JP2022107194A - Imaging apparatus and substrate work device - Google Patents

Abstract

To detect in a short time at least one of an angle and location of an imaging unit whose optical axis is tilted.SOLUTION: An imaging apparatus includes a detection member 37, a substrate imaging camera 36, and a control unit 50. The control unit 50 performs an imaging process and a detection process. The imaging process includes imaging a mark 80 by the substrate imaging camera 36 to generate an image. The detection process includes identifying a reference location P0, a first location P1, and a second location P2 in an X direction on the basis of the mark 80 on the image and detecting at least one of the angle and location of the substrate imaging camera 36 on the basis of a distance F in the X direction from the reference location P0 to the first location P1 on the image and a distance G in the X direction from the reference location P0 to the second location P2 on the image.SELECTED DRAWING: Figure 10

Description

The techniques disclosed herein relate to imaging devices and substrate working devices.

Conventionally, an imaging device including an imaging unit whose optical axis is tilted (in other words, an imaging unit that images an imaged object at an angle) is known (see, for example, Patent Document 1). Specifically, the substrate imaging camera (corresponding to the imaging unit) described in Patent Document 1 is provided in the head unit of the surface mounter, and is arranged so that the optical axis is slanted with respect to the vertical line. .. In the surface mounter described in Patent Document 1, the accommodating recess of the component tape is imaged from diagonally above by a substrate imaging camera, and it is determined whether or not there is a component in the accommodating recess.

Japanese Unexamined Patent Publication No. 2019-36015 (paragraphs 0024 and 0027, FIGS. 2 and 3)

However, conventionally, the problems in the case of imaging an image-imaging object by an imaging unit whose optical axis is tilted have not been sufficiently studied.
The present specification discloses a technique capable of detecting at least one of the angle and the position of the imaging unit whose optical axis is tilted in a short time.

(1) According to one aspect of the present invention, the image pickup apparatus is a member having a flat surface, an image pickup unit whose optical axis is tilted with respect to the flat surface, and a mark formed on the flat surface. When the direction in which the optical axis of the image pickup unit is projected perpendicularly to the flat surface is defined as the X direction, the reference position on the flat surface in the X direction and one of the X directions with reference to the reference position. A mark capable of specifying a first position on the side of the image and a second position on the other side, and a control unit are provided, and the control unit captures the mark by the image pickup unit to generate an image. The imaging process is performed, and the reference position, the first position, and the second position in the X direction are specified on the image based on the mark, and the first position from the reference position on the image. A detection process for detecting at least one of the angle and position of the imaging unit based on the distance in the X direction up to and the distance in the X direction from the reference position to the second position on the image. To execute.

The above-mentioned mark does not necessarily have to directly indicate the reference position, the first position and the second position as long as they have a shape that can be specified. For example, these positions may be specified by applying predetermined rules to the marks.

In the invention described in Patent Document 1 described above, whether or not there is a component in the accommodating recess is determined by a substrate imaging camera, but the application of the imaging unit whose optical axis is tilted is not limited to this, for example. It can also be used to detect the position and height of an object to be imaged.
The angle and position of the imaging unit whose optical axis is tilted may deviate from the original angle and position. For example, when the position or height of an image-imaging object is detected by the image pickup unit, if the angle or position of the image-imaging unit is deviated, the detection accuracy of the position or height of the image-imaging object is lowered. When the angle or position of the image pickup unit is detected, the detected position or height of the image pickup object is corrected according to the angle or position of the image pickup unit, so that the detection accuracy of the position or height of the image pickup object is lowered. Can be suppressed.

Conventionally, as a method of detecting the angle and / or position of an imaging unit whose optical axis is tilted, a method of imaging an imaged object, generating an image, and detecting based on the generated image is known. However, since it is not possible to distinguish whether the angle of the imaging unit is deviated or the position is deviated only by imaging the object to be imaged once, it is conventionally necessary to change the height of the object to be imaged and perform multiple imaging. was there. In other words, conventionally, it is not possible to detect the angle and / or position of the imaging unit with only one imaging, and there is a problem that it takes time to detect.

According to the above-mentioned imaging device, it can be detected by one imaging regardless of whether the angle of the imaging unit is detected, the position is detected, or both of them are detected. Therefore, according to the above-mentioned imaging device, at least one of the angle and the position of the imaging unit whose optical axis is tilted can be detected in a short time.

(2) According to one aspect of the present invention, the distance between the reference position and the first position on the image in the X direction is F, and the distance between the reference position and the second position in the X direction. The distance is defined as G, and in the coordinate system on the virtual plane perpendicular to the flat surface and including the optical axis, the coordinates indicating the position of the imaging unit are (a, b), and the reference position is defined as the reference position. On the first straight line L1 passing through the first straight line L1 and orthogonal to the second straight line L2 passing through the coordinates (a, b) of the imaging unit and the reference position, the distance F is separated from the reference position. When the point A is defined as the point A and the point separated from the reference position by the distance G on the first straight line L1 is defined as the point B, the control unit performs the detection process. In the process of obtaining the coordinates of the intersection of the first straight line L1 and the third straight line L3 passing through the points A and the coordinates (a, b) of the imaging unit as the coordinates of the point A, the first step. The process of obtaining the coordinates of the intersection of the straight line L1 of 1 and the fourth straight line L4 passing through the points B and the coordinates (a, b) of the imaging unit as the coordinates of the point B, and the coordinates of the point A. The process of obtaining the coordinates (a, b) of the imaging unit based on the coordinates of the point B, the distance F, and the distance G may be executed.

