CN113871319A

CN113871319A - Mounting device and mounting method

Info

Publication number: CN113871319A
Application number: CN202110709043.7A
Authority: CN
Inventors: 冨樫徳和
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2020-06-30
Filing date: 2021-06-25
Publication date: 2021-12-31
Also published as: KR20220002113A; TW202202808A; KR20230148303A; KR102590191B1

Abstract

The invention provides a mounting device and a mounting method. The invention comprises the following steps: a substrate stage on which a substrate is placed; a stage moving mechanism that moves the substrate stage; a first detection unit that detects a position of an electronic component before mounting and a position of a predetermined mounting region of a substrate at a mounting position where the electronic component is mounted on the substrate; a bonding head which aligns a position of the electronic component with a position of a predetermined mounting region of the substrate at a mounting position and mounts the electronic component on the substrate; a second detection unit for detecting the mounted electronic component at an inspection position separated from the mounting position; and a control device including a deviation amount detection unit that detects a positional deviation amount between the position of the area to be mounted on the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detection unit, based on the position of the area to be mounted on the substrate detected by the first detection unit.

Description

Mounting device and mounting method

Technical Field

The present invention relates to an apparatus and a method for mounting electronic components.

Background

The mounting of the electronic component on the substrate is, for example, flip chip mounting. Flip chip mounting is a method of mounting an electronic component such as a semiconductor chip with a surface on which electrodes are formed facing a substrate on which a conductive pattern is formed. In flip chip mounting, it is necessary to directly bond the fine electrodes of the electronic component to the fine terminals of the conductive pattern formed on the substrate, and therefore, it is necessary to position the electronic component and the substrate with high accuracy.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. Hei 10-125728

Disclosure of Invention

[ problems to be solved by the invention ]

In recent years, the miniaturization and high density of circuits of electronic components such as semiconductor chips have led to a continuous increase in mounting accuracy. Therefore, after the electronic component is mounted, the alignment marks provided on the electronic component and the substrate are imaged by the imaging unit, and the positional deviation between the mounted electronic component and the substrate is inspected. For example, an infrared camera is used to capture images of alignment marks provided on a lower surface of a substrate side of an electronic component and alignment marks provided on an upper surface of the substrate by the electronic component, thereby detecting a position of the electronic component and a position of the substrate.

However, the alignment mark of the substrate positioned below the electronic component overlaps with the alignment mark or the wiring pattern of the electronic component, and therefore, the image cannot be captured, or the captured image is unclear, and therefore, the position of the substrate cannot be detected. In this case, the positional deviation between the mounted electronic component and the substrate cannot be determined, and the product cannot be inspected for an allowable range. In addition, a positional deviation amount to correct the position at the time of mounting cannot be obtained.

The present invention has been made to solve the above-described problems, and an object thereof is to provide a mounting apparatus and a mounting method capable of detecting a positional deviation between an electronic component and a substrate and detecting a positional deviation amount for correcting a position at the time of mounting even when the position of the mounted substrate cannot be detected.

[ means for solving problems ]

The present invention is a mounting device for mounting an electronic component on a substrate, including: a substrate stage on which the substrate is placed; a stage moving mechanism that moves the substrate stage; a first detection unit that detects a position of the electronic component before mounting and a position of a predetermined mounting area of the substrate at a mounting position of the substrate on which the electronic component is mounted on the substrate stage; a bonding head which aligns a position of the electronic component with a position of a predetermined mounting region of the substrate at the mounting position and mounts the electronic component on the substrate; a second detection unit that detects a position of the electronic component after the mounting at an inspection position spaced apart from the mounting position; and a control device including an offset amount detection unit that detects a positional offset amount between a position of the predetermined mounting area of the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection unit, based on the position of the predetermined mounting area of the substrate detected by the first detection unit.

Further, the present invention is a mounting method for mounting an electronic component on a substrate, including: a first detection process in which a first detection unit detects a position of the electronic component before mounting and a position of a region to be mounted on the substrate at a mounting position where the electronic component is mounted on the substrate; a mounting process of mounting the electronic component on the substrate by aligning a position of the electronic component with a position of a predetermined mounting region of the substrate based on a result of the first detection process with the bonding head at the mounting position; a second detection process of detecting a position of the electronic component after the mounting at an inspection position separated from the mounting position by a second detection unit; and an offset amount detection process of detecting a positional offset amount between a position of the predetermined mounting region of the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection process, based on the position of the predetermined mounting region of the substrate detected by the first detection process.

[ Effect of the invention ]

According to the present invention, it is possible to obtain a mounting apparatus and a mounting method capable of detecting a positional deviation between an electronic component and a substrate even when the position of the mounted substrate cannot be detected, and capable of detecting a positional deviation amount for correcting the position at the time of mounting.

Drawings

Fig. 1 is a plan view showing an electronic component mounting system to which a mounting device according to an embodiment is applied.

Fig. 2 is a front view showing an electronic component mounting system to which the mounting device of the embodiment is applied.

Fig. 3 is a sectional view taken along line a-a of fig. 2, and shows a state in which the image pickup unit enters between the bonding head and the substrate stage in order to photograph a region to be mounted on the electronic component and the substrate.

Fig. 4 is a sectional view taken along line a-a of fig. 2, and shows a state where an electronic component held by the bonding head is mounted on the substrate.

Fig. 5 is a functional block diagram of the control device.

Fig. 6 is a diagram showing the amount of movement from the mounting position to the inspection position.

Fig. 7 is a diagram showing a movement error from the mounting position to the inspection position.

Fig. 8 is a view showing a state in which an electronic component is mounted face down on a substrate.

Fig. 9 (a) is a diagram showing an alignment mark of an electronic component, and fig. 9 (B) is a diagram showing an alignment mark of a region to be mounted on a substrate.

Fig. 10 (a) is a diagram showing a state in which the alignment mark of the electronic component is aligned with the alignment mark of the area to be mounted on the substrate, and fig. 10 (B) is a diagram showing a state in which the alignment mark of the area to be mounted on the substrate is not recognized.

Fig. 11 is an example of an operation flowchart of the electronic component mounting system.

Fig. 12 (a) to 12 (C) show another embodiment of the alignment mark.

[ description of symbols ]

1: electronic component mounting system

2: electronic component

2a, 3a, am: alignment mark

2 b: bump

3: substrate

10: supply device

11: supply stage

12: sheet material

13: camera with a camera module

20: pick-up device

21: pick-up head

21 a: adsorption nozzle

22. 32: head moving mechanism

23. 323: supporting frame

30: mounting device

31: joint head

31 a: adsorption nozzle

33: substrate carrying platform

34: platform deck moving mechanism

35: first detecting part

35a, 42 a: image pickup unit

40: inspection unit

42: second detecting part

43: camera part lifting mechanism

50: control device

51: supply device control unit

52: pickup head control section

53: control part of joint head

54: substrate stage control unit

55: substrate position calculating section

56: correction value calculation unit

57: lifting mechanism control part

58: image pickup unit control unit

59 a: offset amount detection unit

59 b: determination unit

321: sliding mechanism

321 a: track

321b, and 2: sliding member

322: lifting mechanism

A. B: distance between two adjacent plates

M: storage unit

P1: supply position

P2: handover location

P3: mounting location

P4: checking the position

S01-S15: step (ii) of

X, Y, Z, θ: and (4) direction.

