WO2022137457A1

WO2022137457A1 - Substrate work machine and method for measuring depth of viscous body

Info

Publication number: WO2022137457A1
Application number: PCT/JP2020/048555
Authority: WO
Inventors: 正太郎皆川
Original assignee: 株式会社Fuji
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2022-06-30
Also published as: JPWO2022137457A1; JP7572458B2; CN116490752A

Abstract

A substrate work machine that executes work on a substrate. The substrate work machine comprises: a storage unit that stores a viscous body that is adhered to a component; a measurement member that is used for measuring the depth of the viscous body stored in the storage unit; a head that detachably mounts the measurement member; an imaging device that is disposed so as to move integrally with the head and captures images of the measurement member mounted on the head; and a specification unit that, when the measurement member attached to the head is immersed in the storage unit, specifies the depth of the viscous body inside the storage unit, from a captured image of the measurement member captured by the imaging device.

Description

Substrate working machine and method for measuring the depth of viscous material

This specification relates to a substrate working machine and a method for measuring the depth of a viscous body.

In a board working machine (for example, a component mounting machine) that performs a predetermined operation on a substrate, a viscous body (for example, flux or the like) is applied to a component (for example, an electrode of an electronic component) when working on the substrate. May adhere. For this reason, the substrate working machine may be provided with a storage unit for storing the viscous body. In this type of substrate working machine, it is necessary to accurately grasp the depth of the viscous body stored in the storage portion in order to accurately attach the viscous body to the component. For example, the substrate working machine disclosed in International Publication No. 2015/097731 is provided with a mechanism for measuring the depth of the viscous body stored in the storage unit. The substrate working machine of International Publication No. 2015/097731 includes a measuring jig including a plurality of rod-shaped measuring units. Since the lengths of the plurality of measuring units are different, the positions of the lower ends of the plurality of measuring units are different from each other. At the time of measurement, the measuring jig is positioned at a predetermined height set in advance with respect to the storage part, a plurality of measuring parts are pressed against the surface of the stored viscous body, and the measuring part is applied to the surface of the viscous body. Make a measurement mark. Then, the surface of the viscous body is imaged from above using an image pickup device, and the measurement mark is detected from the captured image. As described above, since the positions of the lower ends of the plurality of measuring units are different from each other, it is possible to measure the range of the depth of the viscous body by identifying which measuring unit has detected the measurement mark. There is.

In the substrate working machine of International Publication No. 2015/097731, when measuring the depth of the viscous body in the reservoir, after making a measurement mark on the surface of the viscous body, the measurement mark is imaged from above. Therefore, after pressing the measuring jig against the surface of the viscous body, the measuring jig is retracted from above the reservoir, and then the image pickup device is moved above the measurement mark (above the reservoir) to move the surface of the viscous body. It is necessary to take an image of the measurement mark of. For this reason, after making a measurement mark on the surface of the viscous body, it is necessary to move the image pickup device in order to image the measurement mark, and it takes time to measure the depth of the viscous body in the reservoir.

This specification discloses a technique for efficiently measuring the depth of a viscous body in a storage portion that stores a viscous body attached to a component.

The board working machine disclosed in this specification performs work on the board. The board working machine includes a storage unit that stores the viscous body to be attached to the component, a measuring member used to measure the depth of the viscous body stored in the storage unit, and a head to which the measuring member is detachably mounted. An image pickup device that is installed so as to move integrally with the head and captures an image of the measurement member mounted on the head, and a measurement that is imaged by the image pickup device when the measurement member adsorbed on the head is immersed in the reservoir. A specific portion for specifying the depth of the viscous body in the reservoir from the captured image of the member is provided.

In the above-mentioned substrate working machine, the measuring member is immersed in the viscous body in the reservoir, and the depth of the viscous body in the reservoir is specified from the captured image of the measuring member after the immersion. As a result, unlike the conventional technique, it is not necessary to take an image of the viscous body in the storage portion after the measuring member is immersed, and the depth of the viscous body in the storage portion can be efficiently measured.