According to the above-mentioned imaging device, the position of the imaging unit whose optical axis is tilted can be detected in a short time.

(3) According to one aspect of the present invention, the control unit may execute a process of obtaining the angle of the imaging unit based on the coordinates (a, b) of the imaging unit in the detection process.

According to the above-mentioned imaging device, both the angle and the position of the imaging unit whose optical axis is tilted can be detected in a short time.

(4) According to one aspect of the present invention, the mark may have a shape in which the rod-shaped portion extending in the X direction and the rod-shaped portion extending in the Y direction orthogonal to the X direction are orthogonal to each other.

According to the above image pickup apparatus, for example, on the generated image, the position on the minus side in the X direction of the rod-shaped portion extending in the X direction is the first position, the position on the plus side in the X direction is the second position, and the position in the Y direction. By setting the position on the minus side of the rod-shaped portion extending in the Y direction as the third position and the position on the plus side in the Y direction as the fourth position, the first position, the second position, the third position and the third position The position of 4 can be specified. Then, by setting the intersection of the straight line connecting the first position and the second position and the straight line connecting the third position and the fourth position as the reference position, the reference position, the first position, and the first position are set. The position of 2 can be specified.

The above-mentioned "the position on the minus side in the X direction is the first position", "the position on the plus side in the X direction is the second position", and "the position on the minus side in the Y direction is the third position". "Yes", "The position on the plus side in the Y direction is the fourth position", and "The intersection is the reference position" are examples of the above-mentioned "predetermined rules". By applying this rule to the mark, these positions can be identified from the mark even if the mark does not directly indicate the reference position, the first position and the second position.

(5) According to one aspect of the present invention, the mark may be circular.

According to the above image pickup apparatus, for example, on the generated image, the position on the minus side in the X direction of the circular mark is the first position, the position on the plus side in the X direction is the second position, and the position on the most Y direction (flat). The position on the minus side (direction orthogonal to the X direction on the surface) is set to the third position, and the position on the plus side in the Y direction is set to the fourth position, so that the first position, the second position, and the third position are set. And the fourth position can be specified. Then, by setting the intersection of the straight line passing through the first position and the second position and the straight line passing through the third position and the fourth position as the reference position, the reference position, the first position, and the first position are set. The position of 2 can be specified.
Since the circular mark has a simple shape, it also has an advantage that it is easy to form on a flat surface.

(6) According to one aspect of the present invention, the substrate working apparatus for performing work on the substrate includes the imaging apparatus according to any one of claims 1 to 5.

Conventionally, as a substrate working device for performing work on a substrate, a screen printing machine, a printing inspection machine, a dispenser, a surface mounting machine, a post-mounting visual inspection machine, a post-curing visual inspection machine, and the like are known. Some of these substrate working devices image an image pickup object related to work on the substrate by an imaging unit whose optical axis is tilted.
According to the above-mentioned substrate working apparatus, at least one of the angle and the position of the imaging unit of the imaging apparatus included in the substrate working apparatus can be detected in a short time.

(7) According to one aspect of the present invention, the substrate working apparatus may be a surface mounter for mounting components on a substrate.

When the surface mounter lowers the mounting head to hold the component, the surface mounter may fail to hold the component if the mounting head is misaligned with respect to the component. Alternatively, even if the component can be held, the component may fall while moving the held component to the mounting position on the board. Further, when the component is held by the mounting head, if the mounting head is not sufficiently lowered, a gap may be formed between the mounting head and the upper surface of the component, and the holding of the component may fail. On the contrary, if the mounting head is lowered too much, the mounting head may push the component downward and damage the component.
For this reason, the surface mounter detects the position and height of the component by imaging the component with an imaging unit whose optical axis is tilted, and adjusts the position of the mounting head according to the detected position, or the detected height. Adjust the amount of lowering of the mounting head according to. However, if the angle or position of the imaging unit is deviated, the detection accuracy of the position or height of the component is lowered, and there is a possibility that failure to hold the component or damage to the component cannot be sufficiently suppressed.
According to the above-mentioned substrate working apparatus, the position and the amount of lowering of the mounting head can be appropriately adjusted by correcting the detected position and height of the component according to the angle and position of the imaging unit. Therefore, failure to hold the parts and damage to the parts can be suppressed.

The invention disclosed herein can be realized in various aspects such as devices, methods, computer programs for realizing the functions of these devices or methods, recording media on which the computer programs are recorded, and the like.

At least one of the angle and position of the imaging unit whose optical axis is tilted can be detected in a short time.

Schematic diagram of the production line according to the first embodiment Top view of surface mounter Side view of surface mounter Block diagram showing the electrical configuration of a board imaging camera Block diagram showing the electrical configuration of the surface mounter Schematic diagram showing the vicinity of the parts supply position of the feeder Schematic diagram showing the angle deviation of the first camera Schematic diagram showing the misalignment of the first camera Top view of the detection member Schematic diagram of an image of a detection member captured by a substrate imaging camera (no angular deviation or positional deviation) Schematic diagram of an image of a detection member imaged by a substrate imaging camera (with angular deviation or positional deviation) Schematic diagram of a virtual plane defined by the X-axis and Z-axis Top view of the detection member according to the second embodiment Schematic diagram of an image of a detection member imaged by a substrate imaging camera (with angular deviation or positional deviation) Top view of the detection member according to another embodiment Top view of the detection member according to another embodiment Top view of the detection member according to another embodiment

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 10. In the following description, the left-right direction shown in FIG. 2 is referred to as an X-axis direction, the front-back direction is referred to as a Y-axis direction, and the up-down direction shown in FIG. 3 is referred to as a Z-axis direction. Further, in the following description, the right side shown in FIG. 2 is referred to as an upstream side, and the left side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted except for some of the same components.