Detailed Description

Embodiments of the mounting device of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a plan view showing an electronic component mounting system to which a mounting device according to an embodiment is applied. Fig. 2 is a front view showing an electronic component mounting system to which the mounting device of the embodiment is applied.

The electronic component mounting system 1 is a system for mounting an electronic component 2 on a substrate 3. The electronic component 2 is, for example, a semiconductor chip including silicon. In the present embodiment, the electronic component 2 is a semiconductor chip on which a bump as a protruding electrode formed of a solder material is formed. The electronic component 2 is provided with an alignment mark. When the electronic component 2 is formed in a rectangular shape, the alignment marks are provided at the four corners or diagonal corners of the surface on which the bumps are formed.

The substrate 3 is a plate-like body as an object for mounting the electronic component 2. A conductive pattern to which a bump is connected is formed on the substrate 3. A surface of the substrate 3 on which the conductive pattern is formed is provided with a region to be mounted on which the electronic component 2 is to be mounted. The mounting predetermined area is provided in plurality here and arranged in an array. Alignment marks are respectively provided in the mounting predetermined regions. The alignment marks are provided, for example, in four corners or diagonal corners of a region to be mounted in a rectangular shape when the electronic component 2 is formed in the rectangular shape. After the alignment of the alignment marks of the electronic component 2 and the substrate 3 is performed, the electronic component 2 is mounted on the region to be mounted on the substrate 3. In the present embodiment, various positions such as the position of the electronic component 2 before or after mounting and the position of the region to be mounted on the substrate 3 are detected by detecting the position of the alignment mark. The alignment of the alignment marks means that the electronic component 2 to be mounted is aligned with the substrate 3 by setting the offset amount of the positions of the aligned alignment marks to be compared within a predetermined range.

(Structure)

The electronic part mounting system 1 includes: the supply device 10, the pickup device 20, the mounting device 30, and the control device 50 pick up the electronic component 2 from the supply device 10 by the pickup device 20, deliver the electronic component 2 to the mounting device 30, and mount the electronic component 2 on the substrate 3 by the mounting device 30.

The supply device 10 is a device that supplies the electronic parts 2. Specifically, the feeding device 10 includes a feeding stage 11 on which a sheet 12 on which the electronic component 2 is mounted is placed. The supply device 10 moves the supply stage 11 so that the electronic component 2 to be picked up comes to the supply position P1. The supply position P1 is a predetermined position at which the electronic component 2 picked up by the pickup device 20 as a pickup object is picked up by the pickup device 20. For example, the camera 13 is provided above the supply position P1 so that the optical axis thereof coincides with the supply position P1, and the supply device 10 moves the supply stage 11 so that the electronic component 2 to be picked up comes to the imaging center of the camera 13.

The sheet 12 on which the electronic component 2 placed on the supply stage 11 is mounted is a wafer sheet here. The sheet 12 is an adhesive sheet, and the electronic components 2 are arranged in a matrix (matrix) on the sheet 12. The electronic component 2 may be disposed with the bump exposed upward facing upward, or may be disposed with the bump in contact with the sheet 12 facing downward. In the present embodiment, the through-surface-up arrangement is assumed.

When the electronic component 2 is supplied to the pickup device 20, the supply device 10 may also easily peel the electronic component 2 from the sheet 12 by pushing up the electronic component 2 at the supply position P1 via the sheet 12 by a pin in the shape of a block or a needle provided below the supply position P1.

The pickup device 20 is a relay device that picks up the electronic parts 2 from the supply device 10 and delivers the picked-up electronic parts 2 to the mounting device 30. The pickup device 20 includes a pickup head 21 and a head moving mechanism 22. The pickup head 21 holds the electronic part 2, and releases the holding state to release the electronic part 2. Specifically, the pickup head 21 has a cylindrical adsorption nozzle 21 a. The inside of the suction nozzle 21a communicates with a negative pressure generating circuit such as a vacuum pump, and the electronic component 2 is held by sucking the electronic component 2 through an opening at the tip of the suction nozzle 21a by generating a negative pressure in the circuit. The electronic component 2 is removed from the suction nozzle 21a by releasing the negative pressure.

The head moving mechanism 22 reciprocates the pickup head 21 between a supply position P1 and a delivery position P2 where the electronic component 2 is delivered to the mounting apparatus 30. The head moving mechanism 22 may use, for example, a ball screw mechanism driven by a servomotor. The head moving mechanism 22 is provided on the support frame 23 so as to extend in the X-axis direction described later. The head moving mechanism 22 is provided with an adsorption nozzle 21a via a reversing mechanism. The reversing mechanism reverses the orientation of the adsorption nozzle 21 a. When the head moving mechanism 22 holds the electronic component 2 by suction by the suction nozzle 21a whose open end faces downward at the supply position P1, the head moving mechanism 22 positions the suction nozzle 21a at the delivery position P2. The head moving mechanism 22 rotates the adsorption nozzle 21a by 180 ° by the reversing mechanism so that the open end holding the electronic component 2 faces upward, thereby reversing the electronic component 2. Then, the inverted electronic part 2 is handed over to the mounting device 30.

In the present embodiment, the supply device 10 and the mounting device 30 are arranged in a lateral direction. The arrangement direction of the supply device 10 and the mounting device 30, i.e., the linear direction connecting the supply position P1 and the mounting position P3 is defined as the X-axis direction. In addition, on a horizontal plane on which supply stage 11 extends, a direction orthogonal to the X-axis direction is referred to as a Y-axis direction, and a direction orthogonal to the X-axis and the Y-axis is referred to as a Z-axis direction. In this specification, the position in the Z-axis direction is sometimes simply referred to as "height". For example, a specific reference position may be determined as a position in the Z axis direction of a specific position on substrate stage 33 described later, and the distance in the Z axis direction from the reference position may be set as a height. Further, the rotation direction on the XY plane with the Z axis as the center is defined as the θ direction.

The mounting device 30 is a device that carries the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts the electronic component on the substrate 3. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate 3, and is set at a fixed position here.

The mounting device 30 includes: a bonding head 31, a head moving mechanism 32, a substrate stage 33, a stage moving mechanism 34, a first detection unit 35, and an inspection unit 40.

The bonding head 31 is mounted on the substrate 3 at the mounting position P3 by aligning the position of the electronic component 2 with the position of the region to be mounted on the substrate 3 based on the detection result of the first detecting unit 35 described later. Specifically, the bonding head 31 receives the electronic component 2 from the pickup device 20 at the delivery position P2, and mounts the electronic component 2 on the substrate 3 at the mounting position P3. The bonding head 31 holds the electronic part 2, and releases the holding state to release the electronic part 2 after mounting. Specifically, the bonding head 31 has a cylindrical adsorption nozzle 31 a. The inside of the suction nozzle 31a communicates with a negative pressure generating circuit such as a vacuum pump, and the electronic component 2 is held by sucking the electronic component 2 through an opening at the tip of the suction nozzle 31a by generating a negative pressure in the circuit. The electronic component 2 is detached from the suction nozzle 31a by releasing the negative pressure.

