CN110291852A - To base board operation device and image processing method - Google Patents
To base board operation device and image processing method Download PDFInfo
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- CN110291852A CN110291852A CN201780086364.8A CN201780086364A CN110291852A CN 110291852 A CN110291852 A CN 110291852A CN 201780086364 A CN201780086364 A CN 201780086364A CN 110291852 A CN110291852 A CN 110291852A
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- 238000012545 processing Methods 0.000 claims abstract description 207
- 239000000758 substrate Substances 0.000 claims abstract description 178
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000012360 testing method Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 description 29
- 230000009466 transformation Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000011900 installation process Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
- G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Processing (AREA)
Abstract
Have to base board operation device: filming apparatus shoots substrate；Storage device stores various information；And image processing apparatus, in the case where carrying out predetermined operation to multiple substrates, most preceding substrate processing is executed for most preceding substrate, subsequent substrate processing is executed for the subsequent substrate other than most preceding substrate, wherein, above-mentioned most preceding substrate is the image procossing carried out for the shooting image as obtained from filming apparatus shooting most preceding substrate for detecting scheduled test object required for predetermined operation with processing, and it obtains area information relevant to the region in shooting image required for the detection of test object and is stored in the processing of storage device, above-mentioned subsequent substrate is in the processing region shot as filming apparatus based on area information setting part in shooting image obtained from subsequent substrate and the processing for carrying out image procossing to the processing region of setting with processing.
Description
Technical field
Subject description discloses to base board operation device and image processing method.
Background technique
In the past, the progress to substrate installation elements etc. for substrate operation in base board operation device, for height
Position and the angle etc. for obtaining to precision the element of holding propose and carry out image obtained from generating resolution ratio capturing element
The scheme (see, for example patent document 1) of the super-resolution processing of high high-definition picture.This in base board operation device,
Super-resolution processing only is carried out to the processing region for wrapping element-cont characteristic and generates high-definition picture.
Existing technical literature
Patent document 1:WO2015/049723 bulletin
Summary of the invention
Subject to be solved by the invention
But in recent years, along with the miniaturization of substrate and element, the object of super-resolution processing also has microminiaturization
Trend, wherein sometimes if not can not then identify object by the high-definition picture that super-resolution processing generates.In the feelings
Under condition, it is difficult to determine the processing region comprising the characteristic of objects such as element before super-resolution processing, and by image
Whole region carries out the image procossings such as super-resolution processing as processing region.In this way, the processing time of image procossing is unnecessary
Ground extends, the efficiency decline of image procossing.
The main purpose of the disclosure is image procossing required for efficiently carrying out the operation for substrate.
Means for solving the problems
The disclosure uses means below to reach above-mentioned main purpose.
The disclosure is have to the purport of base board operation device: filming apparatus, shoots substrate；Storage device, storage
Various information；And image processing apparatus, the most preceding substrate in multiple aforesaid substrates of the object as predetermined operation is held
Row most preceding substrate is handled, in multiple aforesaid substrates of the object as above-mentioned predetermined operation in addition to above-mentioned most preceding substrate
Subsequent substrate in addition executes subsequent substrate processing, wherein above-mentioned most preceding substrate with processing is filled to by above-mentioned shooting
Set scheduled inspection required for most preceding image obtained from the above-mentioned most preceding substrate of shooting is carried out for detecting above-mentioned predetermined operation
The image procossing of object is surveyed, and obtains area relevant to the region in the above-mentioned most preceding image that detected above-mentioned test object
Domain information and the processing for being stored in above-mentioned storage device；Above-mentioned subsequent substrate processing is on through the shooting of above-mentioned filming apparatus
It states in subsequent image obtained from subsequent substrate and part is set based on the above-mentioned zone information for being stored in above-mentioned storage device
Processing region, and the processing of above-mentioned image procossing is carried out to set above-mentioned processing region.
The disclosure executes the most preceding substrate in multiple substrates following most preceding substrate use to base board operation device
Reason, above-mentioned most preceding substrate are to carry out most preceding image obtained from the most preceding substrate of shooting for detecting needed for predetermined operation with processing
The image procossing for the scheduled test object wanted, and obtain and store and detected the area in the most preceding image of test object
The processing of the relevant area information in domain.In addition, being executed such as the subsequent substrate other than most preceding substrate in multiple substrates
Under subsequent substrate processing, continue in subsequent image obtained from substrate in the processing of above-mentioned subsequent substrate after the picture is taken and be based on
The area information stored in most preceding substrate processing carries out image procossing to the processing region to set local processing region
Processing.Thereby, it is possible to suitably be set in subsequent image based on the area information stored in most preceding substrate processing
The processing region of part.Also, in subsequent substrate processing, it does not regard subsequent image as processing region entirely, and for office
The processing region in portion carries out image procossing, therefore can be carried out efficiently image required for the operation for multiple substrates
Processing.
