JP7394280B2 - Component mounting equipment - Google Patents

Description

The present invention relates to a component mounting apparatus that holds electronic components with a nozzle and mounts them on a board.

A component mounting device holds an electronic component supplied by a component supply device such as a tape feeder using a nozzle of a mounting head, takes it out, and mounts it on a board. While taking out the electronic component and mounting it on the board, the component mounting device uses a component recognition camera to image the electronic component held by the nozzle from below, recognizes the position of the electronic component held by the nozzle, and places the electronic component on the board. Correct the mounting position. In addition, in order to reliably mount electronic components on the board, we use a flowmeter to measure the air flowing into the nozzle to confirm that the nozzle is holding the electronic component before mounting it, and to confirm that the nozzle is holding the electronic component after mounting it. Known to make sure no parts are retained (taken home).

By the way, with the miniaturization of electronic components in recent years, the diameter of the nozzle has also become smaller, making it difficult to determine the presence or absence of minute electronic components based on the flow rate of air flowing into the nozzle. Detection of presence or absence is desired. For example, Patent Document 1 describes that an imaging device including a camera whose optical axis is directed horizontally and a mirror that is rotatably supported and movable in the horizontal direction is mounted on a mounting head. In Patent Document 1, by changing the position and angle of the mirror, electronic components held by a nozzle are imaged from the side without using a mirror, and a mirror tilted diagonally upward is inserted below the nozzle. This enables imaging of electronic components from below using a single imaging device.

JP2011-86847A

However, in Patent Document 1, the imaging device placed on the mounting head is large in size and heavy because it is equipped with a camera with its optical axis directed horizontally, as well as means for rotating and moving a mirror. . Therefore, there have been problems in that the moving speed of the mounting head is limited, which reduces the efficiency of the mounting operation, and that it becomes difficult to finely control the stopping position of the mounting head.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component mounting apparatus that can detect the presence or absence of an electronic component at the tip of a nozzle without interfering with the electronic component mounting operation.

A component mounting apparatus according to the present invention moves a mounting head having a plurality of nozzles that holds electronic components between a component supply section that supplies electronic components and a board holding section that holds a board, and places the electronic components on the board. A component mounting apparatus mounted on the mounting head, the mounting head having a camera that can simultaneously image the tips of the plurality of nozzles and the substrate, the mounting head having the plurality of nozzles arranged in an annular shape, The camera was placed in an inner area surrounded by the plurality of nozzles .

According to the present invention, the presence or absence of an electronic component at the tip of a nozzle can be detected without interfering with the work of mounting the electronic component.

A plan view of a component mounting apparatus according to an embodiment of the present invention A partial cross-sectional view of a component mounting apparatus according to an embodiment of the present invention (a) Bottom view (b) Partial front view of a mounting head included in a component mounting apparatus according to an embodiment of the present invention A diagram showing an example of an image captured by a head camera of a mounting head included in a component mounting apparatus according to an embodiment of the present invention. A diagram showing an example of an image captured by a head recognition camera provided in a component mounting apparatus according to an embodiment of the present invention. A block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention A diagram showing an example of a component recognition image captured by a component recognition camera included in a component mounting apparatus according to an embodiment of the present invention. A diagram illustrating recognition processing of an image captured by a head camera provided in a component mounting apparatus according to an embodiment of the present invention. A diagram illustrating recognition processing of an image captured by a head recognition camera provided in a component mounting apparatus according to an embodiment of the present invention. (a) (b) Bottom views of other examples of the mounting head included in the component mounting apparatus according to the embodiment of the present invention A bottom view of another example of the mounting head included in the component mounting apparatus according to the embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate depending on the specifications of the component mounting apparatus and the mounting head. Hereinafter, corresponding elements in all drawings will be denoted by the same reference numerals, and redundant explanation will be omitted. In FIG. 1 and some parts described later, the two axes that are orthogonal to each other in the horizontal plane are the X direction of the substrate transport direction (left-right direction in FIG. 1), and the Y direction (vertical direction in FIG. 1) orthogonal to the substrate transport direction. is shown. In FIG. 2 and a portion to be described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal surface.

