CN107371360A - Apparatus for mounting component - Google Patents
Apparatus for mounting component Download PDFInfo
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- CN107371360A CN107371360A CN201710176150.1A CN201710176150A CN107371360A CN 107371360 A CN107371360 A CN 107371360A CN 201710176150 A CN201710176150 A CN 201710176150A CN 107371360 A CN107371360 A CN 107371360A
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- shooting
- light path
- hole
- pattern characteristics
- filming apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of apparatus for mounting component, and it need not carry out optical axis adjustment and focusing in the appearance and size change of part, can be with very high precision in a short time to substrate installation portion part.Mounting head has the through hole until transparent holding member, the holding member can keep the part with pattern characteristics portion and is installed on the substrate with pattern characteristics portion, by filming apparatus to by holding member and the first through hole and by the holding member in the first shooting light path of the first reflective optics reflection and the pattern characteristics portion of substrate, and while by holding member and the second through hole and by the holding member in the second shooting light path that the first reflective optics and the second reflective optics reflect and the pattern characteristics portion of substrate shot, the position in two pattern characteristics portions of shooting unit and part can be made to be moved accordingly along through hole orientation so as to carry out position adjustment by device for moving and adjusting.
Description
Technical field
The present invention relates to the apparatus for mounting component for installing part to substrate.
Background technology
In recent years, with the miniaturization using smart mobile phone or tablet terminal as the electronic equipment of representative and high performance
Development, the densification of the part such as semiconductor element, the more pins and thin space of electrode terminal used in these terminals
The development of change accelerates.Therefore, in the erecting device of semiconductor element is installed to substrate, it is desirable in the limited stenosis area of substrate
Installed in domain with high accuracy.
Generally, in the semiconductor mounting method referred to as die bond, read by identification mechanisms such as cameras and partly led
Identification marking that the electrode surface of volume elements part is formed, the identification marking that is formed of electrode surface in substrate, based on resulting relative
Positional information and installed after being aligned, so as to be installed with defined precision.But in common erecting device
In, the adsorption mouth of semiconductor element is made up of opaque component, therefore before semiconductor element is adsorbed by adsorption mouth, is passed through
The identification marking of semiconductor element is identified CCD camera etc..Therefore, not to by adsorption mouth adsorb semiconductor element when
Position skew is modified, and is installed in the case where deviateing the position of identification, and asking for high precision int can not be realized by existing
Topic.
As the device for tackling this requirement, it is proposed that following erecting device, the erecting device are set in adsorption mouth
There is optical path direction to convert component, the identification mechanism of the side by being arranged at adsorption mouth, read the semiconductor adsorbed by adsorption mouth
The identification marking of element, so as to obtain because position caused by absorption is offset, acquired position skew is modified, thus carried
The precision of height installation (for example, referring to patent document 1).
Figure 10 A are the structure charts for the erecting device 101 for schematically showing the semiconductor device proposed in patent document 1.
Erecting device 101 is the device for installing semiconductor element 102 to substrate 103.In semiconductor element 102 formed with multiple contrapositions
Identification marking 104, substrate 103 ratio install semiconductor element 102 region in the outer part place formed with it is multiple contraposition use
Identification marking 105.The prism 109 that is internally provided with of the adsorption mouth 106 of semiconductor element 102 is kept to be used as light path side in absorption
To mapping device, identification marking 104 and base by the inclined-plane 109a of prism 109 to semiconductor element 102 from below
The reflection image of the identification marking 105 of plate 103 is totally reflected, and is converted to side travel direction.The prism hypotenuse/facet surfaces 109a's of light path
Bottom and sidepiece are made up of clear glass.CCD camera 111 therefore, it is possible to the side by being arranged at adsorption mouth 106 is read
The positional information of identification marking 104 and identification marking 105.
Figure 10 B are the one of contraposition of the identification marking 104,105 for the erecting device 101 for showing Figure 10 A, semiconductor element
The top view of part 102 and substrate 103.As shown in Figure 10 B, with the identification marking 104 of semiconductor element 102 with being located on the outside of it
The mode that the identification marking 105 of substrate 103 is arranged in the scope below the visual field width W of CCD camera 111 is aligned.It is logical
Cross in a visual field and read above-mentioned identification marking 104,105, so as to only by entering on X or Y-direction to CCD camera 111
Line position puts control, just can be focused, so as to identify each identification marking 104,105.
According to above-mentioned such erecting device 101, the drive shaft of CCD camera 111 and adsorption mouth 106 discretely configures, because
The central portion of this semiconductor element 102 that can be kept in the central portion of adsorption mouth 106, i.e. adsorption mouth 106 is pressurizeed, no
Torque can be produced in central portion, position skew during engagement can be prevented, so as to greatly improve installation accuracy.Especially for micro-
Small semiconductor element (for example, while being 0.2~0.5mm square semiconductor element), can easily be aligned
And engagement.
Citation
Patent document 1：International Publication No. 2003/041478
The development of the densification of semiconductor device is notable, thus it requires more precisely installing depositing for Large Copacity than ever
The big high function semiconductor element of the profile such as reservoir or application processor.
But in the manufacture device for the semiconductor device that patent document 1 is proposed, it is outer in order to be identified in a visual field
The big semiconductor element of shape by the multiplying power of CCD camera, it is necessary to be set as low range.However, because the resolution ratio of image reduces, because
The problem of accuracy of identification reduces the deviation increase so as to installation accuracy be present in this.For example, in the profile chi using semiconductor element
Very little is 12mm × 12mm large component and in the case of being 0.3 times of CCD camera using multiplying power, and the resolution ratio per pixel is
12~15 μm, installation accuracy is ± 15~± 20 μm.
On the other hand, it be not intended to identify the feelings of large-scale semiconductor element 102 by two visuals field by a visual field
Under condition, in order to which identification marking is each identified, it is necessary to a CCD camera 111 is moved to each identification marking.Especially
It is, in the case where being mounted with to install 1mm × 1mm part after 12mm × 12mm large component, in order to right in the visual field
Each identification marking of part is each identified, it is necessary to a CCD camera 111 is moved to the position of each identification marking.