The image processing method of the disclosure is the image for shooting the image obtained from the substrate of carry out predetermined operation
Processing method, purport are, comprise the following steps that step (a), to the multiple of the object shot as above-mentioned predetermined operation
Most preceding image obtained from most preceding substrate in aforesaid substrate, it is scheduled required for carrying out for detecting above-mentioned predetermined operation
The image procossing of test object；Step (b), obtain with detected in above-mentioned steps (a) above-mentioned test object it is above-mentioned most
The relevant area information in region in preceding image；Step (c), in multiple above-mentioned bases of the shooting as the object of above-mentioned predetermined operation
In subsequent image obtained from the subsequent substrate other than above-mentioned most preceding substrate in plate, based in above-mentioned steps (b)
The above-mentioned zone information of acquirement sets local processing region；Step (d), in above-mentioned subsequent image in above-mentioned steps
(c) processing region set, the image procossing of scheduled test object required for carrying out for detecting above-mentioned predetermined operation.
The image processing method of the disclosure with it is above-mentioned identical to base board operation device, can be based in most preceding substrate use
The area information that is stored in reason and the processing region for suitably setting the part in subsequent image.It gets, in subsequent substrate use
In reason, it does not regard subsequent image as processing region integrally, and image procossing is carried out to the processing region of part, therefore can
Efficiently carry out image procossing required for the operation for multiple substrates.In addition, can be used in the image processing method
The above-mentioned various modes to base board operation device, or the knot for realizing above-mentioned each function to base board operation device can also be added
Structure.
Detailed description of the invention
Fig. 1 is the structure chart for indicating the structure of installation system 10.
Fig. 2 is the block diagram for indicating the structure of mounting device 11.
Fig. 3 is the flow chart for indicating an example of installation process program.
Fig. 4 is the flow chart for indicating an example of label detection processing.
Fig. 5 is the explanatory diagram for indicating the situation of the image procossing for first piece of substrate S.
Fig. 6 is the explanatory diagram for indicating the situation of image procossing of substrate S for second piece and later.
Fig. 7 is the explanatory diagram indicated to the processing region SR situation being adjusted.
Specific embodiment
Then, using attached drawing, embodiments of the present invention will be described.Fig. 1 is the knot for indicating the structure of installation system 10
Composition.Fig. 2 is the block diagram for indicating the composition of mounting device 11.Installation system 10 is, for example, to execute to the place of substrate S installation elements
The system of reason.The installation system 10 has: implementing to the mounting device 11 of the installation process of substrate S installation elements and is to installation
The management computer (PC) 50 that each device of system 10 is managed.Installation system 10 is from upstream to downstream and fills configured with multiple installations
Set 11.In Fig. 1, for ease of description, a mounting device 11 is only shown.In addition, installation process includes by element configuration, peace
It fills, be inserted into, engaging, the processing being adhered on substrate etc..In addition, in the present embodiment, left and right directions (X-axis), front-rear direction
(Y-axis) and up and down direction (Z axis) are as shown in Figure 1.
As shown in Figure 1 and Figure 2, mounting device 11 has: substrate supply unit 12, installation unit 13, component feeding unit
14, part camera 30 and control device 40.Substrate supply unit 12 be carry out the moving in, convey of substrate S, installed position is consolidated
Unit that is fixed, moving out.Substrate supply unit 12 is arranged at spaced intervals before and after having in Fig. 1 and sets up along left and right directions
A pair of of conveyer belt.By the conveyer belt come conveying substrate S.
Installation unit 13 is from 14 pickup device of component feeding unit, and on the substrate S for being fixed on substrate supply unit 12
Configuration.Installation unit 13 has a moving portion 20 and mounting head 22.Head moving portion 20 has by rail guidance and on the direction XY
The motor for carrying out mobile sliding part and sliding part being driven.Mounting head 22 is installed on sliding in a manner of removable
Part is moved on the direction XY by head moving portion 20.In the lower surface of mounting head 22, it is equipped in a manner of removable
More than one suction nozzle 24.Suction nozzle 24 is the pick-up part using negative pressure pickup device.Mounting head 22 is built-in with Z axis motor
23, the height of suction nozzle 24 is adjusted along Z axis by the Z axis motor 23.In addition, mounting head 22 has through drive (not shown)
Dynamic motor makes suction nozzle 24 rotate the rotating device of (rotation), can adjust holding (absorption) in the angle of the element of suction nozzle 24.