First, the configuration of the component mounting apparatus 1 will be explained with reference to FIGS. 1 and 2. In FIG. 1, a substrate transport mechanism 2 is installed in the center of the base 1a in the X direction. The substrate transport mechanism 2 transports the board 3 carried in from the upstream side in the X direction, and positions and holds the board 3 at a mounting work position by a mounting head, which will be described below. Further, the board transport mechanism 2 transports the board 3 on which the component mounting work has been completed to the downstream side. The substrate transport mechanism 2 includes a substrate holding section 2a that holds the substrate 3 at a mounting work position. Component supply units 4 are installed on both sides of the board transport mechanism 2, respectively.

In FIG. 2, both component supply sections 4 are each attached with a cart 6 on which a plurality of tape feeders 5 are mounted in parallel in the X direction. A reel 8 on which a carrier tape 7 in which a pocket for storing an electronic component D is wound is wound is held on the front side of the cart 6. The tape feeder 5 pitch-feeds the carrier tape 7 stored in the reel 8 in the direction (tape feeding direction) from the outside of the component supply section 4 toward the board transport mechanism 2, so that the mounting head picks up the electronic component D. The electronic component D is supplied to the component take-out position.

In FIG. 1, a Y-axis table 9 equipped with a linear drive mechanism is arranged at both ends of the upper surface of the base 1a in the X direction. A beam 10 similarly equipped with a linear mechanism is coupled to the Y-axis table 9 so as to be movable in the Y direction. A mounting head 11 is mounted on the beam 10 so as to be movable in the X direction. In FIGS. 1 and 2, the mounting head 11 includes a plurality of nozzle units 11a each having a nozzle 11b attached to the lower end of the nozzle 11b for holding the electronic component D by vacuum suction. The nozzle unit 11a moves the nozzle 11b up and down in the vertical direction (Z direction). In this example, the mounting head 11 includes a total of eight nozzle units 11a, four in the X direction and two rows in the Y direction.

The Y-axis table 9 and the beam 10 constitute a mounting head moving mechanism 12 that moves the mounting head 11 in the horizontal direction (X direction, Y direction). The mounting head moving mechanism 12 and the mounting head 11 pick up the electronic component D from the component take-out position of the tape feeder 5 attached to the component supply section 4 by vacuum suction using the nozzle 11b, and hold it on the board holding section 2a. A series of turns of component mounting work, in which the parts are transferred to the mounting position of the board 3 and mounted, is repeatedly executed.

1 and 2, the mounting head 11 is equipped with a board recognition camera 13 that is located on the lower surface side of the beam 10 and moves integrally with the mounting head 11. As the mounting head 11 moves, the board recognition camera 13 moves above the board 3 held by the board holder 2a and images the board mark 3a provided on the board 3. The imaging result is transferred to the control section 20 (see FIG. 6), and the position of the substrate 3 is recognized by the board recognition processing section 21 (see FIG. 6).

A component recognition camera 14 is installed between the component supply section 4 and the board transport mechanism 2 on the front side. The component recognition camera 14 images the electronic component D held by the nozzle 11b from below when the mounting head 11 that has taken out the electronic component D from the component supply section 4 is located above the component recognition camera 14. The imaging result is transferred to the control section 20, and the position of the electronic component D held by the nozzle 11b is recognized by the component recognition processing section 22 (see FIG. 6). In the component mounting work of the electronic component D on the board 3 by the mounting head 11, the mounting position is corrected by taking into account the recognition result of the board 3 by the board recognition camera 13 and the recognition result of the electronic component D by the component recognition camera 14. be exposed.

In FIGS. 1 and 2, a head camera 15 is installed on the lower surface of the mounting head 11. The head camera 15 images the tips of the plurality of nozzles 11b of the mounting head 11. Also. As the mounting head 11 moves, the head camera 15 images the upper surface of the substrate 3 held by the substrate holding section 2a. The imaging result is transferred to the control section 20, the presence or absence of the electronic component D held in the nozzle 11b is recognized by the first electronic component detection section 23 (see FIG. 6), and the presence or absence of the electronic component D held in the nozzle 11b is recognized by the on-board object detection section 25 (see FIG. 6). The state of the upper surface of the substrate 3 is recognized.

