CN1746667A - Substrate inspection method and apparatus - Google Patents

Abstract

The invention provides a substrate checking method and a substrate checking device, completing high-precision setting of the checking area of a checked part to improve checking precision. The invention comprises the following steps: an overall image (103) of the substrate of a checking object is made in advance; correspondence is set up in advance between a checking area (31) and the checked part on the overall image (103); during checking, a camera (3A) is located at a position corresponding to a shooting object area (30) to carry out shooting; when a processing object image (40) is obtained, an area (41) corresponding to the processing object image (40) is extracted from the overall image (103); the amount of deviation (Delta x, Delta y) of the shooting object area (30) relative to the area (41) is calculated; in addition, the set location of the checking area (31) is corrected by means of the amount of deviation (Delta x, Delta y), and a checking area is set on the processing object image (40) according to the corrected coordinates.

Description

Substrate inspecting method and base board checking device

Technical field

The present invention relates to that component-mounted substrate (following singly be called sometimes " substrate ") is taken in a kind of use and the image that obtains comes the method for whether suitable etc. inspection of the having or not of execution unit, position deviation, welding and the base board checking device of implementing this method.

Background technology

The applicant has developed a kind of image with component-mounted substrate and has come the installment state of automatic inspection part and the base board checking device (with reference to patent documentation 1) of welded condition.This base board checking device has: the substrate platform of the substrate of object is checked in supporting; Be used to take the camera of substrate; Be used to make substrate platform and camera along worktable portion (X-axis worktable portion, Y-axis worktable portion) that surface level moves etc.During inspection, make the visual field of above-mentioned camera corresponding with the regulation zone of substrate by the action of controlling each worktable portion, by handling the image that under this state, generates, needed mensuration is checked at the position that is examined in the above-mentioned zone, relatively with the determinating reference value of the measured value that obtains and regulation.

Patent document 1 is a TOHKEMY 2003-222598 communique.

In this testing fixture, before check, make various check data and sign in to processing (teaching) in the storer.In these inspection data, include setting data in the inspection area that each inspection area is set.During inspection, on the image (hereinafter referred to as " process object image ") of the substrate of checking object, set the inspection area, handle respectively, carry out respectively being examined the inspection at position by image to each inspection area based on above-mentioned setting data.

When carrying out above-mentioned inspection, must adjust the position of substrate or camera, so that the position that is examined on the substrate lays respectively at and the matched place of the setting data of inspection area.Generally be the mark of putting on location usefulness in the appropriate location of substrate in the past, and extracted above-mentioned mark from the image of the substrate that is transported into shooting area, the action of each worktable portion of control X, Y is so that this extracting position becomes predetermined normal place.

As disclosing the document of handling identical processing with above-mentioned adjustment, enumerate following patent documentation 2.In this patent documentation 2, put down in writing following content: after the portrait of substrate extracts the figure of two location usefulness, adjust the position of substrate platform, so that it is consistent with the mid point of the line segment of the reference position that connects each figure to connect the mid point of line segment of extracting position of each figure, and make the substrate platform only rotate the degree of each line segment angulation.

Patent documentation 2 is the flat 9-15302 communiques of TOHKEMY.

But, as above-mentioned patent documentation 2 in the method for the drive division of control basal plate platform, can not avoid the influence of the error that the performance of this drive division causes.Particularly because in recent years substrate is constantly developing aspect the miniaturization of parts and the densification, so even the error of the contraposition of substrate is very small, also can have problems in the setting of inspection area, check result also may produce error.In order to reduce error, need to use high performance drive division in addition, cause the increase of cost.

Summary of the invention

The present invention is conceived to the problems referred to above and proposes, its purpose is by adjust the method with respect to the desired location of the inspection area of process object image based on software processes, remove the influence that the actuating quantity error of platform portion of the location usefulness of substrate, camera is brought, carry out the setting of the inspection area that is examined the position with high precision and improve the inspection precision.

Substrate inspecting method of the present invention is to use the image that is obtained by filming apparatus shooting component-mounted substrate, carries out with respect to a plurality of methods that are examined the inspection at position on the aforesaid substrate, it is characterized in that, comprises the step of preparation and the step of inspection.

Because the step of preparing is suitable with so-called " teaching processing ", so comprise the steps A, step B, step C, step D.

In the steps A, obtain the visual field of filming apparatus and the benchmark image of regulation zone on the substrate to obtaining at once.This benchmark image is to be divided into a plurality of zones by the reference substrate that quality is good to take, the synthetic image that obtains by each zone and make substrate all images method and can obtain.Perhaps, also can take and obtain by the assigned position contraposition that makes camera and said reference substrate.In addition, less in the size of substrate, when this substrate all can both enter the visual field of camera, can be benchmark image with all image settings of this substrate.

Among the step B, obtain and make filming apparatus and concern corresponding to the position of the needed filming apparatus of regional contraposition on the substrate of said reference image and substrate.This position relation can be expressed as the position data in the zone (hereinafter referred to as " reference object zone ") on the substrate corresponding with the visual field of filming apparatus.Also have, the ad-hoc location in the above-mentioned reference object zone is represented that as the being seen relative coordinate of the reference point of the regulation from substrate this position data is also passable.At this moment, if make all images of above-mentioned substrate, then as above-mentioned position data, also can be in the hope of relative coordinate with respect to the reference point on all images.In addition, because the size in reference object zone is definite by filming apparatus, so as above-mentioned relative coordinate, as long as the 1 specific point coordinate of obtaining in the reference object zone is just passable.But be not limited in this, for example,, try to achieve above-mentioned relative coordinate respectively, represent that the position in reference object zone and size are also passable at the left upper apex and the summit, bottom right in reference object zone.

Also have also and the position relation of above-mentioned filming apparatus and substrate can be represented as the coordinate of the worktable portion that adjusts these positions.

Among the step C, the inspection area is set at the position that is examined on the said reference image.

This setting is handled and is preferably used the design data (as cad data) of aforesaid substrate to carry out.At this moment, use the position relation that for example in above-mentioned steps B, obtains, design data according to substrate extracts the zone interior data corresponding with benchmark image, according to the position that is examined shown in the data that extracted, can obtain the position and the size of the inspection area that is fit to this part.

But, set to handle to be not limited to this, for example, also can set each inspection area by the said reference image is shown and accept the method for user's setting operation at monitor.

Among the step D, make the position relation of the benchmark image that in steps A, obtains, the filming apparatus that in step B, obtains and substrate and the position relation with respect to benchmark image of the inspection area set is set up corresponding respectively and logined in step C.

For the inspection area of in step C, setting, preferably login the data of the size of expression inspection area on the basis that concerns in position with benchmark image.For example, as the position of inspection area, in the relative coordinate of expression, can represent the width on each limit of inspection area as the size of inspection area with respect to the specific point of the inspection area of the specific point on the benchmark image.Perhaps,, try to achieve relative coordinate respectively, also can by the position and the size of these coordinate representation inspection areas with respect to the specific point on the benchmark image at the left upper apex and the summit, bottom right of inspection area.

In the step of above-mentioned inspection, include each step of following first, second, third, fourth.

In the first step, the position relation according to filming apparatus of logining in above-mentioned steps D and substrate makes above-mentioned filming apparatus carry out shooting with the substrate contraposition of checking object, makes the process object image.The contraposition of this filming apparatus is to move with respect to another by at least one the platform portion that makes filming apparatus and substrate to carry out, if but at this moment produce error at the amount of movement of platform portion, then can not take the zone identical with benchmark image, the process object image may the occurrence positions deviation with respect to benchmark image.

In second step, the process object image that will make in above-mentioned first step contrasts with the benchmark image of logining in above-mentioned steps D, detects the departure with respect to the process object image of benchmark image.This detects in the processing, process object image or benchmark image are scanned with respect to the opposing party, carry out control treatment by each predetermined distance (preferably each pixel), detect the similar degree that becomes between the two images departure when concerning for maximum position based on related operation and deep or light calculus of differences etc.

In addition, may contain bad part on the image of the substrate of inspection object, but the part beyond the bad part is in the state approaching with benchmark image.Therefore, in the above-mentioned control treatment, consider similar degree maximum when benchmark image and process object image are in suitable position and concern, can the high-precision test amount of deviating.

In the third step, inspection area of logining in above-mentioned steps D by detected departure correction in above-mentioned second step and the position of benchmark image relation according to this revised position relation, are set the inspection area on the process object image.

For example, can make expression, set the inspection area on the position of the coordinate after moving with respect to the only mobile above-mentioned departure of the coordinate of the position of the inspection area of benchmark image.

In the 4th step, the view data in the inspection area that use is set in above-mentioned third step is carried out the Flame Image Process of above-mentioned inspection usefulness.This Flame Image Process also can be identical with above-mentioned disclosed processing in the past such as patent documentation 1.Also have,, in the step of above-mentioned preparation, also can login various inspection data by each inspection area for the 4th step.For example can login the parameter of the kind, 2 value threshold values etc. of the program of execution, the reference value of instrumentation data, threshold value that determination processing is used etc.

