TW200417742A - Circuit pattern inspection device and circuit pattern inspection method - Google Patents

Circuit pattern inspection device and circuit pattern inspection method Download PDF

Info

Publication number
TW200417742A
TW200417742A TW92133778A TW92133778A TW200417742A TW 200417742 A TW200417742 A TW 200417742A TW 92133778 A TW92133778 A TW 92133778A TW 92133778 A TW92133778 A TW 92133778A TW 200417742 A TW200417742 A TW 200417742A
Authority
TW
Taiwan
Prior art keywords
pattern
inspection
electrode
detection
signal
Prior art date
Application number
TW92133778A
Other languages
Chinese (zh)
Other versions
TWI247904B (en
Inventor
Shuji Yamaoka
Hiroshi Hamori
Shogo Ishioka
Original Assignee
Oht Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002382813 priority Critical
Application filed by Oht Inc filed Critical Oht Inc
Priority to JP2003436043A priority patent/JP3978178B2/en
Publication of TW200417742A publication Critical patent/TW200417742A/en
Application granted granted Critical
Publication of TWI247904B publication Critical patent/TWI247904B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors

Abstract

The object of the present invention is to provide a circuit inspection device capable of surely and easily detecting defects of a circuit board. To achieve the object, when inspecting an inspection target pattern on which at least their ends are arranged in a line, the inspection target pattern 15 is moved so as to cross an inspection signal feed electrode 35 and an inspection signal detection sensor electrode 25 with maintaining both the ends of the inspection target pattern 15 spaced from the pattern with a predetermined distance, the inspection signal fed from the feed electrode 35 to the inspection target pattern 15 by capacity coupling is detected by the sensor electrode similarly capacity-coupled to the inspection target pattern, and when the detection signal value is below a predetermined range, it is determined to be a pattern disconnection and when the detection signal value is above the predetermined range, it is determined to be a pattern short circuit.

