CN110199173A - Position offset acquisition device, check device, position offset acquisition methods and inspection method - Google Patents
Position offset acquisition device, check device, position offset acquisition methods and inspection method Download PDFInfo
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- CN110199173A CN110199173A CN201780083841.5A CN201780083841A CN110199173A CN 110199173 A CN110199173 A CN 110199173A CN 201780083841 A CN201780083841 A CN 201780083841A CN 110199173 A CN110199173 A CN 110199173A
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- position offset
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
In the image segmentation portion (411) of position offset acquisition device (41), divide an image in two images to obtain cut zone group.Conformable region determining section (412) finds out the fitness that segmentation area obtains processing relative to the offset of the position offset between obtaining two images, and the multiple conformable regions for being suitable for offset acquisition processing are determined according to cut zone group.Position offset acquisition unit (413) carries out the offset acquisition processing between two images, to obtain the position offset of the conformable region in each conformable region.Position offset calculation part (414) is for being not included in the non-habitual regions of multiple conformable regions in cut zone group, according to the position offset of multiple conformable regions and the positional relationship in the non-habitual region and multiple conformable regions, to find out position offset.The position offset of segmentation area in two images can be precisely found out as a result,.
Description
Technical field
The present invention relates to position offset acquisition device, check device, position offset acquisition methods and inspection methods.
Background technique
Currently, the visual examination of printed base plate can be by CAM (Computer Aided Manufacturing；Computer aided manufacturing
Helping manufacture) design datas of data etc. checked as benchmark.For example, by the image of layout shown in design data
Be compared with the image of Wiring pattern of display printed base plate, and will have the place of the difference above to a certain degree as defect and
It extracts.In this audit by comparison, the aligned in position of two images will do it.In the position in alignment, two figures are found out
The position offset of picture.
In addition, in Japanese Patent Laid-Open 6-300703 bulletin, announcement has a kind of check device, by it is each will be by
Check image and reference picture are divided into evaluation region made of the region of given dimensional and reciprocally compare, the inspection of Lai Jinhang defect
It surveys.In the check device, the position offset of two images of each evaluation region is found out, to obtain relative to position offset
Frequency distribution.As image entirety position offset and obtain the position of the distribution center of gravity of the frequency distribution and as tested
It looks into the maximum value of internal strain in pattern shown in image and obtains away from the farthest point of center of gravity at a distance between center of gravity.
However, there are one when the cut zone to each given dimensional carries out the situation of the aligned in position of two images
The situation that the pattern of a cut zone is for example only made of the linear pattern elements extended in one direction.In the situation
When, though the position offset in the direction perpendicular to a direction can precisely be found out, it is difficult to precisely find out
The position offset in one direction.
Summary of the invention
The present invention is for position offset acquisition device, and its object is to precisely find out in two images each point
Cut the position offset in region.
Position offset acquisition device of the invention has: image segmentation portion, divides an image in two images
To obtain cut zone group；Conformable region determining section finds out segmentation area relative between the described two images of acquisition
The offset of position offset obtains the fitness of processing, determines to be suitable for offset acquisition place from the cut zone group
Multiple conformable regions of reason；Position offset acquisition unit carries out the institute between described two images in each conformable region
Offset acquisition processing is stated, to obtain the position offset of each conformable region；And position offset calculation part,
For being not included in the non-habitual region of the multiple conformable region in the cut zone group, according to the multiple adaptation
The property position offset in region and the positional relationship in the non-habitual region and the multiple conformable region, to find out position
Set offset.
According to the present invention, the position offset of segmentation area in two images can precisely be found out.
In a preferable form of the invention, the conformable region determining section is contained in the segmentation area by detection
Shown in pattern characteristic point, to find out the fitness.
In another preferable form of the present invention, one image is derived from the design data institute from expression layout
Image, and another image in described two images is to be formed with the actual pattern based on the design data by shooting
Image acquired in object.
In a form of the invention, in offset acquisition processing, by each adaptability of one image
Region court moves up and down, and finds out the difference of another image in each conformable region and described two images,
To obtain the position offset of each conformable region.
In another form of the present invention, using the position of the segmentation area as the formula quilt of the position offset of parameter
It presets, the position offset calculation part is according to the position offset of the multiple conformable region and the multiple suitable
The position in answering property region, to find out the coefficient of the formula.
The present invention is also used for check device.Check device of the invention has: position offset acquisition device above-mentioned；And
Inspection portion uses the position offset by the segmentation area acquired in the position offset acquisition device, into
The aligned in position of the described two images of row, and obtain the inspection result to the examined image for being contained in described two images.
The present invention is also used for position offset acquisition methods and inspection method.
