CN103196364A - Element photographing device, surface mounting machine and component inspection device - Google Patents
Element photographing device, surface mounting machine and component inspection device Download PDFInfo
- Publication number
- CN103196364A CN103196364A CN2012102627668A CN201210262766A CN103196364A CN 103196364 A CN103196364 A CN 103196364A CN 2012102627668 A CN2012102627668 A CN 2012102627668A CN 201210262766 A CN201210262766 A CN 201210262766A CN 103196364 A CN103196364 A CN 103196364A
- Authority
- CN
- China
- Prior art keywords
- light path
- electronic component
- catoptron
- camera head
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to an element photographing device, a surface mounting machine and an element inspection device. The component photographing device includes a photographing portion which photographs an electronic element mounted on a substrate, a light path from the electronic element to the photographing portion, and a switching component for performing light path switching. The light path includes a first light path and a second light path, the first light path is a light path in which the photographing portion photographs the electronic element from a vertical direction relative to a mounting surface of the substrate, and the second light path is light path in which the photographing portion photographs the electronic element from an inclined direction relative to a direction vertical to the mounting surface of the substrate and has the same light path length as that of the first light path. The switching component switches the first light path and the second light path. Thus, functions of photographing the electronic element from the vertical direction relative to the mounting surface and from the inclined direction can be realized with a simple structure in a compact manner.
Description
Technical field
The present invention relates to the element camera head, use surface mounting apparatus and the component detection device of this element camera head, described element camera head is taken from the direction vertical with the residing installed surface of terminals of electronic components with respect to the direction that described vertical direction tilts.
Background technology
In the past, the component detection device that electronic component is installed to the surface mounting apparatus of printed-wiring board (PWB) or carries out the inspection of electronic component comprised the element camera head of electronic component being taken in order to handle the flatness of detected electrons element and the distortion of lead-in wire etc. by image.For the flatness of detected electrons element and the distortion of lead-in wire, use from the direction vertical with installed surface and take image that electronic component obtains and take the image that electronic component obtains from the direction that tilts with respect to described vertical direction and carry out.As this element camera head in the past, for example there is the open communique spy of Jap.P. to open device and the open communique spy of Jap.P. that 2005-340648 number (patent documentation 1) put down in writing and opens the device that flat 11-132745 number (patent documentation 2) put down in writing.
Disclosed element camera head comprises from first camera head of the direction shooting electronic component vertical with installed surface with from take second camera head of electronic component with respect to the tilted direction of described vertical direction inclination in the patent documentation 1.
In the patent documentation 2 disclosed element camera head comprise the camera head main body of taking electronic component and be arranged on described electronic component and described camera head body between a plurality of catoptron groups.Described camera head main body is still in the top of electronic component, takes electronic component from the direction vertical with respect to installed surface.The capturing element of this camera head main body is area sensor (area sensor).
Described each catoptron group of patent documentation 2 comprises a plurality of catoptrons of the position that is arranged at the optical axis that centers on described camera head main body.The skewing scheme picture of each catoptron group when observing leads of electronic component from the tilted direction that tilts with respect to described vertical direction can be arranged by the mode that described camera head is taken.In the element camera head shown in this patent documentation 2, the image of the image of the electronic component that photographs from described vertical direction and the lead-in wire that photographs from vergence direction is taken simultaneously by a camera head main body.
Each camera head in the element camera head shown in the patent documentation 1 is only taken electronic component from single direction.Therefore, the element camera head shown in the patent documentation 1 must possess two camera heads, and thus, the distribution class also needs two groups.Therefore, use surface mounting apparatus and the component detection device of patent documentation 1 disclosed element camera head to have following problem: manufacturing cost increases, and becomes big owing to the space that needs bigger being used for that two camera heads are set makes device.
So the element camera head shown in the patent documentation 2 is owing to need a plurality of catoptrons thereby complex structure.And, since from directly over when taking electronic component light path around be provided with a plurality of skewing schemes as catoptron for shooting, so this element camera head becomes big in the horizontal direction.In addition, owing to used area sensor, thereby the element camera head shown in the patent documentation 2 must be still in shot location when each the shooting.Therefore, use the required time of the installation elements of surface mounting apparatus of this element camera head elongated, use supervision time of component detection device of this element camera head elongated.
In addition, because the lead-in wire position that catoptron has limited electronic component, thereby also there is the problem of the limited size of the electronic component that can take in the element camera head shown in the patent documentation 2.
Summary of the invention
The object of the present invention is to provide a kind of element camera head, the surface mounting apparatus that uses this element camera head and component detection device, can be with simple structure and realize the function of taking electronic component from respect to this two direction of direction of the vertical direction of installed surface and inclination compactly.
For achieving the above object, the related element camera head of an aspect of of the present present invention comprises: image pickup part, take the electronic component that is installed to substrate; Light path from described electronic component to described image pickup part, this light path comprises first light path and second light path, described first light path is described image pickup part is taken described electronic component from the direction vertical with respect to the installed surface of described substrate light path, described second light path is the light path that described image pickup part is taken described electronic component from the direction that tilts with respect to the direction vertical with the installed surface of described substrate, and described second light path has the optical path length identical with described first light path; Switching part switches described first light path and described second light path.
In addition, the related surface mounting apparatus of another aspect of the present invention comprises: described element camera head, take the installation element as described electronic component; Test section according to the image of the described installation of being taken by described image pickup part with element, detects described installation with the position of the terminal of element and height or described installation position and the height with the lead-in wire of element.
In addition, the related component detection device of one side more of the present invention comprises: described element camera head, and take and use electronic component as being examined of described electronic component; Test section according to the described image of being taken by described image pickup part that is examined with electronic component, detects described position and height or described position and the height that is examined with the lead-in wire of electronic component that is examined with terminals of electronic components.
According to the present invention, can be with simple structure and realize the function of taking electronic component from respect to this two direction of direction of the vertical direction of installed surface and inclination compactly.
Description of drawings
Fig. 1 is to use the vertical view of the surface mounting apparatus of element camera head involved in the present invention.
Fig. 2 is the synoptic diagram of the schematic configuration of expression element camera head, and expression is formed with the state of first light path.
Fig. 3 is the synoptic diagram of the schematic configuration of display element camera head, and expression is formed with the state of second light path.
Fig. 4 is the cut-open view of element camera head, and expression is formed with the state of first light path.
Fig. 5 is the partial sectional view of element camera head, and expression is formed with the state of second light path.
Fig. 6 is the stereographic map of element camera head.
Fig. 7 is the front elevation of drive unit, and expression is formed with the state of first light path.
Fig. 8 is VIII-VIII line cut-open view of Fig. 7.
Fig. 9 is the front elevation of drive unit, and expression is formed with the state of second light path.
Figure 10 is X-X line cut-open view of Fig. 9.