Further, the measuring method disclosed in this embodiment is a method of measuring the depth of the viscous body in the storage portion for storing the viscous body to be attached to the component. The measuring method includes a dipping step of immersing the measuring member in the reservoir and a measuring step of measuring the length in the height direction of the viscous body adhering to the side of the measuring member immersed in the reservoir in the dipping step. , Equipped with.

Even with the above measurement method, since it is only necessary to take an image of the measuring member after immersion, the depth of the viscous body in the reservoir can be efficiently measured.

The figure which shows the outline structure of the component mounting machine which is an example of the board working machine which concerns on Example. FIG. 1 is a cross-sectional view taken along the line II-II of FIG. A block diagram showing a control system of a component mounting machine. The flowchart which shows an example of the process of measuring the film thickness of the flux stored in a storage part using a measuring member. The figure which shows the image which imaged the measuring member immersed in the flux.

The main features of the examples described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims at the time of filing. It's not a thing.

In the substrate working machine disclosed in the present specification, the measuring member mounted on the head is immersed in the storage portion, and the measured member after immersion is imaged by an image pickup device that moves integrally with the head. Since the head, the measuring member, and the imaging device move integrally, the viscous body attached to the measuring member can be efficiently imaged. Therefore, the process of measuring the depth of the viscous body in the storage portion can be efficiently executed.

In the substrate working machine disclosed in the present specification, the image pickup apparatus may image the measuring member from the side. The specific unit may detect the range of the viscous body attached to the measuring member from the captured image to specify the depth of the viscous body in the storage unit. According to such a configuration, since the measuring member is imaged from the side, the depth of the viscous body in the reservoir can be accurately measured from the range of the viscous body attached to the measuring member.

In the substrate working machine disclosed in the present specification, the parts may be set to be immersed in a predetermined position of the storage portion. The position where the measuring member is immersed may be a predetermined position of the storage portion (that is, a position where the component is immersed in the viscous body). The depth of the viscous material in the reservoir may vary slightly depending on the location. By immersing the measuring member in the position where the component is immersed, the depth of the viscous body at the position where the component is immersed in the entire reservoir can be measured. Therefore, the amount of the viscous body attached to the component can be accurately controlled.

The board working machine according to the embodiment will be described with reference to the drawings. Here, the component mounting machine 10 will be described as an example of the board working machine. The component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounting machine 10 is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.

As shown in FIGS. 1 and 2, the component mounting machine 10 moves a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, an imaging device 30, a mounting head 16, and an imaging device 30. It includes an apparatus 18, a nozzle accommodating portion 34, a nozzle holder 36, a substrate conveyor 20, a flux unit 40, a control device 22, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounting machine 10 is arranged outside the component mounting machine 10. Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, a tape-type feeder that accommodates a plurality of electronic components 4 on a wound tape, a tray-type feeder that accommodates a plurality of electronic components 4 on a tray, or a plurality of electronic components 4 in a container. It may be any of the bulk type feeders that randomly accommodate the above.

The feeder holding unit 14 is provided with a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the component mounting machine 10 or may be detachable from the component mounting machine 10.

The mounting head 16 has a nozzle 6 that attracts the electronic component 4. The nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and brings the nozzle 6 closer to and further from the component feeder 12 and the circuit board 2. The mounting head 16 can mount the electronic component 4 sucked on the nozzle 6 on the circuit board 2 while sucking the electronic component 4 from the component feeder 12 by the nozzle 6. The mounting head 16 is not limited to the one having a single nozzle 6, and may have a plurality of nozzles 6.

The image pickup device 30 is fixed to the moving base 18a by the fixing member 29, and moves integrally with the moving base 18a. The image pickup apparatus 30 includes a camera 32, a light source for illumination (not shown), and a prism (not shown). The camera 32 takes an image of the nozzle 6 from the horizontal direction (that is, the −Y direction) so as to include the entire axial direction (that is, the Z direction) of the nozzle 6. For the camera 32, for example, a CCD camera is used. The illumination light source is composed of LEDs and illuminates the image pickup surface (side surface in the ZX plane direction in this embodiment) of the nozzle 6. The prism aligns the optical axis of the camera 32 with the image pickup target. The entire axial direction of the nozzle 6 is illuminated by the illumination light source, and the reflected light is reflected by the prism and guided to the camera 32, so that the camera 32 takes an image of the nozzle 6. The image data of the image captured by the camera 32 is stored in the memory (not shown) of the control device 22.