But if moving CCD camera 111, reduce accuracy of identification because being vibrated caused by movement.In addition,
Only make CCD camera 111 in one direction move in the case of can not be focused, therefore must with ensure from CCD camera 111 to
The mode that the optical path length of identification marking 104 on semiconductor element 102 is constant moves CCD camera 111.Therefore, to identification
Untill time it is elongated, problem be present in productivity.
The content of the invention
Invent problem to be solved
In view of above-mentioned problem, the purpose of apparatus for mounting component of the invention is to provide following apparatus for mounting component, should
Apparatus for mounting component, can be with very high essence without carrying out optical axis adjustment and focusing in the appearance and size change of part
Degree is in a short time to substrate installation portion part.
For solving the scheme of problem
In order to reach above-mentioned purpose, according to the mode of the present invention, there is provided a kind of apparatus for mounting component, possess：Installation
Head, it has holding member in lower end, and with until the first through hole and the second through hole of the holding member, institute
The part in the first pattern characteristics portion and second pattern characteristics portion with contraposition can be kept by stating holding member, and by the portion
Part is installed to the substrate in the first pattern characteristics portion with contraposition and the second pattern characteristics portion, and the holding member energy
It is enough by optical to pass through shooting；First reflective optics, its be configured at first through hole of the mounting head and
The top of second through hole, first reflective optics make by first through hole and second insertion
The first shooting light path and the second shooting light path in hole are distinguished in the top of first through hole and second through hole
The direction that intersects to the through hole orientation from first through hole and second through hole and different to each other
Direction is reflected；Second reflective optics, it makes the either direction of the first shooting light path and the second shooting light path
With appointing the reflection of the opposing party's identical direction；Shooting unit, it has filming apparatus, and the filming apparatus, which utilizes, passes through the holding structure
Part and first through hole of the mounting head and first shooting reflected by first reflective optics
Light path, to the first pattern characteristics portion of upper surface and the institute of the substrate of the part kept by the holding member
State the first pattern characteristics portion to be shot, while utilize second insertion by the holding member and the mounting head
Hole and the second shooting light path reflected by first reflective optics and second reflective optics are right
The second pattern characteristics portion of the upper surface of the part kept by the holding member and described the second of the substrate
Pattern characteristics portion is shot；And device for moving and adjusting, its described first pattern characteristics portion with the part and described
The position in the second pattern characteristics portion correspondingly, makes the shooting unit be moved along the through hole orientation so as to enter line position
Put adjustment.
Invention effect
According to the present invention aforesaid way, part appearance and size change when, without carrying out optical axis adjustment and focusing,
Can be with very high precision in a short time to substrate installation portion part.
Brief description of the drawings
Figure 1A is for being said to the installation action of the apparatus for mounting component involved by first embodiment of the invention
Bright partial, longitudinal cross-sectional.
Figure 1B is the amplification plan view of the mounting head of the apparatus for mounting component involved by first embodiment.
Fig. 1 C are near the first reflective optics of the mounting head of the apparatus for mounting component involved by first embodiment
Amplification longitudinal section.
Fig. 1 D are the first and second reflection optics of the mounting head of the apparatus for mounting component involved by first embodiment
The amplification longitudinal section of arrangement adjacent.
Fig. 1 E are the mounting head of the apparatus for mounting component involved by first embodiment and the top view of shooting unit.
Fig. 2A is for the first through hole to the mounting head by the apparatus for mounting component involved by first embodiment
The top view that observed with the second through hole, widget and the respective pattern characteristics portion of substrate illustrate.
Fig. 2 B are for first in the case of Fig. 2A and the second shooting light path and the first and second reflection optics
The explanation figure that relation between system illustrates.
Fig. 2 C are for the first through hole to the mounting head by the apparatus for mounting component involved by first embodiment
The top view that part observed with the second through hole, big illustrates with the respective pattern characteristics portion of substrate.
Fig. 2 D are for first in the case of Fig. 2 C and the second shooting light path and the first and second reflection optics
The explanation figure that relation between system illustrates.
Fig. 3 is the amplification plan view of the mounting head of the apparatus for mounting component involved by second embodiment.
Fig. 4 A are for the first through hole to the mounting head by the apparatus for mounting component involved by second embodiment
The top view that observed with the second through hole, widget and the respective pattern characteristics portion of substrate illustrate.
Fig. 4 B are the explanations of the identification region based on filming apparatus of the apparatus for mounting component involved by second embodiment
Figure.
Fig. 5 is the mounting head of apparatus for mounting component and the top view of shooting unit involved by the 3rd embodiment.
Fig. 6 is the mounting head of apparatus for mounting component and the top view of shooting unit involved by the 4th embodiment.
Fig. 7 be for the first through hole to the mounting head by the apparatus for mounting component involved by the 5th embodiment with
The top view that second through hole is observed, widget and the respective pattern characteristics portion of substrate illustrate.
Fig. 8 is for first and second count in the mounting head to the apparatus for mounting component involved by the 6th embodiment
The explanation figure that the relation taken the photograph between light path and the first reflective optics and two the second reflective optics illustrates.
Fig. 9 A are for a through hole to the mounting head by the apparatus for mounting component involved by the 7th embodiment
It was observed that, top view that micro-element and the respective pattern characteristics portion of substrate illustrate.
Fig. 9 B are between the first shooting light path and the first and second reflective optics in the case of Fig. 9 A
The explanation figure that illustrates of relation.
Fig. 9 C are between the second shooting light path and the first and second reflective optics in the case of Fig. 9 A
The explanation figure that illustrates of relation.
Figure 10 A are the sketch structure figures for the erecting device for schematically showing the semiconductor device proposed in patent document 1.
Figure 10 B are the vertical views of the one of the contraposition of the identification marking for the erecting device for showing Figure 10 A, part and substrate
Figure.