According to above-mentioned substrate inspecting method, can with respect to the position of the camera of substrate from originally should position deviation what situation, extract by software processes, use this extraction desired location of correction inspection area as a result.Therefore, regardless of the performance of platform portion, can both high-precision setting inspection area, so in the 4th last step, can not hinder and check needed Flame Image Process and carry out.

Below, two modes that relate to the aforesaid substrate inspection method are described.

At first in first mode, comprise in above-mentioned steps A: the reference substrate that quality is good is divided into corresponding to a plurality of zones of the size in the visual field of above-mentioned filming apparatus (reference object zone), presses the steps A 1 of each execution shooting in these zones; Synthesize in steps A 1 each the regional image that generates and generate the steps A 2 of all images of said reference substrate; On this all image, set comprise specified quantity be examined the position and corresponding to the steps A 3 in the zone of the size in the visual field of above-mentioned filming apparatus; Image setting in the zone that will set in steps A 3 is the steps A 4 of said reference image.

In addition, in above-mentioned steps C, comprise: from the substrate design data corresponding with the said reference substrate extract with corresponding regional of the benchmark image of among above-mentioned steps A4, setting in the step C1 of substrate design data; Use the substrate design data of being extracted, determine the step C2 that imposes a condition with respect to the inspection area of said reference image.

In the aforesaid way, in the steps A 1, preferably each reference object zone is set in the mode that only overlaps the width corresponding with the error that produces when the driving of above-mentioned portion.At this moment, in the steps A 2, the above-mentioned intersection of preferably that each is regional image overlaps in order and makes all images.And this overlaps when handling, and uses the figure matching treatment of the image information of intersection, adjusts the corresponding relation of image based on this matching result, thereby can make more suitable all images.

Among the step C1, based on reference point specific on the substrate (for example specifically labelled central point on the substrate), after making the coordinate system of all images of in steps A, making and substrate design data corresponding, based on the position relation with respect to the benchmark image of all images, the substrate design data in zone that can will be corresponding with benchmark image extracts.Among the step C2, from the substrate design data that extracts, will be examined the position and extract, and set with this and be examined the inspection area that the position is fit to, can be with position and big or small imposing a condition that should the zone as the inspection area.The position of inspection area at this moment is preferably as representing with respect to the relative coordinate of the specific point on the benchmark image.This is because in the actual inspection, obtain the image corresponding with benchmark image after, with respect to this image, can former state be suitable for above-mentioned relative coordinate, can simply set the cause of inspection area.

In addition, among the step D of the situation of suitable aforesaid way, also can cut out and login,, also can login all images its replacement from the benchmark image that all images of said reference substrate only will be set steps A 4.

And then in this first mode, in above-mentioned steps A3, on all images of said reference substrate, set and in above-mentioned steps A1, take the regional corresponding zone of use, in above-mentioned steps A4, each the regional image that will set in above-mentioned steps A3 is set at independent benchmark image respectively.So, also take during inspection, substrate can be checked on the whole with the condition identical with the situation that makes all images.

In addition, under the situation of the method for stating on the implementation, also the benchmark image that obtains by each zone can be synthesized all images of substrate and login.

Also have, among the above-mentioned steps A3, also can be according to substrate design data corresponding to the said reference substrate, determine with respect to the imposing a condition of the inspection area that is examined the position of the regulation on the substrate, set and include based on such zone, this inspection area that imposes a condition.At this moment, owing to can take with the condition different with the situation that makes all images, even so when the making of all images, have across be positioned at reference object interregional be examined the position time, also can generate and contain this and be examined all images at position and check, the degree of freedom of inspection improves.In addition, if with the map picture of the distribution that makes the inspection area of expression substrate on all according to the substrate design data, the mode that can carry out inspection is efficiently carried out the allocation process in reference object zone, and then the efficient of Jian Chaing just can improve.

Then, in second mode, in steps A, comprise:, determine the steps A that imposes a condition 1 with respect to the inspection area that is examined the position of the regulation on the substrate according to the design data of aforesaid substrate; With respect to the good reference substrate of quality, so that make above-mentioned filming apparatus contraposition and take, with the image that obtains steps A 2 as benchmark image based on the inspection area of in above-mentioned steps A1, determining that imposes a condition the mode in the visual field of being contained in.In step C, comprise: detect the step C1 that is examined the position on the said reference image; At the step C2 that detects on the said reference image when having set the inspection area with respect to the departure that is examined the position of this inspection area based on imposing a condition of in steps A 1, determining; Step C3 according to the desired location of the above-mentioned inspection area of detected departure correction in step C2.

In the steps A, do not make all images, use the optional position of substrate design data on substrate to determine the reference object zone, make this reference object zone contraposition of filming apparatus and reference substrate, can obtain benchmark image.If but adopt such method, then because the influence of the error of the actuating quantity of platform portion, with respect to the reference object zone, deviation takes place in the visual field of filming apparatus, may not obtain correct benchmark image.But,, can tackle the deviation in the visual field of this filming apparatus by the processing of step C1, C2.

Among the step C1,,, can will be examined the position from benchmark image and extract by methods such as 2 values, edge extractings corresponding to the feature that is examined the position.Perhaps, also can will be examined the position from the substrate design data extracts.Also have, also benchmark image can be shown on monitor, on this expression picture, accept to specify the operation that is examined the position, be examined the position and extract.

Among the step C2, by making the map picture of expression based on the distribution of the inspection area of in steps A 1, determining that imposes a condition, scan this map picture with respect to benchmark image, thus can detect when becoming the position that is fit to benchmark image and concerning (on the benchmark image extracted be examined the position and be included in state in the surveyed area respectively the time) departure.

Even because above-mentioned mode, also can check, so can improve the efficient and the degree of freedom of inspection in the reference object of the set positions arbitrarily zone of substrate.

Base board checking device of the present invention has: the substrate platform, and its substrate that will check object the above-mentioned position state lower support up that is examined; Filming apparatus, it is used for taking the substrate that is being supported on the aforesaid substrate platform from the top; Mobile device, it moves at least one side's along continuous straight runs in above-mentioned filming apparatus and the substrate platform; Storer, its login have on the visual field that makes above-mentioned filming apparatus and the substrate of checking object the regulation zone to the benchmark image that should obtain at once, when obtaining this benchmark image filming apparatus and substrate the position relation and concern with respect to the position of the inspection area of benchmark image; Position regulator, it controls the amount of movement of above-mentioned mobile device, so that the above-mentioned filming apparatus mode identical with the position relation of logining in storer with the position relation of substrate adjusted; The process object video generation device, it generates the process object image at the above-mentioned filming apparatus of adjustment rear drive of above-mentioned position regulator; The departure detection device, it detects the departure with respect to the process object image of benchmark image with above-mentioned process object image and the contrast of said reference image; The zone setting device, the position relation of its inspection area that detected departure correction is logined in above-mentioned storer according to above-mentioned departure detection device and benchmark image, based on this revised position relation, on above-mentioned process object image, set the inspection area; Image processing apparatus, it uses the Flame Image Process of being carried out above-mentioned inspection usefulness by the view data in the inspection area of above-mentioned zone setting device setting.

In above-mentioned, mobile device is equivalent to above-mentioned worktable portion, therefore can be provided with on the both sides of filming apparatus, substrate platform.At this moment, can make the worktable portion of filming apparatus, along with surface level on a side in vertical 2 directions mobile, the worktable portion of substrate platform is moved along other direction.Perhaps, on any one party of filming apparatus and substrate platform, worktable portion is set, makes this worktable portion move also passable along above-mentioned vertical both direction.

Also have, also can rotating mechanism be set in these worktable portions.

In storer, preferably can login the benchmark image that in the step of the preparation of aforesaid substrate inspection method, makes etc.In addition, this storer nonvolatile memory preferably.

Position regulator, process object video generation device, departure pick-up unit, regional setting device, image processing apparatus all are to be made of the computing machine that has program stored therein.The first step that can consider the aforesaid substrate inspection method is to be to be to carry out respectively by image processing apparatus by regional setting device, the 4th step by departure detection device, third step by position regulator and process object video generation device, second step.

The program that constitutes each above-mentioned device can be organized in the computing machine.On the other hand, above-mentioned storer can be provided with or be placed on computing machine in the aforementioned calculation machine.In addition, as follows in this base board checking device, also can set the device that is used to make in the data of storer login.On the other hand, all images that also computing machine at other can be made and the setting image of inspection area etc. are logined in above-mentioned storer.

In the base board checking device of the substrate inspecting method of carrying out above-mentioned first mode, except that above-mentioned formation, also be provided with: imaging control device, it under the state of the good reference substrate of quality at aforesaid substrate platform upper support, control the action of above-mentioned mobile device and filming apparatus, make the said reference substrate to be divided into a plurality of zones of the size corresponding with the visual field of filming apparatus and to take; Image synthesizer, its synthetic each image that obtains by the control of imaging control device, all images of generation said reference substrate; The benchmark image extraction element, it sets the zone that is examined position and the size corresponding with the visual field of above-mentioned filming apparatus that includes specified quantity on above-mentioned all images, the image in this zone is extracted as the said reference image; Condition is determined device, and it determines imposing a condition with respect to the inspection area of said reference image according to the substrate design data in the zone that extracts the said reference image; Entering device, when it logins the said reference image in above-mentioned storer, extract the position relation of reference substrate and filming apparatus when determining the position relation of determined inspection area that imposes a condition of device and benchmark image and obtaining this benchmark image, these positions relations are logined in above-mentioned storer based on above-mentioned condition.

