JP2022013733A - Mounting device and mounting method - Google Patents

Abstract

To provide a mounting device and a mounting method, which can inspect a positional deviation between an electronic component and a substrate, even if the position of the substrate after being mounted cannot be detected.SOLUTION: A mounting device includes: a substrate stage 33 on which a substrate 3 is loaded; a stage movement mechanism 34 which moves the substrate stage 33; a first detector unit 35 which, at a mounting position P3 where an electronic component 2 is mounted on the substrate 3, detects the position of the electronic component 2 before mounted and the position of a planned mounting region of the substrate 3; a bonding head 31 which, after matching the position of the electronic component 2 with the position of the mounting region of the substrate 3 at the mounting position P3, performs mounting on the substrate 3; a second detector unit 42 which, at an inspection position P4 apart from the mounting position P3, detects the position of the electronic component 2 after mounted; and a control device 50. The control device 50 includes a deviation amount detector unit 59a which, based on the position of the planned mounting region of the substrate 3 detected by the first detector unit 35, detects a position deviation between the position of the planned mounting region of the substrate 3, on which the electronic component 2 is mounted, and the position of the electronic component 2 detected by the second detector unit 42.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting device and a mounting method for electronic components.

For mounting electronic components on a substrate, for example, flip chip mounting is performed. Flip-chip mounting is a method in which a substrate on which a conductive pattern is formed faces a surface on which an electrode of an electronic component such as a semiconductor chip is formed. In flip-chip mounting, it is necessary to directly bond the fine electrodes of electronic components to the fine terminals formed in the conductive pattern of the substrate, so the electronic components and the substrate must be positioned accurately.

Japanese Unexamined Patent Publication No. 10-125728

In recent years, the mounting accuracy has been improved by miniaturizing and increasing the density of circuits of electronic components such as semiconductor chips. Therefore, after mounting the electronic component, the alignment mark provided on the electronic component and the substrate is imaged by the image pickup unit, and the positional deviation between the electronic component and the substrate after mounting is inspected. For example, by using an infrared camera to capture an image of an alignment mark provided on the lower surface of an electronic component on the side of the substrate and an alignment mark provided on the upper surface of the substrate through the electronic component, the position of the electronic component can be determined. The position of the board was detected.

However, when the alignment mark of the board located below the electronic component overlaps with the alignment mark and the wiring pattern of the electronic component and cannot be imaged, or the captured image becomes unclear and the position of the board cannot be detected. Occurs. In this case, the amount of misalignment between the electronic component and the substrate after mounting could not be determined, and it was not possible to inspect whether the product was within the permissible range. In addition, it was not possible to obtain the amount of misalignment for correcting the position at the time of mounting.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to be able to inspect the positional deviation between an electronic component and a substrate even when the position of the substrate after mounting cannot be detected. It is an object of the present invention to provide a mounting device and a mounting method capable of detecting a position deviation amount for correcting a position at the time of mounting.

The present invention is a mounting device for mounting electronic components on a board, a mounting device for mounting electronic components on a board, a board stage on which the board is mounted, and a stage moving mechanism for moving the board stage. A first detection unit that detects the position of the electronic component before mounting and the position of the planned mounting area of the board at the mounting position where the electronic component is mounted on the board mounted on the board stage, and the above. After mounting the electronic component and the planned mounting area of the board at the mounting position, the bonding head mounted on the board and the inspection position separated from the mounting position. It has a second detection unit for detecting the position of the electronic component and a control device, and the control device is based on the position of the planned mounting area of the substrate detected by the first detection unit. It has a displacement amount detecting unit that detects the displacement amount between the position of the planned mounting area of the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detection unit.

Further, the present invention is a mounting method for mounting an electronic component on a substrate, wherein a first detection unit mounts the electronic component on the substrate, the position of the electronic component before mounting, and the substrate. In the first detection process for detecting the position of the planned mounting area of the above, and the bonding head at the mounting position, the position of the electronic component and the position of the planned mounting area of the substrate based on the result of the first detection process. A second detection unit detects the position of the electronic component after the mounting at an inspection position separated from the mounting position by the mounting process of mounting the electronic component on the substrate. The position of the planned mounting area of the board on which the electronic component is mounted and the position of the planned mounting area of the board on which the electronic component is mounted, based on the position of the planned mounting area of the board detected by the detection process and the deviation amount detection unit by the first detection process. It includes a deviation amount detection process for detecting a position deviation amount from the position of the electronic component detected by the second detection process.

According to the present invention, even if the position of the board after mounting cannot be detected, the mounting device capable of inspecting the misalignment between the electronic component and the board and detecting the amount of misalignment for correcting the position at the time of mounting and the mounting device. You can get the implementation method.

It is a top view which shows the electronic component mounting system to which the mounting apparatus of embodiment is applied. It is a front view which shows the electronic component mounting system to which the mounting apparatus of embodiment is applied. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 2 and is a diagram showing a state in which an imaging unit enters between a bonding head and a substrate stage in order to image an electronic component and a planned mounting area on a substrate. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 2 and is a diagram showing a state in which an electronic component held by a bonding head is mounted on a substrate. It is a functional block diagram of a control device. It is a figure which shows the movement amount from a mounting position to an inspection position. It is a figure which shows the movement error from a mounting position to an inspection position. It is a figure which shows the appearance that the electronic component is mounted on the substrate by the face-down method. It is a figure which shows the alignment mark (A) of an electronic component, and the alignment mark (B) of the planned mounting area of a substrate. It is a figure which shows the state (A) in which the alignment mark of an electronic component and the alignment mark of the planned mounting area of a board are aligned, and the state (B) which the alignment mark of a planned mounting area of a board cannot be recognized. This is an example of an operation flowchart of an electronic component mounting system. It is a figure which shows the other aspect of the alignment mark.

An embodiment of the mounting device according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing an electronic component mounting system to which the mounting device of the embodiment is applied. FIG. 2 is a front view showing an electronic component mounting system to which the mounting device of the embodiment is applied.

The electronic component mounting system 1 is a system for mounting the electronic component 2 on the substrate 3. The electronic component 2 is, for example, a semiconductor chip made of silicon. In the present embodiment, the electronic component 2 is a semiconductor chip on which a bump, which is a protruding electrode made of a solder material, is formed. The electronic component 2 is provided with an alignment mark. Assuming that the electronic component 2 has a rectangular shape, alignment marks are provided at the four corners or diagonal corners of the surface on which the bumps are formed.

The substrate 3 is a plate-like body on which the electronic component 2 is mounted. A conductive pattern to which bumps are connected is formed on the substrate 3. A mounting area on which the electronic component 2 is to be mounted is provided on the surface of the substrate 3 on which the conductive pattern is formed. A plurality of planned mounting areas are provided here and are arranged in an array. Alignment marks are provided in each of the planned mounting areas. This alignment mark is provided at the four corners or diagonal corners of the rectangular mounting area, for example, assuming that the electronic component 2 has a rectangular shape. After aligning the alignment marks between the electronic component 2 and the substrate 3, the electronic component 2 is mounted in the planned mounting area of the substrate 3. In the present embodiment, by detecting the position of the alignment mark, various positions such as the position of the electronic component 2 before and after mounting, the position of the planned mounting area of the substrate 3, and the like are detected. Aligning the positions of the alignment marks means that the amount of deviation of the positions of the alignment marks to be compared is within a predetermined range, and the positions of the electronic components 2 to be mounted and the substrate 3 are aligned accordingly.