Figure 11 is the exploded perspective view of wanting portion of element camera head.
Figure 12 cuts off the wanting portion of element camera head and the stereographic map represented.
Figure 13 is the stereographic map of wanting portion of element camera head.
Figure 14 is the vertical view of lighting device.
Figure 15 is the cut-open view of lighting device, is X V-X V line cut-open view of Figure 14.
Figure 16 is the stereographic map of lighting device.
(A) of Figure 17 is vertical view for the explanation light illumination mode to (F), wherein, and (A) light illumination mode the during lower surface of expression criterion of identification element; (B) light illumination mode the during lower surface of expression identification ball element; (C) light illumination mode the during lower surface of expression identification specular components; (D) light illumination mode the during coplanarity of expression criterion of identification element, lead elements and production method thereof and ball element; Light illumination mode when (E) surface that is illustrated in lead elements and production method thereof exists concavo-convex and the identification coplanarity when producing shade; Light illumination mode when the coplanarity when (F) being illustrated in the ball summit of wishing identification specular components and ball element is identified.
Figure 18 is the block scheme of structure of the control system of expression surface mounting apparatus involved in the present invention.
Figure 19 is the process flow diagram for the shooting action of explanation surface mounting apparatus involved in the present invention.
Embodiment
Below, describe element camera head involved in the present invention and an embodiment of surface mounting apparatus in detail according to Fig. 1 to Figure 19.In the present embodiment, an example when element camera head involved in the present invention is assembled in surface mounting apparatus describes.
Described printed-wiring board (PWB) conveying unit 3 comprises a pair of conveyance band 6.These conveyance bands 6 will be as the printed-wiring board (PWB) 7 of " substrate " of institute's appellation among the present invention respectively along the directions X conveyance.The action of these conveyance bands 6 by the control device 8(that is arranged on surface mounting apparatus 1 with reference to Figure 18) in conveyance band control part 9 control.Side side at these conveyance bands 6 is provided with element camera head 11 described later.
Described element supply department 4 is used for installing device for supplying electronic element.In the present embodiment, used a plurality of belt feeder 12 as device for supplying electronic element.
Described element moving part 5 comprises a pair of Y running rail unit 13 on the both ends of the directions X that is arranged on base station 2, moves the X running rail unit 14 that is supported on freely on these Y running rail units 13, moves head assembly 15 that is supported on freely on this X running rail unit 14 etc. along directions X along Y-direction.Head assembly 15 has a plurality of adsorption heads (not shown).
These adsorption heads have suction nozzle 16(by being arranged on the bottom with reference to figure 4, Fig. 5) function of stick electronic components 17, make the mobile along the vertical direction function of suction nozzle 16 and by upper and lower to axis centered by make the function of suction nozzle 16 rotations.The action of each drive unit that uses in this element moving part 5 is by described control device 8 controls.As shown in figure 18, as the drive unit that is arranged in the element moving part 5, X running rail unit drive unit 18, head assembly drive unit 19, adsorption head drive unit 20 etc. are arranged.
The action of each drive unit of element moving part 5 is by axle control part 21 controls of described control device 8.As shown in figure 18, control device 8 has the storage part 23 of information of the master control part 22, memory print wiring board 7 and the electronic component 17 that comprehensively carry out various controls and the control part of each actuator.As the control part of each actuator, described conveyance band control part 9, described axle control part 21, the video camera control part 24 that is used for the action of control element camera head 11 described later, lighting control section 25, I/O signal control part 26 etc. are arranged.
Described element camera head 11 is used for being adsorbed in from the below shooting electronic component 17 of suction nozzle 16.This element camera head 11 is taken two kinds of images.A kind of image in these images is the lower surface image that obtains from direction (below) the shooting electronic component 17 vertical with installed surface shown in Figure 2.So-called installed surface is the residing imaginary plane of all welding portions of electronic component 17 herein.But this imaginary plane is imagination printed-wiring board (PWB) 7(substrate) the installed surface of reality the time the plane.As shown in Figure 3, another kind of image is the skewing scheme picture that obtains from taking electronic component 17 with respect to the tilted direction of the direction inclination vertical with described installed surface.
These lower surface image and skewing scheme picture are taken with the mode that terminal (not shown), the packed part 17b of go between 17a and electronic component 17 together develop with the welding of electronic component 17.In the present embodiment, described electronic component 17 is equivalent to so-called among the present invention " install and use element ", and the welding of electronic component 17 is equivalent to " terminal or lead-in wire with element are installed " with terminal or lead-in wire 17a etc.As having the electronic component 17 of described welding with terminal, chip component, BGA (ball grid array), CSP semiconductor devices such as (chip size package) etc. such as chip-resistance are for example arranged.As the electronic component 17 with described lead-in wire 17a, for example just like the such lead-in wire of QFP (quad flat package) from packed part to side other outstanding semiconductor device.
Described lower surface image mainly is used to the adsorbed state that described control device 8 is differentiated electronic component 17.Below, use the action of lower surface image identification electronic component 17 to be called " lower surface identification " control device 8.Control device 8 comes instrumentation to be adsorbed in the adsorbed state of the electronic component 17 of suction nozzle 16 based on the result of lower surface identification, or the encapsulation, terminal or the lead-in wire 17a that differentiate electronic component 17 have the correct and wrong of N/D, electronic component 17 etc.
Described skewing scheme looks like to be used to control device 8 and carries out so-called coplanarity inspection (coplanarity check; Flatness checks).Below, abbreviate control device 8 as " coplanarity identification " (coplanar recognition) based on the action that skewing scheme looks like to carry out the coplanarity inspection.Control device 8 is based on the result of this coplanarity identification, in the aftermentioned mode terminal or the lead-in wire 17a of the electronic component 17 that is adsorbed in suction nozzle 16 carried out various differentiations.Have at electronic component 17 under the situation of a plurality of hemispheric terminals, can use the skewing scheme picture with the whether differentiation in allowed band of the height that carries out each terminal.In addition, also can comprise the whether differentiation in allowed band of smooth degree of installed surface on the summit of terminal in this case.
Have at electronic component 17 under the situation of a plurality of lead-in wire 17a, carry out each lead-in wire 17a end face smooth degree whether in allowed band, the degree of crook of lead-in wire 17a whether in allowed band, whether differentiation such as in allowed band of the perk of lead-in wire 17a.And the image when carrying out the identification of lower surface identification or coplanarity is handled for example can utilize and is opened in 2005-340648 number disclosed method the open communique spy of Jap.P. and carry out.
As Fig. 2, Fig. 3 and shown in Figure 6, element camera head 11 has with video camera 31, first 11A of catoptron portion, second 11B of catoptron portion and with drive unit 43 and is accommodated in inner housing 34.Element camera head 11 uses a video camera 31 and is formed.This video camera 31 has the line sensor (line sensor) 32 as capturing element.In the present embodiment, constitute so-called among the present invention " image pickup part " by described video camera 31.The shooting action of video camera 31 is undertaken by the video camera control part 24 of described control device 8.The optical axis 33 of video camera 31 is the top of directed in orthogonal direction in the present embodiment.