The bonding head 31 is reciprocated between a delivery position P2 and a mounting position P3 by the head moving mechanism 32, and is lifted and lowered at the delivery position P2 and the mounting position P3. In other words, the head moving mechanism 32 includes a sliding mechanism 321 and an elevating mechanism 322.

The slide mechanism 321 moves the joint head 31 linearly between the delivery position P2 and the attachment position P3. Here, the slide mechanism 321 includes: two rails 321a extending parallel to the X-axis direction and fixed to the support frame 323; and a slider 321b that travels on the rail 321 a. Although not shown, the slide mechanism 321 includes a slide mechanism for sliding the bonding head 31 in the Y-axis direction. The sliding mechanism may also include a rail in the Y-axis direction and a slider that travels on the rail. When the slide mechanism 321 moves the suction nozzle 31a of the bonding head 31 to the transfer position P2, the suction nozzle 31a faces the suction nozzle 21a of the pickup head 21 located at the transfer position P2 across the electronic component 2. When the slide mechanism 321 moves the suction nozzle 31a holding the electronic component 2 to the mounting position P3, the suction nozzle 31a faces a region to be mounted on the substrate 3 positioned at the mounting position P3 across the electronic component 2.

The lifting mechanism 322 lifts the bonding head 31. Here, the elevation direction is a direction parallel to the Z-axis direction. Specifically, the elevating mechanism 322 may use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is moved up and down in the Z-axis direction by the driving of the servo motor.

The substrate stage 33 is a stage on which the substrate 3 is placed. The substrate stage 33 slides on the XY plane. Further, the substrate stage 33 rotates in the θ direction on the XY plane.

The stage moving mechanism 34 slides the substrate stage 33 on the XY plane. Specifically, stage moving mechanism 34 includes: an X-axis moving mechanism that moves substrate stage 33 in the X-axis direction, a Y-axis moving mechanism that moves substrate stage 33 in the Y-axis direction, and a rotating mechanism that rotates substrate stage 33 in the θ direction.

The X-axis movement mechanism and the Y-axis movement mechanism include, for example, a servo motor and a ball screw mechanism, and the ball screw mechanism includes a screw shaft, a nut, a guide rail, and a slider. The X-axis moving mechanism is provided with a screw shaft and a guide rail extending in the X-axis direction, and a nut is screwed with the screw shaft. A substrate stage 33 is fixed to the nut via a slider, and by rotating a screw shaft by a servo motor, the slider moves along a guide rail extending in the X-axis direction, and the substrate stage 33 moves linearly in the X-axis direction. The Y-axis moving mechanism is provided with a screw shaft and a guide rail extending in the Y-axis direction, and a nut is screwed with the screw shaft. An X-axis moving mechanism is fixed to the nut via a slider, and by rotating a screw shaft by a servo motor, the slider moves along a guide rail extending in the Y-axis direction, and the substrate stage 33 moves linearly in the Y-axis direction together with the X-axis moving mechanism.

The rotation mechanism includes, for example, a servo motor, a rotation shaft, and a transmission mechanism, and transmits power of the servo motor to the rotation shaft by a transmission mechanism using a gear or a belt, thereby rotating the substrate stage 33.

The first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the region to be mounted on the substrate 3 at the mounting position P3. The first detection unit 35 of the present embodiment includes an imaging unit 35a that images the alignment mark of the electronic component 2 and the alignment mark of the planned mounting region of the substrate 3 at the mounting position P3, extracts a predetermined position of the alignment mark from the image captured by the imaging unit 35a, for example, extracts an outline shape from the outline of the recognized alignment mark, and detects points such as the center of gravity, corners, and the like. The detection of the predetermined position may be performed by a circuit included in the imaging unit 35a, or may be performed by a control device 50 described later. When the control device 50 performs this, the control device 50 assumes a part of the function of the first detection unit 35.

The imaging unit 35a is a two-field-of-view camera. That is, as shown in fig. 3, the image pickup unit 35a enters between the bonding head 31 and the substrate stage 33, and picks up an image of the alignment mark of the electronic component 2 held by the upper suction nozzle 31a and the alignment mark in the region to be mounted at the mounting position P3 on the lower substrate 3. As shown in fig. 3, the image pickup unit 35a enters between the bonding head 31 and the substrate stage 33 before the electronic component 2 is mounted on the substrate 3, and is retracted to a position not interfering with the bonding head 31 as shown in fig. 4 when mounting is performed by the bonding head 31.

The inspection unit 40 inspects a positional deviation between the mounted electronic component 2 and the substrate 3. The inspection unit 40 includes a second detection unit 42 and an image pickup unit elevating mechanism 43 (see fig. 1 and 2). The second detector 42 detects the position of the electronic component 2 after mounting at an inspection position P4, which will be described later and is separated from the mounting position P3. The second detection unit 42 of the present embodiment also has a function of detecting the position of the region to be mounted on the substrate 3 on which the electronic component 2 is mounted.

The second detection unit 42 includes an imaging unit 42a that images the mounted electronic component 2 and the substrate 3, extracts a predetermined position of the alignment mark from the image captured by the imaging unit 42a, for example, extracts an outline shape from the outline of the alignment mark, and detects a point such as the center of gravity and an angle thereof. The detection of the predetermined position may be performed by a circuit included in the imaging unit 42a, or may be performed by a control device 50 described later. When the control device 50 performs this, the control device 50 assumes a part of the function of the second detection unit 42.

The imaging unit 42a images the alignment mark of the mounted electronic component 2 and the alignment mark of the region to be mounted on the substrate 3. The imaging unit 42a images at least two alignment marks for each electronic component 2. The imaging unit 42a images at least two alignment marks for each of the mounting portions of the substrate 3. The imaging unit 42a may use an Infrared (IR) camera. The imaging unit 42a images the alignment mark of the electronic component 2 and the alignment mark of the predetermined mounting region of the substrate 3 by passing infrared rays through the electronic component 2.

The second detector 42 is disposed at the inspection position P4. That is, the imaging unit 42a is provided above the substrate stage 33 so that the optical axis of the camera coincides with the inspection position P4. The inspection position P4 is a position at which the positional deviation between the electronic component 2 and the board 3, that is, the positional deviation between the alignment mark of the electronic component 2 and the alignment mark of the board 3 in the area to be mounted is inspected by imaging the area to be mounted of the electronic component 2 and the board 3 by the imaging unit 42 a. The positional deviation is a positional deviation when each alignment mark of the area to be mounted with the electronic component 2 and the substrate 3 is projected onto the XY plane. In the present embodiment, the inspection position P4 is a fixed position.

The image pickup unit elevation mechanism 43 elevates the image pickup unit 42 a. Here, the ascending and descending direction is a direction parallel to the Z-axis direction, i.e., a direction in which the mounted electronic component 2 located at the inspection position P4 advances and retreats. The image pickup section elevating mechanism 43 may use a ball screw mechanism driven by a servomotor. That is, the imaging unit 42a is moved up and down in the Z-axis direction by driving of the servo motor.