(1) Production Line With reference to FIG. 1, a production line 1 in which components are mounted on a substrate will be described. The production line 1 includes a loader 10, a screen printing machine 11, a printing inspection machine 12, a dispenser 13, a plurality of surface mounting machines 14, a post-mounting visual inspection machine 15, a reflow device 16, a post-curing visual inspection machine 17, an unloader 18, and the like. These are arranged in series via a plurality of conveyors 19.

The screen printing machine 11, the printing inspection machine 12, the dispenser 13, the surface mounting machine 14, the post-mounting visual inspection machine 15, and the post-curing visual inspection machine 17 are examples of substrate working devices that perform work on the substrate, respectively. In the following description, the surface mounter 14 will be described as an example of the substrate working device.

(2) Configuration of Surface Mounter The configuration of the surface mounter 14 will be described with reference to FIG. The surface mounter 14 is a device for mounting a component E such as an electronic component on a substrate P on which a circuit is printed by a screen printing machine 11. The surface mounter 14 includes a base 30, a transfer conveyor 31, a backup device (not shown), four tape component supply devices 32, a rotary head 33, a head moving unit 34, two component imaging cameras 35, and two substrate imaging cameras 36 (imaging). A detection member 37 (an example of a member having a flat surface), a control unit 50 (see FIG. 5), an operation unit 51 (see FIG. 5), and the like, which will be described later, are provided. The detection member 37, the substrate imaging camera 36, and the control unit 50 constitute the imaging device according to the first embodiment.

The base 30 has a rectangular shape in a plan view. The rectangular frame A shown by the alternate long and short dash line in FIG. 2 indicates a working position (hereinafter, referred to as a working position A) when the component E is mounted on the substrate P.
The conveyor 31 carries the substrate P from the upstream side in the X-axis direction to the work position A, and carries out the substrate P on which the component E is mounted at the work position A to the downstream side. The transfer conveyor 31 can also transfer the substrate P to the upstream side. The conveyor 31 includes a pair of conveyor belts 31A and 31B that circulate and drive in the X-axis direction, a conveyor drive motor 63 that drives those conveyor belts (see FIG. 5), and the like. The rear conveyor belt 31A can be moved in the front-rear direction, and the distance between the two conveyor belts 31A and 31B can be adjusted according to the width of the substrate P.

A backup device (not shown) is arranged below the working position A. The backup device fixes the substrate P conveyed to the working position A at the working position A, and supports the substrate P from below by a plurality of backup pins.
The tape component supply devices 32 are arranged at two locations along the X-axis direction on both sides of the conveyor 31 in the Y-axis direction, for a total of four locations. A plurality of feeders 32A are attached to these tape component supply devices 32 side by side in the X-axis direction. Each feeder 32A is a so-called tape feeder, and includes a reel on which a component tape 70 (see FIG. 6) containing a plurality of components E is wound, an electric tape delivery device for pulling out the component tape 70 from the reel, and the like. The parts E are supplied one by one from the parts supply position provided at the end on the transfer conveyor 31 side.
Here, the tape component supply device 32 will be described as an example of the component supply device, but the component supply device may be a so-called tray feeder that supplies a tray on which parts are placed, or a semiconductor wafer. There may be.

The rotary head 33 includes a rotating body 33A that rotates around a vertical line, and a plurality of mounting heads 33B that are supported by the rotating body 33A so as to be able to move up and down. The specific configuration of the rotary head 33 will be described later. Although the rotary head 33 will be described here as an example, it may be a so-called in-line type head in which the mounting heads 33B are arranged in a row.

The head moving unit 34 moves the rotary head 33 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head moving portion 34 includes a beam 34A that supports the rotary head 33 so as to be reciprocally movable in the X-axis direction, a pair of Y-axis guide rails 34B that support the beam 34A so that they can be reciprocated in the Y-axis direction, and a rotary head 33. The X-axis servomotor 58 reciprocates in the X-axis direction, the Y-axis servomotor 59 reciprocates the beam 34A in the Y-axis direction, and the like.

The two component imaging cameras 35 are provided between the two tape component supply devices 32 arranged in the X-axis direction, respectively. The component imaging camera 35 images the component E attracted (an example of holding) to the mounting head 33B from below. The image data captured by the component imaging camera 35 is used for determining whether or not the component E is normally attracted, determining the position and rotation angle of the component E with respect to the mounting head 33B, determining the quality of the component shape, and the like.

The two substrate imaging cameras 36 are provided on the head main body 33C (see FIG. 3) of the rotary head 33, which will be described later. The substrate imaging camera 36 is used for imaging a fiducial mark (not shown) attached to the substrate P. The image data generated by imaging the fiducial mark is used for recognizing the position and angle of the substrate P. The substrate imaging camera 36 is also used to detect the position and height of the component E supplied by the tape component supply device 32. The substrate imaging camera 36 may be used to image a range including the mounting position of the component E after mounting the component E on the board P by the mounting head 33B to determine whether or not the component E is normally mounted. good.

The detection member 37 is fixed to the base 30 between the two tape component supply devices 32 on the rear side. The detection member 37 is for detecting the mounting angle (hereinafter, simply referred to as an angle) of the substrate imaging camera 36 and the mounting position (hereinafter, simply referred to as a position) with respect to the head main body 33C (see FIG. 3). The detection member 37 is a plate-shaped member, and the upper surface is a flat surface. A mark 80, which will be described later, is formed on the upper surface of the detection member 37.