Above-mentioned each device all is that the computing machine by the program that is set with the processing of carrying out this device constitutes.Imaging control device is carried out the steps A 1 of the substrate inspecting method of above-mentioned first mode, image synthesizer execution in step A2.Also have benchmark image extraction element execution in step A3, A4.

Condition is determined device execution above-mentioned steps C1.Entering device is carried out the processing of the position relation of extracting benchmark image and filming apparatus except the processing of carrying out above-mentioned C2, these results are signed in in the storer with benchmark image.

In addition, the position relation between benchmark image and the filming apparatus can and extract as the position relation between the regional and all images of the reference object that the benchmark image extraction element sets.For example, can be as obtaining with respect to the relative coordinate of the specific point in the reference object zone of the specific reference point on all images.

Carry out in the base board checking device of substrate inspecting method of second mode, have: condition is determined device, and it is according to the design data of aforesaid substrate, determines imposing a condition with respect to the inspection area that is examined the position of the regulation on the substrate; The position relation is determined device, and the position relation that it determines above-mentioned filming apparatus and substrate makes and determines that based on above-mentioned condition the inspection area of the determined condition of device is included in the visual field of filming apparatus; Imaging control device, it under the state of the good reference substrate of quality at aforesaid substrate platform upper support, control the action of above-mentioned mobile device and filming apparatus, make aforesaid substrate be under the state that concerns by the determined position of the definite device of relation, above-mentioned position and be taken with respect to filming apparatus; Detection device, when its above-mentioned on the image that the control that detects by above-mentioned imaging control device obtains is examined the position, detect according to determine the determined departure that is examined the position that imposes a condition when on above-mentioned image, setting the inspection area of device by above-mentioned condition with respect to this inspection area; Correcting device, it is according to the desired location by the above-mentioned inspection area of the detected departure correction of above-mentioned detection device; Entering device, its image that will generate by the control of above-mentioned imaging control device is as when benchmark image login is in above-mentioned storer, with above-mentioned position relation determine the determined filming apparatus of device and substrate the position relation and based on by above-mentioned correcting device correction the position of inspection area and benchmark image of desired location concern and login in above-mentioned storer.

Relate to each device of above-mentioned formation, also the computing machine by the program that is set with the processing of carrying out this device constitutes.Above-mentioned condition determines that device carries out the steps A 1 of the substrate inspecting method of above-mentioned second mode.The position relation is determined device and imaging control device execution in step A2.Detection device execution in step C1 and C2, correcting device execution in step C3.

Among the present invention, all image contrasts of process object image and the substrate that makes are in advance extracted the relative position relation between two images, according to the corresponding relation between this extraction result and all images and the inspection area, set the inspection area that the process object image needs.Thereby the deviation of the inspection area that the error of the actuating quantity when elimination moves camera or substrate by platform portion causes with respect to being examined the position, can be set the inspection area with high precision, can improve the precision of checking.

Description of drawings

Fig. 1 is the block diagram of the base board checking device of one embodiment of the invention.

Fig. 2 is the key diagram of the relation of expression benchmark image of substrate and inspection area.

Fig. 3 is the key diagram that all images of expression make the order that the coincidence of the image of usefulness handles.

Fig. 4 is the key diagram of 6 width of cloth images that make in order to make all images of expression.

Fig. 5 is expression makes the process of all images according to the image of Fig. 4 a key diagram.

The key diagram of Fig. 6 all images that to be expression make according to the processing of Fig. 5.

Fig. 7 is the key diagram of processing that expression detects the departure of process object image.

Fig. 8 is the process flow diagram of the step of expression teaching processing.

Fig. 9 is the process flow diagram of the step of expression inspection.

Figure 10 is the key diagram of structure of all images of expression embodiment 2.

Figure 11 is the key diagram of the relation of expression benchmark image and inspection area.

Figure 12 is the key diagram of processing that expression detects the departure of process object image.

Figure 13 is the key diagram of the correcting process of expression inspection area.

Figure 14 is the process flow diagram of step of the inspection of expression embodiment 2.

Figure 15 is the key diagram of structure of all images of expression embodiment 3.

Figure 16 is the key diagram of the relation of expression benchmark image and inspection area.

Figure 17 is the process flow diagram of the step handled of the teaching of expression embodiment 4.

Figure 18 is the key diagram of processing that expression detects the departure of benchmark image.

Embodiment

Fig. 1 represents the structure of the base board checking device of one embodiment of the invention.

This base board checking device is used to handle takes the substrate of checking object and the image that obtains, differentiate the installment state of parts and suitably whether waiting of welding on the aforesaid substrate, constitute by shoot part 3, light-projecting portion 4, control and treatment portion 5, X-axis worktable 6, Y-axis worktable 7 etc.

In addition, the 1T among the figure be the substrate of checking object (hereinafter referred to as " inspection substrate " 1T ").Also have, 1S is the good reference substrate of the installment state of parts, uses during teaching before inspection.

Above-mentioned Y-axis worktable portion 7 has the travelling belt 7A of supporting substrates 1S, 1T, by this travelling belt of motor running not shown in the figures 7A, aforesaid substrate 1S, 1T is moved along Y direction (direction vertical with the paper of figure).Above-mentioned X-axis worktable portion 6 is above Y-axis worktable portion 7, and supporting shoot part 3 and light-projecting portion 4 make these parts move to X-direction (left and right directions of figure) simultaneously.

Above-mentioned light-projecting portion 4 is made of 3 with different-diameter circular light sources 8,9,10.These light sources 8,9,10 send redness, green, blue each coloured light respectively, so by the center is overlapped with position directly over the observation position, from aforesaid substrate 1S, 1T, be provided with to be positioned at the mode of the corresponding direction in the different elevations angle.

Above-mentioned shoot part 3 includes the CCD camera 3A (hereinafter referred to as " camera 3A ") that coloured image generates usefulness, so its optical axis is to be positioned corresponding to the center of each light source 8,9,10 and along the mode of vertical direction.Thus, be injected into shoot part 3, be converted to trichromatic chrominance signal R, G, B, and be input to control and treatment portion 5 from reflected light as substrate 1S, the 1T of object of observation.

Control and treatment portion 5 includes: as the computing machine that contains CPU of control part 11; As the image input section 12 of its formation, storer 13, take controller 14, image processing part 15, lighting control section 16, XY worktable controller 17, inspection portion 18, teaching table (テ イ one チ Application グ テ one Block Le) 19, Data Management Department 20, input part 21, CRT display part 22, printer 23, send acceptance division 24, external memory devices 25 etc.

Image input part 12 has the amplifying circuit that will amplify from each picture signal of R, the G of shoot part 3, B and is used for these picture signals are converted to the A/D change-over circuit etc. of digital signal.Except the digital shading image data of R, G, B, accommodate the 2 value view data handling these shading images and obtain and form and aspect data etc. in the storer 13.

Take controller 14 and have the interface etc. that shoot part 3 is connected in control part 11, based on from the above-mentioned shoot part 3 of the command driven of control part 11, perhaps adjust the control of the output level etc. of each coloured light.Lighting control section 16 is used to regulate the light quantity of each light source of light-projecting portion 4.In addition, among this embodiment, adjust the light quantity of each light source 8,9,10, so that implement white illumination by mixing each coloured light of red, green, blue.

XY worktable controller 17 includes the interface etc. that above-mentioned X-axis worktable portion 6 and Y-axis worktable portion 7 is connected in control part 11, based on order from control part 11, and the shift action of control X-axis worktable portion 6 and Y-axis worktable portion 7.

Teaching table 19 is the storage part that is used for the inspection data of memory substrate, be arranged in the nonvolatile memory of hard disk unit etc., this is checked in the data, except the setting data in benchmark image, inspection area and the process object zone of substrate described later, also include the kind of the program of carrying out in each inspection area, with performed Flame Image Process corresponding parameters (for example the threshold value of usefulness, the filtrator (Off イ Le ) that edge extraction uses etc. are handled in 2 values), be used to judge the whether suitable determinating reference value of the characteristic quantity that is extracted etc.

Above-mentioned inspection data are before inspection, use to take said reference image 1S and the inspection data of the image that obtains and the benchmark logined in advance and by teaching.These check that data are concentrated as judging file by the kind of each substrate.Above-mentioned Data Management Department 20 is that storage is set up the storer of corresponding link information with the kind of substrate with judging file.Control part 11, accept to be examined the input of substrate name of the substrate 1T of portion after, based on the link information of Data Management Department 20, read the judgement file corresponding and deposit in the storer 13 with this inspection substrate 1T.Image processing part 15 and inspection portion 18 handle based on the fox message in this judgement file of reading.

Image processing part 15 will be handled by each inspection area by R, the G of storer 13 storages, the coloured image that each tone of B produces when checking, instrumentation is examined area, the centre of gravity place at position, the figure of color etc. and checks needed characteristic quantity.Inspection portion 18 by the characteristic quantity that will extract by image processing part 15 and said reference data relatively, thereby differentiation respectively is examined the suitability at position.