The image pickup unit elevating mechanism 43 is focused to such an extent that the alignment mark of the mounted electronic component 2 or the alignment mark of the region to be mounted on the substrate 3 can be recognized by the image pickup unit 42 a. In other words, the image pickup unit elevating mechanism 43 adjusts the height of the image pickup unit 42a so that the alignment mark of the mounted electronic component 2 or the alignment mark of the region to be mounted of the substrate 3 to be an image pickup object is limited to the depth of field of the lens of the image pickup unit 42 a. The height adjustment is performed by controlling the image pickup unit elevating mechanism 43 by an elevating mechanism control unit 57 described later. Depending on the magnification or numerical aperture for obtaining the accuracy of the desired positional information, the facing distance between the alignment mark of the electronic component 2 mounted on the substrate 3 and the alignment mark of the region to be mounted on the substrate 3, that is, the separation distance in the height direction may exceed the depth of field (for example, 10 μm) of the lens of the imaging unit 42 a. Therefore, the image pickup unit elevating mechanism 43 switches the height of the image pickup unit 42a between the case of picking up an image of the alignment mark of the electronic component 2 and the case of picking up an image of the alignment mark of the area to be mounted on the substrate 3.

The control device 50 controls the start, stop, speed, operation timing, and the like of the supply device 10, the pickup device 20, the mounting device 30, and the inspection unit 40. The control device 50 can be realized by, for example, a dedicated electronic circuit, a computer running a predetermined program, or the like. An input device for inputting instructions and information necessary for the operator to perform control and an output device for confirming the state of the device and outputting the same are connected to the control device 50. For example, a jog dial (jog dial), a mouse, a touch panel, or the like that operates the stage moving mechanism 34 to move the substrate stage 33 to a desired position is an example of the input device. A display device, such as a speaker or a buzzer, for displaying an image captured by the imaging unit 35a or the imaging unit 42a, an image captured by the mounting position P3 or the inspection position P4, a point extracted from the alignment mark, or a positional displacement amount on a display screen is an example of an output device.

Fig. 5 is a functional block diagram of the control device 50. As shown in fig. 5, the control device 50 includes: a supply device control unit 51, a pickup head control unit 52, a bonding head control unit 53, a substrate stage control unit 54, a substrate position calculation unit 55, a correction value calculation unit 56, an elevation mechanism control unit 57, an imaging unit control unit 58, a shift amount detection unit 59a, a determination unit 59b, and a storage unit M.

The supply device control unit 51 controls the movement of the supply stage 11 so that the electronic component 2 to be supplied placed on the sheet 12 of the supply stage 11 is positioned at the supply position P1.

The pickup control section 52 controls the operation of the pickup device 20. Specifically, the pickup control section 52 controls a negative pressure generation circuit communicating with the inside of the suction nozzle 21a, and controls holding and releasing of the electronic component 2. The head control unit 52 controls the movement of the pickup head 21, that is, the operation of the head moving mechanism 22.

The joint head control unit 53 controls the movement of the joint head 31, that is, the operation of the head moving mechanism 32. The substrate stage control unit 54 controls the operation of the stage moving mechanism 34.

The substrate position calculating part 55 calculates the position when the region to be mounted of the substrate 3 is moved from the mounting position P3 to the inspection position P4. The amount of movement in this case is theoretically a distance B in the direction of a distance A, Y in the X direction from the fixed mounting position P3 to the fixed inspection position P4, as shown in fig. 6. Therefore, in the coordinate system for controlling the movement of stage moving mechanism 34, the coordinates (X + a, Y + B) obtained by adding distance a and distance B to the coordinates (X, Y) when alignment mark am in each planned mounting area of substrate 3 is aligned with fixed mounting position P3, becomes the coordinates (X ', Y') when alignment mark am in each planned mounting area is moved to inspection position P4.

However, in the movement of the substrate stage 33 by the stage moving mechanism 34, there is a movement error due to the mechanism portion. That is, the stage moving mechanism 34 includes, for example, a guide rail along the X-axis direction and a guide rail along the Y-axis direction. Such a guide rail may have fluctuation or strain due to machining accuracy or assembly accuracy. Therefore, even if the substrate stage 33 is moved with the theoretical distances a and B as the movement distances of the coordinate system for moving the stage moving mechanism 34, the actual moving position is shifted from the inspection position P4 by the movement error as shown in fig. 7. The movement error includes not only an error of the movement distance in the X direction, an error of the movement distance in the Y direction, but also an error of the rotation direction on the XY plane, that is, an angle in the θ direction. That is, even if the distance a is moved in the X direction and the distance B is moved in the Y direction from the coordinates (X, Y) when the alignment mark am of each planned mounting region is aligned with the mounting position P3, the alignment mark am of each planned mounting region is shifted from the coordinates (X ', Y') of the inspection position P4 due to the movement errors in the X direction, the Y direction, and the θ direction.

To cope with this, the present embodiment includes a correction value calculation unit 56. The correction value calculating section 56 calculates a correction value for the substrate position calculating section 55 to calculate a position at which the predetermined mounting region is moved from the mounting position P3 to the inspection position P4. The correction values are movement amounts by which movement errors in the X direction, the Y direction, and the θ direction are corrected. The substrate position calculating section 55 calculates the position of each region to be mounted when moved from the mounting position P3 to the inspection position P4 based on the correction value calculated by the correction value calculating section 56.

For example, the correction value calculation unit 56 detects coordinates when the substrate stage 33 is moved in advance to align each area to be mounted of the substrate 3 with the mounting position P3. Further, the correction value calculation unit 56 detects coordinates when the substrate stage 33 is moved to align each planned mounting region with the inspection position P4, and calculates each movement distance between the two coordinates in the X direction and the Y direction. In this case, each movement distance includes not only the X direction and the Y direction but also a movement error in the θ direction.

More specifically, the following is performed using a display device that displays images captured by the imaging unit 35a and the imaging unit 42a, an input device that operates the stage movement mechanism 34, and calibration glass (calibration glass) to which marks corresponding to the respective regions to be mounted on the substrate 3 are given. That is, the coordinates of the marks displayed on the display device after the alignment glass is placed on the substrate stage 33 and imaged by the imaging unit 35a are detected when the marks are aligned with the mounting positions P3 by operating the input device. Further, the coordinates when the calibration glass is moved by operating the input device, and the marks displayed on the display device are aligned with the inspection positions P4 by imaging with the imaging unit 42a are detected. The respective amounts of movement in the X direction and the Y direction between the coordinates detected for each mark are obtained, and these amounts of movement are used as correction values when each region to be mounted is moved from the mounting position P3 to the inspection position P4.

Further, the correction value calculation unit 56 preferably prepares in advance a correction value for moving from the mounting position P3 to the inspection position P4 for all the regions to be mounted. However, the movement amounts (X direction, Y direction) need not be obtained in the above order for all the regions to be mounted. For example, a movement amount (X direction, Y direction) with respect to a reference position is obtained by using one predetermined mounting region of a predetermined region of the substrate 3 as the reference position (representative point, representative position of the region). Then, the movement amount (X direction, Y direction) is obtained based on the relative position with respect to the reference position with respect to the other predetermined mounting region among the regions. Thereby, a correction value of the position of each mounting scheduled area can be calculated. Therefore, the mark of the calibration glass does not necessarily have to correspond to each region to be mounted, and may be provided at a position representing a predetermined region.

