JP5798047B2 - Component imaging device, surface mounter and component inspection device - Google Patents

Description

  The present invention relates to a component imaging device that captures an image from a direction perpendicular to a mounting surface where terminals of electronic components are located and a slanting direction, and a surface mounter and a component inspection device using the component imaging device. .

  2. Description of the Related Art Conventionally, surface mounters that mount electronic components on printed wiring boards and component inspection apparatuses that inspect electronic components image the electronic components in order to detect the flatness of the electronic components and lead deformation by image processing. A component imaging device is provided. In order to detect the flatness of the electronic component and the deformation of the lead, an image obtained by imaging the electronic component from a direction perpendicular to the mounting surface and an image obtained by imaging the electronic component from an oblique direction are used. Conventional component imaging devices of this type include those described in Patent Document 1 and Patent Document 2.

The component imaging device disclosed in Patent Document 1 is a first imaging device that images electronic components from a direction perpendicular to the mounting surface, and a first imaging device that images electronic components from an oblique direction inclined with respect to the vertical direction. 2 imaging devices.
The component imaging device disclosed in Patent Document 2 includes an imaging device body that images an electronic component, and a plurality of mirror groups disposed between the electronic component and the imaging device body. The imaging device main body is stationary above the electronic component and images the electronic component from a direction perpendicular to the mounting surface. The imaging device of the imaging device body is an area sensor.

  Each said mirror group is comprised by the some mirror arrange | positioned in the position surrounding the optical axis of the said imaging device main body. Each mirror group is configured such that an oblique image obtained by viewing the lead of the electronic component from an oblique direction inclined with respect to the vertical direction is captured by the imaging device body. In the component imaging device apparatus disclosed in Patent Document 2, an image obtained by imaging an electronic component from the vertical direction and an image obtained by imaging a lead from an oblique direction are simultaneously captured by one imaging device body.

Japanese Patent Laying-Open No. 2005-340648 Japanese Patent Laid-Open No. 11-132745

  The component imaging apparatus shown in Patent Document 1 captures an electronic component only from a single direction. For this reason, the surface mounter shown in Patent Document 1 needs to include two component imaging devices, and accordingly, two sets of wirings are required. That is, the surface mounting machine and the component inspection apparatus using the component imaging device disclosed in Patent Document 1 are expensive to manufacture and require a large space for installing two component imaging devices. Therefore, there is a problem that the apparatus becomes larger.

The component imaging device disclosed in Patent Document 2 requires a large number of mirrors, and thus has a complicated structure. In addition, the component imaging device is large in size in the horizontal direction because a plurality of oblique image capturing mirrors are provided around the optical path when the electronic component is imaged from directly above. Moreover, since the component imaging device shown in Patent Document 2 uses an area camera, it must be stopped at the imaging position for each imaging. For this reason, the surface mounter using this component imaging device requires a long time for mounting, and the component inspection device using this component imaging device requires a long inspection time.
In addition, the component imaging apparatus disclosed in Patent Document 2 has a problem in that the size of electronic components that can be imaged is limited because the position of the lead of the electronic component is regulated by a mirror.

The present invention has been made to solve such a problem, and has a simple structure and a compact imaging function capable of imaging an electronic component from both a direction perpendicular to a mounting surface and an oblique direction. It is a first object to provide an apparatus.
A second object of the present invention is to provide a component imaging device that has a high degree of freedom in the size of electronic components that can be imaged when realizing the function.
Furthermore, a third object of the present invention is to provide a surface mounter and a component inspection apparatus that can reduce the manufacturing cost and can be reduced in size by being equipped with the above-described component imaging device, and that can perform component recognition promptly. And

In order to achieve this object, a component imaging apparatus according to the present invention includes a first optical path for capturing a lower surface image of an electronic component by an imaging unit from a direction perpendicular to the mounting surface of the substrate, and the mounting surface of the substrate. Is an optical path for capturing an oblique image of the electronic component from a direction inclined to the substrate side with respect to a vertical direction by the imaging unit, the second optical path having the same optical path length as the first optical path; And a switching member that switches between the first optical path and the second optical path, and an illumination device that is positioned between the switching member and the electronic component and that irradiates the electronic component with light. And the lighting device is formed with a first slit constituting a part of the first optical path and a second slit constituting a part of the second optical path. To do.

  According to the present invention, in the above invention, the imaging unit includes a line sensor.

  The present invention is characterized in that, in the above invention, the first slit and the second slit are formed so as to extend in a longitudinal direction of the line sensor.

  According to the present invention, in the above invention, the illumination device includes a plurality of illumination units that can be switched on and off, and the first optical path and the first are switched by switching on and off of the illumination units. The illumination of the two optical paths is switched.

  The present invention is characterized in that, in the above-mentioned invention, the switching member includes a first mirror portion having a reflective surface that can advance and retreat, and a second mirror portion having a reflective surface that does not advance and retreat.

  According to the present invention, in the above invention, the first optical path is formed by a reflection surface of a first mirror portion configured to be capable of moving forward and backward, and reflecting the light in the optical path, and the second optical path is The reflection surface of the first mirror part is retracted, and the light is not reflected on the reflection surface.

  The present invention is characterized in that, in the above invention, the first mirror section includes a mirror that does not advance and retreat, and a mirror that moves in parallel with the mirror that does not advance and retreat.

  According to the present invention, in the above invention, the driving device that advances and retracts the reflecting surface of the first mirror unit, and the imaging unit, the first mirror unit, the second mirror unit, and the driving device are housed inside. And a housing.

  In the surface mounting machine according to the present invention, in the above invention, the electronic component includes a mounting component, the mounting component is imaged by the imaging unit, and the position or height of a terminal or lead of the mounting component is detected. It further has a detection part.

