JP3313099B2 - Component recognition device for mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting machine configured to adsorb a component such as a chip component by a head unit having a nozzle member and mount it at a predetermined position on a printed circuit board. The present invention relates to a component recognizing device of a mounting machine adapted to recognize components picked up by a component.

[0002]

2. Description of the Related Art Conventionally, a head unit having a nozzle member for mounting components sucks a component such as an IC from a component supply unit, transfers the component onto a printed circuit board positioned at a predetermined position on the printed circuit board. A mounting machine designed to be mounted is generally known. Recently, there has been proposed a mounting machine in which a plurality of nozzle members are arranged in a head unit so as to improve mounting efficiency so that a plurality of components can be transferred at a time.

[0003] In such a mounting machine, there is some variation in the position of the component when the component is sucked by the nozzle member, and it is required to correct the mounting position in accordance with the deviation of the component suction position. Therefore, the position of the suction position with respect to the nozzle member is detected by recognizing the suctioned component,
Also, if the component is abnormal, for example, if the component has leads,
The lead breakage or the like is detected.

[0004] As an apparatus for performing such component recognition, an apparatus has been proposed in which a component adsorbed by a nozzle member is imaged by an image pickup means comprising a line sensor or an area sensor, and component recognition is performed based on the image. ing.
For example, when a line sensor is used as an imaging unit, the line sensor is installed on a base of a mounting machine, and the head unit after the component is sucked while passing over the line sensor.
There has been proposed an apparatus that irradiates required light for component recognition to a suction component to capture a component image, and performs component recognition based on the captured image.

[0005]

In the conventional apparatus, there are still points to be improved with respect to irradiation of light necessary for component recognition. Hereinafter, a case where a line sensor is used as the imaging unit will be specifically described.

That is, in the conventional device, the light emitting unit for irradiating the light necessary for component recognition does not obstruct the field of view of the line sensor, and is held at the imaging position of the line sensor, for example, at the side of the line sensor. It is arranged at a relatively distant position with respect to the placed parts. Therefore, in order to secure illuminance suitable for component recognition, it is necessary to increase the luminance of the light emitting unit. Accordingly, the light from the high-brightness light-emitting portion is irradiated over a wide area, and as a result, unnecessary reflection of light and the like are likely to occur, which causes a problem that the recognition accuracy of the component is affected.

Therefore, it is desirable to arrange the light emitting section closer to the component to secure a predetermined illuminance while suppressing the luminance of the light emitting section. Since there is a possibility that the field of view of the sensor may be obstructed, this is naturally limited, and there is no effective solution.

Further, in the conventional apparatus, the line sensor captures the component image in a planar manner, but the component to be recognized is not always planar, so that the accuracy is limited in relation to the irradiated light. There is a possibility that component recognition may not be performed well. That is, for example, when imaging a cylindrical component, the surface of the component is curved, so in the captured component image, the edge is darker than the center of the component, and as a result,
There were cases where the external shape of the component could not be accurately recognized.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problem, and a component recognition apparatus for a mounting machine capable of improving the component recognition accuracy by capturing a component image having a brightness suitable for image recognition. It is intended to provide.

[0010]

In order to solve the above-mentioned problems, the present invention comprises a head unit having a nozzle member for picking up components, and an image pickup means arranged in a moving path of the head unit. In a mounting machine configured to recognize the component adsorbed on the nozzle member by moving the head unit to a predetermined imaging position by an imaging unit, a component image is taken along with the movement of the head unit as the imaging unit. A line sensor that captures one-dimensionally is provided, and a light emitting unit that irradiates light necessary for component recognition to the suction component is provided between the imaging position and the line sensor. It consists of a number of illuminants and a substrate on which the illuminants are mounted, and on this substrate an image capturing slit extending in the arrangement direction of the image sensors of the line sensor. There is formed, together with the luminous body is arranged along the opposite sides of the slit in the arrangement direction of each imaging element of the line sensor is configured to irradiate light in an oblique direction towards the suction part, the The light emitting means
Covers the front side of the light body and corresponds to the slit of the above substrate
A diffusion plate having a slit formed therein.
Has a shape that is inclined with the slit of this diffusion plate as the valley.
To prevent reflection on the surface of the diffusion plate.
The cut processing is performed (claim 1).

