JP7045614B2 - Bonding equipment - Google Patents

Description

The present invention relates to a substrate bonding apparatus in which a chip is held by a bonding tool.

In the process of manufacturing a semiconductor device, a bonding step of bonding a semiconductor chip (hereinafter, simply abbreviated as "chip") to a substrate by ultrasonic bonding or the like is executed. Since high position accuracy is required for bonding, a method of correcting a position error during bonding by image recognition is widely used. When the chip to be bonded is a flip chip having a bump for connection on the lower surface, a technique is known in which both the upper surface of the substrate and the lower surface of the chip are simultaneously imaged and position-corrected prior to bonding. (For example, Patent Document 1).

In the prior art shown in this example of the patent document, an electrode position observation mechanism for simultaneously observing a connection electrode provided on a carrier tape and a chip in a state facing each other immediately before bonding on a flip chip bonder used for manufacturing a semiconductor device. Is provided. In this electrode position observation mechanism, a prism-type mirror provided so as to be retractable is advanced between the chip and the carrier tape, and the image reflected on the two reflecting surfaces of the prism-type mirror is captured by the camera.

Japanese Unexamined Patent Publication No. 2001-176934

However, the prior art shown in the above-mentioned example of the patent document has the following problems in achieving high productivity while ensuring high position accuracy. That is, in order to improve the productivity of the bonding apparatus, it is required to reduce the ascending / descending height of the bonding tool in each bonding operation to shorten the tact time. However, in the above-mentioned electrode position observation mechanism, since it is necessary to advance the prism type mirror between the chip held by the bonding tool and the carrier tape, the standby height of the bonding tool immediately before bonding is the thickness of the prism type mirror. Constrained by dimensions. For this reason, it is difficult to reduce the elevating height of the bonding tool in each bonding operation to shorten the tact time, which results in hindering the improvement of productivity. As described above, the conventional bonding apparatus has a problem that it is difficult to realize high productivity while ensuring high position accuracy.

Therefore, an object of the present invention is to provide a bonding apparatus capable of achieving high productivity while ensuring high position accuracy.

In the bonding apparatus of the present invention, the bonding tool holds the chip, and the bonding tool is lowered in the direction of the stage on which the substrate is placed so as to face the chip, and the chip is bonded to the bonding position of the substrate. In the bonding apparatus, when the image of the chip is incident between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and the first incident port is used. The light is emitted upward from the first exit port horizontally separated from the light source, and the image of the bonding position of the substrate is incident from the second incident port facing the bonding position in the horizontal direction from the first incident port. A movable light guide body that emits light upward from a second exit port separated from the above, a first light guide body that incidents and emits an image of the chip emitted from the first exit port, and the first light guide body. A first image pickup unit that captures an image of the chip emitted from the light guide, a second light guide that incidents and emits an image of the bonding position emitted from the second outlet, and the above. The image of the chip imaged by the second imaging unit, the image of the chip imaged by the first imaging unit, and the image captured by the second imaging unit are captured by the second imaging unit that captures the image of the bonding position emitted from the second light guide. The bonding tool and the stage are relative to each other based on the detection means for detecting the relative positional deviation between the chip and the bonding position based on the image of the bonding position and the positional deviation detected by the detecting means. The alignment means for moving the movable light guide body in the space between the chip and the substrate located above the bonding position, the first image pickup unit and the second image pickup unit, and the second image pickup unit. The image pickup unit moving means for moving the image pickup unit relative to the first light guide body and the second light guide body is provided.

In the bonding apparatus of the present invention, the bonding tool holds the chip, and the bonding tool is lowered in the direction of the stage on which the substrate is placed so as to face the chip, and the chip is bonded to the bonding position of the substrate. In the bonding apparatus, when the image of the chip is incident between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and the first incident port is used. The light is emitted upward from the first exit port horizontally separated from the light source, and the image of the bonding position of the substrate is incident from the second incident port facing the bonding position in the horizontal direction from the first incident port. A movable light guide body that emits light upward from a second exit port that is separated from the above, and a first partial image that is a part of an image of the chip emitted from the first exit port are incident and emitted. One of the light guide body, the first image pickup unit that captures the first partial image emitted from the first light guide body, and the image of the bonding position emitted from the second exit port. A second light guide body that incidents and emits a second partial image, which is a unit, a second image pickup unit that captures the second partial image emitted from the second light guide body, and the second image pickup unit. A third light guide body that incidents and emits a third partial image that is a part different from the first partial image of the image of the chip emitted from the exit port 1, and the third light guide. The third image pickup unit that captures the third partial image emitted from the body and the second partial image of the bonding position image emitted from the second exit port are different parts. A fourth light guide body that incidents and emits a fourth partial image, a fourth image pickup unit that captures the fourth partial image emitted from the fourth light guide body, and the first image pickup. The first partial image captured by the unit, the second partial image captured by the second imaging unit, the third partial image captured by the third imaging unit, and the fourth partial image. The detection means for detecting the relative positional deviation between the chip and the bonding position based on the fourth partial image captured by the imaging unit, and the positional deviation detected by the detection means. The first alignment means for relatively moving the bonding tool and the stage, and the moving means for moving the movable light guide body back and forth in the space between the chip and the substrate located above the bonding position. The image pickup unit, the second image pickup unit, the third image pickup unit, and the fourth image pickup unit The first light guide body, the second light guide body, the third light guide body, and the image pickup unit moving means for relatively moving the third light guide body and the fourth light guide body are provided.

According to the present invention, high productivity can be realized while ensuring high position accuracy in the bonding apparatus.

Perspective view of the bonding apparatus according to the embodiment of the present invention. Side view of the bonding apparatus according to the embodiment of the present invention Front view of the bonding apparatus according to the embodiment of the present invention. Bottom view of the image pickup unit equipped in the bonding apparatus according to the embodiment of the present invention. Sectional drawing of the image pickup unit equipped in the bonding apparatus of one Embodiment of this invention An operation explanatory view of the bonding apparatus according to the embodiment of the present invention. A perspective view showing the configuration of a movable light guide body in the bonding apparatus according to the embodiment of the present invention. Explanatory drawing of an image pickup unit used for image pickup of a chip and a bonding position by the bonding apparatus of one Embodiment of this invention, and an image pickup field of view acquired. Explanatory drawing of image acquisition path in image pickup of chip and bonding position by bonding apparatus of one Embodiment of this invention Schematic diagram of the configuration of the optical head of the bonding apparatus according to the embodiment of the present invention. Schematic diagram of the configuration of the upper lighting unit and the lower lighting unit mounted on the movable light guide in the bonding apparatus according to the embodiment of the present invention. Sectional drawing of the movable optical unit in the bonding apparatus of one Embodiment of this invention A block diagram showing a configuration of a control system of a bonding apparatus according to an embodiment of the present invention.

Next, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the bonding apparatus 1 having a function of bonding chips such as semiconductor chips to the bonding positions of the substrate will be described with reference to FIGS. 1, 2, and 3. In FIG. 1, the bonding apparatus 1 includes a chip supply unit 2, a substrate holding unit 3, a bonding mechanism 4, and a control unit 5 that controls each of these units.

The chip supply unit 2 has a function of supplying a chip, which is a component to be bonded. As shown in FIG. 2, the chip supply unit 2 includes a supply stage 11 arranged on the upper surface of the first XY table 10. The wafer sheet 13 is held in a stretched state on the upper surface of the supply stage 11, and the chip 14 in a state of being divided into individual pieces is placed on the upper surface of the wafer sheet 13 in a posture in which the active surface on which the bump is formed faces upward. It is pasted with. By driving the first XY table 10, the supply stage 11 can move in the X direction and the Y direction, and can be positioned at the extraction position [P1] of any chip 14 to be extracted.