Description

200417742 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a circuit pattern inspection device and a circuit pattern inspection method capable of inspecting the quality of a conductive pattern formed on a substrate. [Prior art] in the manufacture of a conductive pattern formed on the circuit board on the substrate, there is formed a conductive pattern on the substrate to check whether there is a short circuit and disconnection necessary. Conventionally, as a method for inspection of the conductive pattern, for example, as shown in Patent Document 1, it is known that the one kind of contact pins at both ends of the conductive pattern, the conductive pattern of the electrical signal is supplied from one end of the pin, and the other end side from the pin receiving the electrical signal to the conductive pattern for testing conduction of the contact type inspection method (pin-contact manner). Electrical power supply system of the metal probe by the stand on the whole terminal, and from there to the conductive pattern is performed by the flow of current. The pin contact manner, since the direct contact with the probe, thus having a S / N ratio of two strengths. However, in recent years, due to the increase in the density of conductive patterns, the pitch of connection wiring has become finer, and a pitch of 50 μm or less has also appeared. Thus, manufacturing cost, and to narrow the pitch of the plurality of probes composed of several probe card. Further, at the same time, it must be applied to the production of each wiring pattern (each inspection object) different new probe card. So check the cost is high and a serious obstacle for low-cost electronic components. In addition, the probe card on the fine structure is very fragile, it is necessary to consider the danger often damaged in the use of the actual. 5312 / present specification (complement member) / 93-02 / 92133778 200 417 742 Thus, as shown in Patent Document 2, it has also been proposed to make the pin end of the probe to the conductor pattern of the object under examination, and check signal is applied comprising alternating, at the other end the probe is not in contact with the conductor positioned in the state of FIG specified interval, the capacitive coupling via the contact detecting the inspection - a non-contact manner and scheme. This contact - and a non-contact manner, since the other pattern lines $ probe without direct contact with the pattern as necessary, it can be given coarse accuracy. More and enables the non-contact portion for a plurality of patterned lines can reduce the number of this common probe. For this purpose, the conductive pattern may also correspond to the fine. (Patent Document 1) Japanese Patent Laid-Open No. 6 2-2 6 9 0 7 5 (Patent Document 2) Japanese Patent Laid-Open No. 1 1-7 2 5 2 4 [Summary of Invention] (Inventive Solution (Problem) However, in the above-mentioned contact-non-contact method, the probes disposed at both ends of $ and the detection signals from the probes are processed according to the arrangement interval of the conductive pattern. one kind of class decision, if the conductive pattern is not the same, there are necessary with the jig. In addition, in the above-mentioned contact-non-contact simultaneous use method, one end of the conductor pattern of the inspection target of the direct-contact sound probe is also miniaturized, and the work for contacting the needle becomes difficult. In addition, it is also unavoidable to use 312 / Invention Specification (Supplement) / 93-02 / 92133778 to directly contact the inspection of components and to separate the probe bits of the signal connection S. The use of space, micro-electric patterns, etc. The risk of damage to the conductor pattern of the inspection object is made by making 3 pre-patterns according to the shape and making the pins probe pins 6 200417742 contact. (Means for Solving the Problems) object of the present invention is to solve the problems of the conventional art, to provide a simple configuration and change the wiring pattern may correspond to the circuit pattern inspection apparatus and inspection method for checking a fine wiring pattern. As a means for achieving the above-mentioned object, for example, an embodiment of the present invention has the following configuration. That end of the AC supply, is formed from the vicinity of both ends of the line inspection object area is a row-like pattern inspection target in the inspection target region of the inspection signal, the detection signal from the other end of the inspection target pattern from the target to check the inspection A patterned circuit pattern inspection device includes: a supply mechanism having a supply electrode for supplying the inspection signal from one end of an inspection object region of the inspection object pattern to the inspection object pattern; and a detection mechanism having a detection electrode for detecting signal from the inspection object pattern; and the moving mechanism, so that the supply side feeding mechanism and the detection electrode of the detection electrode means away from the detection target pattern edge moves across the pattern line ends close to the region to be inspected unit. In addition, for example, the inspection target pattern is a conductive pattern having a substantially rod-like shape formed on a substrate with a predetermined width. In addition, for example, it is characterized in that the width of the detection electrode is at least about two lines of the pattern of the inspection target. Further, for example, wherein: said detecting means includes a first detection electrode system disposed at a position at one end may be by the other end position of the inspection object pattern inspection signal supplied to the electrode is supplied; a second detection circuit 7 312 / Invention specification (Supplement) / 93-02 / 92133778 200417742 The pole is arranged at the other end of the inspection target pattern adjacent to the inspection target pattern which can be supplied with the inspection signal by the supply electrode at one end on. In addition, for example, it is characterized in that the width of the first detection electrode is equal to or less than the pattern width of the inspection target pattern. In addition, for example, it is characterized in that the width of the second detection electrode is equal to or less than the pattern width of the inspection target pattern. Further, e.g., wherein: the moving means so that the supply means based on a detection surface of the electrode surface and the supply electrode of the detecting means, the state of the inspection object pattern capacitive coupling, to move across said area of inspection of two line-shaped portion near the end. Further, for example, characterized by: further comprising determination means, based on in the case of the specified range is determined inspection target pattern is a normal by the detection result of the detecting means, in the case of test results outside the specified range is judged that the inspection object pattern is defective . Further, for example, characterized by: further comprising a second moving mechanism, when the judging means determines the inspection object pattern is defective at both ends, so that the supply means supply electrode for detecting movement of the electrode and the detection means, so that the supply means any of the detecting electrode or the detecting electrodes supplying means moves toward the other along the pattern; and a position detecting means for detecting a change position detection based on the detection result of the detecting means. Further, for example, characterized by: further comprising a contact mechanism Bishi any other of the detection electrode or the electrode detecting means supplying the supply means in contact with the inspection object pattern. 8 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742 In addition, for example, it is characterized by the aforementioned supply electrode and the aforementioned detection mechanism. Or, it is characterized by having the above-mentioned one of the second moving mechanism moving separately from the inspection target pattern, and for example, it is characterized by that at least one of the position control moves the electrode by the moving mechanism and the inspection is set. In addition, for example, it is characterized in that the displacement of the position near the detection electrode or the power supply electrode is controlled perpendicular to the detection electrode or the power supply so that the detection electrode or the power supply is substantially constant. In addition, for example, it is characterized in that the average displacement between the plural numbers of the inspection target pattern is perpendicular to the control as the separation distance of the detection image. Further, for example, is provided near both ends of the supply line is formed for positioning on the supply line by controlling the shape of the subject one end of the specimen inspection signal supplied to the camera control means includes at least one of said second moving means by moving electrode is electrode and the detection electrode becomes substantially constant distance. It includes the separation from the supply electrode separation distance control means for moving and said predetermined pattern is a substantially detected as a control unit includes the above-described process separating movement of the pole or to the detection electrode, based on the detection result of the displacement gauge with electrode direction away from the inspection object to the inspection target locating the separation process control means, based the detection result of the electrode of the displacement gauge between the pitch or the supply electrodes and the inspection direction of the inspection object positioning means, having A supply electrode for the inspection pattern from the inspection object pattern in the inspection object region of the inspection object pattern; and inspection 312 / Invention Specification (Supplement) / 93-02 / 92133778 9 200417742 detection mechanism having a detection electrode for detecting the inspection object from the inspection object. a circuit pattern inspection method of a signal pattern of the pattern inspection apparatus circuit, wherein: sides of the supply electrode the supply means and the detection electrode of the detection means to maintain the detection electrode so that the supply mechanism supplying the electrode surface and the detecting means surface, and the detection target in FIG. Surface separated state, so that the supply-side electrode and the detection electrode and the inspection target pattern, so that movement across the line pattern portion in the vicinity of both ends of the target region of the inspection, the inspection target region from the inspection target pattern One end of the AC signal supplied to the inspection, the detection signal from the inspection object pattern from the other end, in order to check the inspection target pattern. Further, e.g., wherein: said circuit pattern is based at the specified width is formed as a substantially bar-like conductive pattern on the substrate. Further, for example, wherein: a width of the detection electrode is at least 2 rows degree inspection object pattern width; a detection signal from the adjacent conductive pattern supplied check signal conductive pattern, can detect a short between adjacent conductive pattern . Further, e.g., wherein: the first detection electrode detecting means detects the signal from the detection pattern from the conductive electrode inspection signal is supplied, the disconnection between the conductive patterns can be detected; the detection by said second detection means the detection signal from the electrode and the conductive pattern adjacent to the conductive pattern inspection signal supplied to the detection electrode can detect a short circuit between the adjacent conductive patterns. Further, e.g., wherein: the detection means to be from a non-detection position detecting means to detect the position of disconnected portion substantially conductive pattern. 