Control part 11, the result of various juggling in the Integrated Checkout portion 18 judges whether inspection substrate 1T is non-defective unit.This final decision result outputs to CRT display part 22 and printer 23 or sends acceptance division 24.

Above-mentioned input part 21 is used for various conditions that input checking uses and input of fox message etc., is made of keyboard and mouse etc.CRT display part 22 (being designated hereinafter simply as " display part 22 ") is accepted the supply of view data, check result etc. from control part 11.It is presented in the display frame.Also have, printer 23 is from be checked result's etc. supply of control part 11, with it with predetermined form printout.

Send that acceptance division 24 is used for and other devices between carry out the exchange of data, for example for being judged as bad inspection substrate 1T,, can revise defective work apace by its identifying information and bad content being sent to the correcting device of after-stage.External memory devices 25 is to be used for the device that reads and writes data on storage mediums such as floppy disk, CD-R, photomagneto disk, is used to preserve above-mentioned check result, perhaps is taken into from the outside to check needed program and setting data.Also have, send when setting inspection area and reference object zone in acceptance division 24 and the teaching of external memory devices 25 before inspection, also use sometimes with the purposes of the cad data that is taken into substrate.

In addition, in the said structure, image processing part 15 and inspection portion 18 are made of the processor that enrolls the special use that is used to carry out above-mentioned each program of handling.But, not necessarily need to be provided with special-purpose processor, also can give control part 11 with the function endowing of image processing part 15 and inspection portion 18.

In the base board checking device of this embodiment, make impose a condition (position of inspection area and the size) of above-mentioned inspection area with cad data.Use Fig. 2 that the principle that the setting of inspection area relates to is described below.

100 of Fig. 2 will take said reference substrate 1S and the benchmark image signalization that obtains.This benchmark image 100 expression substrate 1S's is all.

The 101st, the distribution image conversion of the inspection area on the benchmark image 100 102 is represented.Below, this image 101 is called " the map picture of inspection area " or abbreviates " map picture " as.Each inspection area 102 on this map picture is to set with size corresponding to the position that is examined the position that the cad data of substrate is represented.

That is, map similarly is the position of the inspection area on the expression substrate and the information of size, just represents the information that imposes a condition of inspection area.In addition, in fact this impose a condition by the coordinate (x for example described later of the position of expression inspection area _n, y _n) and represent that the numerical value of the width of inspection area constitutes.But among Fig. 2 and later each embodiment, describe, imposing a condition of inspection area looked like to show as map in order to understand easily.

This embodiment is in upper left bight and bight, bottom right as substrate 1S, the 1T of process object, and the substrate when being transported in order to make coincides with the reference position and sets telltale mark.The data that in cad data, also contain expression above-mentioned specifically labelled position etc.Among Fig. 2, the telltale mark on the benchmark image 100 as 105,106, is illustrated map respectively as 105a, 106a as the telltale mark on 101.

In the example of Fig. 2, the mode that overlaps with telltale mark 105,106 on the benchmark image 100 respectively as telltale mark 105a, 106a on 101 with map, after making benchmark image 100 and map as 101 contrapositions, with map as the position of the inspection area 102 on 101 and size as the setting data of inspection area 102 and specific.Like this, coordinate system by making benchmark image 100 and map be as 101 coordinate system contraposition, for being examined the position arbitrarily on the said reference image, the inspection area 102 of containing the size that is examined the position can be set in position.

In addition, among Fig. 2, the part that will contain article body portion and electrode part is examined the position as one and sets inspection area 102, but be not limited only to this, as described later, also can set inspection area 102 with article body, electrode, welding position (fillet weld) etc. respectively as the independent position that is examined.

Therefore, if will login in above-mentioned teaching table 19 with respect to the desired location and the size of the inspection area 102 of this benchmark image 100, then for the image of inspection substrate 1T, also can be with the above-mentioned telltale mark on this image as benchmark, with the condition enactment inspection area 102 identical with respect to the condition of reference substrate 1S.Also have, if with the position of inspection area 102 as logining with respect to the relative coordinate of above-mentioned telltale mark 105, even then the image of inspection substrate 1T is with respect to benchmark image 100 occurrence positions deviations, based on the telltale mark on this image 105, also can will set in position with respect to the inspection area that respectively is examined the position.

But big according to the visual field of camera 3A at substrate 1S, 1T, in the time of must being divided into a plurality of reference objects zone and taking, by each reference object zone login benchmark image, imposing a condition of inspection area also needs to determine by each benchmark image.

Under such situation, in order to generate the benchmark image in each reference object zone, need at first at containing specifically labelled reference object zone (for example zone in bight, bottom right), so that the telltale mark 105 on the image be positioned at the mode of predetermined reference coordinate adjust camera 3A and substrate position relation and after taking, for other reference object zone, according to respect to relative coordinate (can obtain as 101) the control X-axis worktable portion 6 in specifically labelled this reference object zone on the substrate and the amount of movement of Y-axis worktable portion 7, make the visual field and each the reference object area coincidence of camera 3A from the map of aforesaid substrate image.

Also have, in the processing that imposes a condition that is used for determining the inspection area, according to relative coordinate with respect to above-mentioned specifically labelled reference object zone, the map all from aforesaid substrate extracts as 101 images with this reference object zone, makes the processing of this map picture that extracts and said reference picture registration.

In addition, use " coincidence " such performance for convenience's sake in above-mentioned, but be actually positional information of carrying out the inspection area that to obtain from cad data and the processing that size information is transformed to the coordinate system of benchmark image side.

But, because how many actuating quantities of each worktable portion 6,7 contains some errors, so the visual field of the camera 3A during actual photographed has position deviation with respect to the reference object zone.Therefore, even from map as 101 images that extract correctly corresponding to the reference object zone, also become benchmark image with respect to the reference object zone and even the state of position deviation with both contrapositions, also may not be set to the tram with inspection area 102.

Among 4 embodiment as follows, the substrate of needs being set a plurality of reference objects zone is as checking object, will be by the regional situation that generates benchmark images of these each reference objects as prerequisite, the high-precision position of determining with respect to the inspection area of this benchmark image of energy.

Further, because the deviation in the visual field of above-mentioned camera 3A also produces when checking, so in each embodiment, by contrasting by process object image and the said reference image that camera 3A generates, detect departure, with the setting data of this departure correction inspection area with respect to the visual field of the camera 3A in above-mentioned reference object zone.And, use this revised setting data to carry out the setting of the inspection area of above-mentioned process object image is handled.

＜embodiment 1 〉

Among this embodiment, said reference substrate 1S is divided into a plurality of zones and after taking, the image that each is regional links together, makes all images of reference substrate 1S and login.Also have, between adjacent areas, the error that produces corresponding to the amount of movement of X-axis worktable portion 6 and Y-axis worktable portion 7 (below be referred to as " machine error ") is set the coincidence of determined pixel quantity.For these images, carry out the figure matching treatment of the image information of using intersection respectively, afterwards the pixel of correspondence is overlapped each other by the corresponding relation of adjusting pixel according to this matching result, thereby make suitable all images.

The example that the coincidence of Fig. 3 presentation video is handled, the order of connection is by the numeral of band circle.In the example of Fig. 3, with the image of central portion image, towards clockwise direction coincidence pattern picture in order as the 1st.Also have, in each pixel of intersection, set the concentration mean value of each pixel before overlapping.

The object lesson that makes processing of all images of Fig. 4-6 expression.In addition, in these figure, be the state easy to understand of the image that makes substrate, the distribution pattern of the parts on the substrate be replaced into " ABC " such literal represent.Also have, be arranged on the upper left bight of substrate and bight, bottom right+word mark the 105, the 106th, be used for the telltale mark that the substrate when sending into overlaps with the position of benchmark.

Fig. 4 is each image when being divided into 6 reference objects zones and taking of the substrate with process object (among the figure with g1-g6 symbolic representation).To be expression be set at the 1st and begun the state that makes of all images with the image g2 of the hypomere central portion in these images to Fig. 5.In addition, when the coincidence of Fig. 3 is applicable to making of this all image in proper order, carries out the coincidence of image by the order of g2, g5, g6, g3, g1, g4 and handle.Handle all images 103 that make as shown in Figure 6 by this coincidence.

Among this embodiment, on above-mentioned all images 103, use and set the inspection area,, on substrate, set a plurality of reference objects zone according to the distribution of these inspection areas in above-mentioned method shown in Figure 2.Therefore, can consider that above-mentioned all images 103 contain the benchmark image in these a plurality of reference objects zones, also have, set the image g1-g6 of intersection, can obtain the suitable all images 103 that link together of intersection according to the machine error of considering X, Y worktable portion 6,7.Therefore, for reference object zone arbitrarily, if image that will the reference object zone on above-mentioned all images 103 cuts and extracts, with it as benchmark image, can with the visual field of camera 3A correctly to being positioned at the identical image of image that this reference object obtains when regional as benchmark image.