As shown in FIG. 1, a pickup head 15 is coupled to the tip of an arm portion extending from the pickup head drive portion 16. By driving the pickup head drive unit 16, the pickup head 15 moves between the take-out position [P1] of the chip 14 above the supply stage 11 and the delivery position pickup position [P2] to the bonding mechanism 4. In the pickup of the chip 14, the chip 14 to be picked up is peeled off from the wafer sheet 13 by operating the ejector 12 arranged on the lower surface side of the wafer sheet 13. The peeled chip 14 is held by the pickup head 15 in a posture in which the active surface faces upward.

The pickup head 15 holding the chip 14 at the take-out position [P1] rises and moves to the pickup position [P2] by the bonding head 26 of the bonding mechanism 4 (arrow c). By turning the pickup head 15 upside down (arrow d) during this movement, the pickup head 15 is in a state of holding the chip 14 in a posture in which the active surface is facing downward at the pickup position [P2]. The pickup head 15 and the pickup head drive unit 16 constitute a chip transfer unit 17 that transfers the chip 14 taken out from the chip supply unit 2 at the take-out position [P1] to the pickup position [P2] by the optical head 30.

Next, the configuration of the substrate holding portion 3 will be described. As shown in FIGS. 1 and 2, a substrate holding stage 21 holding the substrate 22 to be bonded is arranged on the upper surface of the second XY table 20. By driving the second XY table 20, the substrate holding stage 21 moves in the X direction and the Y direction. As a result, the bonding position 22a (see FIG. 6) set on the substrate 22 can be positioned at the working position [P3]. The chip 14 is bonded to the bonding position 22a aligned with the working position [P3] by the bonding tool 29 of the bonding mechanism 4 described below.

The configuration of the bonding mechanism 4 will be described. As shown in FIGS. 1 and 2, the Y-axis frame 23 is horizontally arranged in the Y direction above the chip supply unit 2 and the substrate holding unit 3. A linear motor 24 having two rows of guide rails 25 is arranged along the side surface of the Y-axis frame 23. The guide rail 25 extends horizontally above the substrate holding stage 21 (stage). A first moving base 26a is movably mounted on the guide rail 25 via the slider 25a (FIG. 3). Further, the guide rail 25 is equipped with a second moving base 30a that can move along the guide rail 25 independently of the first moving base 26a.

A bonding head 26 is attached to the first moving base 26a. The bonding head 26 has a configuration in which the bonding tool 29 is held by the bonding tool holding unit 28 driven by the bonding tool driving unit 27. By driving the bonding tool driving unit 27 while the chip 14 is held by the bonding tool 29, the bonding tool 29 is lowered and the held chip 14 is bonded to the bonding position 22a of the substrate 22 (see FIG. 6). That is, in the bonding apparatus 1 shown in the present embodiment, the bonding tool 29 holds the chip 14, and the bonding tool 29 is lowered in the direction of the substrate holding stage 21 on which the substrate 22 is placed so as to face the chip 14. , The work of joining the chip 14 to the bonding position 22a of the substrate 22 is performed.

A light source box 31 is mounted on the second moving base 30a. As shown in FIG. 2, a movable optical unit 32 having a movable prism 32a (see FIG. 7), which is a movable light guide, is coupled to an arm portion 31a extending downward from the lower part of the light source box 31. .. Here, the arm portion 31a is provided so as to be bent toward the bonding head 26, and the movable prism 32a is offset toward the bonding head 26 with respect to the center of the optical head 30.

By driving the linear motor 24, the first moving base 26a and the second moving base 30a move along the guide rail 25, whereby the bonding head 26 and the optical head 30 move in the Y direction. Therefore, the linear motor 24 and the guide rail 25 are moving means for moving the bonding head 26 and the optical head 30.

That is, this moving means moves the bonding head 26 between the pickup position [P2] where the bonding tool 29 picks up the chip 14 and the working position [P3] where the chip 14 is bonded, and is movable with a movable prism 32a built-in. The optical head 30 is moved in order to move the optical unit 32 in and out of the working position [P3].

Then, by moving the optical head 30, the movable prism 32a, which is a movable light guide body built in the movable optical unit 32, is moved back and forth in the space between the chip 14 located above the bonding position 22a and the substrate 22. It has a function. As described above, by configuring the bonding head 26 and the optical head 30 to operate by the same moving means, it is possible to simplify the mechanism of the bonding apparatus and reduce the equipment cost.

As shown in FIG. 3, on the lower surfaces of the Y-axis frame 23 and the linear motor 24, the image pickup unit 34 shown in FIG. 4 is placed in the X direction via the base portion 35a of the image pickup section moving mechanism 35 which is the image pickup section moving means. It is mounted so that it can be moved in the Y direction. The image pickup unit 34 has four image pickup units individually provided with a camera. Further, on the lower surface of the linear motor 24, the upper left prism 45 (first light guide body), the upper right prism 46 (third light guide body), and the lower left prism 47 (second light guide body) shown in FIGS. A fixed optical unit 33 incorporating a light guide) and a lower right prism 48 (fourth light guide) is arranged. In the present embodiment, by combining the image pickup unit 34 with the movable optical unit 32 and the movable optical unit 32 that moves back and forth between the chip 14 and the substrate 22, the chip 14 and the substrate 22 are imaged by the image pickup unit 34. I have to.

As shown in FIGS. 2 and 3, a pair of spot lights 36 are arranged on the upper part of the Y-axis frame 23 so as to sandwich the work position [P3] from both sides. The spot illumination 36 is held by the tip of the holding bracket 36a extending from the Y-axis frame 23, and is arranged in a posture in which the irradiation direction is directed toward the movable optical unit 32 located at the working position [P3]. The illumination light emitted from the spot illumination 36 is incident on the movable prism 32a in the movable optical unit 32 and is irradiated to the bonding position 22a of the substrate 22 (see FIG. 12). That is, the spot illumination 36 is an illumination means for irradiating the substrate 22 with illumination light from above.

Next, with reference to FIGS. 4 and 5, the structure of the image pickup unit moving mechanism 35 for moving the image pickup unit 34 and the image pickup unit 34 will be described. FIG. 4 shows the lower surface of the image pickup unit 34 shown in FIG. 3, and FIG. 5 shows a cross section taken along the line AA in FIG. The base portion 35a shown in FIG. 4 is a rectangular base plate, and is mounted on the lower surface of the Y-axis frame 23 and the linear motor 24 (see FIG. 3). That is, in the present embodiment, the first image pickup means and the second image pickup means (see the description in FIG. 8) constituting the image pickup unit 34 are the moving means for moving the bonding head 26 and the optical head 30. It is configured to be mounted on the lower surface of the Y-axis frame 23 that supports the 24 or the moving means.

The configuration of the image pickup unit moving mechanism 35 will be described. A slider 37a fixed to a substantially rectangular X-direction moving table 35X is slidably fitted to a pair of guide rails 37 arranged in the X direction at both ends of the base portion 35a in the Y direction. An X-axis nut member 39X is arranged at an extension portion provided at one end of the X-direction moving table 35X in the Y direction. A feed screw 39Xa rotationally driven by the image pickup unit X-axis motor 34X is screwed into the X-axis nut member 39X. By driving the image pickup unit X-axis motor 34X in the forward and reverse directions, the X-direction moving table 35X reciprocates in the X direction. The image pickup unit X-axis motor 34X, the X-axis nut member 39X, and the feed screw 39Xa constitute a first movement mechanism included in the image pickup unit movement mechanism 35.

A plurality of sliders 38a fixed to the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 are slidably fitted to the pair of guide rails 38 arranged on the X-direction moving table 35X. In each of the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, a first Y-axis nut member 39Y1 and a second Y-axis nut member 39Y2 are provided at the extending portions provided at one end in the X direction, respectively. Have been placed. A feed screw 39Ya rotationally driven by the image pickup unit Y-axis motor 34Y is screwed into the first Y-axis nut member 39Y1 and the second Y-axis nut member 39Y2.