  In the component inspection apparatus according to the present invention, in the above invention, the electronic component includes an electronic component to be inspected, the electronic component to be inspected is imaged by the imaging unit, and a terminal or a lead position of the electronic component to be inspected And a detecting unit for detecting the height.

According to the present invention, the switching member can be positioned on the optical axis of the imaging unit. The first and second optical paths can be formed so as to extend from the switching member to the electronic component side. For this reason, since the first and second optical paths can be formed without being greatly separated from the optical axis of the imaging unit, the component imaging device can be formed in a compact manner.
Therefore, according to the present invention, it is possible to provide a component imaging apparatus capable of realizing a function of imaging an electronic component from both a direction perpendicular to the mounting surface and an oblique direction with a simple structure and compactly.

  According to the invention provided with the illumination device, an effective optical path can be formed by the first slit and the second slit formed in the illumination device.

  According to the invention in which the imaging unit includes a line sensor, it is not necessary to stop the electronic component during imaging, and thus imaging is completed in a short time. Further, the length of one side of the electronic component that can be imaged by the line sensor is within the formation width of the line sensor, and the length of the other side is relatively difficult to be restricted. For this reason, the component imaging device according to the present invention has a higher degree of freedom in the size of electronic components that can be imaged as compared with a conventional component imaging device configured by an area sensor.

  According to the invention in which the first slit and the second slit extend in the longitudinal direction of the line sensor, an effective optical path can be formed when the line sensor is used.

  According to the invention in which the illumination device has a plurality of illumination units, an effective optical path can be formed by switching between lighting and extinction points of the illumination unit.

  According to the invention in which the switching member includes the first mirror part and the second mirror part, the switching of the optical path can be easily realized by the mirror.

  According to the invention in which the first optical path is formed by advancing and retracting mirrors and reflecting the light in the second optical path, the optical path can be switched with a simple structure that only moves one mirror. Therefore, it is possible to provide a component imaging device with a low manufacturing cost.

  According to the invention including the mirror in which the first mirror part does not advance and retreat and the mirror that moves in parallel with the mirror that does not advance and retreat, the first mirror part can be easily formed by the mirror.

  According to the invention including the drive device and the housing, the first optical path and the second optical path can be compactly formed in the housing that houses the imaging unit.

  The surface mounting machine according to the present invention includes a component imaging device capable of imaging an electronic component from both a direction perpendicular to the mounting surface and an oblique direction, and thus a conventional surface including two component imaging devices. Compared with a mounting machine, the manufacturing cost can be reduced and the size can be reduced. The small size here means that the occupied floor area of the surface mounter is reduced.

  Since the component inspection apparatus according to the present invention includes a component imaging device capable of imaging an electronic component from both a direction perpendicular to the mounting surface and an oblique direction, the conventional component including two component imaging devices is provided. Compared with an inspection apparatus, the manufacturing cost is reduced and the apparatus can be formed in a small size. Small here means that the occupied floor area of the component inspection apparatus is reduced.

It is a top view of the surface mounter which uses the component imaging device which concerns on this invention. FIG. 2 is a schematic diagram illustrating a schematic configuration of a component imaging apparatus, and illustrates a state in which a first optical path is formed. It is a schematic diagram which shows the structure of the outline of a component imaging device, The figure has shown the state in which the 2nd optical path is formed. FIG. 6 is a cross-sectional view of the component imaging apparatus, and shows a state where a first optical path is formed. FIG. 5 is a partial cross-sectional view of the component imaging apparatus, and shows a state in which a second optical path is formed. It is a perspective view of a component imaging device. FIG. 3 is a front view of the driving device, and shows a state in which a first optical path is formed. It is the VIII-VIII sectional view taken on the line in FIG. FIG. 3 is a front view of the driving device, and shows a state in which a second optical path is formed. It is the XX sectional view taken on the line in FIG. It is a disassembled perspective view of the principal part of a component imaging device. It is a perspective view which fractures | ruptures and shows the principal part of a component imaging device. It is a perspective view of the principal part of a component imaging device. It is a top view of an illuminating device. It is sectional drawing of an illuminating device, The figure is the XV-XV sectional view taken on the line in FIG. It is a perspective view of an illuminating device. FIG. 4A is a plan view for explaining an illumination pattern, in which FIG. 1A shows an illumination pattern when a lower surface of a standard part is recognized, FIG. 2B shows an illumination pattern when an underside of a ball part is recognized, and FIG. C) shows the illumination pattern when recognizing the lower surface of the mirror part, FIG. 4D shows the illumination pattern when copra recognition of the standard part, the lead part, and the ball part, and FIG. An illumination pattern at the time of copra recognition when there is an unevenness and a shadow is generated is shown, and FIG. 8F shows an illumination pattern at the time of copra recognition when it is desired to recognize the ball apex of the mirror surface component and the ball component. It is a block diagram which shows the structure of the control system of the surface mounter which concerns on this invention. It is a flowchart for demonstrating the imaging operation of the surface mounter based on this invention.

  Hereinafter, an embodiment of a component imaging device and a surface mounter according to the present invention will be described in detail with reference to FIGS. In this embodiment, an example in which the component imaging apparatus according to the present invention is assembled to a surface mounter will be described.

  A surface mounter 1 shown in FIG. 1 includes a base 2 formed in a square shape in a plan view, and a printed wiring board transport unit 3 provided so as to cross the top of the base 2 in the left-right direction in the figure. The component supply unit 4 provided at both ends of the base 2 so as to sandwich the printed wiring board transport unit 3, the component moving unit 5 provided above the base 2, and a component imaging device 11 to be described later And a detection unit 10 that picks up an image of the mounting component and detects the position and height of the terminal or lead of the mounting component. In this specification, a direction in which the printed wiring board transport unit 3 extends is referred to as an X direction, and a horizontal direction orthogonal to the X direction is referred to as a Y direction.

