1376177 九、發明說明： 【發明所屬之技術領域】 • 本發明是關於一種光學對位裝置及具有該裝置之系 統，尤其是一種電路裝置與基板接合用光學對位裝置及具 • 5 有該裝置之系統ό 【先前技術】 液晶顯示器玻璃或印刷電路板類之基板上，多需設置 • 如積體電路、或其他電路元件，尤其隨元件之複雜化，接 腳數目持續增多、接腳密度隨之增大，接合程序的效率與 1〇精準日盈夂重視，業界無不費盡心思開發應用於接合製程 之全自動化機台，其中，負責精密定位電路裝置與基板兩 者，從而確保接合時之精密對位裝置，更成為影響機台效 能之重要因素。 圖1是習知電路裝置與基板接合進行對位時，定焦型 15工業攝影機動作示意圖，一般工業攝影機為保持精密之解 鲁析度，所設定之攝像景深範圍因而相當短淺，亦即，當光 程稍有超過範圍，即無法清楚判別解析。圖中左上侧為基 板10，上方記號X為預備接合點，右上側之電路裝置12 準備以s己號X定位接合至基板1〇，基板1〇與電路裝置以 20進行接合之前’必需保持一高度差h。 為確定電路裝置12與基板10接合正確，需由定焦型 工業攝影機14感測基板1〇與電路裝置12之兩處記號X 位置，因兩者存有高度差h，兩個記號χ與定焦型工業攝 影機14之距離（光程）並不相同，只能依先後分別判斷。假 5 1376177 定先測定基板10之記號χ位 記號X時，定焦型工業攝影機後:感測電路裝置 焦型工業攝影機位置14， '依-頭方向變換至定 誤，基板1〇需暫時朝水 ’且為避免感測判讀錯 5 置私 箭碩方向位移，候感測電路裝 置2之記號X動作執行完畢後方復位。 二即，縱令^ 1〇為透明破璃材質，定隹型工⑽ :……接穿透感測基板i。，卻 二⑽ 上之記號X與電路裝置12 ㈣龜板10 …退避與復位流程，除二額，添基 次可能發生機械誤差之機合，、0 又化成 ιλ -人進仃對位動作時，定焦 業攝心機14亦需不斷升降以變換對焦位置。 圖2是習知電路裝置與基板接合進行對位時，變隹型 =?6動作示意圖’若將感測之鏡頭更換為變焦型工 15 外靡 可藉變焦型工業攝影機16之内部動作減少 h硯之上下移動，卻仍有相同的問題， 板1。與電路裝置〗2上的記號乂。 湖基 因此’若能提供一種可同時感測基板與電路裝置接人 §己號之光學對位裝置與具有該裝置之系統，同時感測兩者 之預備接合記號，除大幅縮短對位時間，減少被感測物之 不必要位移，也直接杜絕可能產生誤差之機會，應為最佳 解決方案。 【發明内容】 ^因此，本發明之一目的，在提供一種運用光學原理補 W拜南度差問題’同時感測電路裝置與基极所在空間位 20 1376177 置之電路裝置與基板接合用光學對位裝置。 一 發月另目的’在提供一種運用光學原理補償消弭 南度差問題，同時感測電路裝置與基板所在空間位置之電 路裝置與基板接合用光學對位系統。 5 本發明之再一目的，在提供一種僅需單次影像類取作 f ’大巾田縮Μ學對位耗用時間，直接提昇接合系統與機 台工作效率之電路裝置與基板接合用光學對位系統。 • 纟發月之又—目的’在提供—種減少基板與電路裝置 間無謂相對應運動，使機械誤差產生機會降至最低，接合 1〇良率從而提升之電路裝置與基板接合用光學對位系統。 本發明之又另一目的，在提供一種不必使用變焦型工 業攝影機、構造精簡、建制成本低廉之電路裝置與基板接 合用光學對位系統。 因此，本發明為一種電路裝置與基板接合系統用之光 U予對位裝置’供將該電路裝置精密對位接合至與該電路裝 I置間留有高度差之該基板，該接合系統包含一組承載該基 板之承載裝置、-組攜帶並移動該電路裝置之攜行裝置、 及一組驅動該承載裝置與該攜行裝置相對移動之控制裝 置，該光學對位裝置包含：一組受該控制裝置驅動、在該 留有高度差方向、供同步操取該電路裝置及該基板之光學 影像的光學影像操取單元；及一組介於該電路裝置與該光 學影像掘取單元間及/或該基板與該光學影像榻取單元 間、用以補償該電路裝置與該基板對應該高度差之光程差 的光程補償單元。 7 1376177 藉由光程補償單元之配置，一方面有效補償電路裝置 與基板之對位記號至光學影像擷取單元之實際高度與光 程差，使光學影像擷取裝置可單次同步擷取兩者影像，並 判讀三度空間之對位是否精確，不僅簡化對位流程、提升 作業效率，從而降低機械操作所導致之可能誤差、提升良 率，尤其光學影像擷取裝置可採用定焦攝影機，使系統之 建制成本明顯降低、精度提升，完整解決習知光學對位系 統存在的各方面問題。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之較佳實施例的詳細說明中，將可清楚 的呈現。 15 20 圖3為本發明應用之第一較佳實施例示意圖，如前所 =，其中基板10與電路裝置12間留有高度差h ,且兩者 而精密對位接合。本發明之光學對位裝置2包含：受控制 裝置3驅動、在尚度差方向同步擷取電路裝置I?及基板 10光學影像的光學影像擷取單元2〇 ;及介於電路裝置12 ”光子衫像擷取單元2〇間、用以補償電路裝置12與基板 10對應高度差h之光程差的光程補償單元22。 其令兩段關鍵之光程，即光學影像擷取單元2〇至電 1裝置12 s己號X間，以及光學影像擷取單元2〇至基板 號X間之光程，為避免校准移動中相互碰撞，兩者 :有:目對移動所需之安全高度差，導致兩段光程並不相 5仁光程補償單元22可改變自光學影像擷取單元20至 8 1376177 • 電路裝置12記號X間之光程，使兩段光程無差距，光學 影像擷取單元20可同時擷取視為一平面之影像。 光程補償單元22可由具一定透光率’且滿足所需轉 換光程率之材料形成，例如石英或其他適宜材料；圖4為 5本發明第—較佳實施例示意圖，光程補償單元22,介於電 路裝置12/基板1〇與光學影像擷取單元2〇間，藉由兩種 彼此折射率相異的透光稜鏡，讓來自電路裝置12之光束 • 與來自基板10之光束，行經不同折射率之稜鏡而進入光 學影像擷取單元，完成光程補償。 圖5疋本發明第二較佳實施例，光程補償單元22”同 樣介於電路裝置12/基板1〇與光學影像擷取單元2〇間， 刀另J由直角二角形稜鏡與一配置於三角形 平行四邊形稜鏡共同構成，在三角形與四邊形稜鏡介面 處’並鍍覆有一半反射半穿透膜。 15 使得來自基板的光線’會先由四邊形稜鏡之上方表面 書入射絰左下斜邊反射，橫向越過圖式之四邊形稜鏡，再 由介面處之半反射半穿透膜反射向圖式下方脫離棱鏡；相 對地，來自電路元件之光線，將直接穿過三角形棱鏡、半 反射半穿透膜、與四邊形而直行向圖式下方，使得來自基 板與電路元件之光束行經此一複合棱鏡之不同光程，從= 補償原本結構上之光程差。 圖6是本發明的光學對位裝置第四實施例之示意 圖，實際應用上，為能更清楚擷取基板1〇與電路裝置^ 各記號X之影像，光學對位系統2除包含控制裝置3所控 1376177 制之攝影機24,以及提供光程補償的光程補償單元η 外’更設置有補充照明度之光源26。 ίο 15 參照圖7是本發明的光學對位裝置第五實施例之立 體示意圖，為求更精密之對位效果’將上述各實施例之單 點對位改成在電路裝置12與基板1〇上各設置兩處定位兮己 號，分別由兩組攝影機負責校准對位；光學搁取之構件亦 稍做變換，圖中，基板10由承載裝置7承載，電路裝置 η由搞行裝置6吸取’控制裝置3除控制承載裝置7鱼 攜行裝置6相對移動外，更同時控管光學對位裝置匕光 ^對位裝置2,可如圖般配置，光程補償單元22位於電路 2下方，光程補償單元22遠離電路裝置12之另— 側喝角反射件4;上述兩具例如電相合元件攝影機5 置於轉角反射件4之對應兩側，藉光線折射與反射 =原理側之電輕合元件攝影機5可同時感 12兩端與基板Π)兩端之接合記號，可更提升接合精度置 將光學對位裝置進一步整合於系統中，可見如 =明的具有光學對位裝置的系統之第一實施例立體： «動電I:包含:載基板 行裝置6相對移動二置6、驅動承載裝置7與揭 .移動之控制裝置3及光學對位裝置2。 高戶差^位裝置2更包括：受控制裝置3驅動，在留有 像^ =、供同步綠電路裝置12及基板 像操取單元2〇及介於電路裝置】2與光學影： 〇間、用以補償電路裝M 12與基板1〇對應高 20 1376177 光學對位裝置2 度差之光程差的光程補償單元22;告 可視需求配置光源以補充照明程度。 