(2-1) Rotary head As shown in FIG. 3, the rotary head 33 includes a head body 33C, a rotating body 33A, a plurality of mounting heads 33B, two Z-axis drive devices (not shown), and an N-axis servomotor 61 (FIG. 5). (See), R-axis servomotor 62 (see FIG. 5), and the like. The rotary head 33 is connected to the control unit 50 via a bending resistant cable 33F (so-called flexible cable).

The head main body 33C is formed in an arm shape and is supported by the beam 34A so as to be reciprocally movable in the X-axis direction. The rotating body 33A has a substantially cylindrical shape, and is rotatably supported by the head body 33C around a vertical line.
The plurality of mounting heads 33B are arranged at equal intervals on the circumference centered on the rotation axis of the rotating body 33A. The mounting head 33B has a nozzle shaft 33D and a suction nozzle 33E that is detachably attached to the lower end of the nozzle shaft 33D. Negative pressure and positive pressure are supplied to the suction nozzle 33E from an air supply device (not shown) via the nozzle shaft 33D. The suction nozzle 33E sucks the component E by supplying a negative pressure, and releases the component E by supplying a positive pressure.

Two Z-axis drive devices (not shown) are fixed to the head body 33C. The Z-axis drive device is arranged above a predetermined pressing position set on the circumference on which the mounting head 33B is arranged. The Z-axis drive device includes a Z-axis linear motor 60 (see FIG. 5) in which the mover moves in the vertical direction, and presses the mounting head 33B that has been rotationally moved to the pressing position downward.
The N-axis servomotor 61 is a motor that rotationally drives the rotating body 33A around a vertical line. The R-axis servomotor 62 is a motor that rotates each mounting head 33B all at once around the axis of the mounting head 33B.

(2-2) Substrate Imaging Camera As shown in FIG. 3, the substrate imaging camera 36 is a stereo camera, respectively, and the first camera 40 and the second camera 40 and the second camera 40 take an image of an object to be imaged (the substrate P and the component E) from diagonally above. It has a camera 41. The angle formed by the plate surface of the substrate P and the optical axis of the camera of the first camera 40 is larger than that of the second camera 41.

The electrical configuration of the substrate imaging camera 36 will be described with reference to FIG. The substrate imaging camera 36 includes a first camera 40, a second camera 41, an FPGA 42 (Field Programmable Gate Array), and a communication unit 43.
The first camera 40 and the second camera 41 are emitted from an area sensor 44 in which a plurality of light receiving elements are two-dimensionally arranged, a light source 45 such as an LED that illuminates the image pickup object, and a light source 45, and are reflected by the image pickup object. It has an optical system (not shown) that forms an image of light on the light receiving surface of the area sensor 44, an A / D converter 46, and the like. The A / D converter 46 converts the voltage corresponding to the electric charge accumulated in each light receiving element into, for example, 0 (black) to 255 (white) digital data (hereinafter referred to as image data) and outputs the voltage to the FPGA 42. The FPGA 42 transmits the output image data to the image processing unit 55 (see FIG. 5), which will be described later, via the communication unit 43.

The substrate imaging camera 36 may be provided with a microcomputer or an ASIC (Application Specific Integrated Circuit) instead of the FPGA 42. The substrate imaging camera 36 may include a linear sensor in which light receiving elements are arranged in a row instead of the area sensor 44. In that case, the entire image-imaging object is imaged by photographing the image-imaging object in time series with the linear sensor while moving the rotary head 33.

(2-3) Electrical Configuration of Surface Mount Machine As shown in FIG. 5, the surface mount machine 14 includes a control unit 50 and an operation unit 51. The control unit 50 includes an arithmetic processing unit 52, a motor control unit 53, a storage unit 54, an image processing unit 55, an external input / output unit 56, a feeder communication unit 57, and the like.

The arithmetic processing unit 52 includes a CPU, a ROM, a RAM, and the like, and controls each unit of the surface mounter 14 by executing a control program stored in the ROM.
Under the control of the arithmetic processing unit 52, the motor control unit 53 includes an X-axis servo motor 58, a Y-axis servo motor 59, a Z-axis linear motor 60, an N-axis servo motor 61, an R-axis servo motor 62, a conveyor drive motor 63, and the like. Controls the start, stop and rotation speed of each motor.

The storage unit 54 is a rewritable storage device (hard disk or the like) in which data is not erased even when the power is turned off. Various programs and data are stored in the storage unit 54. The various data include the model of the board P scheduled to be produced, the data related to the various parts E (shape data of the part E, etc.), the order in which each model is produced, and the data for each model (number of production sheets, board P). The shape, the component E to be mounted, the mounting order of the component E, the mounting coordinates of the component E, the mounting angle, and the like are included.

The image processing unit 55 receives the image data transmitted from the component imaging camera 35 and the substrate imaging camera 36, and stores the received image data in the RAM of the arithmetic processing unit 52.
The external input / output unit 56 is a so-called interface, and is configured to capture detection signals output from various sensors 66 provided in the main body of the surface mounter 14. Further, the external input / output unit 56 is configured to perform operation control on various actuators 67 (including an air supply device and a backup device (not shown)) based on a control signal output from the arithmetic processing unit 52.

The feeder communication unit 57 is connected to the feeder 32A and controls the feeder 32A in a centralized manner.
The operation unit 51 includes a display unit such as a liquid crystal display and an input unit such as a touch panel and a keyboard. The operator can operate the operation unit 51 to perform various settings and operation instructions for the surface mounter 14.