The direction that when being taken by this line sensor 32 electronic component 17 is moved is left and right directions in Fig. 2, Fig. 3, and is directions X shown in Figure 1.In addition, video camera 31 is arranged in the housing 34 of element camera head 11 to the mode that the side (being the right side in Fig. 4) on the directions X departs from distance to a declared goal with respect to camera position A with optical axis 33.
As Fig. 4 and shown in Figure 5, described optical element 35 comprises first catoptron 38 and supports the movable carriage 39 of this first catoptron 38.Described first catoptron 38 and movable carriage 39 slenderly form in the mode of extending along Y-direction (with the direction of the paper quadrature of Fig. 4, Fig. 5).The both ends of the length direction of movable carriage 39 are supported in the upper frame 41(framework of this element camera head 11 freely via the 42 parallel movements of linear guide mechanism).
Described upper frame 41 constitutes the upper wall of described housing 34.As shown in figure 11, linear guide mechanism 42 comprises slide rail 42a and the mobile slide block 42b that is supported on freely on this slide rail 42a that is fixed in upper frame 41.Described movable carriage 39 is fixed on the described slide block 42b.Described slide rail 42a is fixed on the first dip plane 41b of the two side 41a that is formed at described upper frame 41.
As shown in Figure 4 and Figure 5, observe down from Y-direction, the first dip plane 41b forms in the mode of the optical axis 33 that crosses described video camera 31 obliquely.The vergence direction of the first dip plane 41b is the direction that uprises gradually towards described camera position A along with from optical axis 33.The first dip plane 41b of present embodiment tilts with about 45 degree with respect to horizontal direction.Therefore, movable carriage 39 is along the first dip plane 41b parallel movement obliquely.Movable carriage 39 and drive unit 43(described later with reference to figure 6 to Figure 10) be connected, and move along the first dip plane 41b by the driving of drive unit 43.
Described first catoptron 38 is installed in the lower surface of described movable carriage 39 in the mode of reflecting surface 38a directed downwards.
As shown in Figure 4, described first light path 36 is based on described movable carriage 39 and rises and the reflecting surface 38a of described first catoptron 38 crosses the optical axis 33 of video camera 31 and the light path set up along the first dip plane 41b.In addition, as shown in Figure 5, described second light path 37 is based on described movable carriage 39 and descends and the reflecting surface 38a of first catoptron 38 departs from the optical axis 33 of video camera 31 and the light path set up along the first dip plane 41b.
As Fig. 2 and shown in Figure 4, described first light path 36 by described first catoptron 38, with the first slit 46(of these first catoptron, 38 opposed second catoptrons 44, lighting device described later 45 with reference to figure 4) form.In the present embodiment, constitute so-called among the present invention " catoptron of not advancing and retreat " by described second catoptron 44, constitute so-called among the present invention " with respect to the parallel catoptron of advance and retreat movably of described catoptron of not advancing and retreat " by described first catoptron 38.In addition, the reflecting surface 38a by first catoptron 38 constitutes so-called among the present invention " reflecting surface that can advance and retreat ".And, constitute so-called among the present invention " the first catoptron portion with the reflecting surface that can advance and retreat " by the optical element 35 with first catoptron 38 and second catoptron 44.This first catoptron portion represents with symbol 11A in Fig. 2 and Fig. 3.
Described second catoptron 44 is semi-permeable mirrors, and be positioned at camera position A under that is the below of vertical direction.The reason that this second catoptron 44 is formed by semi-permeable mirror is to arrange bottom illumination 47 below second catoptron 44.Bottom illumination 47 is thrown light on from the below to electronic component 17 along first light path 36 by described second catoptron 44 that is made of semi-permeable mirror.
As shown in figure 11, second catoptron 44 form along Y-direction extend tabular.The both ends of second catoptron 44 are fixed on to be formed on the second dip plane 41c of upper frame 41 across the adjacent mode of step with the described first dip plane 41b.The second dip plane 41c and the first dip plane 41b form abreast.Therefore, second catoptron 44 is inclined relative to horizontal in the mode parallel with first catoptron 38.Because first catoptron 38 and second catoptron 44 are supported on the upper frame 41, so the element camera head 11 of present embodiment can be with high precision and these catoptrons 38,44 that are arranged in parallel easily.
As shown in figure 14, described first slit 46 is formed on the central portion of lighting device 45 described later.First slit 46 extends abreast with the length direction of described line sensor 32.
As Fig. 3 and shown in Figure 5, described second light path 37 is by the 3rd transmitting mirror 51 that intersects at the optical axis 33 than the higher position of described first catoptron 38 and video camera 31, form with second slit 53 of the 3rd catoptron 51 opposed the 4th catoptrons 52, lighting device described later 45.In the present embodiment, constitute so-called among the present invention " the second catoptron portion with the reflecting surface of not advancing and retreat " by described the 3rd catoptron 51 and the 4th catoptron 52.This second catoptron portion represents with symbol 11B in Fig. 2 and Fig. 3.Among the present invention so-called switching part 11C(referring to figs. 2 and 3) comprise second 11B of catoptron portion and the first above-mentioned 11A of catoptron portion.
Described the 3rd catoptron 51 and the 4th catoptron 52 form the elongated band plate-like of extending along Y-direction separately.Described the 3rd catoptron 51, the 4th catoptron 52 support (with reference to Figure 11) by the analog bracket 54 that is installed on the described upper frame 41 under the state that the angle with appointment tilts.The optical path length of second light path 37 is by decisions such as the position of the horizontal direction of the angle of inclination of the 3rd catoptron 51 and the 4th catoptron 52, angles of inclination.The optical path length of second light path 37 of present embodiment is formed consistent with the optical path length of the first above-mentioned light path 36.Optical path length based on first light path 36 is consistent with the optical path length of second light path 37, can clearly take lower surface image and skewing scheme as the two by a video camera 31.
To shown in Figure 12, the drive unit 43 that drives described movable carriage 39 has cylinder 55 with as drive source as Fig. 7.Cylinder 55 comprise cylinder main body 55a on the housing 34 that is installed in element camera head 11, from this cylinder main body 55a upward outstanding piston rod 55b, be installed in the slide block 55c on this piston rod 55b.The action of cylinder main body 55a is by I/O signal control part 26 controls of described control device 8.