圖9是本發明具有光學對位裝置的系統之第二實施 5 例的立體示意圖，將圖8之系統以另—種組合呈現，基板 可為液晶顯示模組ίο’，電路裝置可為驅動ic 12,，控制 裝置3控管承載裝置7、攜行裝置6與光學對位裝置2，之 對應運作。 I 料對位裝置2’包括光程補償Μ 22、轉角反射件4 與兩侧對應設置之電粞合元件攝影機5;承載裝置？係一 !〇組内部形成有通氣管ϋ 72、且承載液晶顯示模組ι〇，之表 面形成有複數通氣孔74之承載架76。 …攜行裝置6則包括-組可以相對趨近及遠離液晶顯 不杈組ίο’之機械臂62及一組受機械臂62帶動、供吸取 驅動！C12,之吸嘴64;攜行裝置6更包括—組用以將驅動 15 IC I2’加熱壓貼至液晶顯示模組10,之加熱器66。 ► m述各實施例說明，顯見絲補償單元確實有效 解決高度差之問題，也藉此配置單次即可完成確認需接合 的電路裝置與基板位置是否正確；更充分利用光學折射: 理’使光學對位系統各構件之配置更加靈活發揮，因此藉 2〇由本發明確實可以有效達成本案之所有上述目的。9 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修錦，皆 應仍屬本發明專利涵蓋之範圍内。 ^/()177 【圖式簡單說明】 圖1是習知電路裝置 工業攝影機動作示意圖； 與基板接合進行對位時 定焦型 5 圖2是習知電路裝置與基板接 工業攝影機動作示意圖； 合進行對位時，變焦型1376177 IX. Description of the Invention: [Technical Field] The present invention relates to an optical alignment device and a system therefor, and more particularly to an optical alignment device for a circuit device and a substrate, and a device System ό [Prior Art] On the substrate of liquid crystal display glass or printed circuit board, it is necessary to set up • such as integrated circuits, or other circuit components, especially with the complexity of components, the number of pins continues to increase, and the pin density The increase, the efficiency of the bonding process and the precision of the day, the industry has no effort to develop a fully automated machine for the bonding process, in which it is responsible for precision positioning of the circuit device and the substrate to ensure the bonding time. The precision alignment device has become an important factor affecting the performance of the machine. 1 is a schematic view showing the operation of a fixed-focus type 15 industrial camera when a conventional circuit device is engaged with a substrate, and the general industrial camera maintains a precise resolution, and the set camera depth range is thus relatively short, that is, when The optical path slightly exceeds the range, that is, the resolution cannot be clearly discriminated. The upper left side of the figure is the substrate 10, the upper mark X is the preliminary bonding point, and the circuit device 12 on the upper right side is prepared to be bonded to the substrate 1 by the X number X. Before the substrate 1 is bonded to the circuit device 20, it is necessary to maintain one. The height difference is h. In order to determine that the circuit device 12 and the substrate 10 are properly connected, the fixed focus industrial camera 14 needs to sense the position X of the substrate 1 and the circuit device 12, because there is a height difference h between the two, and the two marks are fixed. The distance (optical path) of the focal type industrial camera 14 is not the same, and can only be judged separately. False 5 1376177 When measuring the mark X of the substrate 10 first, after the fixed focus industrial camera: the position of the sensing circuit device focal type industrial camera 14, 'the head-to-head direction changes to the fixed error, the substrate 1 needs to be temporarily In order to avoid the sensing error 5, the private arrow is displaced in the direction of the arrow, and the symbol X of the sensing circuit device 2 is reset after the execution is completed. Second, the length ^ 1 〇 is a transparent broken glass material, the fixed type of work (10): ... penetrates the sensing substrate i. , but the symbol X on the second (10) and the circuit device 12 (four) turtle plate 10 ... retreat and reset process, in addition to the second amount, the addition of the base may occur mechanical error, 0 and into the ιλ - person into the 仃 alignment action, The fixed focus photo machine 14 also needs to be constantly raised and lowered to change the focus position. 