Purpose and other purposes above-mentioned, feature, form and advantage can refer to attached drawing and carry out the present invention by following
Detailed description and make clear.
Detailed description of the invention
Fig. 1 is the figure for indicating the composition of inspection apparatus for pattern.
Fig. 2 is the figure for indicating the composition of computer.
Fig. 3 is the block diagram for indicating the function of inspection apparatus for pattern and constituting.
Fig. 4 is the figure for indicating to check the process flow of substrate.
Fig. 5 is the figure for indicating cut zone group.
Fig. 6 is the figure for indicating a part of cut zone.
Fig. 7 is the figure for indicating a part of cut zone.
Fig. 8 is the figure for indicating conformable region.
Fig. 9 is the figure for indicating non-habitual region.
Figure 10 is the figure for indicating multiple conformable regions in cut zone group.
Figure 11 is to illustrate that offset obtains the figure of processing.
Figure 12 is the figure for indicating to be examined the pixel arrangement of cut zone.
Figure 13 is the figure for indicating the pixel arrangement of the examined cut zone corresponding to non-habitual region.
Specific embodiment
Fig. 1 is the figure for indicating the composition of inspection apparatus for pattern 1 of an embodiment of the present invention.Inspection apparatus for pattern 1 is for example
It is the device of the appearance of the printed base plate (also referred to as printed wiring board) before inspection electronic component is mounted.
Herein, printed base plate is the electric conductivity material for passing through copper etc. on the surface of resin substrate 9 (hereinafter referred to as " substrate 9 ")
Expect and be formed with the substrate of Wiring pattern.In the manufacture of printed base plate, the surface of substrate 9 is provided with the film of conductive material
(conductive film).The photoresistance film as photosensitive material is formed on conductive film, and the image of the pattern based on design data is logical
Drawing apparatus (directly drawing (direct patterning) device) is crossed directly to be depicted in the photoresistance film.There is pattern to description
Substrate 9 implement development treatment, etching process, photoresist lift-off processing etc..To be formed with Wiring pattern on substrate 9.To base
The etching process of plate 9 is for example by bestowing the wet etching that etching solution is carried out to substrate 9.At the etching to substrate 9
Reason, can also carry out the dry-etching such as using plasma-based.In addition, it is possible to use show the light shield of layout and make pattern quilt
(exposure) is formed in photoresistance film.
Inspection apparatus for pattern 1 has the entirety of the device noumenon 2 and control inspection apparatus for pattern 1 that are shot to substrate 9
The computer 3 for acting and realizing aftermentioned operational part etc..Device noumenon 2 has shooting substrate 9 and obtains multi-level (multi-
Gradation the camera 21 of photographs (data)), the platform 22 for keeping substrate 9 and by platform 22 relative to taking the photograph
The table drive part 23 that image device 21 relatively moves.Camera 21 has the illumination portion 211 for being emitted illumination light, will illuminate
Light guides the optics to substrate 9 and the light incidence for carrying out self-reference substrate 9 to be system 212 and will be 212 imagings of system by optics
The picture of substrate 9 is converted to the ministry of photography 213 of electric signal.Table drive part 23 is made of ball screw, guide rail, motor etc..
3 control platform driving portion 23 of computer and camera 21, to shoot the given area on substrate 9.
Fig. 2 is the figure for indicating the composition of computer 3.Computer 3 is the CPU (Central comprising carrying out various calculation process
Processing Unit；Central processing unit) 31, store basic program ROM (Read-Only Memory；Read-only storage
Device) 32 and the various information of storage RAM (Random Access Memory；Random access memory) 33 general computer be system
Composition.Computer 3 further includes the display for the various information carry out the fixed disk 34 of information storage, carry out image etc.
Display 35, receive the input from operator keyboard 36a and mouse 36b, from the calculating of CD, disk, photomagneto disk etc.
The record media 8 that machine can be read carries out the reading device 37 of the reading of information and in other composition with inspection apparatus for pattern 1
Between receiving and transmitting signal communication unit 38.
In computer 3, program 80 is read out and stored from record media 8 in fixation via reading device 37 in advance
Disk 34.CPU 31 utilizes RAM 33 and fixed disk 34 according to program 80, and executes calculation process.
Fig. 3 is the block diagram for indicating the function of inspection apparatus for pattern 1 and constituting, in Fig. 3, with the dotted line square of symbol 3
Shape is made of to surround the function that the CPU 31 of computer 3, ROM 32, RAM 33, fixed disk 34 etc. are realized.Computer 3
With position offset acquisition device 41, inspection portion 42 and storage unit 49.Position offset acquisition device 41 has image segmentation
Portion 411, conformable region determining section 412, position offset acquisition unit 413 and position offset calculation part 414.Storage unit 49
Storage CAM data (or CAD (Computer Aided Design；CAD) data) etc. design data 48.It closes
The details that realized function is constituted in these is explained below.Furthermore these functions both can by the construction of dedicated circuit institute,
Dedicated circuit can locally be utilized.