Here, details of the head camera 15 will be explained with reference to FIGS. 3 and 4. In FIGS. 3A and 3B, the head camera 15 is arranged at the center of the lower surface of the mounting head 11. That is, the head camera 15 is located between the second and third of the four nozzles 11b arranged in the X direction on the lower surface of the mounted head 11, and between the two rows of nozzles 11b arranged in the Y direction. It is located at the position of The head camera 15 is arranged on the mounting head 11 with its optical axis 15c facing downward. The head camera 15 is configured such that a lens 15b such as a fisheye lens for capturing wide-angle images is disposed above an imaging section 15a that includes an imaging means such as an image sensor.

FIG. 4 shows a head camera image taken by the head camera 15 when the mounting head 11, which is sucking electronic components D into eight nozzles 11b, is located near the center of the board 3 held by the board holding part 2a. Image 15v is shown. The head camera captured image 15v has distortion due to the characteristics of the lens 15b. The black portions at the four corners of the head camera captured image 15v are areas that cannot be captured by the head camera 15 due to the characteristics of the lens 15b. The left and right sides of the head camera captured image 15v are areas that cannot be captured by the head camera 15 due to the characteristics of the imaging unit 15a.

In the peripheral part of the head camera captured image 15v, the tips of the eight nozzles 11b of the mounting head 11 and the electronic components D held by the nozzles 11b are shown so as not to overlap with each other. Furthermore, the top surface of the board 3 including two board marks 3a formed on the board 3 is shown in the center of the head camera captured image 15v. That is, the head camera 15 includes a lens 15b that simultaneously guides light from the tip of the nozzle 11b and light from the top surface of the substrate 3 to the imaging section 15a. Since the head camera 15 moves together with the mounting head 11, even if the mounting head 11 moves, the positions of the nozzle 11b and the electronic component D shown in the head camera image 15v do not change. On the other hand, the image of the substrate 3 reflected at the center moves as the mounting head 11 moves.

In FIG. 3(b), the lens 15b is located at the same height as the position Hn of the tip of the nozzle 11b when the nozzle 11b holds the electronic component D and rises, or is located above the position of the tip of the nozzle 11b. ing. In this example, a position Hl where the lens 15b contacts the imaging section 15a is set at a position higher than the position Hn of the tip of the nozzle 11b by a height ΔH. As a result, the eight nozzles 11b and the electronic component D held by the nozzles 11b that appear in the head camera captured image 15v do not fall out of the imaging area of the head camera 15.

Note that the head camera captured image 15v obtained by the head camera 15 differs depending on the characteristics of the imaging section 15a and the lens 15b, so the arrangement position of the head camera 15 is changed as appropriate according to these characteristics. That is, the head camera 15 is arranged at a position where images of the tips of the plurality of nozzles 11b can be captured without overlapping each other, depending on the characteristics of the imaging unit 15a and the lens 15b. In this way, the mounting head 11 has the optical axis 15c directed below the mounting head 11, and has the head camera 15 that can simultaneously image the tip of the nozzle 11b and the top surface of the substrate 3.

In FIGS. 1 and 2, a head recognition camera 16 is installed between the component supply section 4 and the substrate transport mechanism 2 on the rear side. The head recognition camera 16 is arranged on the base 1a with the optical axis 16c facing upward. The head recognition camera 16 is configured such that a lens 16b such as a fisheye lens for capturing wide-angle images is disposed above an imaging section 16a that includes an imaging means such as an image sensor. The head recognition camera 16 images the lower surface of the mounting head 11 located above. The imaging result is transferred to the control section 20, and the presence or absence of the electronic component D held in the nozzle 11b is recognized by the second electronic component detection section 24 (see FIG. 6).

FIG. 5 shows a head recognition camera image 16v taken by the head recognition camera 16 when the mounting head 11, which is sucking electronic components D into eight nozzles 11b, is in the sky. The image captured by the head recognition camera 16v has distortion due to the characteristics of the lens 16b. The black parts at the four corners of the head recognition camera image 16v are areas that the head recognition camera 16 cannot capture due to the characteristics of the lens 16b. The left and right sides of the head recognition camera captured image 16v are areas that cannot be captured by the head recognition camera 16 due to the characteristics of the imaging unit 16a.