2 is a schematic diagram of the operation of the conventional circuit device and the substrate when the alignment is performed. If the sensor is replaced with a zoom type, the internal motion of the zoom type industrial camera 16 can be reduced.砚 Move up and down, but still have the same problem, board 1. And the symbol 乂 on the circuit device 〖2. Therefore, the lake base can provide an optical alignment device that can simultaneously sense the substrate and the circuit device and the system having the device, and simultaneously sense the preliminary joint marks of the two, in addition to greatly shortening the alignment time, Reducing the unnecessary displacement of the sensed object, and directly eliminating the possibility of error, should be the best solution. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an optical pair for bonding a circuit device and a substrate by using an optical principle to compensate for the problem of the difference between the south and the base of the sensing circuit device and the base space 20 1376177. Bit device. The purpose of the present invention is to provide an optical alignment system for bonding a circuit device and a substrate for sensing the position of the circuit device and the substrate in which the optical device is used to compensate for the problem of the difference in the south. 5 Another object of the present invention is to provide a circuit device and a substrate bonding optical which can be used to directly improve the working efficiency of the bonding system and the machine by using only a single image. Alignment system. • The purpose of the 纟 月 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — system. Still another object of the present invention is to provide an optical alignment system for circuit assembly and substrate bonding which is not required to use a zoom type industrial camera, has a compact structure, and is inexpensive to manufacture. Accordingly, the present invention is a light U pre-alignment device for a circuit device and a substrate bonding system for precisely aligning the circuit device to a substrate having a height difference from the circuit device, the bonding system including a set of carrying devices carrying the substrate, a carrying device carrying and moving the circuit device, and a set of control devices for driving the carrying device and the carrying device to move relative to each other, the optical matching device comprising: a group of The control device drives, in the direction of the height difference, an optical image manipulation unit for synchronously operating the optical device of the circuit device and the substrate; and a set between the circuit device and the optical image capturing unit And an optical path compensation unit between the substrate and the optical image reclining unit for compensating for an optical path difference between the circuit device and the substrate. 