10 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742 In addition, for example, it is further characterized in that when the result of the above-mentioned detection mechanism is within a specified range, it is determined that the inspection target pattern is that the result of the inspection is outside the specified range. FIG inspection object is determined good. Further, e.g., wherein: the determination of both end portions of the recognized target pattern is not checked, so that the supply means supply electrode detecting means detects electrode to move and hold the identification unit is determined to be defective in the inspection target pattern position , so that the supply or upper electrode of any one moves toward the other along the pattern, based on the detection result of the detection, the change in position of the inspection target as a defective pattern further, e.g., wherein: the supply means so that supply the detection electrode according to any one of the other detection means and the inspection target contact. In addition, for example, it is characterized in that the imaging mechanism provided in either of the supply electrode or the measurement electrode is moved toward the other along the pattern in a defective state of the defective position of the inspection target pattern. Further, for example, wherein: in the detecting electrode or the vicinity of the pole position is disposed together with the detection electrode or the supply electrode displacement gauge, and based on the detection result of the displacement gauge to the specimen or supply electrode and the object under examination the result is substantially constant separation distance perpendicular to the direction of the positioning control is performed so that the inspection object of a very constant. Another Bu Xi, e.g., wherein: the average displacement of the test results of the displacement gauge distance between the inspection target pattern, as 312 / present specification (complement element) is often detected / 93-02 / 92,133,778 of , while the case of failure of the subject and detecting said configuration determines the position of the measuring means. An electrode pattern connected to the specimen or, photography sensing electrode system is electrically fed moved between a plurality of said detection circuit detects a separation distance 11200417742 electrode or the electrode and supplying the inspection object, to control the positioning of said object under examination. (Effect of the Invention) As explained above, according to the present invention, the failure detection can be reliably inspection object pattern. And further, a pattern can be easily recognized adverse conditions, particularly the failure to make a certain portion of the bit. And more, even with surface irregularities on the inspection object, still it does not hurt the pattern, and the pattern inspection can be performed really. DESCRIPTION OF EMBODIMENTS Hereinafter, with reference to the drawings in detail, one embodiment of the invention, embodiments of the present invention will be described. Of the following description, the system should be checked to check as to form a pattern of the liquid crystal display panel of the dot matrix display nondefective dot matrix pattern before the adhesive panel circuit pattern inspection apparatus described as an example. However, the present invention is not limited to the examples described below, as long as at least the line shape is formed into a pattern in the vicinity of both ends of the inspection target region of the inspection object, then without any limitation. (Example of Embodiment 1 of the invention) FIG. 1 is a diagram illustrating the principle of inspection of a pattern showing an embodiment used in one embodiment of the present invention invention. 1, reference numerals 10 of the present embodiment is provided with the substrate forms should check the conductive pattern embodiment, the present embodiment example, a glass substrate, a liquid crystal display panel. The surface of the glass substrate 10 to constant intervals in row shape provided with a shaped 12312 / Manual (complement member) invention / 93-02 / 92133778 200 417 742 made of a circuit according to the present embodiment example of embodiment of a pattern inspection apparatus examined dot matrix display panel 15 with the conductive pattern. In FIG 1 FIG nonconductive case 'widths of the pattern 15 is substantially the same, each pattern interval is substantially equal intervals. However, the present embodiment example, even if the patterns are not spaced at equal intervals can also be checked. Component symbol 20 is a sensor; component symbol 30 is an inspection signal supply unit; component symbol 50 is an analog signal processing circuit that processes a detection signal from the sensor 20 and outputs it to the control unit 60; component symbol 6 0 is a control unit that manages the overall control of the inspection device of this embodiment; element symbol 70 is a robot controller that controls a scalar robot 80; element symbol 80 is a liquid crystal panel 10 positioned at the inspection position and held, all simultaneously, according to the control of the robot controller 70 to sequentially supply electrode 30 and sense electrode inspection signal supplied to the sensor unit 20 across the liquid crystal panel 10 of the inspection target conductive pattern connecting terminals scanning scalar robot. Embodiment of the present embodiment, the scalar robot 80 to the inspection target based substrate (liquid crystal panel) 10 is positioned in a specified inspection position, and can be configured to three-dimensional positioning. Similarly, the sensor 20, the inspection signal supply unit 30, and the surface of the inspection target substrate 10 are moved on the inspection target pattern while maintaining a predetermined distance, so as to be configured for three-dimensional positioning control. Further, in the above description, the scalar robot 80 to the sensor 20, inspection signal supply section 30 while moving distance specified example of a pattern in the test object holding surface of the inspection target board and the edge 10 . However, the present embodiment is not limited to the above example of embodiment, may be controlled inspection signal supply section 30 is fixed, the inspection target board 10 and the sensor 20, check 13312 / Manual (complement member) invention / 93-02 / 92133778 200417742 The way in which the front-end electrodes 25 and 35 of the signal supply unit 30 move on the substrate while maintaining the specified distance. So as to control exactly the same effect can be obtained. Further, in actual the inspection control in each pattern interval is not like the case of intervals and different pattern pitch double-ended case, there sense electrodes moving distance supply electrode 25 moving distance 35 in synchronization with each other by way of another end position, at least a supply electrode 35 to become a pattern inspection signal actually supplied to the control portion of the sensing electrode 25 is necessary. If so, then control like, for example, even if the interval of each pattern intervals, the pitch of the pattern portions of different double-ended, two electrodes is still only controls the moving speed corresponds to the scalar robot. A sensor electrode 25 and a supply electrode 35 are provided on at least the front end surface of the sensor 20 and the inspection signal supply unit 30 in this embodiment. The sensing electrode 25 and the supply electrode 35 are formed of a metal such as copper (Cu) or gold (Au). Also, to protect the respective electrodes, an insulating material may also be coated. Further, for example, although the semiconductor may be used as an electrode, but this is because of the formation of a metal electrode 'may be increased because of the capacitance between the conductive pattern. Check signal supply section 30, by the Department of the scalar robot 80 moves like a panel terminal portion 10 of the inspection object pattern and the like, and the capacitive coupling via the check signal sequentially supplied to each of the wiring pattern across the liquid crystal display are supplied to the electrode width of the distal end portion 35 is, for example, preferably (pattern width and the pattern size of the gap below the inspection pattern) the pattern pitch of the inspection object pattern. This is because if the width of the supply electrode 35 is larger than that of the inspection target pattern in Figure 14 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742, the sensor electrode 2 5 of the sensor 20 will have a larger pitch. detection check signal, detects a signal from the inspection because of the inspection object pattern other than the inspection object pattern. However, do not have to supply electrode 35 is defined as the width of the pattern pitch of the inspection object pattern, if the pattern as long as the inspection object hold a plurality of adjacent patterns of the pattern, can be described in detail in the subsequent embodiment of the present embodiment the inspection method for inspection. Sensor 20, and based on each of the inspection object by the pattern to be mediated by a scalar robot 80 moves the display panel like a terminal portion 10 or the like to the inspection object pattern across the liquid crystal, by the capacitive coupling sequence by the width of the sensing electrodes detecting the front end portion of the check signal to check the signal supply unit supplying 3,025, preferably at 35, for example, relatively wide supply electrode pattern width of the inspection target 1 or more spacing. The detection signal from the sensor 20 is sent to the analog signal processing circuit 50 to perform analog signal processing. The analog signal processed by the analog signal processing circuit 50 is sent to the control unit 60 to determine whether the inspection object pattern contacted by the inspection signal supply unit 30 of the liquid crystal display panel 10 is good or not. Further, the control unit 60 also checks a control signal supplied to the inspection unit 30 of the signal supply. Analog signal processing circuit 50 has an amplification signal from the sensor 20 detects an amplifier 51; removing the noise component amplified by an amplifier 51 to a detection signal of the detection signal through a bandpass filter with a 52; Rectifier circuit 5 3 for full-wave rectification of the signal from the band-pass filter 5 2; and smoothing circuit for smoothing the detection signal for full-wave rectification by the rectifier circuit 5 3 15 312 / Invention Specification (Supplement) / 93-02 / 9,213,377,820,041,774,254. It is not necessary to include a rectifier circuit 5 3 for performing full-wave rectification and a smoothing circuit 54 for smoothing the detection signal. The control unit 60 based management according to the present embodiment all of the control mode embodiment of the inspection device, includes a computer (CPU) 61; Memory CPU control sequence such as 61 of the R 0 Μ 6 2; temporarily stores the CPU 61 via the Information and Detection signal, etc. RA Μ 6 3; analog signal from the analog signal processing circuit 50 for converting the digital signal corresponding to the a / D converter 64; should the inspection signal is supplied inspection signal supplying section 30 of the signal supply section 6 5; and a display section 6 6 that displays inspection results and operation instruction guidance. 