On the other hand, during inspection because the machine error of X, Y worktable portion 6,7, become can not make camera 3A the visual field correctly to the state in the reference object zone that is positioned at above-mentioned setting.With respect to the departure in the visual field of the camera 3A in this reference object zone, can be used as with respect to the departure of the process object image in the reference object zone on above-mentioned all images 103 and detect.

Fig. 7 illustrates the roughly situation that above-mentioned departure detects processing.Among the figure 31 is inspection areas of setting according to all images 103, the 30th, and the reference object zone on all images 103.Image in this reference object zone 31 has the function of the benchmark image that is used to check.In addition in this embodiment, only set 1 inspection area 30, but in fact, included a plurality of inspection areas in 1 reference object zone 30.

Among the figure 40 is the process object images that generate by to the camera 3A that is positioned at the reference object zone on the actual substrate.Also have, the 41st, on all images 103, obtain the zone (hereinafter referred to as " corresponding region 41 ") of the image corresponding with above-mentioned process object image 40.When the correct contraposition in the visual field of camera 3A, this corresponding region 41 should be consistent with above-mentioned reference object zone 30, but in should example, reason makes the visual field of camera 3A not have correct contraposition in the machine error of above-mentioned X-axis worktable portion 6, Y-axis worktable portion 7, so, produce the departure of Δ x, Δ y with respect to reference object zone 30.

The position in inspection area 31 and reference object zone 30 is as the coordinate of the coordinate system identical with all images 103 of aforesaid substrate and login.Position that each zone in this coordinate system is 30,31 is closed and is tied up to former state where applicable in the process object image 40, and inspection area 31 becomes from the state of the position deviation that should set originally (inspection area of the state that the zone of representing with dot-and-dash line on process object image 40 311 is offsets).

In the present embodiment, after will extracting with respect to the corresponding region 41 of above-mentioned process object image 40 by figure matching treatment (be also referred to as relevant matches handle), on all images 103, calculate departure Δ x, Δ y with respect to the zone 41 in above-mentioned reference object zone 30 by each telegoniometer of horizontal direction, vertical direction.And, in the present embodiment, according to the desired location (zone that dots 312 on the process object image 40 is revised inspection area) of the inspection area 31 of above-mentioned departure Δ x, Δ y correcting process object images 40.Thereby, by this correction,, on the position identical, set inspection area 31 with the position in the benchmark image 103 for being examined position (being " B " in this example), can obtain correct check result.

In the testing fixture in the past, the departure of the substrate that the image of the telltale mark 105,106 from the image of substrate extracts when checking beginning only, carry out the contraposition in the visual field and the reference object zone of camera 3A by above-mentioned method, therefore, in process object image 40, to position deviation inspection area 311 in images handle.Also have, if the machine error of X-axis worktable portion 6, Y-axis worktable portion 7 can diminish, then the precision of the desired location of inspection area 311 can improve.But for machine error is diminished, need cause cost to increase at X-axis worktable portion 6, the Y-axis worktable portion 7 high performance drive division of packing into.

With respect to this, in the example of above-mentioned Fig. 7, to extract with respect to departure Δ x, the Δ y of the process object image 40 in the reference object zone 30 on all images 103, use these departure Δs x, Δ y to revise the desired location of inspection area 31, so can in the scope of the error of 1 pixel degree, set the inspection area.Thereby no matter the performance of the drive division of X-axis worktable portion 6 and Y-axis worktable portion 7 is how, can both high-precision setting inspection area, and do not hinder the Flame Image Process that inspection needs and carry out.

In addition, the reference substrate 1S that using character is good generates all images 103, with respect to this, in the process object image 40 that obtains, may include bad part taking the substrate 1T that checks object.But, even consider for example bad part, for the part outside this, also can obtain the image of the state identical with the counterpart of all images 103, if so the ratio of shared bad part is little in process object image 40, then in corresponding to the zone of process object image 40 than other zones, correlation uprises.Thereby, by extracting as above-mentioned corresponding region 41 in the highest zone with the correlation of process object image 40, can try to achieve departure Δ x, Δ y based on the figure matching treatment.

Fig. 8 is illustrated among the embodiment 1 order that the teaching carried out is handled, and Fig. 9 represents the order checked.Below, along the flow process of each figure, express religion and handle and check the roughly situation of handling.In addition, in Fig. 8, Fig. 9 and the following description, " ST " is the abbreviation of " step ".

At first, the teaching of Fig. 8 processing begins corresponding to the operation of the substrate name of importing the login object and substrate size etc.In initial ST1, reference substrate 1S is transported into above-mentioned Y-axis worktable portion 7.In the ST2 that follows, according to the substrate size of above-mentioned input, determine that all images make the quantity and the position in the reference object zone of usefulness, make camera 3A be positioned wherein the photographic images zone that includes above-mentioned telltale mark 105 or 106.

Among the ST3, drive the above-mentioned camera 3A that has located and take.Taking the image that produces by this temporarily preserves in storer 13 by above-mentioned image input part 12.

Among the ST4, show the image of above-mentioned temporary transient preservation, make the user specify the position of above-mentioned telltale mark 105 or 106 at display part 22, with this specified coordinate specific be the coordinate of reference point.In addition, also can extract the telltale mark 105 or 106 on the image by figure coupling etc. automatically, coordinate that will this extracting position of expression is as reference point.

The processing one of ST4 finishes, and just enters into ST5, and driving X-axis worktable portion 6, Y-axis worktable portion 7 make above-mentioned camera 3A to being positioned at next reference object zone.In the ST6 that follows, drive camera 3A, the image that generates is temporary in the storer 13.

Below also identical, in the position of change with respect to the camera 3A of reference substrate 1S, the processing of taking repeatedly.When all image of obtaining that making of all images need, enter ST8 from ST7.Among this ST8, according to above-mentioned method shown in Figure 3, each image that will temporarily preserve in above-mentioned storer 13 overlaps in order, makes all images 103.

In the ST9 that follows, by according to making the method for the map picture of inspection area corresponding to the cad data of said reference substrate 1S, the inspection area is set in respectively being examined on above-mentioned all images 103 on the position.In addition, this map similarly is to being positioned at all images 103, with the position and the big or small setting data that is set at the inspection area of the inspection area on the map picture after the contraposition by above-mentioned telltale mark 105,106.

And, in the ST10 that follows, on the map picture of above-mentioned inspection area scanning corresponding to the window of the size in the visual field of camera 3A, the desired location in the reference object zone during specific inspection.

Among the ST11, by each parts on above-mentioned all images, as other inspection data, make with respect to the inspection at each position in the inspection area with the parameter of the kind of the desired location of window, performed program, 2 value threshold values etc., be used to differentiate the data of whether suitable reference value of the characteristic quantity that extracted etc.In addition, in these check data, the inspection data (routine library data) of the with good grounds standard of logining by each variety of components in advance and data that make and the data of using all images to make.

Among the ST12, make the coordinate of reference point specific in above-mentioned ST4, all images that make in above-mentioned ST8 and the various inspection data that make in ST9-11 and substrate name are set up corresponding judgement file, login in above-mentioned teaching table 19.Then, transport reference substrate 1T at ST13, processing finishes.

The checks sequence of Fig. 9 is, after the teaching of having carried out above-mentioned Fig. 8 is handled, corresponding to the substrate name of inspection substrate 1T with check the input of initiation command etc. and begin.Among the ST21 as initial step, read the judgement file of corresponding substrate, deposit in the storer 13 from above-mentioned teaching table 19.

When in ST22, in Y-axis worktable portion 7, being transported into inspection substrate 1T, in ST23, at first use above-mentioned telltale mark, revise initial position with respect to the camera 3A of inspection substrate 1T.In this correcting process, the visual field that makes camera 3A is taken with comprising corresponding to the area coincidence of the telltale mark 105 of said reference point or 106, extract the telltale mark on the image that is generated, try to achieve the corresponding specifically labelled position deviation amount of reference point with login in above-mentioned teaching is handled.And, this position deviation amount is scaled the amount of movement of X-axis worktable portion 6 and Y-axis worktable portion 7, move each worktable portion 6,7 according to the amount of movement after this conversion, adjust the position relation of camera 3A and substrate 1T.In addition, same in other embodiment of aftermentioned, use and the position of above-mentioned identical order adjustment camera 3A.

When above-mentioned position correction processing finishes, below, pay close attention to the reference object zone of being logined in order, carry out ST24-31 by each reference object zone.

At first, among the ST24, drive X-axis worktable portion 6 and Y-axis worktable portion 7, make camera 3A being arranged in the reference object zone of concern.Then in ST25, carry out the shooting of above-mentioned camera 3A and make the process object image.Among the ST26, on above-mentioned all images, the zone that will contain the prescribed level of reference object zone in the concern and image on every side thereof is set at the sweep object of above-mentioned process object image.In the ST27 that follows, press picture element scan process object image one by one in this sweep object zone, carry out relevant matches at each scanning position and handle, extract corresponding region towards the process object image.Further follow in ST28,, calculate departure Δ x, Δ y with respect to the reference object zone in the above-mentioned concern for the corresponding region that in ST27, extracts.