7 1376177 By the configuration of the optical path compensation unit, on the one hand, the actual height and the optical path difference of the alignment mark of the circuit device and the substrate to the optical image capturing unit are effectively compensated, so that the optical image capturing device can simultaneously acquire two The image and the accuracy of the alignment of the three-dimensional space not only simplify the alignment process, improve the efficiency of the operation, but also reduce the possible errors caused by mechanical operations and improve the yield. In particular, the optical image capturing device can adopt a fixed focus camera. The construction of the system is significantly reduced, the precision is improved, and all aspects of the conventional optical alignment system are completely solved. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. 15 20 is a schematic view of a first preferred embodiment of the application of the present invention, as previously described, wherein a height difference h is left between the substrate 10 and the circuit device 12, and the two are precisely aligned. The optical alignment device 2 of the present invention comprises: an optical image capturing unit 2 driven by the control device 3, synchronously capturing the circuit device I in the direction of the difference, and an optical image of the substrate 10; and a photon device 12 The optical path compensation unit 22 is used to capture the optical path difference of the height difference h between the circuit device 12 and the substrate 10. The optical path capturing unit 2 is the optical path of the two segments. To the optical path between the 12th and the Xth, and the optical image capturing unit 2〇 to the substrate number X, in order to avoid collisions during calibration movement, both: There is a safety height difference required for the movement The optical path capturing unit 20 can be changed. The optical path capturing unit 20 can be changed from the optical image capturing unit 20 to 8 1376177. At the same time, the image is regarded as a plane. The optical path compensation unit 22 can be formed of a material having a certain light transmittance 'and satisfying the required conversion optical path rate, such as quartz or other suitable materials; FIG. 4 is the fifth embodiment of the present invention. Schematic diagram of a preferred embodiment, optical path compensation The unit 22 is interposed between the circuit device 12/substrate 1 and the optical image capturing unit 2, and the light beam from the circuit device 12 and the substrate 10 are separated by two kinds of light-transmitting ridges having different refractive indices from each other. The light beam enters the optical image capturing unit through different refractive indices to complete the optical path compensation. Figure 5 is a second preferred embodiment of the present invention, and the optical path compensation unit 22" is also interposed between the circuit device 12/substrate 1 Between the optical image capturing unit 2 and the optical image capturing unit 2, the knife J is formed by a right-angled square 稜鏡 and a triangular parallelogram ,, and is semi-transparent and semi-transparent at the triangular and quadrangular 稜鏡 interface. . 15 The light from the substrate is first reflected by the upper surface of the quadrilateral 稜鏡, the lower left oblique side of the quadrilateral ,, transversely across the quadrilateral 图 of the figure, and then reflected by the semi-reflective semi-transparent film at the interface. Prism; relatively, the light from the circuit component will pass directly through the triangular prism, the semi-reflective semi-transmissive film, and the quadrilateral and go straight below the pattern, so that the light beam from the substrate and the circuit component passes through the different light of the composite prism. Cheng, from = compensate for the optical path difference on the original structure. 