Described slide block 55c is mobile being supported on the cylinder main body 55a freely along the vertical direction.As shown in figure 12, roller 57 is installed on the slide block 55c with support 56 via supporting.The axis direction of this roller 57 points to Y-direction.The pressure-containing parts 58 that is installed on the bottom of described movable carriage 39 is positioned on the roller 57 from the top.The lower surface of pressure-containing parts 58 forms the tabular surface of rough level.Described movable carriage 39 based on be arranged on and housing 34 between draft helical spring 59(with reference to Figure 13) spring force and be pressed against to oblique below along the first dip plane 41b.Therefore, described pressure-containing parts 58 is pressed in described roller 57 from the top based on described spring force.
In this drive unit 43, slide block 55c is moved upward by the driving of cylinder main body 55a, as Fig. 7 and shown in Figure 8, roller 57 rolls at the lower surface of pressure-containing parts 58, and pressure-containing parts 58 overcomes the spring force of draft helical spring 59 and mobile obliquely upward with movable carriage 39.Stop position when movable carriage 39 moves obliquely upward is by block 60 restrictions that are installed on upper frame 41.
As Fig. 7 and shown in Figure 8, block 60 is to be arranged by the mode of the upper end of movable carriage 39 contact.Under the state of movable carriage 39 contact blocks 60, first catoptron 38 intersects with the optical axis 33 of video camera 31.Therefore, move to obliquely upward with till block 60 contacts by movable carriage 39, first catoptron 38 is oriented to intersect with the optical axis 33 of video camera 31, and second light path 37 is covered by first catoptron 38 and disappeared, and first light path 36 forms.
On the other hand, mobile based on the driving of cylinder main body 55a and downwards by slide block 55c, roller 57 descends, and presses under the situation of this roller 57 at the spring force of draft helical spring 59, and pressure-containing parts 58 descends to oblique below with movable carriage 39.Its result, optical axis 33, the first light paths 36 that first catoptron 38 departs from video camera 31 disappear and 37 formation of second light path.
Described lighting device 45 throws light on from the below to the electronic component 17 that is positioned at camera position A.To shown in Figure 16, this lighting device 45 has a plurality of LED61 as light source, is fixed on the described upper frame 41 as Figure 14.As shown in figure 15, lighting device 45 comprise side Lighting Division 62 in the upper end, in the downside Lighting Division 63 of bottom, oblique illumination portion 64 between described side Lighting Division 62 and downside Lighting Division 63.
The second substrate 63B of downside Lighting Division 63, the 3rd substrate 63C flatly arrange generally in the mode of LED61 points upwards.The LED61 of the second substrate 63B and the 3rd substrate 63C is from electronic component 17 irradiates lights of below to being positioned at camera position A of vertical direction.Between the second substrate 63B and the 3rd substrate 63C, be formed with the space S 1 that the length direction with Y-direction that is described line sensor 32 extends abreast.This space S 1 constitutes first slit 46, and this first slit 46 constitutes the part of described first light path 36.
Described oblique illumination portion 64 comprises eight substrate 64A～64H that a plurality of LED61 are installed.These substrates 64A～64H forms trapezoidal shape separately, and is set up to grow the mode of below that the limit is positioned at each substrate 62A～62H of described side Lighting Division 62.These substrates 64A～64H tilts in the mode that LED61 points to oblique upper.The LED61 of substrate 64A～64H from oblique below to electronic component 17 irradiates lights that are positioned at camera position A.
In eight substrate 64A～64H of oblique illumination portion 64, as shown in figure 14, the bottom of three substrate 64F～64H above the first substrate 63A of a distolateral and described downside Lighting Division 63 that is positioned at directions X is formed with the light path forming portion 65～67 of passing for the light from the LED61 irradiation of the described first substrate 63A.
In eight substrate 64A～64H of oblique illumination portion 64, as shown in figure 14, be formed with light path forming portion 68～70 in the bottom of another three distolateral substrate 64B～64D that are positioned at directions X.Between these light path forming portions 68～70 and described the 3rd substrate 63C, be formed with the space S 2 that the length direction with Y-direction that is described line sensor 32 extends abreast.This space S 2 constitutes second slit 53, and this second slit 53 constitutes the part of described second light path 37.
Each LED61 of lighting device 45 is luminous based on the light illumination mode that is predetermined.Luminous (the turning on light) of each LED61, the switching of turning off the light are undertaken by the lighting control section 25 of described control device 8.Lighting control section 25 is corresponding to the illumination purpose, switches turning on light and the combination of turning off the light of remainder and the light illumination mode that forms by the part of a plurality of LED61.
Described light illumination mode corresponding to the surface state of kind, terminal or the lead-in wire 17a of the electronic component of taking 17, take direction etc. and as following, be set with six kinds.
(A) first light illumination mode:
Carrying out lower surface when identification and when shooting has the electronic component 17 of standard of the smooth terminal of installed surface or lead-in wire 17a, making LED61 luminous with first light illumination mode.
In first pattern, as impose among Figure 17 (A) hacures represented, the most LED61 of downside Lighting Division 63 and the most LED61 of oblique illumination portion 64 are luminous.Not luminous LED61 is the LED61 that is in around the position of described first slit 46 in downside Lighting Division 63 and oblique illumination portion 64.
(B) second light illumination mode:
When carrying out lower surface identification and when shooting has the electronic component 17 of hemispheric terminal, make LED61 luminous with second light illumination mode.And, when being minute surface on the surface of hemispherical terminal, make LED61 luminous with the 3rd light illumination mode described later.
In second pattern, as impose among Figure 17 (B) hacures represented, make the LED61 of side Lighting Division 62 luminous.
(C) the 3rd light illumination mode:
When the installed surface that carries out lower surface when identification and terminal or lead-in wire 17a is minute surface, make LED61 luminous with the 3rd light illumination mode.
In three-mode, as impose among Figure 17 (C) hacures represented, make the LED61 of a part of the LED61 of a part of downside Lighting Division 63 and oblique illumination portion 64 luminous.This moment, luminous LED61 was the LED61 that is in around the position of described first slit 46.In addition, in three-mode, it is 47 luminous to be thrown light in the bottom of the below that is positioned at described second catoptron 44.
(D) the 4th light illumination mode:
Carry out coplanarity when identification and shooting have the smooth terminal of installed surface standard element (standard component) or when having the electronic component (lead elements and production method thereof) of lead-in wire 17a or having the ball element etc. of hemispherical terminal, make LED61 luminous with the 4th light illumination mode.
In four-mode, as impose among Figure 17 (D) hacures represented, make the LED61 of a part of the LED61 of a part of downside Lighting Division 63 and oblique illumination portion 64 luminous.This moment, luminous LED61 was in LED61 with described second slit, 53 opposition sides at directions X.
(E) the 5th light illumination mode:
Carrying out coplanarity when identification and be formed with concavo-convex on the surface of lead elements and production method thereof and when being easy to generate shade, make LED61 luminous with the 5th light illumination mode.And, when being minute surface on the surface of hemispherical terminal, make LED61 luminous with the 6th light illumination mode described later.
