CN114322756B - Dual-mode QFP and SOP packaging component pin coplanarity detection system - Google Patents
Dual-mode QFP and SOP packaging component pin coplanarity detection system Download PDFInfo
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- CN114322756B CN114322756B CN202111364898.7A CN202111364898A CN114322756B CN 114322756 B CN114322756 B CN 114322756B CN 202111364898 A CN202111364898 A CN 202111364898A CN 114322756 B CN114322756 B CN 114322756B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 238000001514 detection method Methods 0.000 title claims abstract description 25
- 238000005259 measurement Methods 0.000 claims abstract description 40
- 238000006073 displacement reaction Methods 0.000 claims abstract description 16
- 230000000630 rising effect Effects 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 7
- 230000006855 networking Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012216 screening Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
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Abstract
The invention discloses a dual-mode QFP and SOP packaging component pin coplanarity detection system, which comprises a component conveying device, a component picking and placing device, a laser component coplanarity non-contact measuring device, a resistance coplanarity contact measuring device, a video display and a main controller, wherein the component picking and placing device is used for picking and placing the component; the component conveying device conveys QFP or SOP packaged components to a specified position, and the component picking and placing device picks up the components and places the components at the specified measurement position; the laser component coplanarity non-contact measuring device is used for carrying out laser non-contact measurement on the component and measuring whether the component pin has a non-coplanarity problem or not; the resistance coplanarity contact type measuring device is used for measuring the rising displacement of the resistance contactor, and when the rising displacement of the resistance contactor exceeds a specified size, the resistance contactor automatically gives an alarm in a voice mode. The system can solve the screening problem of a large number of components which do not accord with coplanarity before the components are welded on the SMT production line, and effectively eliminates unqualified components.
Description
Technical Field
The invention belongs to the technical field of electronic component measurement, and particularly relates to a component pin coplanarity detection system.
Background
In the existing secondary screening test and inspection of the components of the airborne products, the appearance inspection of the surface mounted components is usually carried out according to standards such as GJB7243 and GJB548B, the inspection effect is only carried out around the appearance defects and character integrity of the components, and coplanarity indexes of the components (such as QFP packaged components) of the surface mounting cannot be effectively detected and judged, so that normal automatic welding of the components of the QFP packaging type cannot be carried out on a subsequent SMT production line due to poor coplanarity, the production efficiency of a circuit board is greatly affected, hidden dangers such as cold welding are caused due to insufficient coplanarity in the later stage of the components of the QFP packaging type of the SMT production line, more serious problems occur after the components are delivered to users in the future, and irreversible loss is finally caused.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a dual-mode QFP and SOP packaging component pin coplanarity detection system which comprises a component conveying device, a component picking and placing device, a laser component coplanarity non-contact measuring device, a resistance coplanarity contact measuring device, a video display and a main controller; the component conveying device conveys QFP or SOP packaged components to a specified position, and the component picking and placing device picks up the components and places the components at the specified measurement position; the laser component coplanarity non-contact measuring device is used for carrying out laser non-contact measurement on the component and measuring whether the component pin has a non-coplanarity problem or not; the resistance coplanarity contact type measuring device is used for measuring the rising displacement of the resistance contactor, and when the rising displacement of the resistance contactor exceeds a specified size, the resistance contactor automatically gives an alarm in a voice mode. The system can solve the screening problem of a large number of components which do not accord with coplanarity before the components are welded on the SMT production line, and effectively eliminates unqualified components.