Here, the feed groove formed in the feed screw 39Ya has opposite pitch directions in the range screwed into the first Y-axis nut member 39Y1 and the range screwed into the second Y-axis nut member 39Y2. By driving the image pickup unit Y-axis motor 34Y in the forward and reverse directions, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 move in directions that approach or separate from each other in the Y direction. The image pickup unit Y-axis motor 34Y, the first Y-axis nut member 39Y1, the second Y-axis nut member 39Y2, and the lead screw 39Ya constitute a second movement mechanism included in the image pickup unit moving mechanism 35.

In the above configuration, since the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 are fixedly arranged on the X-direction moving table 35X, the first Y is driven by driving the above-mentioned first moving mechanism. The direction moving table 35Y1 and the second Y direction moving table 35Y2 move in the same direction and the same distance. Further, by driving the above-mentioned second moving mechanism, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 can be moved by the same distance in opposite directions.

In the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, the upper left image pickup unit 41 (first image pickup unit), the upper right image pickup unit 43 (third image pickup unit), and the lower right image pickup unit 43 constituting the image pickup unit 34, respectively. The left imaging unit 42 (second imaging unit) and the lower right imaging unit 44 (fourth imaging unit) are arranged in the X direction.

Here, the configuration of the imaging unit constituting the imaging unit 34 will be described. These image pickup units are configured such that incident portions and cameras are attached to both ends of a cylindrical lens barrel portion, and coaxial illumination is arranged on the side surface of the lens barrel portion located between the incident portion and the camera. In this configuration, the elephant to be imaged that is vertically incident on the incident portion is transmitted horizontally through the lens barrel and is incident on the camera, whereby the image to be imaged is acquired. At this time, the illumination light from the coaxial illumination is irradiated by the half mirror in the direction toward the image pickup target along the image pickup optical axis, and is incident on the image pickup target from the coaxial direction.

Specifically, the upper left image pickup unit 41, which is the first image pickup unit, has an upper left lens barrel unit 41a, an upper left coaxial illumination 41b, an upper left camera 41c, which is the first camera, and an upper left incident unit 41d. The upper right image pickup unit 43, which is the third image pickup unit, has an upper right lens barrel unit 43a, an upper right coaxial illumination 43b, an upper right camera 43c, which is a third camera, and an upper right incident unit 43d. ing. Similarly, the lower left image pickup unit 42, which is the second image pickup unit, has a lower left lens barrel unit 42a, a lower left coaxial illumination 42b, a lower left camera 42c, which is a second camera, and a lower left incident unit 42d. The lower right image pickup unit 44 has a lens barrel unit 44a, a lower right coaxial illumination 44b, a lower right camera 44c which is a fourth camera, and a lower right incident unit 44d.

As shown in the example of the upper left image pickup unit 41 and the upper right image pickup unit 43 in FIG. 5, the upper left lens barrel portion 41a and the upper right lens barrel portion 43a are holding brackets coupled to the lower surface of the first Y direction moving table 35Y1. It is held by 41e and 43e. A fixed optical unit 33 fixed to the base portion 35a is located above the upper left incident portion 41d and the upper right incident portion 43d. The fixed optical unit 33 has a configuration in which an upper left prism 45, an upper right prism 46, a lower left prism 47, and a lower right prism 48 are built in the storage portion 33a. The upper left prism 45, the upper right prism 46, the lower left prism 47, and the lower right prism 48 internally reflect images incident from the incident edges 45a, 46a, 47a, and 48a, and the exit edges 45b, 46b, 47b, It has a function of emitting downward from 48b (see FIG. 8).

The fixed optical unit 33 divides the upper and lower two-field images of the chip 14 and the bonding position 22a captured by the movable optical unit 32 described below into two left and right chip images and two left and right bonding position images. It has a function of transmitting to one image pickup unit. That is, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are located above the exit edge portions 45b, 47b, 46b, and 48b shown in FIG. 8, respectively. The left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are aligned. This alignment is performed using the function of the image pickup unit moving mechanism 35 described above.

That is, the image pickup unit moving mechanism 35, which is an image pickup unit moving means, includes an upper left image pickup unit 41 (first image pickup unit), a lower left image pickup unit 42 (second image pickup unit), and an upper right image pickup unit 43 (third image pickup unit). The upper left prism 45 (first light guide), the lower left prism 47 (second light guide), and the upper right prism 46 (the image pickup unit) and the lower right image pickup unit 44 (fourth image pickup unit). The third light guide body) and the lower right prism 48 (fourth light guide body) are moved relative to each other. As a result, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are aligned with the exit edge portions 45b, 47b, 46b, 48b.

FIG. 6 shows the vertical two-direction recognition in the bonding operation performed by the bonding device 1 and the subsequent bonding operation. That is, prior to the execution of the bonding operation, as shown in FIG. 6A, the bonding tool 29 holding the chip 14 is positioned above the bonding position 22a, and the movable optical unit is located between the bonding position 22a and the chip 14. Advance 32.

Here, since the movable optical unit 32 is offset toward the bonding head 26 with respect to the center of the optical head 30, the bonding position 22a does not cause interference between the optical head 30 and the bonding head 26. It is possible to position the movable optical unit 32 between the chip 14 and the chip 14. Imaging and position recognition of the chip 14 and the bonding position 22a by the imaging unit 34 are performed in this state. The chip 14 and the elephant at the bonding position 22a incident on the movable optical unit 32 are incident on the image pickup unit 34 via the fixed optical unit 33 fixed upward (see FIG. 8).

When the imaging and position recognition for one chip 14 are completed, the optical head 30 is moved in the retracting direction (arrow e) as shown in FIG. 6 (b). As a result, the movable optical unit 32 retracts from between the bonding position 22a and the chip 14 (arrow f), and the space between the bonding position 22a and the chip 14 becomes free. Then, in this state, by driving the bonding tool driving unit 27 to lower the bonding tool 29 (arrow g), the bonding head 26 joins the chip 14 held by the bonding tool 29 to the bonding position 22a of the substrate 22.

At this time, the positioning of the chip 14 with respect to the bonding position 22a is performed to reflect the above-mentioned position recognition result. In this position recognition, the chip 14 and the bonding position 22a are simultaneously imaged immediately before the chip 14 is mounted to detect these relative positional deviations. As a result, it is possible to detect the misaligned state with high accuracy, and it is possible to secure a highly accurate bonding result.

Next, with reference to FIG. 7, the configuration and function of the movable prism 32a incorporated in the movable optical unit 32 will be described. As described above, the movable optical unit 32 is free to move back and forth between the chip 14 and the substrate 22. When the movable prism 32a is located between the chip 14 located above the bonding position 22a of the substrate 22 and the substrate 22, the image of the chip 14 and the image of the bonding position 22a are transferred to the fixed optical unit 33 located above. Has the function of transmitting.

In FIG. 7, the movable prism 32a is a multi-faceted reflective prism made of a translucent member, and is a pair of substantially rhombic first block bodies 53 (first light guide body) and second block body 54 (second). The main body is a prism body in which the sharp-angled end portions of the light guide body) are connected via a rectangular parallelepiped reflector 50. The reflector 50 has a configuration in which the hypotenuses of the first light guide 51 and the second light guide 52 having a right-angled triangular column shape are combined and combined, and the upper surface and the lower surface of the combined surface are reflective surfaces that reflect light ( It functions as a first reflecting surface 71 and a fifth reflecting surface 75). The hypotenuse surfaces provided at the left and right ends of the first block body 53 and the second block body 54 are reflective surfaces (second reflective surface 72, third reflective surface 73, sixth reflective surface) that reflect light inside the member. 76, functioning as the seventh reflecting surface 77).