Among the ST29, will read and be stored in the desired location of the inspection area in the storer 13, revise by above-mentioned departure Δ x, Δ y from above-mentioned teaching table 19.In addition, in this correcting process, at first, the coordinate (based on the coordinate system of above-mentioned all images) of the desired location of the inspection area logined (for example is replaced into the relative coordinate corresponding with the above-mentioned reference object zone of having logined, the coordinate of seeing by the summit, bottom right in reference object zone) after, the coordinate after this conversion is revised by above-mentioned departure Δ x, Δ y.

Revise the laggard ST30 of arriving, relate to a series of processing of inspection.

Among this ST30,, on above-mentioned process object image, set the inspection area according to the desired location of revising at above-mentioned ST29.And, by each inspection area, use the inspection data of reading from above-mentioned teaching table 19, carry out handling and good not determination processing with respect to the instrumentation that is examined the position.In addition, the good not result of determination of each inspection area accumulates in the storer 13.

When the inspection of ST30 finishes, return ST24 by ST31, carry out processing same as described above for next reference object zone.

When at all reference object zones, carry out above-mentioned ST24-30 after, ST31 is a "Yes", enters into ST32.Among this ST32, the good not result of determination that lodges in each inspection area in the above-mentioned storer 13 is combined, differentiate whether inspection substrate 1T is non-defective unit, export this differentiation result.

Then, in ST33, transport above-mentioned inspection substrate 1T, finish inspection this substrate.Also have, under the situation that the substrate of checking object is arranged, return ST22, below next inspection substrate 1T is carried out same processing by ST34.

＜embodiment 2 〉

Among this embodiment each embodiment below 2, with the welding portion (fillet weld) of inspection part as prerequisite, the method for detecting of the departure between the establishing method of more specific description reference object zone, inspection area, process object image and the reference object zone etc.

According to the structure of above-mentioned Fig. 1, owing to just penetrate, reflect on the surface of fillet weld from the colorama of each light source 8,9,10 of light-projecting portion 4, so corresponding to the heeling condition of fillet weld, the image that the color that can obtain red, green, blue distributes with the ratio of regulation.In the inspection of fillet weld,, compare its position, area, thereby differentiate the good of heeling condition with the determinating reference value by extracting these colors respectively.

Figure 10 is all images of expression substrate.All images 103 of this embodiment are also the same with above-mentioned Fig. 4,5 example, have 3 on transverse direction (x direction), have 2 on the longitudinal direction (y direction), will amount to 6 picture registrations and constitute.In addition, among this embodiment, simple in order to make explanation, the intersection between image is omitted expression.

Among this embodiment 2, when checking, also take and make the reference object zone of above-mentioned all images 103 the same terms.Therefore, among this embodiment 2, press and each corresponding all image 103 of each regional r cutting in reference object zone, the image G0-G5 of each regional r is logined as benchmark image respectively.Also have, the data of the X-axis worktable portion 6 that the visual field of camera 3A and the regional contraposition of each reference object is used as expression and the amount of movement of Y-axis worktable portion 7 are with the size x in length and breadth of above-mentioned zone r _p, y _pLogin.

Also having, after making all images 103, is the machine error that produces when eliminating the shooting of the generation usefulness of carrying out benchmark image with each benchmark image G0-G5 cutting.

Among Figure 10, constitute among the image G0-G5 of all images 103, have only two parts 50 shown in the image G4 of epimere central authorities.These parts 50 are chip parts that both sides have electrode part, the above-mentioned fillet weld of 51 expressions, and 52 expressions are with respect to the inspection area of this fillet weld 51.

Among this embodiment,, login the coordinate on the summit, bottom right of this inspection area 52 as the desired location of inspection area 52.This coordinate representation is to contain the relative coordinate (x of the summit, bottom right of the image of above-mentioned inspection area 52 as benchmark _p, y _p).In addition, though do not illustrate,, login the depth of above-mentioned inspection area 52 and the length of banner as the data of the size of representing each inspection area 52 at Figure 10.

Figure 11 represents to use the object lesson of processing of the desired location of the specific inspection area 52 of above-mentioned image G4.

During this is handled, from the cad data of aforesaid substrate will be corresponding with each benchmark image the zone in data extract go out, the data of specific expression fillet weld 51 from the data that extracted are determined imposing a condition of inspection area corresponding to this position and size that is examined the position.

In Figure 11, represent that the benchmark image G4 of epimere central portion of above-mentioned all images 103 and the map of distribution of inspection area of representing this benchmark image G4 are as M4.Identical with above-mentioned example shown in Figure 2, by making map as M4 and benchmark image G4 contraposition, make map be applicable to benchmark image G4, can on each fillet weld 51 on the said reference image G4, set suitable inspection area 52 respectively as the position and the size of the inspection area on the M4 52.

In addition, among this embodiment, in order to make the map picture corresponding, the center point P of the telltale mark 105 in the bight, bottom right of substrate as reference point, by this reference point P, is made the coordinate system contraposition of all images 103 and cad data with each benchmark image G0-G5.Cad data also contains specifically labelled data, also has, because the precision height of the specifically labelled formation position on the actual substrate, therefore according to a telltale mark 105 special datum point P.

The position of the each point on above-mentioned all images 103 can be expressed as the relative coordinate with respect to reference point P.For example, as shown in figure 10, for the image G0 that contains reference point P and the image G1 that is adjacent, the boundary line of G5, when the distance apart from reference point respectively is x ₀, y ₀The time, the coordinate on the summit, bottom right of the inspection area 51 on the said reference image G4 can be expressed as (x ₀+ x _n, y ₀+ y _n).

Among this embodiment 2, during inspection, identical when making above-mentioned all image 103, with camera 3A and reference object zone contraposition, generate the process object image corresponding with each benchmark image G0-G5, but because machine error, the visual field of camera 3A can not with to being positioned at correct reference object zone, the possibility of generation position deviation is arranged between the benchmark image of being logined and the process object image.Thereby, among this embodiment 2 also with the same position deviation of extracting the process object image of embodiment 1, revise the inspection area.

Figure 12 represents the process object image corresponding with said reference image G4.This process object image 54 has position deviation with respect to benchmark image G4.Also have, produce bad in four (being 51K in the figure) that are examined in the position 51 on the process object image 54.

Among this embodiment, with respect to process object image 54, with benchmark image G4 when pixel scans one by one, calculate correlation at the intersection between two images, position deviation amount Δ x, Δ y between two images with correlation when the highest are judged as the departure with respect to the process object image 54 of said reference image G4.This is because shown in the example of Figure 12, even the part of process object image 54 exists under the condition of poor, the part beyond this bad part 51K is also identical with benchmark image G4, so benchmark image G4 is when moving to optimal position, the correlation maximum.

Figure 13 represents at above-mentioned process object image 54, will be with the position of the inspection area 52 (representing) of the condition enactment identical with said reference image G4 with dot-and-dash line, and the example of revising according to above-mentioned departure Δ x, Δ y.By such processing, also can set suitable inspection area at fillet weld 51,51K arbitrarily, can guarantee to check precision.

Among this embodiment 2, also can replace all images, each image G0-G5 is logined as benchmark image, except this point, can carry out teaching with the order identical and handle with above-mentioned Fig. 8.

Thereby, for the flow process that teaching is handled, omit diagram and detailed explanation, the processing when inspection being described with Figure 14.

In Figure 14, in ST41, read the inspection data of corresponding substrate and be stored in the storer 13 from above-mentioned teaching table 19 as initial step.Then in ST42, when being transported into inspection substrate 1T, in ST43, make camera 3A and reference object zone (the reference object zone corresponding) contraposition that comprises corresponding to the telltale mark 105 of said reference point P with benchmark image G0.

In the ST44 that follows, to take by above-mentioned camera 3A, the central point with telltale mark 105 on the image that is generated extracts, and asks for the position deviation amount with respect to the said reference point P of this extracting position.And, by move x axle worktable portion 6 and Y-axis worktable portion 7 corresponding to this position deviation amount, adjust the position of above-mentioned camera 3A.But also can produce machine error during this adjustment, the visual field of camera 3A is with respect to the regional possible occurrence positions deviation of reference object.Therefore, among this embodiment, in the ST45 that follows, adjusted camera 3A takes once more by above-mentioned position, generate after the process object image corresponding with benchmark image G0, by carrying out the processing of ST46, ST47, on the object handles image, be not subjected to the influence of the deviation that above-mentioned machine error brings and set the inspection area.

Among the ST46, between process object image that is generated and benchmark image G0, carry out relevant matches and handle, detect departure Δ x, Δ y.This processing is used Figure 12 and identical as detecting situation about illustrating with respect to the method for the departure of the process object image 54 of benchmark image G4 with previous.

Also have, in ST47, revise with these departure Δs x, Δ y after the desired location of inspection area, in ST48, use the inspection of the view data of revised inspection area.

Enter ST50 from ST49 then, make the zone contraposition of camera 3A and next reference object.For example, make under camera 3A and the situation, above-mentioned X-axis worktable portion 6 is only moved and above-mentioned x corresponding to the zone contraposition of the reference object of benchmark image G1 _pCorresponding amount.Also have, make camera 3A with the time, above-mentioned Y-axis worktable portion 7 is only moved and above-mentioned y corresponding to the reference object zone contraposition of benchmark image G5 _pCorresponding amount.Then, return ST45, take by camera 3A in the place of new location.Also have, with respect to the image that is generated, with above-mentioned same execution ST46-48.