The technical scheme adopted for solving the technical problems is as follows:
a dual-mode QFP and SOP packaging component pin coplanarity detection system comprises a component conveying device, a component picking and placing device, a laser component coplanarity non-contact measuring device, a resistance coplanarity contact measuring device, a video display and a main controller;
the component conveying device is used for conveying QFP or SOP packaging components to a designated position, and placing the components on the conveying belt at intervals so as to facilitate the component picking and placing devices to pick up the components one by one;
the component picking and placing device is used for picking up the QFP or SOP packaged components on the component conveying device by using the suction nozzle of the component picking and placing device and placing the components at a specified measuring position;
the laser component coplanarity non-contact measuring device comprises a laser head, a laser measuring tower, a base and a track; the laser head is arranged on the laser measuring tower and can move up and down; the laser measuring tower is arranged on the base, the base is arranged on the sliding rail, and the base can move left and right on the sliding rail to drive the laser head to move left and right; the laser component coplanarity non-contact measuring device is used for carrying out laser non-contact measurement on the placed QFP or SOP packaging components to be measured, measuring whether non-coplanarity problems exist on pins of the components or not, and automatically giving an alarm by voice when the coplanarity relative difference exceeds a specified size;
the resistance coplanarity contact type measuring device comprises two rows of pin measuring contact grooves, a resistance contactor and an indicator lamp; the interval of two rows of pin measurement contact grooves can cover the width from the root to the root of the two sides of the pins of the QFP and SOP packaging components and parts, each pin measurement contact groove is internally provided with a resistance contactor, the size of the resistance contactor is smaller than that of the pin measurement contact groove, all pins of two rows of devices to be tested are fully contacted by the resistance contactor when tested, an indicator lamp corresponding to each pin measurement contact groove can be lightened after the pins are contacted in place, the rising displacement of the resistance contactor is measured by the device, and when the rising displacement of the resistance contactor exceeds a specified size, the voice alarm is automatically given, and related data are displayed in a video display.
The video display is used for displaying the state and the report of the measurement of the QFP or SOP packaging components to be measured and flashing images when the laser components coplanar non-contact measuring device or the resistance coplanar contact measuring device alarms;
the main controller is used for controlling the coplanarity non-contact measuring device of the laser component and the resistance coplanarity contact measuring device to be matched for measurement simultaneously, and when the resistance coplanarity contact measuring device measures the left and right rows of pins of the component, the coplanarity non-contact measuring device of the laser component tests the front and rear rows of pins of the component so as to shorten the testing time of each component; meanwhile, the main controller can control the system to realize an automatic process of testing while transmitting and realize multi-system networking parallel testing;
further, the laser head irradiates pins of the device to be measured to determine the position of each pin, and the displacement of the movement of the laser head can be measured.
Further, the component picking and placing device can pick up QFP or SOP packaging components and rotate according to instructions, so that the coplanarity non-contact type measuring device of the laser components and the resistance coplanarity contact type measuring device can measure at any time, and the components are placed on the component conveying device after measurement is completed.
Furthermore, the component conveying device is provided with scale marks, and the components are placed according to the distances of the scale marks, so that the automatic process of conveying and testing can be realized.
Preferably, the prescribed size of the alarm is 0.1mm when the coplanarity non-contact measuring device of the laser component and the resistance coplanarity contact measuring device are used for measuring.
Preferably, the main controller can record out-of-tolerance data that the unqualified components do not conform to coplanarity.
Preferably, the detection system can realize programming of multiple sets of linkage work, and improves detection efficiency.
The beneficial effects of the invention are as follows:
1. the dual-mode QFP and SOP packaging component pin coplanarity detection system provided by the invention can solve the screening problem of a large number of components which do not accord with coplanarity before the QFP and SOP packaging components are welded on an SMT production line, effectively eliminates the unqualified components, and prevents the QFP and SOP packaging components which do not accord with the coplanarity requirement from being mounted on the SMT production line, so that hidden hazards caused by various cold welding, false welding and the like of electronic products after the electronic products are welded are reduced, and the dual-mode QFP and SOP packaging component pin coplanarity detection system has good popularization.
2. The invention can provide two modes of laser component pin coplanarity non-contact measurement and resistance component pin coplanarity contact measurement, and the two modes can not only work independently and rapidly detect, but also can be matched with each other to work in a mixed mode to carefully find problems, and can automatically alarm the found problems in time.
Drawings
FIG. 1 is a top view of the system of the present invention.
Fig. 2 is a top view of the coplanar non-contact measuring device of the laser component of the present invention. 3 a contact measuring device for coplanarity with the resistor.
FIG. 3 is a side view of a coplanar non-contact measuring device for laser components of the present invention.
FIG. 4 is an oblique view of a resistive co-planarity contact measurement apparatus of the present invention.
FIG. 5 is a schematic diagram of a resistive coplanar contact measurement apparatus according to the present invention; wherein, the figure (a) is a top view, and the figure (b) is a section view of A-A.
FIG. 6 is a side view of a resistive coplanarity touch measurement apparatus of the present invention.
Fig. 7 is a side view of the system configuration of the present invention.