Further, it is preferable that the correction value calculation unit 56 calculates the correction value at a predetermined timing. That is, it is preferable that the temporarily calculated correction value is not constantly used in a fixed manner as the attachment device 30 is operated, but is calculated and updated at a timing set in advance. For example, it is conceivable to update the correction value by performing calculation every time a predetermined time elapses from the start of operation, every time an unallowable positional deviation occurs, or every time the frequency of the unallowable positional deviation within the predetermined time reaches a threshold value.

The elevation mechanism control unit 57 is a control unit that controls the image pickup unit elevation mechanism 43. For example, the elevation mechanism control unit 57 controls the image pickup unit elevation mechanism 43 to adjust the height of the image pickup unit 42 a. The imaging unit control unit 58 controls the operation of the imaging unit 42 a. For example, the start, stop, shooting, and shooting timing of the imaging unit 42a are controlled.

The offset amount detecting portion 59a detects the amount of positional offset between the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detecting portion 42, based on the position of the area to be mounted on the substrate 3 detected by the first detecting portion 35. When the second detection unit 42 detects the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted, the displacement amount detection unit 59a of the present embodiment detects the amount of displacement of the position based on the position detected by the second detection unit 42. When the second detection unit 42 cannot detect the position of the region to be mounted on the substrate 3 on which the electronic component 2 is mounted, the amount of positional deviation is detected based on the position of the region to be mounted on the substrate 3 detected by the first detection unit 35 and the position of the electronic component 2 detected by the second detection unit 42.

The determination unit 59b determines a positional deviation between the area to be mounted on the substrate 3 on which the electronic component 2 is mounted and the electronic component 2 detected by the second detection unit 42, based on the positional deviation amount detected by the deviation amount detection unit 59 a. The determination unit 59b determines whether or not the detected amount of positional deviation is within an allowable range, determines that the positional deviation is not present if the amount of positional deviation is within the allowable range, and determines that the positional deviation is outside the allowable range.

More specifically, when both the image of the alignment mark of the electronic component 2 and the image of the alignment mark of the area to be mounted on the substrate 3 are recognizable from the image captured by the imaging unit 42a, the shift amount detecting unit 59a detects the amount of positional shift at the predetermined position of the two alignment marks based on the recognition result. When the image of the alignment mark in the area to be mounted on the substrate 3 is overlapped with the alignment mark, the wiring pattern, or the like of the electronic component 2 and thus cannot be recognized in a correct shape, the displacement amount detecting unit 59a detects the amount of displacement of the alignment mark based on the predetermined position of the image of the alignment mark in the area to be mounted on the substrate 3 captured by the imaging unit 35a and the predetermined position of the image of the alignment mark of the electronic component 2 obtained by the imaging unit 42 a.

As described above, the determination of the positional shift by the determination unit 59b is performed based on whether or not the shift amount of the predetermined position of the alignment mark detected by the shift amount detection unit 59a is within a predetermined range (allowable range). In the case of using the image of the alignment mark of the region to be mounted of the substrate 3 obtained from the imaging result of the imaging unit 35a, the predetermined position of the alignment mark of the region to be mounted of the substrate 3 is converted to the position when the substrate is moved from the mounting position P3 to the inspection position P4, that is, the position after the position calculated by the substrate position calculating unit 55 based on the correction value calculated by the correction value calculating unit 56.

In the present embodiment, as shown in fig. 8, an example in which the electronic component 2 is mounted face down on the substrate 3 will be described. The alignment mark 2a of the electronic component 2 is provided on the surface on which the bump 2b is provided, and faces the substrate 3 by face-down mounting. The alignment mark 3a of the area to be mounted on the substrate 3 is provided on the surface opposite to the substrate stage 33, that is, the surface on which the electronic component 2 is mounted. By the face-down mounting, the electronic component 2 and the part of the predetermined mounting region of the substrate 3 where the alignment mark 2a and the alignment mark 3a are provided come to a position overlapping in the Z-axis direction. In the figure, the two-dot chain line is a virtual line when the substrate 3 is cut and divided for each electronic component 2.

Fig. 9 (a) shows an example of the alignment mark 2a of the electronic component 2, and fig. 9 (B) shows an example of the alignment mark 3a in the region to be mounted on the substrate 3. The alignment mark 2a includes a triangle and 20 quadrangles arranged around the triangle. The alignment mark 3a is an example including a triangle. In the figure, the two-dot chain line is a virtual line when the substrate 3 is cut and divided for each electronic component 2, and corresponds to one region to be mounted on the substrate 3. Fig. 10 (a) is a diagram showing a state in which the alignment marks 2a of the electronic component 2 and the alignment marks 3a of the planned mounting region of the substrate 3 are aligned, that is, positioned substantially accurately. Fig. 10 (B) is a diagram showing a case where the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the area to be mounted on the substrate 3 are displaced from each other, and the alignment mark 3a of the area to be mounted on the substrate 3 is hidden by the alignment mark 2a of the electronic component 2 and cannot be recognized. Note that fig. 10 (a) and 10 (B) show a state in which the image pickup unit 42a is not sufficiently focused on the alignment mark 2a of the electronic component 2, and therefore the image of the alignment mark 2a is unclear, in hatched lines.

As a method of determining the positional deviation, for example, the deviation amount detecting section 59a calculates a distance between a predetermined position extracted from a result of recognition of an image of the alignment mark 2a of the electronic component 2 and a predetermined position extracted from a result of recognition of an image of the alignment mark 3a of the region to be mounted on the substrate 3. The determination unit 59b determines that the alignment is good when the calculated distance is within a predetermined threshold (allowable range), and determines that the alignment is poor when the calculated distance exceeds the predetermined threshold (allowable range). When it is determined that the alignment is not correct, the operator is notified of the alignment by a notification device such as a display device or a speaker connected to the control device 50. When it is determined that the alignment is not correct, the mounting apparatus 30 may be stopped. However, when it is determined that the alignment is not good, the determination result may be recorded without stopping. For example, the positioning may be stopped when the number of times of the positioning failure reaches a predetermined number or when the positioning failure continues for a predetermined number of times. Further, the operation can be continued even in the case of a detection failure due to dust or the like on the electronic component 2 or the substrate 3.

The storage unit M is a magnetic and electronic recording medium such as a Hard Disk Drive (HDD) or a Solid State Drive (SSD). The storage unit M stores data and programs necessary for the operation of the system, and data necessary for the operation of the system. For example, the storage unit M stores the positions of the areas to be mounted on the electronic component 2 and the substrate 3 before mounting, which are detected by the first detection unit 35, the positions of the electronic component 2 after mounting, which are detected by the second detection unit 42, and the positions of the areas to be mounted on the substrate 3 on which the electronic component 2 is mounted. The storage unit M also stores the position of the region to be mounted of the substrate 3 calculated by the substrate position calculation unit 55 and the correction value calculated by the correction value calculation unit 56. Further, the storage unit M stores the allowable range of the positional deviation amount, and the result of the determination of the positional deviation.

(action)

The operation of the electronic component mounting system 1 and the mounting apparatus 30 according to the embodiment will be described. Further, a mounting method for mounting electronic components in accordance with the processing procedure described below is also an embodiment of the present invention. Fig. 11 is an example of an operation flowchart of the electronic component mounting system 1. The sheet 12 on which the electronic components 2 are arranged in an array is placed on the supply stage 11, and the substrate 3 to which the electronic components 2 are mounted is placed on the substrate stage 33. The electronic component 2 on the sheet 12 is placed with the bump 2b facing upward.