(3) Detection of component position and height using a substrate imaging camera FIG. 6 schematically shows the periphery of the component supply position of the feeder 32A. As shown in FIG. 6, the component tape 70 includes a carrier tape 72 in which a plurality of accommodating recesses 71 are provided at equal intervals in the longitudinal direction, a component E accommodated in each accommodating recess 71, and an upper surface of the carrier tape 72. It has a release tape 73 attached to. The component tape 70 is provided with feed holes (not shown) for inserting the teeth of the sprocket provided in the feeder 32A at equal intervals along the longitudinal direction, and the component tape 70 is fed by rotating the sprocket.

The feeder 32A is provided with a peeling device (not shown) for peeling the release tape 73 in front of the component supply position, and the release tape 73 is peeled off in front of the component supply position in each accommodating recess 71. Then, when the accommodating recess 71 reaches the component supply position, the feeding of the component tape 70 is stopped, and in that state, the mounting head 33B is lowered and the component E is sucked.
When the mounting head 33B is lowered to attract the component E, the control unit 50 captures the component E from diagonally above by the substrate imaging camera 36 to detect the position and height of the component E. The control unit 50 adjusts the position of the mounting head 33B according to the detected position, and adjusts the amount of descent of the mounting head 33B according to the detected height.

(4) Detection of Angle and Position of Substrate Imaging Camera With reference to FIGS. 7A and 7B, the angle deviation and the positional deviation of the first camera 40 and the second camera 41 will be described. Here, the first camera 40 will be described as an example. In FIG. 7A, θ0 is the original angle of the first camera 40 (the angle when the angle deviation does not occur), and θ is the angle when the angle deviation occurs. In FIG. 7B, the coordinates (a0, b0) are the original positions of the first camera 40 with respect to the head body 33C (positions when there is no misalignment), and the coordinates (a, b) are when the misalignment occurs. The position of.

The control unit 50 detects the angle and position of the first camera 40 and the second camera 41, and corrects the position and height of the component E according to the angle and position of the first camera 40 and the second camera 41. Since the method of detecting the angle and position of the first camera 40 and the method of detecting the angle and position of the second camera 41 are the same, the first camera 40 will be described as an example in the following description.

As shown in FIG. 8, a mark 80 is formed on the upper surface of the detection member 37. The mark 80 is for detecting the angle and position of the first camera 40. The upper surface of the detection member 37 is formed in white, for example, and the mark 80 is formed in black. The alternate long and short dash line 90 is the direction in which the optical axis of the first camera 40 that has moved to the position where the mark 80 is imaged is projected vertically onto the upper surface of the detection member 37. In the following description, the direction indicated by the alternate long and short dash line 90 is defined as the X direction. Further, in the following description, the direction orthogonal to the X direction on the upper surface of the detection member 37 is defined as the Y direction, and the direction orthogonal to both the X direction and the Y direction is defined as the Z direction.

The mark 80 indicates a reference position P0 on the upper surface of the detection member 37 in the X direction, a first position P1 on one side in the X direction with reference to the reference position P0, and a second position P2 on the other side. There is. Specifically, the mark 80 has a shape in which a rectangular rod-shaped portion extending in the X direction and a rectangular rod-shaped portion extending in the Y direction are orthogonal to each other (in other words, a + shape, a cross shape, or a cross shape). The center point in the Y direction of the short side on the left side of the rectangular rod-shaped portion extending in the X direction (an example of the point on the minus side in the X direction) is the first position P1, and the center point in the Y direction of the short side on the right side (an example). An example of a point on the plus side in the X direction) is the second position P2. The first position P1 is not limited to the center point of the short side on the left side, and may be, for example, one end of the short side on the left side. The same applies to the second position P2.

The center point in the X direction of the lower short side of the rectangular rod-shaped portion extending in the Y direction (an example of the point on the minus side in the Y direction) is the third position P3, and the center point in the X direction of the upper short side. (An example of the point on the plus side in the Y direction) is the fourth position P4. The third position P3 is not limited to the center point of the lower short side, and may be, for example, one end of the lower short side. The same applies to the fourth position P4.
The position of the reference position P0 is indicated by the intersection of a straight line connecting the first position P1 and the second position P2 and a straight line connecting the third position P3 and the fourth position P4.

For convenience, in the following description, the actual distance in the X direction from the reference position P0 of the mark 80 to the first position P1 and the actual distance in the X direction from the reference position P0 to the second position P1 are both. It is assumed that the distance is c. That is, the mark 80 has the same actual distance in the X direction from the reference position P0 to the first position P1 and the actual distance in the X direction from the reference position P0 to the second position P2.
Further, the mark 80 indicates that the actual distance in the Y direction from the reference position P0 to the third position P3 and the actual distance in the Y direction from the reference position P0 to the fourth position P4 are both distances c. do. That is, the mark 80 has the same actual distance in the Y direction from the reference position P0 to the third position P3 and the actual distance in the Y direction from the reference position P0 to the fourth position P4.
Further, in the following description, the XYZ coordinate system with the reference position P0 as the origin will be used. The origin of the XYZ coordinate system does not necessarily have to be the reference position P0.

