JP2009272325A - Mounting apparatus for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus for electronic components equipped with an image aggregating device for determining whether the electronic component sucking position is good or not by integrally capturing images of each of electronic components sucked on a plurality of nozzles without using an expensive camera having high resolution and wide field of view. <P>SOLUTION: The mounting apparatus 2 for electronic component includes: a camera 30 for recognizing components which picks up a plurality of images G of an electronic component P sucked on each sucking nozzle 24 of a mounting head 22 having a plurality of sucking nozzles 24. In this case, a plurality of prisms 34 for capturing the incident lights of the plurality of images G of the electronic component P and aggregating the incident lights of the plurality of images G into a single field of view of the camera 30 for recognizing components, and the adjacent prisms 34 are densely arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component having an image aggregating device that aggregates images of electronic components adsorbed by each nozzle of a mounting device having a plurality of adsorption nozzles, captures the images in one field of view, and causes a component recognition camera to capture the images. It is related with the mounting apparatus.

  A component recognition camera such as a CCD is used to determine whether the electronic component mounted on the substrate is good or bad and the posture attracted by the nozzle of the mounting head. Since the electronic parts to be mounted are precise and small parts, a determination with a high resolution camera is required. In order to mount a plurality of types of electronic components at high speed, a so-called multi-nozzle in which a plurality of suction nozzles are mounted on the mounting head is used. It is more desirable in terms of production efficiency to collectively collect images of each electronic component sucked by the multi-nozzle and determine whether the electronic component suction posture or the like is good. However, in order to capture images with a wide field of view at once, a camera with a high resolution and a wide field of view is required, which requires high equipment costs. The resolution is still insufficient for recent ultra-small electronic components, so we are dealing with the method of increasing the magnification of the lens and increasing the resolution, but since the field of view is narrowed, all the components can be captured and processed at the same time. First, it took a long working time to acquire images of each part.

Therefore, the invention of Patent Document 1 forms a plurality of recognition regions within the component position recognition range, forms an optical path incident on the image input device (camera) for each recognition region, and is a portion to recognize the position of the component. The optical path is alternatively selected in accordance with the recognition region where is located. According to this, the image of the electronic component adsorbed by the plurality of nozzles can be captured and captured with a high-resolution image input device (camera) provided at one place.
Sho 62-179602

  However, although the invention of Patent Document 1 inputs a plurality of recognition ranges to an image input device, since it is performed by selecting an optical path alternatively, a plurality of images can be input simultaneously. Therefore, there was a problem that a quick decision could not be made.

  The object of the present invention is made in view of such conventional problems, and it is possible to display an image of each electronic component adsorbed by a multi-nozzle with a high resolution without using a large lens or an expensive camera with high pixels. It is an object to provide an electronic component mounting apparatus equipped with an image aggregating apparatus capable of determining whether the electronic component suction posture or the like is good by taking in a batch of images.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is a component that captures a plurality of images of an electronic component sucked by each suction nozzle of a mounting head provided with a plurality of suction nozzles. In an electronic component mounting apparatus including a recognition camera, a plurality of prisms that capture incident light of a plurality of images of the electronic component and aggregate the incident light of the plurality of images into one field of view of the component recognition camera The adjacent prisms are arranged without gaps.

  The structural feature of the invention according to claim 2 is that, in claim 1, the prism is capable of facing one of the electronic components sucked by the suction nozzle, and the optical axis of the lens of the component recognition camera. A first reflection surface that is provided on a peripheral portion side and reflects incident light of an image of the electronic component to the optical axis side, and is provided on the optical axis side in parallel with the first reflection surface, A second reflecting surface that reflects the incident light reflected from one reflecting surface so as to be parallel to the optical axis, and there is no gap between adjacent prisms at the optical axis side tip of each prism. Joining surfaces that can be joined are formed, and these prisms are arranged radially on a plane perpendicular to the optical axis of the lens of the component recognition camera.

  The structural feature of the invention according to claim 3 is that in claim 1 or 2, the number of the prisms is four, and they are arranged at equal intervals of 90 degrees on a plane perpendicular to the optical axis. is there.

  The structural feature of the invention according to claim 4 is that, in claim 3, the joint surface of the prism is formed by notching both angles equally 45 degrees around the optical axis on a plane perpendicular to the optical axis. It is formed.