  The printed wiring board transport unit 3 includes a pair of conveyors 6. These conveyors 6 each convey a printed wiring board 7 as a “board” in the present invention in the X direction. The operations of these conveyors 6 are controlled by a conveyor control unit 9 provided in the control device 8 (see FIG. 18) of the surface mounter 1. A component imaging device 11 to be described later is arranged on the side of these conveyors 6.

The component supply unit 4 is for attaching an electronic component supply device. In this embodiment, a large number of tape feeders 12 are used as the electronic component supply device.
The component moving unit 5 includes a pair of Y rail units 13 provided on both ends of the base 2 in the X direction, and an X rail unit 14 supported by the Y rail units 13 so as to be movable in the Y direction. The head unit 15 is supported by the X rail unit 14 so as to be movable in the X direction. The head unit 15 includes a plurality of suction heads (not shown).

  These suction heads have a function of sucking the electronic component 17 by a suction nozzle 16 (see FIGS. 4 and 5) provided at the lower end, a function of moving the suction nozzle 16 in the vertical direction, and a vertical direction of the suction nozzle 16. And a function of rotating about the axis of the axis. The operation of each driving device used in the component moving unit 5 is controlled by the control device 8. As shown in FIG. 18, the drive unit provided in the component moving unit 5 includes an X rail unit drive unit 18, a head unit transfer drive unit, a suction head drive unit, and the like.

  The operation of each drive unit of the component moving unit 5 is controlled by the axis control unit 21 of the control device 8. As shown in FIG. 18, the control device 8 includes a main control unit 22 that integrally performs various controls, a storage unit 23 that stores information on the printed wiring board 7 and the electronic component 17, and a control unit for each actuator. It has. As a control unit for each actuator, the conveyor control unit 9, the axis control unit 21, a camera control unit 24 for controlling operations of the component imaging device 11 to be described later, an illumination control unit 25, and I / O signal control. Part 26 and the like.

  The component imaging device 11 is for imaging the electronic component 17 sucked by the suction nozzle 16 from below. The component imaging device 11 captures two types of images. One of these images, as shown in FIG. 2, is a bottom image obtained by capturing the electronic component 17 from a direction (downward) perpendicular to the mounting surface. The mounting surface here is a virtual plane on which all the soldered portions of the electronic component 17 are located. As shown in FIG. 3, the other image is an oblique image obtained by imaging the electronic component 17 from an oblique direction that is inclined with respect to the perpendicular direction.

  These bottom and oblique images are taken so that the soldering terminals (not shown) of the electronic component 17 and the leads 17a are also taken together with the package portion 17b of the electronic component 17. In this embodiment, the “mounting terminal” referred to in the present invention is constituted by the soldering terminal of the electronic component 17 and the lead 17a. Examples of the electronic component 17 having the soldering terminal include a chip component such as a chip resistor, and a semiconductor device such as BGA and CSP. As the electronic component 17 having the lead 17a, for example, there is a semiconductor device such as a QFP in which a lead protrudes laterally from a package portion.

  The lower surface image is mainly used by the control device 8 to determine the suction state of the electronic component 17. Hereinafter, the operation in which the control device 8 recognizes the electronic component 17 using the lower surface image is referred to as “lower surface recognition”. The control device 8 measures the suction state of the electronic component 17 sucked by the suction nozzle 16 based on the result of the lower surface recognition, the presence / absence of a defect in the package or terminal of the electronic component 17 or the lead 17a, and the electronic component 17 Determine correctness.

  The oblique image is used by the control device 8 to perform a so-called coplanarity check. Hereinafter, the operation in which the control device 8 performs the coplanarity check based on the oblique image is simply referred to as “copra recognition”. Based on the result of the copra recognition, the control device 8 makes various determinations on the terminals of the electronic component 17 and the leads 17a sucked by the suction nozzle 16 as described later. When the electronic component 17 has many hemispherical terminals, it is determined whether or not the height of each terminal is within an allowable range using an oblique image. In this case, it is also determined whether or not the flatness of the mounting surface including the vertex of the terminal is within an allowable range.

  When the electronic component 17 has a large number of leads 17a, it is determined whether the flatness of the end face of each lead 17a is within an allowable range, and whether the bending of the lead 17a is within an allowable range. And whether or not the floating of the lead 17a is within an allowable range is determined. Note that image processing when performing bottom surface recognition or copra recognition can be performed using a technique as disclosed in, for example, Japanese Patent Application Laid-Open No. 2005-340648.

  The component imaging apparatus 11 according to this embodiment is configured using one camera 31 as shown in FIGS. 2 and 3. The camera 31 includes a line sensor 32 as an image sensor. In this embodiment, the camera 31 constitutes an “imaging unit” in the present invention. The imaging operation of the camera 31 is performed by the camera control unit 24 of the control device 8. The optical axis 33 of the camera 31 is directed upward in the vertical direction in this embodiment.

The direction in which the electronic component 17 is moved when imaged by the line sensor 32 is the left-right direction in FIGS. 2 and 3, and is the X direction shown in FIG. The camera 31 is installed in the housing 34 of the component imaging device 11 so that the optical axis 33 is biased to one side in the X direction (rightward in FIG. 4) by a predetermined distance from the imaging position A.
The component imaging apparatus 11 includes a first optical path 36 (see FIG. 2) that can be switched using a movable optical component 35 in order to capture the lower surface image and the oblique image with one camera 31. 2 optical paths 37 (see FIG. 3). The first optical path 36 is an optical path for capturing the lower surface image, that is, an optical path for capturing the electronic component 17 by the camera 31 from a direction perpendicular to the mounting surface of the printed wiring board. The second optical path 37 is an optical path for capturing the oblique image, that is, the electronic component 17 is moved from the direction inclined toward the printed wiring board 7 with respect to the direction perpendicular to the mounting surface of the printed wiring board 7. It is an optical path for imaging with a camera.

