JP6770069B2 - measuring device - Google Patents

Description

The techniques disclosed herein relate to measuring devices that measure the height of parts.

Patent Document 1 (Japanese Patent Laid-Open No. 10-163690) discloses a suction nozzle that sucks the upper end portion of a component and holds the component. The component is held by the suction nozzle and the component is mounted on the substrate. A concave groove is formed on the side surface of the suction nozzle of Patent Document 1. In Patent Document 1, the type of suction nozzle is identified by using this concave groove as a mark.

When mounting a component held by a suction nozzle on a substrate, the height of the component may be measured. This is to accurately mount the components on the board. At this time, if the height of the component cannot be measured accurately, the component may not be accurately mounted on the substrate. For example, when mounting a component held by a suction nozzle on a substrate, the height of the component may be measured and the position of the suction nozzle may be controlled based on the height. If the height of the component cannot be measured accurately, the suction nozzle may be too close to the substrate when the component is mounted on the board, and the component may be strongly pressed against the substrate. Alternatively, the suction nozzle may not be sufficiently close to the substrate and the component may not be able to reach the substrate. In such a case, the component cannot be accurately mounted on the board. Therefore, the present specification provides a technique capable of accurately measuring the height of a component.

The measuring device disclosed in the present specification is a device that measures the height of a component mounted on a substrate. This measuring device includes a suction nozzle that sucks parts, a mark formed on the side surface of the suction nozzle, an imaging unit that images the part and the suction nozzle from the side of the suction nozzle that sucks the part, and a storage unit. And a control unit. The control unit identifies the positions of the mark and the lower end of the component in the image of the component and the suction nozzle imaged by the imaging unit when the upper end of the component is sucked to the lower end of the suction nozzle, and the specified mark and the specified mark. The distance between the upper end and the lower end of the component is calculated based on the distance between the lower end of the component and the distance between the mark stored in advance by the storage unit and the lower end of the suction nozzle.

In such a configuration, the imaging unit images the component and the suction nozzle. In the image of the component and the suction nozzle imaged by the imaging unit, the position of the mark and the position of the lower end of the component can be accurately specified as compared with other parts. For example, when the width of the component and the width of the suction nozzle are the same, the position of the upper end portion of the component is difficult to distinguish from the position of the lower end portion of the suction nozzle, and may not be accurately specified. The same applies when the width of the component is narrower than the width of the suction nozzle. According to the above configuration, the height of the component is measured based on the position (the position of the mark and the position of the lower end portion of the component) that can be accurately identified in the image captured by the imaging unit. Specifically, the control unit sets the upper end portion of the component based on the distance between the mark and the lower end portion of the component and the distance between the mark stored in advance by the storage unit and the lower end portion of the suction nozzle. The distance between the lower ends (height of parts) is calculated. In this way, since the height of the component is measured based on the position that can be accurately specified, the height of the component can be accurately measured.

If the position of the upper end of the part can be accurately specified, the height of the part can be accurately measured based on the position of the upper end and the position of the lower end of the part. However, as described above, the upper end of the part can be accurately measured. The position of may not be accurately identified. Therefore, according to the above configuration, the height of the component can be accurately measured by measuring the height of the component based on the position of the mark that can be accurately specified and the position of the lower end portion of the component.

It is a side view which shows typically the structure of the measuring apparatus (parts mounting apparatus) of an Example. It is sectional drawing in line II-II of FIG. It is a side view which shows a part of the structure of the measuring apparatus of an Example schematically (the figure which shows the main part III of FIG. 1 enlarged). It is a figure which shows an example of the image which the image pickup apparatus has taken. It is a block diagram of a measuring device. It is a side view of the suction nozzle of another Example. It is a side view of the suction nozzle of still another Example.

The main features of the examples described below are listed. It should be noted that the technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Absent.

(Characteristic 1) In the measuring device disclosed in the present specification, the mark may be formed above the lower end of the suction nozzle.

According to such a configuration, since the position of the mark is separated from the position of the lower end portion of the suction nozzle, the position of the mark can be clearly separated from the position of the lower end portion of the suction nozzle. As a result, the position of the mark can be specified more accurately, and the height of the part can be measured more accurately.

(Feature 2) The measuring device may include a sticker attached to the side surface of the suction nozzle. The marker may be formed by a part of the seal.

According to such a configuration, the mark can be formed only by attaching the sticker to the side surface of the suction nozzle, so that the mark can be easily formed.

Hereinafter, examples will be described with reference to the accompanying drawings. The measuring device of the embodiment is a device for measuring the height of an electronic component. The measuring device is a device for mounting electronic components on a circuit board. The measuring device of the embodiment may be referred to as a component mounting device. The measuring device (component mounting device) is also called a chip mounter. Usually, the measuring device (component mounting device) is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.