Fig. 4 is to indicate that inspection apparatus for pattern 1 checks the figure of the process flow of substrate 9.It herein, will be as 1 batch (hereinafter referred to as
For " object batch ") and multiple substrates 9 for being manufactured are set as check object.Multiple substrates 9 of object batch are contained in for phase
With the manufacture of product, and it is formed with identical Wiring pattern.
In inspection apparatus for pattern 1, firstly, forming the Wiring pattern on the surface of substrate 9 (hereinafter, by practical upper substrate 9
On Wiring pattern be known as " actual pattern ") when the design data 48 that is utilized, storage unit 49 can be input to and be prepared
(step S10).The design data 48 of present embodiment is the vector data for indicating layout.Design data 48 can also be grid
Data (Raster data).The actual pattern being contained on multiple substrates 9 of object batch is led to according to design data 48
Overetch processing etc. is formed.
In image segmentation portion 411, the binary image (hereinafter referred to as " reference picture ") of display layout is generated.?
In reference picture, multiple pixels are arranged along column direction and line direction, and to the area of the pattern for being contained in layout
Each pixel assigns a value (such as 1), and assigns another value (such as 0) to each pixel for being contained in background area.Such as Fig. 5 institute
Show, reference picture 6 is divided into multiple regions 60 (hereinafter referred to as " cut zone 60 ") (step S11).For example, 6 edge of reference picture
Column direction and line direction be divided and cut, multiple cut zone 60 are identical sizes.Multiple cut zone 60 can also be difference
Size.In the following description, the collection of multiple cut zone 60 is collectively referred to as " cut zone group ".
Fig. 6 and Fig. 7 is the figure for indicating a part of cut zone 60.If obtaining cut section by image segmentation portion 411
Domain group, conformable region determining section 412 just by each pixel for being not included in area of the pattern 61 in reference picture 6, be contained in back
Each pixel of scene area 62 as object pixel, respectively to 8 orientation measurements set by 45 degree of intervals from object pixel to
Distance (hereinafter referred to as " background measurement distance ") until the edge of area of the pattern 61.In Fig. 6, with arrow 81 (to 1 arrow
Symbol 81a) come indicate 8 directions when the situation using pixel 82 as object pixel background measure distance.
In object pixel, the background measurement distance in only 1 direction is set judgement more than, and other 7
When the background measurement distance in direction is less than the situation for determining distance, object pixel is detected as recess portion pixel.Picture in Fig. 6
Element 82, more than only with the measurement of background shown in arrow 81a distance for judgement distance, pixel 82 is recess portion pixel.It is recessed
Portion's pixel indicates the presence of the recess portion 63 (hereinafter referred to as " patterned recess 63 ") of area of the pattern 61.Furthermore background measures distance
The upper limit is preset, and the background that the arrow 81a in Fig. 6 becomes the upper limit measures distance.The exploration of recess portion pixel can also be to background
The pixel of every given amount carries out (exploration of protrusion pixel is also identical) in region 62.
Conformable region determining section 412 is further included in each pixel of area of the pattern 61 as object pixel, and divides
It is other to (following with distance of 8 orientation measurements set by 45 degree of intervals until from object pixel to the edge of area of the pattern 61
Referred to as " pattern measurement distance ").In Fig. 7, indicated with arrow 71 (to 3 arrows symbols 71a, 71b, 71c) with picture
The pattern measurement distance in 8 directions when element 72, situation of the 72A as object pixel.
Then, in object pixel, the pattern measurement distance in only 1 direction is set judgement distance or more, and its
When the pattern measurement distance in his 7 directions is less than the situation for determining distance, object pixel is detected as protrusion pixel.Fig. 7
In pixel 72, as only with pattern shown in arrow 71a measurement distance for determine distance more than, pixel 72 be protrusion picture
Plain (in Fig. 7, showing the protrusion pixel of the front end of solder joint).In addition, pixel 72A, as with two shown in arrow 71b, 71c
Pattern measurement distance is determines distance or more, therefore pixel 72A is not protrusion pixel.Protrusion pixel indicates the convex of area of the pattern 61
The presence in portion 64 (hereinafter referred to as " pattern protrusion 64 ").Furthermore the upper limit of pattern measurement distance is preset, the arrow in Fig. 7
The pattern that head 71a, 71b become the upper limit measures distance.