The moving device 18 moves the mounting head 16 and the image pickup device 30 between the component feeder 12 and the circuit board 2. As an example, the moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction, and the mounting head 16 and the imaging device 30 are fixed to the moving base 18a. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.

The nozzle accommodating portion 34 is arranged between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). The nozzle accommodating portion 34 can accommodate a plurality of nozzles 6, and transfers the nozzle 6 to and from the mounting head 16. The plurality of nozzles 6 are housed in the nozzle holder 36 attached to the nozzle housing portion 34. A plurality of types of nozzles 6 can be accommodated in the nozzle holder 36. The nozzle holder 36 is removable from the nozzle accommodating portion 34, and is removed from the nozzle accommodating portion 34, for example, when an operator replaces the nozzle 6 of the nozzle holder 36.

The nozzle holder 36 also houses the measuring member 44. The measuring member 44 is used to measure the film thickness of the flux in the storage portion 42 (described later) of the flux unit 40. The measuring member 44 has a shape that can be mounted on the mounting head 16 and can be accommodated in the nozzle holder 36. In this embodiment, the base end portion of the measuring member 44 has the same shape as the nozzle 6, and the tip end portion thereof has a rod shape so that the adhesion range of the flux can be discriminated. When the measuring member 44 is viewed from the imaging direction of the image pickup apparatus 30 with the measuring member 44 mounted on the mounting head 16, the outer shape of the measuring member 44 has a rectangular shape (see FIG. 5). Therefore, when the measuring member 44 mounted on the mounting head 16 is imaged by the imaging device 30, the measuring member 44 is imaged in a rectangular shape.

The board conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2. As an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

As shown in FIG. 2, the flux unit 40 can be installed in the feeder holding portion 14. The dimension of the flux unit 40 in the X direction is larger than the dimension of the component feeder 12 in the X direction. Therefore, the flux unit 40 is installed across the plurality of slots of the feeder holding portion 14. A storage unit 42 is provided on the upper surface of the flux unit 40. The storage unit 42 has a rectangular box shape when viewed in a plan view, and a viscous body is stored inside the storage unit 42. The viscous body is used by being attached to the electronic component 4 (for example, the electrode of the electronic component 4 or the like) when the electronic component 4 is mounted on the circuit board 2. The viscous body of this embodiment is a flux. The storage unit 42 is arranged on the substrate conveyor 20 side of the flux unit 40 (the tip side when the flux unit 40 is inserted to be installed in the feeder holding unit 14). The storage unit 42 is arranged at a position accessible to the mounting head 16. Therefore, an electrode installed on the lower side of the electronic component 4 (for example, the lower surface of the electronic component 4 or the lower side of the electronic component 4) in a state where the upper surface of the electronic component 4 is attracted by the nozzle 6 mounted on the mounting head 16. Etc.), the flux in the storage unit 42 can be attached.

The control device 22 is configured by using a computer including a memory and a CPU. The control device 22 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in FIG. 3, the control device 22 is connected to the mobile device 18, the substrate conveyor 20, the image pickup device 30, and the touch panel 24, and controls each part of the mobile device 18, the board conveyor 20, the image pickup device 30, and the touch panel 24. is doing. The touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.

Next, a process of measuring the film thickness (depth) of the flux stored in the storage unit 42 using the measuring member 44 will be described. The process of measuring the film thickness of the flux stored in the storage unit 42 is performed, for example, before executing the process of mounting the electronic component 4 on the circuit board 2. By performing the following processing, the film thickness of the flux stored in the storage unit 42 can be accurately specified. When the flux is adhered to the electronic component 4, the control device 22 controls the position of the electronic component 4 with respect to the storage unit 42 based on the measured value of the film thickness of the flux, whereby the flux is appropriately applied to the electronic component 4. Can be attached.