The upper surface of the first light guide body 51 and the lower surface of the second light guide body 52 are a first incident port 61 and a second incident port 62 for incident an image to be imaged, respectively. When the movable prism 32a is positioned between the chip 14 and the substrate 22, the reflector 50 is aligned so as to be located between the chip 14 and the substrate 22. In this state, the first incident port 61 and the second incident port 62 are located at positions facing the bonding positions 22a (see FIG. 6) of the chip 14 and the substrate 22, respectively.

On the outer surface of the right end of the first block body 53 and the second block body 54, a fifth light guide body 55 and a sixth light guide 56 having a right-angled triangular column shape are formed on one right-angled surface, respectively. It is provided so as to be flush with the upper surface of the block body 53 of 1 and the upper surface of the second block body 54. The oblique side surfaces of the fifth light guide body 55 and the sixth light guide body 56 are reflective surfaces (fourth reflective surface 74,) that upwardly reflect light incident from the side of the first block body 53 and the second block body 54. It functions as an eighth reflecting surface 78). The upper surfaces of the fifth light guide body 55 and the sixth light guide body 56 are a first outlet 63 and a second outlet 64 that emit the reflected light. Here, the first exit port 63 and the second exit port 64 are provided at positions horizontally separated from the first incident port 61 and the second incident port 62.

Further, on the outer surface of the left end portion of the first block body 53 and the second block body 54, a seventh light guide body 57 and an eighth light guide 58 having a right-angled triangular column shape are formed on one right-angled surface, respectively. Is provided so as to be flush with the lower surface of the first block body 53 and the second block body 54. The seventh light guide body 57 and the eighth light guide body 58 have a function of guiding the illumination light emitted from the spot illumination 36 to the bonding position 22a.

Details of the function of the movable prism 32a in imaging the chip 14 and the bonding position 22a will be described. When the movable prism 32a is located between the chip 14 and the substrate 22, the image of the chip 14 is incident from the first incident port 61 facing the chip 14, and the elephant of the bonding position 22a is referred to as the bonding position 22a. It is incident from the opposite second incident port 62.

Next, the image of the chip 14 incident from the first incident port 61 is reflected in the first horizontal direction (arrow h1) by the first reflecting surface 71 of the reflector 50. At the same time, the image of the bonding position 22a incident from the second incident port 62 is reflected by the fifth reflecting surface 75 of the reflector 50 in the second horizontal direction (arrow h2) opposite to the first horizontal direction. (See also FIG. 9 (b)).

Next, the image of the chip 14 reflected in the first horizontal direction is sequentially reflected by a plurality of chip image reflecting surfaces (second reflecting surface 72, third reflecting surface 73, and fourth reflecting surface 74), and first. It leads to the exit port 63 of. At the same time, the image of the bonding position 22a reflected in the second horizontal direction is sequentially reflected by the plurality of substrate image reflecting surfaces (sixth reflecting surface 76, seventh reflecting surface 77, and eighth reflecting surface 78). It leads to the exit port 64 of 2.

The plurality of chip image reflecting surfaces provided on the first block body 53 are arranged directly below the first exit port 63, and the first final image of the horizontally incident chip 14 is reflected directly above. At least one first upright reflecting surface (second reflection) that guides the image of the reflecting surface (fourth reflecting surface 74) and the chip 14 horizontally reflected by the first reflecting surface 71 to the first final reflecting surface. It has a form including a surface 72 and a third reflecting surface 73).

Further, the above-mentioned substrate image reflecting surface provided on the second block body 54 is arranged directly below the second exit port 64, and the second final image reflecting the horizontally incident image of the bonding position 22a is directly above. At least one second upright reflecting surface (sixth) that guides the image of the reflecting surface (eighth reflecting surface 78) and the bonding position 22a horizontally reflected by the fifth reflecting surface 75 to the second final reflecting surface. It has a form including a reflecting surface 76 and a seventh reflecting surface 77).

In the movable prism 32a having the above configuration, the first block body 53 and the second block body 54, the first final reflection surface (fourth reflection surface 74) and the second final reflection surface (eighth reflection surface 78). , And the first upright reflecting surface (second reflecting surface 72, third reflecting surface 73) and the second upright reflecting surface (sixth reflecting surface 76, seventh reflecting surface 77) are centered on the reflector 50. It is line-symmetrical with respect to a straight line (center line CL) that passes through and is orthogonal to the first horizontal direction (arrow h1) and the second horizontal direction (arrow h2) in the horizontal plane.

Summarizing the functions of the movable prism 32a, when the movable prism 32a is located between the chip 14 located above the bonding position 22a and the substrate 22, the image of the chip 14 faces the chip 14 first. Is incident from the incident port 61 of the above, and is emitted upward from the first exit port 63 horizontally separated from the first incident port 61. In both cases, the movable prism 32a has an image of the bonding position 22a of the substrate 22 incident on the second incident port 62 facing the bonding position 22a and horizontally separated from the second incident port 62 from the second exit port 64. It has a function to emit upward.

As described above, as a movable light guide body used for simultaneously recognizing two upper and lower fields of view by advancing and retreating between the chip 14 held by the bonding tool 29 and the bonding position 22a of the substrate 22, the present embodiment is used. By using the movable prism 32a having the configuration as shown below, the effects described below can be obtained. First, since the movable prism 32a is configured by combining prisms such as the first block body 53 and the second block body 54, the thickness dimension in the overall shape of the movable optical unit 32 can be made as small as possible and the weight can be reduced as much as possible. It is possible to reduce the weight of the.

Therefore, in the imaging operation shown in FIG. 6A, it is possible to set the standby height for holding the bonding tool 29 holding the chip 14 as low as possible. As a result, in the bonding operation shown in FIG. 6B, the bonding operation stroke in which the bonding tool 29 moves up and down can be reduced, and the operation tact time is shortened. In addition, in the advancing / retreating operation of moving the movable optical unit 32, the weight is reduced, so that high-speed operation becomes possible and the operation tact time is further shortened.

Although the present embodiment shows an example in which a movable prism 32a using a multi-faceted reflection prism is used as the movable light guide, the present invention is not limited to the movable prism 32a. That is, a movable light guide body may be configured by incorporating a reflector such as a mirror or an optical element such as a lens as long as the above-mentioned function can be realized.

Further, in the present embodiment, a configuration is adopted in which the first outlet 63 and the second outlet 64 are arranged at positions horizontally separated from the first incident port 61 and the second incident port 62. However, the present invention is not limited to such a configuration. That is, the image of the chip 14 captured from the first incident port 61, the second incident port 62, and the image of the bonding position 22a are captured by the upper left imaging unit 41 (first imaging unit) and the lower left imaging unit 42 (the lower left imaging unit 42). The movable prism 32a, the fixed optical unit 33, and the image pickup so as to be transmitted to the second image pickup unit), the upper right image pickup unit 43 (third image pickup unit), and the lower right image pickup unit 44 (fourth image pickup unit). It suffices if the connection portion with the unit 34 is set.

Next, refer to FIGS. 8 and 9 for an imaging field of view and an imaging path when imaging the chip 14 and the bonding position 22a by the imaging unit 34 using the combination of the movable prism 32a and the fixed optical unit 33 having the above configuration. I will explain. In FIG. 8, the upper left image UL and the upper right image UR shown above the reflector 50 of the movable prism 32a show an image of the chip 14 to be imaged, and the lower left image DL shown below the reflector 50. The lower right image DR shows an image of the bonding position 22a to be imaged. Note that C1 to C11 shown by the broken line of the thick line indicate the image pickup path in which the image of the chip 14 is guided to the image pickup unit 34, and B1 to B11 shown by the alternate long and short dash line of the thick line indicate the image of the bonding position 22a. The image pickup path guided to the image pickup unit 34 is shown.