65, for example, as the inspection signal supplied to the AC signal generating unit 2 0 0 Κ Η z, 2 0 0 V sine wave signal is supplied inspection signal supplying section 30. In this case, the bandpass filter 52 so that as the system 200 of the bandpass filter check signal by Κ Η ζ. The inspection signal does not have to be a sine wave signal. Of course, as long as it is an AC signal, it may be a rectangular wave or a pulse wave. Hereinafter, with reference to a flowchart of FIG. 2 includes the above described control inspection of the conductive pattern constituting the embodiment of the present embodiment aspect. Fig. 2 is a flowchart for explaining inspection control of the inspection apparatus according to the embodiment of the present invention. When performed by the inspection apparatus according to the present embodiment checks embodiment, the glass substrate conductive pattern inspection target, is transported to the circuit pattern inspection device location (work position) showing an embodiment of the present embodiment in the conveyance path (not shown). For this, first at step S1, the liquid crystal panel as the inspection target 10 is set in the inspection apparatus. This may be by a transfer robot (not shown) will be automatically conveyed to the inspection target board is set to the inspection apparatus, or set directly by an operator. The control unit 60 is activated when an inspection object is set in the inspection device. Machine 16 312 / Invention Manual (Supplement) / 93-02 / 92133778 200417742 Robot controller 70 controls the scalar robot 80 and positions the inspection object. to check the position. Next, in step S3, the supply electrode 3 5 of the inspection signal supply unit 30 is positioned at the initial position on the one end side of the inspection object pattern 15 of the inspection object (liquid crystal panel) 10 (the end portion separated from the designated distance). the inspection target pattern position), while the sensor 20 of the sensing electrode 25 positioned in the inspection target transfer position of the other end portion of the initial pattern side 15 (the distance away from the wiring pattern of the outermost end position specifying portion) . In this embodiment, the pitch (distance between the pattern to be inspected and the electrode) is maintained in a range from 1 0 0 // m to 2 0 0, for example. However, the distance is not limited to the above examples, the present embodiment form of embodiment, the pitch-based sized inspection target pattern to be determined, the pitch increases if the size of the pattern is increased, and in the case of the small size of the pattern pitch is also narrows. Another Bu Xi, the pattern size is very small, the electrode surface is formed by an insulating cover material, and in no direct contact with the electrode pattern is formed, via an insulating material 20 or sensor inspection signal is supplied close contact portion 30 directly on the substrate, at a pitch substantially the thickness of the insulating material way be controlled, can be easily and accurately the distance between the inspection object and the electrode pattern remains constant distance check. Accordingly, even in a very fine pattern, a simple structure can still be easily and accurately obtained inspection result. Next, in step S5, an instruction is given to the signal supply unit 65 to start supplying the inspection signal to the supply electrode 35 of the inspection signal supply unit 30. Next, the process proceeds to step S7, and the distance between the pattern and the electrode is maintained at 17 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742 so that each of the sensor 20 and the inspection signal supply unit 30 electrode 5 2 5,3 synchronous manner across the inspection target pattern, and to separate from the pattern surface of the inspection target is kept constant while controlling the start mode of the control side movement. Whereby, after it, the sensing electrode 25 and the capacitive coupling system is supplied by the electrodes 35 from the apparatus to detect the inspection signal is supplied a signal potential with a inspection object pattern. That is, in the case of the pattern located at the position of the supply inspection signal supplied to the electrode 35, the sensing electrodes at least a portion supplying the other end position of the inspection target pattern 25 of the check signal, which is supplied to control electrode etc. 35 during a movement distance of the inspection object pattern end portion, the other end of the sensing electrode portion 25 also moves one pitch amount of the inspection object pattern state. For this reason, in step S10, the analog signal processing circuit 50 is activated to process the detection signal from the sensing electrode 25 and output the control to the control unit 60. In the signal processing circuit 50, as described above, the amplifier 51 amplifies the detection signal from the sensing electrode 25 of the sensor 20 to a necessary level, and transmits the detection signal amplified by the amplifier 51 to the inspection. band pass filter the signal frequency by 52 to remove the noise component, and thereafter, a signal of the band-pass filter 52 for future rectifying circuit 53 full-wave rectifier, 54 will be full by the smoothing circuit wave rectified signal is detected as a smoothing process and transmitted to the control unit 60 of the a / D converter 64. C P U 6 1-based starting A / D converter 64 and the analog input signal is converted to digital signal corresponding to the digital value is read as the check signal by the sensing electrodes 25 of the detection. 18312 / present specification (complement member) / 93-02 / 92133778 200417742 C P U 6 1 based on the subsequent step S 1 2, transmits a detection signal to the read R A Μ 6 3. Detecting the transmitted signal to the R A Μ 6 3 sequentially stored. In addition, the detection of the read signal comprising a detection signal from the inspection object pattern is normal, the detection signal from the inspection object pattern is broken, the detection signal from the detection of all the inspection target pattern adjacent short inspection target pattern signal. In step S1, it is judged whether the inspection of the inspection target pattern is completed, for example, it is judged whether the sensing electrode 25 has moved to a position exceeding the last pattern of the inspection target pattern (to investigate whether the inspection of the inspection target pattern is finished). In the case of inspection only to the middle of the wiring pattern, the process proceeds to step S 1 6, continued scanning electrodes, the inspection signal is supplied to the next pattern. Then, processing returns to step S 1 0, continue reading process. On the other hand, in step S14, when the inspection of all the inspection target patterns is completed, the process proceeds to step S20, and an instruction is given to the signal supply unit 65 to stop the supply of the inspection signal, and at the same time, cause the signal to be stopped. The processing circuit 50 and the operation of the A / D converter 64 are stopped. Then, finally, in step S2, the inspection object is moved away from the inspection position, positioned and transported to the next transport position to perform necessary post-processing. With the control as described above, inspection of a pattern such as that the sensing electrode 25 and the supply electrode 35 do not contact the inspection target pattern at all is performed. For this reason, even in a small strength of the substrate inspection target pattern, the problem can still be checked inspection target pattern will not hurt the like. Therefore, even if it is used for a small mobile phone whose pattern strength cannot be sufficiently obtained, 19 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742, a liquid crystal display panel glass substrate for a liquid crystal display panel, the wiring pattern is not damaged. and indeed check. In addition, in the inspection control of the conductive pattern of this embodiment, the sensing electrode 25 and the supply electrode 35 are moved while crossing the detection target pattern, and the inspection target pattern is continuously supplied from the supply electrode 35. sine wave input signals, the sensing electrodes 25 by detection signal level from the inspection object pattern, thus, the potential of the detection signal by the sensing electrode 25 obtained, as is to some extent continuous constant detection signal value is detected. Case the inspection object pattern is defective Thus, the complex pattern is provided in the inspection target in the inspection target pattern, having an open (disconnection inspection target pattern) or short (of the inspection object pattern and the adjacent short circuit inspection target pattern) 'in some degree of continuous inspection target range of normal open or short circuit pattern is not detected continuously a certain detection signal value, and the failure may be generated between the numerical value of a detection failure signal pattern inspection target position has an open or short circuit detected difference. So as, to some extent some of the successive detection signal value, the signal value detected by the failure to open or short circuit is reflected as a difference value, i.e. change value, thus, for example, the detection result by the signal detection system 3 and subsequent to the graph shown in detailed in FIG. 4, can be easily determined for a particular failure inspection target board is defective and the position of the inspection object pattern having open or short circuit. And further, when the inspection process by the edge of the inspection target board inspection apparatus in order to exchange each side changes, the sensing electrodes 25 and 20 of the inspection target pattern