Description of reference numerals
1 mounting head
1a head main parts
2 parts
2a upper surfaces
2b lower surfaces
The first pattern characteristics of 3a portion
The second pattern characteristics of 3b portion
5 adsorption mouths
6 heaters
11 shooting units
The filming apparatus of 11a first
The filming apparatus of 11b second
11c shoots platform
Mono- filming apparatus of 11e
Mono- identification region of 11f
The region that 11g-A, 11g-B should be identified
12
13 substrates
14 coupling members
40 lift drive mechanisms
41 vavuum pumps
42 image processing apparatus
50 position calculating parts
51 control devices
52 head moving mechanisms
61 first reflective optics
The reflectings surface of 61a first
The reflectings surface of 61b second
62 second reflective optics
The mirrored sides of 62a first
The mirrored sides of 62b second
63a three-reflection optical systems
The reflective optics of 63b the 4th
64 triangular prisms
65 first shooting light paths
66 second shooting light paths
67 heater modules
68 refrigerating modules
The through holes of 69a first
The through holes of 69b second
70 device for moving and adjusting
71 prism modules
72 third shots take the photograph light path
73 reflective optics
74 second reflective optics
74a sides
75 second reflective optics
75a sides
80 through hole orientations
90 and sized parts pattern characteristics portion between the corresponding size (amount of movement) of difference
Embodiment
Hereinafter, embodiments of the present invention are illustrated referring to the drawings.
(first embodiment)
Figure 1A is the schematic cross sectional view of the structure for the apparatus for mounting component for showing the first embodiment of the present invention.Figure 1B is
The mounting head 1 of apparatus for mounting component make reflective optics expose in the state of top view.Fig. 1 C and Fig. 1 D is respectively
Summary longitudinal section after the partial enlargement that reflective condition for the shooting light path to reflective optics illustrates.Fig. 1 E
It is the top view for showing the relation between mounting head 1 and shooting unit 11.
The apparatus for mounting component of first embodiment of the invention shown in Figure 1A~Fig. 1 E be configured to possess mounting head 1,
First reflective optics 61, the second reflective optics 62, shooting unit 11 and device for moving and adjusting 70.
Mounting head 1 comprises at least head main part 1a and is fixed on a holding member for main part 1a lower end 5.As
One, holding member 5 is made up of adsorption mouth 5.Adsorption mouth 5 can holding member 2, and by the part 2 kept to being held in platform
12 substrate 13 is installed, and by that by optical can be formed through the transparent material of shooting.It should be noted that part
2 keeping method uses such as vacuum suction, electrostatic or mechanical clamps.Platform 12 can be under the control of control device 51
By known drive device etc., moved up in the XY direction orthogonal with above-below direction (Z-direction) and around the θ side of Z-direction.
Part 2 plays function as one of member for mount, such as illustrates by silicon, CaCl2 or carborundum etc.
The tube core of the thin plate-like member for the quadrangle that opaque material is formed is IC chip etc..In a face of part 2 (in figure ia
For upper surface) 2a, such as square part 2 at least one pair of diagonal position formed with it is small square etc. the first pattern characteristics
The example (reference picture 2A) of portion 3a and the second pattern characteristics portion 3b as contraposition identification marking.In another face (in Figure 1A
In be lower surface) 2b, formed with such as heat curable adhesive, thermoplasticity as epoxy resin, acrylic resin or silicones
The adhesive linkage (not shown) that bonding agent, conductive adhesive or paste solder are formed.Adhesive linkage is one of bonding layer.
In addition, substrate 13 is formed such as by silicon, glass, stainless steel or resin substrate, flat shape to be circular or
Person is rectangular-shaped etc..In the upper surface of substrate 13 (being in figure ia upper surface) 2a, such as the part peace of the substrate 13 in quadrangle
At least one pair of diagonal bits near holding position and near the first pattern characteristics portion 3a of part 2 and the second pattern characteristics portion 3b
Put and be also formed with first pattern characteristics such as small L-shaped shape portion 16a and the second pattern characteristics portion 16b, as contraposition identification mark
The example (reference picture 2A) of knowledge.
There is the vacuum chamber (not shown) being connected with vavuum pump 41 in adsorption mouth 5 and be connected with vacuum chamber multiple
Suction hole (not shown), vacuum holding can be carried out to part 2 by suction hole.Adsorption mouth 5 is for example by sapphire, quartz, glass
Glass or heat resistant plastice etc. are formed.
Head main part 1a include the prism module 71 of cuboid plate shape, cuboid plate shape refrigerating module 68 and
The heater module 67 of cuboid plate shape.The first reflective optics 61 and the second reflected light are configured with prism module 71
System 62.After it can be identified by the first reflective optics 61 and the second reflective optics 62 progress light chopper
Shooting unit 11 is configured with the direction of image.
Refrigerating module 68 is fixed with the lower surface of prism module 71, having heaters is fixed in the lower surface of refrigerating module 68
Module 67, adsorption mouth 5 is fixed with the lower surface of heater module 67.
It is built-in with heater module 67 as one of heater and plays the heater 6 of function, can be via suction
Attached mouth 5 heats to part 2.In order to soften adhesive linkage when part 2 is installed to substrate 13 or engage solder etc.
Material molten, and the heating for using the heater 6 to carry out.
Refrigerating module 68 is configured with the cooling channel (not shown) of the circulations such as Cooling Water, is cooled down to cause a main body
Portion 1a is not heated because of the heater 6 in heater module 67.
In refrigerating module 68 and heater module 67, there is insertion along the vertical direction in the vertical direction until keeping
The upper surface of component 5 and the first through hole 69a and the second through hole respectively with flat shapes of elongated hole such as ellipses
69b.At the top for the installation site that the adsorption mouth 5 for maintaining part 2 is located at substrate 13, in the first through hole 69a lower end
In opening, the first pattern characteristics portion 3a of the contraposition of part 2 and the first pattern characteristics portion 16a of substrate 13 are positioned at can be saturating
The position that holding member 5 is detected is crossed, and in the second through hole 69b lower ending opening, the second of the contraposition of part 2
Second pattern characteristics portion 16b of pattern characteristics portion 3b and substrate 13, which is located at, can pass through the position that holding member 5 is detected
(reference picture 2A).