In the upper left of the head recognition camera captured image 16v, the tips of the eight nozzles 11b of the mounting head 11 and the electronic components D held by the nozzles 11b are shown without overlapping each other. That is, the head recognition camera 16 has a lens 16b that guides light from the tips of the plurality of nozzles 11b to the imaging device. The head recognition camera 16 has a wide angle of view, and by setting the head recognition camera 16 between the component supply section 4 and the board holding section 2a, the mounting head that moves between the component supply section 4 and the board 3 during component mounting work can be used. 11 can be imaged over a wide range.

Note that since the head recognition camera image 16v obtained by the head recognition camera 16 differs depending on the characteristics of the imaging unit 16a and the lens 16b, the arrangement position of the head recognition camera 16 is changed as appropriate according to the characteristics. That is, the head recognition camera 16 is arranged at a position where images of the tips of the plurality of nozzles 11b can be captured without overlapping each other, depending on the characteristics of the imaging section 16a and the lens 16b. The component mounting apparatus 1 may include two or more head recognition cameras 16.

In FIG. 1, a touch panel 17 that is operated by a worker is installed at a position where the worker works on the front side of the component mounting apparatus 1. The touch panel 17 displays various information on its display section, and allows an operator to input data and operate the component mounting apparatus 1 using operation buttons displayed on the display section.

Next, with reference to FIG. 6, the configuration of the control system of the component mounting apparatus 1 will be described. The control unit 20 included in the component mounting apparatus 1 includes a board transport mechanism 2, a component supply unit 4, a mounting head 11, a mounting head moving mechanism 12, a board recognition camera 13, a component recognition camera 14, a head camera 15, a head recognition camera 16, It is connected to the touch panel 17. The control section 20 includes a board recognition processing section 21 , a component recognition processing section 22 , a first electronic component detection section 23 , a second electronic component detection section 24 , a board object detection section 25 , a mounting control section 26 , and a mounting storage section 27 . We are prepared. The mounting storage section 27 is a storage device, and stores production data including the component name (type), mounting position (XY coordinates), etc. of the electronic component D, which is referred to when mounting the electronic component D on the board 3.

The board recognition processing unit 21 controls the board recognition camera 13, performs recognition processing on the imaged result of the board 3 held by the board holding unit 2a by the board recognition camera 13, and specifies the position of the board mark 3a. Further, the board recognition processing unit 21 recognizes and processes the imaging result including the mounting position of the electronic component D, and recognizes dust at the mounting position and electronic components D that have been accidentally dropped onto the board 3 on the top surface of the board 3. Detect foreign objects.

In FIG. 6, the component recognition processing unit 22 controls the component recognition camera 14, performs recognition processing on the imaged result of the electronic component D held in the nozzle 11b before mounting by the component recognition camera 14, and recognizes the electronic component D for the nozzle 11b. Detect the position of D.

Here, with reference to FIG. 7, the component recognition image 14v of the electronic component D held in the nozzle 11b, which was captured by the component recognition camera 14 and subjected to recognition processing by the component recognition processing unit 22, will be described. In the component recognition image 14v, a center line 14x in the X direction and a center line 14y in the Y direction are displayed in an overlapping manner. The intersection of the center line 14x in the X direction and the center line 14y in the Y direction is the center 14c of the component recognition image 14v. The mounting position of the component recognition camera 14 and the stop position of the nozzle 11b are adjusted so that the center 14c of the component recognition image 14v and the center Cn of the nozzle 11b coincide.

The component recognition processing unit 22 detects the center Cd of the electronic component D from the outer shape of the electronic component D in the component recognition image 14v. The center Cd is the suction target position of the nozzle 11b. Further, the component recognition processing unit 22 calculates the position of the center Cd of the electronic component D from the center 14c of the component recognition image 14v as a holding position deviation (Xm, Ym). Further, the component recognition processing unit 22 detects whether or not the electronic component D is held in the nozzle 11b and whether the posture of the electronic component D held is normal or not from the component recognition image 14v.