Here, the upper left image UL corresponds to the first partial image which is a part (left half) of the image of the chip 14, and the upper right image UR is different from the first partial image of the image of the chip 14. It corresponds to the third partial image which is a part (right half). Further, the lower left image DL corresponds to a second partial image which is a part (left half) corresponding to the first partial image of the image of the bonding position 22a, and the lower right image DR corresponds to the second image of the bonding position 22a. It corresponds to the fourth partial image which is a part (right half) corresponding to the partial image of 3. Here, "corresponding" means that the imaging fields of view when acquiring these partial images are in a state of being overlapped vertically.

The upper left image UL and the upper right image UR of the chip 14 are incident on the first incident port 61 on the upper surface of the reflector 50 (path C1), and are guided in the first block body 53 to be a fifth light guide body. It exits upward from the first outlet 63 on the upper surface of the 55 (path C5). The lower left image DL and the lower right image DR of the bonding position 22a are incident on the second incident port 62 on the lower surface of the reflector 50 (path B1), and are guided in the second block body 54 to guide the sixth light guide. It exits upward from the second outlet 64 on the upper surface of the body 56 (path B5).

As shown in FIG. 9A, in the first block body 53, the image of the chip 14 (path C2) incident from the reflector 50 is incident on the second reflecting surface 72 and reflected in the X direction (). Path C3), and further incident on the third reflecting surface 73 and reflected in the Y direction (path C4). Next, it is incident on the fourth reflecting surface 74 of the fifth light guide 55 and reflected upward (FIG. 9 (b)) to reach the first exit port 63. Further, in the second block body 54, the image of the bonding position 22a (path B2) incident from the reflector 50 is incident on the sixth reflecting surface 76 and reflected in the X direction (path B3), and further, the seventh reflecting surface. It is incident on 77 and reflected in the Y direction (path B4). Next, it is incident on the eighth reflecting surface 78 of the sixth light guide 56 and reflected upward (FIG. 9 (b)) to reach the second exit port 64.

The incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are located above the fifth light guide body 55, and the lower left prism is located above the sixth light guide body 56. The incident edge portion 47a of 47 and the incident edge portion 48a of the lower right prism 48 are located (see FIG. 8). Here, in the upper left prism 45 and the upper right prism 46, the incident edge portion 45a and the incident edge portion 46a are the first in which the first exit port 63 on the upper surface of the fifth light guide body 55 is divided into two in the left-right direction. It is arranged so as to be located above the left exit port 63L and the first right exit port 63R. Further, in the lower left prism 47 and the lower right prism 48, the incident edge portion 47a and the incident edge portion 48a divide the second outlet 64 on the upper surface of the sixth light guide 56 into two in the left-right direction. It is arranged so as to be located above the left exit port 64L and the second right exit port 64R, respectively.

With such a configuration, each of the four partial images obtained by dividing the image of the chip 14 and the image of the bonding position 22a into two on the left and right can be captured by the four imaging units constituting the imaging unit 34. There is. That is, among the images of the chip 14 emitted from the first exit port 63, the upper left image UL emitted from the first left outlet 63L and the upper right image UR emitted from the first right exit 63R are , The incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are incident on each (paths C6 and C7).

The upper left image UL and the upper right image UR incident on the incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are the emission edge portions in the upper left prism 45 and the upper right prism 46, respectively. 45b is reflected toward the exit edge portion 46b (see paths C8 and C10 shown in FIG. 9), where it is reflected downward and incident on the upper left image pickup unit 41 and the upper right image pickup section 43 (pathways C9 and C11).

Further, among the images of the bonding position 22a emitted from the second exit port 64, the lower left image DL emitted from the second left exit port 64L and the lower right image DR emitted from the second right exit port 64R. Is incident on the incident edge portion 47a of the lower left prism 47 and the incident edge portion 48a of the lower right prism 48, respectively (paths B6 and B7). The lower left image DL and the lower right image DR incident on the incident edge portion 47a of the lower left prism 47 and the incident edge portion 48a of the lower right prism 48 are the emission edge portions in the lower left prism 47 and the lower right prism 48, respectively. 47b is reflected toward the exit edge portion 48b (see paths B8 and B10 shown in FIG. 9), where it is reflected downward and incident on the lower left image pickup unit 42 and the lower right image pickup section 44 (pathways B9 and B11).

In the above configuration, the upper left image pickup unit 41 captures a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63, and the lower left image pickup unit 42. Takes a second partial image (lower left image DL) which is a part corresponding to the first partial image (upper left image UL) of the image of the bonding position 22a emitted from the second exit port 64. Further, the upper right image pickup unit 43 is a third partial image (upper right image) which is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. UR) is imaged, and the lower right image pickup unit 44 is a part corresponding to the third partial image (upper right image UR) of the image of the bonding position 22a emitted from the second exit port 64. A partial image (DR) is imaged.

More specifically, the fixed optical unit 33 provided in the bonding device 1 incidents a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63. The first light guide body (upper left prism 45) to be emitted is incident, and the second partial image (lower left image DL) which is a part of the image of the bonding position 22a emitted from the second emission port 64 is incident. The second light guide body (lower left prism 47) to be emitted is a different part from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. The second part of the image of the third light guide body (upper right prism 46) that incidents and emits the third partial image (upper right image UR) and the bonding position 22a emitted from the second exit port 64. It is provided with a fourth light guide body (lower right prism 48) that incidents and emits a fourth partial image (lower right image DR) that is a part different from the image (lower left image DL).

Then, the upper left image pickup unit 41 takes an image of the first partial image (upper left image UL) emitted from the first light guide body (upper left prism 45), and the lower left image pickup unit 42 takes a second light guide. A second partial image (lower left image DL) emitted from the body (lower left prism 47) is imaged. Further, the upper right image pickup unit 43 takes an image of a third partial image (upper right image UR) emitted from the third light guide body (upper right prism 46), and the lower right image pickup unit 44 takes a fourth guide. The fourth partial image (lower right image DR) emitted from the light body (lower right prism 48) is imaged.

In imaging the chip 14 and the bonding position 22a by the imaging unit 34 having the above configuration, it may be necessary to adjust the position of the imaging field of view depending on the shape, size, position of the recognition point, etc. of the chip 14 to be imaged and the bonding position 22a. .. In such a case, the upper left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are combined with the upper left prism 45, the lower left prism 47, and the upper side by the image pickup unit moving mechanism 35. By moving the prism 46 relative to the right prism 46 and the lower right prism 48, the position of the imaging field of view of each imaging unit is adjusted.

Here, as shown in FIG. 8, the field of view of the upper left image pickup unit 41 in the chip 14 (upper left image UL) and the field of view of the lower left image pickup unit 42 at the bonding position 22a (lower left image DL) are vertically overlapped positions. There is a relationship. Similarly, the field of view of the upper right image pickup unit 43 (upper right image UR) on the chip 14 and the field of view of the lower right image pickup unit 44 at the bonding position 22a (lower right image DR) are in a vertically overlapping positional relationship.

As described above, in the configuration of the image pickup unit moving mechanism 35, the upper left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are moved in the X direction by the first movement mechanism. Move the same distance in the same direction. Then, by the second moving mechanism, the upper left image pickup unit 41 and the upper right image pickup unit 43 are moved in the same direction by the same distance, and the lower left image pickup unit 42 and the lower right image pickup unit 44 are moved to the upper left image pickup unit 41. It can be moved by the same distance in the direction opposite to the upper right image pickup unit 43.

By moving the upper left image pickup unit 41, the upper right image pickup unit 43, the lower left image pickup unit 42, and the lower right image pickup unit 44 under such conditions, the image pickup unit moving mechanism 35 can see the field of view and the lower side of the upper left image pickup unit 41. While maintaining the state in which the fields of view of the left image pickup unit 42 overlap and the field of view of the upper right image pickup unit 43 and the field of view of the lower right image pickup unit 44 overlap, the upper left image pickup unit 41, the lower left image pickup unit 42, and the upper right The image pickup unit 43 and the lower right image pickup unit 44 can be moved. This makes it possible to adjust the position of the imaging field of view of each imaging unit while correctly maintaining the positional relationship of the four partial images that divide each of the two upper and lower imaging targets of the chip 14 and the bonding position 22a. ing.