As one, the first reflective optics 61 is by with two reflectings surface for deviating from each other 180 degree, i.e., the first reflection
First prism 61 of face 61a and the second reflecting surface 61b rectangular shape is formed.First reflective optics 61 can be like this
It is made up of reflecting prism or speculum.First prism 61 is accommodated in the prism module on the head main part 1a of mounting head 1 top
In 71, and configure in the first through hole 69a and the second through hole 69b top, in the first through hole 69a upper end open
The first reflecting surface 61a of the first reflective optics 61 is inside configured with, and is configured in the second through hole 69b upper end open
There is the second reflecting surface 61b of the first reflective optics 61.Thereby, it is possible to by two first and the second reflecting surface 61a,
61b, make the first longitudinal shooting pickup light of light path 65 and second by the first through hole 69a and the second through hole 69b
Road 66 the first through hole 69a and the second through hole 69b top respectively to the first through hole 69a and the second through hole
The direction (such as orthogonal transverse direction) and mutually different direction that 69b through hole orientation 80 intersects are (for example, deviate 180
The direction of degree, i.e. be right obliquely downward in Figure 1B and Fig. 2 B to left oblique direction) reflection.
Second reflective optics 62 is configured in the prism module 71 on the head main part 1a of mounting head 1 top, as
One, it is made up of the second prism 62 of triangle tabular.Second reflective optics 62 can like this by reflecting prism or
Speculum is formed.As shown in Figure 2 B, for the second prism 62 by using two sides equivalent to hypotenuse, i.e., first is anti-
Penetrate side 62a and the second mirrored sides 62b reflects in 90 degrees respectively, so as to make the first shooting light path 65 and second count
Take the photograph either one of light path 66 shooting light path (for example, in fig. ib for second shooting light path 66) to appoint the opposing party (for example,
It is the first shooting light path 65 in Figure 1B) reflection of identical direction.
As one, shooting unit 11 is by two filming apparatus will being made up of respectively camera etc., i.e., and first and
Two filming apparatus 11a, 11b are fixed on a shooting platform 11c and formed.Platform 11c is shot can be moved relative to mounting head 1 is relative
Dynamic mode is linked by coupling member 14 and mounting head 1, is configured to integratedly move with mounting head 1.Thus, keeping
During the top for the installation site that the adsorption mouth 5 for having part 2 is located at substrate 13, the of the upper surface of the part 2 kept by adsorption mouth 5
First pattern characteristics portion 16a of one pattern characteristics portion 3a and substrate 13 is entered the first shooting and filled using the first shooting light path 65
11a is put, so as to be shot, the first shooting light path 65 passes through transparent adsorption mouth 5, penetrates the first through hole of mounting head 1
69a, reflect 90 degree towards the first filming apparatus 11a in the first reflecting surface 61a of the first reflective optics 61.In addition, by inhaling
Second pattern characteristics portion 3b of the upper surface for the part 2 that attached mouth 5 is kept and the second pattern characteristics portion 16b of substrate 13 utilizes the
Two shooting light paths 66 enter the second filming apparatus 11b, and so as to be shot, the second shooting light path 66 passes through transparent adsorption mouth
5, the second through hole 69b of mounting head 1 is penetrated, in the second reflecting surface 61b directions and second count of the first reflective optics 61
After taking the photograph 90 degree opposite of a lateral reflections of device 11b, reflected in the first mirrored sides 62a of the second reflective optics 62 and second
Side 62b reflect 90 degree respectively and towards the second filming apparatus 11b.From the first reflecting surface 61a of the first reflective optics 61
The first shooting light path 65 towards the first filming apparatus 11a and the second mirrored sides 62b courts from the second reflective optics 62
It is parallel to the second filming apparatus 11b the second shooting light path 66.By using this structure, the adsorption mouth 5 of part 2 is being maintained
, can be by the first filming apparatus 11a and the second filming apparatus 11b to by adsorbing during positioned at the top of the installation site of substrate 13
The the first pattern characteristics portion 3a of upper surface and the first pattern characteristics portion 16a and part 2 of substrate 13 for the part 2 that mouth 5 is kept
The second pattern characteristics portion 3b and substrate 13 the second pattern characteristics portion 16b simultaneously shot.So, in the first pickup light
In road 65, reflected once in the first reflecting surface 61a of the first reflective optics 61, in the second shooting light path 66, first
Second reflecting surface 61b of reflective optics 61, the first mirrored sides 62a of the second reflective optics 62, the second reflection side
Face 62b reflects three times, overall to amount to reflection four times.So, in the configuration aspects of mounting head 1, can not mounting head 1 just on
Side's configuration filming apparatus, and in the case of the side of mounting head 1 configuration filming apparatus, lead between component side to filming apparatus
Reflective optics overall reflective even-times is crossed, so as to the figure of each two by filming apparatus to part 2 and substrate 13
Pattern characteristics portion is shot simultaneously.
In addition, it is connected with image processing apparatus 42, first and second count in first and second filming apparatus 11a, 11b
Take the photograph device 11a, 11b and image processing apparatus 42 plays function as one of pattern recognition device.Can be according to by first
And second image information that photographs of filming apparatus 11a, 11b, utilize image processing apparatus 42 to carry out the public affairs such as background subtraction
The image procossing known, so as to read the first of the first pattern characteristics portion 3a and the second pattern characteristics portion 3b position and substrate 13
Pattern characteristics portion 16a and the second pattern characteristics portion 16b position.First pattern characteristics portion 3a of the part 2 being kept and
The the first pattern characteristics portion 16a and the second pattern characteristics portion 16b of second pattern characteristics portion 3b and substrate 13 image are passing through
After adsorption mouth 5, penetrate the first through hole 69a and the second through hole 69b respectively, by the first reflective optics 61 and/
Or second shooting face travel direction conversion of the reflective optics 62 to first and second filming apparatus 11a, 11b, import
To first and second filming apparatus 11a, 11b, the first pattern spy thus, it is possible to read part 2 by image processing apparatus 42
Sign portion 3a and the second pattern characteristics portion 3b positional information and the first pattern characteristics portion 16a of substrate 13 and the second pattern are special
Sign portion 16b positional information (reference picture 2A).Here, according to the first pattern characteristics portion 3a of two positions on part 2 and
Second pattern characteristics portion 3b positional information, by the position calculating part 50 being connected with image processing apparatus 42 calculate relative to
The relative coordinate of the part 2 of the coordinate of the center of gravity of adsorption mouth 5, as position offset.Equally, according to two positions on substrate 13
The the first pattern characteristics portion 16a and the second pattern characteristics portion 16b positional information put, by being connected with image processing apparatus 42
Position calculating part 50 calculate the relative coordinate of the substrate 13 of the coordinate of the center of gravity relative to platform 12, as position offset.