In this way, the component recognition camera 14 images the electronic component D held by the nozzle 11b before being mounted on the board 3. Further, the component recognition processing section 22 is an electronic component detection section that detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image acquired by the component recognition camera 14.

In FIG. 6, the first electronic component detection unit 23 controls the head camera 15, recognizes and processes the imaging result including the nozzle 11b taken by the head camera 15, and detects the presence or absence and posture of the electronic component D held in the nozzle 11b. To detect.

Here, with reference to FIG. 8, an example of the head camera image 15v1 captured by the head camera 15 and recognized by the first electronic component detection unit 23 will be described. The tips of the eight nozzles 11b of the mounting head 11 are shown in the periphery of the head camera image 15v1. The first electronic component detection unit 23 performs recognition processing within recognition frames Wa1 to Wa8 that are set in advance according to the type of nozzle 11b mounted on the mounting head 11 and the type of electronic component D held, and detects the nozzle 11b. detects the presence and posture of the electronic component D held by the electronic component D. The first electronic component detection unit 23 detects the presence or absence and posture of the electronic component D in the recognition frames Wa1 to Wa8, for example, by pattern matching.

In FIG. 8, electronic components D held in normal postures are shown in recognition frames Wa1, Wa2, Wa4, Wa5, Wa7, and Wa8. Therefore, the first electronic component detection unit 23 determines that the nozzles 11b corresponding to the recognition frames Wa1, Wa2, Wa4, Wa5, Wa7, and Wa8 are holding the electronic component D in a normal posture. Further, the first electronic component detection unit 23 determines that the nozzle 11b corresponding to the recognition frame Wa3 does not hold the electronic component D because the electronic component D is not reflected in the recognition frame Wa3. In addition, the first electronic component detection unit 23 detects that a part of the electronic component D is captured in the recognition frame Wa6, but is not included in the recognition frame Wa6, so the nozzle 11b corresponding to the recognition frame Wa6 is It is determined that the electronic component D is not held in a normal posture.

In this way, the first electronic component detection unit 23 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image of the tip of the nozzle 11b in the peripheral area of the head camera captured image 15v1 acquired by the head camera 15. This is an electronic component detection unit that detects. The first electronic component detection section 23 detects the electronic component D at the tip of the nozzle 11b during a period after the mounting head 11 picks up the electronic component D from the component supply section 4 and before mounting it on the substrate 3 held by the substrate holding section 2a. The presence or absence of part D and its orientation are detected. Thereby, it can be determined whether the mounting head 11 can mount the electronic component D or not.

Further, after the mounting head 11 mounts the electronic component D on the substrate 3, the first electronic component detection unit 23 detects the presence or absence of the electronic component D at the tip of the nozzle 11b. Thereby, it can be determined whether the nozzle 11b is unable to mount the electronic component D on the board 3 and is taking it home. In this way, the component mounting apparatus 1 of the present embodiment can be used even if the nozzle 11b is used for minute electronic components and has a small inner diameter, and the presence or absence of the electronic component D cannot be detected based on the difference in the flow rate of sucked air. , the presence or absence of the electronic component D can be detected by the head camera 15.

Further, since the head camera 15 is installed integrally with the mounting head 11, it is possible to detect the presence or absence of the electronic component D at the tip of the nozzle 11b even when the mounting head 11 is moving. Therefore, there is no need to go through the air above the component recognition camera 14 to confirm the presence or absence of the electronic component D, and the component mounting work can be performed efficiently.

In FIG. 6, the board object detection unit 25 controls the head camera 15, performs recognition processing on the image taken by the head camera 15, and detects an object present on the top surface of the board 3. In FIG. 8, the board object detection unit 25 detects the board 3 that appears in the center of the head camera image 15v1 based on the relative positional relationship of the mounting head 11 with respect to the board 3 held by the board holding unit 2a. The position of the board mark 3a is specified. Further, the board object detection unit 25 detects foreign objects present on the top surface of the board 3, such as dust at the mounting position of the electronic component D or electronic components D accidentally dropped onto the board 3.