The image 100 shown in FIG. 9A is an image of the mark 80 captured when the angle and position of the first camera 40 are not deviated. Since the first camera 40 images the mark 80 from diagonally above, the mark 80 is imaged in a distorted shape even when the angle and position of the first camera 40 are not deviated.
The image 101 shown in FIG. 9B is an image of the mark 80 captured when the angle or position of the first camera 40 is deviated. When the angle or position of the first camera 40 is deviated, the position of the mark 80 is deviated on the image 101, and the degree of distortion of the mark 80 is different from that when the angle or position is not deviated. When the shape of the mark 80 is +, the first position P1, the second position P2, the third position P3, and the fourth position P4 can be specified on the image 101 even if the mark 80 is distorted. .. Therefore, the reference position P0 can be specified even if the mark 80 is distorted.

The detection of the angle and position of the first camera 40 using the mark 80 will be specifically described. The angle and position of the first camera 40 can be detected at any timing. For example, it may be performed before the production of the substrate P is started, or it may be performed when the type of the substrate P to be produced is switched. Alternatively, it may be performed at predetermined time intervals, or it may be performed every time a predetermined number of substrates P are produced.

The control unit 50 moves the first camera 40 to a position where the mark 80 is imaged, and the first camera 40 images the mark 80 from diagonally above (imaging process). The position where the mark 80 is imaged is, for example, a position where the center of the captured image overlaps with the reference position P0 of the mark 80 when the mark 80 is imaged by the first camera 40 whose angle and position are not deviated.

As shown in FIG. 9B, the control unit 50 identifies the first position P1, the second position P2, the third position P3, and the fourth position P4 on the image 101 based on the mark 80, and these positions. The reference position P0 on the image 101 is specified from. Then, the control unit 50 sets the distance F in the X direction from the reference position P0 to the first position P1 on the image 101 and the distance G in the X direction from the reference position P0 to the second position P2 on the image 101. Is determined, and the angle and position of the first camera 40 are detected based on the distance F and the distance G (detection processing).

The above-mentioned detection process will be specifically described with reference to FIG. FIG. 10 shows a virtual plane defined by the X-axis and the Z-axis of the XYZ coordinate system. The virtual plane is a plane perpendicular to the upper surface of the detection member 37 and includes the optical axis of the first camera 40. In FIG. 10, the point Pc indicates the position of the first camera 40 in the XZ direction. Here, the XZ coordinates of the point Pc are defined as (a, b). At this point, (a, b) is unknown.

In FIG. 10, the first straight line L1 passing through the points A and B is a straight line passing through the reference position P0 and orthogonal to the second straight line L2 passing through the points Pc and the reference position P0. The distance between the reference position P0 and the point A is F, and the distance between the reference position P0 and the point B is G. That is, the distance (= F + G) between the point A and the point B indicates the length of the mark 80 in the image in the X direction.

The XZ coordinates of the point A are obtained as the intersection of the first straight line L1 passing through the point A and the point B and the third straight line L3 passing through the point A and the point Pc. Specifically, the first straight line L1 is represented by the following formula 1, and the third straight line L3 is represented by the following formula 2. In the equations described below, c is the actual distance in the X direction from the reference position P0 to the first position P1 and the actual distance in the X direction from the reference position P0 to the second position P2 as described above. Is.

By solving the above equations 1 and 2, the XZ coordinates of the point A can be obtained as shown in the following equations 3 and 4.

Similarly, the XZ coordinates of the point B are obtained as the intersection of the first straight line L1 described above and the fourth straight line L4 passing through the point B and the point Pc. The fourth straight line L4 is represented by the following equation 5.

By solving the above equations 1 and 5, the XZ coordinates of the point B can be obtained as shown in the following equations 6 and 7.

As described above, the distance F and the distance G are obtained on the image. When the coordinates of the point A, the coordinates of the point B, the distance F, and the distance G are obtained, the XZ coordinates (a, b) of the point Pc are obtained as shown in the following equation 8. That is, the position of the first camera 40 is obtained as shown in the following equation 8.

Here, d and e are represented by the following equations 9 and 10.

By substituting the obtained coordinates (a, b) into the following equation 11, the angle θ of the first camera 40 can be obtained.

When the angle θ is obtained, the angle deviation Δθ of the first camera 40 is obtained by the following equation 12.
Δθ = θ0−θ ・ ・ ・ Equation 12

The positional deviation (Δx, Δz) of the first camera 40 in the XZ direction is calculated by the following equation 13.
(Δx, Δz) = (a0-a, b0-b) ... Equation 13

(5) Effect of the Embodiment According to the imaging apparatus (detection member 37, substrate imaging camera 36 and control unit 50) according to the first embodiment, the angle of the first camera 40 and the second camera 41 is detected. Even when the position is detected, or both are detected, the position can be detected by one imaging. Therefore, according to the imaging apparatus according to the first embodiment, at least one of the angle and the position of the substrate imaging camera 36 whose optical axis is tilted can be detected in a short time.

According to the imaging device, the control unit 50 uses the coordinates of the intersection of the first straight line L1 and the third straight line L3 passing through the coordinates (a, b) of the point A and the substrate imaging camera 36 as the coordinates of the point A. The process of obtaining, the process of obtaining the coordinates of the intersection of the first straight line L1 and the fourth straight line L4 passing through the coordinates (a, b) of the point B and the substrate imaging camera 36 as the coordinates of the point B, and the process of obtaining the point A. The process of obtaining the coordinates (a, b) of the substrate imaging camera 36 based on the coordinates of the above, the coordinates of the point B, the distance F, and the distance G is executed. As a result, the position of the substrate imaging camera 36 can be detected by one imaging. Therefore, the position of the substrate imaging camera 36 whose optical axis is tilted can be detected in a short time.