Conformable region determining section 412 finds out the number of the protrusion pixel and recess portion pixel that are contained in segmentation area 60,
The number is determined for cut zone 60 more than both fixed numbers as conformable region (step S12).It in fig. 8, will be as suitable
Determined 3 cut zone 60 in answering property region longitudinally arrange display.On the other hand, the number of protrusion pixel and recess portion pixel
Less than the cut zone 60 of both fixed numbers, it is determined as non-habitual region.It, will be true as non-habitual region in Fig. 9
3 cut zone 60 made longitudinally arrange display.In Figure 10, adapt to being used as in the cut zone group of reference picture 6
Property region determined cut zone 60 indicate parallel diagonal lines.
As described later, in the inspection of substrate 9, the photographs of the substrate 9 and the aligned in position of reference picture 6 are carried out.
In the position in alignment, find out pattern shown in the segmentation area 60 of reference picture 6 with and the pattern consistent (or substantially one
Cause) photographs in pattern between position offset.In order to precisely find out positional shift to segmentation area 60
Amount, preferably pattern shown in the cut zone 60 include that (reason will later for patterned recess 63 and pattern protrusion 64 to a certain degree
Illustrate).It therefore, is both by the number of cut zone group center dant pixel and protrusion pixel in conformable region determining section 412
Cut zone 60 more than fixed number, as the processing suitable for obtaining position offset, (position offset acquisition unit 413 is carried out
Processing, hereinafter referred to as " offset acquisition processing ") conformable region and use.In other words, cut zone group center dant pixel
And the number of protrusion pixel is less than the cut zone 60 of both fixed numbers, obtains the non-habitual region handled as offset is unsuitable for
And it uses.Non-habitual region is the cut zone 60 that multiple conformable regions are not included in cut zone group.
Then, in device noumenon 2, the substrate 9 at first being contained in multiple substrates 9 of object batch is placed in flat
On platform 22 (referring to Fig.1), the given area on substrate 9 is the photographed region that the ministry of photography 213 is configured in by table drive part 23
Domain.Then, by the photographs (hereinafter referred to as " actual pattern image ") of the acquisition display actual pattern of the ministry of photography 213, and by
It exports to position offset acquisition device 41 (step S13).In actual pattern image, identically as reference picture 6, multiple pictures
Element is arranged along column direction and line direction.The resolution ratio of actual pattern image is identical as the resolution ratio of reference picture 6.Or
It says, cooperates the resolution ratio of the photographs of the ministry of photography 213, reference picture 6 is generated according to design data 48.The one of reference picture 6
The size in the region on substrate 9 shown in a pixel, region on substrate 9 shown in a pixel with actual pattern image
Size is identical.
In position offset acquisition unit 413, actual pattern image carries out binaryzation by set threshold value, and it is real to generate display
The binary image (hereinafter referred to as " examined image ") of border pattern.Then, the offset being examined between image and reference picture 6
Amount obtains processing in the progress of segmentation area 60 as conformable region, and obtains position offset to each conformable region
(step S14).
Figure 11 is to illustrate that offset obtains the figure of processing.In Figure 11, indicate relative to aftermentioned examined segmentation
Region 50 (shows) with the rectangle of dotted line, by cut zone 60 (being shown with indicating the solid-line rectangle of parallel diagonal lines) towards upper and lower
Left and right displacement and the case where configure.In this processing example, identically as the cut zone group of reference picture 6, by along column side
To and line direction divide and be examined image, in being examined image, determine the segmentation area 60 corresponding to reference picture 6
Region 50 (is the region for showing the position on substrate 9 identical with the cut zone 60, hereinafter referred to as " is examined cut zone
50").In offset acquisition processing, as shown in the center in Figure 11, it is somebody's turn to do the entirety of cut zone 60 to be overlapped in correspond to
In the state of the entirety of the examined cut zone 50 of cut zone 60, the value and and the picture of each pixel of cut zone 60 are found out
The difference (absolute value) of the value of the pixel of the examined image of element overlapping.Then, it obtains as evaluation of estimate relative to cut zone
The sum of the 60 whole obtained differences of pixel.
In addition, on being examined image, by cut zone 60 from the position of examined cut zone 50 pixel one at a time
Ground is mobile towards (column direction and line direction) up and down, and similarly obtains evaluation of estimate.In this way, with by examined cut zone 50
Center pixel be set as center M column N row (M and N be arbitrary integer) pixel arrangement each pixel and cut zone 60
The mode of center pixel overlapping configures cut zone 60 and obtains evaluation of estimate.Then, in examined cut zone 50, overlapping
Have in the plural pixel of the center pixel of cut zone 60, obtain the pixel as set threshold value evaluation of estimate below, it is true
It is set to specific pixel.In the state of the position that the center pixel for being configured in cut zone 60 is Chong Die with specific pixel, segmentation
Region 60 and the difference of examined image are relatively small.