312 / present specification (complement member) change / 93-02 / 92133778 200417742 pitch or change the supply electrode 3 and the target pitch pattern of the inspection, some degree of continuous detection signal constant value, during the exchange of the substrate to be inspected as an absolute value becomes different values. However, poor judgment on the inspection target board is checked under this form of embodiment of the conductive pattern and the specific embodiment of a control failure of the inspection object pattern having an open position or a short circuit may be utilized to some extent in certain continuous detection signal values occurring Numerical values having a failure detection signal to open or short circuit of the difference, i.e. the change in the relative value of the detection signal. Thus, for the failure threshold value and determines a specific location is poor, the relative value can be used for failure detection signal values of the ratio of continuous detection failure detection signal value or the signal value change for successive signal values of detection of the proportion of for the substrate edge, to some extent without using a certain value is continuously detected as an absolute value signal, checking means checks the inspection object side sequentially switched, still poor indeed specific for position determination and failure. In addition, the inspection control of the conductive pattern in this embodiment is not limited to the above example, and it may be set to investigate whether the detection signal read in step S 1 2 is between step S 1 2 and step S 1 4. the above-described range of relative threshold value, if the result of the check process proceeds to step S 1 4 is within a threshold range, if not within a threshold range, it is determined that the inspection signal supplied to the inspection object pattern having open or poor short inspection target pattern 'and the memory location and status of the inspection target pattern step. Fig. 3 and Fig. 4 show the inspection signal detection results of the sensing electrodes 25 controlled as described above. 21312 FIG. 3 is a check signal as a break (open) portion of the inspection object 3 pattern inspection apparatus according to a embodiment of the present embodiment of the embodiment detect / description of the invention (up member) / 93-02 / 92133778 200 417 742 FIG. FIG 4 is a graph showing the case where a short-circuit inspection signal inspection object pattern shape of this embodiment detecting of an embodiment. Is normal, the signal supplied by the supplying portion to the inspection object pattern inspection signal (AC signal) electrode 35, and is supplied to the pattern to be inspected electrically, and reaches the lower portion of the sensed via the inspection object by the pattern by a capacitive coupling with the sensing electrode 25 being sensed by the detector 1, the output control section 60. In this way, the supply electrode 35 and the sensing electrode 25 are supplied with a detection signal (AC signal) while crossing the inspection case, so the detection signal is continuously detected as a certain detection signal value. In the examination object at least part of the pattern is broken, feeding inspection signals supplied (AC power) part of the electrode 35 by the supply unit 65, the inspection target portion due to breakage of the pattern and does not reach the sensing power side, therefore, detection signal value becomes smaller. Thus, as shown in FIG 3 the detection signal value at the inspection object pattern, the value becomes smaller than a certain continuous from the normal pattern of the object detected. On the other hand, in the case of the inspection object pattern adjacent to the inspection object graph, by a signal 65 supplied to the supply portion supplying the subject (AC power) to the electrodes 35, by short-circuiting the adjacent portion of the inspection object pattern is adjacent to the movable the inspection object pattern, thus, the detection signal from the superimposed signal of the sensing electrodes 25 and adjacent to the inspection target pattern, so that the number becomes larger. Therefore, as shown in FIG. 4, the signal value of the short-circuited inspection target pattern becomes larger than a certain value detected from the normal inspection target pattern. 312 / Explanation of the invention (Supplement) / 93-02 / 92133778 65 positions and capacity couplings for poles 2 5 I: poles 25 The object drawing number is used as the signal for at least pole 2 5 disconnection of the signal to check the short circuit check signal, The continuous detection of the current detection signal 22 200417742 As described above, the disconnection and disconnection of the detection target pattern can be detected by one sensing electrode 25 because the width of the sensing electrode 25 is set to be larger than the supply electrode. a width of more than 35 of the inspection target pattern width of at least one pitch width sake. However, it is not necessary to set the width of the sensing electrode 25 to be more than one pitch wider than the width of the supply electrode 35, and it is also possible to perform an inspection of a broken inspection pattern and an adjacent inspection object. check pattern inspection object pattern short, for example, can be configured to follow the detailed embodiment of the second embodiment of the configuration. In this case, some degree of continuous certain value as a detection signal an absolute value of the case when the threshold value is set within a certain range, smaller than the threshold value of the detection signal can be determined that the inspection target pattern disconnection, the threshold value is larger than in the case where the detection signal value can be determined as the end of passage of the inspection object pattern. For example, in FIG. 4, a certain degree relative to a certain detection signal is continuous 0. 6 0 V pp, 0. 0 2 V pp If the threshold is, it is determined in becomes 0. 5 8 V pp less The inspection target pattern at the position where the sensor's moving distance is approximately 2 mm, 42 mm, and 78 mm is broken. Further, in the threshold for judgment and poor poor location specific use, using the failure detection signal values of the detection signals of the successive values of the ratio and the failure detection signal value proportional to the relative value of successive signal values of detection of the change, e.g. in the case of a continuous detection signal is lower than the value of 3% or less, can be determined disconnection inspection target pattern, but increased to 3% or more in the continuous detection of the short-circuit signal values can be determined with the inspection object pattern. As such, in this embodiment example, the judgment of the good or bad of the pattern can be made using the absolute value as a threshold value 23 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742, and of course, the bad pattern can also be measured. ratio of change in threshold value corresponding to the signal values of the detection signal of the normal pattern of their utilization, and therefore, even if the inspection subject image switching apparatus side substrate side sequentially checked, still set the appropriate value based on the detection result, even in each examination detection signal when there is an error value, i.e., the detection signal is low additional value, these effects can be completely prevented, correct inspection result available. As such, since the sensor and the inspection signal is supplied both are non-contact portion, so even a slight change check mode detection signal value, by the inspection apparatus according to the present embodiment example, identifying the difference still does, and indeed it may be status check pattern. Thus, compared with the conventional method of detecting the absolute value of the signal value as a threshold value to determine it can be very accurately and easily detect whether the pattern is outside good, because a non-contact, there is no need to correct the positioning accuracy, i.e., the inspection object pattern very fine pitch substrate, the line can still be accurately checked. (Example of Embodiment of the Second Invention) In the above description, an example of the position of the other end portion of the figure when controlling at least a part of the sensing electrode 25 to be the supply electrode 35 to actually supply the inspection signal has been described. However, the present invention is not limited to the above example of embodiment, one of the sense electrode 25 may be 25, for setting a plurality of sensing electrodes disposed a plurality of lines arranged in another pattern when the actual supply 35 checks supply electrode The position of one end, at least one of the plurality of sensing electrodes 25, is provided when the supply electrode 3 5 actually supplies the inspection signal. The inspection of 312 / Invention Specification (Supplement) / 93-02 / 92133778 is used as a temporary inspection. It is easy to use if it is right. It is also the structure of the other end of the adjacent pattern of the electric signal in Figure 24 200417742. Hereinafter, with reference to FIG. 5 illustrates a second embodiment of the morphological embodiment of the present invention thus configured like. Fig. 5 is an explanatory diagram for explaining the configuration of an inspection apparatus according to a second embodiment of the present invention. In Fig. 5, the same constituent elements as those shown in Fig. 1 of the first embodiment are given the same reference numerals, and detailed descriptions are omitted. In FIG. 5, a first sensing electrode 22 and a second sensing electrode 24 are provided on at least the front end surface of the sensor section 20. The first sensing electrode 22 and the second sensing electrode 24 are separately arranged only by the pattern pitch of the inspection target pattern, and the first sensing electrode 2 2 is provided when the inspection signal is actually supplied by the supply electrode 35. The position of the other end of the pattern to be inspected is set, and the second sensing electrode 24 is provided in a cut-off state at the position of the other end of the pattern to be inspected which is adjacent to the pattern to be inspected when the supply electrode 35 actually supplies the inspection signal. The widths of the first and second sensing electrodes 22 and 24 are preferably equal to or less than the pattern width of the inspection target pattern. This is to perform disconnection inspection of the pattern to be inspected by the first sensing electrode 2 2, and to perform short-circuit inspection of the pattern to be inspected and the adjacent pattern of the inspection pattern by the second sensing electrode 24 to achieve a very short high-precision inspection. Specifically, if the width of the first sensing electrode 22 is less than the pattern width of the inspection target pattern, even if the inspection target pattern is disconnected and the inspection target pattern and the adjacent inspection target pattern are short-circuited, the first 1 Sensing electrode 2 2 It is still extremely difficult to receive a detection signal from an adjacent inspection target pattern that flows into the adjacent inspection target pattern from the inspection target pattern through the short-circuit portion. Impact. In addition, if the width of the second sensing electrode 24 is less than the pattern width of the inspection target pattern, even if the inspection target pattern is not disconnected or short-circuited, or if the inspection target pattern is not disconnected, the acceptance In a case where the inspection target pattern and the adjacent inspection target pattern are short-circuited, the second sensing electrode 24 is still extremely difficult to be affected by the inspection signal from the inspection target pattern. Such as the presence or absence of any, by checking sensing electrode 22 of the first sensing and the second sensing electrode 24 disconnection, short circuit, regardless of whether or receiving short inspection target pattern and disconnection of the adjacent inspection target pattern presence, can achieve very high accuracy inspection. However, it may not be necessary to sense the first sensing electrode 22 second sensing electrode 24 is set to the width of the pattern width in the case of the inspection object pattern below, with the sensing electrode of the first embodiment example 15 i.e. at a glance. Further, as described in detail a second embodiment of the embodiment of illustration, the description of the sensing electrodes are turned off for the second sensing electrode 24, however, using on the opposite side adjacent to the inspected target pattern adjacent to the inspection object pattern check the detection signal provided from the second abutment adjacent to the inspection object pattern sensing the third sensing electrode adjacent to the short-circuit inspection simultaneously to two adjacent pattern inspection target object is inspected two adjacent pattern. Another Bu Xi, of course, the sensing electrodes provided on the sensor 20, the sensing only a first sensing electrode 22 or only the second sensing electrode 24, still no problem, or, three or more is cut off the sensing electrode can. (Embodiment example of the third invention) In the above description, it has been described that the sensing electrode 2 is formed in a manner that crosses the end of the pattern of the inspection target. 26 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742 and a supply electrode 35 moves, to detect the failure pattern examples. However, the present invention is not limited to the above example, for example, may be moved along the inspection object pattern's sense of control constitutes a sensing electrode 25 or 35 is supplied to the electrodes, in particular the failure to the control pattern, the pattern position on failure Position the two electrodes, move one electrode on the pattern along the defective pattern, read in the detection signal value of the sensing electrode 25, detect the change position of the detection signal value, and specify it as a pattern defect generation unit. Hereinafter, an example of a third embodiment of the present invention having such a configuration will be described with reference to FIGS. 6 to 10. FIG 6 is a block diagram of the present invention, inspection apparatus according to a embodiment of the third embodiment, FIG. 7 is an explanatory view of an electrode mobile inspection apparatus according to a embodiment of the present invention, a third embodiment of control of illustration, Figure 8 is a third embodiment the pattern flowchart showing an embodiment of controlling undesirable site specific, FIG. 9 is a third embodiment of the blame shape consistent application of FIG failure in the detection signal waveform pattern of the sensing electrodes 25, and FIG 10 is a diagram of a pattern of adverse feeling An example of a detection signal waveform of the measurement electrode 25. In Fig. 6, the same constituent elements as those shown in Fig. 1 of the first embodiment are given the same reference numerals, and detailed description is omitted. 