In the figure, a 1-component conveying device, a 2-component picking and placing device, a 3-laser component coplanarity non-contact measuring device, a 4-resistance coplanarity contact measuring device, a 5-video display, a 6-main controller, an 8-laser head, a 9-laser measuring tower, a 10-base, a 11-track, a 12-laser beam, a 13-indicator lamp, a 14-pin measuring contact groove, a 15-resistance contactor and a 16-component pin.
Detailed Description
The invention will be further described with reference to the drawings and examples.
The invention aims to provide a dual-mode QFP and SOP packaging component pin coplanarity detection system which can finish coplanarity automatic detection before an SMT production line on QFP packaging type components and can automatically alarm in time for finding out problems.
As shown in fig. 1 and 7, a dual-mode QFP and SOP package component pin coplanarity detection system includes a component conveying device 1, a component picking and placing device 2, a laser component coplanarity non-contact measuring device 3, a resistance coplanarity contact measuring device 4, a video display 5 and a main controller 6;
the component conveying device 1 is used for conveying QFP or SOP packaging components to a designated position, and placing the components on a conveying belt according to intervals so as to facilitate the component picking and placing device 2 to pick up the components one by one;
the component picking and placing device 2 is used for picking up the QFP or SOP packaged components on the component conveying device 1 by using the suction nozzle of the component picking and placing device 2 and placing the components at a specified measuring position;
the coplanarity non-contact measuring device 3 of the laser components shown in fig. 2 and 3 comprises a laser head 8, a laser measuring tower 9, a base 10 and a track 11; the laser head 8 is arranged on the laser measuring tower 9, and the laser head 8 can move up and down; the laser measuring tower 9 is arranged on the base 10, the base 10 is arranged on the track 11, and the base 10 can move left and right on the track 11 to drive the laser head 8 to move left and right; the laser component coplanarity non-contact measuring device 3 is used for carrying out laser non-contact measurement on the placed QFP or SOP packaging components to be measured, measuring whether non-coplanarity problems exist on pins of the components or not, and automatically giving an alarm by voice when the coplanarity relative difference exceeds a specified size;
as shown in fig. 4, 5 and 6, the resistance coplanarity contact measurement device 4 comprises two rows of pin measurement contact grooves 14, a resistance contactor 15 and an indicator lamp 13; the distance between the two rows of pin measuring contact grooves 14 can cover the width from the root to the root of the two sides of the pins of the QFP and SOP packaging components, a resistance contactor is arranged in each pin measuring contact groove 14, the size of the resistance contactor 15 is smaller than that of the pin measuring contact groove 14, all pins of two rows of devices to be tested are fully contacted by lifting the resistance contactor 15 from the groove during testing, the indicator lamps 13 corresponding to the pin measuring contact grooves 14 are lightened after the pins are contacted in place, the ascending displacement of the resistance contactor 15 is measured by the device, and when the ascending displacement of the resistance contactor 15 exceeds the specified size, the voice alarm is automatically given out and related data are displayed in the video display 5.
The video display 5 is used for displaying the state and report of the QFP or SOP packaging component measurement to be tested and flashing images when the laser component coplanarity non-contact measuring device 3 or the resistance coplanarity contact measuring device 4 alarms;
the main controller 6 is used for controlling the coplanarity non-contact measuring device 3 of the laser component and the resistance coplanarity contact measuring device 4 to be matched for measurement simultaneously, and when the resistance coplanarity contact measuring device 4 measures the left and right rows of pins of the component, the coplanarity non-contact measuring device 3 of the laser component tests the front and rear rows of pins of the component so as to shorten the testing time of each component; meanwhile, the main controller 6 can control a system to realize an automatic process of testing while transmitting and realize multi-system networking parallel testing;
further, the laser head 8 irradiates pins of the device to be tested to determine positions of the pins, and displacement of movement of the laser head 8 can be measured.
Further, the component picking and placing device 2 can pick up QFP or SOP packaging components and rotate according to instructions so that the coplanarity non-contact measuring device 3 of the laser components and the resistance coplanarity contact measuring device 4 can measure at any time, and the components are placed on the component conveying device 1 after measurement is completed.
Furthermore, the component conveying device 1 is provided with scale marks, and the components are placed according to the distances of the scale marks, so that the automatic process of conveying and testing can be realized.
Preferably, the prescribed size of the alarm when the coplanarity non-contact measuring device 3 and the resistance coplanarity contact measuring device 4 of the laser components are measured is 0.1mm.