When the components used for imaging the chip 14 and the bonding position 22a are classified for each imaging target, the first combination of the upper left prism 45 and the upper left imaging unit 41 or the upper right prism 46 and the upper right imaging is performed. The third combination with the unit 43 constitutes a first imaging means for capturing an image of the chip 14 emitted from the first ejection port 63 of the movable prism 32a. Further, the second combination of the lower left prism 47 and the lower left image pickup unit 42, or the fourth combination of the lower right prism 48 and the lower right image pickup unit 44 is emitted from the second outlet 64 of the movable prism 32a. A second imaging means for imaging the image of the bonding position 22a is configured.

In the first imaging means and the second imaging means, only one of the two combinations may be used, or both may be used. When only one combination is used, for example, when the first combination is used as the first imaging means and the second combination is used as the second imaging means, only a partial image on one side of the imaging field of view is used. This refers to the case of imaging.

That is, when the bonding target is a small chip 14 and the recognition at the time of the bonding operation is sufficient for the recognition of one point at the center of the chip, only the image pickup unit on one side is used. On the other hand, when the bonding target is a large chip 14 and it is necessary to recognize two points such as the diagonal position of the chip in recognition during the bonding operation, both of the above two combinations are used. To do so. That is, both the chip 14 and the bonding position 22a are imaged by the two imaging units. As described above, the bonding device 1 shown in the present embodiment can handle a wide variety of chips from small chips to large chips, and a bonding device having excellent versatility is realized.

Then, based on the image of the chip 14 imaged by the above-mentioned first imaging means and the image of the bonding position 22a imaged by the second imaging means, the relative positional deviation between the chip 14 and the bonding position 22a is generated. , Detected by image recognition. The position shift detection by image recognition is executed by the processing function of the image recognition unit 93 (FIG. 13) provided in the control unit 5. Therefore, the image recognition unit 93 of the control unit 5 is a detection means for detecting the relative positional deviation between the chip 14 and the bonding position 22a based on the image of the chip 14 and the image of the bonding position 22a.

The alignment processing unit 92 (FIG. 13) of the control unit 5 controls the second XY table 20 based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detection means in this way. As a result, the bonding tool 29 holding the chip 14 and the substrate holding stage 21 holding the substrate 22 are relatively moved to perform an alignment process for aligning the chip 14 with the bonding position 22a. Therefore, the alignment processing unit 92 of the control unit 5 constitutes an alignment means for relatively moving the bonding tool 29 and the substrate holding stage 21.

A plurality of definitions of the image pickup means in the bonding apparatus 1 can be defined, and the following definitions may be used. That is, the combination of the upper left prism 45 and the upper left image pickup unit 41 captures a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63. The combination of the lower left prism 47 and the lower left image pickup unit 42 is defined as the image pickup means of 1, and the first partial image of the image of the bonding position 22a emitted from the second exit port 64 (upper left image UL). It is defined as a second image pickup means for capturing a second partial image (lower left image DL) which is a part corresponding to the above.

Further, the combination of the upper right prism 46 and the upper right image pickup unit 43 is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. It is defined as a third image pickup means for capturing a partial image of 3 (upper right image UR), and the combination of the lower right prism 48 and the lower right image pickup unit 44 is combined with the bonding position 22a emitted from the second outlet 64. It is defined as a fourth image pickup means for capturing a fourth partial image (lower right image DR) which is a part corresponding to the third partial image (upper right image UR) of the image.

Then, the first partial image (upper left image UL) captured by the above-mentioned first imaging means, the second partial image (lower left image DL) captured by the second imaging means, and the third. The chip 14 and the bonding position based on the third partial image (upper right image UR) captured by the imaging means and the fourth partial image (lower right image DR) captured by the fourth imaging means. The relative misalignment of 22a is detected by the detection means described above. Then, based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detecting means in this way, the bonding tool 29 and the substrate holding stage 21 are relatively moved by the above-mentioned alignment means. , The alignment process for aligning the chip 14 and the bonding position 22a is performed.

Next, the configuration of the optical head 30 will be described with reference to FIG. In FIG. 10, a light source box 31 is attached to the second moving base 30a that moves along the guide rail 25 (see FIG. 2). The second movement base 30a moves in the Y direction by the moving means described with reference to FIG. The light source box 31 houses the upper light source 85 shown in FIG. 11, the upper light source 81 constituting the lower light unit 86, and the lower light source 82.

From the upper light source 81 and the lower light source 82, an upper optical fiber cable 83 and a lower optical fiber cable 84, which are configured by bundling a plurality of optical fibers, respectively, extend. The upper optical fiber cable 83 and the lower optical fiber cable 84 are connected to the movable optical unit 32 via the inside of the arm portion 31a. By operating the upper light source 81 and the lower light source 82, the illumination light is irradiated inside the movable optical unit 32 via the upper optical fiber cable 83 and the lower optical fiber cable 84.

FIG. 11 shows a movable prism 32a housed inside the movable optical unit 32, an upper lighting unit 85 and a lower lighting unit 86 included in the movable prism 32a. An upper lighting unit 85 is provided on the upper surface side of the movable light guide 32a, and a lower lighting unit 86 is provided on the lower surface side of the movable prism 32a. Both the upper lighting unit 85 and the lower lighting unit 86 move together with the movable prism 32a by the above-mentioned moving means (linear motor 24 and guide rail 25). The upper illumination unit 85 illuminates the chip 14 when the movable prism 32a is located between the chip 14 and the substrate 22. Further, the lower illumination unit 86 illuminates the substrate 22 when the movable prism 32a is located between the chip 14 and the substrate 22.

In the upper optical fiber cable 83 and the lower optical fiber cable 84, the optical fiber is untied inside the movable optical unit 32 and the end portions are formed flat, and the end faces are aligned linearly in the irradiation portions 83a and 84a. To form. The upper light source 81 and the lower light source 82 emit light at the end faces of the optical fibers constituting the upper optical fiber cable 83 and the lower optical fiber cable 84, respectively, and the upper optical fiber cable 83 and the lower optical fiber cable 84 are emitted. The upper light emitting unit 83b and the lower light emitting unit 84b irradiate the illumination light guided by the above on the upper surface and the lower surface of the reflector 50.

That is, the upper lighting unit 85 has an upper light source 81 and an upper optical fiber cable 83 which is a bundle of a plurality of optical fibers and guides the light of the upper light source 81 to the chip 14, and the lower lighting unit 86 has a lower light source 82. It is a bundle of a plurality of optical fibers and has a lower optical fiber cable 84 that guides the light of the lower light source 82 to the substrate 22.

Then, the end portion of the upper optical fiber cable 83 is formed flat so that the end faces of the plurality of optical fibers constituting the upper optical fiber cable 83 surround the first incident port 61 on the upper surface of the reflector 50, and the irradiation portion 83a is formed. It has become. Further, the end portion of the lower optical fiber cable 84 is formed flat so that the end faces of the plurality of optical fibers constituting the lower optical fiber cable 84 surround the second incident port 62 on the lower surface of the reflector 50 to form an irradiation unit. It is 84a.

On the outer surfaces of the first block body 53 and the second block body 54 forming the movable prism 32a, the seventh light guide body 57 and the seventh light guide body 57, which are triangular columnar light guide bodies, are located at positions sandwiching the reflector 50, respectively. The 8 light guide body 58 extends outward and is provided integrally with the movable prism 32a. The seventh light guide body 57 and the eighth light guide body 58 provided with the movable prism 32a interposed therebetween are lighting means provided above when the movable prism 32a is located between the chip 14 and the substrate 22. It functions as a condensing unit that guides the illumination light radiated downward from two different directions by the pair of spot illuminations 36 (see FIGS. 2 and 3) to the bonding position 22a of the substrate 22.