As shown in FIGS. 1 and 2, the measuring device 10 (component mounting device) includes a plurality of component feeders 12, a feeder holding unit 14, a head unit 15 including a mounting head 16 and a head moving device 18. It includes an image pickup device 30 (an example of an image pickup unit), a substrate conveyor 20, a control device 22 (an example of a control unit), and a touch panel 24. A PC 26 configured to communicate with the measuring device 10 is arranged outside the measuring device 10 (component mounting device). Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14, and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a winding tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders which randomly accommodates. Further, the feeder holding portion 14 may be fixed in the measuring device 10 or may be detachable from the measuring device 10.

The mounting head 16 has a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the suction nozzle 6 in the Z direction (here, the vertical direction), and causes the suction nozzle 6 to approach and separate from the component feeder 12 and the circuit board 2. The mounting head 16 can suck the electronic component 4 from the component feeder 12 by the suction nozzle 6, and can mount the electronic component 4 sucked on the suction nozzle 6 on the circuit board 2. The mounting head 16 is not limited to the one having a single suction nozzle 6, and may have a plurality of suction nozzles 6.

The suction nozzle 6 can suck and hold the electronic component 4 by sucking air. As shown in FIG. 3, the suction nozzle 6 sucks the upper end portion 45 of the electronic component 4. The upper end 45 of the electronic component 4 is in close contact with the lower end 62 of the suction nozzle 6. A fluorescent sticker 70 is attached to the side surface of the suction nozzle 6.

The fluorescent sticker 70 is formed in a band shape. The fluorescent sticker 70 emits light when it is irradiated with ultraviolet rays by the ultraviolet irradiation device 60 described later. The mark 50 is formed by the lower end portion 72 of the fluorescent sticker 70. Therefore, a mark 50 is formed on the side surface of the suction nozzle 6. The mark 50 is used to measure the height of the electronic component 4. The height of the electronic component 4 is the distance between the upper end portion 45 and the lower end portion 46 of the electronic component 4.

As shown in FIGS. 1 and 2, the head moving device 18 moves the mounting head 16 and the fixing member 29 between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction, and the mounting head 16 is fixed to the moving base 18a. The head unit 15 is composed of the mounting head 16 and the head moving device 18. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.

The board conveyor 20 is a device that carries in, positions, and carries out the circuit board 2. Although it is an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

The touch panel 24 is a display device that provides various information to the operator, and is a user interface that receives instructions and information from the operator. For example, the determination result by the control device 22 can be displayed to the operator.

The image pickup device 30 is fixed to the moving base 18a by the fixing member 29, and moves integrally with the moving base 18a. The image pickup apparatus 30 includes a camera 32, a light source for illumination (not shown), and a prism (not shown). The camera 32 captures the suction posture of the electronic component 4 sucked by the suction nozzle 6 from the horizontal direction (that is, the −Y direction) so as to include the entire axial direction (that is, the Z direction) of the suction nozzle 6. For the camera 32, for example, a CCD camera is used. The illumination light source is composed of LEDs and illuminates the imaging surface (side surface in the ZX plane direction in this embodiment) of the electronic component 4. The prism aligns the optical axis of the camera 32 with the imaging target. The light source for illumination illuminates the entire axial direction of the electronic component 4 and the suction nozzle 6, and the reflected light is reflected by the prism and guided to the camera 32, so that the camera 32 images the electronic component 4 and the suction nozzle 6. The image data of the image captured by the camera 32 is stored in a memory 40 (an example of a storage unit) described later.

The camera 32 is arranged on the side of the suction nozzle 6. When the suction nozzle 6 holds the electronic component 4, the camera 32 is located on the side of the electronic component 4 and the suction nozzle 6. The camera 32 can take an image of the electronic component 4 and the suction nozzle 6 from the side of the suction nozzle 6 that sucks the electronic component 4. The side of this embodiment is a direction orthogonal to the height direction of the electronic component 4. As shown in FIG. 4, the camera 32 can capture an image with the electronic component 4 and the suction nozzle 6 within the imaging range. In the image 200 captured by the camera 32, the portion of the fluorescent sticker 70 is displayed in white. When the camera 32 takes an image, the portion of the fluorescence sticker 70 is displayed in white because the fluorescence sticker 70 emits light due to the ultraviolet rays emitted by the ultraviolet irradiation device 60.