Below, also obtain the image corresponding in order with each benchmark image, with order same as described above, carry out the correction of the detecting of the departure of benchmark image, inspection area and check.When finishing for all reference object zone processing, just enter ST51 outgoing inspection result from ST49, transport inspection substrate 1T at ST52.Also have,, then turn back to ST42, carry out same order from ST53 if other inspection substrate is arranged.

＜embodiment 3 〉

In the foregoing description 2, the position that is examined on the substrate is contained in the image arbitrarily that constitutes all images as prerequisite, but as shown in figure 15, the parts 56 (parts shown in the figure are QFP) of checking object is also arranged across situation about being positioned between image.Under these circumstances, similarly to Example 1, the reference object zone is set in the optional position that is preferably on all images 103.

Among the embodiment 3, make after all images 103 of reference substrate 1S, set reference object zone 57, make and on this image 103, comprise all of parts 56, login this desired location, cut the image in the reference object zone 57 simultaneously, login as benchmark image.

In addition, the setting in reference object zone 57 can use the map of aforesaid substrate to look like to carry out, but is not limited to this, for example above-mentioned all images 103 is shown at display part 22, also can set by the setting operation of accepting the user in this display frame.

Also have, undoubtedly, this reference object zone 57 also is that banner is x _p, depth is y _p

Figure 16 represent benchmark image G11 that the process object zone 57 from above-mentioned all images 103 cuts out and in the map of the inspection area that this benchmark image G11 distributes as M11.Also have, 59 expressions are with respect to the fillet weld of a lead of above-mentioned parts among the figure, and 58 expressions are with respect to the inspection area of this fillet weld.

The map of this embodiment is identical as the M11 also situation with embodiment 2, on the coordinate system that makes all images 103 and basis that the coordinate system of cad data overlaps, makes by the data of extracting the zone corresponding with said reference image G11 from cad data.Also have, map is also identical with embodiment 2 as the desired location of each inspection area 58 on the M11, is from the being seen relative coordinate (x in the summit, bottom right of image with the bottom right vertex representation of this inspection area 58 _n, y _n).

The desired location in the reference object zone 57 on above-mentioned all images 103 is summits, bottom right that this is regional as from the being seen relative coordinate (x of said reference point P _T, y _T) (with reference to Figure 15) of setting.

During corresponding regional of specific with above-mentioned benchmark image G11, need only according to reference point P on cad data in order to determine imposing a condition of inspection area, after making all images and the coordinate system of cad data overlapping, setting will be present in above-mentioned coordinate (x _T, y _T) point as the banner x on summit, bottom right _p, depth y _pThe zone get final product.

Also have, in order when checking, to make reference object zone 57 contrapositions on camera 3A and the substrate, at first by with the ST43 of above-mentioned Figure 14,44 identical processing, adjust after the position relation between substrate and the camera 3A according to reference point P, make X-axis worktable portion 6 and Y-axis worktable portion 7 only move respectively with at x _T, y _TOn add that the distance of the seat target value of reference point P gets final product.

According to above-mentioned main points, after camera 3A contraposition,, extract departure Δ x, Δ y with respect to the reference object zone of benchmark image by the method identical with the foregoing description 2, use this departure Δ x, Δ y can revise the position of inspection area.

In addition, because the processing that relates to teaching and inspection among the embodiment 3 is also identical with embodiment 1 and 2, so omit detailed description to this.

In addition, in the foregoing description 2,3, make all images 103 of reference substrate 1S after, from this all image 103 image corresponding with reference object zone cut out and logins as benchmark image.But be not limited to this, also can login all images 103 similarly to Example 1.At this moment, when detecting when checking the departure with respect to the process object image of benchmark image, cut out benchmark image from all images 103 of being logined, it is also passable to carry out above-mentioned relevant matches processing between this benchmark image that cuts out and process object image.

＜embodiment 4 〉

This embodiment 4 also be with above-mentioned Figure 15 with the substrate of spline structure as object, set all such reference object zone 57 that includes parts 56, these reference object zone 57 interior images are logined as benchmark image G11.But, among this embodiment 4, do not make all images 103, but on cad data the specific desired location that comprises the reference object zone 57 of above-mentioned parts 56, make the above-mentioned specific reference object zone contraposition of camera 3A and reference substrate 1S, obtain image as benchmark image G11.But, when generating benchmark image, must consider the influence that the machine error of X-axis worktable portion 6 and Y-axis worktable portion 7 is brought with such method.Therefore, among the embodiment 4, carry out teaching according to the step of following shown in Figure 17 and handle.

In Figure 17, in the ST61 as initial step, the cad data of the substrate of read around check object uses these data to make the map picture of all inspection areas of substrate.In the ST62 that follows, in above-mentioned map picture, on the position that comprises all inspection areas 58 corresponding, set reference object zone 57 with above-mentioned parts 56.In addition, the desired location in this reference object zone 57 is also identical with situation in all images 103 of the foregoing description 3, by with the relative coordinate (x on the corresponding summit, bottom right that should zone 57 of said reference point P _T, y _T) represent.

Then in ST63, be transported into reference substrate 1S.Then in ST64, the position of adjusting reference substrate 1S and camera 3A concerns, makes that the telltale mark 105 on the image of said reference substrate 1S is positioned at predetermined coordinate.This contraposition enters ST65, according to x after finishing _T, y _T, X-axis worktable portion 6 and Y-axis worktable portion 7 are moved respectively, make camera 3A and reference object zone 57 contrapositions of in above-mentioned ST62, setting.Also have, among the ST66, take, become the image of benchmark image by above-mentioned camera 3A.

Among the ST67, use above-mentioned relative coordinate (x _T, y _T), the map picture all from aforesaid substrate extracts the image in the above-mentioned reference object zone 57, makes this map picture and said reference picture registration.And then, by picture element scan map picture one by one, till said reference image and map look like to become suitable position relation, detect the benchmark image when being in this position that is fit to and concerning and the position deviation amount d of map picture _x, d _y

At this, use Figure 18, specify the processing of this ST67.

Figure 18 (1) expression is initially set the map in above-mentioned reference object zone 57 state of benchmark image G11 as M11.Because the benchmark image G11 of this embodiment is in the state of position deviation with respect to reference object zone 57, so the fillet weld 59 on the image is also with respect to inspection area 58 occurrence positions deviations.Figure 18 (2) becomes the state that each fillet weld 59 is contained in the position in the corresponding inspection area 58 for map is moved to as M11.If become this state, can think that then benchmark image G11 and map are matched as M11.Departure with respect to the transverse direction of the benchmark image of at this moment map picture is above-mentioned d _x, the departure of longitudinal direction is above-mentioned d _y

In addition, in order to try to achieve benchmark image G11 and map matched position relation, at first on benchmark image G11, the extracted region of each COLOR COMPOSITION THROUGH DISTRIBUTION of red, green, blue is gone out, and then the zone that is extracted is distinguished and 2 values mutually with other zones as M11.Also have,, also also 2 values are distinguished in inspection area 58 and other zones for the map picture.Then, when making above-mentioned two 2 value images relatively deviation take place, try to achieve correlation and be the highest position relation.Close this position is said reference image G11 and the matched position of reflection correspondence image M11 relation, and at this moment the deviation between two images is above-mentioned d _x, d _y

Return Figure 17, when trying to achieve by the processing of above-mentioned ST67 with respect to the departure d of map as the benchmark image G11 of M11 _x, d _yThe time, in the ST68 that follows, just with these position deviation amounts d _x, d _y, revise the desired location of the inspection area 58 on the above-mentioned map picture.Then in ST69, at the desired location in the reference object zone 57 that above-mentioned ST62 sets use location departure d too _x, d _yRevise.

Among the ST70, identical with the ST11 of above-mentioned Fig. 8, make inspection area inspection data in addition.After this, among the ST71, the judgement file of the inspection data of other that make the revised desired location of the revised desired location that includes the benchmark image that generates at above-mentioned ST66, reference object zone, inspection area and size, make at ST70 etc., with its login in teaching table 13.Enter ST72 then and transport said reference substrate 1S, the teaching processing finishes then.

In addition, the inspection after this teaching is handled becomes the content identical with the foregoing description 2, therefore omits the explanation that relates to inspection.

Handle according to above-mentioned teaching, even do not make all images of reference substrate 1S, also can use cad data, on the optional position that is examined the position that comprises specified quantity on the substrate, set the reference object zone, login the needed benchmark image of inspection and the inspection area in this reference object zone.

In addition, during teaching is as shown in figure 17 handled, according to above-mentioned departure d _x, d _y, except the desired location of inspection area 58, also revise the desired location in reference object zone 57, but this correction is not necessary processing.But, need with the position that is examined the position on the substrate as situation about correctly obtaining from the being seen relative coordinate of said reference point P under, need to revise the desired location in reference object zone 57.Its reason below is described.