The each information calculated is exported to control device 51.It should be noted that in fig. 2, the dotted line 11a- of the quadrangle of lower-left
A is the identification region of the first filming apparatus 11a including the first pattern characteristics portion 3a and the first pattern characteristics portion 16a,
The dotted line 11b-B of the quadrangle of upper right is second including the second pattern characteristics portion 3b and the second pattern characteristics portion 16b
Filming apparatus 11b identification region.
Mounting head 1 is also equipped with a lift drive mechanism 40 and head moving mechanism 52.
Head lift drive mechanism 40 in a manner of opposed with mounting head 1 relative to being set and keep the platform 12 of substrate 13
Drive installation first 1 on the vertical direction of plane (such as above-below direction is Z-direction).
Head moving mechanism 52 can make mounting head 1 in the moving direction with the mounting head 1 based on head lift drive mechanism 40
(such as above-below direction) orthogonal transverse direction moves on (such as XY directions).
Control device 51 distinguishes correct lift drive mechanism 40, heater 6, vavuum pump 41, head moving mechanism 52, mobile tune
Engagement positions 70, image processing apparatus 42, position calculating part 50 and platform 12 are driven control.Control device 51 being capable of basis
The position coordinates for being identified by image processing apparatus 42 and being calculated by position calculating part 50, difference driving head lift drive mechanism
40th, head moving mechanism 52, heater 6, vavuum pump 41, so as to carry out the contraposition of part 2 and substrate 13 while carrying out part
Installation.
Device for moving and adjusting 70 can make to be fixed with the first and second filming apparatus under the control of control device 51
11a, 11b shooting platform 11c and the size of part 2 correspondingly, specifically, with the first pattern characteristics portion 3a of part 2 and
Second pattern characteristics portion 3b position is moved accordingly along through hole orientation 80, so as to carry out position adjustment.As shifting
The example of dynamic adjusting apparatus 70, can be made up of cylinder isoline actuator, or can by motor, rectilinear guide and
The direct acting device that can be point-blank moved back and forth that ball-screw is formed is formed.
Enter in further detail to carry out the content of position adjustment to moving shooting unit 11 by device for moving and adjusting 70
Row explanation.
Part 2 it is of different sizes in the case of, by moving shooting unit 11, respectively change first reflection optical system
System 61 and second reflective optics 62 reflection position and make first and second shooting light path 65,66 move in parallel, energy
The first pattern that the part 2 of diverse location is enough pointed to by identical two first and second filming apparatus 11a, 11b is special
Sign portion 3a and the second pattern characteristics portion 3b are identified.For example, in the case of widget 2A as Fig. 2A, Fig. 2 B void
The first shooting light path 65A shown in line and Fig. 2 D single dotted broken line and each position on the second shooting light path 66A part 2
Put it is close to each other, can by first and second filming apparatus 11a, 11b to widget 2A the first pattern characteristics portion 3a with
And second the first pattern characteristics portion 16a and the second pattern characteristics portion 3b of pattern characteristics portion 3b and substrate 13 known simultaneously
Not.On the other hand, in the case of big part 2B as Fig. 2 C, shooting unit 11 can be made by device for moving and adjusting 70
The position of the first shooting light path 65A and the second shooting light path 66A shown in single dotted broken line from Fig. 2 D are moved to Fig. 2 D void
The first shooting light path 65B and the second shooting light path 66B shown in line, in other words, as indicated with arrows 81 like that from single dotted broken line
Position 11A be moved to the position 11B of dotted line.So, if as shown in Fig. 2 D dotted line first shooting light path 65B and
Second shooting light path 66B is such, changes the reflection position of the first reflective optics 61 and the second reflective optics 62 respectively
Put, then each position phase on the first shooting light path 65B shown in Fig. 2 D dotted line and the second shooting light path 66B part 2
It is mutually remote, can be by first and second filming apparatus 11a, 11b to big part 2B the first pattern characteristics portion 3a and the
Two pattern characteristics portion 3b and substrate 13 the first pattern characteristics portion 16a and the second pattern characteristics portion 3b are identified simultaneously.
This, as one, widget 2B size is 1mm × 1mm, and big part 2A size is 12mm × 12mm.
It should be noted that for the amount of movement of shooting unit 11 as caused by device for moving and adjusting 70, for example, making
Shooting unit 11 moves and widget 2B the first pattern characteristics portion 3a position and big part 2A the first pattern characteristics portion 3a
Position difference corresponding to size 90.
Apparatus for mounting component involved by the first embodiment carries out installation action as described below.A following system
The installation action of row carries out action control by control device 51.
The load transfer station (not shown) of boarded parts 2 is arranged on the position for separating constant distance with the platform 12 of mounted board 13.
Mounting head 1 possesses the head moving mechanism 52 and Vertical Square that can carry out the horizontal direction moved back and forth between load transfer station and platform 12
To head lift drive mechanism 40, control is driven by control device 51 respectively.Shooting unit 11 is configured to pacifying
Side near dress first 1 moves adjustment by device for moving and adjusting 70.
In this state, first, under the control of control device 51, for the part 2 being mounted on load transfer station, pass through
First and second pattern characteristics portion 3a, the 3b for being formed at part 2 is identified load transfer station camera (not shown), reads and
The positional information of the mounting head 1 of self-control device 51.
Afterwards, according to first and second pattern characteristics portion 3a, 3b identification information (the first and second pattern characteristics portion
The positional information of 3a, 3b relative coordinate) and mounting head 1 positional information (positional information of the absolute coordinate of mounting head 1), lead to
The drive control of head moving mechanism 52 and head lift drive mechanism 40 is crossed, makes mounting head 1 in X, Y and θ direction (around Z-direction
Direction of rotation) on align and decline with being equipped on the part 2 of load transfer station, the adsorption mouth 5 of mounting head 1 is contacted with part 2, pass through
Vacuum suction acts the adsorption mouth 5 that part 2 is held in mounting head 1.It is formed to it should be noted that having in load transfer station
, can also be without using the first filming apparatus 11a and second in the case of the positioning mechanism for storing the concave shape of all parts 2 etc.