First, of the plurality of electronic components 2 on the sheet 12, the electronic component 2 to be supplied to the mounting device 30 is moved to the supply position P1 by the supply device 10 (step S01). The pickup head 21 is moved to the supply position P1 by the head moving mechanism 22, the electronic component 2 at the supply position P1 is picked up (step S02), and the electronic component 2 is delivered to the bonding head 31 at the delivery position P2 (step S03). That is, the pickup head 21 is moved to the intersection position P2, and the picked-up electronic part 2 is reversed by 180 ° by the reversing device. Thereby, the bonding head 31 faces and receives the electronic component 2. Thereby, the electronic component 2 is held by the bonding head 31 with the alignment mark 2a facing downward.

The bonding head 31 is moved to the mounting position P3 by the slide mechanism 321 (step S04). On the other hand, the substrate stage 33 is moved by the stage moving mechanism 34, and the area to be mounted this time among the plurality of areas to be mounted of the substrate 3 is moved to the mounting position P3 (step S05).

After the area to be mounted of the electronic component 2 and the substrate 3 is moved to the mounting position P3, the image pickup unit 35a as the upper and lower two-field-of-view cameras is moved in and out between the bonding head 31 and the substrate 3, and the alignment mark 2a of the electronic component 2 located above and the alignment mark 3a of the area to be mounted of the substrate 3 located below are picked up and the positions of the area to be mounted of the electronic component 2 and the substrate 3 are detected (step S06). The bonding head 31 performs positioning of the electronic component 2 and the predetermined mounting region of the substrate 3 (step S07).

After the positioning, the bonding head 31 is lowered by the elevation mechanism 322, and the electronic component 2 is mounted while being in contact with the region to be mounted on the substrate 3 (step S08). The mounted bonding head 31 releases the holding of the electronic component 2 and moves up, and returns to the delivery position P2 to receive the next electronic component 2.

After the electronic component 2 is mounted on the substrate 3, the electronic component 2 at the mounting position P3 is moved to the inspection position P4 by the stage moving mechanism 34 (step S09). The image pickup unit elevating mechanism 43 is controlled by the elevating mechanism control unit 57, and the height of the image pickup unit 42a is adjusted to image the alignment mark 2a and the alignment mark 3a, thereby detecting the position of the electronic component 2 and the position of the region to be mounted of the substrate 3 on which the electronic component 2 is mounted (step S10). When the distance between the alignment mark 2a and the alignment mark 3a exceeds the depth of field of the lens, the height of the imaging unit 42a is adjusted and the alignment mark 2a and the alignment mark 3a are imaged.

The imaging of the alignment marks 2a and 3a is preferably performed at two locations in one predetermined mounting area of one electronic component 2 and one substrate 3. By identifying the positions of the two portions apart from a fixed distance, the rotational offset of the object can be identified with higher accuracy. When the electronic component 2 has a rectangular shape, for example, the alignment marks 2a and 3a at the diagonal positions are photographed. For example, from the viewpoint of the imaging unit 42a, in order to image the alignment mark 2a at the lower left corner, the substrate stage 33 is moved by the stage moving mechanism 34 so that the lower left corner of the target mounted electronic component 2 comes to the inspection position P4, the height of the imaging unit 42a is adjusted, and the alignment mark 2a is imaged. Then, the height of the image pickup unit 42a is adjusted by the image pickup unit elevating mechanism 43 based on the height of the alignment mark 3a paired with the alignment mark 2a, and the alignment mark 3a is picked up.

Then, in order to photograph the alignment mark 3a located at the diagonally upper right corner, the substrate stage 33 is moved by the stage moving mechanism 34 so that the upper right corner of the target mounted electronic component 2 comes to the inspection position P4. Thus, the alignment mark 3a at the upper right corner is limited in the field of view, and therefore, the image is captured by the imaging unit 42 a. Thereafter, in order to photograph the alignment mark 2a at the lower right corner, the height of the image pickup unit 42a is adjusted by the image pickup unit elevating mechanism 43 based on the height of the alignment mark 2a, and the image pickup unit 42a photographs the alignment mark 2a at the upper right corner. Further, the

diagonal alignment marks

2a and 3a are captured because the distance between two points is long and the angle is easily recognized, so that the position calculation error can be reduced. However, the alignment marks 2a and 3a that are not necessarily diagonal may be captured, and the probability of recognition may be increased by providing the alignment marks 2a and 3a at positions where positions are easily recognized. For example, by setting the alignment mark 3a in the region to be mounted on the substrate 3 at a position difficult to be hidden, it is possible to reduce an unrecognizable situation.

Next, when the position of the area to be mounted on the substrate 3 and the electronic component 2 after mounting is detectable from the obtained image (YES in step S11), the positional deviation amount between the area to be mounted on the substrate 3 and the electronic component 2 after mounting is detected by the deviation amount detecting unit 59a based on the detected position (step S13), and the positional deviation is determined by the determining unit 59b (step S14). If the position of the region scheduled to mount the substrate 3 after mounting the electronic component 2 cannot be detected from the obtained image (NO at step S11), the substrate position calculating unit 55 calculates the position at which the region scheduled to mount the substrate 3 moves from the mounting position P3 to the inspection position P4 (step S12). Then, based on the detected position of the electronic component 2 and the calculated position of the area to be mounted on the substrate 3, the positional deviation amount between the mounted electronic component 2 and the area to be mounted on the substrate 3 is detected by the deviation amount detecting unit 59a (step S13), and the positional deviation is determined by the determining unit 59b (step S14).

If it is determined that the positional deviation is within the allowable range, that is, the alignment is good (yes in step S15), the process returns to step S01, and the process proceeds to the next mounting of the electronic component 2. The steps S01 to S15 are repeated, and when there is no electronic component 2 supplied onto the stage 11 or electronic components 2 are mounted on all the regions to be mounted on the substrate 3, the operation of the system is stopped. On the other hand, when the determination unit 59b determines that the positional deviation is within the range that cannot be tolerated, that is, that the positioning is poor (no in step S15), the operator is notified by the notification means, and the system is stopped and terminated. Further, the electronic components 2 may be supplied in parallel to the detection of the amount of positional deviation or the determination of the positional deviation. Therefore, for example, the process may return to S05 without necessarily returning to S01. That is, the above-described processing procedure is an example, and the present invention is not limited thereto. Further, the image pickup unit 42a may be moved to the positions of the alignment marks 2a and 3a to pick up an image.

(Effect)

(1) The present embodiment is a mounting apparatus 30 for mounting an electronic component 2 on a substrate 3, including: a substrate stage 33 on which the substrate 3 is placed; a stage moving mechanism 34 that moves the substrate stage 33; a first detection unit 35 that detects the position of the electronic component 2 before mounting and the position of a region to be mounted on the substrate 3 at a mounting position P3 where the electronic component 2 is mounted on the substrate stage 33 on the substrate 3; a bonding head 31 mounted on the substrate 3 with the position of the electronic component 2 aligned with the position of the region to be mounted on the substrate 3 at the mounting position P3; a second detecting portion 42 for detecting the position of the electronic component 2 after mounting at a checking position P4 spaced apart from the mounting position P3; and a control device 50.