In the lower face side of the mounting head 22 (or sliding part) configured with label camera 25.Mark camera 25 along with installation
First 22 movement and moved on the direction XY.The label camera 25, which is shot, is attached to the reference mark M of substrate S, or from upper
The element supplied by component feeding unit 14 is just shot, and the image is exported to control device 40.
Component feeding unit 14 has from the nearby side feed element of mounting device 11 along left and right directions (X-direction)
The mode of arrangement is fitly arranged and come the tape feeder 15 of feed element and can pass through pallet by material strip
Carry out the pallet feeder 16 of feed element.Tape feeder 15 has the band for being wound with the material strip for being accommodated with element at a predetermined interval
Disk, by pulling out material strip from tep reel come feed element.Pallet feeder 16 supplies member using the pallet that element fitly arranges
Part.
Part camera 30 shoots the element for being adsorbed in the suction nozzle 24 of mounting head 22 from below, and by the image to control device
40 outputs.
As shown in Fig. 2, control device 40 is configured to the microprocessor centered on CPU41, has storage processing program
It is ROM42, the HDD43 of the various data of storage, the RAM44 used as operating area, electrical for being carried out between external device (ED)
Input/output interface 45 of the transmitting-receiving of signal etc..These components are connected via bus 46.The control device 40 is conveyed to substrate
Unit 12, installation unit 13, component feeding unit 14, the output control signal of part camera 30, and input and come from installation unit 13
The signal of (label camera 25), component feeding unit 14, part camera 30.
Managing PC50 is the computer being managed to the information of each device of installation system 10.Management PC50 has composition
For the control device of the microprocessor centered on CPU, which has the ROM of storage processing program, the various numbers of storage
According to HDD, used as operating area RAM, between external device (ED) carry out electric signal transmitting-receiving input it is defeated
Outgoing interface etc..Management PC50 has that input the input units 52 such as keyboard and mouse of various instructions, display for operator various
The display 54 of information.
It is the movement to the installation system 10 of the present embodiment constituted in this way below, specifically to mounting device 11
The explanation of installation process.Fig. 3 is the flow chart for indicating an example by the CPU41 of the control device 40 installation process program executed.
The program is stored in the HDD43 of control device 40, equal and input via the input unit 52 for managing PC50 according to operator
Installation process starts to indicate to execute.In addition, mounting device 11 carries out installation process to same kind of muti-piece substrate S.
When starting to execute the program, the CPU41 of control device 40 passes through substrate supply unit 12 first and carries out substrate S's
It moves in processing (S100), and executes the aftermentioned label detection processing (S110) for detecting the reference mark M of substrate S.Also,
The element that CPU41 will be adsorbed in the suction nozzle 24 of mounting head 22 installs (S120) to substrate S.CPU41 by the label of S110 to be examined
Survey processing and the position of reference mark M that detects is as benchmark, the installation site of element is corrected and in S120 to
Substrate S installation elements.CPU41 is before processing terminate for the whole elements for being judged to making a reservation for installing current substrate S
(S130), the processing of S120 is repeated.CPU41 is in the processing for being determined as predetermined whole elements to current substrate S installation
At the end of, substrate S is moved out (S140) by substrate supply unit 12, and determine that the processing for making a reservation for whole substrate S of installation is
No end (S150).CPU41 returns to S100 and repeats processing, determining when the processing for being determined as whole substrate S is not finished
When processing terminate for whole substrate S, make installation process EP (end of program).It is the explanation of the label detection processing of S110 below.Make
For an example of the label detection processing of S110, CPU41 is illustrated the case where super-resolution processing for using multiframe rebuilding type.
The super-resolution processing of multiframe rebuilding type is that the processing of the higher image of resolution ratio is obtained according to multiple images.Fig. 4 is to indicate to mark
Remember the flow chart of an example of detection processing.Fig. 5 is the explanatory diagram for indicating the situation of the image procossing for first piece of substrate S.Fig. 6
It is the explanatory diagram for indicating the situation of image procossing of substrate S for second piece and later.