  As shown in FIGS. 4 and 5, the optical component 35 according to this embodiment includes a first mirror 38 and a movable holder 39 that supports the first mirror 38. The first mirror 38 and the movable movable holder 39 are formed to be elongated so as to extend in the Y direction (direction perpendicular to the paper surface of FIGS. 4 and 5). Both ends in the longitudinal direction of the movable holder 39 are supported by the upper frame 41 of the component imaging device 11 through a linear guide 42 so as to be movable in parallel.

  The upper frame 41 constitutes the upper wall of the housing 34. As shown in FIG. 11, the linear guide 42 includes a rail 42a fixed to the upper frame 41 and a slider 42b supported movably on the rail 42a. The movable holder 39 is fixed to the slider 42b. The rail 42a is fixed to a first inclined surface 41b formed on both side walls 41a (see FIG. 11) of the upper frame 41.

As shown in FIGS. 4 and 5, the first inclined surface 41 b is formed so as to obliquely cross the optical axis 33 of the camera 31 when viewed from the Y direction. The direction in which the first inclined surface 41 b is inclined is a direction that gradually increases from the optical axis 33 toward the imaging position A. The first inclined surface 41b according to this embodiment is inclined at about 45 degrees with respect to the horizontal. For this reason, the movable holder 39 moves in parallel obliquely along the first inclined surface 41b. The movable holder 39 is connected to a drive device 43 (see FIGS. 6 to 10) described later, and moves along the first inclined surface 41 b when driven by the drive device 43.
The first mirror 38 is attached to the lower surface of the movable holder 39 so that the reflecting surface 38a is directed downward.

  As shown in FIG. 4, in the first optical path 36, the movable holder 39 rises along the first inclined surface 41 b, and the reflecting surface 38 a of the first mirror 38 moves along the optical axis 33 of the camera 31. Formed by traversing. Further, as shown in FIG. 5, in the second optical path 37, the movable holder 39 is lowered along the first inclined surface 41 b, and the reflecting surface 38 a of the first mirror 38 is the optical axis 33 of the camera 31. It is formed by coming off.

  As shown in FIGS. 2 and 4, the first optical path 36 includes the first mirror 38, a second mirror 44 facing the first mirror 38, and a first illumination device 45 described later. The slit 46 (see FIG. 4). In this embodiment, the second mirror 44 constitutes a “mirror that does not advance and retreat” according to the present invention, and the first mirror 38 moves in parallel with the “mirror that does not retreat and retreat” according to the present invention. Mirror that moves forward and backward. The reflective surface 38a of the first mirror 38 constitutes the “reflective surface that can be advanced and retracted” in the present invention. Further, the optical member 35 having the first mirror 38 and the second mirror 44 constitute the “first mirror portion having a reflective surface that can be advanced and retracted” according to the present invention. This first mirror portion is shown as 11A in FIGS.

  The second mirror 44 is a half mirror and is located immediately below the imaging position A, that is, below the vertical direction. The reason why the second mirror 44 is formed by a half mirror is to provide a lower illumination 47 below the second mirror 44. The lower illumination 47 illuminates the electronic component 17 from below along the first optical path 36 through the second mirror 44 formed of a half mirror.

  As shown in FIG. 11, the second mirror 44 is formed in a plate shape extending in the Y direction. Both ends of the second mirror 44 are fixed to a second inclined surface 41c (see FIG. 11) formed on the upper frame 41 so as to be adjacent to the first inclined surface 41b. The second inclined surface 41c is formed in parallel with the first inclined surface 41b. For this reason, the second mirror 44 is inclined with respect to the horizontal so as to be parallel to the first mirror 38. In the component imaging apparatus 11 according to this embodiment, since the first mirror 38 and the second mirror 44 are supported by one upper frame 41, these mirrors 38 and 44 are easily paralleled with high accuracy. Can be arranged.

As shown in FIG. 14, the first slit 46 is formed in a central portion of a lighting device 45 described later. The first slit 46 is formed to extend in parallel with the longitudinal direction of the line sensor 32.
As shown in FIGS. 3 and 5, the second optical path 37 includes a third mirror 51 that intersects the optical axis 33 of the camera 31 at a position higher than the first mirror 38, and the third mirror 51. Are formed by a fourth mirror 52 that faces the second slit 53 and a second slit 53 of the illumination device 45 described later. In this embodiment, the third mirror 51 and the fourth mirror 52 constitute the “second mirror portion having a reflection surface that does not advance and retreat” according to the present invention. This second mirror portion is shown as 11B in FIGS. The second mirror portion 11B and the first mirror portion 11A described above constitute a switching member 11C (see FIGS. 2 and 3) in the present invention.

  The third mirror 51 and the fourth mirror 52 are each formed in an elongated strip shape extending in the Y direction. These third and fourth mirrors 51 and 52 are supported by a fixed holder 54 mounted on the upper frame 41 in a state inclined at a predetermined angle. The optical path length of the second optical path 37 is determined by the tilt angle of the third mirror 51, the horizontal position of the fourth mirror 52, the tilt angle, and the like. The optical path length of the second optical path 37 according to this embodiment is formed to match the optical path length of the first optical path 36 described above. Since the optical path length of the first optical path 36 and the optical path length of the second optical path 37 coincide with each other, it is possible to clearly capture both the lower surface image and the oblique image with one camera 31.