Another aspect of the present invention is a nozzle for picking up parts.
Unit having head member and head unit
Imaging means arranged in a moving path of
Move the unit to the predetermined imaging position by the imaging means.
Recognition of the parts sucked by the nozzle member
In the mounting machine configured as described above,
Parts images are one-dimensionally displayed as the head unit moves.
A line sensor for capturing is provided.
Between the sensor and this line sensor.
Light emitting means for irradiating light necessary for product recognition is provided.
The light emitting means includes a large number of light emitting bodies and a base on which the light emitting bodies are mounted.
Board, and this substrate has a line sensor
A slit for image capture extending in the arrangement direction is formed,
On both sides of this slit, each image sensor of the line sensor
The luminous bodies are arranged side by side along the arrangement direction, and
It is configured to irradiate light obliquely toward the
The light emitting means covers the surface of the light emitting body.
Formed a slit corresponding to the slit of the substrate
The prism has a thick prism.
In the direction orthogonal to the longitudinal direction of the slit, the prism
So that it gradually increases outward from both sides of the slit
Component recognition device for mounting machine characterized by being formed
(Claim 2).

According to the above configuration, the illuminance of the entire component can be kept uniform even when the surface of the suction component is inclined or curved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component recognition device according to the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show the structure of a mounting machine on which a component recognition device according to the present invention is mounted. As shown in FIG. 1, a conveyor 2 for transporting a printed board is arranged on a base 1 of a mounting machine, and a printed board 3 is transported on the conveyor 2 and stopped at a predetermined mounting work position. It has become. A component supply unit 4 is arranged on the side of the conveyor 2. The component supply unit 4 includes a component supply feeder, for example, a multi-row tape feeder 4.
a.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located. In this example, the head unit 5 is in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (X-axis on the horizontal plane).
(In a direction perpendicular to the axis).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 rotated and driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit is mounted on the fixed rail 7. A support member 11 is provided, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. The support member 11 has X
An axial guide member 13 and a ball screw shaft 14 driven by an X-axis servomotor 15 are provided, and the head unit 5 is movably held by the guide member 13,
A nut portion (not shown) provided on the head unit 5 is screwed to the ball screw shaft 14. And
By the operation of the Y-axis servo motor 9, the support member 11
The head unit 5 moves in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15 while moving in the axial direction.

The Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detecting devices 10 and 16 each comprising a rotary encoder, and thereby detect the moving position of the head unit 5. It has become.

The head unit 5 is provided with a nozzle member 20 for sucking chip components. As shown in FIG. 2, in this embodiment, eight nozzle members 20 are arranged in the X-axis direction. Each nozzle member 20 moves up and down with respect to the frame of the head unit 5 (movement in the Z-axis direction).
And rotation about the nozzle center axis (R-axis) is enabled, and is operated by a Z-axis servo motor and an R-axis servo motor (not shown). Further, each of these servo motors is provided with a position detecting device to detect the moving position of each nozzle member 20.

Further, a sensor unit 23 for taking in a component image when recognizing a component adsorbed by each nozzle member 20 of the head unit 5 is arranged between the component supply unit 4 and the conveyor 2. Has been established.

The sensor unit 23 includes a sensor main body 25 having a line sensor 24 and an illumination unit 26 (light emitting means) for irradiating light necessary for capturing an image. The line sensor 24 provided in the sensor main body 25 is an image sensor in which CCD solid-state imaging devices 24a are arranged in a direction (Y-axis direction) orthogonal to the arrangement direction of the nozzle members 20, as shown in FIG. ,
By moving the head unit 5 in a direction (sub-scanning direction; X-axis direction) orthogonal to the arrangement direction (main scanning direction; Y-axis direction) of each element 24a, the main scanning direction of the component sucked by the nozzle member 20 is achieved. Are sequentially captured one-dimensionally in the sub-scanning direction. Although not shown, the component image is captured by the line sensor 24 via a lens provided in the sensor main body 25.