6 is a schematic view of a fourth embodiment of the optical alignment device of the present invention. In practical application, in order to more clearly capture the image of the substrate 1 and the circuit device X, the optical alignment system 2 includes the control device 3 The camera 24 controlled by 1376177 and the optical path compensation unit η providing optical path compensation are further provided with a light source 26 supplemented with illumination. FIG. 7 is a perspective view of a fifth embodiment of the optical alignment device of the present invention. For a more precise alignment effect, the single point alignment of the above embodiments is changed to the circuit device 12 and the substrate 1〇. Two positioning positions are set on the top, and two sets of cameras are responsible for aligning the alignment; the components of the optical shelving are also slightly changed. In the figure, the substrate 10 is carried by the carrying device 7, and the circuit device η is sucked by the driving device 6. In addition to controlling the relative movement of the fish carrying device 6 of the carrying device 7 , the control device 3 controls the optical alignment device and the optical device 2 can be configured as shown in the figure. The optical path compensation unit 22 is located below the circuit 2 . The optical path compensation unit 22 is remote from the other side of the circuit device 12, and the two cameras, such as the electrical matching component camera 5, are placed on opposite sides of the corner reflector 4, and the light is refracted and reflected = the principle side is light. The component camera 5 can simultaneously sense the joint marks of the two ends of the substrate 12 and the substrate Π), and can further improve the bonding precision, and further integrate the optical alignment device into the system, and can be seen as a system with an optical alignment device. the first Example perspective: «electrokinetic I: comprising: a substrate carrying device 6 relative movement of two rows means 6, the carrier drive means 7 and the shutter 3 and the control means for moving the optical alignment apparatus 2. The high-difference device 2 further includes: driven by the control device 3, leaving the image ^ =, the synchronous green circuit device 12 and the substrate image manipulation unit 2 and the circuit device 2 and the optical shadow: The optical path compensation unit 22 is used to compensate the optical path difference between the circuit assembly M 12 and the substrate 1 高 high 20 1376177 optical alignment device by 2 degrees difference; the light source is configured to supplement the illumination level. 9 is a perspective view showing a second embodiment of a system with an optical alignment device according to the present invention. The system of FIG. 8 is presented in another combination. The substrate can be a liquid crystal display module ίο', and the circuit device can be a driving IC. 12, the control device 3 controls the carrying device 7, the carrying device 6 and the optical alignment device 2, corresponding operation. The I material aligning device 2' includes an optical path compensation Μ 22, a corner reflector 