6, the detecting section 20 is attached to the camera 26. The camera 2 6 is connected to a display unit 66 such as the control unit 60 in order to display a captured image, and is used to observe a defect occurrence state of a pattern defect occurrence portion. The inspection signal supply unit 30 is provided with a probe contact mechanism 32 to which an inspection signal supply probe for supplying an inspection signal is mounted. The probe means 32 into contact with the inspection signal supply lines for the probe produced indeed be defective portion of a specific pattern. 27312 / present specification (complement member) / 93-02 / 92133778 200 417 742 In the third form of embodiment, the scalar robot system configured to not only the direction of arrow in FIG. 1, further movement control along a longitudinal direction of the pattern of FIG. 1 may be electrode. First, the first embodiment of FIG. 1 showing an embodiment of the inspection control shown in FIG. 2, to check whether the inspection target pattern adversely. Results on the inspection of, for example, the inspection object pattern is a broken pattern, the pattern position of the inspection object, for example, held in the RAM63 and the like. When so detected as a defective pattern, and the defective position of a specific pattern, the process proceeds to a particular defective site. Poor morphology of the portion of the third embodiment of a particular embodiment of the process, ① 7 shown in the FIG., That the first power supply electrode 35 and sense electrodes 25 synchronized to move at the pattern position is determined to be bad. Next, ② 7 of As shown, the sensing electrodes 25 from the end of the pattern portion to the other end portion sequentially read while moving the check signal, the read signal obtained by the rapidly changing the position (or the detection signal is not detected in low level change of position), and the position of the specific position of a pattern failure. Hereinafter, with reference to the flow of FIG. 8 will be described in detail. In the third embodiment, the processing of step S14 in the first embodiment is continued, the detection signal stored in the RA M 63 is confirmed, and a defective pattern is detected, and if no defective pattern is detected, then the processing proceeds to the step S 2 0. On the other hand, when a defective pattern is detected in the inspection result, the signal supply unit 65 is weakened, and at the same time, the electrode is positioned at the initial position and shifted to the processing shown in Fig. 8 as in step S3. Then, after the processing shown in FIG. 8 as long as the processing proceeds to step S 20 to the. In the third form of embodiment, the initial step 8 S 3 shown in FIG. 1, the failure detection processing in FIG. 16 is a specific S 2 by the steps illustrated in FIG. 1 to step S 28312 / present specification (up member ) / 93-02 / 92,133,778 200,417,742 case position. For example, FIG. 9 shows a case where the detection signal waveform pattern of a portion of a disconnection. In the example shown in FIG. 9, the signal before the analog signal processing circuit 50 is. In the illustrated circle portion, a pattern is detected opening (in the case of a broken pattern 2) of a signal waveform. Next, in step S 3 3, starting the robot controller 70, to control the scalar robot 80, while sense electrodes 25 and the feeding electrode 35 is moved to the side of bad synchronization pattern position. In this case, for the detection of high sense, so that the center in the width direction of the sensing electrode 25 and the power supply to the electrode 35 to the pattern of adverse widthwise substantially central position of the inspection object inspection position is positioned in a manner to position (FIG. 7 ① of control). Next, the process proceeds to step S35, the signal supply unit 65 is activated, an inspection signal is applied to the supply electrode 35, and the inspection signal is supplied to the defective pattern. Then, the robot controller 70 is started, and the sensing electrode 25 is moved in the direction of the power supply electrode 35 along the pattern (control in ② of Fig. 7). Meanwhile, as shown in step S40, reads the detection signal from the sensing electrode 25. It is then checked in step S 4 2 whether the detection signal value from the sensing electrode 25 has a large change. In the absence of a large change, the process returns step S37, the continuing sense movement of electrode 25. On the other hand, if there is a large change in the value of the detection signal from the sensing electrode 25 in step S 4 2, the process proceeds to step S 4 4 to determine the starting point of the large change in the detection signal from the sensing electrode 25. start position change disappears and the large position, and an intermediate position to a specific position of these defective portions pattern. Examples of the detection signal waveform display 25 of the sensing electrode 10 in FIG. As shown in FIG. 10, the inspection letter 29 312 / Invention specification (supplement) / 93-02 / 92133778 200417742 provided by the supply electrode 3 5 up to the disconnection portion does not reach the sensing electrode 2 5 until the disconnection portion, and the detection signal is provided. value is low, but when more than the disconnection point, as has been supplied reaches the check signal, the detection signal value also rises. For example, since the middle position between the start position where the detection signal from the sensing electrode 25 changes and the position where the large change disappears is specified as the defective pattern portion, the approximately middle position of the inclined portion may be specified as defective portions pattern. In the above description, the sensing electrode 25 is moved in the direction of the supply electrode, but it is not necessarily the sensing electrode 25, and the supply electrode 35 may be moved in the direction of the sensing electrode 25. According to as aspect of the third embodiment described above, the can with the above-described first embodiment embodiment the same high precision pattern in a non-contact manner nondefective examination, while use in X - 2 direction Y movement control sense electrodes, not only only remain in the pattern inspection, if the negative, also certain specific failure part. Thus, for example, also needed to repair defective parts in a short time. In addition, in the repair of the above-mentioned defective parts, in order to determine whether or not the repair is possible, it is best to observe the state of occurrence of the defects in the pattern defective generating part. For example, if the site knows a pattern of adhesion failure is generated only dust and the like, it may be determined as the repair site, the other Bu Xi, it is defective if it is determined that a fatal uncorrectable. In order to observe the state of occurrence of a defect in the pattern defect occurrence portion, a camera 26 mounted on the detection portion 20 is used. Since the camera 26 is mounted on the detection unit 20, the shooting of the camera 26 is started in step S35, the shooting is continued during the steps S40 and S42, and the shooting is continued until the pattern defective part in step S 4 2 is specified. . The image of the pattern defect occurrence part photographed in this way is displayed in the subsequent row of photography and after the pattern defect occurrence part is specified. 30 312 / Invention Manual (Supplement) / 93-02 / 92133778 200417742 is shown on the display section 6 6, a failure to observe the state of occurrence of failure pattern generating portion. Further, the state of the defective portion of the pattern, based from an empty state to a disconnection or short circuit of the disconnection and part of the adhesion properties of dust and the like due to the partial short circuit state, and a variety of states. In this state of partial disconnection and partial short circuit, during the non-contact inspection of both the sensing electrode 25 and the supply electrode 35, is it possible to obtain the detection signal waveform shown in FIG. 10? In such a case, if the probe contact mechanism 32 is actuated, the inspection signal supply probe is brought into contact with one end of the defective pattern, and then the sensing electrode 25 is moved on the pattern along the defective pattern to confirm the specific pattern defect. produced parts. Alternatively, instead of the sensing electrode 25 at the other end portion of the defective pattern, a contact-type sensing probe may be used to make the sensing probe contact the other end portion and move the non-contact supply electrode 35 to sensing probe direction of the other end portion of the defective pattern. Described above (embodiment of the fourth aspect of the invention example), described by scalar robot 80 but mainly in X - Y directions to move the example two-dimensional sensing electrodes 25 control supply electrode 35 and the control. This reason is because the liquid crystal panel as the inspection target board, and the smoothness of the glass substrate south. When the substrate rather large and can not ignore the surface irregularities of the influence of the inspection pattern is thicker, or inspection of the substrate, can also be configured to control in the vertical direction (Z direction) is not only at least two-dimensional control, as long as even irregularities having the inspection target board is still good test results can be constituted. Hereinafter, with reference to FIG. 11 described fourth embodiment of the present invention is configured to control not only two-dimensional, but also into 31,312 / present specification (complement member) Control / 93-02 / 92133778 200417742 row vertical direction (Z direction) of example. FIG 11 is a diagram illustrating a configuration of the inspection apparatus according to a fourth embodiment of the present invention described embodiment. In FIG 11, the same constituent elements constituting the above-described first embodiment shown in FIG form of Example 1, the elements denoted by the same reference numerals, and detailed description is abbreviated province. In FIG 11, the detection unit 20 is attached to the laser displacement gauge 28, and the inspection signal supply section 30 is mounted a laser displacement gauge 38, is provided from the two displacement gauges 28, 38 of detecting a detection result of the measurement unit 20, 30 and the distance from the surface of the inspection target board inspection signal supplied to the measurement section portion 90. Further, the scalar robot 80 in addition to 20 may check the signal supply section 30 controls the two-dimensional detecting unit, may be further configured to control the positioning of FIG direction (vertical direction) to the vertical. Then, in the fourth embodiment includes a form of embodiment of the above configuration, the distance measuring section 90 and the movable electrode activated simultaneously laser displacement gauge 8 8,3 2, measured from the surface of each electrode substrate and the inspection target, and determination of result output control section 60. The control unit 60 averages the measurement results of the measurement distances during which the electrode from the distance measurement unit 90 moves a certain distance, and controls the distance between the electrode and the pattern so that the averaged distance becomes constant. For example, the average distance of the three amounts of the inspection object pattern, to control the distance between the electrodes, the surface of the substrate system. Such as average distance, in order to prevent and control the Z-direction is sharply becomes moderate control, to reduce noise, the influence of the measurement error or the like object. So as not only in X - Y directions also controls the Z-direction, in particular, inspection of large substrates is effective. For example, in the specification (s member) and other large flat display inventors examined a panel surface 32312 / wiring pattern / 93-02 / 92133778 200 417 742 in any case not always avoid bending the substrate surface is generated, so in the case can be effectively prevent contact with the electrode pattern. Further, in the case of large thickness of the pattern, as long as a narrow range by reducing the average of the distance measurement can be performed by a high intensity can be detected. Brief Description of the drawings] [FIG 1 is a diagram illustrating the principle of inspection of a pattern showing an embodiment used in one embodiment of the present invention invention. FIG 2 is a flow chart showing a morphological examination of the examination of the present embodiment the control apparatus embodiment. FIG 3 is the inspection target pattern inspection apparatus according to a embodiment of the present embodiment has an inspection signal detected embodiment of FIG. 3 in case of a short circuit. FIG 4 is a diagram showing an example of a detected waveform of a case where the inspection target becomes way form a pattern inspection apparatus of the embodiment of the present embodiment is disconnected state. FIG 5 is a configuration view of an inspection apparatus according to a second embodiment of the embodiment of the present invention. FIG 6 is a block diagram of the inspection apparatus of the present invention forms a third embodiment of the embodiment. FIG 7 is a diagram illustrating a third embodiment of the mobile electrode inspection apparatus according to the embodiment of the control of FIG. FIG 8 is a flowchart showing an embodiment defective portion of a specific pattern of the third embodiment of the control instructions. 9 is a third embodiment showing an embodiment of FIG. Shi poor penetration pattern of the sensing electrodes of the detection signal waveform in FIG. 33 312 / Description of the Invention (Supplement) / 93-02 / 92133778 200417742 Fig. 10 is a diagram illustrating an example of a detection signal waveform of a sensing electrode of a defective pattern. FIG 11 is a diagram illustrating the configuration of the inspection apparatus according to a fourth embodiment of the present invention to the embodiment with FIG. The conductive pattern 15 (REFERENCE SIGNS element) 10 made of a glass substrate 20 of the first sensor 22 sensing the first sensing electrode 24 second sensing electrode 25 sensing electrode 26 camera 28 laser displacement gauge 30 checks the signal supply section 32 Probe contact mechanism 35 Supply electrode 38 Laser displacement meter 5 0 Analog signal processing circuit 5 1 Amplifier 5 2 Band-pass filter 5 3 Rectifier circuit 5 4 Smoothing circuit 6 0 Control unit 6 1 Computer (CPU) 34 312 / invention, the description (up member) / 93-02 / 92133778 200 417 742