  The drive device 43 for driving the movable holder 39 includes an air cylinder 55 as a drive source, as shown in FIGS. The air cylinder 55 includes a cylinder body 55a attached to the housing 34 of the component imaging device 11, a piston rod 55b protruding upward from the cylinder body 55a, and a slider 55c attached to the piston rod 55b. Has been. The operation of the cylinder body 55 a is controlled by the I / O signal control unit 26 of the control device 8.

  The slider 55c is supported by the cylinder body 55a so as to be movable in the vertical direction. As shown in FIG. 12, a roller 57 is attached to the slider 55c via a support bracket 56. The axial direction of the roller 57 is directed in the Y direction. A pressure receiving member 58 attached to the lower end of the movable holder 39 is placed on the roller 57 from above. The lower surface of the pressure receiving member 58 is formed to be a substantially horizontal flat surface. The movable holder 39 is biased obliquely downward along the first inclined surface 41b by the spring force of a tension coil spring 59 (see FIG. 13) provided between the movable holder 39 and the housing 34. Therefore, the pressure receiving member 58 is pressed against the roller 57 from above by the spring force.

  In the driving device 43, the slider 55c moves upward by driving by the cylinder body 55a, so that the roller 57 rolls on the lower surface of the pressure receiving member 58 and is movable with the pressure receiving member 58 as shown in FIGS. The holder 39 moves obliquely upward against the spring force of the tension coil spring 59. The stop position when the movable holder 39 moves obliquely upward is regulated by a stopper 60 attached to the upper frame 41.

  The stopper 60 is arrange | positioned so that the upper end part of the movable holder 39 may contact, as shown in FIG.7 and FIG.8. When the movable holder 39 hits the stopper 60, the first mirror 38 intersects the optical axis 33 of the camera 31. For this reason, when the movable holder 39 moves obliquely upward until it hits the stopper 60, the first mirror 38 is positioned so as to intersect the optical axis 33 of the camera 31, and the second optical path 37 is set to the first mirror 38. The first optical path 36 is formed.

  On the other hand, when the slider 55c is moved downward by the drive of the cylinder body 55a, the roller 57 is lowered, and the pressure receiving member 58 is tilted downward together with the movable holder 39 while being pressed against the roller 57 by the spring force of the tension coil spring 59. Descend. As a result, the first mirror 38 is disengaged from the optical axis 33 of the camera 31, and the first optical path 36 disappears to form the second optical path 37.

  The illumination device 45 is for illuminating the electronic component 17 located at the imaging position A from below. As shown in FIGS. 14 to 16, the illuminating device 45 includes a large number of LEDs 61 as light sources, and is fixed on the upper frame 41. As shown in FIG. 15, the illumination device 45 includes a side illumination unit 62 located at the upper end, a lower illumination unit 63 located at the lower end, and the side illumination unit 62 and the lower illumination unit 63. It is comprised by the diagonal illumination part 64 located in between.

  As shown in FIGS. 14 to 16, the side illumination unit 62 includes eight substrates 62 </ b> A to 62 </ b> H on which a large number of LEDs 61 are mounted. As shown in FIG. 14, these substrates 62 </ b> A to 62 </ b> H are arranged so that an octagon is formed when viewed from above. Each of the substrates 62A to 62H is erected so that the LED 61 is directed toward the center of the octagon. The LED 61 of the side illumination unit 62 illuminates the electronic component 17 at the imaging position from obliquely below near the horizontal.

  The lower illumination unit 63 includes first to third substrates 63A to 63C on which a large number of LEDs 61 are mounted. These three substrates 63A to 63C are formed in a rectangular shape that is long in the Y direction (vertical direction in FIG. 14), and are arranged at a predetermined interval in the X direction. Among these first to third substrates 63A to 63C, the first substrate 63A located on one end side in the X direction is inclined and installed so that the LED 61 is directed to the imaging position A as shown in FIG. Has been. The LED 61 of the first substrate 63A irradiates light to the electronic component 17 at the imaging position A from obliquely below.

  The other second and third substrates 63B and 63C are installed substantially horizontally so that the LEDs 61 are directed upward. The LEDs 61 of the second and third substrates 63B and 63C irradiate the electronic component 17 at the imaging position A with light from below in the vertical direction. Between these second and third substrates 63B and 63C, a space S1 extending in the Y direction, that is, parallel to the longitudinal direction of the line sensor 32 is formed. The space S1 constitutes a first slit 46 that becomes a part of the first optical path 36.

  The oblique illumination unit 64 is configured by eight substrates 64A to 64H on which a large number of LEDs 61 are mounted. These substrates 64 </ b> A to 64 </ b> H are each formed in a trapezoidal shape, and are arranged so that the long sides are positioned below the substrates 62 </ b> A to 62 </ b> H of the side illumination unit 62. These substrates 64 </ b> A to 64 </ b> H are inclined so that the LEDs 61 are directed obliquely upward. The LEDs 61 of these substrates 64A to 64H irradiate light to the electronic component 17 at the imaging position from obliquely below.

  Of the eight substrates 64A to 64H of the oblique illumination unit 64, the lower ends of the three substrates 64F to 64H located on one end side in the X direction and above the first substrate 63A of the lower illumination unit 63. Are formed with optical path forming portions 65 to 67 through which the light emitted from the LEDs 61 of the first substrate 63A passes.