Preferably, the main controller 6 can record out-of-tolerance data that the failed components do not conform to coplanarity.
Preferably, the detection system can realize programming of multiple sets of linkage work, and improves detection efficiency.
Specific examples:
the system comprises a component conveyor belt, a component picking and placing device, a laser component coplanarity non-contact measuring device, a resistance coplanarity contact measuring device, a video display and a main controller.
The system mainly detects coplanarity of component pins in two packaging forms of QFP and SOP, can provide two modes of laser component pin coplanarity non-contact measurement and resistance component pin coplanarity contact measurement, can be used for single operation and rapid detection, can also be matched with operation to find problems carefully, and can automatically alarm in time when the found problems are found, namely, the system can work in a laser non-contact mode, a resistance contact mode and a mixed mode which is achieved by matching operation.
When the laser non-contact mode is adopted, the laser component coplanarity non-contact measuring device can carry out non-contact measurement on coplanarity of component pins in two packaging modes of QFP and SOP, the device is provided with a laser head capable of moving up and down, left and right, the position of each pin can be determined through illuminating the component pin, the displacement of the movement of the laser head can be accurately measured, when all pins on one side of the component are measured, the coplanarity relative difference value is found to exceed a specified size (for example, exceed 0.1 mm), an alarm is given in time, and related data are displayed in a video display.
When the resistor contact working mode is adopted, the coplanarity of pins of the resistor component can be measured in a contact mode, all pins of components in two packaging modes of QFP and SOP can be measured in a contact mode, two rows of pin measuring contact grooves are distributed on the upper surface of the device, the distance between the two rows of pin measuring contact grooves can cover the width from the root to the root of the two sides of the pins of most QFP and SOP packaging components, the span of the device can cover the width from the end to the end of the two sides of the pins of most QFP and SOP packaging components, each groove is internally provided with a resistor contactor, the contactor is slightly smaller than the inner size of the pin measuring contact groove, the resistor contactor lifts from the groove to fully contact all pins of two rows of components in the test, lamps corresponding to each groove can be lightened after the contact are in place, the device is used for measuring the lifting displacement of the resistor contactor, and for relative displacement exceeding a specified size (for example, exceeding 0.1 mm), alarming is timely, and relevant data are displayed in a video display.
When the device works in a mixed working mode, under the control of the main controller, the coplanarity non-contact measuring device of the laser component and the resistance coplanarity contact measuring device can be matched for measurement at the same time, and when the resistance coplanarity contact measuring device measures the left and right rows of pins of the component, the coplanarity non-contact measuring device of the laser component can test the front and rear rows of pins of the component, so that the test time of each component is shortened.
The component conveyor belt and the component picking and placing device of the system can work cooperatively under the control of a main controller program, and the component picking and placing device can suck up components packaged by QFP or SOP and rotate according to instructions so as to facilitate the measurement of the coplanarity non-contact type measuring device of the laser components and the coplanarity contact type measuring device of the resistor at any time, and the components are placed on the component conveyor belt after the measurement is completed. The conveyor belt is provided with scale marks, and components are placed according to the distance of the scale marks, so that an automatic process of testing while conveying can be realized. And when the demand of component testing is large, the parallel testing of the multi-system networking can be realized.
The main controller can record out-of-tolerance data that the unqualified components do not conform to coplanarity.
In order to realize simultaneous testing of multiple components and parts and provide higher detection efficiency, the system can also realize programming of multiple sets of linkage work.