(Constitution)
The electronic component mounting system 1 includes a supply device 10, a pickup device 20, a mounting device 30, and a control device 50. The pick-up device 20 picks up the electronic component 2 from the supply device 10, and mounts the electronic component 2. It is delivered to 30 and the electronic component 2 is mounted on the substrate 3 by the mounting device 30.

The supply device 10 is a device that supplies the electronic component 2. Specifically, the supply device 10 has a supply stage 11 on which the sheet 12 on which the electronic component 2 is placed is placed. The supply device 10 moves the supply stage 11 so that the electronic component 2 to be picked up comes to the supply position P1. The supply position P1 is a position where the electronic component 2 to be picked up by the pickup device 20 is scheduled to be picked up by the pickup device 20. For example, a camera 13 is provided above the supply position P1 so that the optical axis coincides with the supply position P1, and the supply device 10 has the electronic component 2 to be picked up at the center of the image pickup of the camera 13. The supply stage 11 is moved.

The sheet 12 on which the electronic component 2 mounted on the supply stage 11 is mounted is a wafer sheet here. The sheet 12 is an adhesive sheet, and electronic components 2 are arranged in a matrix on the sheet 12. The electronic component 2 may be arranged face-up with the bumps exposed upward, or may be arranged face-down with the bumps in contact with the sheet 12. In this embodiment, it is assumed that they are arranged face-up.

When supplying the electronic component 2 to the pickup device 20, the supply device 10 pushes up the electronic component 2 on the supply position P1 via the sheet 12 with a block or a needle-shaped pin provided below the supply position P1 to obtain electrons. The component 2 may be easily peeled off from the sheet 12.

The pickup device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked up electronic component 2 to the mounting device 30. The pickup device 20 has a pickup head 21 and a head moving mechanism 22. The pickup head 21 holds the electronic component 2 and releases the holding state to release the electronic component 2. Specifically, the pickup head 21 has a cylindrical suction nozzle 21a. The inside of the suction nozzle 21a communicates with a negative pressure generating circuit such as a vacuum pump, and the electronic component 2 is sucked by the opening at the tip of the suction nozzle 21a by generating the negative pressure in the circuit. To hold. Further, by releasing the negative pressure, the electronic component 2 is separated from the suction nozzle 21a.

The head moving mechanism 22 reciprocates the pickup head 21 between the supply position P1 and the delivery position P2 of the electronic component 2 to the mounting device 30. As the head moving mechanism 22, for example, a ball screw mechanism driven by a servomotor can be used. The head moving mechanism 22 is provided on the support frame 23 so as to extend along the X-axis direction described later. The head moving mechanism 22 is provided with a suction nozzle 21a via a reversing mechanism. The reversing mechanism reverses the direction of the suction nozzle 21a. When the head moving mechanism 22 sucks and holds the electronic component 2 at the supply position P1 by the suction nozzle 21a whose opening end is directed downward, the head moving mechanism 22 delivers the suction nozzle 21a and positions it at the delivery position P2. Further, the head moving mechanism 22 inverts the electronic component 2 by rotating the suction nozzle 21a by an inversion mechanism by 180 ° so that the open end holding the electronic component 2 faces upward. Then, the inverted electronic component 2 is delivered to the mounting device 30.

In this embodiment, the supply device 10 and the mounting device 30 are arranged side by side. The alignment direction of the supply device 10 and the mounting device 30, that is, the linear direction connecting the supply position P1 and the mounting position P3 is defined as the X-axis direction. Further, in the horizontal plane on which the supply stage 11 extends, the direction orthogonal to the X-axis direction is defined as the Y-axis direction, and the direction orthogonal to the X-axis and the Y-axis is defined as the Z-axis direction. In the present specification, the position in the Z-axis direction may be simply referred to as "height". For example, a specific reference position can be set and the distance in the Z-axis direction to the reference position can be set as a height, such as a position in the Z-axis direction of a specific position on the substrate stage 33 described later. Further, the rotation direction on the XY plane about the Z axis is defined as the θ direction.

The mounting device 30 is a device that conveys the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate 3. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate 3, and is set to a fixed place here.

The mounting device 30 includes a bonding head 31, a head moving mechanism 32, a substrate stage 33, a stage moving mechanism 34, a first detection unit 35, and an inspection unit 40.

The bonding head 31 is mounted on the board 3 at the mounting position P3 by aligning the position of the electronic component 2 with the position of the planned mounting area of the board 3 based on the detection result of the first detection unit 35 described later. do. Specifically, the bonding head 31 receives the electronic component 2 from the pickup device 20 at the delivery position P2, and mounts the electronic component 2 on the substrate 3 at the mounting position P3. The bonding head 31 holds the electronic component 2, and after mounting, releases the holding state and releases the electronic component 2. Specifically, the bonding head 31 has a cylindrical suction nozzle 31a. The inside of the suction nozzle 31a communicates with a negative pressure generating circuit such as a vacuum pump, and the electronic component 2 is sucked by the opening at the tip of the suction nozzle 31a by generating the negative pressure in the circuit. To hold. Further, by releasing the negative pressure, the electronic component 2 is separated from the suction nozzle 31a.

The bonding head 31 reciprocates between the transfer position P2 and the mounting position P3 by the head moving mechanism 32, and moves up and down at the transfer position P2 and the mounting position P3. In other words, the head moving mechanism 32 has a slide mechanism 321 and an elevating mechanism 322.

The slide mechanism 321 linearly moves the bonding head 31 between the transfer position P2 and the mounting position P3. Here, the slide mechanism 321 has two rails 321a extending parallel to the X-axis direction and fixed to the support frame 323, and a slider 321b traveling on the rails 321a. Although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 31 in the Y-axis direction. This slide mechanism can also be configured by a rail in the Y-axis direction and a slider traveling on the rail. When the slide mechanism 321 moves the suction nozzle 31a of the bonding head 31 to the delivery position P2, the suction nozzle 31a faces the suction nozzle 21a of the pickup head 21 located at the delivery position P2 via the electronic component 2. When the slide mechanism 321 moves the suction nozzle 31a holding the electronic component 2 to the mounting position P3, the suction nozzle 31a moves through the planned mounting area on the substrate 3 positioned at the mounting position P3 and the electronic component 2. opposite.

The elevating mechanism 322 elevates and elevates the bonding head 31. Here, the direction of raising and lowering is a direction parallel to the Z-axis direction. Specifically, the elevating mechanism 322 can use a ball screw mechanism driven by a servomotor. That is, the bonding head 31 moves up and down along the Z-axis direction by driving the servomotor.

The board stage 33 is a table on which the board 3 is placed. The substrate stage 33 slides on the XY plane. Further, the substrate stage 33 rotates in the θ direction on the XY plane.