The control device 50 further includes a deviation amount detection unit 59a, and the deviation amount detection unit 59a detects a positional deviation amount between the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42, based on the position of the area to be mounted on the substrate 3 detected by the first detection unit 35.

Further, the present embodiment is a mounting method for mounting an electronic component 2 on a substrate 3, including: a first detection process in which the first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the area to be mounted on the substrate 3 at the mounting position P3 where the electronic component 2 is mounted on the substrate 3 placed on the substrate stage 33 moved by the stage moving mechanism 34; a mounting process of mounting the bonding head 31 on the substrate 3 by aligning the position of the electronic component 2 with the position of the region to be mounted on the substrate 3 based on the result of the first detection process at the mounting position P3; a second detection process in which the second detection unit 42 detects the position of the electronic component after mounting at an inspection position P4 spaced apart from the mounting position P3; and a shift amount detection process in which the shift amount detection unit 59a detects a positional shift amount between the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection process, based on the position of the area to be mounted on the substrate 3 detected by the first detection process.

Thus, even when the position of the area to be mounted on the substrate 3 after mounting cannot be detected, the positional displacement amount between the electronic component 2 and the area to be mounted on the substrate 3 can be detected. Therefore, the occurrence of a stop time due to failure to detect the position of the region to be mounted of the substrate 3 can be suppressed, and the mounting apparatus 30 with high productivity can be manufactured. In addition, even if the electronic component 2 or the substrate 3 is in a form in which the position of the area to be mounted of the substrate 3 cannot be detected in a state in which the electronic component 2 is mounted, the amount of positional deviation can be detected, and therefore, the mounting apparatus 30 in which the substrate 3 or the electronic component 2 can be mounted can be provided in a wide range of applications.

(2) The control device 50 includes a board position calculating section 55, the board position calculating section 55 calculates a position when the region to be mounted of the board 3 is moved from the mounting position P3 to the inspection position P4, and the offset amount detecting section 59a detects a position offset amount between the position of the region to be mounted of the board 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detecting section 42, based on the position calculated by the board position calculating section 55. Therefore, the mounting planned region of the substrate 3 can be converted into a position when moved from the mounting position P3 to the inspection position P4 to detect the positional displacement amount.

(3) The control device 50 includes a correction value calculation section 56, and the correction value calculation section 56 calculates a correction value for the substrate position calculation section 55 to calculate a position at which the predetermined mounting region is moved from the mounting position P3 to the inspection position P4. Therefore, the position when the area to be mounted is moved from the mounting position P3 to the inspection position P4 is calculated using the correction value, and therefore, even if there is a movement error in the stage moving mechanism 34, the positional deviation can be accurately determined.

(4) The second detection unit 42 has a function of detecting the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted, and when the second detection unit 42 can detect the position of the area to be mounted on the substrate 3 on which the electronic component 2 is mounted, the offset amount detection unit 59a detects the amount of positional offset based on the position detected by the second detection unit 42. Therefore, when the position of the area to be mounted on the substrate 3 can be detected by the second detection unit 42, the positional deviation can be determined with high accuracy by using the positional judgment, regardless of the fluctuation due to the movement. In the case where the position of the region to be mounted of the substrate 3 cannot be detected by the second detection portion 42, the amount of positional deviation can be detected by using the position of the region to be mounted of the substrate 3 at the mounting position P3.

Further, since two detection methods can be performed, it is possible to suppress the failure of the determination of the positional deviation due to the failure to detect the position of the region to be mounted of the substrate 3, thereby improving the mounting accuracy and suppressing the occurrence of defects. In this way, even the electronic component 2 or the substrate 3 in which it is difficult to detect the position of the region to be mounted on the substrate 3 can be used, and therefore the applicable range of the electronic component 2 or the substrate 3 that can be mounted can be expanded.

(5) The second detection unit 42 includes an imaging unit 42a, and the imaging unit 42a images the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the predetermined mounting region of the substrate 3 through the mounted electronic component 2. Therefore, the positional deviation can be determined regardless of the arrangement or form of the alignment marks 2a and 3a in the area to be mounted on the electronic component 2 or the substrate 3. The degree of freedom in the arrangement of the alignment marks 2a and 3a in the region where the electronic component 2 or the substrate 3 is to be mounted is improved, and the range of applications of the electronic component 2 or the substrate 3 that can be mounted can be expanded. The area of the non-functional portion to be secured for the alignment mark 2a and the alignment mark 3a can be reduced, and the area of the functional portion of the electronic component 2 such as a wiring pattern or the substrate 3 can be enlarged, so that the mounting density of the same area can be increased. Further, the density of the functional portions can be increased to reduce the size of the whole.

(6) The control device 50 includes a determination unit 59b that determines whether or not the amount of positional displacement of the positional displacement is within an allowable range based on the amount of positional displacement detected by the displacement amount detection unit 59 a. Therefore, whether or not the mounting is good can be determined according to the degree of the positional deviation amount.

(7) The determination section 59b determines the positional deviation each time the electronic component 2 is mounted on the substrate 3. Therefore, since the inspection can be performed in real time every time the electronic component 2 is mounted, the work such as the interruption or the correction can be performed every time the failure occurs, and the waste of the mounted electronic component 2 can be suppressed, as compared with the case where all the substrates 3 after the mounting is finished are collectively inspected in an inspection apparatus separately provided. Further, the number of mounting failures can be reduced, and the yield can be improved. In the present invention, it is not always necessary to determine the positional deviation every time the electronic component 2 is mounted on the substrate 3, and the positional deviation may be determined every predetermined number of times of mounting or at predetermined time intervals. This saves the time for the determination process, thereby improving the productivity.

(8) Correction value calculation unit 56 calculates a correction value at a predetermined timing. The movement error changes due to a change in ambient temperature, deterioration of the mechanism, and the like as the mounting apparatus 30 operates, but the change in the movement error can be corrected by calculating and updating the movement amount at a predetermined timing, and the inspection accuracy can be improved.

(other embodiments)

The present invention is not limited to the above embodiment, and includes other embodiments described below. The present invention also includes a combination of all or any of the above-described embodiment and the other embodiments described below. Furthermore, various omissions, substitutions, and changes may be made to the embodiments without departing from the scope of the invention, and modifications thereof are also included in the invention.

(1) Correction value calculation section 56 may be omitted. When the movement error of the stage moving mechanism 34 is small, the movement amount when moving from the mounting position P3 to the inspection position P4 can be fixed. For example, the board position calculating unit 55 may calculate the position of the area to be mounted of the board 3 by using the distance (a, B) from the mounting position P3 to the inspection position P4 as the movement amount. This eliminates the need to obtain a correction value in advance. Since the time for obtaining the correction value is not required, productivity is improved. The inventors have conducted studies and found that a movement range within approximately 100mm is a movement range in which the movement error can be ignored. Therefore, for example, by setting the mounting position P3 and the inspection position P4 within 100mm, the movement range of the substrate stage 33 can be set within 100mm, and therefore, even without calculating a correction value for the movement of the stage movement mechanism 34, a movement error of the substrate stage 33 can be suppressed. Further, such setting can be appropriately determined by measuring in advance based on the required inspection accuracy.