Claims (7)
1. The dual-mode QFP and SOP packaging component pin coplanarity detection system is characterized by comprising a component conveying device, a component picking and placing device, a laser component coplanarity non-contact measuring device, a resistance coplanarity contact measuring device, a video display and a main controller;
the component conveying device is used for conveying QFP or SOP packaging components to a designated position, and placing the components on the conveying belt at intervals so as to facilitate the component picking and placing devices to pick up the components one by one;
the component picking and placing device is used for picking up the QFP or SOP packaged components on the component conveying device by using the suction nozzle of the component picking and placing device and placing the components at a specified measuring position;
the laser component coplanarity non-contact measuring device comprises a laser head, a laser measuring tower, a base and a track; the laser head is arranged on the laser measuring tower and can move up and down; the laser measuring tower is arranged on the base, the base is arranged on the sliding rail, and the base can move left and right on the sliding rail to drive the laser head to move left and right; the laser component coplanarity non-contact measuring device is used for carrying out laser non-contact measurement on the placed QFP or SOP packaging components to be measured, measuring whether non-coplanarity problems exist on pins of the components or not, and automatically giving an alarm by voice when the coplanarity relative difference exceeds a specified size;
the resistance coplanarity contact type measuring device comprises two rows of pin measuring contact grooves, a resistance contactor and an indicator lamp; the interval between the two rows of pin measurement contact grooves can cover the width from the root to the root of the two sides of the pins of the QFP and SOP packaging components, each pin measurement contact groove is internally provided with a resistance contactor, the size of the resistance contactor is smaller than that of the pin measurement contact groove, all pins of two rows of devices to be tested are fully contacted by lifting the resistance contactor from the groove during testing, an indicator lamp corresponding to each pin measurement contact groove can be lightened after the pins are contacted in place, the rising displacement of the resistance contactor is measured by the device, and when the rising displacement of the resistance contactor exceeds a specified size, the voice alarm is automatically carried out, and related data are displayed in a video display;
the video display is used for displaying the state and the report of the measurement of the QFP or SOP packaging components to be measured and flashing images when the laser components coplanar non-contact measuring device or the resistance coplanar contact measuring device alarms;
the main controller is used for controlling the coplanarity non-contact measuring device of the laser component and the resistance coplanarity contact measuring device to be matched for measurement simultaneously, and when the resistance coplanarity contact measuring device measures the left and right rows of pins of the component, the coplanarity non-contact measuring device of the laser component tests the front and rear rows of pins of the component so as to shorten the testing time of each component; meanwhile, the main controller can control the system to realize an automatic process of testing while transmitting and can also realize multi-system networking parallel testing.
2. The dual-mode QFP and SOP package device pin coplanarity testing system of claim 1, wherein the laser head irradiates the device pins to be tested to determine the position of each pin and is capable of measuring the displacement of the movement of the laser head.
3. The dual-mode QFP and SOP package component pin coplanarity detection system of claim 1, wherein the component picking and placing device can pick up QFP or SOP package components and rotate according to instructions so that the laser component coplanarity non-contact measuring device and the resistance coplanarity contact measuring device can measure at any time, and the components can be placed on the component conveying device after measurement is completed.
4. The dual-mode QFP and SOP package component pin coplanarity detection system of claim 1, wherein the component conveying device is provided with scale marks, and components are placed according to the distance of the scale marks, so that an automatic process of conveying and testing can be realized.
5. The dual-mode QFP and SOP package component pin coplanarity detection system of claim 1, wherein the prescribed dimensions of the laser component coplanarity non-contact measurement device and the resistance coplanarity contact measurement device for alarming are both 0.1mm.
6. The dual-mode QFP and SOP package component pin coplanarity detection system of claim 1, wherein the master controller is capable of recording out-of-tolerance data for non-compliance with coplanarity for non-compliant components.
7. The dual-mode QFP and SOP package component pin coplanarity detection system of claim 1, wherein the detection system can realize programming multiple sets of linkage work and improves detection efficiency.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111364898.7A CN114322756B (en) | 2021-11-17 | 2021-11-17 | Dual-mode QFP and SOP packaging component pin coplanarity detection system |
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| CN202111364898.7A CN114322756B (en) | 2021-11-17 | 2021-11-17 | Dual-mode QFP and SOP packaging component pin coplanarity detection system |
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| CN117706432B (en) * | 2024-02-02 | 2024-04-30 | 合肥中航天成电子科技有限公司 | Pin detection equipment for SOP packaging element |
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| KR100412272B1 (en) * | 2001-11-21 | 2003-12-31 | 미래산업 주식회사 | A Coplanarity Inspection System and a Method Thereof of Package |
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2021
- 2021-11-17 CN CN202111364898.7A patent/CN114322756B/en active Active
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| US4754555A (en) * | 1987-05-18 | 1988-07-05 | Adcotech Corporation | Apparatus for inspecting the coplanarity of leaded surface mounted electronic components |
| JP2004012222A (en) * | 2002-06-05 | 2004-01-15 | Fujitsu Component Ltd | Coplanarity measuring method |
| CN103196364A (en) * | 2012-01-10 | 2013-07-10 | 雅马哈发动机株式会社 | Element photographing device, surface mounting machine and component inspection device |
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