In the 5th light illumination mode, as impose among Figure 17 (E) hacures represented, make the LED61 of a part of the LED61 of a part of downside Lighting Division 63 and oblique illumination portion 64 luminous.This moment, luminous LED61 was the LED61 that is in around the position of described first slit 46.
(F) the 6th light illumination mode:
Carrying out coplanarity when identification and wishing recognition terminal or the installed surface of lead-in wire 17a when being the ball summit of the specular components of minute surface and ball element, make LED61 luminous with the 6th light illumination mode.
In the 6th pattern, as impose among Figure 17 (F) hacures represented, the LED61 of the first substrate 63A that only is installed on downside Lighting Division 63 is luminous.
Next, the action that has the surface mounting apparatus 1 of said elements camera head 11 according to flowchart text shown in Figure 19.
In surface mounting apparatus 1, after the absorption action (step S1) of having carried out electronic component 17, in step S2, carry out lower surface identification.In this lower surface identification step, surface mounting apparatus 1 make the suction nozzle 16 that adsorbed electronic component 17 near above the element camera head 11 along the parallel movement of directions X, and element camera head 11 is taken lower surface image by video camera 31.This shooting is carried out under the state that makes cylinder 55 actions, so that described first catoptron 38 is crossing with the optical axis 33 of video camera 31.Surface mounting apparatus 1 utilizes the lower surface image of taking in this mode to carry out lower surface identification, and carries out above-mentioned instrumentation, differentiation etc.
Afterwards, in step S3, control device 8 differentiates whether carry out the coplanarity inspection.When not carrying out the coplanarity inspection, advance to step S4, surface mounting apparatus 1 carries out installation action.
On the other hand, when carrying out the coplanarity inspection, in the light path switch step shown in the step S5, control device 8 makes cylinder 55 actions, so that described first catoptron 38 leaves the optical axis 33 of video camera 31 to oblique below.
In the coplanarity identification step shown in the step S6, element camera head 11 moves and forms and take the skewing scheme picture under the state of second light path 37 at first catoptron 38.Skewing scheme similarly be the electronic component 17 that makes the lower surface image that has been taken again above the element camera head 11 along the image of taking by video camera 31 under the situation of the parallel movement of directions X.Control device 8 utilizes previous lower surface image of taking and the current skewing scheme of taking to look like to carry out coplanarity identification and coplanarity inspection.
Afterwards, in step S7, control device 8 is differentiated the crooked or lead-in wire perk of lead-in wire 17a of electronic components 17 whether in allowed band.When the crooked of lead-in wire 17a or lead-in wire perk were outside allowed band, control device 8 advanced to step S8 and installation action is stopped.At this moment, control device 8 carries out to the action of operator's notification error generation, or abandons the action of the electronic component 17 that is adsorbed.When the crooked of described lead-in wire 17a or lead-in wire perk were in allowed band, control device 8 advanced to step S9 and carries out installation action.
The element camera head 11 of Gou Chenging has the optical element 35 of video camera 31, first light path 36, second light path 37, light path switching usefulness as described above, wherein, video camera 31 is taken a plurality of installations terminal (terminal or lead-in wire 17a) of the electronic component 17 that is installed to printed-wiring board (PWB) 7.First light path 36 be for by described video camera 31 from comprise described a plurality of installation and take described installation with the light path of terminal with the vertical direction of the installed surface of terminal.Second light path 37 is for taking described installation with the light path of terminal by described video camera 31 from the direction that tilts with respect to described vertical direction, and is consistent with the optical path length of described first light path 36.Described optical element 35 is with any one and described video camera 31 ways of connecting switching-over light paths in described first light path 36 and second light path 37.
According to above-mentioned embodiment, 35 pairs of video cameras 31 of optical element are set up first light path 36, thereby video camera 31 is taken electronic component 17 from the direction vertical with respect to installed surface.On the other hand, 35 pairs of video cameras 31 of optical element are set up second light path 37, thereby video camera 31 is taken electronic component 17 from the tilted direction that tilts with respect to described vertical direction.Therefore, can take electronic component 17 from described two directions by a video camera 31.
Described optical element 35 is positioned on the optical axis 33 of video camera 31.In addition, described first light path 36, second light path 37 form in the mode of extending from described optical element 35 to electronic component 17 sides.Therefore, because need not significantly to leave the optical axis 33 of video camera 31, first light path 36 and second light path 37 just can form, so can form element camera head 11 compactly.Therefore, according to present embodiment, can provide a kind of with simple structure and realize compactly taking the element camera head 11 of the function of electronic component 17 from this two direction of direction with respect to the vertical direction of installed surface and inclination.
The capturing element of the described video camera 31 of present embodiment is line sensor 32.Therefore, owing to need not when taking, to make electronic component 17 static, so element camera head 11 is finished shooting at short notice.In addition, though the length on one side of the electronic component 17 that can be taken by line sensor 32 needing to be subjected to the scope of length direction of on-line sensor 32 with interior such restriction, the length relative difficult on other limits of electronic component 17 is restricted.Therefore, the element camera head 11 of present embodiment is compared with the element camera head in the past that is made of area sensor, has improved the degree of freedom of the size of the electronic component 17 that can take.
In addition, element camera head 11 has lighting device 45 between described video camera 31 and described electronic component 17.45 pairs of described electronic component 17 irradiates lights of this lighting device.In this lighting device 45, be formed with first slit 46 of a part that constitutes described first light path 36 and second slit 53 of a part that constitutes described second light path 37.Described first slit 46 and second slit 53 form in the mode that the length direction with described line sensor 32 extends abreast.
Therefore, although first light path 36 and second light path 37 for crossing, this lighting device 45 also can be radiated at light on the electronic component 17 fully.Therefore, can provide and to obtain the element camera head of two kinds of images clearly, wherein, a kind of image is the image that obtains from the direction shooting electronic component 17 vertical with installed surface, and another kind of image is the image that obtains from the tilted direction shooting electronic component 17 that tilts with respect to described vertical direction.
Described lighting device 45 has to switch turns on light and a plurality of Lighting Divisions of turning off the light (side Lighting Division 62, downside Lighting Division 63, oblique illumination portion 64).By switching with the turning on light and the light illumination mode of turning off the light and forming of remainder of the part of these Lighting Divisions, this lighting device 45 can switch be used to the illumination of the electronic component 17 that utilizes described first light path to take and be used for utilizing the illumination of the electronic component 17 that described second light path takes.Therefore, when lower surface is identified and coplanarity when identification, can correspond respectively to the optimum illumination of the state of the lead-in wire 17a of electronic component 17 and terminal.
Described switching part 11C comprises first 11A of catoptron portion with the reflecting surface that can advance and retreat and has second 11B of catoptron portion of the reflecting surface of not advancing and retreat.Therefore, can realize the switching of first light path 36 and second light path 37 by catoptron (first catoptron 38) simply.