The stage moving mechanism 34 slides the substrate stage 33 on the XY plane. Specifically, the stage moving mechanism 34 includes an X-axis moving mechanism that moves the substrate stage 33 in the X-axis direction, a Y-axis moving mechanism that moves the board stage 33 in the Y-axis direction, and a substrate stage 33 in the θ direction. It has a rotating mechanism for rotating.

The X-axis moving mechanism and the Y-axis moving mechanism are composed of, for example, a servomotor and a ball screw mechanism including a screw shaft, a nut, a guide rail, and a slider. The X-axis moving mechanism is provided so that its screw shaft and guide rail extend in the X-axis direction, and a nut is screwed to the screw shaft. A board stage 33 is fixed to this nut via a slider, and by rotating the screw shaft by a servomotor, the slider moves along a guide rail extending in the X-axis direction, and the board stage 33 moves X. It moves linearly in the axial direction. The Y-axis moving mechanism is provided so that its screw shaft and guide rail extend in the Y-axis direction, and a nut is screwed to the screw shaft. An X-axis movement mechanism is fixed to this nut via a slider, and by rotating the screw axis with a servomotor, the slider moves along a guide rail extending in the Y-axis direction, and the X-axis movement mechanism. At the same time, the substrate stage 33 moves linearly in the Y-axis direction.

The rotation mechanism includes, for example, a servomotor, a rotation shaft, and a transmission mechanism, and rotates the substrate stage 33 by transmitting the power of the servomotor to the rotation shaft by a transmission mechanism by a gear or a belt.

The first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the planned mounting area of the substrate 3 at the mounting position P3. The first detection unit 35 of the present embodiment has an image pickup unit 35a that captures the alignment mark of the electronic component 2 and the alignment mark of the planned mounting region of the substrate 3 at the mounting position P3, and is imaged by the image pickup unit 35a. From the image, an outer shape is extracted from a predetermined position of the alignment mark, for example, the contour that identifies the alignment mark, and points such as the center of gravity and corners thereof are detected. The detection of the predetermined position may be performed by the circuit included in the image pickup unit 35a or by the control device 50 described later. When the control device 50 performs, the control device 50 is responsible for a part of the functions of the first detection unit 35.

The image pickup unit 35a is an upper and lower two-field camera. That is, as shown in FIG. 3, the image pickup unit 35a enters between the bonding head 31 and the substrate stage 33, and at the alignment mark of the electronic component 2 held by the upper suction nozzle 31a and the lower substrate 3. The alignment mark of the planned mounting area at the mounting position P3 is imaged. As shown in FIG. 3, the image pickup unit 35a enters between the bonding head 31 and the substrate stage 33 before mounting the electronic component 2 on the substrate 3, and when mounted by the bonding head 31, FIG. 4 shows. As shown, it is retracted to a position where it does not interfere with the bonding head 31.

The inspection unit 40 inspects the positional deviation between the electronic component 2 and the substrate 3 after mounting. The inspection unit 40 has a second detection unit 42 and an image pickup unit elevating mechanism 43 (see FIGS. 1 and 2). The second detection unit 42 detects the position of the electronic component 2 after mounting at the inspection position P4 described later, which is separated from the mounting position P3. The second detection unit 42 of the present embodiment also has a function of detecting the position of the planned mounting area of the substrate 3 on which the electronic component 2 is mounted.

The second detection unit 42 has an image pickup unit 42a that images the electronic component 2 and the substrate 3 after mounting, and identifies a predetermined position of the alignment mark, for example, the alignment mark from the image captured by the image pickup unit 42a. The outer shape is extracted from the contour, and the points such as the center of gravity and the corners are detected. The detection of the predetermined position may be performed by the circuit included in the image pickup unit 42a or by the control device 50 described later. When the control device 50 performs, the control device 50 is responsible for a part of the functions of the second detection unit 42.

The image pickup unit 42a images the alignment mark of the electronic component 2 after mounting and the alignment mark of the planned mounting area of the substrate 3. The image pickup unit 42a images at least two alignment marks for one electronic component 2. Further, the image pickup unit 42a captures at least two alignment marks for each mounting location of the substrate 3. An infrared (IR) camera can be used as the image pickup unit 42a. The image pickup unit 42a transmits infrared rays to the electronic component 2 to image the alignment mark of the electronic component 2 and the alignment mark of the planned mounting area of the substrate 3.

The second detection unit 42 is provided at the inspection position P4. That is, the image pickup unit 42a is provided above the substrate stage 33 so that the optical axis of the camera coincides with the inspection position P4. The inspection position P4 is a positional shift between the electronic component 2 and the substrate 3 by imaging the planned mounting area of the electronic component 2 and the substrate 3 after mounting by the image pickup unit 42a, that is, the alignment of the electronic component 2 after mounting. This is a position for inspecting the positional deviation between the mark and the alignment mark in the planned mounting area of the substrate 3. This misalignment is the misalignment when each alignment mark of the planned mounting area of the electronic component 2 and the substrate 3 is projected on the XY plane. In this embodiment, the inspection position P4 is a fixed position.

The image pickup unit elevating mechanism 43 raises and lowers the image pickup unit 42a. Here, the direction of raising and lowering is a direction parallel to the Z-axis direction, that is, a direction of advancing and retreating with respect to the mounted electronic component 2 located at the inspection position P4. As the image pickup unit elevating mechanism 43, a ball screw mechanism driven by a servomotor can be used. That is, the image pickup unit 42a moves up and down along the Z-axis direction by driving the servomotor.

The image pickup unit elevating mechanism 43 focuses to the extent that the alignment mark of the electronic component 2 after mounting or the alignment mark of the mounting area of the substrate 3 can be recognized by the image pickup unit 42a. In other words, in the image pickup unit elevating mechanism 43, the alignment mark of the electronic component 2 to be imaged after mounting or the alignment mark of the mounting area of the substrate 3 is set within the depth of field of the lens of the image pickup unit 42a. , Adjust the height of the image pickup unit 42a. This height adjustment is performed by the elevating mechanism control unit 57, which will be described later, controlling the image pickup unit elevating mechanism 43. Depending on the magnification and numerical aperture for obtaining the required position information accuracy, the distance between the alignment mark of the electronic component 2 mounted on the substrate 3 and the alignment mark of the planned mounting area of the substrate 3, that is, the distance in the height direction. The distance may exceed the depth of field (for example, 10 μm) of the lens of the imaging unit 42a. Therefore, the image pickup unit elevating mechanism 43 switches the height of the image pickup unit 42a when the alignment mark of the electronic component 2 is imaged and when the alignment mark of the planned mounting area of the substrate 3 is imaged.

The control device 50 controls the start, stop, speed, operation timing, and the like of the supply device 10, the pickup device 20, the mounting device 30, and the inspection unit 40. The control device 50 can be realized by, for example, a dedicated electronic circuit, a computer operating with a predetermined program, or the like. The control device 50 is connected to an input device for inputting instructions and information necessary for workers to control, and an output device for checking and outputting the state of the device. For example, a jog dial, a mouse, a touch panel, etc. that operate the stage moving mechanism 34 to move the substrate stage 33 to a desired position are examples of input devices. A display device, a speaker, a buzzer, or other notification device that displays the image captured by the mounting position P3, the inspection position P4, the image pickup units 35a, 42a, the points extracted from the alignment mark, the amount of misalignment, etc. on the display screen. This is an example of an output device.