FIG. 12 shows the illumination state of the chip 14 and the substrate 22 when the movable optical unit 32 is positioned between the chip 14 held by the bonding tool 29 and the substrate 22 and the chip 14 and the substrate 22 are imaged. ing. First, by operating the spot illumination 36, illumination light is emitted from above on both sides of the movable optical unit 32 with respect to the seventh light guide body 57 and the eighth light guide body 58 from two different diagonally upward directions. (Arrows i, j). The irradiated illumination light is collected by the 7th light guide body 57 and the 8th light guide body 58, and is incident on the bonding position 22a on the upper surface of the substrate 22 to illuminate.

Further, by operating the upper lighting unit 85 and the lower lighting unit 86, the illumination light is emitted from the upper light source 81 and the lower light source 82 via the upper optical fiber cable 83 and the lower optical fiber cable 84, and the irradiation units 83a and 84a. Guided to. Then, this illumination light is emitted from the upper light emitting unit 83b and the lower light emitting unit 84b to the chip 14 and the substrate 22 as indirect illumination light (arrow k, arrow m), respectively. Further, the illumination light from the coaxial illumination provided in each imaging unit is applied to the imaging portion.

That is, the illumination light from the coaxial illumination of the upper left image pickup unit 41 and the upper right image pickup unit 43 is incident on the first light guide body 51 of the reflector 50 (arrow n), and the first reflection surface 71 (see FIG. 7). It is reflected upward by the light and enters the chip 14 from the coaxial direction (arrow o). Further, the illumination light from the coaxial illumination of the lower left image pickup unit 42 and the lower right image pickup unit 44 is incident on the second light guide body 52 of the reflector 50 (arrow p), and the fifth reflection surface 75 (see FIG. 7). It is reflected downward by the light and enters the substrate 22 from the coaxial direction (arrow q).

As described above, in the bonding apparatus 1 of the present embodiment, the movable optical unit 32 incorporating the movable prism 32a having the configuration shown in FIG. 7 is positioned between the chip 14 and the substrate 22 to perform imaging in two directions, up and down. In the method, a plurality of lighting means described below are provided.

First, the chip 14 and the substrate 22 are irradiated with the illumination light from the coaxial direction by the coaxial illumination provided in each imaging unit of the imaging unit 34. As indirect lighting that illuminates the chip 14 and the substrate 22 from the surroundings, an upper lighting unit 85 and a lower lighting unit 86 that are arranged on the upper and lower sides of the movable prism 32a and irradiate the illumination light guided by the optical fiber cable are provided. ing. Furthermore, the illumination light radiated downward by the pair of spot illuminations 36 provided above is collected by the seventh light guide body 57 and the eighth light guide body 58, and the bonding position on the upper surface of the substrate 22 is obtained. I am trying to illuminate 22a. By providing a plurality of lighting means in this way, even if the substrate 22 to be bonded has an interfering object such as a substrate holding member that interferes with normal lighting, appropriate lighting conditions necessary for good imaging are required. Can be met.

Next, the configuration of the control system will be described with reference to FIG. In FIG. 13, the control unit 5 includes a bonding operation control unit 91, an alignment processing unit 92, an image recognition unit 93, a visual field position setting unit 94, and a storage unit 95 as internal processing function units. Further, the control unit 5 includes a linear motor 24, a first XY table 10, a second XY table 20, a bonding head 26, a pickup head 15, an image pickup unit X-axis motor 34X, an image pickup unit Y-axis motor 34Y, and an upper left camera. 41c, lower left camera 42c, upper right camera 43c, lower right camera 44c, upper light source 81, lower light source 82, spot lighting 36, upper left coaxial lighting 41b, lower left coaxial lighting 42b, upper right coaxial lighting 43b, lower right The coaxial illumination 44b and the touch panel 96 are connected. The touch panel 96 displays a recognition screen by the image recognition unit 93, an operation input to the control unit 5, an operation screen for data input, and the like.

The bonding operation control unit 91 controls the linear motor 24, the first XY table 10, the second XY table 20, the bonding head 26, and the pickup head 15, so that the chip taken out from the chip supply unit 2 by the pickup head 15 The bonding operation of bonding 14 to the substrate 22 by the bonding head 26 is controlled.

The image recognition unit 93 recognizes and processes the image obtained by imaging the chip 14 and the bonding position 22a by the upper left camera 41c, the lower left camera 42c, the upper right camera 43c, and the lower right camera 44c, thereby forming the chip 14 and the chip 14. The positional deviation from the bonding position 22a is detected. That is, the image recognition unit 93 is a detection means for detecting the relative positional deviation between the chip 14 and the bonding position 22a. At the time of imaging by the upper left camera 41c, the lower left camera 42c, the upper right camera 43c, and the lower right camera 44c, the upper light source 81, the lower light source 82, the spot illumination 36, and the upper left coaxial are provided by the lighting control function provided in the image recognition unit 93. The lighting of the illumination 41b, the lower left coaxial illumination 42b, the upper right coaxial illumination 43b, and the lower right coaxial illumination 44b is controlled.

The field of view position setting unit 94 moves the image pickup unit 34 by controlling the drive of the image pickup unit X-axis motor 34X and the image pickup unit Y axis motor 34Y. As a result, the positions of the image pickup fields of the upper left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are set according to the image pickup target. The storage unit 95 includes bonding data used for controlling the bonding operation by the bonding operation control unit 91, recognition data used for recognition processing by the image recognition unit 93, and an imaging field of view used for setting the visual field position by the visual field position setting unit 94. Store data such as data.

As described above, in the present embodiment, when the bonding device 1 for bonding the chip 14 held by the bonding tool 29 to the bonding position 22a of the substrate 22 is advanced between the chip 14 and the substrate 22, the chip is inserted. Movable having a function of incident the image of 14 and the image of the bonding position 22a from the first incident port 61 and the second incident port 62, respectively, and eject them upward from the first exit port 63 and the second exit port 64, respectively. An image pickup unit 34 that captures an image of the emitted chip, an image of a bonding position, and an image of a bonding position by four image pickup units via a fixed optical unit 33 having four prisms that function as a double reflection mirror. A movable prism 32a made of a thin multi-faceted reflection prism is used as the movable light guide. As a result, high productivity can be realized while ensuring high position accuracy in the bonding work.

Then, by the fixed optical unit 33, the upper left image UL, the upper right image UR, and the lower left image of the chip 14 at the bonding position 22a emitted from the second exit 64 are the upper left image UL and the upper right image UR of the chip 14 emitted from the first exit 63. The DL and the lower right image DR are reflected downward by four prisms. In a configuration in which these reflected images are incident on the four image pickup units of the image pickup unit 34 and imaged, the four image pickup units are moved relative to the four prisms of the fixed optical unit 33 by the image pickup unit moving means. This adjusts the position of the imaging field of view by the four imaging units. This makes it possible to target a wide variety of chips 14 having different sizes and positions of recognition points.

In the bonding mechanism 4 of the bonding device 1 having the above configuration, the bonding tool 29 is provided on the first moving base 26a and the second moving base 30a driven by a common linear motor 24 and moving along the guide rail 25. The bonding head 26 and the optical head 30 provided with the movable optical unit 32 are attached. With the optical head 30 moved and the movable optical unit 32 positioned between the chip 14 and the substrate 22, the image pickup unit 34 captures an image of the chip 14 and an image of the bonding position 22a. This makes it possible to simplify the mechanism of the bonding device and reduce the equipment cost.