Thereby the reflecting surface 38a of described first light path 36 by first 11A of catoptron portion that can constitute enters into the light of light path reflected light path and forms with advancing and retreat.Thereby the reflecting surface 38a of described second light path 37 by described first 11A of catoptron portion from light path withdraw from reflecting surface 38a not reflected light form.
Therefore, can carry out the switching of light path by only making the mobile simple structure of a catoptron (first catoptron 38), thereby the element camera head of low cost of manufacture can be provided.
Described first 11A of catoptron portion of present embodiment comprise the catoptron (second catoptron 44) of not advancing and retreat with respect to the parallel catoptron (first catoptron 38) of advance and retreat movably of described catoptron of not advancing and retreat.Therefore, can change light path by simple mirror structure.
In addition, element camera head 11 has the drive unit 43 of the reflecting surface 38a advance and retreat that make described first 11A of catoptron portion and described image pickup part (video camera 31), described first 11A of catoptron portion, described second 11B of catoptron portion and described drive unit 43 is accommodated in inner housing 34.
Therefore, can in the housing 34 of taking in video camera 31, form first light path 36 and second light path 37 compactly.
Therefore, owing to can make the catoptron 38 of winning mobile automatically by the control of control device 8, can after finishing, the shooting that utilizes first light path 36 utilize the shooting of second light path 37 rapidly.Therefore, element camera head 11 can carry out described two kinds of shootings in the shorter time.
The surface mounting apparatus 1 of present embodiment has terminal or the position of lead-in wire 17a and the test section 10 of height of taking electronic component 17 and detected electrons element 17 by said elements camera head 11.Therefore, compare with the surface mounting apparatus in the past of the camera head with two elements, the quantity of the camera head of the element of this surface mounting apparatus 1 is 1/2nd, can correspondingly reduce manufacturing cost and form small-sized.Herein so-called small-sized be the meaning that the floor area of surface mounting apparatus diminishes.
In addition, to have used imaging apparatus be the element camera head 11 of line sensor 32 to this surface mounting apparatus 1.Therefore, when taking, need not to make electronic component 17 to stop, can shortening the set-up time of the shooting time that comprises electronic component 17.
In the above-mentioned embodiment, show the example that uses catoptron (first catoptron 38) to constitute " switching part " of the present invention.But switching part involved in the present invention also can be made of prism.
Except surface mounting apparatus, so long as the device that electronic component is moved by suction nozzle, element camera head then involved in the present invention all can be suitable for.For example, although not shown, element camera head involved in the present invention can be applicable to by shooting and be adsorbed in being examined with the outward appearance of electronic component and carrying out the component detection device that image handles to check this electronic component of suction nozzle.In addition, even electronic component is contained in the component detection device that carries out the electricity inspection in the slot, be adsorbed in being examined with electronic component and detection of suction nozzle and be examined the position with terminals of electronic components or lead-in wire, test section highly as long as have to take by the element camera head, then also can use element camera head involved in the present invention.
Compare with the component detection device in the past of the camera head with two elements, equipped the component detection device of element camera head involved in the present invention, the quantity of the camera head of its element is 1/2nd, can correspondingly reduce manufacturing cost and form small-sized.Herein so-called small-sized be the meaning that the floor area of component detection device diminishes.
In addition, be the element camera head 11 of line sensor by using imaging apparatus, this component detection device does not need electronic component is stopped when taking, so can shorten the supervision time of electronic component.
Mainly comprise the invention with following structure in the above-mentioned embodiment.
The related element camera head of an aspect of of the present present invention comprises: image pickup part, take the electronic component that is installed to substrate; Light path from described electronic component to described image pickup part, this light path comprises first light path and second light path, described first light path is described image pickup part is taken described electronic component from the direction vertical with respect to the installed surface of described substrate light path, described second light path is the light path that described image pickup part is taken described electronic component from the direction that tilts with respect to the direction vertical with the installed surface of described substrate, and described second light path has the optical path length identical with described first light path; Switching part switches described first light path and described second light path.
According to this structure, switching part can be positioned on the optical axis of image pickup part.First light path and second light path can form in the mode of extending from described switching part to the electronic component side.Therefore, since first light path and second light path can be not significantly away from the optical axis ground formation of image pickup part, so can form the element camera head compact.Therefore, according to the present invention, can provide a kind of can and the realization compactly with simple structure to take the element camera head of the function of electronic component from this two direction of direction with respect to the vertical direction of installed surface and inclination.
Comparatively it is desirable in the said structure, also comprise: lighting device, between described image pickup part and described electronic component, illumination is penetrated to described electronic component; Wherein, described lighting device comprises: first slit constitutes the part of described first light path; Second slit constitutes the part of described second light path.
According to this structure, by being formed on first slit and second slit on the lighting device, can form effective light path.
Comparatively it is desirable in the said structure, described image pickup part comprises line sensor.According to this structure, owing to need not when taking, to make electronic component static, so can finish shooting at short notice.In addition, the length direction scope of the length on-line sensor on one side of the electronic component that can be taken by line sensor gets final product with interior, and the length relative difficult on other limits is restricted.Therefore, element camera head of the present invention is compared with the element camera head in the past that is made of area sensor, has improved the degree of freedom of the size of the electronic component that can take.
At this moment, extend along the length direction of described line sensor by making described first slit and described second slit, when using line sensor, can form effective light path.
Comparatively it is desirable in the said structure, described lighting device has can switch a plurality of Lighting Divisions of turning on light and turning off the light, based on turning on light and the switching of the pattern of turning off the light of remainder of the part of described a plurality of Lighting Divisions, and switch the illumination of the described electronic component that is used for utilizing described first light path to carry out described shooting and be used for utilizing described second light path to carry out the illumination of the described electronic component of described shooting.
According to this structure, by switching turning on light and turning off the light of Lighting Division, can form effective light path.
Comparatively it is desirable in the said structure, described switching part comprises: the first catoptron portion has the reflecting surface that can advance and retreat; The second catoptron portion has the reflecting surface of not advancing and retreat.According to this structure, can realize the switching of light path by catoptron simply.
Comparatively it is desirable in the said structure, thereby described first light path enters into the light of light path reflected light path based on the described reflecting surface that can advance and retreat of the described first catoptron portion and forms, thereby described second light path withdraws from not reflected light and forming of this reflecting surface based on the reflecting surface of the described first catoptron portion from light path.
According to this structure, because can be with the simple structure switching-over light path that a catoptron is moved, thereby can provide the element camera head of low cost of manufacture.
In addition, if the catoptron that the first catoptron portion is comprised do not advance and retreat with respect to the parallel catoptron of advance and retreat movably of described catoptron of not advancing and retreat, then can form the first catoptron portion simply by catoptron.