According to the imaging device, the control unit 50 executes a process of obtaining the angle of the substrate imaging camera 36 based on the coordinates (a, b) of the substrate imaging camera 36, so that both the angle and the position of the substrate imaging camera 36 are set to 1. It can be detected by taking multiple images. Therefore, both the angle and the position of the substrate imaging camera 36 whose optical axis is tilted can be detected in a short time.

According to the image pickup apparatus, since the mark 80 has a + shape in which the rod-shaped portion extending in the X direction and the rod-shaped portion extending in the Y direction are orthogonal to each other, the positions of the reference position P0, the first position P1 and the second position P2 are specified. can.

According to the substrate working apparatus (specifically, the surface mounter 14) according to the first embodiment, at least one of the angle and the position of the substrate imaging camera 36 whose optical axis is tilted can be detected in a short time.

The board working apparatus according to the first embodiment is a surface mounter 14. According to the surface mounter 14, the position and the amount of descent of the mounting head 33B can be appropriately adjusted by correcting the detected position and height of the component E according to the angle and position of the substrate imaging camera 36. Therefore, it is possible to suppress the failure of suction of the component E and the damage of the component E.

<Embodiment 2>
As shown in FIG. 11A, the mark 110 according to the second embodiment is circular. In the mark 110, the leftmost point (minus side in the X direction) is the first position P1, the rightmost point (plus side in the X direction) is the second position P2, and the lowest point (minus side in the Y direction) is the first position. The third position P3 and the uppermost (plus side in the Y direction) point are the fourth position P4. The reference position P0 is the center point of the mark 110. The center point of the mark 110 is the intersection of a straight line passing through the first position P1 and the second position P2 and a straight line passing through the third position P3 and the fourth position P4.

At the mark 110, the actual distance in the X direction from the reference position P0 to the first position P1 is equal to the actual distance in the X direction from the reference position P0 to the second position P2. Further, the mark 110 has the same actual distance in the Y direction from the reference position P0 to the third position P3 and the actual distance in the Y direction from the reference position P0 to the fourth position P4.

The image 111 shown in FIG. 11B is an image captured by the first camera 40. As shown in FIG. 11B, when the optical axis is tilted with respect to the upper surface of the detection member 37, the mark 110 has a distorted shape on the image 111 obtained by capturing the mark 110. However, when the mark 110 is circular, the reference position P0, the first position P1 and the second position P2 can be specified even if the mark 110 is distorted.

The circular mark 110 also has the advantage that it is easy to form because of its simple shape.

<Other embodiments>
The techniques disclosed herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the above embodiment, the case of detecting both the angle and the position of the substrate imaging camera 36 has been described as an example, but only the angle or the position may be detected. Conventionally, even when detecting only an angle or a position, it is necessary to take a plurality of imagings in order to distinguish whether the angle is deviated or the position is deviated. However, in the above embodiment, the angle or the position is detected. Even if only one of them is detected, it can be detected by one imaging. Even when only the angle is detected, it is necessary to obtain the position for the convenience of calculation.

(2) In the first embodiment, the + -shaped mark 80 is exemplified as the mark, and in the second embodiment, the circular mark 110 is exemplified as the mark. However, the mark may have any shape as long as the reference position P0, the first position P1 and the second position P2 can be specified.

For example, the mark 120 shown in FIG. 12 is composed of four small circles 130. The center point of the circle 130 on the left side is the first position P1, the center point of the circle 130 on the right side is the second position P2, the center point of the lower circle 130 is the third position P3, and the center point of the upper circle 130. Indicates the fourth position P4. Even if the mark 130 is distorted, the position of the reference position P0, the position of the first position P1, and the position of the second position P2 can be specified. A quadrangle or a triangle may be used instead of the circle.

Further, for example, the mark 131 shown in FIG. 13 is a rhombus. The left apex of the diamond-shaped mark 131 indicates the first position P1, the right apex indicates the second position P2, the lower apex indicates the third position P3, and the upper apex indicates the fourth position P4. The diamond-shaped mark 131 also has a shape capable of specifying the reference position P0, the first position P1, and the second position P2 even if it is distorted.

Further, for example, the mark 132 shown in FIG. 14 is composed of three small triangles 133. The tip of the triangular mark 133 on the left side shows the first position P1, the tip of the triangular mark 133 in between shows the reference position P0, and the tip of the triangular mark 133 on the right side shows the second position P2. Is shown. In the case of mark 132, the reference position P0 is directly indicated by the triangular mark 133 in between.

Further, in the second embodiment, the circular mark 110 is illustrated as the mark, but the mark may be an ellipse. The ellipse may be an ellipse in which the major axis is in the X direction and the minor axis is in the Y direction, or the ellipse may be an ellipse in which the major axis is in the Y direction and the minor axis is in the X direction.

(3) In the above embodiment, the surface mounting machine 14 has been described as an example of the board working device, but the board working device includes a screen printing machine 11, a printing inspection machine 12, a dispenser 13, a post-mounting visual inspection machine 15, and a post-curing visual inspection. It may be a machine 17 or the like. Among these board work devices, there is one that takes an image of an image pickup object related to work on the board P by an image pickup unit whose optical axis is tilted. When, for example, the imaging apparatus of the first embodiment or the second embodiment is applied to such a substrate working apparatus, at least one of the angle and the position of the imaging unit can be detected by one imaging. Therefore, work efficiency is improved.

(4) In the above embodiment, the case where the substrate imaging camera 36 includes the first camera 40 and the second camera 41 and the height of the component E is measured from the image data stereo-imaged by these cameras will be described as an example. did. However, the method for measuring the height of the component E is not limited to this. For example, the substrate imaging camera 36 includes only one camera, and the height may be measured by an optical cutting method, a phase shift method, or the like.