  Of the eight substrates 64A to 64H of the oblique illumination unit 64, at the lower end portions of the three substrates 64B to 64D located on the other end side in the X direction, as shown in FIG. Is formed. Between these optical path forming portions 68 to 70 and the third substrate 63 </ b> C, a space S <b> 2 is formed extending in the Y direction, that is, in parallel with the longitudinal direction of the line sensor 32. This space S2 constitutes a second slit 53 that becomes a part of the second optical path 37.

Each LED 61 of the illumination device 45 emits light based on a predetermined illumination pattern. Switching of light emission and extinction of each LED 61 is performed by the illumination control unit 25 of the control device 8.
Six types of illumination patterns are set as described later according to the type of electronic component 17 to be imaged, the surface state of the terminals and leads 17a, the imaging direction, and the like.

(A) First illumination pattern:
When the lower surface recognition is performed and the standard electronic component 17 having the flat mounting surface and the lead 17a is imaged, the LED 61 is caused to emit light with the first illumination pattern.
In the first pattern, as shown by hatching in FIG. 17A, most of the LEDs 61 of the lower illumination unit 63 and most of the LEDs 61 of the oblique illumination unit 64 emit light. The LED 61 that does not emit light in the lower illumination unit 63 and the oblique illumination unit 64 is the LED 61 in a position surrounding the first slit 46.

(B) Second illumination pattern:
When the lower surface recognition is performed and the electronic component 17 having the hemispherical terminal is imaged, the LED 61 is caused to emit light with the second illumination pattern. In addition, when the surface of a hemispherical terminal is a mirror surface, LED61 is made to light-emit with the 3rd illumination pattern mentioned later.
In the second pattern, as shown by hatching in FIG. 17B, the LED 61 of the side illumination unit 62 is caused to emit light.

(C) Third illumination pattern:
When the lower surface recognition is performed and the mounting surface of the terminal or the lead 17a is a mirror surface, the LED 61 is caused to emit light with the third illumination pattern.
In the third pattern, as shown by hatching in FIG. 17C, some of the LEDs 61 of the lower illumination unit 63 and some of the LEDs 61 of the oblique illumination unit 64 are caused to emit light. The LED 61 that emits light at this time is the LED 61 in a position surrounding the first slit 46. Further, in the third pattern, the lower illumination 47 positioned below the second mirror 44 is also caused to emit light.

(D) Fourth illumination pattern:
When performing copra recognition, image a standard component (standard component) having a terminal with a flat mounting surface, an electronic component having a lead 17a (lead component), a ball component having a hemispherical terminal, etc. If so, the LED 61 is caused to emit light with the fourth illumination pattern.
In the fourth pattern, as shown by hatching in FIG. 17D, some of the LEDs 61 of the lower illumination unit 63 and some of the LEDs 61 of the oblique illumination unit 64 are caused to emit light. The LED 61 that emits light at this time is an LED 61 that is located on the opposite side in the X direction from the second slit 53.

(E) Fifth illumination pattern:
In the case of performing copra recognition, when the unevenness is formed on the surface of the lead component and a shadow is likely to occur, the LED 61 is caused to emit light with the fifth illumination pattern. In addition, when the surface of a hemispherical terminal is a mirror surface, LED61 is made to light-emit with the 6th illumination pattern mentioned later.
In the fifth illumination pattern, as shown by hatching in FIG. 17E, some of the LEDs 61 of the lower illumination unit 63 and some of the LEDs 61 of the oblique illumination unit 64 are caused to emit light. The LED 61 that emits light at this time is the LED 61 in a position surrounding the first slit 46.

(F) Sixth illumination pattern:
In the case of performing copra recognition, when it is desired to recognize the specular surface component in which the mounting surface of the terminal and the lead 17a is a mirror surface and the ball apex of the ball component, the LED 61 is caused to emit light with the sixth illumination pattern.
In the sixth pattern, as indicated by hatching in FIG. 17F, only the LED 61 mounted on the first substrate 63A of the lower illumination unit 63 emits light.

Next, the operation of the surface mounter 1 having the component imaging device 11 described above will be described with reference to the flowchart shown in FIG.
After the suction operation of the electronic component 17 is performed in the surface mounter 1 (step S1), the lower surface is recognized in step S2. In this lower surface recognition step, the component imaging device 11 captures the lower surface image by the camera 31 while the surface mounting machine 1 translates the suction nozzle 16 that has attracted the electronic component 17 in the X direction near the upper part of the component imaging device 11. To do. This imaging is performed in a state where the air cylinder 55 is operated so that the first mirror 38 intersects the optical axis 33 of the camera 31. The surface mounter 1 performs lower surface recognition using the lower surface image thus captured, and performs the above-described measurement, discrimination, and the like.

Thereafter, in step S3, the control device 8 determines whether or not to perform a coplanarity check. When the coplanarity check is not performed, the process proceeds to step S4, and the surface mounter 1 performs the mounting operation.
On the other hand, when the coplanarity check is performed, the control device 8 operates the air cylinder 55 so that the first mirror 38 is obliquely removed from the optical axis 33 of the camera 31 in the optical path switching step shown in step S5.

  The component imaging apparatus 11 captures an oblique image in a state where the first mirror 38 is moved and the second optical path 37 is formed in the copra recognition step shown in step S6. The oblique image is picked up by the camera 31 while the electronic component 17 on which the lower surface image is picked up is again translated in the X direction above the component image pickup device 11. The surface mounter 1 performs copra recognition and coplanarity check using the lower surface image captured first and the oblique image captured this time.

  Thereafter, in step S7, the control device 8 determines whether or not the bending of the lead 17a and the lead floating of the electronic component 17 are within an allowable range. When the bending of the lead 17a or the lead floating is outside the allowable range, the control device 8 proceeds to step S8 and stops the mounting operation. In this case, the control device 8 performs an operation for notifying the driver of the occurrence of an error or an operation for discarding the sucked electronic component 17. If the bending of the lead 17a or the floating of the lead is within the allowable range, the control device 8 proceeds to step S9 and performs a mounting operation.