Figure 12 is to indicate that the center pixel 51a by examined cut zone 50 is set as the battle array of the pixel 51 of 5 column, 5 row in center
The figure of column 510 (i.e. pixel array 510), and parallel diagonal lines are indicated to specific pixel 51.In the cut section as conformable region
Domain 60 offset acquisition processing in, multiple specific pixels 51 and one piece is gathered into as particular pixel group.Then, as this
The position offset of cut zone 60 obtains the weight from the center pixel 51a of examined cut zone 50 towards particular pixel group
The vector of heart position 52.Position offset includes the ingredient of column direction and the ingredient of line direction, in the following description, by these
Ingredient is known as " position offset of column direction " and " position offset of line direction ".As described above, being obtained in position offset
In portion 413, each conformable region court of reference picture 6 is moved up and down, and finds out the conformable region and is examined figure
The difference of picture, to obtain the position offset of the conformable region.
In addition, even if any one pixel 51 configuration cut zone 60 in the pixel array 510 of cooperation M column N row still can not
When obtaining the situation of threshold value evaluation of estimate below (specific pixel 51 can not be obtained), to new with the pixel array 510 adjoining
Pixel arrangement carries out processing same as described above.In offset acquisition processing, until obtaining specific pixel 51 or both
Until the new pixel arrangement of fixed number amount is set, repeat the processing.Even if in the new pixel arrangement of setting given amount
When can not still obtain the situation of specific pixel 51, stopping repeats the processing, such as by 60 adaptivity of cut zone
Region is changed to non-habitual region
In inspection apparatus for pattern 1, the formula that the position of segmentation area 60 is set as the position offset of parameter is (following
Referred to as " offset calculating formula ") it is preset.For example, using segmentation shown in Fig. 10 in the offset calculating formula of formula 1
The position Xb of the column direction of the center pixel in the region 60 and position Yb of line direction, to indicate the position offset Δ X of column direction
And the position offset Δ Y of line direction.In formula 1, α x, β x, γ x, α y, β y, γ y are coefficient.
[formula 1]
Δ X=α xXb+ β xYb+ γ x
Δ Y=α yXb+ β yYb+ γ y
In position offset calculation part 414, according to position (the additional parallel oblique line in Figure 10 of multiple conformable regions
Cut zone 60 position) and it is inclined by the position of multiple conformable region acquired in position offset acquisition unit 413
Shifting amount, to find out factor alpha x, β x, γ x, α y, β y, the γ y (value) (step S15) of offset calculating formula.For example, these coefficients
It is found out by least squares method.Least squares method from formula 2 derived from the institute of formula 1, in multiple conformable regions in
The position of the position offset Δ X and line direction of the position Xb of the column direction of imago element and the position Yb of line direction and column direction
Offset Δ Y is set to be substituted into.Then, the Ex and Ey of formula 2 are just as calculated by the smallest factor alpha x, β x, γ x, α y, β y, γ y.
[formula 2]
Ex=∑ (α xXb+ β xYb+ γ x- Δ X) 2
Ey=∑ (α yXb+ β yYb+ γ y- Δ Y) 2
If the coefficient of offset calculating formula is found out, each non-habitual region (the white cut zone 60 in Figure 10)
The position Xb of the column direction of the center pixel and position Yb of line direction, is just substituted into offset calculating formula.To non-adaptive to this
Property region, finds out the position offset Δ X of the column direction and position offset Δ Y (step S16) of line direction.As described above, partially
Factor alpha x, the β x of meter formula, γ x, α y, β y, γ y are moved according to the position offset of multiple conformable regions and multiple
The position of the column direction of conformable region and line direction is found out.In addition, the position offset in non-habitual region is non-using this
The column direction of conformable region and the position of line direction, by calculated by offset calculating formula.Therefore, the position in non-habitual region
Offset is set, substantially can be considered according to the position offset of multiple conformable regions and non-habitual region and multiple adaptations
Calculated by the positional relationship in property region.
In inspection portion 42, such as the center pixel of the segmentation area 60 of reference picture 6 is being configured at corresponding quilt
In the state of the position for checking the position offset that the center pixel 51a of cut zone 50 only moves the cut zone 60, to obtain
Take the differential area image for showing the difference of the cut zone 60 and examined image.Differential area image is in aligned in position
In reference picture 6 and examined image, show the value of each pixel of cut zone 60 with and the Chong Die examined image of the pixel
Pixel value or (exclusive or；XOR binary image).Differential area image display defect candidate pixel.
When the size of the set of the defect candidate pixel to adjoin each other the situation bigger than set area threshold, the defect candidate pixel
Set be detected as defect area.