6 2 ROM

66 display unit 63 RAM 64 A / D converter 65 signal supply section 70 of the robot controller 80 scalar robot

312 / present specification (complement member) / 93-02 / 9213377835

Claims (1)

  1. 200417742 pickup, Patent Application range: supplying alternating current at one end A circuit pattern inspection apparatus, inspection system is formed from the vicinity of both ends of the target region of the inspection target line-shaped pattern in the inspection target region of the inspection signal from the detector from the other end A person who inspects a signal of an inspection pattern to inspect the inspection pattern is characterized by: a supply mechanism having a supply electrode for supplying the inspection signal to the inspection pattern from one end of an inspection region of the inspection pattern; a detection mechanism, a detector for detecting a signal electrode pattern from the inspection target; and moving means, the supply-side electrode means supplied with the detection electrode of the detection means away from the detection target pattern edge moves across to the region to be inspected line pattern portions near both ends. 2. Patent application range of the circuit pattern inspection apparatus of Item 1, wherein the inspection target pattern lines of specified width to form a substantially bar-like conductive pattern on the substrate. 3. The patent application range of the circuit pattern inspection apparatus of Item 1, wherein the width of the detection electrode is at least 2 rows degree pattern width of the inspection object. 4. The circuit pattern inspection device according to item 1 of the scope of patent application, wherein the detection mechanism includes: a first detection electrode, which is arranged at another end of the inspection target pattern and can be supplied with an inspection signal by the supply electrode; At one end position; and the second detection electrode is arranged at a position which can be provided at one end position with an inspection target pattern for supplying an inspection signal to the electrode by the aforementioned 36 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742 adjacent to the other end position of the inspection object pattern. 5. The circuit pattern inspection device according to item 4 of the patent application, wherein the width of the first detection electrode is equal to or less than the pattern width of the inspection target pattern. 6. The range of the circuit pattern patent inspection apparatus, Paragraph 4 or 5, wherein the width of the second detection electrode pattern of a width of the line pattern of the inspection target. 7. The circuit pattern inspection device according to item 1 of the scope of patent application, wherein the moving mechanism is in a state where the supply electrode surface of the supply mechanism and the detection electrode surface of the detection mechanism are engaged with the pattern capacitor of the inspection target, movement across said area of inspection to the line-shaped portion near the ends. 8. The circuit pattern inspection device according to item 1 of the patent application scope, further comprising a judging mechanism for judging that the inspection target pattern is normal according to the detection result of the above-mentioned inspection mechanism within the specified range, and when the inspection result exceeds the specified range the case where the inspection target pattern is determined to be defective. 9. The patent application range of the circuit pattern inspection apparatus of item 8, wherein further comprising: a second moving mechanism, when the judging means determines that the two ends of the inspection object pattern is defective, so that the supply electrode is supplied with said detection means detecting electrode moving mechanism to make any of the above-described supply mechanism supplying electrode or the detection electrode of the detection means moves toward the other along the pattern; and a position detecting means for detecting a change position detection based on the detection result of the detecting means. 37312 / present specification (complement member) / 93-02 / 9,213,377,820,041,774,210 as patent application range of the circuit pattern inspection apparatus of 9, further comprising detecting means or said supply electrode means in contact with the supply mechanism Bishi any of the other detection electrode in contact with the inspection object pattern. 1 1. The range of the circuit pattern inspection patented apparatus, Paragraph 9, wherein the imaging means comprises at least one of the supply electrode and the detection electrode by the second moving mechanism. 12. The circuit pattern inspection device according to item 9 of the scope of patent application, which includes a separation control mechanism for positioning and controlling at least one of the supply electrode and the detection electrode moved by the second movement mechanism, and an inspection pattern the distance is substantially constant. 1 3. The circuit pattern inspection device according to item 1 of the scope of patent application, which includes a separation distance control mechanism for positioning and controlling at least one of the supply electrode and the detection electrode moved by the moving mechanism, and an inspection pattern pattern. The separation distance is substantially constant. 1 4. The circuit pattern inspection device according to item 12 or 13 of the scope of patent application, wherein the separation processing control mechanism includes a displacement meter that moves together with the detection electrode and the supply electrode near the detection electrode or the supply electrode. According to the detection result of the displacement meter, positioning control is performed in a direction perpendicular to the inspection object such that a separation distance between the detection electrode or the supply electrode and the inspection object becomes substantially constant. 15. The circuit pattern inspection device according to item 14 of the scope of patent application, wherein the separation processing control mechanism is an average displacement of the detection result of the displacement meter between the number intervals of the inspection target pattern, as the above. 312 / Invention Manual (Supplement) / 93-02 / 92133778 Measure the shift pair or shift the position 38 200417742 Detect the separation distance between the detection electrode or the supply electrode and the inspection object, and perform in the direction perpendicular to the inspection object positioning control. 16--. Kinds of circuit pattern inspection method, based on the circuit pattern inspection apparatus includes a feeding mechanism, which has one end formed from the vicinity of both ends of the inspection target pattern is line-shaped inspection object pattern inspection object areas the inspection signal supplied to the inspection A supply electrode of a target pattern; and a detection mechanism having a detection electrode for detecting a signal from the inspection target pattern, wherein the supply electrode of the supply mechanism and the detection electrode of the detection mechanism maintain the supply mechanism The supply electrode surface and the detection electrode surface of the detection mechanism are separated from the surface of the detection target pattern while the supply electrode, the detection electrode, and the inspection target pattern are moved across both ends of the inspection target region. line pattern portion near one end of the inspection object supplied from the inspection area of the inspection target pattern AC signal, and detection signal from the inspection object pattern from the other end, in order to check the inspection target pattern. 17 as the scope of patented circuit pattern inspection method of Paragraph 16, wherein the circuit pattern lines to form a specified width substantially bar-like conductive pattern on the substrate. 18 as the scope of patented circuit pattern inspection method of Paragraph 16, wherein the detection electrode width coefficient set at least 2 rows degree inspection object pattern width, and the conductive pattern is detected from the adjacent check signal is supplied to the conductive signal pattern can be detected a short circuit between the adjacent conductive patterns. 1 9. The method of patent application range of the circuit pattern inspection of the first six, where '/ 93-02 / 39 312 92133778 200 417 742 feed / present specification (complement member) from the detection electrode by the first detection electrode of the detection means signal from the conductive pattern of the check signal, can detect the disconnection between the conductive patterns; with the adjacent conductive pattern from the detection electrode inspection signal supplied from the second detecting electrode detecting means detects the signal from the conductive pattern can be detected the short-circuiting between adjacent conductive patterns. 20 as the scope of patented circuit pattern inspection method of Paragraph 16, wherein, in the detecting means from the detecting means becomes a non-detection position, to detect the position of the conductive pattern portions substantially broken. 21 as patent application range of the circuit inspection method of pattern of the first six of which, further in the case of the specified ranges depending on the detection result of the detecting means determines that the inspection target pattern as normal, but the inspection result circumstances beyond the specified range inspection target pattern is determined to be defective. 22 as the scope of patented circuit pattern inspection method of the second one, wherein the determination of both end portions of the recognized inspection object pattern is defective, the detection electrode of the movable electrode is supplied with said detection means supplying means and to identify any one of determining whether the holding means is determined to be defective in the inspection target pattern position, so that the supply of the electrode or the detection electrode patterns moving toward the other direction, based on the detection result of the detecting means, the change in the position to be inspected bad position of the pattern. 23 as the scope of patented circuit pattern inspection method of Paragraph 22, wherein the detecting electrode is electrically supplying said supply means or said detection means is any one of the other electrode in contact with the inspection object pattern. Patent application range of the circuit 24. The pattern inspection method of item 22, wherein the preparation is supplied to the electrode or the detection electrode according to any one of the imaging means moves along toward the other pattern, a pattern failure photographers inspection target 40 312 / Invention Specification (Supplement) / 93-02 / 92133778 200417742. 25 as patent range of 2 to 4 a first circuit 16 in any one of the pattern inspection method, wherein, in the detection electrode or a position near the supply electrodes, arranged displaced together with the movable electrode or the detection electrode is supplied meter, and based on the detection result of the displacement gauge so as to separate from the detection electrode or the supply electrode and the object under examination substantially constant manner positioning control in a direction perpendicular to the inspection object to make the result of the detection electrodes constant left foot dagger. 2 6. The method for inspecting a circuit pattern according to item 25 of the scope of patent application, wherein the average displacement of the inspection result of the displacement meter between the plurality of pitches of the inspection object pattern is used as the detection electrode or the supply electrode and separation distance of the inspection object, to perform positioning control of the inspection object. 41312 / present specification (complement member) / 93-02 / 92133778
TW92133778A 2002-11-30 2003-11-28 Circuit pattern inspection device and circuit pattern inspection method TWI247904B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002382813 2002-11-30
JP2003436043A JP3978178B2 (en) 2002-11-30 2003-11-28 Circuit pattern inspection apparatus and circuit pattern inspection method