The board object detection unit 25 detects a recognition frame Wb1, which is determined based on the current position of the mounting head 11, the coordinates of the board mark 3a on the board 3, and distortion determined by the characteristics of the imaging unit 15a and lens 15b of the head camera 15. The position of the board mark 3a in Wb2 is recognized. Further, the on-board object detection section 25 detects whether or not there is a foreign object such as dust in the recognition frames Wc1 and Wc2 determined based on the mounting position of the electronic component D and the distortion aberration stored in the mounting storage section 27. to judge. In this way, the on-board object detection unit 25 detects objects (board marks 3a, foreign objects, etc.).

In FIG. 6, the second electronic component detection unit 24 controls the head recognition camera 16, performs recognition processing on the imaging result including the nozzle 11b by the head recognition camera 16, and determines whether or not there is an electronic component D held in the nozzle 11b. Detect posture.

Here, with reference to FIG. 9, a head recognition camera image 16v1 captured by the head recognition camera 16 and subjected to recognition processing by the second electronic component detection unit 24 will be described. The head recognition camera captured image 16v1 shows the mounting head 11 shown in FIG. 8, and the tips of the eight nozzles 11b of the mounting head 11 are shown. The second electronic component detection unit 24 detects the current position of the mounting head 11, the type of nozzle 11b attached to the mounting head 11, the type of electronic component D held, and the characteristics of the imaging unit 16a and lens 16b of the head recognition camera 16. The presence or absence and orientation of the electronic component D held by the nozzle 11b within the recognition frames Wd1 to Wd8 determined based on the distortion aberration determined by are detected. The second electronic component detection unit 24 detects the presence or absence and orientation of the electronic component D in the recognition frames Wd1 to Wd8, for example, by pattern matching.

In FIG. 9, electronic components D held in normal postures are shown in recognition frames Wd1, Wd2, Wd4, Wd5, Wd7, and Wd8. Therefore, the second electronic component detection unit 24 determines that the nozzles 11b corresponding to the recognition frames Wd1, Wd2, Wd4, Wd5, Wd7, and Wd8 are holding the electronic component D in a normal posture. Further, the second electronic component detection unit 24 determines that the nozzle 11b corresponding to the recognition frame Wd3 does not hold the electronic component D because the electronic component D is not reflected in the recognition frame Wd3. Further, the second electronic component detection unit 24 detects the nozzle corresponding to the recognition frame Wd6 because the electronic component D is reflected in the recognition frame Wd6 and the electronic component D in the recognition frame Wa6 does not have a predetermined shape. 11b determines that the electronic component D is not held in a normal posture.

In this way, the second electronic component detection section 24 is an electronic component detection section that detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the head recognition camera captured image 16v1 acquired by the head recognition camera 16. . The second electronic component detection section 24 detects the electronic component D at the tip of the nozzle 11b during the period after the mounting head 11 picks up the electronic component D from the component supply section 4 and before it is mounted on the substrate 3 held by the substrate holding section 2a. The presence or absence of part D and its orientation are detected. Thereby, it can be determined whether the mounting head 11 can mount the electronic component D on the board 3 or not.

Further, after the mounting head 11 mounts the electronic component D on the substrate 3, the second electronic component detection unit 24 detects the presence or absence of the electronic component D at the tip of the nozzle 11b. Thereby, it can be determined whether the nozzle 11b is unable to transfer the electronic component D onto the board 3 and is taking it home. In this way, the component mounting apparatus 1 of the present embodiment can be used even if the nozzle 11b is used for minute electronic components and has a small inner diameter, and the presence or absence of the electronic component D cannot be detected based on the difference in the flow rate of sucked air. , the presence or absence of the electronic component D can be detected by the head recognition camera 16.

In addition, since the head recognition camera 16 has a wide angle of view, there is no need for the mounting head 11 to approach directly above the head recognition camera 16 in order to detect the presence or absence of the electronic component D, allowing the component mounting work to be carried out efficiently. be able to. Note that the component mounting apparatus 1 may include two or more head recognition cameras 16. In that case, the second electronic component detection unit 24 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the head recognition camera image 16v1 captured by the head recognition camera 16 near the mounting head 11.