In the label detection processing of Fig. 4, the CPU41 of control device 40 determines the base of the process object as this first
Plate S whether be in same kind of muti-piece substrate S most before (first piece) substrate S (S200).CPU41 be determined as be most before
Image A (referring to Fig. 5) (S210) when substrate S, by the shooting of label camera 25 as first image of most preceding substrate S.Separately
Outside, CPU41 moves mounting head 22 slightly using the head moving portion 20 of installation unit 13 and makes to mark camera 25 to substrate S's
After the offset of camera site, using the shooting of label camera 25 as the image B of second image of most preceding substrate S (referring to Fig. 5)
(S220).The camera site of image B is set as in such a way that CPU41 is able to carry out the super-resolution processing of multiframe, for example relatively
In the position that image A offsets by 1/X pixel (in addition, 1 < X, such as X=2).In addition, for the ease of illustration, Fig. 5 table
Show the image B of the shooting of the camera site after deviating greater than 1/X pixel.In addition, label camera 25 is opposite with the position of substrate S
Ground offset can make substrate S mobile, can also make to mark camera 25 (mounting head 22) mobile.Then, CPU41 is to image
A, B carries out image procossing and calculates the position deviation amount (S230) between image A and image B.For example, well known to CPU41 use
Template matching or pure phase correlation method etc. calculate the position deviation amount between image A and image B.In the present embodiment, CPU41
Position deviation amount is calculated using pure phase correlation method.In addition, pure phase correlation method is following known method, to as processing pair
Elephant image (herein be image A, B) carry out Fourier transformation, using only in the data after Fourier transformation phase component and
Phase component in amplitude component obtains correlativity.In addition, CPU41 is by the image used in the calculating of position departure
Data Da after the Fourier transformation of A is stored in HDD43 (S240).
Also, CPU41 executes the whole region of each image A, B based on the position deviation amount between image A and image B
Super-resolution processing, to obtain the high-definition picture (S250, referring to Fig. 5) on the basis of image A.Next, CPU41 is carried out
Following label detection processing, by extracted from obtained high-definition picture color (pixel value), shape, pixel number etc. with
Reference mark M (S260) is detected in consistent region reference mark M etc..In addition, CPU41 is according to the high score detected in S260
The position coordinates of reference mark M in resolution image carry out inverse operation, calculate the reference mark position Ma in image A and are stored in
(S270 referring to Fig. 5), and makes that detection processing is marked to terminate HDD43.For example, CPU41 is by the N pixel number in high-definition picture
Apart from inverse operation be image A in N/X pixel number distance etc., calculate base thus according to the position coordinates of reference mark M
Quasi- mark position Ma.In this way, CPU41 shoots this two images of image A and image B for the substrate S of (first piece) before most, for
The entire scope of these images executes super-resolution processing, to detect the position of reference mark M.In addition, CPU41 storage carries out most
The fiducial mark in data Da and image A after Fourier transformation when the label detection processing of preceding substrate S, first image A
Remember position Ma.In addition, the processing of S210~S270 is equivalent to most preceding substrate processing.
In addition, CPU41 be determined as in s 200 the substrate S of the process object as this be not most preceding substrate S but
At two pieces and subsequent substrate S later, (joined using the shooting of label camera 25 as the image C of first image of subsequent substrate S
According to Fig. 6) (S280).In addition, CPU41 moves mounting head 22 slightly using the head moving portion 20 of installation unit 13 and makes to mark
After camera 25 is to the camera site offset of substrate S, using the label shooting of camera 25 as second image of subsequent substrate S
Image D (referring to Fig. 6) (S290).Then, CPU41 carries out image procossing to image C, D and calculates between image C and image D
Position deviation amount (S300).CPU41 carries out the processing of S280~S300 identically as the processing of S210~S230.
Next, CPU41 reads from HDD43 and obtains in the label detection processing of the image A of most preceding substrate S
The reference mark position Ma (S310) in data Da and image A after the Fourier transformation of the image A stored in S240, S270.
Also, CPU41 calculates first image of the first image A and the subsequent substrate S as this process object of most preceding substrate S
Position deviation amount (S320) between C.In the present embodiment, CPU41 uses the Fourier of the image A read in S310 to become
After data Da after changing and while calculating position deviation amount in S320, have carried out the Fourier transformation of image C of Fourier transformation
Data calculate the position deviation amount between image A, C by pure phase correlation method.Here, image A, C are to different substrate S
Image is shot obtained from being shot, but due to shooting same kind of substrate S, is formed in the wiring pattern of substrate S
Or hole etc. is presented in the same manner in each image.But because the position of substrate S and label camera 25 when shooting image A, C are closed
System is not identical, but there are deviations, so there is also deviations for the position of the wiring pattern or hole that are presented in image.
CPU41 can detect such deviation as the phase component according to obtained from the data after Fourier transformation.Therefore,
CPU41 is calculating the position deviation between image A and image C based on the position deviation in these wiring patterns or hole in S320
Amount.Also, CPU41 according to the reference mark position Ma of the image A read in S310 and image A, C for being calculated in S320 it
Between position deviation amount, to determine rough position Mrc (S330, the reference of the general location as the reference mark M in image C
Fig. 6).In addition, the region of the part of image C, D is set as high-resolution based on the rough position Mrc determined in S330 by CPU41
Processing region SR (the S340, referring to Fig. 6) of rate processing.In addition, processing region SR can be set as centered on rough position Mrc
Such as several times of label diameter of reference mark M or so region or to label diameter add predetermined margin region etc..
Here, can be operator can be adjusted processing region SR by for example managing PC50 etc..In addition, operator
Region not centered on rough position Mrc and relative to rough position Mrc offset can be set as processing region SR, it can also be with
The size in region is finely adjusted.Fig. 7 is the explanatory diagram to the processing region SR situation being adjusted.Fig. 7 A is indicated with rough position
Set centered on Mrc and be respectively set as length in length and breadth the processing region SR of such as 4 times or so of the rectangle of label diameter D.
Fig. 7 B expression makes center C relative to the processing region SR of the rough position Mrc rectangle deviated.Fig. 7 C is indicated with rough position
Centered on Mrc and respectively to the treatment region of such as 2 times or so of rectangle of length progress size adjusting in length and breadth to label diameter D
Domain SR.Indicate there is the color such as element or solder or shape and reference mark M near reference mark M in the Fig. 7
The case where similar label similar department.It in this case, include marking class in processing region SR in the processing region SR of Fig. 7 A
Like portion, therefore there are error detections to go out a possibility that marking M.On the other hand, in the processing region SR of Fig. 7 B or Fig. 7 C, marking class
It is in except processing region SR like portion.Therefore, in the case where marking similar department to be near reference mark M, operator can
By being adjusted as Fig. 7 B or Fig. 7 C to processing region SR, to prevent the error detection of reference mark M.
When setting processing region SR in this way, CPU41 is based on the position deviation amount between image C and image D to each figure
As the processing region SR of C, D execute super-resolution processing and obtain the high resolution graphics on the basis of the processing region SR of image C
As (S350).Next, detection processing is marked to obtained high-definition picture to detect reference mark M in CPU41
(S360), and make that detection processing is marked to terminate.In addition, the processing of S280~S360 is equivalent to subsequent substrate processing.In this way,
Substrate S of the CPU41 for second piece and later, to the processing region SR execution super-resolution of this two images of image C and image D
Processing, to detect reference mark M.That is, because CPU41 is not to the whole region of image but only to the processing region SR of part
Super-resolution processing is executed, so can reduce the processing load of super-resolution processing and detection processing is promptly marked.
In addition, due to data Da when CPU41 is using the label detection processing for carrying out most preceding substrate S, after the Fourier transformation of image A
Calculate image A, C position deviation amount, and based on the reference mark position Ma in the position deviation amount and image A that use calculating and
The rough position Mrc of decision carrys out setting processing region SR, it is possible to and easily handling by comprising reference mark M can
The high appropriate area of energy property is set as processing region SR.Therefore, the super-resolution for detecting reference mark M can promptly be carried out
Rate processing.Therefore, even if the reference mark M for investing substrate S is minimum, mounting device 11 can also not improve label camera 25 certainly
In the case where the resolution ratio of body, reference mark M is suitably detected by super-resolution processing.
Here, between the constituent element of clear present embodiment and the constituent element to base board operation device of the disclosure
Corresponding relationship.The label camera 25 of present embodiment is equivalent to the filming apparatus of the disclosure, and HDD43 is equivalent to storage device, control
Device 40 processed is equivalent to image processing apparatus, and mounting device 11 is equivalent to base board operation device.In addition, in present embodiment
In, it is illustrated by the movement to mounting device 11, also specifies an example of the image processing method of the disclosure.
The mounting device 11 of embodiments described above is in the feelings that same kind of multiple substrate S are carried out with installation exercise
Under condition, following most preceding substrate is executed for first piece of most preceding substrate S and is handled, which makes to shooting most
Image A, B obtained from preceding substrate S carry out the super-resolution processing for detecting reference mark M required for installation exercise, and
And it obtains the reference mark position Ma in image A and is stored in the processing of HDD43.In addition, mounting device 11 for second piece and
Subsequent substrate S later executes following subsequent substrate processing, continues in substrate S obtained image C, D after the picture is taken, for
The processing region SR of the part set based on reference mark position Ma executes super-resolution processing.Mounting device 11 exists as a result,
Super-resolution processing is carried out for the processing region SR of part in subsequent substrate processing, can be carried out efficiently super-resolution
Rate processing.In addition, mounting device 11 is local to set based on the reference mark position Ma stored in most preceding substrate processing
Processing region SR, so being capable of more suitably setting processing region SR.In addition, the generation of high-definition picture uses multiple bats
Image is taken the photograph so processing is easy time-consuming, by being defined in local processing region SR, the significant effect of reduction processing time.
In addition, mounting device 11 is obtained based on the correlativity by obtaining image A, B in most preceding substrate processing
Position deviation amount and image A, B and high-definition picture is generated by super-resolution processing, detected from high-definition picture
Reference mark M out, and obtain the reference mark position Ma in image A and be stored in HDD43.Mounting device 11 is in subsequent substrate
With in processing based on position deviation amount and being stored in HDD43 as obtained from obtaining the correlativity between image A and image C
Reference mark position Ma come set in image C part processing region SR, based on by obtain image C, D in treatment region
Position deviation amount obtained from the correlation of domain SR detects reference mark from high-definition picture to generate high-definition picture
M.Mounting device 11 can be by based on the image A used in most preceding substrate processing and in subsequent substrate processing as a result,
Used in image C simply and easy treat, carry out super-resolution processing to set local processing region SR.
In addition, mounting device 11 uses in most preceding substrate processing has carried out the image of Fourier transformation to image A, B
Data and the position deviation amount that each image is obtained by pure phase correlation method, and by the data of the image A after Fourier transformation
Da is stored in HDD43.In addition, mounting device 11 uses in subsequent substrate processing when obtaining the correlativity of image A, C
It is stored in the data Da of HDD43 and implements the image data after Fourier transformation to image C.Mounting device 11 is rear as a result,
Using being stored in the data Da after the Fourier transformation of HDD43 i.e. when the correlativity of acquirement image A, C in continuous substrate processing
Can, so can be carried out efficiently.
In addition, mounting device 11 detects the reference mark M for being attached to the upper surface of substrate S by super-resolution processing.
Here, along with the miniaturization of substrate S and element in recent years, reference mark M also microminiaturization, therefore CPU41 is in order to be marked
Detection needs to carry out super-resolution processing to each substrate S.Therefore, efficiently super-resolution processing bring effect is carried out more
Significantly.
In addition, the present invention is by any restriction of above embodiment, as long as belonging to technical scope of the invention, so that it may
It is implemented in various ways, this is self-evident.
For example, in the above-described embodiment, being used in label detection processing for CPU41 and passing through multiple images acquirement point
The case where super-resolution processing of the multiframe rebuilding type of the higher image of resolution, is illustrated.But CPU41 is detected in label
Also other super-resolution processings can be used in processing.It is rebuild for example, single frames also can be used in label detection processing in CPU41
The super-resolution processing of type.The super-resolution processing of single frames rebuilding type is to obtain high-resolution figure according to an image A (or C)
The processing of picture.As the super-resolution processing of single frames rebuilding type, such as there is following mode etc., it is raw according to an image A (or C)
It is bad obtained from the deterioration process generated when imitating shooting according to interim high-definition picture at interim high-definition picture
Change image, calculates the error between deterioration image and original image A (or C), repeat to interim high-definition picture
The calculation process for carrying out the image correction of the margin of error, thus obtains final high-definition picture.In addition, CPU41 can also make
Use learning-oriented super-resolution processing as label detection processing.As learning-oriented super-resolution processing, such as there is following mode
Deng, CPU41 based on using with the image in different resolution of the image same degree shot by label camera 25 as training data, in advance
Learning outcome estimate and obtain high-resolution image.As learning-oriented super-resolution processing, CPU41, which can be used, to be based on
Learning outcome in advance and the learning-oriented super-resolution of single frames for estimating and obtaining high-definition picture from an image A (or C)
Processing.In addition, as learning-oriented super-resolution processing, CPU41 also can be used based on learning outcome in advance and from multiple figure
As A, B (or C, D) obtains the learning-oriented super-resolution processing of multiframe of the higher image of resolution ratio.
In the above-described embodiment, the data Da of the image A after Fourier transformation is stored in HDD43, but not limited to this,
Fourier transformation can also be carried out to image A in each correlativity obtained with image C.But, in order to efficiently carry out
Processing, is preferably stored in HDD43 for data Da in advance.
In the above-described embodiment, image A, C used as first image in most preceding substrate S and subsequent substrate S
Carry out setting processing region SR, but not limited to this, it also can be used as second image in most preceding substrate S and subsequent substrate S
Image B, D carry out setting processing region SR.In this case, in most preceding substrate processing, the benchmark in image B is stored
The position of M is marked, and stores the data of the image B after Fourier transformation.
In the above-described embodiment, super-resolution processing is instantiated as image procossing, but not limited to this, as long as
The image procossing for shooting image obtained from substrate S is shot, can be any processing.In addition, being not limited to use in detection substrate S's
The image procossing of reference mark also can detecte the label other than reference mark M for being attached to substrate S or 2 d code etc.
Other test objects.Moreover, being not limited to the image procossing before the installation of substrate S, also can be set to substrate S printing solder etc.
Image procossing before printing, or also can be set to the image procossing before the inspection carried out after element to be installed on to substrate S.
That is, in the above-described embodiment, mounting device 11 is instantiated as to base board operation device, but as long as being carried out to substrate S
The device of predetermined operation, can be set to the printing equipment printed to substrate S, also can be set to and examines to substrate S
The check device looked into.
In the above-described embodiment, high-definition picture is generated based on image A, B (or image C, D) the two images,
But not limited to this, high-definition picture can also be generated based on three or more multiple images.
Make aforesaid substrate and above-mentioned to above-mentioned image procossing use in base board operation device, is also possible in the disclosure
The position of filming apparatus relatively deviates and the multiple images that take generate the high high score of the above-mentioned multiple images of resolution ratio
The super-resolution processing of resolution image.Such high-definition picture is generated due to having used multiple images, so there is processing
Time extended tendency shortens the significant effect of processing time and being defined in local processing region.
It is used in above-mentioned most preceding substrate in the disclosure in base board operation device, being also possible to above-mentioned image processing apparatus
In processing, use comprising the above-mentioned multiple images including the first image and the second image as above-mentioned most preceding image, based on passing through
The position deviation amount between image obtained from the correlativity of above-mentioned multiple images is obtained to generate above-mentioned high-definition picture, from
Above-mentioned scheduled test object is detected in above-mentioned high-definition picture, and obtains the letter of the above-mentioned zone in above-mentioned first image
Above-mentioned storage device is ceased and is stored in, for above-mentioned image processing apparatus in the processing of above-mentioned subsequent substrate, obtaining includes third figure
As and the 4th image including above-mentioned multiple images as above-mentioned subsequent image, based on by obtain above-mentioned first image with it is above-mentioned
Position deviation amount between two images obtained from the correlativity of third image and it is stored in above-mentioned the first of above-mentioned storage device
Above-mentioned zone information in image sets the processing region of the part in above-mentioned third image, based on above-mentioned multiple by obtaining
Position deviation amount between image obtained from the correlativity of the above-mentioned processing region of setting in image generates above-mentioned high score
Resolution image detects above-mentioned scheduled test object from above-mentioned high-definition picture.So, it is able to use before most
First image used in substrate processing and third image used in handling in subsequent substrate suitably set part
Processing region.
It is used in above-mentioned most preceding substrate in the disclosure in base board operation device, being also possible to above-mentioned image processing apparatus
In processing, implement predetermined map processing using to comprising the above-mentioned multiple images including above-mentioned first image and above-mentioned second image
Obtained from image data obtain the correlativities of above-mentioned multiple images, and by above-mentioned predetermined map, that treated is above-mentioned in advance
The image data of first image is stored in above-mentioned storage device, above-mentioned image processing apparatus in the processing of above-mentioned subsequent substrate,
When obtaining the correlativity of above-mentioned first image and above-mentioned third image, made a reservation for using the above-mentioned of above-mentioned storage device is stored in
The image data of above-mentioned first image after conversion process and to above-mentioned third image implement predetermined map processing obtained from scheme
As data.So, when obtaining the correlativity of the first image and third image in subsequent substrate processing, storage is used
The image data of the first image after the scheduled conversion process of storage device, and the first image can not implemented
It is efficiently handled in the case where scheduled conversion process.
In the disclosure in base board operation device, above-mentioned scheduled test object is also possible to be attached to aforesaid substrate
The label of upper surface.Here, along with the miniaturization of substrate and element in recent years, the label for being attached to the upper surface of substrate has
It is the micro marks for being difficult to detect from the image taken by filming apparatus.In this case, right in order to detect label
Each substrate carries out super-resolution processing, and it is more significant efficiently to carry out image procossing bring effect.
Industrial applicability
The present invention can be used in the device for carrying out the operation for substrate.
The explanation of appended drawing reference
10 installation systems, 11 mounting devices, 12 substrate supply units, 13 installation units, 14 component feeding units, 15 belts
Loader, 16 pallet feeders, 20 moving portions, 22 mounting heads, 23Z axis motor, 24 suction nozzles, 25 label cameras, 30 parts
Camera, 40 control devices, 41CPU, 42ROM, 43HDD, 44RAM, 45 input/output interfaces (input and output I/F), 46 buses, 50
Manage computer (management PC), 52 input units, 54 displays, M reference mark, Mrc rough position, S substrate, SR treatment region
Domain.
Claims (6)
1. a kind of pair of base board operation device, which is characterized in that have:
Filming apparatus shoots substrate；
Storage device stores various information；And
Image processing apparatus executes most preceding base for the most preceding substrate in multiple substrates of the object as predetermined operation
Plate processing, after in multiple substrates of the object as the predetermined operation other than the most preceding substrate
Continuous substrate executes subsequent substrate processing, wherein the most preceding substrate processing is to shoot institute to by the filming apparatus
State scheduled test object required for most preceding image obtained from most preceding substrate is carried out for detecting the predetermined operation
Image procossing, and obtain area information relevant to the region in the most preceding image that detected the test object simultaneously
It is stored in the processing of the storage device；The subsequent substrate processing is described subsequent by filming apparatus shooting
Local treatment region is set based on the area information for being stored in the storage device in subsequent image obtained from substrate
Domain, and the processing of described image processing is carried out to the set processing region.
2. according to claim 1 to base board operation device, wherein
Described image processing is taken multiple using the position of the substrate and the filming apparatus is deviated relatively
Image generates the super-resolution processing of the high-definition picture of the high resolution of resolution ratio described multiple images.
3. according to claim 2 to base board operation device, wherein
Described image processing unit is in the most preceding substrate processing, using including the institute including the first image and the second image
Multiple images are stated as the most preceding image, based between the image as obtained from the correlativity for obtaining described multiple images
Position deviation amount generates the high-definition picture, detects from the high-definition picture the scheduled detection pair
As, and obtain the area information in the first image and be stored in the storage device,
Described image processing unit obtains in subsequent substrate processing comprising the institute including third image and the 4th image
Multiple images are stated as the subsequent image, based on the correlativity by obtaining the first image and the third image
Position deviation amount between two obtained images and the area information being stored in the first image of the storage device
Come set in the third image part processing region, based on by obtain described multiple images in setting the place
The position deviation amount between image obtained from the correlativity in region is managed to generate the high-definition picture, from the high-resolution
The scheduled test object is detected in rate image.
4. according to claim 3 to base board operation device, wherein
Described image processing unit is in the most preceding substrate processing, using to including the first image and second figure
Described multiple images as including implement image data obtained from predetermined map processing to obtain the correlation of described multiple images
Relationship, and the image data of the predetermined map treated the first image is stored in the storage device in advance,
Described image processing unit is obtaining the first image and the third image in subsequent substrate processing
When correlativity, the image data of the predetermined map for being stored in the storage device treated the first image is used
Implement image data obtained from predetermined map processing with to the third image.
5. according to any one of claim 1 to 4 to base board operation device, wherein
The scheduled test object is the label for being attached to the upper surface of the substrate.
6. a kind of image processing method is the image processing method for shooting the image obtained from the substrate of carry out predetermined operation
Method, described image processing method are characterised by comprising following step:
Step (a), to shooting as obtained from the most preceding substrate in multiple substrates of the object of the predetermined operation
Most preceding image, the image procossing of scheduled test object required for carrying out for detecting the predetermined operation；
Step (b) obtains and the region phase in the most preceding image that detected the test object in the step (a)
The area information of pass；
Step (c), shoot in multiple substrates as the object of the predetermined operation in addition to the most preceding substrate
In subsequent image obtained from subsequent substrate in addition, set based on the area information obtained in the step (b)
The processing region of part；
Step (d) carries out described pre- for detecting the processing region in the step (c) setting in the subsequent image
It is set for the image procossing of scheduled test object required for industry.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/006938 WO2018154691A1 (en) | 2017-02-23 | 2017-02-23 | Substrate working device and image processing method |
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| Publication Number | Publication Date |
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| CN110291852A true CN110291852A (en) | 2019-09-27 |
| CN110291852B CN110291852B (en) | 2021-01-26 |
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| US (1) | US10863661B2 (en) |
| EP (1) | EP3589105B1 (en) |
| JP (1) | JP6831446B2 (en) |
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| WO (1) | WO2018154691A1 (en) |
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| US11874679B2 (en) * | 2019-01-09 | 2024-01-16 | Mitsubishi Electric Corporation | Using an imaging device to correct positioning errors |
| US20220346296A1 (en) * | 2019-09-26 | 2022-10-27 | Fuji Corporation | Image processing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110291852B (en) | 2021-01-26 |
| US10863661B2 (en) | 2020-12-08 |
| EP3589105A4 (en) | 2020-02-26 |
| EP3589105B1 (en) | 2023-11-15 |
| US20200060052A1 (en) | 2020-02-20 |
| WO2018154691A1 (en) | 2018-08-30 |
| EP3589105A1 (en) | 2020-01-01 |
| JPWO2018154691A1 (en) | 2019-11-07 |
| JP6831446B2 (en) | 2021-02-17 |
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