At this moment, comparatively it is desirable to also comprise: framework comprises and has first dip plane of specifying the pitch angle and second dip plane adjacent and parallel with described first dip plane across step with described first dip plane; Wherein, the catoptron of described advance and retreat can be installed on described first dip plane movably, and described catoptron of not advancing and retreat is fixed in described second dip plane.
According to this structure, because the catoptron of advance and retreat and the catoptron of not advancing and retreat be supported on the framework, so can make these catoptron high precision and be arranged in parallel simply.
Comparatively it is desirable in the said structure also comprise: drive unit is advanced and retreat the reflecting surface of the described first catoptron portion; Housing is accommodated in inside with described image pickup part, the described first catoptron portion, the described second catoptron portion and described drive unit.
According to this structure, can in taking in the housing of image pickup part, form first light path and second light path compactly.
The related surface mounting apparatus of another aspect of the present invention comprises: the said elements camera head, take the installation element as described electronic component; Test section according to the image of the described installation of being taken by described image pickup part with element, detects described installation with the position of the terminal of element and height or described installation position and the height with the lead-in wire of element.
According to this structure, can be from take the element camera head of electronic component with respect to this two direction of direction of the vertical direction of installed surface and inclination owing to have, therefore compare with the surface mounting apparatus in the past of the camera head with two elements, can reduce manufacturing cost and surface mounting apparatus is formed small-sized.Herein so-called small-sized be the meaning that the floor area of surface mounting apparatus diminishes.
The related component detection device of one side more of the present invention comprises: the said elements camera head, and take and use electronic component as being examined of described electronic component; Test section according to the described image of being taken by described image pickup part that is examined with electronic component, detects described position and height or described position and the height that is examined with the lead-in wire of electronic component that is examined with terminals of electronic components.
According to this structure, can be from take the element camera head of electronic component with respect to this two direction of direction of the vertical direction of installed surface and inclination owing to have, therefore compare with the component detection device in the past of the camera head with two elements, can reduce manufacturing cost and component detection device is formed small-sized.Herein so-called small-sized be the meaning that the floor area of component detection device diminishes.
Claims (12)
1. element camera head is characterized in that comprising:
Image pickup part is taken the electronic component that is installed to substrate;
Light path from described electronic component to described image pickup part, this light path comprises first light path and second light path, described first light path is described image pickup part is taken described electronic component from the direction vertical with respect to the installed surface of described substrate light path, described second light path is the light path that described image pickup part is taken described electronic component from the direction that tilts with respect to the direction vertical with the installed surface of described substrate, and described second light path has the optical path length identical with described first light path;
Switching part switches described first light path and described second light path.
2. element camera head according to claim 1 is characterized in that also comprising:
Lighting device between described image pickup part and described electronic component, is penetrated illumination to described electronic component; Wherein,
Described lighting device comprises:
First slit constitutes the part of described first light path;
Second slit constitutes the part of described second light path.
3. element camera head according to claim 1 is characterized in that:
Described image pickup part comprises line sensor.
4. element camera head according to claim 3 is characterized in that:
Described first slit and described second slit extend along the length direction of described line sensor.
5. element camera head according to claim 2 is characterized in that:
Described lighting device has can switch a plurality of Lighting Divisions of turning on light and turning off the light,
Based on turning on light and the switching of the pattern of turning off the light of remainder of the part of described a plurality of Lighting Divisions, and switch the illumination of the described electronic component that is used for utilizing described first light path to carry out described shooting and be used for utilizing described second light path to carry out the illumination of the described electronic component of described shooting.
6. element camera head according to claim 1 is characterized in that,
Described switching part comprises:
The first catoptron portion has the reflecting surface that can advance and retreat;
The second catoptron portion has the reflecting surface of not advancing and retreat.
7. element camera head according to claim 6 is characterized in that:
Thereby described first light path enters into the light of light path reflected light path based on the described reflecting surface that can advance and retreat of the described first catoptron portion and forms,
Thereby described second light path withdraws from not reflected light and forming of this reflecting surface based on the reflecting surface of the described first catoptron portion from light path.
8. element camera head according to claim 6 is characterized in that,
The described first catoptron portion comprises:
The catoptron of not advancing and retreat;
With respect to the parallel catoptron of advance and retreat movably of described catoptron of not advancing and retreat.
9. element camera head according to claim 8 is characterized in that also comprising:
Framework comprises first dip plane at the pitch angle with appointment and second dip plane adjacent and parallel with described first dip plane across step with described first dip plane; Wherein,
The catoptron of described advance and retreat can be installed on described first dip plane movably,
Described catoptron of not advancing and retreat is fixed in described second dip plane.
10. element camera head according to claim 6 is characterized in that also comprising:
Drive unit is advanced and retreat the reflecting surface of the described first catoptron portion;
Housing is accommodated in inside with described image pickup part, the described first catoptron portion, the described second catoptron portion and described drive unit.
11. a surface mounting apparatus is characterized in that comprising:
Claim 1 each described element camera head to the claim 10 is taken the installation element as described electronic component;
Test section according to the image of the described installation of being taken by described image pickup part with element, detects described installation with the position of the terminal of element and height or described installation position and the height with the lead-in wire of element.