As shown in FIG. 3, the ultraviolet irradiation device 60 is attached to the upper part of the camera 32. The ultraviolet irradiation device 60 is arranged on the side of the suction nozzle 6. The ultraviolet irradiation device 60 is configured to irradiate ultraviolet rays from the side of the adsorption nozzle 6 toward the side surface of the adsorption nozzle 6. When the fluorescent sticker 70 on the side surface of the adsorption nozzle 6 is irradiated with ultraviolet rays, the fluorescent sticker 70 emits light. The ultraviolet irradiation device 60 can also irradiate ultraviolet rays toward the electronic component 4 held by the adsorption nozzle 6.

As shown in FIG. 5, the control device 22 is configured by using a computer including a memory 40 and a CPU 41. The memory 40 is provided with a component data storage unit 44. The component data storage unit 44 stores component data related to all the electronic components 4 mounted on various types of circuit boards 2. Specifically, the component data storage unit 44 transfers the size of the electronic component 4 by the type of the circuit board 2, the component type (chip component, lead component, etc.), the package type (QFP, BGA, etc.), and the head unit 15. It is stored in association with the order in which it is performed, the mounting position on the circuit board 2, and the like. An arithmetic program is stored in the memory 40, and the CPU 41 executes the arithmetic program. The process executed by the control device 22 will be described in detail later.

The memory 40 stores in advance the distance a between the mark 50 and the lower end portion 62 of the suction nozzle 6. The distance a has been measured in advance.

The control device 22 can calculate the height of the electronic component 4 based on the image 200 captured by the camera 32 of the image pickup device 30 and the information stored in the memory 40. As shown in FIG. 4, the control device 22 specifies the position of the mark 50 formed on the side surface of the suction nozzle 6 in the image 200 of the electronic component 4 and the suction nozzle 6 imaged by the camera 32. Further, the control device 22 specifies the position of the lower end portion 46 of the electronic component 4 in the image 200 captured by the camera 32. Further, the control device 22 specifies the distance b between the position of the specified mark 50 and the position of the lower end portion 46 of the electronic component 4, with the position of the specified mark 50 as a reference position (0 “zero”). Then, the control device 22 calculates the height of the electronic component 4. More specifically, the control device 22 determines the distance b between the position of the mark 50 and the position of the lower end 46 of the electronic component 4, the position of the mark 50 stored in advance in the memory 40, and the suction nozzle. Based on the distance a from the position of the lower end portion 62 of 6, the distance x between the upper end portion 45 and the lower end portion 46 of the electronic component 4 (that is, the height x of the electronic component 4) is calculated. Specifically, the height x = distance b-distance a of the electronic component 4. In this way, the height of the electronic component 4 can be measured.

As is clear from the above description, in the above-mentioned measuring device 10, the camera 32 of the image pickup device 30 images the electronic component 4 and the suction nozzle 6. In the image 200 of the electronic component 4 and the suction nozzle 6 captured by the camera 32, the mark 50 formed on the side surface of the suction nozzle 6 and the lower end portion 46 of the electronic component 4 are located at accurate positions as compared with other parts. It is a part that is easy to identify. This is because the mark 50 and the lower end 46 of the electronic component 4 are easily distinguished from other parts in the image 200 captured by the camera 32. Therefore, in the above-mentioned measuring device 10, the control device 22 calculates the height x of the electronic component 4 based on the position of the mark 50 and the position of the lower end portion 46 of the electronic component 4. Specifically, as described above, the distance b between the specified mark 50 and the lower end portion 46 of the electronic component 4 by the control device 22, and the mark 50 and the suction nozzle 6 stored in advance by the memory 40. The height of the electronic component 4 is calculated based on the distance a between the lower end portions 62. As described above, in the above-mentioned measuring device 10, the height of the electronic component 4 is calculated based on the portion (mark 50 and the lower end portion 46 of the electronic component 4) in which the accurate position can be easily specified in the image 200 captured by the camera 32. Therefore, the height of the electronic component 4 can be accurately measured.

Further, in the above-mentioned measuring device 10, even if the height position of the suction nozzle 6 with respect to the camera 32 of the image pickup device 30 deviates, the position of the mark 50 and the lower end portion 46 of the electronic component 4 in the image 200 captured by the camera 32. The position can be specified, and the height of the electronic component 4 can be accurately measured.

Further, in the above-mentioned measuring device 10, the mark 50 is formed above the lower end portion 62 of the suction nozzle 6. According to such a configuration, the mark 50 can be clearly distinguished from the lower end portion 62 of the suction nozzle 6, so that the position of the mark 50 can be more accurately specified in the image 200 captured by the camera 32. As a result, the height of the electronic component 4 can be measured more accurately.

Further, in the above-mentioned measuring device 10, a fluorescent sticker 70 is attached to the side surface of the suction nozzle 6, and a mark 50 is formed by a part of the fluorescent sticker 70. According to such a configuration, the mark 50 can be formed only by attaching the fluorescent seal 70 to the side surface of the suction nozzle 6, so that the mark 50 can be easily formed.