  According to the first aspect of the present invention, the incident lights of the images of the plurality of electronic components sucked by the plurality of suction nozzles are aggregated by the plurality of prisms, but the adjacent prisms are arranged with no gap therebetween. Incident light of each image can be made closer to each other and further collected in a narrow range on the optical axis side of the lens of the component recognition camera. Therefore, without using an expensive large lens or high pixel camera, the images of each electronic component adsorbed by the multi-nozzle can be captured in a batch with a high resolution image to determine whether the electronic component is good or bad Can be quickly determined.

  According to the second aspect of the present invention, the incident light of the images of the plurality of electronic components adsorbed by the plurality of adsorption nozzles is emitted from the lens of the component recognition camera on the first reflecting surface of each prism arranged radially. The reflected incident light is reflected on the axis side and reflected by the second reflecting surface in parallel with the optical axis to be collected in the lens of the component recognition camera. Adjoining surfaces that are adjacent to each other with no gap between adjacent prisms are formed at the optical axis side tip of the prism. Then, by making the prisms adjacent to each other at the formed joint surface, the central part of the second reflecting surface of each prism is shifted to the optical axis side, so that the reflected image is moved to the optical axis side. The incident light of the plurality of images can be concentrated in one narrow field of view of the component recognition camera. Therefore, without using an expensive large lens or high pixel camera, the images of each electronic component adsorbed by the multi-nozzle can be captured in a batch with a high resolution image to determine whether the electronic component is good or bad Can be quickly determined.

  According to the third aspect of the present invention, it is possible to quickly and collectively judge whether or not the electronic components are sucked by the mounting head provided with the four suction nozzles.

  According to the fourth aspect of the invention, the incident light of the image of the electronic component is placed on the optical axis side of the lens of the component recognition camera with a simple configuration in which the prisms are notched at 45 degrees to join the adjacent prisms. The images can be collected together, and the images can be taken into the component recognition camera all at once to quickly judge whether or not the electronic component is good and the suction posture is good.

  An embodiment of an electronic component mounting apparatus provided with the image aggregation device of the present invention will be described below. FIG. 1 is a perspective view showing an outline of an electronic component mounting apparatus, and FIG. 2 is an enlarged view showing the main part.

  As shown in FIG. 1, the electronic component mounting apparatus 2 is provided with a substrate transfer device 4 that transfers the substrate S in the transfer direction (X direction). An elongated slide 6 extending in the Y direction perpendicular to the X direction is guided and supported on the upper side of the substrate transport device 4 by a fixed rail (not shown) extending in the X direction. It is controlled by an X direction servo motor (not shown) via a ball screw. On one side of the slide 6, a moving table 12 on which the substrate recognition camera 8 and the component transfer device 10 are mounted is guided and supported so as to be movable in the Y direction. It is controlled by a servo motor.

  The substrate recognition camera 8 has an LED light source (not shown) that is irradiated downward where the substrate S is disposed, and a vertical optical axis from below where the light from the irradiated LED light source is reflected from the substrate S. A refraction mirror (not shown) that is refracted in a direction, and a main body portion 14 that converts an image captured along the optical axis entering the horizontal direction by the refraction mirror into a digital signal.

  As shown in FIG. 2, the component transfer apparatus 10 is supported by a support base 20 that is detachably attached to the moving table 12, and is supported by the support base 20 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction. A mounting head 22 whose elevation is controlled by a Z-direction servo motor (not shown) via a ball screw, and a cylindrical suction nozzle 24 that protrudes downward from the mounting head 22 and sucks and holds the component P at its lower end. And composed of A plurality of (for example, four) cylindrical nozzle holders 26 are attached to the mounting head 22 so as to be rotatable about the axis. The suction nozzles 24 that can reciprocate vertically are attached to the nozzle holder 26, and each suction nozzle 24 is urged downward by a compression spring (not shown). The nozzle holder 26 is rotated intermittently by a motor (not shown) so that the suction nozzle 24 stops at a predetermined position.

  On one end side of the electronic component mounting apparatus 2, as shown in FIG. 1, an unillustrated component supply apparatus including a plurality of feeders arranged side by side in the X direction is provided. As shown in FIG. 2, a component recognition camera (CCD camera) 30 having an optical axis O1 parallel to the Z direction is provided on the base 1 between the substrate transfer device 4 and the component supply device. ing.

  The component recognition camera 30 is mounted so as to look upward from the base 1, and an image aggregating device 32 is fixed to a frame (not shown) above the component recognition camera 30. As shown in FIG. 4, the image aggregating apparatus 32 is configured by combining four prisms 34 radially at equal intervals of 90 degrees on a plane perpendicular to the optical axis O1. . As shown in FIGS. 6 to 8, each prism 34 includes a horizontal incident surface 34a, a first reflective surface 34b inclined by 45 degrees from the horizontal, and a second reflective surface 34c that faces the first reflective surface 34b in parallel. And a horizontal exit surface 34d that is inclined 45 degrees from the second reflecting surface 34c. In each prism 34, the two adjacent corners of the tip portion arranged on the center side (optical axis side) are equally cut out in the vertical direction by 45 degrees around the optical axis O1, and the tip becomes a right angle. It is formed as follows. The notched surface constitutes a joint surface 36, and the adjacent prisms 34 are joined to each other by the joint surfaces 36, thereby forming a cross shape and exiting from the exit surface 34d as shown in FIGS. The images G are gathered to the center, and are configured to fit within a narrow range of the lens 30a of the component recognition camera 30. The image G of the electronic component P sucked by the four suction nozzles 24 is collectively taken into the field of view of the component recognition camera 30 by the image aggregation device 32.

  Note that a clamp device (not shown) and a substrate backup device (not shown) are provided at the position of the substrate transport device 4 into which the substrate S is carried. This substrate backup device includes a pin support base (not shown) in which a plurality of pins that support the substrate S are erected and a lift device (not shown) that lifts and lowers the pin support base. The clamp device includes a pair of pressing portions (not shown). When the substrate S placed at the stop position of the substrate transfer device 4 is raised to the mounting position by the substrate backup device, the substrate S is moved to both sides in the Y direction. To be clamped and fixed by the presser part.

  The operation of the electronic component mounting apparatus 2 including the image aggregating apparatus 32 configured as described above will be described below. First, the substrate S is carried into the electronic component mounting apparatus 2 by the substrate transfer device 4, and the substrate S is stopped at a stop position on the substrate transfer device 4 by a sensor (not shown). The stopped substrate S is raised to the mounting position by the substrate backup device, and is clamped and fixed by the clamp device at the raised position. Then, the position of the substrate mark (not shown) provided on the substrate S is detected by the substrate recognition camera 8. The position is corrected based on the position of the board mark, and the slide 6 and the moving base 12 are moved in the X direction and the Y direction, and from the component supply device (not shown) to the tip of the suction nozzle 24 of the component transfer device 10. The sucked and held electronic component P is mounted on the commanded coordinate position on the substrate S. At this time, the suction nozzle 24 is temporarily stopped on the component recognition camera 30 while the electronic component P sucked and held at the tip of the suction nozzle 24 is moved from the component supply device to the commanded coordinate position on the substrate S. And whether the suction posture is good or bad is determined. The component recognition camera 30 detects a misalignment with respect to the axis of the suction nozzle 24 and an angle shift with respect to the axis of the suction nozzle 24 of the suctioned electronic component P as a material for judging whether or not the suction posture is good. At this time, the four electronic components P are attracted to the tips of the four suction nozzles 24, but the electronic components P are placed at the positions where the respective incident surfaces 34 a of the four prisms 34 of the image aggregating apparatus 32 are disposed. Position them to face each other. At this time, as shown in FIG. 3, the arrangement of the suction nozzle 24 is wider than the field of view of the component recognition camera 30 as a whole, but as shown in FIG. By gathering and gathering the images G, the four images G can be collected into the component recognition camera 30 at once. As a result, the misalignment and angular misalignment of the four electronic components P are simultaneously detected. Then, after correcting the suction nozzle 24 based on the detection result of the angular deviation, the movement amount in the X direction and the Y direction of the slide 6 and the movable table 12 is corrected based on the detection result of the misalignment, and the electronic component P is fixed. Mounting is accurately performed at the commanded coordinate position based on the substrate mark on the substrate S. Further, the quality of the electronic component P itself sucked by the suction nozzle 24 is also judged by the component recognition camera 30 at the same time. The electronic component P determined to be defective is discarded in a not-shown disposal box or the like, and only the electronic component P determined to be good is mounted on the substrate S.

  According to the electronic component mounting apparatus 2 provided with the image aggregating apparatus, as shown in FIG. 5, the incident light of the images G of the plurality of electronic components P sucked by the plurality of suction nozzles 24 is arranged radially. The first reflecting surface 34b of the prism 34 is reflected toward the optical axis O1 side of the lens 30a of the component recognition camera 30, and the reflected incident light is reflected by the second reflecting surface 34c in parallel with the optical axis to recognize the component. In the lens 30a of the camera 30 for use. At the front end of the prism 34 on the optical axis O1 side, an adjacent joint surface 36 is formed between the adjacent prisms 34 without a gap. Then, by causing the prisms 34 to be adjacent to each other at the formed joint surface 36, the central portion of the second reflecting surface 34c of each prism 34 is shifted to the optical axis O1 side. Can be brought closer to the optical axis O1 side, and the incident light of the plurality of images G can be concentrated in one narrow field of view of the component recognition camera 30. Therefore, without using a large lens or an expensive camera with high pixels, the images G of the respective electronic components P sucked by the multi-nozzles (plural suction nozzles 24) are collectively fetched as high-resolution images P. It is possible to quickly determine whether the electronic component P is good or bad and the suction posture is good.

  Further, as in this embodiment, the four prisms 34 are arranged radially at equal intervals of 90 degrees on a plane perpendicular to the optical axis O1, so that the mounting head 22 provided with the four suction nozzles 24 is provided. Therefore, it is possible to quickly and collectively judge whether the sucked electronic component P is good or bad. Further, the incident light of the image G of the electronic component P is collected on the optical axis side of the lens 30a of the component recognition camera 30 with a simple configuration in which both angles of the prism 34 are cut out by 45 degrees and the adjacent prisms 34 are joined. Therefore, it is possible to quickly determine the quality of the electronic component P, the quality of the suction posture, and the like by fetching the images G into the component recognition camera 30 at a low equipment cost.

  In the present embodiment, the image processing apparatus 32 is a combination of the four prisms 34 in order to correspond to the four suction nozzles 24 as a plurality of suction nozzles. However, the present invention is not limited to this. For example, FIG. As shown, six prisms 40 may be combined. As a result, the images of the electronic components P sucked by the six suction nozzles 24 can be collectively fetched by the component recognition camera 30.

  In addition, the prism 32 and the component recognition camera 30 are fixed between the component supply device and the substrate transfer device, but are not limited to those fixed in this way. For example, together with the mounting head The component recognition camera and the prism move. The component recognition camera and the prism may operate so as to approach the suction nozzle during imaging and to separate from the suction nozzle after imaging.

The perspective view which shows the outline | summary of the electronic component mounting machine in embodiment. The enlarged view which shows the principal part of the same FIG. FIG. 5 is a schematic diagram showing a route for taking images of the plurality of electronic components into a component recognition camera. The perspective view which shows the combined state of the prism. The schematic diagram which shows the reflection state of the said some image. The top view of the prism. The side view of the prism. The front view of the prism. The figure which shows another example of an image aggregation apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Electronic component mounting apparatus, 30 ... Component recognition camera, 30a ... Lens, 32 ... Image aggregation apparatus, 34 ... Image aggregation apparatus (prism), 34b ... 1st reflective surface, 34c ... 2nd reflective surface, 36 ... Bonding Surface, O1 ... optical axis, P ... electronic component, S ... substrate.

Claims (4)

In an electronic component mounting apparatus including a component recognition camera that captures a plurality of images of an electronic component sucked by each suction nozzle of a mounting head provided with a plurality of suction nozzles,
A plurality of prisms that capture incident light of a plurality of images of the electronic component and aggregate the incident light of the plurality of images in one field of view of the component recognition camera, and each adjacent prism is arranged without a gap. An electronic component mounting apparatus characterized by comprising: 2. The electronic component according to claim 1, wherein the prism can be opposed to one of the electronic components sucked by the suction nozzle and is provided on a peripheral side with respect to an optical axis of a lens of the component recognition camera. A first reflecting surface that reflects the incident light of the image on the optical axis side, and the first reflecting surface that is provided on the optical axis side in parallel with the first reflecting surface, and the incident light reflected from the first reflecting surface is the light. A second reflecting surface that reflects so as to be parallel to the axis,
A joint surface is formed at the tip of each prism on the optical axis side so that the prisms can be joined with no gap between them, and these prisms are radial on a plane perpendicular to the optical axis of the lens of the component recognition camera. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is arranged in an array.   3. The electronic component mounting apparatus according to claim 1, wherein the number of the prisms is four, and the prisms are arranged at equal intervals of 90 degrees on a plane perpendicular to the optical axis.   4. The electronic component mounting according to claim 3, wherein the joint surface of the prism is formed by notching both angles equally 45 degrees around the optical axis on a plane perpendicular to the optical axis. apparatus.

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