FIG. 5 is a functional block diagram of the control device 50. As shown in FIG. 5, the control device 50 includes a supply device control unit 51, a pickup head control unit 52, a bonding head control unit 53, a board stage control unit 54, a board position calculation unit 55, a correction value calculation unit 56, and an elevating mechanism. It has a control unit 57, an image pickup unit control unit 58, a deviation amount detection unit 59a, a determination unit 59b, and a storage unit M.

The supply device control unit 51 controls the movement of the supply stage 11 so that the electronic component 2 to be supplied on the sheet 12 mounted on the supply stage 11 is located at the supply position P1.

The pickup head control unit 52 controls the operation of the pickup device 20. Specifically, the pickup head control unit 52 controls the negative pressure generation circuit communicating in the suction nozzle 21a, and controls the holding and detachment of the electronic component 2. Further, the pickup head control unit 52 controls the movement of the pickup head 21, that is, the operation of the head movement mechanism 22.

The bonding head control unit 53 controls the movement of the bonding head 31, that is, the operation of the head moving mechanism 32. The board stage control unit 54 controls the operation of the stage moving mechanism 34.

The board position calculation unit 55 calculates the position when the planned mounting area of the board 3 moves from the mounting position P3 to the inspection position P4. As shown in FIG. 6, the movement amount in this case is theoretically the distance A in the X direction and the distance B in the Y direction from the fixed mounting position P3 to the fixed inspection position P4. Therefore, in the coordinate system for controlling the movement of the stage movement mechanism 34, the coordinates (X, Y) when the alignment mark am of each planned mounting area of the substrate 3 is aligned with the fixed mounting position P3. The coordinates obtained by adding the distance A and the distance B, that is, the coordinates (X + A, Y + B) are the coordinates (X', Y') when the alignment mark am of each planned mounting area is moved to the inspection position P4.

However, there is a movement error due to the mechanism portion in the movement of the substrate stage 33 by the stage movement mechanism 34. That is, the stage moving mechanism 34 includes, for example, a guide rail along the X-axis direction and a guide rail along the Y-axis direction. Such a guide rail may have waviness and distortion due to processing accuracy and assembly accuracy. Therefore, even if the substrate stage 33 is moved with the moving distance of the coordinate system for moving the stage moving mechanism 34 as the theoretical distance A and the distance B, the actual moving position is as shown in FIG. , It deviates from the inspection position P4 due to the movement error. This movement error includes not only an error in the movement distance in the X direction and an error in the movement distance in the Y direction, but also an error in the rotation direction on the XY plane, that is, the angle in the θ direction. That is, even if the coordinates (X, Y) when the alignment mark am of each planned mounting area is aligned with the mounting position P3 are moved by the distance A in the X direction and the distance B in the Y direction, the X direction and the Y direction And, due to the movement error in the θ direction, the alignment mark am of each planned mounting area deviates from the coordinates (X', Y') of the inspection position P4.

In order to deal with this, the present embodiment has a correction value calculation unit 56. The correction value calculation unit 56 calculates the correction value for the board position calculation unit 55 to calculate the position where the planned mounting area has moved from the mounting position P3 to the inspection position P4. This correction value is a movement amount in which the movement error in the X direction, the Y direction, and the θ direction is corrected. The board position calculation unit 55 calculates the position when each planned mounting area moves from the mounting position P3 to the inspection position P4 based on the correction value calculated by the correction value calculation unit 56.

For example, the correction value calculation unit 56 moves the board stage 33 in advance to detect the coordinates when each planned mounting area of the board 3 is aligned with the mounting position P3. Further, the correction value calculation unit 56 moves the board stage 33, detects the coordinates when each planned mounting area is aligned with the inspection position P4, and determines the moving distances in the X and Y directions between the coordinates. calculate. At this time, each movement distance includes not only the movement error in the X direction and the Y direction but also the movement error in the θ direction.

More specifically, a display device that displays images captured by the image pickup unit 35a and the image pickup unit 42a, an input device that operates the stage moving mechanism 34, and calibration with marks corresponding to each planned mounting area of the substrate 3. Perform as follows using an input glass. That is, when the calibration glass is placed on the substrate stage 33 and each mark displayed on the display device by the image pickup unit 35a taking an image is aligned with the mounting position P3 by operating the input device, respectively. Detect the coordinates of. Further, the calibration glass is moved by operating the input device, and the coordinates when each mark displayed on the display device by the image pickup unit 42a taking an image is aligned with the inspection position P4 are detected. .. The amount of movement in the X and Y directions between the detected coordinates for each mark is obtained, and the amount of movement is used as a correction value when each planned mounting area is moved from the mounting position P3 to the inspection position P4. ..

It is preferable that the correction value calculation unit 56 prepares in advance the correction values when the mounting position P3 is moved to the inspection position P4 for all the planned mounting areas. However, it is not necessary to obtain the movement amount (X direction, Y direction) for all the planned mounting areas by the above procedure. For example, one planned mounting area in a predetermined area of the substrate 3 is set as a reference position (representative point, representative position of the area), and the amount of movement (X direction, Y direction) with respect to the reference position is obtained. Then, for the other planned mounting areas in the area, the movement amount (X direction, Y direction) is obtained based on the relative position with respect to the reference position. As a result, the correction value of the position of each planned mounting area can be calculated. Therefore, the above-mentioned calibration glass mark does not necessarily have to correspond to each planned mounting area, and may be provided at a position representing a predetermined area.

Further, it is preferable that the correction value calculation unit 56 calculates the correction value at a predetermined timing. That is, it is preferable to calculate and update the correction value once calculated at a predetermined timing, instead of continuously using the corrected value once calculated as the mounting device 30 is operated. For example, it is calculated every time a predetermined time elapses from the start of operation, every time an unacceptable misalignment occurs, or every time the frequency of unacceptable misalignment within a predetermined time reaches a threshold value. By doing so, it is conceivable to update the correction value.

The elevating mechanism control unit 57 is a control unit that controls the image pickup unit elevating mechanism 43. For example, the elevating mechanism control unit 57 adjusts the height of the image pickup unit 42a by controlling the image pickup unit elevating mechanism 43. The image pickup unit control unit 58 controls the operation of the image pickup unit 42a. For example, the start, stop, image pickup, and image pickup timing of the image pickup unit 42a are controlled.

The deviation amount detection unit 59a determines the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted and the second detection based on the position of the planned mounting area of the board 3 detected by the first detection unit 35. The amount of misalignment with the position of the electronic component 2 detected by the unit 42 is detected. When the second detection unit 42 can detect the position of the planned mounting area of the substrate 3 on which the electronic component 2 is mounted, the deviation amount detection unit 59a of the present embodiment detects the position of the planned mounting area. The amount of misalignment is detected based on the position. When the second detection unit 42 cannot detect the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted, the position of the planned mounting area of the board 3 detected by the first detection unit 35 and the position of the planned mounting area of the board 3 are determined. The amount of misalignment is detected based on the position of the electronic component 2 detected by the second detection unit 42.