The setting data x in above-mentioned reference object zone 57 _T, y _TBe relative coordinate with respect to said reference point P.With respect to this, shown in Figure 18 (1), the setting data x of inspection area 58 _n, y _nFor map as G11, in other words be the relative coordinate corresponding with the summit, bottom right in reference object zone 57.Because the position of substrate and inspection area 58 relation is fixed, so always get certain value (x usually with respect to the relative coordinate of the inspection area of reference point P _T+ x _n, y _T+ y _n).Therefore, at x _n, y _nValue when change, x certainly _T, y _TValue also must the change.The coordinate x of above-mentioned inspection area for example _nChange to x _n+ d _xSituation under, the coordinate x in reference object zone _TMust change to y _T-d _y

In addition, like this with the setting data x in reference object zone 57 _T, y _TDuring change, when checking, make camera 3A and the regional contraposition of reference object after changing, but at this moment the possibility that produces machine error is also arranged.Therefore, the inspection area that needs the correcting process object images.But for the position that is examined the position in this inspection area as representing corresponding to the relative coordinate of reference point P, based on reason same as described above, also need to revise the setting data in reference object zone.

Claims (9)

1. a substrate inspecting method is to use the image that is obtained by filming apparatus shooting component-mounted substrate, carries out with respect to a plurality of methods that are examined the inspection at position on the aforesaid substrate, it is characterized in that, comprises the step of preparation and the step of inspection,

In the step of above-mentioned preparation, include each following step: obtain the visual field of above-mentioned filming apparatus and the regulation zone on the substrate steps A to the benchmark image that should obtain at once; Obtain and make filming apparatus and the step B that concerns corresponding to the position of the needed filming apparatus of regional contraposition on the substrate of said reference image and substrate; The step C that is examined setting inspection area, position on the said reference image; The position relation with respect to benchmark image of the inspection area that the benchmark image that obtains in above-mentioned steps A, the filming apparatus that obtains in above-mentioned steps B is concerned with the position of substrate and set in step C is set up step D corresponding and that login respectively,

In the step of above-mentioned inspection, include each following step:

Position relation according to filming apparatus of logining in above-mentioned steps D and substrate makes above-mentioned filming apparatus carry out shooting with the substrate contraposition of checking object, makes the first step of process object image;

The process object image that will make in above-mentioned first step and the benchmark image of logining in above-mentioned steps D contrast, and detect second step with respect to the departure of the process object image of benchmark image;

Inspection area of logining in above-mentioned steps D by detected departure correction in above-mentioned second step and the position of benchmark image relation according to this revised position relation, are set the third step of inspection area on the process object image;

View data in the inspection area that use is set in above-mentioned third step is carried out the 4th step of the Flame Image Process of above-mentioned inspection usefulness.

2. substrate inspecting method as claimed in claim 1, it is characterized in that, comprise in above-mentioned steps A: the reference substrate that quality is good is divided into a plurality of zones corresponding to the size in the visual field of above-mentioned filming apparatus, presses the steps A 1 of each execution shooting in these zones; Synthesize in steps A 1 each the regional image that generates and generate the steps A 2 of all images of said reference substrate; On this all image, set comprise specified quantity be examined the position and corresponding to the steps A 3 in the zone of the size in the visual field of above-mentioned filming apparatus; Image setting in the zone that will set in steps A 3 is the steps A 4 of said reference image,

In above-mentioned steps C, comprise: from the substrate design data corresponding with the said reference substrate extract with corresponding regional of the benchmark image of among above-mentioned steps A4, setting in the step C1 of substrate design data; Use the substrate design data of being extracted, determine the step C2 that imposes a condition with respect to the inspection area of said reference image.

3. substrate inspecting method as claimed in claim 1, it is characterized in that, in above-mentioned steps A3, on all images of said reference substrate, set and in above-mentioned steps A1, take the regional corresponding zone of use, in above-mentioned steps A4, each the regional image that will set in above-mentioned steps A3 is set at independent benchmark image respectively.

4. substrate inspecting method as claimed in claim 1, it is characterized in that, in above-mentioned steps A3, according to substrate design data corresponding to the said reference substrate, determine with respect to the imposing a condition of the inspection area that is examined the position of the regulation on the substrate, set and include based on such zone, this inspection area that imposes a condition.

5. substrate inspecting method as claimed in claim 1 is characterized in that, comprises in above-mentioned steps A: according to the design data of aforesaid substrate, determine the steps A that imposes a condition 1 with respect to the inspection area that is examined the position of the regulation on the substrate; With respect to the good reference substrate of quality, so that make above-mentioned filming apparatus contraposition and take based on the inspection area of in above-mentioned steps A1, determining that imposes a condition the mode in the visual field of being contained in, with the image that obtains steps A 2 as benchmark image,

In step C, comprise: detect the step C that is examined the position 1 on the said reference image; At the step C2 that detects on the said reference image when having set the inspection area with respect to the departure that is examined the position of this inspection area based on imposing a condition of in steps A 1, determining; Step C3 according to the desired location of the above-mentioned inspection area of detected departure correction in step C2.

6. substrate inspecting method as claimed in claim 1, it is characterized in that, filming apparatus of logining in above-mentioned steps D and the position of substrate relation are that the ad-hoc location in the zone on the substrate corresponding with the visual field of above-mentioned filming apparatus is represented as the being seen relative coordinate of the reference point of the regulation from aforesaid substrate.

7. a base board checking device is to use the image of taking component-mounted substrate and obtaining to carry out with respect to a plurality of devices that are examined the inspection at position on the aforesaid substrate, it is characterized in that having:

The substrate platform, its substrate that will check object the above-mentioned position state lower support up that is examined;

Filming apparatus, it is used for taking the substrate that is being supported on the aforesaid substrate platform from the top;

Mobile device, it moves at least one side's along continuous straight runs in above-mentioned filming apparatus and the substrate platform;

Storer, its login have on the visual field that makes above-mentioned filming apparatus and the substrate of checking object the regulation zone to the benchmark image that should obtain at once, when obtaining this benchmark image filming apparatus and substrate the position relation and concern with respect to the position of the inspection area of benchmark image;

Position regulator, it controls the amount of movement of above-mentioned mobile device, so that the above-mentioned filming apparatus mode identical with the position relation of logining in storer with the position relation of substrate adjusted;

The process object video generation device, it generates the process object image at the above-mentioned filming apparatus of adjustment rear drive of above-mentioned position regulator;

The departure detection device, it detects the departure with respect to the process object image of benchmark image with above-mentioned process object image and the contrast of said reference image;

The zone setting device, the position relation of its inspection area that detected departure correction is logined in above-mentioned storer according to above-mentioned departure detection device and benchmark image, based on this revised position relation, on above-mentioned process object image, set the inspection area;

Image processing apparatus, it uses the Flame Image Process of being carried out above-mentioned inspection usefulness by the view data in the inspection area of above-mentioned zone setting device setting.

8. base board checking device as claimed in claim 7 is characterized in that also having:

Imaging control device, it under the state of the good reference substrate of quality at aforesaid substrate platform upper support, control the action of above-mentioned mobile device and filming apparatus, make the said reference substrate to be divided into a plurality of zones of the size corresponding with the visual field of filming apparatus and to take;

Image synthesizer, its synthetic each image that obtains by the control of above-mentioned imaging control device, all images of generation said reference substrate;

The benchmark image extraction element, it sets the zone that is examined position and the size corresponding with the visual field of above-mentioned filming apparatus that includes specified quantity on above-mentioned all images, the image in this zone is extracted as the said reference image;

Condition is determined device, and it determines imposing a condition with respect to the inspection area of said reference image according to the substrate design data in the zone that extracts the said reference image;

Entering device, when it logins the said reference image in above-mentioned storer, extract the position relation of reference substrate and filming apparatus when determining the position relation of determined inspection area that imposes a condition of device and benchmark image and obtaining this benchmark image, these positions relations are logined in above-mentioned storer based on above-mentioned condition.

9. base board checking device as claimed in claim 7 is characterized in that also having:

Condition is determined device, and it is according to the design data of aforesaid substrate, determines imposing a condition with respect to the inspection area that is examined the position of the regulation on the substrate;

The position relation is determined device, and the position relation that it determines above-mentioned filming apparatus and substrate makes and determines that based on above-mentioned condition the inspection area of the determined condition of device is included in the visual field of filming apparatus;

Imaging control device, it under the state of the good reference substrate of quality at aforesaid substrate platform upper support, control the action of above-mentioned mobile device and filming apparatus, make aforesaid substrate be under the state that concerns by the determined position of the definite device of relation, above-mentioned position and be taken with respect to filming apparatus;

Detection device, when its above-mentioned on the image that the control that detects by above-mentioned imaging control device obtains is examined the position, detect according to determine the determined departure that is examined the position that imposes a condition when on above-mentioned image, setting the inspection area of device by above-mentioned condition with respect to this inspection area;

Correcting device, it is according to the desired location by the above-mentioned inspection area of the detected departure correction of above-mentioned detection device;

Entering device, its image that will generate by the control of above-mentioned imaging control device is as when benchmark image login is in above-mentioned storer, with above-mentioned position relation determine the determined filming apparatus of device and substrate the position relation and based on by above-mentioned correcting device correction the position of inspection area and benchmark image of desired location concern and login in above-mentioned storer.

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