In another example of the processing in inspection portion 42, in each position for being examined image, width or background as pattern
Width and obtain the width of area of the pattern or the width of background area.In addition, in inspection apparatus for pattern 1, relative to reference to figure
As 6 each position is set with the threshold value of width, in the reference picture 6 and examined image of aligned in position, obtains and be examined
The threshold value of the position of the reference picture 6 of each position overlapping of image.Then, by the pattern width of the position of examined image or
Background width is compared with the threshold value, therefore, it is determined that whether the position for being examined image is defect.As previously discussed, exist
In inspection portion 42, using the position offset of segmentation area 60, the aligned in position of reference picture 6 and examined image is carried out,
And it obtains for the inspection result (step S17) for being examined image.
If the inspection for substrate 9 at first terminates, the ministry of photography 213 shoots the 2nd substrate for being contained in object batch
9, and obtain and be examined image (step S18, S13).Then, as described above, the position offset of conformable region is obtained,
To find out the coefficient (step S14, S15) of offset calculating formula.Multiple substrates 9 of object batch are contained in due to based on identical
Design data 48, therefore the conformable region of cut zone group is all the same in multiple substrates 9.Then, non-habitual area is obtained
The position offset in domain, and inspection result (step S16, S17) is obtained according to the reference picture 6 positioned and examined image.
If all substrates 9 for being contained in object batch are carried out with the processing of the step S13~S17, the processing of inspection apparatus for pattern 1
Terminate (step S18).
Herein, illustrate to carry out the pattern that offset obtains the comparative example of processing to all cut zone 60 of cut zone group
Check device.3 cut zone 60 of Fig. 9 are carried out at offset acquisition in the inspection apparatus for pattern of comparative example, such as also
Reason.The pattern of the cut zone 60 of the upper section of Fig. 9, middle section and lower section, respectively only by prolonging towards column direction, line direction and inclined direction
The linearity pattern element stretched is constituted.Therefore, as shown in the upper section of Figure 13, middle section and lower section, to be examined cut zone
50 center pixel 51a be in the pixel array 510 of the M column N row in center indicate the specific pixels 51 of parallel diagonal lines respectively along
Column direction, line direction and inclined direction form a line.As a result, being difficult to correctly obtain the position of 51 orientations of specific pixel
Set offset.If even if being obtained as position offset from the center pixel 51a of examined cut zone 50 towards specific
The vector of position of centre of gravity in pixel group, the reliability of the position offset is also very low, this point that can be checked in inspection portion 42
In the inspection result for cutting region 60, often occur not being the position for defect as the error message of defect detection.Dividing
Region 60 shows also identical when the situation in one direction with other periodic patterns.
In this regard, the pattern of the cut zone 60 comprising patterned recess 63 or pattern protrusion 64, will not be only in one direction
The linear pattern elements extended.In other words, the cut zone 60 being detected in recess portion pixel or protrusion pixel (referring to Fig. 8)
In, the recess portion pixel or protrusion pixel become the characteristic point of pattern shown in the cut zone 60, and make specific pixel 51 in institute
It states and is difficult to form a line in the pixel array 510 of M column N row.In fact, being contained in recess portion pixel and the protrusion of segmentation area 60
The number of the number of pixel, i.e. characteristic point is more, is more difficult to that specific pixel 51 is made to form a line, of recess portion pixel and protrusion pixel
Number indicates the fitness that processing is obtained to offset of the cut zone 60.
In inspection apparatus for pattern 1, the fitness handled, root are obtained relative to offset by finding out segmentation area 60
Multiple conformable regions are determined according to cut zone group, and are handled by offset acquisition to obtain the position of each conformable region
Offset.Then, to non-habitual region, according to the position offset of multiple conformable regions and non-habitual region and more
The positional relationship of a conformable region, to find out position offset.In this way, obtaining the adaptability area handled using offset is suitable for
The position offset in domain is unsuitable for the position offset in the non-habitual region that offset obtains processing to find out, so as to precision
The position offset of the segmentation area 60 of reference picture 6 and examined image is found out well.In addition, due to only to multiple suitable
Answering property region carries out offset acquisition processing, therefore carries out the feelings that offset obtains processing compared to all cut zone 60
Shape can reduce the treating capacity of position offset acquisition unit 413, that is, can shorten the time required for the acquisition of position offset.
In addition, each conformable region court of reference picture 6 moves up and down in offset acquisition processing, and
Find out the difference of the conformable region Yu examined image.The position offset of the conformable region can be easily obtained as a result,.This
Outside, the offset calculating formula that the position of segmentation area 60 is set as parameter is preset, according to multiple conformable regions
The position of position offset and multiple conformable region, to find out the coefficient of offset calculating formula.It can promptly ask as a result,
The position offset in non-habitual region out.