Publications (2)

Publication Number Publication Date
TW200417742A true TW200417742A (en) 2004-09-16
TWI247904B TWI247904B (en) 2006-01-21

Family

ID=32473767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92133778A TWI247904B (en) 2002-11-30 2003-11-28 Circuit pattern inspection device and circuit pattern inspection method

Country Status (5)

Country Link
JP (1) JP3978178B2 (en)
KR (1) KR101013243B1 (en)
AU (1) AU2003302525A1 (en)
TW (1) TWI247904B (en)
WO (1) WO2004051290A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407126B (en) * 2005-01-19 2013-09-01 Oht Inc Circuit pattern checking device and method thereof
TWI418815B (en) * 2011-05-20 2013-12-11 Union Arrow Technologies Inc Conductive pattern inspection device
TWI629629B (en) * 2013-06-07 2018-07-11 日商日本電產理德股份有限公司 Inspection apparatus, calibration and inspection method of the inspection apparatus

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3989488B2 (en) * 2005-01-19 2007-10-10 オー・エイチ・ティー株式会社 Inspection device, inspection method, and sensor for inspection device
JP2006300665A (en) * 2005-04-19 2006-11-02 Oht Inc Inspection device, and conductive pattern inspection method
JP5276774B2 (en) * 2005-11-29 2013-08-28 株式会社日本マイクロニクス Inspection method and apparatus
JP4730904B2 (en) * 2006-04-28 2011-07-20 日本電産リード株式会社 Substrate inspection apparatus and substrate inspection method
JP4861755B2 (en) * 2006-06-23 2012-01-25 オー・エイチ・ティー株式会社 Jig for position calibration of sensor part of circuit pattern inspection equipment
KR100799161B1 (en) * 2006-07-20 2008-01-29 마이크로 인스펙션 주식회사 Non-contact type single side probe and inspection apparatus and method for open/short test of pattern electrodes used thereof
JP4634353B2 (en) * 2006-09-20 2011-02-23 オー・エイチ・ティー株式会社 Circuit pattern inspection device
JP2008249522A (en) * 2007-03-30 2008-10-16 Aisin Seiki Co Ltd Glass breakage detection apparatus
JP4644745B2 (en) * 2009-08-04 2011-03-02 オー・エイチ・ティー株式会社 Circuit pattern inspection device
JP4723664B2 (en) * 2009-08-17 2011-07-13 株式会社エフカム Conductive pattern inspection apparatus and inspection method
JP5334197B2 (en) 2009-12-15 2013-11-06 株式会社ジャパンディスプレイ Capacitance input device, inspection method for capacitance input device, drive device for capacitance input device
JP5305111B2 (en) * 2011-01-21 2013-10-02 オー・エイチ・ティー株式会社 Circuit pattern inspection device
JP5865734B2 (en) * 2012-03-01 2016-02-17 株式会社Screenホールディングス Area classification apparatus, program therefor, board inspection apparatus, and area classification method
JP5417651B1 (en) * 2013-01-08 2014-02-19 オー・エイチ・ティー株式会社 Circuit pattern inspection device
JP6202452B1 (en) * 2016-06-01 2017-09-27 オー・エイチ・ティー株式会社 Non-contact type substrate inspection apparatus and inspection method thereof
JP6476234B2 (en) * 2016-06-30 2019-02-27 オー・エイチ・ティー株式会社 Non-contact type circuit pattern inspection and repair device
CN107567199B (en) * 2016-06-30 2020-01-07 Oht株式会社 Non-contact circuit pattern inspection and repair device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693353B2 (en) * 1992-04-28 2005-09-07 松下電器産業株式会社 Electrical inspection machine for printed wiring boards
JPH05333357A (en) * 1992-05-29 1993-12-17 Idemitsu Kosan Co Ltd Method and device for inspecting stripe electrode pattern of liquid crystal display element
JPH07146323A (en) * 1993-11-22 1995-06-06 Inter Tec:Kk Method and device for inspecting glass substrate for liquid crystal display
JPH10206485A (en) 1997-01-21 1998-08-07 Hioki Ee Corp Substrate inspecting apparatus
JP3311698B2 (en) * 1998-11-19 2002-08-05 オー・エイチ・ティー株式会社 Circuit board continuity inspection device, continuity inspection method, continuity inspection jig, and recording medium
JP2000221227A (en) * 1999-01-30 2000-08-11 Koperu Denshi Kk Apparatus and method for inspecting conductive pattern
JP2001084905A (en) * 1999-09-14 2001-03-30 Dainippon Printing Co Ltd Inspection device for electrode and method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407126B (en) * 2005-01-19 2013-09-01 Oht Inc Circuit pattern checking device and method thereof
TWI418815B (en) * 2011-05-20 2013-12-11 Union Arrow Technologies Inc Conductive pattern inspection device
TWI629629B (en) * 2013-06-07 2018-07-11 日商日本電產理德股份有限公司 Inspection apparatus, calibration and inspection method of the inspection apparatus

Also Published As

Publication number Publication date
WO2004051290A1 (en) 2004-06-17
JP2004191381A (en) 2004-07-08
JP3978178B2 (en) 2007-09-19
TWI247904B (en) 2006-01-21
AU2003302525A1 (en) 2004-06-23
KR20050084001A (en) 2005-08-26
KR101013243B1 (en) 2011-02-09

Similar Documents

Publication Publication Date Title
US5654204A (en) Die sorter
US6118894A (en) Integrated circuit probe card inspection system
US5631573A (en) Probe-type test handler
JP5131962B2 (en) Non-contact single side probe, pattern electrode disconnection / short circuit inspection apparatus using the same, and method thereof
JP4562358B2 (en) Conductive pattern inspection device
JP4187718B2 (en) Probe card
CN1272635C (en) Circuit distribution inspection device, circuit distribution inspection method, and recording medium
US6995566B2 (en) Circuit pattern inspection apparatus, circuit pattern inspection method, and recording medium
JP4493421B2 (en) Printed circuit board inspection apparatus, printed circuit board assembly inspection line system, and program
JP2005012119A (en) Inspecting method and apparatus
JP2006220426A (en) Method and system for inspecting mounted electronic component
CN1292260C (en) Device and method for inspection
DE10043726C2 (en) Method for testing circuit boards with a parallel tester and apparatus for carrying out the method
TWI302985B (en) Movement amount operation correction method for prober, computer-readable recording media for recording a movement amount operation operation correction processing program, and prober
JP4996119B2 (en) Probe tip position detection method, storage medium recording this method, and probe apparatus
CN1187619C (en) Method and device for testing printed circuit boards with a parallel tester
JP4997127B2 (en) Inspection method and program recording medium recording this inspection method
US5268645A (en) Method of and apparatus for testing circuit boards and the like with an inhomogeneous electric field
KR100841263B1 (en) Wire bonding apparatus, bonding control program and bonding methdo
JP5392231B2 (en) Screen printing apparatus and screen printing method
TWI438452B (en) Inspection device and inspection method
TWI401452B (en) Circuit pattern inspection device and inspection method
TW200845261A (en) Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus
US20100242259A1 (en) Electronic module and method of manufacturing electronic module
JP2006066561A (en) Semiconductor device, its inspection method, inspection device and semiconductor manufacturing method