  The component imaging apparatus 11 configured as described above includes a camera 31 that images a plurality of mounting terminals (terminals and leads 17a) of the electronic component 17 mounted on the printed wiring board 7, and first and second optical paths. 36, 37 and an optical component 35 for switching the optical path. The first optical path 36 is an optical path for imaging the mounting terminal by the camera 31 from a direction perpendicular to the mounting surface including the plurality of mounting terminals. The second optical path 37 is an optical path for imaging the mounting terminal by the camera 31 from a direction inclined with respect to the perpendicular direction, and is an optical path whose optical path length matches the first optical path 36. . The optical component 35 switches the optical path so that one of the first optical path 36 and the second optical path 37 is connected to the camera 31.

  Therefore, according to this embodiment, when the optical component 35 connects the first optical path 36 to the camera 31, the camera 31 images the electronic component 17 from a direction perpendicular to the mounting surface. On the other hand, when the optical component 35 connects the second optical path 37 to the camera 31, the camera 31 captures an image of the electronic component 17 from an oblique direction inclined with respect to the perpendicular direction. For this reason, the electronic component 17 can be imaged from the two directions by the single camera 31.

The optical component 35 according to this embodiment is positioned on the optical axis 33 of the camera 31. The first and second optical paths 36 and 37 are formed to extend from the optical component 35 to the electronic component 17 side. For this reason, the first and second optical paths 36 and 37 can be formed without being greatly separated from the optical axis 33 of the camera 31, so that the component imaging apparatus 11 can be formed compactly.
Therefore, according to this embodiment, it is possible to provide a component imaging device capable of realizing the function of imaging the electronic component 17 from both the direction perpendicular to the mounting surface and the oblique direction with a simple structure and compactly. Can do.

  The image sensor of the camera 31 according to this embodiment is a line sensor 32. For this reason, the component imaging apparatus 11 according to this embodiment does not require the electronic component 17 to be stationary during imaging, and thus imaging is completed in a short time. In addition, the length of one side of the electronic component 17 that can be imaged by the line sensor 32 is within the formation width of the line sensor 32, and the length of the other side is relatively unaffected. For this reason, the component imaging device 11 according to this embodiment has a higher degree of freedom in the size of the electronic component 17 that can be imaged as compared to a conventional component imaging device configured by an area sensor.

  The component imaging device 11 according to this embodiment includes an illumination device 45 between the camera 31 and the electronic component 17. The illumination device 45 is for irradiating the electronic component 17 with light. The illumination device 45 is formed with a first slit 46 that constitutes a part of the first optical path 36 and a second slit 53 that constitutes a part of the second optical path 37. These first and second slits 46 and 53 are formed to extend in parallel with the longitudinal direction of the line sensor 32.

  For this reason, the illuminating device 45 can sufficiently irradiate the electronic component 17 with light even though the first and second optical paths 36 and 37 cross. Therefore, according to this embodiment, both an image obtained by imaging the electronic component 17 from a direction perpendicular to the mounting surface and an image obtained by imaging the electronic component 17 from an oblique direction inclined with respect to the perpendicular direction are provided. It is possible to provide a component imaging device in which an image becomes clear.

The illumination device 45 has a plurality of illumination units (a side illumination unit 62, a lower illumination unit 63, and an oblique illumination unit 64) that can be switched on and off. The illuminating device 45 is configured to switch the illumination of the first optical path 36 and the second optical path 37 by switching on / off the illumination units.
For this reason, according to this embodiment, the optimal illumination according to the state of the lead 17a and the terminal of the electronic component 17 can be performed at the time of lower surface recognition and copra recognition, respectively.

  The switching member 11C according to this embodiment includes a first mirror portion 11A having a reflective surface that can advance and retreat, and a second mirror portion 11B having a reflective surface that does not advance and retract. Therefore, according to this embodiment, the switching between the first optical path 36 and the second optical path 37 can be easily realized by the mirror (first mirror 38).

The first optical path 36 according to this embodiment is formed by the reflection surface 38a of the first mirror portion 11A configured to be able to advance and retreat, and reflecting the light in the optical path.
The second optical path 37 is formed by the reflection surface 38a of the first mirror portion 11A leaving and the light not reflecting on the reflection surface 38a.
For this reason, according to this embodiment, since the optical path can be switched with a simple structure that only moves one mirror (first mirror 38), a component imaging device with low manufacturing cost is provided. be able to.

The first mirror portion 11A according to this embodiment includes a mirror that does not advance and retreat (second mirror 44) and a mirror that moves in parallel with the mirror that does not advance and retreat (first mirror 38). It is out.
For this reason, according to this embodiment, the optical path can be changed with a simple mirror structure.

The component imaging device 11 according to this embodiment includes a driving device 43 that moves the reflecting surface 38a of the first mirror unit 11A back and forth, the imaging unit (camera 31), the first mirror unit 11A, and the second mirror unit 11A. A mirror unit 11B and a housing 34 for housing the driving device 43 therein are provided.
Therefore, according to this embodiment, the first optical path 36 and the second optical path 37 can be formed compactly in the housing 34 that houses the camera 31.

The first mirror 31 of the first mirror portion 11 </ b> A moves forward and backward with respect to the second optical path 37 by driving by a driving device 43 supported by the housing 34.
For this reason, the first mirror 38 can be automatically moved under the control of the control device 8, so that imaging using the second optical path 37 can be performed immediately after imaging using the first optical path 36 is completed. it can. Therefore, according to this embodiment, it is possible to provide a component imaging apparatus capable of performing the two types of imaging in a shorter time.