In inspection portion 42, using the position offset of segmentation area 60, reference picture 6 and examined image are carried out
Aligned in position, and obtain for the inspection result for being examined image.At this point, by carrying out each cut zone 60 with reference to figure
As 6 and the aligned in position of examined image, the inspection result of examined image can be precisely obtained and (reduce error message).
Various modifications can be carried out in the position offset acquisition device 41 and inspection apparatus for pattern 1.
In conformable region determining section 412, though using recess portion pixel and protrusion pixel as characteristic point, and it is each to being contained in
The characteristic point of pattern shown in cut zone 60 is detected, and easily finds out the cut zone 60 relative to offset to realize
Other than amount obtains the fitness of processing, but characteristic point can also be for recess portion pixel and protrusion pixel.For example, in 60 institute of segmentation area
In the pattern shown, the curve part as the edge on the vertex or pattern elements of the polygonal shape of pattern elements (can also be free of
Straight line) it is handled as characteristic point.In addition, fitness can also be found out by the method other than the detection of characteristic point.
In image segmentation portion 411, the cut zone group of examined image can also be obtained.In the situation, basis is carried out
The cut zone group determines multiple conformable regions to find out at the offset acquisition of the difference of each conformable region and reference picture 6
Reason.As described above, in inspection apparatus for pattern 1, to an image in two images of examined image and reference picture 6 into
Row segmentation determines the multiple adaptability areas for being suitable for offset and obtaining processing according to the cut zone group to obtain cut zone group
Domain.In addition, each conformable region court of an image is moved up and down, and finds out in offset acquisition processing
The difference of another image in the conformable region and two images, to obtain the position offset of the conformable region.
It on the other hand, can nothing when in through examined image acquired in shooting substrate 9 comprising the defective situation waited
Method precisely finds out the fitness of cut zone.Therefore, the sight of the fitness of segmentation area is just precisely found out
For point, cut zone group preferably is obtained in the reference picture 6 derived from 48 institute of design data from expression layout.Separately
Outside, in multiple substrates 9, when being formed with the situation of actual pattern according to identical design data 48, by being set from this
It counts in reference picture 6 derived from 48 institutes and obtains cut zone group, can be to the examined image of multiple substrates 9, use is identical
Conformable region, and efficiency carries out the inspection of multiple substrates 9 well.
As the offset acquisition processing for obtaining the position offset between two images, it is possible to use 1 and Figure 12 referring to Fig.1
Method other than illustrated method.In offset acquisition processing, related pattern match (Pattern can be used
Matching various methods (for example, regular correlation matching algorithm (Normalized Correlation method) etc.)).
In said embodiment, it obtains the ginseng of actual pattern image binaryzation resulting examined image and binaryzation
The position offset between image 6 is examined, but in offset acquisition processing, multi-level reality can also be used as examined image
Border pattern image.In the situation, such as is generated as reference picture and area of the pattern 61 and background area 62 are assigned respectively
It is examined the image of the resulting layout of average value of the average value and background area of the area of the pattern of image.Then, more
In the examined image and the reference picture of level, the processing using position offset acquisition device 41 is carried out.It is checking
Similarly the inspection result for multi-level examined image can also be obtained in portion 42.
The offset calculating formula of formula 1 only as an example of, it is possible to use secondary or high order formula.In addition, in positional shift
It measures in calculation part 414, the position offset in non-habitual region can also be found out without using offset calculating formula.For example, can also
By using the position offset and these conformable regions of the multiple conformable regions being located at around each non-habitual region
With the difference operation of the positional relationship in the non-habitual region, to find out the position offset in the non-habitual region.
The substrate of check object as inspection apparatus for pattern 1 can also be semiconductor substrate or glass substrate etc..In addition,
In inspection apparatus for pattern 1, other than substrate, can also the object etc. of object or stereo structure to film-form examine
It looks into.
Find out the position offset acquisition device 41 of the position offset of two images, it can also be used to which drawing apparatus etc. is used
In the position offset for obtaining various types of image.
As long as the composition of the embodiment and each variation is not conflicting to be suitably combined.
Though describing in detail and being illustrated to invention, explanation above-mentioned is merely illustration rather than to the person of restriction.
Therefore, without departing from the scope of the present invention, a variety of deformation and aspect can be realized.