In FIG. 6, the mounting control unit 26 determines the position of the board mark 3a recognized by the board recognition processing unit 21 or the on-board object detection unit 25, the presence or absence of foreign objects on the top surface of the board 3, and the presence or absence of foreign objects recognized by the component recognition processing unit 22. the position of the electronic component D held by the nozzle 11b, the presence or absence of the electronic component D at the tip of the nozzle 11b detected by the component recognition processing section 22, the first electronic component detection section 23, or the second electronic component detection section 24; Based on the posture and the production data stored in the mounting storage section 27, a component mounting work for mounting the electronic component D on the board 3 is executed.

The component mounting apparatus 1 described above includes a board recognition camera 13, a component recognition camera 14, a head camera 15, and a head recognition camera 16, but the component mounting apparatus 1 does not need to include all of these cameras. For example, the component mounting apparatus 1 may include a component recognition camera 14, a board recognition camera 13, and a head camera 15. In that case, the component recognition camera 14 is a first camera that is held by a nozzle 11b that passes through the sky and captures an image of the electronic component D before being mounted on the board 3. Further, the board recognition camera 13 is a second camera that images the top surface of the board 3.

Further, the head camera 15 has a wider angle of view than the angle of view of the first camera and the second camera, and moves to the component supply section 4 after the nozzle 11b mounts the electronic component D on the board 3. This is a third camera that images the nozzle 11b that the mounting head 11 has. Note that the angle of view of the first camera is any value from 0° to 30°. Further, the angle of view of the second camera is any value from 0° to 20°. Further, the angle of view of the third camera is between 100° and 200°, and particularly preferably between 185° and 195°.

Then, the first electronic component detection unit 23 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image acquired by the third camera (head camera captured image 15v1). Further, the on-board object detection unit 25 detects an object (board mark 3a, foreign object, etc.) present on the top surface of the board 3 based on the image of the top surface of the board 3 in the center part of the image acquired by the third camera. .

Further, the component mounting apparatus 1 only needs to include a component recognition camera 14, a board recognition camera 13, and a head recognition camera 16. In that case, the component recognition camera 14 is a first camera that is held by a nozzle 11b that passes through the sky and captures an image of the electronic component D before being mounted on the board 3. Further, the board recognition camera 13 is a second camera that images the top surface of the board 3. The head recognition camera 16 has a wider angle of view than the first camera and the second camera, and the head recognition camera 16 detects the tip of the nozzle 11b after the mounting operation of mounting the electronic component D on the board 3 as it passes through the sky. This is the third camera that captures images. Then, the second electronic component detection unit 24 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image acquired by the third camera (head recognition camera captured image 16v1).

Furthermore, the component mounting apparatus 1 may include two cameras, a component recognition camera 14 and a head recognition camera 16, which capture images of objects passing above. In that case, the component recognition camera 14 is a first camera that images the electronic component D held by the nozzle 11b before being mounted on the board 3. Further, the head recognition camera 16 is a second camera that images the tip of the nozzle 11b after the mounting operation of mounting the electronic component D on the board 3, and has a wider angle of view than the first camera. Then, the second electronic component detection unit 24 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image acquired by the second camera (head recognition camera captured image 16v1).

Furthermore, the component mounting apparatus 1 may include only the head recognition camera 16. In that case, the head recognition camera 16 is a camera that can image an object passing in the sky and simultaneously image the tips of the plurality of nozzles 11b after the mounting operation of mounting the electronic component D on the board 3. The second electronic component detection section 24 is an electronic component detection section that detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image acquired by the camera (head recognition camera image 16v1).

Further, the component mounting apparatus 1 may include only the head camera 15. In that case, the head camera 15 is a camera that can simultaneously image the tips of the plurality of nozzles 11b that the mounting head 11 has. Then, the first electronic component detection unit 23 detects the presence or absence and posture of the electronic component D at the tip of the nozzle 11b based on the image of the tip of the nozzle 11b in the peripheral area of the image acquired by the camera (head camera captured image 15v1). This is an electronic component detection section.