In the movable prism 32a provided in the above-mentioned movable optical unit 32, the illumination light from the upper light source is guided to the irradiation unit 83a by the upper optical fiber cable 83 and irradiated from the upper light emitting unit 83b to illuminate the chip 14. 85 and a lower lighting unit 86 that guides the illumination light from the lower light source to the irradiation unit 84a by the lower optical fiber cable 84 and irradiates the illumination light from the lower light emitting unit 84b to illuminate the bonding position 22a of the substrate 22 are provided. ing. With this configuration, it is possible to illuminate the chip 14 and the bonding position 22a under appropriate lighting conditions and perform highly accurate position recognition.

Further, in the bonding apparatus 1 shown in the present embodiment, the illumination light from the pair of spot illuminations 36 arranged on the Y-axis frame 23 of the bonding mechanism 4 is the movable optics located between the chip 14 and the substrate 22. The unit 32 is irradiated, and the irradiation light is focused by the seventh light guide body 57 and the eighth light guide body 58 provided on the side surface of the movable prism 32a and guided to the bonding position of the substrate 22. As a result, even if an interfering object is present on the substrate 22, the bonding position 22a of the substrate 22 can be illuminated under appropriate lighting conditions.

In the bonding device 1 shown in the present embodiment, the pair of spot lights 36 are arranged on the Y-axis frame 23, but they may be arranged on a member different from the Y-axis frame 23.

The bonding apparatus of the present invention has the effect of being able to realize high productivity while ensuring high position accuracy, and is useful in the technical field of bonding chips to the bonding position of a substrate.

1 Bonding device 2 Chip supply part 3 Board holding part 4 Bonding mechanism 14 Chip 21 Board holding stage 22 Board 22a Bonding position 24 Linear motor 25 Guide rail 26 Bonding head 26a First moving base 29 Bonding tool 30 Optical head 30a Second Moving base 31 Light source box 32 Movable optical unit 32a Movable prism 33 Fixed optical unit 34 Imaging unit 35 Imaging unit Moving mechanism 36 Spot lighting 41 Upper left imaging unit 41c Upper left camera 42 Lower left imaging unit 42c Lower left camera 43 Upper right imaging unit 43c Upper right camera 44 Lower right image pickup unit 44c Lower right camera 45 Upper left prism 46 Upper right prism 47 Lower left prism 48 Lower right prism 50 Reflector 53 First block body 54 Second block body 61 First incident port 62 Second incident port 63 First exit port 64 Second exit port 81 Upper light source 82 Lower light source 83 Upper optical fiber cable 84 Lower optical fiber cable 85 Upper lighting unit 86 Lower lighting unit UL Upper left image UR Top right image DL Bottom left image DR Bottom right image [P1] Extraction position [P2] Pickup position [P3] Working position

Claims (8)

In a bonding apparatus in which the bonding tool holds the chip and lowers the bonding tool toward the stage on which the substrate is placed so as to face the chip to bond the chip to the bonding position of the substrate.
When it is located between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and horizontally from the first incident port. The image of the bonding position of the substrate is incident from the second incident port facing the bonding position and horizontally separated from the first incident port while being emitted upward from the separated first ejection port. A movable light guide that emits upward from the exit port of 2 and
A first light guide body that incidents and emits an image of the chip emitted from the first exit port, and
A first imaging unit that captures an image of the chip emitted from the first light guide, and a first imaging unit.
A second light guide body that incidents and emits an image of the bonding position emitted from the second exit port, and
A second imaging unit that captures an image of the bonding position emitted from the second light guide, and a second imaging unit.
Detection to detect the relative positional deviation between the chip and the bonding position based on the image of the chip imaged by the first imaging unit and the image of the bonding position imaged by the second imaging unit. Means and
An alignment means for relatively moving the bonding tool and the stage based on the misalignment detected by the detection means, and an alignment means.
A moving means for advancing and retreating the movable light guide body into the space between the chip and the substrate located above the bonding position.
An image pickup unit moving means for moving the first image pickup unit and the second image pickup unit relative to the first light guide body and the second light guide body.
A bonding device. The field of view of the first image pickup unit on the chip and the field of view of the second image pickup unit at the bonding position are vertically overlapped with each other.
The image pickup unit moving means moves the first image pickup unit and the second image pickup unit while maintaining a state in which the field of view of the first image pickup unit and the field of view of the second image pickup unit overlap. Item 1. The bonding apparatus according to Item 1. The bonding apparatus according to claim 1, wherein the image pickup unit moving means includes a first movement mechanism for moving the first image pickup unit and the second image pickup unit by the same distance in the same direction. The bonding apparatus according to claim 1, wherein the image pickup unit moving means includes a second moving mechanism capable of moving the first image pickup unit and the second image pickup unit by the same distance in opposite directions. In a bonding apparatus in which the bonding tool holds the chip and lowers the bonding tool toward the stage on which the substrate is placed so as to face the chip to bond the chip to the bonding position of the substrate.
When it is located between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and horizontally from the first incident port. The image of the bonding position of the substrate is incident from the second incident port facing the bonding position and horizontally separated from the first incident port while being emitted upward from the separated first ejection port. A movable light guide that emits upward from the exit port of 2 and
A first light guide body that incidents and emits a first partial image that is a part of an image of the chip emitted from the first exit port.
A first imaging unit that captures the first partial image emitted from the first light guide, and a first imaging unit.
A second light guide body that incidents and emits a second partial image that is a part of the image of the bonding position emitted from the second exit port.
A second imaging unit that captures the second partial image emitted from the second light guide, and a second imaging unit.
A third light guide body that incidents and emits a third partial image that is a part different from the first partial image of the image of the chip emitted from the first exit port.
A third imaging unit that captures the third partial image emitted from the third light guide, and a third imaging unit.
A fourth light guide body that incidents and emits a fourth partial image that is a part different from the second partial image of the image of the bonding position emitted from the second exit port.
A fourth imaging unit that captures the fourth partial image emitted from the fourth light guide, and a fourth imaging unit.
The first partial image captured by the first imaging unit, the second partial image captured by the second imaging unit, and the third partial image captured by the third imaging unit. And a detection means for detecting the relative positional deviation between the chip and the bonding position based on the fourth partial image captured by the fourth imaging unit.
An alignment means for relatively moving the bonding tool and the stage based on the misalignment detected by the detection means, and an alignment means.
A moving means for advancing and retreating the movable light guide body into the space between the chip and the substrate located above the bonding position.
The first image pickup unit, the second image pickup unit, the third image pickup unit, and the fourth image pickup unit are combined with the first light guide body, the second light guide body, and the third light guide body. An image pickup unit moving means for moving the light guide body relative to the fourth light guide body, and
A bonding device. The field of view of the first image pickup unit on the chip and the field of view of the second image pickup unit at the bonding position are vertically overlapped with each other.
The field of view of the third image pickup unit on the chip and the field of view of the fourth image pickup unit at the bonding position are vertically overlapped with each other.
The image pickup unit moving means has a state in which the field of view of the first image pickup unit and the field of view of the second image pickup unit overlap, and a state in which the field of view of the third image pickup unit and the field of view of the fourth image pickup unit overlap. The bonding apparatus according to claim 5, wherein the first image pickup unit, the second image pickup unit, the third image pickup unit, and the fourth image pickup unit are moved while maintaining the above. The image pickup unit moving means includes a first moving mechanism that moves the first image pickup unit, the second image pickup unit, the third image pickup unit, and the fourth image pickup unit by the same distance in the same direction. , The bonding apparatus according to claim 5. The image pickup unit moving means moves the first image pickup unit and the third image pickup unit by the same distance in the same direction, and moves the second image pickup unit and the fourth image pickup unit to the first image pickup unit. The bonding apparatus according to claim 5, further comprising a second moving mechanism capable of moving the image pickup unit and the third image pickup unit by the same distance in opposite directions.

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