As shown in FIG. 4, first, the control device 22 mounts the measuring member 44 on the mounting head 16 (S12). Specifically, the control device 22 moves the moving base 18a so that the mounting head 16 is arranged above the measuring member 44 in the nozzle holder 36. Then, the control device 22 moves the mounting head 16 downward, and mounts the measuring member 44 on the mounting head 16 in the same procedure as when mounting the nozzle 6.

Next, the control device 22 immerses the measuring member 44 in the storage unit 42 (S14). Specifically, the control device 22 moves the moving base 18a so that the measuring member 44 is located above the storage unit 42 in a state where the measuring member 44 is mounted on the mounting head 16. Then, the control device 22 moves the mounting head 16 downward and immerses the measuring member 44 in the flux in the storage unit 42. At this time, the control device 22 is moved so that the measuring member 44 is located above the position where the flux is attached to the electronic component 4 (hereinafter, also referred to as the attachment position) in the storage unit 42, and the attachment position is set to the position. The measuring member 44 is immersed in the same position. Here, "the same position as the attachment position" means that when the storage unit 42 is viewed in a plan view, the range (position) in the storage unit 42 to which the electronic component 4 is attached and the position where the measuring member 44 is immersed are defined. It means that they overlap. The position where the measuring member 44 is immersed may be at least partially overlapped with the position (range) in the storage portion 42 where the electronic component 4 is immersed. As a result, the measuring member 44 is immersed in the same position as the attachment position of the electronic component 4 (that is, a position overlapping the position in the storage portion 42 in which the electronic component 4 is immersed). Further, in this embodiment, the control device 22 immerses the measuring member 44 so that the measuring member 44 comes into contact with the bottom of the storage portion 42.

Next, the control device 22 takes an image of the measuring member 44 with the image pickup device 30 (S16). Specifically, the control device 22 moves the mounting head 16 upward and takes out the measuring member 44 immersed in the storage unit 42 from the storage unit 42. Then, the control device 22 takes an image of the measuring member 44 with the image pickup device 30. As shown in FIG. 1, the mounting head 16 and the image pickup device 30 are installed on the moving base 18a, and the image pickup device 30 moves integrally with the mounting head 16. Therefore, even if the mounting head 16 moves, the position of the measuring member 44 with respect to the image pickup apparatus 30 does not change. When the tip of the measuring member 44 is imaged by using the image pickup device 30 with the measuring member 44 mounted on the mounting head 16, the region of the measuring member 44 facing the image pickup device 30 is imaged from the side.

Next, the control device 22 calculates the length of the flux adhering to the measuring member 44 in the height direction from the captured image (S18). As shown in FIG. 5, in the measuring member 44, the portion to which the flux is attached is imaged in a different mode (for example, different luminance) from the portion to which the flux is not attached. The control device 22 specifies the number of pixels in the height direction of the portion to which the flux is attached in the captured image. For example, the control device 22 detects whether or not flux is attached to each pixel on the line (center line) in the height direction passing through the center of the captured image, and specifies the number of pixels to which flux is attached. do. As a result, the length d of the flux adhering to the measuring member 44 in the height direction is calculated. In this embodiment, the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42. Therefore, the calculated length d in the height direction of the flux coincides with the film thickness (depth) in the reservoir 42 at the adhesion position.

In this embodiment, the measuring member 44 is immersed in the flux in the storage unit 42 with the flux unit 40 installed in the feeder holding unit 14. Conventionally, when measuring the film thickness of the flux in the storage unit 42, the flux unit 40 may be measured in a state of being pulled out of the component mounting machine 10 by an operator. In this embodiment, since the measuring member 44 is immersed in the flux with the flux unit 40 installed in the feeder holding portion 14, the film thickness of the flux in the storage portion 42 can be automatically measured. Further, since it is not necessary to move the flux unit 40 from the feeder holding unit 14 in order to measure the film thickness of the flux in the storage unit 42, the film thickness of the flux in the storage unit 42 can be measured more accurately. .. Further, in this embodiment, the measuring member 44 is immersed in the same position as the immersion position (adhesion position) when the flux is adhered to the electronic component 4. The surface of the storage portion 42 has substantially the same film thickness, but the film thickness may differ slightly depending on the position in the storage portion 42. By immersing the measuring member 44 in the flux at the attachment position, the film thickness of the flux at the position where the flux is attached to the electronic component 4 (adhesion position) can be measured.