4 and an electric splicing component camera 5 corresponding to the two sides; a carrying device? A vent tube 72 is formed inside the 〇 group, and a liquid crystal display module ι is disposed on the surface, and a carrier 76 of a plurality of vent holes 74 is formed on the surface. The carrying device 6 includes a robot arm 62 that can be relatively close to and away from the liquid crystal display group, and a group of mechanical arms 62 that are driven by the driving arm for driving! C12, the nozzle 64; the carrying device 6 further comprises a heater 66 for heating and driving the driver 15 IC I2' to the liquid crystal display module 10. ► The description of each embodiment shows that the silk compensation unit can effectively solve the problem of height difference, and the configuration can confirm the correct position of the circuit device and the substrate to be joined in a single configuration; more fully utilize optical refraction: The configuration of each component of the optical alignment system is more flexible, and therefore all of the above objects of the present invention can be effectively achieved by the present invention. 9 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Jin, should still be within the scope of the invention patent. ^/()177 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of the operation of a conventional camera device industrial camera; a fixed focus type when the substrate is bonded to the alignment; FIG. 2 is a schematic diagram of the operation of the conventional circuit device and the substrate industrial camera; Zoom type when performing alignment
10 圖3，本發明光學對位裝置第—較佳實施例示意圖； 是本發明光學對位裝置第二較佳實施例示意圖； 圖5是本發明光學對位裝置第三較佳實施例示意圖； 圖6是本發明光學對位裝置第四較佳實施例示意圖； 圖7是本發明光學對位裝置第五實施例立體示意圖； 圖8是本發明測試系統第一實施例的立體示意圖；及 圖9是本發明測試系統之第二實施例的立體示意圖。 153 is a schematic view of a preferred embodiment of the optical alignment device of the present invention; FIG. 5 is a schematic view of a third preferred embodiment of the optical alignment device of the present invention; Figure 6 is a perspective view of a fourth embodiment of the optical alignment device of the present invention; Figure 7 is a perspective view of a fifth embodiment of the optical alignment device of the present invention; Figure 8 is a perspective view of the first embodiment of the test system of the present invention; 9 is a perspective schematic view of a second embodiment of the test system of the present invention. 15
12 1376177 【主要元件符號說明】 X...記號 1 0...基板 10’...液晶顯示模組 5 14...定焦型工業攝影機 14’...定焦型工業攝影機位置 16.. .變焦型工業攝影機 2、2’...光學對位裝置 20.. .光學影像擷取單元 10 22、22’、22，，··.光程補償單元 24.. .攝影機 3.. .控制裝置 5.. .電耦合元件攝影機 62.. .機械臂 1 5 6 6…加熱器 7.. .承載裝置 7 4...通氣孔 8.. .接合系統12 1376177 [Description of main component symbols] X...symbol 1 0...substrate 10'...liquid crystal display module 5 14...fixed focus industrial camera 14'...fixed focus industrial camera position 16 .. . Zoom industrial camera 2, 2 '... optical alignment device 20.. Optical image capturing unit 10 22, 22', 22, ..... optical path compensation unit 24.. Camera 3. .. Control device 5. Electric coupling device camera 62.. Robot arm 1 5 6 6... Heater 7. Carrying device 7 4... Vent hole 8.. Engagement system
h...南度差 12…電路裝置 12’…驅動1C 2 6…光源 4.. .轉角反射件 6.. .攜行裝置 64.. .吸嘴 72.. .通氣管道 76.. .承載架 13h...South degree difference 12...Circuit device 12'...Drive 1C 2 6...Light source 4.. Corner reflector 6.. Carrying device 64.. Suction nozzle 72.. Ventilation duct 76.. . Carrier 13