As described above, the component mounting apparatus 1 of this embodiment includes a camera (head camera 15) in the mounting head 11 that can simultaneously image the tips of the plurality of nozzles 11b. Thereby, the presence or absence of the electronic component D at the tip of the nozzle 11b can be detected without interfering with the mounting work of the electronic component D.

Next, other embodiments of the mounting head will be described with reference to FIGS. 10 and 11. Hereinafter, the same parts as those of the above-mentioned mounting head 11 will be given the same reference numerals, and detailed explanation will be omitted. The other mounting head (hereinafter referred to as "first mounting head 30") shown in FIG. 10(a) has a total of eight nozzles 11b, four in the X direction and two in the Y direction. However, the distance between the nozzles 11b is narrower than that of the mounting head 11. Therefore, the head camera 15 cannot be placed in the center of the first mounting head 30, and one head camera 15 is placed on one side in the Y direction. This head camera 15 is arranged at a position where it can capture images of the tips of the plurality of nozzles 11b without overlapping each other.

The other mounting head (hereinafter referred to as "second mounting head 31") shown in FIG. 10(b) has the same number and arrangement of nozzles 11b as the first mounting head 30, but the arrangement of the head camera 15 is different. different. That is, the second mounting head 31 has head cameras 15 arranged on both sides in the X direction. The two head cameras 15 are arranged at positions where they can complement each other and capture images of the tips of all (eight) nozzles 11b of the mounting head 11 without overlapping each other. In this way, the number of head cameras 15 disposed on the second mounting head 31 is not limited to two, and two or more head cameras 15 may be disposed.

The other mounting head (hereinafter referred to as "third mounting head 32") shown in FIG. , which is different from the second mounting head 31. The head camera 15 is arranged in an inner region surrounded by the plurality of nozzles 11b. Thereby, the head camera 15 can capture images of the tips of the plurality of nozzles 11b without overlapping each other.

The component mounting device of the present invention has the effect of being able to detect the presence or absence of an electronic component at the tip of a nozzle without interfering with the work of mounting electronic components, and is useful in the field of mounting electronic components on a board. .

1 Component mounting device 2a Board holding section 3 Board 4 Component supply section 11 Mounting head 11b Nozzle 15 Head camera (camera)
15a Imaging unit 15b Lens 15c Optical axis 15v, 15v1 Head camera captured image (image)
30 First mounted head (mounted head)
31 Second mounting head (mounting head)
32 Third mounting head (mounting head)
D Electronic parts

Claims (9)

The component mounting apparatus mounts the electronic component on the board by moving a mounting head having a plurality of nozzles that holds the electronic component between a component supply part that supplies the electronic component and a board holding part that holds the board. hand,
The mounting head includes a camera that can simultaneously image the tips of the plurality of nozzles and the substrate,
A plurality of the nozzles are arranged in an annular shape on the mounting head, and the camera is arranged in an inner region surrounded by the plurality of nozzles . The component mounting apparatus according to claim 1, wherein the camera includes a lens that simultaneously guides light from the tips of the plurality of nozzles to an imaging section. 3. The component mounting apparatus according to claim 2, wherein the camera has an optical axis directed below the mounting head. 4. The component mounting apparatus according to claim 3, wherein the lens is located at the same height as or above the position of the tip of the nozzle when the nozzle is raised holding the electronic component. 5. The component mounting apparatus according to claim 1, further comprising an electronic component detection section that detects the presence or absence and orientation of an electronic component at the tip of the nozzle based on an image acquired by the camera. The component mounting apparatus according to claim 5, wherein the electronic component detection unit detects the presence or absence and posture of the electronic component held at the tip of the nozzle based on an image of the tip of the nozzle in a peripheral area of the image. . 7. The component mounting apparatus according to claim 5, wherein the image is an image having distortion aberration. 8. The component mounting apparatus according to claim 1, wherein the camera is arranged at a position where images of the tips of the plurality of nozzles can be captured without overlapping with each other. 8. The component mounting apparatus according to claim 1, wherein two or more of the cameras are arranged on the mounting head.

Images