The determination unit 59b includes the planned mounting area of the substrate 3 on which the electronic component 2 is mounted and the electronic component 2 detected by the second detection unit 42 based on the displacement amount detected by the displacement detection unit 59a. Judge the misalignment. The determination unit 59b determines whether or not the detected misalignment amount is within the permissible range, determines that the misalignment amount is within the permissible range, determines that the misalignment amount is not within the permissible range, and the misalignment amount is out of the permissible range. If there is, it is determined that the position is misaligned.

More specifically, when the deviation amount detection unit 59a can recognize both the image of the alignment mark of the electronic component 2 and the image of the alignment mark of the planned mounting area of the substrate 3 from the image captured by the image pickup unit 42a. In the above-mentioned recognition result, the amount of misalignment of the predetermined positions of both alignment marks is detected. If the image of the alignment mark in the planned mounting area of the substrate 3 cannot be recognized in the correct shape due to overlapping with the alignment mark, wiring pattern, etc. of the electronic component 2, the image of the planned mounting area of the substrate 3 captured by the image pickup unit 35a. The misalignment detection unit 59a detects the amount of misalignment from a predetermined position of the image of the alignment mark and a predetermined position of the image of the alignment mark of the electronic component 2 obtained by the image pickup unit 42a.

As described above, the determination of the positional deviation by the determination unit 59b is performed based on whether or not the displacement amount of the predetermined position of the alignment mark detected by the displacement amount detection unit 59a is within the predetermined range (allowable range). .. When the image of the alignment mark of the planned mounting area of the substrate 3 obtained from the image pickup result of the imaging unit 35a is used, the predetermined position of the alignment mark of the planned mounting area of the substrate 3 is moved from the mounting position P3 to the inspection position P4. The position when it is moved, that is, the position converted to the position calculated by the board position calculation unit 55 based on the correction value calculated by the correction value calculation unit 56 is used.

In this embodiment, as shown in FIG. 8, an example in which the electronic component 2 is face-down mounted on the substrate 3 will be described. The alignment mark 2a of the electronic component 2 is provided on the surface on which the bump 2b is provided, and faces the substrate 3 by face-down mounting. The alignment mark 3a in the planned mounting area of the substrate 3 is provided on the surface on which the electronic component 2 is mounted, which is the surface opposite to the substrate stage 33. By face-down mounting, the locations where the alignment marks 2a and 3a in the planned mounting area of the electronic component 2 and the substrate 3 are provided come to the positions where they overlap in the Z-axis direction. In the figure, the alternate long and short dash line is a virtual line when the substrate 3 is cut and divided for each electronic component 2.

FIG. 9A is an example of the alignment mark 2a of the electronic component 2, and FIG. 9B is an example of the alignment mark 3a of the planned mounting area of the substrate 3. The alignment mark 2a is an example composed of a triangle and 20 quadrangles arranged around the triangle. The alignment mark 3a is an example composed of a triangle. In the figure, the alternate long and short dash line is a virtual line when the substrate 3 is cut and divided for each electronic component 2, and corresponds to one planned mounting area of the substrate 3. FIG. 10A is a diagram showing a state in which the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the planned mounting area of the substrate 3 are aligned, that is, they are positioned almost accurately. In FIG. 10B, the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the planned mounting area of the substrate 3 are misaligned, and the alignment mark 3a of the planned mounting area of the substrate 3 is the alignment mark 2a of the electronic component 2. It is a figure which shows the case which is hidden in and cannot be recognized. Note that FIG. 10 shows a state in which the image of the alignment mark 2a is unclear due to insufficient focusing on the alignment mark 2a of the electronic component 2 of the imaging unit 42a.

As a method for determining the misalignment, for example, the misalignment detection unit 59a has an image of a predetermined position extracted from the recognition result of the image of the alignment mark 2a of the electronic component 2 and an image of the alignment mark 3a in the planned mounting area of the substrate 3. The distance from the predetermined position extracted from the recognition result of is calculated. The determination unit 59b determines that the implementation has good alignment if the calculated distance is within a predetermined threshold value (allowable range), and if the calculated distance exceeds the predetermined threshold value (allowable range), the position Judged as a misaligned implementation. If it is determined that the alignment is poor, the worker is notified by a notification device such as a display device or a speaker connected to the control device 50. If it is determined that the alignment is defective, it is conceivable to stop the mounting device 30. However, if it is determined that the alignment is poor, it is possible to record the determination result and not stop. For example, it may be stopped when the number of defective alignments reaches a predetermined number or when the number of consecutive misalignments reaches a predetermined number. Further, in the case of a detection failure due to dust on the electronic component 2 or the substrate 3, the operation may be continued.

The storage unit M is, for example, a magnetic or electronic recording medium such as an HDD or SSD. Data and programs necessary for system operation are stored in advance in the storage unit M, and data necessary for system operation are stored in the storage unit M. For example, the storage unit M is the position of the pre-mounting electronic component 2 and the planned mounting area of the substrate 3 detected by the first detection unit 35, and the post-mounting electronic component 2 detected by the second detection unit 42. The position and the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted are stored. Further, the storage unit M also stores the position of the planned mounting area of the board 3 calculated by the board position calculation unit 55 and the correction value calculated by the correction value calculation unit 56. Further, the storage unit M also stores the allowable range of the misalignment amount, the misalignment amount, and the determination result of the misalignment.

(Action)
The operation of the electronic component mounting system 1 and the mounting device 30 according to the embodiment will be described. A mounting method for mounting electronic components by the processing procedure shown below is also an aspect of the present invention. FIG. 11 is an example of an operation flowchart of the electronic component mounting system 1. A sheet 12 in which the electronic components 2 are arranged in an array is pre-mounted on the supply stage 11, and a substrate 3 to be mounted on the electronic components 2 is pre-mounted on the substrate stage 33. Further, it is assumed that the electronic component 2 on the sheet 12 is placed in a face-up state in which the bump 2b faces upward.

First, the supply device 10 moves the electronic component 2 to be supplied to the mounting device 30 out of the plurality of electronic components 2 on the sheet 12 to the supply position P1 (step S01). The pickup head 21 is moved to the supply position P1 by the head moving mechanism 22, the electronic component 2 at the supply position P1 is picked up (step S02), and the electronic component 2 is delivered to the bonding head 31 at the delivery position P2 (step S03). .. That is, the pickup head 21 moves to the delivery position P2 and reverses the electronic component 2 picked up by the reversing device by 180 °. As a result, the bonding head 31 and the electronic component 2 face each other and are delivered. As a result, the electronic component 2 is held by the bonding head 31 with the alignment mark 2a facing downward.

The bonding head 31 is moved to the mounting position P3 by the slide mechanism 321 (step S04). On the other hand, the board stage 33 is moved by the stage moving mechanism 34, and the planned mounting area to be mounted this time is moved to the mounting position P3 among the plurality of planned mounting areas of the board 3 (step S05).

In this way, after the planned mounting area of the electronic component 2 and the board 3 is moved to the mounting position P3, the image pickup unit 35a, which is a vertical two-view camera, is advanced between the bonding head 31 and the board 3 and is located above. The alignment mark 2a of the electronic component 2 and the alignment mark 3a of the planned mounting area of the substrate 3 located below are imaged, and the positions of the electronic component 2 and the planned mounting area of the substrate 3 are detected (step S06). The bonding head 31 aligns the electronic component 2 with the planned mounting area of the substrate 3 (step S07).

After the alignment, the bonding head 31 is lowered by the elevating mechanism 322, and the electronic component 2 is brought into contact with the planned mounting area of the substrate 3 for mounting (step S08). After mounting, the bonding head 31 releases / raises the holding of the electronic component 2 and returns to the delivery position P2 in order to receive the next electronic component 2.

After mounting the electronic component 2 on the substrate 3, the electronic component 2 at the mounting position P3 is moved to the inspection position P4 by the stage moving mechanism 34 (step S09). The position of the electronic component 2 and the electronic component 2 are mounted by controlling the image pickup unit elevating mechanism 43 by the elevating mechanism control unit 57, adjusting the height of the image pickup unit 42a, and imaging the alignment marks 2a and 3a. The position of the planned mounting area of the board 3 is detected (step S10). When the distance between the alignment marks 2a and 3a exceeds the depth of field of the lens, the height adjustment of the imaging unit 42a and the imaging of the alignment marks 2a and 3a are performed separately.

It is preferable that the alignment marks 2a and 3a are imaged at two locations in one planned mounting area of one electronic component 2 and the substrate 3. By recognizing the positions of two places separated by a certain distance, it is possible to recognize the rotation deviation of the target with higher accuracy. When the electronic component 2 has a rectangular shape, for example, the alignment marks 2a and 3a at diagonal positions are imaged. For example, in order to image the alignment mark 2a in the lower left corner when viewed from the viewpoint of the image pickup unit 42a, the stage moving mechanism 34 causes the lower left corner of the target mounted electronic component 2 to come to the inspection position P4. The substrate stage 33 is moved to the surface, the height of the image pickup unit 42a is adjusted, and the alignment mark 2a is imaged. Then, the height of the image pickup unit 42a is adjusted by the image pickup unit elevating mechanism 43 based on the height of the alignment mark 3a paired with the alignment mark 2a, and the alignment mark 3a is imaged.

Then, in order to image the alignment mark 3a in the upper right corner located diagonally, the board stage 33 is provided by the stage moving mechanism 34 so that the upper right corner of the target mounted electronic component 2 comes to the inspection position P4. To move. As a result, the alignment mark 3a in the upper right corner fits in the field of view, and the image pickup unit 42a takes an image. After that, in order to image the alignment mark 2a in the upper right corner, the height of the image pickup unit 42a is adjusted by the image pickup unit elevating mechanism 43 based on the height of the alignment mark 2a, and the alignment mark in the upper right corner is adjusted by the image pickup unit 42a. 2a is imaged. The diagonal alignment marks 2a and 3a are imaged because the distance between the two points is long and the angle is easy to recognize, so that the position calculation error can be reduced. However, the image is not necessarily the diagonal alignment marks 2a and 3a, but the recognition probability may be increased by using the alignment marks 2a and 3a at positions where the arrangement position is easy to recognize. For example, by setting the alignment mark 3a in the planned mounting area of the substrate 3 at a position where it is difficult to hide, it is possible to reduce an unrecognizable situation.

Next, if the positions of the planned mounting areas of the electronic component 2 and the substrate 3 after mounting can be detected from the obtained image (YES in step S11), the deviation amount detecting unit 59a is based on the detected positions. (Step S13) detects the amount of misalignment between the electronic component 2 and the planned mounting area of the substrate 3 after mounting, and the determination unit 59b determines the misalignment (step S14). If the position of the planned mounting area of the board 3 after mounting the electronic component 2 cannot be detected from the obtained image (NO in step S11), the board position calculation unit 55 determines that the planned mounting area of the board 3 is the mounting position. The position when moving from P3 to the inspection position P4 is calculated (step S12). Then, based on the detected position of the electronic component 2 and the calculated position of the planned mounting area of the substrate 3, the displacement amount detection unit 59a determines the amount of positional deviation between the electronic component 2 after mounting and the planned mounting area of the substrate 3. It is detected (step S13), and the positional deviation is determined by the determination unit 59b (step S14).

If it is determined that the misalignment is within an acceptable range, that is, the alignment is good (YES in step S15), the process returns to step S01 and the next step is to mount the electronic component 2. When steps S01 to S15 are repeated and the electronic component 2 on the supply stage 11 disappears or the electronic component 2 is mounted in the entire mounting area of the substrate 3, the operation of the system is stopped. On the other hand, when the determination unit 59b determines that the misalignment is unacceptable, that is, the misalignment is determined (NO in step S15), the notification means notifies the worker, the system is stopped, and the system is terminated. Even during the detection of the misalignment amount and the determination of the misalignment, the electronic components 2 may be supplied in parallel. Therefore, for example, it is not always necessary to return to the process of S01, and the process of S05 may be returned. That is, the above processing procedure is an example, and the present invention is not limited thereto. Further, the image pickup unit 42a may be moved to the position of the alignment marks 2a and 3a to take an image.

(effect)
(1) The present embodiment is a mounting device 30 for mounting an electronic component 2 on a substrate 3, a substrate stage 33 on which the substrate 3 is mounted, a stage moving mechanism 34 for moving the substrate stage 33, and an electronic component 2. At the mounting position P3 on which the board 3 is mounted on the board stage 33, the first detection unit 35 for detecting the position of the electronic component 2 before mounting and the position of the planned mounting area of the board 3 and the mounting position P3. In, the position of the electronic component 2 and the position of the planned mounting area of the board 3 are aligned, and the bonding head 31 to be mounted on the board 3 and the electron after mounting at the inspection position P4 separated from the mounting position P3. It has a second detection unit 42 for detecting the position of the component 2 and a control device 50.

Then, the control device 50 determines the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted and the second detection based on the position of the planned mounting area of the board 3 detected by the first detection unit 35. It has a deviation amount detecting unit 59a for detecting a displacement amount with respect to the position of the electronic component 2 detected by the unit 42.

Further, the present embodiment is a mounting method in which the electronic component 2 is mounted on the substrate 3, and the first detection unit 35 is mounted on the substrate 3 mounted on the substrate stage 33 moved by the stage moving mechanism 34. The first detection process for detecting the position of the electronic component 2 before mounting and the position of the planned mounting area of the board 3 at the mounting position P3 on which the component 2 is mounted, and the bonding head 31 are the first at the mounting position P3. Based on the result of the detection process, the position of the electronic component 2 and the position of the planned mounting area of the board 3 are aligned and mounted on the board 3, and the second detection unit 42 is separated from the mounting position P3. At the inspection position P4, the second detection process for detecting the position of the electronic component after mounting and the position of the planned mounting area of the substrate 3 detected by the deviation amount detection unit 59a by the first detection process. Based on the above, the displacement amount detection process for detecting the displacement amount between the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection process. include.

As a result, even when the position of the planned mounting area of the board 3 after mounting cannot be detected, the amount of misalignment between the electronic component 2 and the planned mounting area of the board 3 can be detected. Therefore, it is possible to suppress the occurrence of a stop time due to the inability to detect the position of the planned mounting area of the substrate 3, and the mounting device 30 with high productivity can be obtained. Further, in the state where the electronic component 2 is mounted, the amount of misalignment can be detected even in the electronic component 2 or the substrate 3 in such a manner that the position of the planned mounting region of the substrate 3 cannot be detected, so that the mountable substrate 3 can be mounted. The mounting device 30 has a wide range of application for the electronic component 2 and the electronic component 2.

(2) The control device 50 has a board position calculation unit 55 that calculates a position when the planned mounting area of the board 3 moves from the mounting position P3 to the inspection position P4, and the deviation amount detecting unit 59a is the board position. Based on the position calculated by the calculation unit 55, the amount of misalignment between the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42 is determined. To detect. Therefore, the planned mounting area of the substrate 3 can be converted into a position when the board 3 is moved from the mounting position P3 to the inspection position P4, and the amount of misalignment can be detected.

(3) The control device 50 has a correction value calculation unit 56 in which the board position calculation unit 55 calculates a correction value for calculating the position where the planned mounting area has moved from the mounting position P3 to the inspection position P4. Therefore, since the position when the planned mounting area moves from the mounting position P3 to the inspection position P4 is calculated from the correction value, the position deviation can be accurately determined even if the stage moving mechanism 34 has a movement error.

(4) The second detection unit 42 has a function of detecting the position of the planned mounting area of the substrate 3 on which the electronic component 2 is mounted, and the deviation amount detection unit 59a has the second detection unit 42 of the electronic component. When the position of the planned mounting area of the board 3 on which 2 is mounted can be detected, the amount of misalignment is detected based on the position detected by the second detection unit 42. Therefore, when the position of the planned mounting area of the substrate 3 can be detected by the second detection unit 42, the position deviation is determined based on the position, so that the variation due to the movement is not taken into consideration, and the position is relatively accurate. The amount of misalignment can be detected. When the position of the planned mounting area of the board 3 cannot be detected by the second detection unit 42, the amount of misalignment can be detected by using the position of the planned mounting area of the board 3 at the mounting position P3.

Further, since two types of detection methods can be executed, it is possible to suppress the inability to determine the positional deviation due to the inability to detect the position of the planned mounting area of the substrate 3, improve the mounting accuracy, and suppress the occurrence of defects. .. As described above, since it can be applied even to the electronic component 2 or the substrate 3 whose position of the planned mounting area of the substrate 3 is difficult to detect, the applicable range of the electronic component 2 or the substrate 3 that can be mounted can be expanded.

(5) The second detection unit 42 has an image pickup unit 42a that transmits the electronic component 2 after mounting and images the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the planned mounting area of the substrate 3. .. Therefore, the positional deviation can be determined regardless of the arrangement and mode of the alignment marks 2a and 3a in the planned mounting area of the electronic component 2 and the substrate 3. The degree of freedom in arranging the alignment marks 2a and 3a in the planned mounting area of the electronic component 2 and the substrate 3 is increased, and the applicable range of the electronic component 2 and the substrate 3 that can be mounted can be expanded. Since the area of the non-functional part to be secured for the alignment marks 2a and 3a can be reduced and the area of the functional part of the electronic component 2 or the substrate 3 such as the wiring pattern can be expanded, the mounting density in the same area is increased. be able to. Furthermore, the density of the functional parts can be increased and the overall size can be reduced.

(6) The control device 50 has a determination unit 59b for determining whether or not the displacement amount is within the allowable range based on the displacement amount detected by the displacement amount detection unit 59a. Therefore, the quality of mounting can be determined according to the degree of misalignment.

(7) The determination unit 59b determines the positional deviation each time the electronic component 2 is mounted on the substrate 3. Therefore, since it is possible to inspect in real time each time mounting is completed, each time a defect occurs, the substrate 3 after all mounting is inspected collectively by a separately provided inspection device. Work such as interruption and correction can be performed, and waste of the mounted electronic component 2 can be suppressed. Further, the number of mounting defects can be suppressed and the yield can be improved. In the present invention, it is not always necessary to determine the misalignment each time the electronic component 2 is mounted on the substrate 3, and the misalignment may be determined for each predetermined number of mounts or at a predetermined time interval. As a result, the time for the determination process can be saved and the productivity can be increased.

(8) The correction value calculation unit 56 calculates the correction value at a predetermined timing. The movement error changes due to changes in the ambient temperature, deterioration of the mechanism, etc. with the operation of the mounting device 30, but by calculating and updating the movement amount at a predetermined timing, the change in the movement error can be corrected and the inspection accuracy can be corrected. Can be enhanced.

(Other embodiments)
The present invention is not limited to the above embodiment, but also includes other embodiments shown below. The present invention also includes a combination of all or any of the above embodiments and the following other embodiments. Further, various omissions, replacements, and changes can be made to these embodiments without departing from the scope of the invention, and modifications thereof are also included in the present invention.

(1) The correction value calculation unit 56 may be omitted. When the movement error of the stage movement mechanism 34 is small, the movement amount when the stage movement mechanism 34 is moved from the mounting position P3 to the inspection position P4 can be made constant. As an example, the board position calculation unit 55 can calculate the position of the planned mounting area of the board 3 by using the distance (A, B) from the mounting position P3 shown above to the inspection position P4 as the movement amount. As a result, it is not necessary to obtain the correction value in advance. Productivity is improved by eliminating the need for time to obtain the correction value. As a result of examination by the inventor, the movement range within about 100 mm was a movement range in which the movement error could be ignored. Therefore, for example, by providing the mounting position P3 and the inspection position P4 within 100 mm, the moving range of the substrate stage 33 can be set within 100 mm, so that the correction value for the movement of the stage moving mechanism 34 does not have to be calculated. Also, the movement error of the substrate stage 33 can be suppressed. It should be noted that such a setting can be measured in advance and appropriately determined based on the required accuracy of the inspection.

(2) The second detection unit 42 does not necessarily have to detect the position of the planned mounting area of the board 3 on which the electronic component 2 is mounted. That is, the determination unit 59b may always determine the positional deviation by using the position of the planned mounting area of the substrate 3 detected by the first detection unit 35 at the inspection position P4. As a result, the second detection unit 42 does not need time to detect the position of the planned mounting area of the substrate 3 on which the electronic component 2 is mounted, so that the productivity is improved. Further, either a mode using the position of the planned mounting area of the board 3 detected by the second detection unit 42 or a mode using the position of the planned mounting area of the board 3 detected by the first detection unit 35 is selected. It may be possible to select. As a result, either mode can be selected depending on whether the inspection accuracy is improved or the productivity is emphasized, and the degree of freedom in the operation of the mounting device 30 can be increased.