Filming apparatus 11b.Here, in order to shorten the set-up time, mounting head 1 can also be heated in advance by heater 6.
Next, under the control of control device 51, according to it is being stored in the storage part being held in control device 51, take
The information of the parts mount position for the substrate 13 being loaded on platform 12, pass through the drive of head moving mechanism 52 and head lift drive mechanism 40
Dynamic control, makes mounting head 1 be moved to the top position of the parts mount position of substrate 13, makes the first pattern characteristics portion of part 2
The the first pattern characteristics portion 16a and the second pattern characteristics portion 16b of 3a and the second pattern characteristics portion 3b and substrate 13 enter
The first count in light path 66 is shot from the first through hole 69a and the second through hole 69b the first shooting light path 65 and second
Take the photograph in device 11a identification region and the second filming apparatus 11b identification region.
Next, under the control of control device 51, special to the first pattern of part 2 by the first filming apparatus 11a
While sign portion 3a and substrate 13 the first pattern characteristics portion 16a are shot, by the second filming apparatus 11b to part 2
Second pattern characteristics portion 3b and substrate 13 the second pattern characteristics portion 16b are shot.
Next, under the control of control device 51, according to the image photographed, pass through the image of image processing apparatus 42
Processing, to two on two first be held on the part 2 of mounting head 1 and second pattern characteristics portion 3a, 3b and substrate 13
Individual first and second pattern characteristics portion 16a, 16b carries out image recognition simultaneously, according to image recognition result, is calculated by position
Portion 50 carrys out relative coordinate of the calculating unit 2 relative to substrate 13.
Next, under the control of control device 51, according to the result of calculation of position calculating part 50, pass through head moving mechanism
52 make mounting head 1 be moved along X, Y, θ direction, or/and platform 12 is moved along X, Y, 0 direction and carry out position adjustment, with right
Position skew is modified, afterwards while pressurizeing part 2 while making part 2 by head lift drive mechanism 40 towards substrate 13
Decline and installed.Here, the heat of heater 6 is transmitted to the adhesive linkage at the back side of part 2 via the adsorption mouth 5 of mounting head 1
Amount, is bonded because the adhesive linkage softened heat is pressed against substrate 13.
According to this installation method, before it will install, by two first and second filming apparatus 11a, 11b with
Image processing apparatus 42 is to first and second pattern characteristics portion 3a, 3b of part 2 and the first pattern characteristics portion 16a of substrate 13
And second the total four pattern characteristics portions of pattern characteristics portion 16b shot simultaneously and carry out image recognition, therefore do not pass through
Filming apparatus carries out multiple shooting action, only by a shooting action, therefore can shorten shooting processing time, moreover it is possible to
Accuracy of identification deviation is enough reduced, and can be installed according to the positional information of part 2 and substrate 13 before will installing,
Therefore can be installed with very high precision.
In addition, part 2 it is of different sizes in the case of, it is necessary to following such mobile adjustment action.Here, as one
Example, is illustrated to following situation：After installation action is carried out to the widget 2A shown in Fig. 2 B and Fig. 2 C, next,
Installation action is carried out to the big part 2B shown in Fig. 2 C and Fig. 2 D.In widget 2A and big part 2B, part 2 first with
And second pattern characteristics portion 3a, 3b position and substrate 13 the first pattern characteristics portion 16a and the second pattern characteristics portion 16b
Position differs greatly, it is therefore desirable to moves identification region.
Therefore, first, under the control of control device 51, make shooting unit 11 i.e. first and the second filming apparatus 11a,
11b is special relative to the movement of mounting head 1 and widget 2B the first pattern characteristics portion 3a position and big part 2A the first pattern
Size 90 corresponding to the difference of sign portion 3a position.Specifically, make shooting unit 11 relative to mounting head 1 with from Fig. 2 D single-point
The mode of the position of line to the position of Fig. 2 D dotted line moves.
After next, carry out the holding of part 2, the movement above the installation site towards substrate 13, part 2 with
Being shot while adding up to four pattern characteristics portion 3a, 3b, 16a, 16b, after identifying processing and position calculating for substrate 13, enters
Row part is installed.
It should be noted that conversely, to shown in Fig. 2 C and Fig. 2 D big part 2B carry out installation action followed by
In the case of carrying out installation action to the widget 2A shown in Fig. 2 B and Fig. 2 C, it is right that adjustment need to be only moved round about
Installation action is carried out afterwards.
As described above, according to first embodiment, only need to be with the first figure of part 2 even if the appearance and size of part 2 becomes big
Pattern characteristics portion 3a and the second pattern characteristics portion 3b position correspondingly, by device for moving and adjusting 70 make two filming apparatus
11a, 11b are integratedly mobile along direction (through hole orientation 80), change respectively the first reflective optics 61 with
And second reflective optics 62 reflection position, without carrying out trickle optical axis adjustment and focusing.Therefore, exist
During the appearance and size change of part 2, without carrying out trickle optical axis adjustment and focusing, therefore it can be existed with very high precision
To the installing component 2 of substrate 13 in short time.In addition, even big part 2, also can accurately be known in a short time
Not.Thereby, it is possible to easily tackle to change associated production type switching with the appearance and size of part 2, additionally it is possible to tackle more product
Kind production.
In addition, by the first reflective optics 61 and the second reflective optics 62 simultaneously by the first pattern characteristics portion
3a and the second pattern characteristics portion 3b image information are guided to first and second filming apparatus 11a, 11b respective cog region
In domain, the first pattern characteristics portion 3a and the second pattern characteristics portion 3b of part 2 position are obtained respectively by image processing apparatus 42
The position coordinates of coordinate, the first pattern characteristics portion 16a of substrate 13 and the second pattern characteristics portion 16b is put, so as to pass through position
Put the position coordinates that calculating part 50 distinguishes calculating unit 2 and the in-plane of substrate 13.As a result, even if without using low range
Camera, also can in first and second filming apparatus 11a, 11b each visual field simultaneously observe each two first
Pattern characteristics portion 3a, 16a each other and second pattern characteristics portion 3b, 16b each other, it is possible to increase four pattern characteristics portion 3a, 3b,
16a, 16b resolution ratio, either profile are, for example, the widget of big part or 1mm × 1mm as 12mm × 12mm,
It can be installed in a short time to substrate 13 with very high precision.