As shown in FIG. 4, the illumination unit 26 is disposed below the movement path of the head unit 5 for component recognition and above the sensor main body 25, and is mounted on the substrate 28. LEDs 27 (light emitters)
And a diffusion plate 29 disposed on the surface thereof.

As shown in FIG. 5, a Y portion is provided vertically above the line sensor 24 of the sensor main body 25 and at the center of the substrate 28 in correspondence with the arrangement of the CCD solid-state imaging elements 24a of the line sensor 24. Slit 28 extending in the axial direction
a is formed. On both sides of the slit 28a (on both sides in the X-axis direction), a large number of the LEDs 27 are mounted in a line along the slit 28a. Are provided.

The diffusing plate 29 is composed of an LED 2 having a high directivity.
By appropriately diffusing the irradiation light of No. 7, the unevenness of the illuminance of the illuminated component is suppressed, and is made of, for example, a resin material such as acrylic. In the central portion of the diffusion plate 29, corresponding to the slit 28a of the substrate 28,
A slit 29a having the same shape as or slightly larger than the slit 28a is formed. The surface (upper surface in FIG. 4) of the diffusion plate 29 is subjected to an appropriate unevenness process (matting process), so that reflection of light applied to the surface of the diffusion plate 29 can be suppressed. I have.

Next, the component recognition operation of the mounting machine configured as described above will be described.

When the mounting operation is started in the mounting machine, the head unit 5 is moved to the component supply unit 4, and the components are sucked by the nozzle members 20. When the suction of the component is completed, the head unit 5 is moved with respect to the sensor unit 23 for component recognition. Specifically, after the head unit 5 is set at, for example, the left end of the movement path for the sensor unit 23, the head unit 5 is moved rightward (in the direction of the arrow S in FIGS. 1, 3, 4, and 5) from this position. Can be

When the movement of the head unit 5 for component recognition is started, the light emission of the illumination unit 26 is started at a timing synchronized with the movement. Then, as the head unit 5 moves above the sensor unit 23, the components adsorbed by the nozzle members 20 of the head unit 5 are illuminated by the light of the illumination unit 26, and the component images are sequentially displayed. It will be captured by the line sensor 24 of the sensor body 25. More specifically, when the LED 27 emits light in the illumination unit 26, the light is diffused by the diffusion plate 29 and the nozzle member 2
Irradiation is performed on the front surface (back surface) of the component that has been attracted to zero. When the light is reflected on the surface of the component, the reflected light is transmitted to the diffusion plate 29 and the slits 28a and 28 of the substrate 28.
The light enters the sensor main body 25 through the line 9a, whereby the component image is captured by the line sensor 24.

When the head unit 5 completely passes over the sensor unit 23, the nozzle member 20
The images of all the components that are sucked in are captured by the line sensor 24.

Incidentally, the above-described mounting machine configured as described above has the following advantages.

That is, in the mounting machine described above, in the sensor unit 23, the illumination unit 26 is disposed immediately above the sensor main body 25, and the slits 28 a and 29 a formed in the substrate 28 and the diffusion plate 29 of the illumination unit 26. Since the component image is captured, the component can be illuminated by disposing the illumination unit 26 at a position closer to the component to be imaged without obstructing the field of view of the sensor body 25.

Therefore, it is possible to secure a predetermined component illuminance suitable for component recognition while suppressing the brightness of the LED 27. By irradiating light from a position close to the imaging target component while suppressing the brightness of the LED 27, the range to be illuminated is narrowed, that is, only the component to be recognized is illuminated clearly, and component recognition such as the background of the component is performed. Thus, it is possible to prevent unnecessary portions from being illuminated, and to suppress unnecessary light reflection. In addition, since the sensor body 25 is irradiated with light through the slits 28a and 29a formed in the illumination unit 26, unnecessary light is less likely to be irradiated on the sensor body 25. Therefore, it is possible to increase the component recognition accuracy. Further, since the surface of the diffusion plate 29 is subjected to a matting process to prevent reflection of light,
Unnecessary light due to reflection can be prevented from entering the sensor body 25.