(3) The height fluctuation amount of the substrate stage 33 when the mounted electronic component 2 located at the mounting position P3 is moved to the inspection position P4 is detected, and the image pickup unit 42a detects the electronic component 2 based on this fluctuation amount. The height when the alignment mark 2a of the above is imaged and the height when the alignment mark 3a of the planned mounting area of the substrate 3 is imaged may be changed. As a result, the height of the image pickup unit 42a can be accommodated within the depth of field (for example, 10 μm) of the lens to obtain an in-focus captured image, so that the detection accuracy of the amount of misalignment can be improved.

(4) In the above aspect, the electronic component 2 is mounted on the substrate 3 by a face-down method, but in the mounting device 30, the surface on which the electrode formed by the bump 2b or the like of the electronic component 2 is formed is the substrate 3. May be implemented in a face-up manner facing the other side. In this case as well, the alignment mark 3a in the planned mounting area of the substrate 3 may not be recognized, so that the present invention is effective.

(5) The embodiments of the alignment marks 2a and 3a are not limited to those shown in the above example. For example, FIG. 12A shows a state in which the position of the cross-shaped alignment mark 2a is aligned with the square alignment mark 3a arranged at four points. In this case, for example, as shown in FIGS. 12B and 12C, the alignment mark 2a may overlap with the alignment mark 3a, so that the alignment mark 3a may not be recognized. In addition, in FIG. 12B, the state where the alignment mark 2a overlaps with the alignment mark 3a is also shown by a solid line.

(6) The alignment marks 2a and 3a do not have to be provided only for alignment. For example, an electronic component 2, a part of a substrate 3, a part of a wiring pattern, and the like can be used as alignment marks. In both this case and this case, the alignment mark 3a in the planned mounting area of the substrate 3 may not be recognized, so that the present invention is effective.

(7) In the above example, the above-mentioned movement amount (X direction, Y direction) was obtained by using the calibration glass. As a result, the amount of movement (X direction, Y direction) can be obtained relatively accurately. However, instead of the calibration glass, the moving amount (X direction, Y direction) can be obtained by using the substrate 3 before mounting. By using the substrate 3 before mounting, the movement amount (X direction, Y direction) can be obtained more easily without preparing the calibration glass. When the correction value is updated at a predetermined timing, the substrate 3 used for mounting is used as it is, so that there is no need to switch to calibration glass or the like, and it is possible to suppress a decrease in productivity.

(8) In the above example, an example of the process of recording the determination result when the alignment is determined to be defective has been described. However, the information to be recorded includes the determination result when the alignment is determined to be good and the detected displacement amount. The control device 50 can determine, for example, the timing for updating the correction value based on the result of monitoring and analyzing the recorded displacement amount. As a result, it is possible to update at an appropriate time, so that it is possible to improve the mounting accuracy and suppress the decrease in productivity. Further, for example, by stopping the operation and prompting confirmation based on the result of monitoring and analyzing the amount of misalignment, it is possible to prevent the occurrence of defects. Furthermore, by performing such monitoring and analysis together with the implementation, it is possible to provide feedback to the implementation in real time, and the yield can be further increased.

1 Electronic component mounting system 2 Electronic component 2a Alignment mark 2b Bump 3 Board 3a Alignment mark 10 Supply device 11 Supply stage 12 Sheet 13 Camera 20 Pickup device 21 Pickup head 21a Suction head 22 Head movement mechanism 23 Support frame 30 Mounting device 31 Bonding head 31a Suction nozzle 32 Head movement mechanism 321 Slide mechanism 321a Rail 321b Slider 322 Elevating mechanism 323 Support frame 32a Suction nozzle 33 Board stage 34 Stage movement mechanism 35 First detection unit 35a Imaging unit 40 Inspection unit 42 Second detection unit 42a Imaging Unit 43 Image pickup unit Elevating mechanism 50 Control device 51 Supply device control unit 52 Pickup head control unit 53 Bonding head control unit 54 Board stage control unit 55 Board position calculation unit 56 Correction value calculation unit 57 Elevating mechanism control unit 58 Imaging unit control unit 59a Misalignment detection unit 59b Judgment unit M Storage unit

Claims (9)

A mounting device that mounts electronic components on a board.
The board stage on which the board is placed and
A stage moving mechanism for moving the board stage and
A first detection unit that detects the position of the electronic component before mounting and the position of the planned mounting area of the board at the mounting position where the electronic component is mounted on the board mounted on the board stage.
At the mounting position, the bonding head to be mounted on the board by aligning the position of the electronic component with the position of the planned mounting area of the board.
A second detection unit that detects the position of the electronic component after mounting at an inspection position separated from the mounting position, and
With the control device
Have,
The control device is
Based on the position of the planned mounting area of the board detected by the first detection unit, the position of the planned mounting area of the board on which the electronic component is mounted and the position of the planned mounting area of the board detected by the second detection unit. A mounting device including a displacement amount detecting unit that detects a displacement amount with respect to the position of an electronic component. The control device is
It has a board position calculation unit that calculates a position when the planned mounting area of the board moves from the mounting position to the inspection position.
Based on the position calculated by the board position calculation unit, the deviation amount detection unit includes the position of the mounting area of the board on which the electronic component is mounted and the electron detected by the second detection unit. The mounting device according to claim 1, wherein the amount of misalignment with the position of a component is detected. The control device is
The mounting according to claim 2, wherein the board position calculation unit has a correction value calculation unit for calculating a correction value for calculating a position where the mounting planned area is moved from the mounting position to the inspection position. Device. The second detection unit has a function of detecting the position of a planned mounting area of the board on which the electronic component is mounted.
When the second detection unit can detect the position of the planned mounting area of the board on which the electronic component is mounted, the deviation amount detection unit is based on the position detected by the second detection unit. The mounting apparatus according to any one of claims 1 to 3, wherein the misalignment amount is detected. The second detection unit is characterized by having an image pickup unit that transmits the electronic component after mounting and images an alignment mark of the electronic component or an alignment mark of a region to be mounted on the substrate. The mounting device according to any one of claims 1 to 4. 1. The mounting device according to any one of 5. The mounting device according to claim 6, wherein the determination unit determines a positional deviation each time an electronic component is mounted on a substrate. The mounting device according to claim 3, wherein the correction value calculation unit calculates the correction value at a predetermined timing. It is a mounting method for mounting electronic components on a board.
A first detection process in which the first detection unit detects the position of the electronic component before mounting and the position of the planned mounting area of the board at the mounting position where the electronic component is mounted on the board.
A mounting process in which the bonding head aligns the position of the electronic component with the position of the planned mounting area of the board based on the result of the first detection process at the mounting position and mounts the bonding head on the board.
A second detection process in which the second detection unit detects the position of the electronic component after mounting at an inspection position separated from the mounting position.
Based on the position of the planned mounting area of the board detected by the first detection process, the deviation amount detection unit determines the position of the planned mounting area of the board on which the electronic component is mounted and the second detection. Misalignment detection processing that detects the amount of misalignment with the position of the electronic component detected by the processing, and
An implementation method characterized by including.

Images