The surface mounter 1 according to this embodiment includes the detection unit 10 that images the electronic component 17 by the above-described component imaging device 11 and detects the position and height of the terminal of the electronic component 17 or the lead 17a. For this reason, the surface mounter 1 is formed in a smaller size as compared with a conventional surface mounter having two component image pickup devices, because the number of component image pickup devices is halved and the manufacturing cost is reduced. be able to. The small size here means that the occupied floor area of the surface mounter is reduced.
In addition, since the surface mounter 1 uses the component imaging device 11 in which the image sensor is the line sensor 32, it is not necessary to stop the electronic component 17 during imaging, and the mounting is performed including the imaging time of the electronic component 17. Time can be shortened.

In the embodiment described above, an example in which the “switching member” referred to in the invention of claim 1 is configured using the mirror (first mirror 38) has been shown. However, the switching member according to the present invention can be constituted by a prism.
The component imaging device according to the present invention can be applied to any device other than the surface mounter as long as the device moves the electronic component by the suction nozzle. For example, although not shown, the component imaging apparatus according to the present invention is applied to a component inspection apparatus that images the appearance of an electronic component to be inspected sucked by a suction nozzle and inspects the electronic component by image processing. be able to. Further, even in the case of a component inspection apparatus that electrically inspects by loading an electronic component in a socket, the electronic component for inspection sucked by the suction nozzle is imaged by the component imaging device, and the terminal of the electronic component for inspection or The component imaging device according to the present invention can be used as long as it has a detection unit that detects the position and height of the lead.

The electronic component inspection device equipped with the component recognition device according to the present invention is lower in manufacturing cost because the number of component imaging devices is halved compared to a conventional component inspection device having two component imaging devices. And can be made small. Small here means that the occupied floor area of the component inspection apparatus is reduced.
Further, this component inspection apparatus can shorten the inspection time of the electronic component because it is not necessary to stop the electronic component during imaging by using the component imaging device 11 whose imaging element is a line sensor.

  DESCRIPTION OF SYMBOLS 1 ... Surface mounter, 7 ... Printed wiring board (board | substrate), 11 ... Component imaging device, 11A ... 1st mirror part, 11B ... 2nd mirror part, 11C ... Switching member, 17 ... Electronic component, 17b ... Lead 31 ... Camera (imaging part), 34 ... Housing, 35 ... Switching member, 36 ... First optical path, 37 ... Second optical path, 38 ... First mirror (moving forward / backward mirror), 38a ... Reflecting surface (advancing / retreating) Possible reflection surface), 39 ... Movable holder, 45 ... Illuminating device, 43 ... Driving device, 44 ... Second mirror (mirror that does not move forward and backward), 46 ... First slit, 51 ... Third mirror, 52 ... First 4 mirrors, 53 ... second slit, 55 ... air cylinder, 62 ... side illumination part, 63 ... lower illumination part, 64 ... oblique illumination part.

Claims (10)

A first optical path for capturing an image of the lower surface of the electronic component from the direction perpendicular to the mounting surface of the substrate by the imaging unit;
An optical path for capturing an oblique image of the electronic component by the imaging unit from a direction inclined toward the board with respect to a direction perpendicular to the mounting surface of the board, and has the same optical path length as the first optical path. A second optical path;
Consists of
A switching member that switches between the first optical path and the second optical path ;
An illumination device that is located between the switching member and the electronic component and irradiates light to the electronic component;
With
In the lighting device,
A first slit constituting a part of the first optical path ;
A component imaging apparatus , comprising: a second slit that forms part of the second optical path . The component imaging apparatus according to claim 1 ,
The component imaging apparatus, wherein the imaging unit includes a line sensor. In the component imaging device according to claim 2 ,
The component imaging device, wherein the first slit and the second slit are formed to extend in a longitudinal direction of the line sensor. In the component imaging device according to any one of claims 1 to 3,
The illumination device has a plurality of illumination units that can be switched on and off, and switches between illumination of the first optical path and the second optical path by switching on and off of the illumination units. A component imaging device characterized by the above. In the component imaging device according to any one of claims 1 to 4 ,
The switching member is
A first mirror section having a reflective surface that can be advanced and retracted;
A component imaging apparatus comprising: a second mirror portion having a reflective surface that does not advance and retreat. In the component imaging device according to claim 5 ,
The first optical path is formed by the reflection surface of the first mirror unit configured to be able to advance and retreat, and reflecting the light in the optical path,
The component imaging apparatus, wherein the second optical path is formed by the reflection surface of the first mirror portion leaving and the light not reflecting on the reflection surface. In the component imaging device according to claim 5 or 6 ,
The first mirror part is
A mirror that doesn't move forward and backward
A mirror that moves in parallel with the mirror that does not move forward and backward, and
A component imaging device comprising: In the component imaging device according to any one of claims 5 to 7 ,
A drive device for advancing and retreating the reflecting surface of the first mirror unit;
A housing that houses the imaging unit, the first mirror unit, the second mirror unit, and the driving device;
A component imaging apparatus further comprising: In the component imaging device according to any one of claims 1 to 8 ,
The electronic component includes a mounting component,
A surface mounter further comprising a detection unit that images a mounting component by the imaging unit and detects a position or height of a terminal or lead of the mounting component. In the component imaging device according to any one of claims 1 to 8 ,
The electronic component includes an electronic component for inspection,
A component inspection apparatus, further comprising: a detection unit that images an electronic component to be inspected by the imaging unit and detects a position or height of a terminal or a lead of the electronic component to be inspected.

Images