The LED 27 is provided on both sides of the slit 28a.
Are provided in a plurality of rows, respectively, so that even when the surface of the recognition target component is inclined or curved, the illuminance of light incident on the line sensor 24 through the slit 28a can be appropriately secured. That is, if the surface of the component to be recognized is inclined, curved, or the like, the illuminance at the edge of the component or the like tends to decrease, and it is difficult to maintain uniform illuminance of the entire component. However, according to the above example, L
The ED 27 has a certain range in a direction orthogonal to the line sensor 24, and the edge of the component is effectively illuminated, so that the illuminance of the entire component is kept uniform and unevenness in brightness of the component image is suppressed. Therefore, the edge shape of the component can be more accurately recognized, and the component can be accurately recognized.

Further, in the above mounting machine, the lighting unit 2
6 can be arranged directly above the sensor body 25, so that there is no need to provide a space for arranging the illumination unit 26 around the sensor body 25 or the like, thus contributing to space saving of the mounting machine. In addition to this, there is an advantage that the degree of freedom in layout can be increased.

As an embodiment of the component recognition apparatus according to the present invention, a sensor unit using lighting units 30 and 31 as shown in FIGS. 23. Hereinafter, these examples will be briefly described.

The illumination unit 30 shown in FIG. 6 basically has the same configuration as the illumination unit 26 of the above-described example in that it includes the LED 27, the substrate 28, and the diffusion plate 29. However, as shown in the figure, the substrate 28 and the diffusion plate 29 are each inclined with the slits 28a and 29a as valleys, whereby the LED 27 is arranged in a substantially V-shape. 26. If the lighting unit 30 having such a configuration is adopted,
As shown in the figure, when the surface of the component C is curved or the like, the curved portion can be effectively illuminated, so that the illuminance of the entire component can be increased more than the illumination unit 26 of the above embodiment. It can be kept uniform.

The illumination unit 31 shown in FIG. 7 is different from the illumination unit 26 in that a prism 32 is provided instead of the diffusion plate 29. This prism 32
Has a thickness of X from the center as shown in FIG.
The slits 28a of the substrate 28 are formed so as to gradually increase toward the outer side of the axis, and at the center thereof.
Accordingly, a slit 32a for capturing an image having the same shape as the slit 28a or slightly larger than the slit 28a is formed. According to the illumination unit 31 having such a configuration, the light from the LED 27 is refracted by the prism 32, so that when the surface of the component C is curved, the curved portion can be effectively illuminated. . Therefore,
The illumination unit 31 can also maintain uniform illuminance of the entire component.

In each of the above embodiments, an example has been described in which a line sensor is employed as the image pickup means. However, the present invention is also applicable to a case in which an area sensor which captures an image two-dimensionally is employed. is there. In this case, for example, an opening such as a circle corresponding to the field of view of the area sensor may be formed in the substrate and the diffusion plate.

Further, in the above embodiment, regarding the movement of the head unit 5 with respect to the sensor unit 23 for component recognition, the head unit 5 is set at the left end of the movement path and then to the right (FIGS. 1, 3). Although an example in which the head unit 5 is moved in the direction of arrow S in FIGS. 4 and 5), the head unit 5 may be moved to the left after the head unit 5 is set at the right end of the movement path. The movement of the head unit 5 for such component recognition is performed by, for example, moving the head unit 5 in the direction of the arrow S when the last component to be sucked is sucked on the left side of the sensor unit 23 or at a position close thereto. In addition, if the last component to be sucked is sucked to the right of the sensor unit 23 or at a position close thereto, the head unit 5 is moved in the direction opposite to the arrow S to improve efficiency. Good component recognition can be performed.