Although one embodiment has been described above, the specific embodiment is not limited to the above embodiment. In the following description, the same reference numerals will be given to the same configurations as those in the above description, and the description thereof will be omitted.

In the above embodiment, the mark 50 is formed by the lower end portion 72 of the fluorescent sticker 70, but the present invention is not limited to this configuration, and the mark 50 may be formed by the upper end portion of the fluorescent sticker 70.

Further, in the above embodiment, the fluorescent seal 70 is used to form the mark 50 on the side surface of the suction nozzle 6, but the present invention is not limited to this configuration. In another embodiment, a reflective sticker may be used instead of the fluorescent sticker 70. The mark 50 is formed by the lower end of the reflective seal. The reflection sticker reflects light when the camera 32 of the image pickup apparatus 30 images the suction nozzle 6. As a result, in the image 200 captured by the camera 32, the portion of the reflection sticker is displayed in white.

Further, in still another embodiment, a fluorescent paint may be used instead of the fluorescent seal 70. Fluorescent paint is applied to the side surface of the suction nozzle 6. The fluorescent paint is applied in a strip shape. The mark 50 is formed by the lower end portion of the fluorescent paint which is applied in a band shape.

Further, in still another embodiment, as shown in FIG. 6, a recess 76 may be formed on the side surface of the suction nozzle 6 instead of the fluorescent seal 70. The recess 76 is formed by notching the side surface of the suction nozzle 6. The mark 50 is formed by the lower end portion of the recess 76.

Further, the configuration of the mark 50 is not limited to the above configuration, and as shown in FIG. 7, the mark 50 may be configured by points 78 attached to the side surface of the suction nozzle 6.

In the above embodiment, the height x (distance x between the upper end 45 and the lower end 46 of the electronic component 4) of the electronic component 4 is calculated with the position of the mark 50 as the reference position (0 "zero"). However, it is not limited to this configuration. The reference position (0 “zero”) for calculating the distance is not particularly limited. For example, the position of the upper end or the lower end of the image 200 captured by the camera 32 of the imaging device 30 can be used as the reference position. The control device 22 specifies the distance from the reference position to the mark 50 and the distance from the reference position to the lower end 46 of the electronic component 4, and based on these, between the mark 50 and the lower end 46 of the electronic component 4. Distance b is calculated. Then, the control device 22 has a distance b between the calculated mark 50 and the lower end 46 of the electronic component 4, and a distance a between the mark 50 stored in advance in the memory 40 and the lower end 62 of the suction nozzle 6. The distance x between the upper end portion 45 and the lower end portion 46 of the electronic component 4 is calculated based on the above. Even with such a configuration, the height of the electronic component 4 can be measured.

Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples illustrated above. The technical elements described herein or in the drawings exhibit their technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques illustrated in the present specification or drawings can achieve a plurality of purposes at the same time, and achieving one of the purposes itself has technical usefulness.

2: Circuit board 4: Electronic component 6: Suction nozzle 10: Measuring device 12: Component feeder 14: Feeder holding unit 15: Head unit 16: Mounting head 18: Head moving device 18a: Moving base 20: Board conveyor 22: Control device 24: Touch panel 29: Fixing member 30: Imaging device 32: Camera 40: Memory 41: CPU
44: Part data storage unit 45: Upper end portion 46: Lower end portion 50: Mark 60: Ultraviolet irradiation device 62: Lower end portion 70: Fluorescent seal 72: Lower end portion 76: Recessed portion 200: Image

Claims (3)

A measuring device that measures the height of components mounted on a board.
A suction nozzle that sucks the parts and
The mark formed on the side surface of the suction nozzle and
An imaging unit that images the component and the suction nozzle from the side of the suction nozzle that is sucking the component.
Memory and
With a control unit
The imaging unit is fixed at a position facing the suction nozzle on the side of the suction nozzle.
In the image of the component and the suction nozzle imaged by the imaging unit when the upper end of the component is sucked on the lower end of the suction nozzle, the control unit has the upper end of the image, the mark, and the above. The position of the lower end of the component is specified, and the mark and the mark are based on the distance between the upper end of the image and the mark and the distance between the upper end of the image and the lower end of the component. The distance between the lower end of the component is calculated, the calculated distance between the mark and the lower end of the component, and the distance between the mark and the lower end of the suction nozzle stored in advance by the storage unit. A measuring device that calculates the distance between the upper end and the lower end of the component based on the distance. The measuring device according to claim 1, wherein the mark is formed above the lower end of the suction nozzle. It also has a seal attached to the side surface of the suction nozzle.
The measuring device according to claim 1 or 2, wherein the mark is formed by a part of the seal.

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