ、１４　配置部、１５　抽出部、１５ａ　良品用トレイ、１５ｂ　不良品用トレイ、２０　モニタ、５０　コンピュータ、７０　演算部、７２　ＣＰＵ、７４　ＲＡＭ、７６　ＲＯＭ、８０　記憶部、８１　制御プログラム、９０　入出力Ｉ／Ｆ、１００，２００　治具、１１０　ベース、１２０　保持プレート、１２４　凹部、１３０　校正用プレート、１１２　ネジ穴、１１４　押さえ部材、１１４ａ　第１面部、１１４ｂ　屈曲部、１１４ｃ　第２面部、１１６，１２２，２１２　ネジ、２１０　標準試験片、２２０　パターン部、２２１，２２２，２２３，２２４，２２５　ＱＦＮパターン、２３１，２３２，２３３，２３４，２３５　ＢＧＡパターン、２４１，２４２，２４３，２４４　マークパターン、２２９，２３９，２４９　模様、Ａ１　切断モジュール、Ｂ１　検査・収納モジュール、Ｄ１　ドット、Ｍ１　マガジン、Ｐ１　パッケージ基板、Ｓ１　電子部品。 1 cutting device, 3 substrate supply section, 4 positioning section, 4a rail section, 5 cutting table, 5a holding member, 5b rotating mechanism, 5c moving mechanism, 5d first position confirmation camera, 5e first cleaner, 6 spindle section, 6a Blade, 6b Second position confirmation camera, 6c Rotation shaft, 6d First flange, 6e Second flange, 6f Fastening member, 7 Transfer section, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 12a, 13a Illumination device, 13 Second optical inspection camera, 14 Placement unit, 15 Extraction unit, 15a Good product tray, 15b Defective product tray, 20 Monitor, 50 Computer, 70 Calculation unit, 72 CPU, 74 RAM, 76 ROM, 80 Storage part, 81 control program, 90 input/output I/F, 100, 200 jig, 110 base, 120 holding plate, 124 recessed part, 130 calibration plate, 112 screw hole, 114 pressing member, 114a first surface part, 114b bending part , 114c second surface portion, 116, 122, 212 screw, 210 standard test piece, 220 pattern portion, 221, 222, 223, 224, 225 QFN pattern, 231, 232, 233, 234, 235 BGA pattern, 241, 242, 243, 244 mark pattern, 229, 239, 249 pattern, A1 cutting module, B1 inspection/storage module, D1 dot, M1 magazine, P1 package substrate, S1 electronic component.

Claims (6)

  1. 　切断装置のメンテナンス方法であって、
    　前記切断装置は、パッケージ基板を切断することによって電子部品を製造し、第１画像データに基づいて前記電子部品の外観検査を行なうように構成されており、
    　前記第１画像データは、テーブルに配置された前記電子部品をカメラで撮像することによって生成され、
    　前記メンテナンス方法は、
    　前記テーブルに配置された標準試験片を前記カメラで撮像し、第２画像データを生成するステップと、
    　前記第２画像データに基づいて前記標準試験片の長さを算出するステップと、
    　算出された前記標準試験片の長さと前記切断装置において記憶されている前記標準試験片の長さに関する基準値とを比較し、比較結果に基づいて前記外観検査のための調整の要否を判定するステップとを含む、メンテナンス方法。     A cutting device maintenance method comprising:
    The cutting device is configured to manufacture an electronic component by cutting a package substrate and perform a visual inspection of the electronic component based on the first image data,
    The first image data is generated by imaging the electronic component placed on the table with a camera,
    The maintenance method is
    imaging the standard test piece placed on the table with the camera to generate second image data;
    calculating the length of the standard test piece based on the second image data;
    The calculated length of the standard test piece is compared with a reference value related to the length of the standard test piece stored in the cutting device, and the necessity of adjustment for the visual inspection is determined based on the comparison result. and a maintenance method.
  2. 　前記外観検査のための調整は、前記カメラの校正、又は、前記外観検査に関するパラメータの再設定である、請求項１に記載のメンテナンス方法。 The maintenance method according to claim 1, wherein the adjustment for the visual inspection is calibration of the camera or resetting of parameters related to the visual inspection.
  3. 　前記校正は、前記カメラのピクセルサイズを算出することを含む、請求項２に記載のメンテナンス方法。 The maintenance method according to claim 2, wherein said calibration includes calculating a pixel size of said camera.
  4. 　前記パラメータは、前記テーブルに光を照射する照明に関するパラメータを含む、請求項２又は請求項３に記載のメンテナンス方法。 The maintenance method according to claim 2 or claim 3, wherein the parameters include parameters relating to lighting for irradiating the table with light.
  5. 　前記外観検査のための調整が必要であると判定された場合に、前記外観検査のための調整を行なうステップをさらに含む、請求項１から請求項４のいずれか１項に記載のメンテナンス方法。 The maintenance method according to any one of claims 1 to 4, further comprising a step of adjusting for the visual inspection when it is determined that the adjustment for the visual inspection is necessary.
  6. 　請求項５に記載のメンテナンス方法を使用する、電子部品の製造方法であって、
    　前記メンテナンス方法の使用後に、前記パッケージ基板を切断することによって前記電子部品を製造するステップを含む、電子部品の製造方法。

          A method for manufacturing an electronic component using the maintenance method according to claim 5,
    A method of manufacturing an electronic component, comprising manufacturing the electronic component by cutting the package substrate after using the maintenance method.
PCT/JP2022/021903 2021-09-09 2022-05-30 Maintenance method and method for manufacturing electronic component WO2023037671A1 (en)

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US20130222579A1 (en) * 2010-10-13 2013-08-29 Koh Young Technology Inc. Measurement apparatus and correction method of the same
JP2014085115A (en) * 2012-10-19 2014-05-12 Inotech:Kk Dimension measurement device, dimension measurement method, and program for dimension measurement device
JP2018205023A (en) * 2017-05-31 2018-12-27 株式会社キーエンス Image inspection device, image inspection method, method for setting image inspection device, image inspection program, image device setting inspection program, computer readable recording medium, and recorded apparatus
JP2020017559A (en) * 2018-07-23 2020-01-30 Ｔｏｗａ株式会社 Transfer mechanism, electronic component manufacturing installation, transfer method and manufacturing method of electronic component
JP2020038087A (en) * 2018-09-03 2020-03-12 株式会社ディスコ Maintenance method for processing device, and processing device
JP2020516883A (en) * 2017-04-17 2020-06-11 コグネックス・コーポレイション High precision calibration system and method

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US20130222579A1 (en) * 2010-10-13 2013-08-29 Koh Young Technology Inc. Measurement apparatus and correction method of the same
JP2014085115A (en) * 2012-10-19 2014-05-12 Inotech:Kk Dimension measurement device, dimension measurement method, and program for dimension measurement device
JP2020516883A (en) * 2017-04-17 2020-06-11 コグネックス・コーポレイション High precision calibration system and method
JP2018205023A (en) * 2017-05-31 2018-12-27 株式会社キーエンス Image inspection device, image inspection method, method for setting image inspection device, image inspection program, image device setting inspection program, computer readable recording medium, and recorded apparatus
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