[0038]

As described above, according to the component recognition apparatus of the present invention, after the component is mounted, the head unit is moved to the predetermined imaging position of the imaging means, so that the image of the component adsorbed on the head unit is obtained. The image is captured by the line sensor through the slit, and component recognition is performed based on the component image. At this time, light is emitted obliquely from the luminous body of the light emitting means toward the adsorption component,
Even if the surface of the suction component is inclined or curved,
The illuminance of the entire part is kept uniform, thereby increasing the recognition accuracy of the part.

[Brief description of the drawings]

FIG. 1 is a plan view of a mounting machine to which an example of a component recognition device according to the present invention is applied.

FIG. 2 is a front view of the same.

FIG. 3 is an enlarged schematic view showing a line sensor of the sensor main body.

FIG. 4 is an enlarged view of FIG. 2 showing a sensor unit.

FIG. 5 is a cross-sectional view taken along the line AA in FIG. 4 showing a substrate and an LED mounted on the substrate.

FIG. 6 is a view corresponding to FIG. 4, showing another example of the lighting unit.

FIG. 7 is a diagram corresponding to FIG. 4, showing another example of the lighting unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 3 Printed circuit board 4 Parts supply part 5 Head unit 9 Y-axis servo motor 15 X-axis servo motor 10, 16 Position detection means 20 Nozzle member 23 Sensor unit 23a Illumination part 24 Line sensor 25 Sensor main body 26 Lighting unit 27 LED 28 substrate 28a, 29a slit 29 diffusion plate

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-8-181496 (JP, A) JP-A-5-41596 (JP, A) JP-A-1-152699 (JP, A) JP-A-2- 280400 (JP, A) JP-A-4-103200 (JP, A) JP-A-2-32005 (JP, U) JP-A-5-4596 (JP, U) JP-A-7-174539 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/30 H05K 13/00-13/08

Claims (2)

(57) [Claims] 1. A head unit having a nozzle member for picking up a component, and an imaging unit arranged in a movement path of the head unit, wherein the head unit is moved to a predetermined imaging position by the imaging unit. In a mounting machine configured to recognize a component adsorbed on a nozzle member, a line sensor for one-dimensionally capturing a component image with the movement of the head unit is provided as the imaging unit, and the imaging position is determined. Light emitting means for irradiating the suction component with light necessary for component recognition is provided between the light emitting device and the line sensor, and the light emitting means includes a large number of light emitting members and a substrate on which the light emitting members are mounted. An image capturing slit extending in the direction of arrangement of the respective image sensors of the line sensor is formed on the substrate, and the slits of the line sensor are provided on both sides of the slit. Together with the luminous body is arranged along the arrangement direction of the imaging device is configured to irradiate light in an oblique direction towards the suction part, the light emitting means, issued
Covers the front side of the light body and corresponds to the slit of the above substrate
A diffusion plate having a slit formed therein.
Has a shape that is inclined with the slit of this diffusion plate as the valley.
To prevent reflection on the surface of the diffusion plate.
A component recognition device for a mounting machine, wherein the component recognition process is performed . 2. A head having a nozzle member for picking up components.
Unit and the head unit
Imaging means, wherein the head unit is an imaging means.
The nozzle unit is moved to a predetermined imaging position by
Mounting configured to recognize components adsorbed on materials
Machine, the head unit as the imaging means
A line sensor that captures part images one-dimensionally as it moves
Provided, and the imaging position and the line sensor
Irradiates light necessary for component recognition to the suction component
A light emitting means for emitting light is provided.
It consists of a light body and a board on which this light body is mounted.
Image extending in the array direction of each image sensor of the line sensor on the plate
A slit for taking in is formed, and on both sides of this slit
The above along the arrangement direction of each image sensor of the line sensor
The luminous bodies are arranged side by side and obliquely facing the suction parts.
The light emitting means is configured to irradiate light in the
Covers the front side of the luminous body and fits in the slit of the substrate.
It has a prism with a corresponding slit,
Rhythm, the thickness of the prism and the longitudinal direction of the slits
In the direction perpendicular to the prism slit,
It is characterized that it is formed so as to gradually increase outward.
Component recognition device for mounting machines.