(second embodiment)
It should be noted that the present invention is not limited to the first embodiment, other various modes can also be passed through
To implement.
For example, shooting unit 11 is not limited to possess two filming apparatus 11a, 11b, electricity can possess a filming apparatus
11e.That is, as shown in figure 3, configuring a filming apparatus 11e as shooting unit 11, and by reflecting prism by triangle etc.
The three-reflection optical system 63a and the 4th reflective optics 63b formed is configured at shooting unit 11, filming apparatus 11e
Integratedly moved by device for moving and adjusting 70 with three-reflection optical system 63a and the 4th reflective optics 63b.And
And second shooting light path 66 it is identical with first embodiment, but replace first shoot light path 65 and form third shot and take the photograph light path 72,
It is identical with the first shooting light path 65 of first embodiment from the side of mounting head 1 to the light path for entering shooting unit 11, but entering
During shooting unit 11, after 90 degree of 66 lateral reflection of light path is shot to second by three-reflection optical system 63a, in the second shooting
90 degree are reflected to enter filming apparatus 11e by the 4th reflective optics 63b near light path 66.
Thus, in a filming apparatus 11e identification region 11f, Fig. 4 A part 2 should be known with two of substrate 13
Other region 11g-A, 11g-B are adjacently presented as shown in Figure 4B.
According to the second embodiment, two shooting light paths 56,66 can be applied to by a filming apparatus 11e, because
This structure is simpler, further, it is possible to which cost of implementation reduces.In addition, according to the second embodiment, without multiple filming apparatus
Mutual synchronous driving, can be identified, and can shorten the beat of shooting action etc. with high accuracy.
(the 3rd embodiment)
Light path 65 is shot with entering second into the first of the first filming apparatus 11a from the reflective optics of mounting head 1
Filming apparatus 11b the second shooting light path 66 is not limited to parallel as in the first embodiment, can also form one as shown in Figure 5
Fixed fixed angle.
According to the 3rd embodiment, it is possible to increase the first filming apparatus 11a and the second filming apparatus 11b layout from
By spending.
(the 4th embodiment)
Even if light path 65 is shot with entering into the first of the first filming apparatus 11a from the reflective optics of mounting head 1
Second filming apparatus 11b the second shooting light path 66 is parallel as in the first embodiment, can also be as shown in fig. 6, by second
Filming apparatus 11b is configured to deviate relative to the first filming apparatus 11a 90 degree of phase.In this case, will be from second
Light path 66 is shot to enter before the second filming apparatus 11b, it is necessary to reflect 90 degree by the reflective optics such as triangular prism 73.
According to the 4th embodiment, if being combined with first embodiment, can be laid out with the configuration of shooting unit 11
Independently apply first embodiment.
(the 5th embodiment)
In addition, the first pattern characteristics portion 3a of part 2 and the second pattern characteristics portion 3b position are not limited to diagonal section,
Can be with as shown in fig. 7, being arranged respectively at the arbitrary part such as the pars intermedia on one side.
According to the 5th embodiment, if being combined with first to fourth embodiment, even for elongated rectangle
Part etc. can also apply first to fourth embodiment, it is possible to increase the design freedom of component shape.
(the 6th embodiment)
First shooting light path 65 is not limited to only be reflected by the first reflective optics 61, can also as shown in figure 8,
Two secondary reflections are carried out by the side 75a equivalent to base of the first reflective optics 61 and the second reflective optics 75,
The second shooting light path 66 can also be by the first reflective optics 61 and the second reflective optics 74 equivalent to base
Side 74a carries out two secondary reflections.Second reflective optics 75,76 is able to the triangle by making shooting light path reflect 90 degree
Speculum or prism form.
According to the 6th embodiment, it is possible to increase the free degree of the configuration layout of reflective optics.
(the 7th embodiment)
, can also the invention is not restricted to be divided into the through hole of two as the first through hole 69a and the second through hole 69b
As shown in Figure 9 A by a through hole dual-purpose as through hole 69c.So, structure is simpler.
Alternatively, it is also possible to as shown in Figure 9 B, in Fig. 9 A structure, extend the first reflecting surface 61c of the first prism 61
To the center of mounting head 1.So, for the first shooting light path 65C, the upper surface of the part 2 kept by adsorption mouth 5
The first pattern characteristics portion 3a and the first pattern characteristics portion 16a of substrate 13 pass through transparent adsorption mouth 5, penetrate mounting head 1
A through hole 69c, the first reflecting surface 61c towards the first filming apparatus 11a reflect 90 degree.Thereby, it is possible to be formed as
One shooting structures of the light path 65C by the center of mounting head 1.It should be noted that when using the second shooting light path, the is used
Second reflecting surface 61d of one prism 61.
It should be noted that as the example different from Fig. 9 B, it can also make as shown in Figure 9 C, in Fig. 9 A structure
Second reflecting surface 61f extends to the center of mounting head 1.So, for the second shooting light path 66C, protected by adsorption mouth 5
First pattern characteristics portion 3a of the upper surface for the part 2 held and the first pattern characteristics portion 16a of substrate 13 pass through transparent suction
Attached mouth 5, a through hole 69c of mounting head 1 is penetrated, after the second reflecting surface 61f reflects 90 degree, in the first mirrored sides 62a
90 degree are reflected respectively with the second mirrored sides 62b, then towards the second filming apparatus 11b.Thereby, it is possible to be formed as the second shooting
The structure that light path 66C passes through the center of mounting head 1.It should be noted that when using the first shooting light path, the first prism is used
61 the first reflecting surface 61e.
According to the 7th embodiment, it is not limited to be based on using two through holes 69a, 69b as in the first embodiment
Two visuals field shooting, can also be shot by using a through hole 69c visual field, also can be such as Fig. 9 A institutes
Show and be applied to small semiconductor element like that.
It should be noted that in each embodiment, the position for substrate 13 relative to platform 12 can also be without using upper
The filming apparatus for the shooting unit stated, but shooting identification is carried out by other filming apparatus of substrate position identification, so as to
Obtain position coordinates.