(5) In the above embodiment, the case where the mark is formed by printing on the upper surface of the detection member 37 has been described as an example, but the mark may be attached as a sticker. Alternatively, a convex, concave or hole may be formed on the upper surface of the detection member 37 and used as a mark.

(6) In the above embodiment, the case where the angle and position of the substrate imaging camera 36 are detected based on the mark has been described as an example, but the twist of the substrate imaging camera 36 may be detected based on the mark. The twist referred to here may be a deviation of the position of the substrate imaging camera 36 in the Y direction, or may be a rotation of the substrate imaging camera 36 around the optical axis.
For example, when detecting the position of the substrate imaging camera 36 in the Y direction as a twist, if the + shape mark described in the first embodiment or the circular mark described in the second embodiment is used, the third position P3 and the fourth position are used. Position P4 can be detected. Therefore, the position in the Y direction may be detected based on the distance in the Y direction from the reference position P0 to the third position P3 and the distance in the Y direction from the reference position P0 to the fourth position P4.

(7) In the first and second embodiments, the mark 80 and the mark 110 are the actual distance in the X direction from the reference position P0 to the first position P1 and the X direction from the reference position P0 to the second position P2. The case where the actual distance is equal is described as an example. However, these distances do not necessarily have to be equal, as long as these distances are known in advance. Further, in the first and second embodiments, the mark 80 and the mark 110 are the actual distance in the Y direction from the reference position P0 to the third position P3 and the actual distance in the Y direction from the reference position P0 to the fourth position P4. The case where the distances are equal to each other has been described as an example. However, these distances do not necessarily have to be equal.
Further, in the first and second embodiments, the actual distance in the X direction from the reference position P0 to the first position P1 and the actual distance in the Y direction from the reference position P0 to the third position P3 are both c. The case of is described as an example. However, these distances need only be known in advance, and even if the actual distance in the X direction to the first position P1 and the actual distance in the Y direction from the reference position P0 to the third position P3 are different. good.

(8) In the above embodiment, the coordinates of the point A and the coordinates of the point B are calculated, but the coordinates of the point A and the coordinates of the point B do not necessarily have to be calculated. Specifically, the equations 8, 9 and 10 are stored in the storage unit 54, and the control unit 50 substitutes the actual distance c, the distance F and the distance G on the image into the equations 8, 9 and 10. The position of the first camera 40 may be calculated.

36: Substrate imaging camera (an example of imaging unit)
37: Detection member (example of member)
80: Mark 101: Image 110: Mark 111: Image 120: Mark 131: Mark 132: Mark L1: First straight line L2: Second straight line L3: Third straight line L4: Fourth straight line P0: Reference position P1 : First position P2: Second position P: Substrate

Claims (7)

A member with a flat surface and
An imaging unit whose optical axis is tilted with respect to the flat surface,
When the mark formed on the flat surface and the direction in which the optical axis of the imaging unit is projected perpendicularly to the flat surface is defined as the X direction, the reference position on the flat surface in the X direction, A mark that can identify the first position on one side in the X direction and the second position on the other side with reference to the reference position.
Control unit and
With
The control unit
An imaging process in which the mark is imaged by the imaging unit to generate an image, and
The reference position, the first position and the second position in the X direction are specified on the image based on the mark, and the X direction from the reference position to the first position on the image. A detection process that detects at least one of the angle and position of the imaging unit based on the distance of the image and the distance in the X direction from the reference position to the second position on the image.
An imaging device that performs. The imaging device according to claim 1.
The distance between the reference position and the first position on the image in the X direction is defined as F, and the distance between the reference position and the second position in the X direction is defined as G.
In the coordinate system on the virtual plane including the optical axis, which is a virtual plane perpendicular to the flat surface, the coordinates indicating the position of the imaging unit are (a, b), and the first straight line L1 passing through the reference position is used. Point A is a point on the first straight line L1 orthogonal to the second straight line L2 passing through the coordinates (a, b) of the imaging unit and the reference position by the distance F from the reference position. When a point on the first straight line L1 that is separated from the reference position by the distance G on the opposite side of the point A is defined as a point B.
In the detection process, the control unit
A process of obtaining the coordinates of the intersection of the first straight line L1 and the third straight line L3 passing through the coordinates (a, b) of the point A and the imaging unit as the coordinates of the point A.
A process of obtaining the coordinates of the intersection of the first straight line L1 and the fourth straight line L4 passing through the coordinates (a, b) of the point B and the imaging unit as the coordinates of the point B.
A process of obtaining the coordinates (a, b) of the imaging unit based on the coordinates of the point A, the coordinates of the point B, the distance F, and the distance G.
An imaging device that performs. The imaging device according to claim 2.
The control unit is an image pickup apparatus that executes a process of obtaining an angle of the image pickup unit based on the coordinates (a, b) of the image pickup unit in the detection process. The imaging apparatus according to any one of claims 1 to 3.
The mark is an imaging device having a shape in which a rod-shaped portion extending in the X direction and a rod-shaped portion extending in the Y direction orthogonal to the X direction are orthogonal to each other. The imaging apparatus according to any one of claims 1 to 3.
The image pickup apparatus in which the mark is circular. A substrate working apparatus that performs work on a substrate and includes the imaging apparatus according to any one of claims 1 to 5. The substrate working apparatus according to claim 6.
The board work device is a board work device that is a surface mounter for mounting components on a board.

Images