Description of symbols
1 inspection apparatus for pattern
6 reference pictures
9 substrates
41 position offset acquisition device
42 inspection portions
48 design datas
60 cut zone
411 image segmentation portions
412 conformable region determining sections
413 position offset acquisition units
414 position offset calculation parts
S10~S18 step
Claims (12)
1. a kind of position offset acquisition device, wherein have:
An image in two images is divided to obtain cut zone group in image segmentation portion；
Conformable region determining section finds out segmentation area relative to the inclined of the position offset between obtaining described two images
Shifting amount obtains the fitness of processing, determines that being suitable for the offset obtains the multiple adaptability handled from the cut zone group
Region；
Position offset acquisition unit carries out at the offset acquisition between described two images in each conformable region
Reason, to obtain the position offset of each conformable region；And
Position offset calculation part, for being not included in the non-adaptive of the multiple conformable region in the cut zone group
Property region, according to the position offset of the multiple conformable region and the non-habitual region and the multiple adaptability
The positional relationship in region, to find out position offset.
2. position offset acquisition device according to claim 1, wherein
The conformable region determining section is contained in the characteristic point of pattern shown in the segmentation area by detection, to find out
The fitness.
3. position offset acquisition device according to claim 1 or 2, wherein
One image is the derived image from the design data for indicating layout, another in described two images
Image is to be formed with image acquired in the object of the actual pattern based on the design data by shooting.
4. position offset acquisition device according to any one of claim 1 to 3, wherein
In offset acquisition processing, each conformable region court of one image is moved up and down, and
And the difference of another image in each conformable region and described two images is found out, to obtain each adaptability area
The position offset in domain.
5. position offset acquisition device according to any one of claim 1 to 4, wherein
It is preset the position of the segmentation area as the formula of the position offset of parameter,
Position offset and the multiple adaptability area of the position offset calculation part based on the multiple conformable region
The position in domain, to find out the coefficient of the formula.
6. a kind of check device, wherein have:
Position offset acquisition device described in any one of claims 1 to 5；And
Inspection portion uses the positional shift by the segmentation area acquired in the position offset acquisition device
Described two images are carried out aligned in position, and obtain the inspection for the examined image for being contained in described two images by amount
Come to an end fruit.
7. a kind of position offset acquisition methods, wherein have:
A) step divides an image in two images to obtain cut zone group；
B) step is obtained by finding out segmentation area relative to the offset of the position offset between obtaining described two images
The fitness of processing, to determine to be suitable for multiple adaptability that the offset obtains processing according to the cut zone group
Region；
C) step carries out the offset acquisition processing between described two images, to obtain institute in each conformable region
State the position offset of each conformable region；And
D) step, for the non-habitual region for being not included in the multiple conformable region in the cut zone group, base
In the position offset of the multiple conformable region and the position in the non-habitual region and the multiple conformable region
Relationship, to find out position offset.
8. position offset acquisition methods according to claim 7, wherein
In the b) step, the characteristic point of pattern shown in the segmentation area is contained in by detecting, it is described to find out
Fitness.
9. position offset acquisition methods according to claim 7 or 8, wherein
One image is the image derived from the design data for indicating layout, another figure in described two images
It seem that image acquired in the object of the actual pattern based on the design data is formed with by shooting.
10. position offset acquisition methods according to any one of claims 7 to 9, wherein
In offset acquisition processing, each conformable region court in one image is moved up and down,
And the difference for finding out another image in each conformable region and described two images, to obtain each adaptability
The position offset in region.
11. position offset acquisition methods according to any one of claims 7 to 10, wherein
It is preset the position of the segmentation area as the formula of the position offset of parameter,
D) the step has the position of position offset and the multiple conformable region according to the multiple conformable region
The step of setting to find out the coefficient of the formula.
12. a kind of inspection method, wherein have:
Position offset acquisition methods described in any one of claim 7 to 11；And
Using the position offset by the segmentation area acquired in the position offset acquisition methods, by described two
A image carries out aligned in position, and obtains the step of the inspection result for the examined image for being contained in described two images
Suddenly.
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| JP2017008269A JP6936577B2 (en) | 2017-01-20 | 2017-01-20 | Misalignment amount acquisition device, inspection device, misalignment amount acquisition method and inspection method |
| JP2017-008269 | 2017-01-20 | ||
| PCT/JP2017/040777 WO2018135112A1 (en) | 2017-01-20 | 2017-11-13 | Positional-deviation-amount acquisition device, inspection device, positional-deviation-amount acquisition method, and inspection method |
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| KR (1) | KR102227341B1 (en) |
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| KR102610783B1 (en) * | 2022-11-03 | 2023-12-07 | 시냅스이미징(주) | Deep learning inspection system implementing image preprocessing of CAD image |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201842830A (en) | 2018-12-01 |
| CN110199173B (en) | 2021-08-06 |
| KR102227341B1 (en) | 2021-03-11 |
| TWI674048B (en) | 2019-10-01 |
| WO2018135112A1 (en) | 2018-07-26 |
| JP2018116008A (en) | 2018-07-26 |
| KR20190092506A (en) | 2019-08-07 |
| JP6936577B2 (en) | 2021-09-15 |
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