It should be noted that pass through any embodiment in appropriately combined above-mentioned various embodiments or variation or change
Shape example, the effect that each of which has can be realized.In addition, embodiment can be combined with each other or by embodiment group each other
Close or combine embodiment with embodiment, and also can be by the feature in different embodiment or embodiment each other
Combination.
Industrial applicability
Apparatus for mounting component involved by the aforesaid way of the present invention, which has, accurately in a short time installs part
It is used in the large-scale part such as installation high-speed large capacity memory, application processor, CPU in the effect of substrate
It is particularly useful in apparatus for mounting component.
Claims (8)
1. a kind of apparatus for mounting component, possesses：
Mounting head, it has holding member in lower end, and with until the first through hole and second of the holding member
Through hole, the holding member can keep the portion in the first pattern characteristics portion and second pattern characteristics portion with contraposition
Part, and the part is installed to the substrate in the first pattern characteristics portion with contraposition and the second pattern characteristics portion, and institute
Stating holding member can be by optical through shooting；
First reflective optics, it is configured at the upper of first through hole of the mounting head and second through hole
Side, first reflective optics make by the first shooting light path of first through hole and second through hole with
And second shooting light path the top of first through hole and second through hole respectively to first through hole
And direction and the directions different to each other reflection of the through hole orientation intersection of second through hole；
Second reflective optics, it makes the either direction of the first shooting light path and the second shooting light path another with appointing
One side's identical direction is reflected；
Shooting unit, it has filming apparatus, and the filming apparatus utilizes the institute by the holding member and the mounting head
State the first through hole and shoot light path by described the first of first reflective optics reflection, to by the holding member
The first pattern characteristics portion of the upper surface of the part kept is carried out with the first pattern characteristics portion of the substrate
Shooting, while utilize by the holding member and second through hole of the mounting head and reflected by described first
Optical system and the second shooting light path of second reflective optics reflection, to what is kept by the holding member
The second pattern characteristics portion of the upper surface of the part is shot with the second pattern characteristics portion of the substrate；With
And
Device for moving and adjusting, itself and the first pattern characteristics portion of the part and the position in the second pattern characteristics portion
Correspondingly, the shooting unit is made to be moved along the through hole orientation so as to carry out position adjustment.
2. apparatus for mounting component according to claim 1, wherein,
The direction and the second shooting light path that the first shooting light path is reflected by first reflective optics are described
The direction of first reflective optics reflection is the direction intersected with the through hole orientation and is to deviate from each other 180 degree
Direction, and the second shooting light path carries out two secondary reflections by second reflective optics, per 90 degree of secondary reflection, from
And enter the shooting unit as the light path parallel with the described first shooting light path.
3. apparatus for mounting component according to claim 1, wherein,
The shooting unit possesses the first filming apparatus being equipped with the first shooting light path and the second shooting light path
Second filming apparatus of middle outfit, the shooting unit carry out the first shooting light path based on first filming apparatus simultaneously
In shooting and based on second filming apparatus it is described second shooting light path in shooting.
4. apparatus for mounting component according to claim 2, wherein,
The shooting unit possesses the first filming apparatus being equipped with the first shooting light path and the second shooting light path
Second filming apparatus of middle outfit, the shooting unit carry out the first shooting light path based on first filming apparatus simultaneously
In shooting and based on second filming apparatus it is described second shooting light path in shooting.
5. apparatus for mounting component according to claim 1, wherein,
The shooting unit possesses the filming apparatus being equipped with the first shooting light path and the second shooting light path, passes through
The filming apparatus carries out the shooting in shooting and the described second shooting light path in the first shooting light path simultaneously.
6. apparatus for mounting component according to claim 2, wherein,
The shooting unit possesses the filming apparatus being equipped with the first shooting light path and the second shooting light path, passes through
The filming apparatus carries out the shooting in shooting and the described second shooting light path in the first shooting light path simultaneously.
7. apparatus for mounting component according to claim 1, wherein,
Doubled as by a through hole as first through hole and second through hole.
8. apparatus for mounting component according to claim 2, wherein,
Doubled as by a through hole as first through hole and second through hole.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-095394 | 2016-05-11 | ||
| JP2016095394 | 2016-05-11 | ||
| JP2016-222128 | 2016-11-15 | ||
| JP2016222128A JP6390925B2 (en) | 2016-05-11 | 2016-11-15 | Component mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107371360A true CN107371360A (en) | 2017-11-21 |
| CN107371360B CN107371360B (en) | 2019-07-05 |
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ID=60304359
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710176150.1A Active CN107371360B (en) | 2016-05-11 | 2017-03-22 | Apparatus for mounting component |
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| Country | Link |
|---|---|
| CN (1) | CN107371360B (en) |
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| CN109906029A (en) * | 2017-12-08 | 2019-06-18 | 爱立发株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| CN110446423A (en) * | 2019-08-21 | 2019-11-12 | 常州铭赛机器人科技股份有限公司 | Easy-to-mount absorption executing agency and the placement equipment with it |
| CN113451175A (en) * | 2020-03-26 | 2021-09-28 | 芝浦机械电子装置株式会社 | Mounting device for electronic component |
| CN113451176A (en) * | 2020-03-26 | 2021-09-28 | 芝浦机械电子装置株式会社 | Mounting device for electronic component |
| CN114302785A (en) * | 2019-09-27 | 2022-04-08 | 松下知识产权经营株式会社 | Mounting system, head unit, and imaging method |
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| CN110446423A (en) * | 2019-08-21 | 2019-11-12 | 常州铭赛机器人科技股份有限公司 | Easy-to-mount absorption executing agency and the placement equipment with it |
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| CN113451175A (en) * | 2020-03-26 | 2021-09-28 | 芝浦机械电子装置株式会社 | Mounting device for electronic component |
| CN113451176A (en) * | 2020-03-26 | 2021-09-28 | 芝浦机械电子装置株式会社 | Mounting device for electronic component |
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| CN113451176B (en) * | 2020-03-26 | 2024-04-12 | 芝浦机械电子装置株式会社 | Electronic component mounting apparatus |
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| Publication number | Publication date |
|---|---|
| CN107371360B (en) | 2019-07-05 |
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