Further, in this embodiment, the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16 to which the measuring member 44 is mounted. For example, when the measuring member 44 is imaged by an image pickup device fixedly installed in the component mounting machine 10, it is necessary to move the measuring member 44 (that is, the mounting head 16) in order to image the measuring member 44. Occurs. In this embodiment, since the measuring member 44 is imaged by the image pickup device 30 installed so as to move integrally with the mounting head 16, the measuring member 44 (that is, the mounting head 16) is used to image the measuring member 44. The measuring member 44 can be efficiently imaged without moving the measuring member 44.

In this embodiment, the measuring member 44 is immersed so as to be in contact with the bottom of the storage portion 42, but the configuration is not limited to this. For example, if the measuring member 44 is immersed in the flux in the storage section 42, the measuring member 44 does not have to come into contact with the bottom portion of the storage section 42. In this case, the control device 22 controls how much position (height) the tip of the measuring member 44 is lowered (moved) with respect to the bottom of the storage portion 42. Therefore, the control device 22 determines the film thickness of the flux in the storage unit 42 based on the length of the flux adhering to the measurement member 44 in the height direction and the distance of the tip of the measurement member 44 to the bottom of the storage unit 42. (Depth) can be specified. That is, the control device 22 adds the length d of the flux adhering to the measuring member 44 in the height direction and the length between the lower end of the measuring member 44 and the bottom of the storage portion 42 to store the storage unit. The film thickness of the flux in 42 can be specified.

In this embodiment, the film thickness of the flux in the storage unit 42 included in the component mounting machine 10 can be measured, but the configuration is not limited to this. As long as it is a substrate working machine provided with a storage portion for storing the viscous body, the same configuration as in this embodiment can be adopted. A configuration similar to the example may be provided.

The points to keep in mind regarding the board working machine described in the examples will be described. The component mounting machine 10 of the embodiment is an example of a "board working machine", the electronic component 4 is an example of a "component", the mounting head 16 is an example of a "head", and the control device 22 is an example. This is an example of a "specific part".

Although specific examples of the disclosed techniques have been described in detail in the present specification, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples exemplified above. Further, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in this specification or drawings achieve a plurality of purposes at the same time, and achieving one of the purposes itself has technical usefulness.

Claims

It is a board work machine that executes work on the board.
A storage unit that stores the viscous body attached to the parts,
A measuring member used for measuring the depth of the viscous body stored in the storage portion, and a measuring member.
A head to which the measuring member is detachably attached and
An image pickup device that is installed so as to move integrally with the head and images the measuring member mounted on the head, and an image pickup device.
When the measuring member adsorbed on the head is immersed in the storage portion, a specific portion for specifying the depth of the viscous body in the reservoir from the image captured by the measuring member captured by the imaging device, and a specific portion. Equipped with a board working machine.
The image pickup device captures the measurement member from the side and obtains an image.
The substrate working machine according to claim 1, wherein the specific unit detects a range of the viscous body attached to the measuring member from the captured image to specify the depth of the viscous body in the storage unit.
The viscous body is set so that the viscous body adheres to the component by immersing the component in a predetermined position of the storage portion.
The substrate working machine according to claim 1 or 2, wherein the position where the measuring member is immersed is the predetermined position of the storage portion.
It is a method of measuring the depth of the viscous body in the storage part for storing the viscous body to be attached to the component.
The dipping step of immersing the measuring member in the reservoir and
A measuring method comprising a measuring step of measuring the length in the height direction of the viscous body adhering to the side of the measuring member immersed in the reservoir in the dipping step.