(2) The second detection portion 42 does not necessarily need to detect the position of the region to be mounted of the substrate 3 on which the electronic component 2 is mounted. That is, the determination unit 59b may always determine the positional deviation using the position of the area to be mounted on the substrate 3 detected by the first detection unit 35 at the inspection position P4. Thus, the time required for the second detection unit 42 to detect the position of the region to be mounted on the substrate 3 on which the electronic component 2 is mounted is not required, and productivity is improved. Further, either one of the mode using the position of the region to be mounted on the substrate 3 detected by the second detection unit 42 and the mode using the position of the region to be mounted on the substrate 3 detected by the first detection unit 35 may be selected. Thus, it is possible to select an arbitrary mode depending on whether the inspection accuracy is improved or the productivity is emphasized, and it is possible to improve the degree of freedom in the operation of the mounting apparatus 30.

(3) The height variation of the substrate stage 33 when the mounted electronic component 2 at the mounting position P3 is moved to the inspection position P4 may be detected, and the height when the image pickup unit 42a picks up the image of the alignment mark 2a of the electronic component 2 and the height when the image pickup unit picks up the image of the alignment mark 3a in the region to be mounted on the substrate 3 may be changed based on the variation. This makes it possible to obtain a focused captured image by limiting the height of the imaging unit 42a to within the depth of field (for example, 10 μm) of the lens, and therefore, the accuracy of detecting the amount of positional deviation can be improved.

(4) In the above-described embodiment, the electronic component 2 is mounted on the substrate 3 in a face-down manner, but the mounting apparatus 30 may be mounted in a face-up manner in which the face of the electronic component 2 on which the electrode including the bump 2b and the like is formed faces the opposite side of the substrate 3. In this case, too, a situation occurs in which the alignment mark 3a in the region to be mounted on the substrate 3 cannot be recognized, and therefore the present invention becomes effective.

(5) The forms of the alignment marks 2a and 3a are not limited to the examples described above. For example, fig. 12 (a) shows a state in which the positions of the cross-shaped alignment marks 2a are aligned with the alignment marks 3a of a square in which four dots are arranged. In this case, for example, as shown in fig. 12 (B) and 12 (C), the alignment mark 3a may not be recognized because the alignment mark 2a overlaps the alignment mark 3 a. In fig. 12 (B), the state where the alignment mark 2a and the alignment mark 3a overlap each other is also shown by a solid line.

(6) The alignment marks 2a and 3a need not be provided only for alignment. For example, the electronic component 2, a part of the substrate 3, a part of the wiring pattern, and the like may be used as the alignment marks. In this case, too, a situation occurs in which the alignment mark 3a in the region to be mounted on the substrate 3 cannot be recognized, and therefore the present invention becomes effective.

(7) In the above example, the amount of movement (X direction, Y direction) is obtained using a calibration glass. Thus, the amount of movement (X direction, Y direction) can be determined relatively accurately. However, the amount of movement (X direction, Y direction) may be determined using the substrate 3 before mounting instead of the calibration glass. By using the substrate 3 before mounting, the amount of movement (X direction, Y direction) can be obtained more easily without preparing a calibration glass. When the correction value is updated at a predetermined timing, since the substrate 3 used for mounting is used as it is, it is not necessary to switch to the work of aligning the glass or the like, and the decrease in productivity can be suppressed.

(8) In the above example, an example of processing for recording the determination result when it is determined that the alignment is not good is described. However, the information to be recorded also includes the determination result when it is determined that the alignment is good and the detected positional deviation amount. The control device 50 may determine the timing of updating the correction value based on the result of monitoring and analyzing the recorded positional deviation amount, for example. This enables updating at an appropriate timing, thereby improving mounting accuracy and suppressing a decrease in productivity. Further, for example, by stopping the operation and facilitating the confirmation based on the result of monitoring and analyzing the positional deviation amount, the occurrence of a failure can be prevented in advance. Further, by performing such monitoring, analysis, and mounting, and feeding back to the mounting in real time, the yield can be further improved.

Claims

1. A mounting apparatus for mounting an electronic component on a substrate, comprising:

a substrate stage on which the substrate is placed;

a stage moving mechanism that moves the substrate stage;

a first detection unit that detects a position of the electronic component before mounting and a position of a predetermined mounting area of the substrate at a mounting position of the substrate on which the electronic component is mounted on the substrate stage;

a bonding head which aligns a position of the electronic component with a position of a predetermined mounting region of the substrate at the mounting position and mounts the electronic component on the substrate;

a second detection unit that detects a position of the electronic component after the mounting at an inspection position spaced apart from the mounting position; and

a control device, and

the control device includes an offset amount detection unit that detects a positional offset amount between a position of a predetermined mounting region of the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection unit, based on the position of the predetermined mounting region of the substrate detected by the first detection unit.

2. The mounting device according to claim 1, wherein the control device includes a substrate position calculating portion,

the substrate position calculating section calculates a position when a mounting scheduled region of the substrate is moved from the mounting position to the inspection position,

the offset amount detecting unit detects a positional offset amount between the position of the predetermined mounting region of the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detecting unit, based on the position calculated by the substrate position calculating unit.

3. The mounting device according to claim 2, wherein the control device includes a correction value calculation section,

the correction value calculation section calculates a correction value for the substrate position calculation section to calculate a position at which the mounting scheduled region moves from the mounting position to the inspection position.

4. The mounting device according to any one of claims 1 to 3, wherein the second detection portion has a function of detecting a position of a mounting planned region of the substrate on which the electronic component is mounted,

when the second detection unit can detect the position of the area to be mounted on the substrate on which the electronic component is mounted, the offset amount detection unit detects the amount of positional offset based on the position detected by the second detection unit.

5. The mounting device according to any one of claims 1 to 4, wherein the second detection portion includes an imaging portion that takes an image of an alignment mark of the electronic component or an alignment mark of a region to be mounted of the substrate by the electronic component after the mounting.

6. The mounting device according to any one of claims 1 to 5, wherein the control device includes a determination section that determines whether or not the positional shift amount of positional shift is within an allowable range based on the positional shift amount detected by the shift amount detection section.

7. The mounting device according to claim 6, wherein the determination section determines the positional deviation each time the electronic component is mounted on the substrate.

8. The mounting device according to claim 3, wherein the correction value calculation section calculates the correction value at a predetermined timing.

9. A mounting method for mounting an electronic component on a substrate, the mounting method comprising:

a first detection process in which a first detection unit detects a position of the electronic component before mounting and a position of a region to be mounted on the substrate at a mounting position where the electronic component is mounted on the substrate;

a mounting process of mounting the electronic component on the substrate by aligning a position of the electronic component with a position of a predetermined mounting region of the substrate based on a result of the first detection process with the bonding head at the mounting position;

a second detection process of detecting a position of the electronic component after the mounting at an inspection position separated from the mounting position by a second detection unit; and

and an offset amount detection process of detecting a positional offset amount between a position of the predetermined mounting region of the substrate on which the electronic component is mounted and a position of the electronic component detected by the second detection process, based on the position of the predetermined mounting region of the substrate detected by the first detection process.