12. a component detection device is characterized in that comprising:
Claim 1 each described element camera head to the claim 10 is taken and is used electronic component as being examined of described electronic component;
Test section according to the described image of being taken by described image pickup part that is examined with electronic component, detects described position and height or described position and the height that is examined with the lead-in wire of electronic component that is examined with terminals of electronic components.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-001887 | 2012-01-10 | ||
| JP2012001887A JP5798047B2 (en) | 2012-01-10 | 2012-01-10 | Component imaging device, surface mounter and component inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103196364A true CN103196364A (en) | 2013-07-10 |
| CN103196364B CN103196364B (en) | 2016-04-06 |
Family
ID=48719069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210262766.8A Active CN103196364B (en) | 2012-01-10 | 2012-07-26 | Element camera head, surface mounting apparatus and component detection device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5798047B2 (en) |
| CN (1) | CN103196364B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106465581A (en) * | 2014-05-27 | 2017-02-22 | 雅马哈发动机株式会社 | Component mounting apparatus and tape feeder |
| CN106465580A (en) * | 2014-05-30 | 2017-02-22 | 雅马哈发动机株式会社 | Component-data-generating device, surface-mounting machine, and method for generating component data |
| CN107709924A (en) * | 2015-05-27 | 2018-02-16 | 卡尔蔡司工业测量技术有限公司 | Use Lighting control during optical measuring device |
| CN105684568B (en) * | 2013-11-13 | 2018-09-07 | 雅马哈发动机株式会社 | Element photographic device and the surface mounting apparatus for using the element photographic device |
| CN114322756A (en) * | 2021-11-17 | 2022-04-12 | 中国航空工业集团公司洛阳电光设备研究所 | Dual-mode QFP and SOP packaging component pin coplanarity detection system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392356B (en) * | 2015-12-04 | 2018-10-09 | 深圳市瓦力自动化有限公司 | A kind of combination accurate positioning device and its method |
| WO2019176024A1 (en) * | 2018-03-14 | 2019-09-19 | 株式会社Ｆｕｊｉ | Image-capturing unit and component-mounting device |
| JP7116524B2 (en) * | 2018-03-22 | 2022-08-10 | ヤマハ発動機株式会社 | Image recognition device |
| JP7389920B2 (en) | 2020-10-30 | 2023-11-30 | 株式会社Fuji | Component placement machine and board production system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11132745A (en) * | 1997-11-04 | 1999-05-21 | Nec Corp | Lead bending inspection device |
| JP2005340648A (en) * | 2004-05-28 | 2005-12-08 | Yamaha Motor Co Ltd | Part recognition method, part recognition apparatus, surface mounter, and part inspection apparatus |
| CN1759644A (en) * | 2003-03-12 | 2006-04-12 | 雅马哈发动机株式会社 | Electronic component mounting device |
| CN1842269A (en) * | 2005-03-30 | 2006-10-04 | 雅马哈发动机株式会社 | Component moving and loading device, surface mounting machine, component detection device and disorder decision method |
| CN1860499A (en) * | 2003-09-29 | 2006-11-08 | 雅马哈发动机株式会社 | Imaging device and object-to-be-imaged moving device having the imaging device |
| CN201075000Y (en) * | 2007-08-06 | 2008-06-18 | 北京东孚久恒仪器技术有限公司 | Reflecting image-taking device of single lens particle decisionmaking instrument |
| CN101653057A (en) * | 2007-03-30 | 2010-02-17 | 雅马哈发动机株式会社 | Mounting apparatus and mounting method and substrate imaging means transfer method employed in the mounting apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3313099B2 (en) * | 1994-12-26 | 2002-08-12 | ヤマハ発動機株式会社 | Component recognition device for mounting machine |
| JP4166587B2 (en) * | 2003-01-24 | 2008-10-15 | 株式会社サキコーポレーション | Appearance inspection apparatus and volume inspection method |
| JP2007225317A (en) * | 2006-02-21 | 2007-09-06 | Juki Corp | Apparatus for three-dimensionally measuring component |
-
2012
- 2012-01-10 JP JP2012001887A patent/JP5798047B2/en active Active
- 2012-07-26 CN CN201210262766.8A patent/CN103196364B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11132745A (en) * | 1997-11-04 | 1999-05-21 | Nec Corp | Lead bending inspection device |
| CN1759644A (en) * | 2003-03-12 | 2006-04-12 | 雅马哈发动机株式会社 | Electronic component mounting device |
| CN1860499A (en) * | 2003-09-29 | 2006-11-08 | 雅马哈发动机株式会社 | Imaging device and object-to-be-imaged moving device having the imaging device |
| JP2005340648A (en) * | 2004-05-28 | 2005-12-08 | Yamaha Motor Co Ltd | Part recognition method, part recognition apparatus, surface mounter, and part inspection apparatus |
| CN1842269A (en) * | 2005-03-30 | 2006-10-04 | 雅马哈发动机株式会社 | Component moving and loading device, surface mounting machine, component detection device and disorder decision method |
| CN101653057A (en) * | 2007-03-30 | 2010-02-17 | 雅马哈发动机株式会社 | Mounting apparatus and mounting method and substrate imaging means transfer method employed in the mounting apparatus |
| CN201075000Y (en) * | 2007-08-06 | 2008-06-18 | 北京东孚久恒仪器技术有限公司 | Reflecting image-taking device of single lens particle decisionmaking instrument |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105684568B (en) * | 2013-11-13 | 2018-09-07 | 雅马哈发动机株式会社 | Element photographic device and the surface mounting apparatus for using the element photographic device |
| CN106465581A (en) * | 2014-05-27 | 2017-02-22 | 雅马哈发动机株式会社 | Component mounting apparatus and tape feeder |
| CN106465581B (en) * | 2014-05-27 | 2019-06-18 | 雅马哈发动机株式会社 | Element fixing apparatus and tape feeder |
| CN106465580A (en) * | 2014-05-30 | 2017-02-22 | 雅马哈发动机株式会社 | Component-data-generating device, surface-mounting machine, and method for generating component data |
| CN106465580B (en) * | 2014-05-30 | 2019-06-18 | 雅马哈发动机株式会社 | Component data generating means, surface mounting apparatus and component data generation method |
| CN107709924A (en) * | 2015-05-27 | 2018-02-16 | 卡尔蔡司工业测量技术有限公司 | Use Lighting control during optical measuring device |
| CN114322756A (en) * | 2021-11-17 | 2022-04-12 | 中国航空工业集团公司洛阳电光设备研究所 | Dual-mode QFP and SOP packaging component pin coplanarity detection system |
| CN114322756B (en) * | 2021-11-17 | 2023-10-24 | 中国航空工业集团公司洛阳电光设备研究所 | Dual-mode QFP and SOP packaging component pin coplanarity detection system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5798047B2 (en) | 2015-10-21 |
| JP2013143419A (en) | 2013-07-22 |
| CN103196364B (en) | 2016-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103196364A (en) | Element photographing device, surface mounting machine and component inspection device | |
| CN105684568B (en) | Element photographic device and the surface mounting apparatus for using the element photographic device | |
| KR102255607B1 (en) | Bonding device and method for detecting the height of the object to be bonded | |
| CN104081193A (en) | Complex inspection device for printed-circuit board | |
| KR20130097168A (en) | Component mounting device and component mounting method | |
| CN107006147A (en) | Component mounter | |
| CN101866863B (en) | Head assembly for chip mounter | |
| EP1154227B1 (en) | Edge detecting method and edge detecting apparatus | |
| CN1759644B (en) | Electronic component mounting device | |
| KR102393237B1 (en) | Conductive ball inspection and repair device | |
| CN106465580B (en) | Component data generating means, surface mounting apparatus and component data generation method | |
| US20150029330A1 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JP6392958B2 (en) | Component imaging apparatus and surface mounter using the same | |
| JP5149147B2 (en) | Component inspection device and component transfer device | |
| US9491411B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JP4213292B2 (en) | Component recognition system for surface mounters | |
| US20150026974A1 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JP5873988B2 (en) | Parts transfer device | |
| KR20110094972A (en) | Flip chip mounter | |
| JP7300580B2 (en) | Component mounter | |
| JP7316488B2 (en) | Component mounter | |
| JP7316489B2 (en) | Component mounter | |
| JP7394280B2 (en) | Component mounting equipment | |
| KR100604317B1 (en) | Device for mounting of electrical parts and method for mounting of Electrical Parts using the same | |
| JP6033052B2 (en) | Parts transfer device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |