JP7113169B2 - bonding equipment - Google Patents

Description

The present invention relates to a bonding apparatus that holds a chip by a bonding tool and bonds it to a substrate.

2. Description of the Related Art In the process of manufacturing a semiconductor device, a bonding process is performed in which a semiconductor chip (hereinafter simply abbreviated as "chip") is bonded to a substrate by ultrasonic bonding or the like. Since bonding requires high positional accuracy, a method of correcting positional errors during bonding by image recognition is widely used. When the chip to be bonded is a flip chip having connection bumps on the bottom surface, there is known a technique of simultaneously capturing images of both the top surface of the substrate and the bottom surface of the chip prior to bonding to correct the position. (For example, Patent Document 1).

In the prior art shown in this patent document example, an electrode position observation mechanism for simultaneously observing connection electrodes provided on a chip and a carrier tape facing each other just before bonding in a flip chip bonder used for manufacturing a semiconductor device. is provided. In this electrode position observation mechanism, a retractable prism type mirror is advanced between the chip and the carrier tape, and the images reflected on the two reflecting surfaces of the prism type mirror are captured by the camera.

JP-A-2001-176934

However, the prior art disclosed in the above-mentioned patent document example has the following problems in achieving high productivity while ensuring high positional accuracy. That is, in order to improve the productivity of the bonding apparatus, it is required to reduce the lifting height of the bonding tool in each bonding operation to shorten the tact time. However, in the electrode position observation mechanism described above, it is necessary to advance the prism type mirror between the chip held by the bonding tool and the carrier tape. Constrained by dimensions. For this reason, it is difficult to shorten the takt time by reducing the lifting height of the bonding tool in each bonding operation, resulting in hindrance to improvement of productivity. As described above, the conventional bonding apparatus has a problem that it is difficult to achieve high productivity while ensuring high positional accuracy.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a bonding apparatus capable of achieving high productivity while ensuring high positional accuracy.

In the bonding apparatus of the present invention, a bonding tool holds a chip, lowers the bonding tool in the direction of a stage on which a substrate is placed so as to face the chip, and bonds the chip to a bonding position of the substrate. In the bonding apparatus, an image of the chip is caused to enter from a first incident port facing the chip when positioned between the substrate and the chip located above the bonding position, and the first incident port faces the chip. The image of the bonding position of the substrate is incident from a second entrance facing the bonding position and horizontally from the second entrance. a movable prism that emits light upward from a second exit port spaced apart by a distance; a first imaging means that captures an image of the chip that exits from the first exit port; a second imaging means for imaging the image of the bonding position obtained by the bonding; based on the image of the chip captured by the first imaging means and the image of the bonding position captured by the second imaging means, detection means for detecting relative positional deviation between the chip and the bonding position; alignment means for relatively moving the bonding tool and the stage based on the positional deviation detected by the detection means ; moving means for advancing and retreating the movable prism in a space between the chip and the substrate located above the bonding position without moving the first imaging means and the second imaging means. .

In the bonding apparatus of the present invention, a bonding tool holds a chip, lowers the bonding tool in the direction of a stage on which a substrate is placed so as to face the chip, and bonds the chip to a bonding position of the substrate. In a bonding apparatus, an image of the chip is made to enter from a first incident port facing the chip when positioned between the chip and the substrate located above the bonding position, and the first incident port faces the chip. , and the image of the bonding position of the substrate is incident from a second entrance facing the bonding position from the first entrance in the horizontal direction. a movable prism that emits light upward from a second exit port that is spaced apart by a distance; , a second imaging means for imaging a second partial image corresponding to the first partial image of the image of the bonding position emitted from the second outlet; a third imaging means for capturing a third partial image which is a part of the image of the chip emitted from the mouth different from the first partial image; and the bonding emitted from the second exit opening. fourth imaging means for imaging a fourth partial image that is a part of the position image corresponding to the third partial image; and the first partial image and the The second partial image captured by the second imaging means, the third partial image captured by the third imaging means, and the fourth partial image captured by the fourth imaging means detecting means for detecting a relative positional deviation between the chip and the bonding position based on the above; and alignment means for relatively moving the bonding tool and the stage based on the positional deviation detected by the detecting means. and moving means for moving the movable prism back and forth in the space between the chip positioned above the bonding position and the substrate.

According to the present invention, it is possible to achieve high productivity while ensuring high positional accuracy in a bonding apparatus.

1 is a perspective view of a bonding apparatus according to one embodiment of the present invention; FIG. 1 is a side view of a bonding apparatus according to one embodiment of the present invention; FIG. 1 is a front view of a bonding apparatus according to one embodiment of the present invention; FIG. FIG. 2 is a bottom view of an imaging unit installed in a bonding apparatus according to one embodiment of the present invention; FIG. 2 is a cross-sectional view of an imaging unit installed in a bonding apparatus according to one embodiment of the present invention; FIG. 2 is an operation explanatory diagram of the bonding apparatus according to one embodiment of the present invention; FIG. 1 is a perspective view showing the configuration of a movable light guide in a bonding apparatus according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of an imaging unit used for imaging a chip and a bonding position by a bonding apparatus according to an embodiment of the present invention and an acquired imaging field of view; FIG. 2 is an explanatory diagram of an image acquisition path in imaging a chip and a bonding position by a bonding apparatus according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of an optical head of a bonding apparatus according to an embodiment of the present invention; FIG. 2 is a configuration explanatory diagram of an upper illumination section and a lower illumination section provided on a movable light guide in a bonding apparatus according to an embodiment of the present invention; FIG. 2 is a cross-sectional view of a movable optical unit in a bonding apparatus according to an embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a bonding apparatus according to an embodiment of the present invention; FIG.

Embodiments of the present invention will now be described with reference to the drawings. First, referring to FIGS. 1, 2 and 3, the configuration of a bonding apparatus 1 having a function of bonding a chip such as a semiconductor chip to a bonding position of a substrate will be described. In FIG. 1, the bonding apparatus 1 includes a chip supply section 2, a substrate holding section 3, a bonding mechanism 4, and a control section 5 for controlling these sections.

The chip supply unit 2 has a function of supplying chips, which are components to be bonded. As shown in FIG. 2, the chip supply section 2 has a supply stage 11 arranged on the upper surface of the first XY table 10 . A wafer sheet 13 is held in a stretched state on the upper surface of the supply stage 11, and chips 14 in a state of being divided into individual pieces are placed on the upper surface of the wafer sheet 13 with the active surface on which bumps are formed facing upward. affixed with By driving the first XY table 10, the supply stage 11 moves in the X and Y directions, and any chip 14 to be taken out can be positioned at the takeout position [P1].

As shown in FIG. 1, the pickup head 15 is coupled to the tip of an arm portion extending from the pickup head driving portion 16 . By driving the pickup head drive unit 16, the pickup head 15 moves between a pick-up position [P1] for the chips 14 above the supply stage 11 and a pick-up position [P2] for delivery to the bonding mechanism 4. In picking up the chips 14 , the chips 14 to be picked up are separated from the wafer sheet 13 by operating the ejector 12 arranged on the lower surface side of the wafer sheet 13 . The peeled chip 14 is held by a pickup head 15 with its active surface facing upward.

The pickup head 15 holding the chip 14 at the take-out position [P1] rises and moves to the pickup position [P2] by the bonding head 26 of the bonding mechanism 4 (arrow c). By turning the pickup head 15 upside down (arrow d) during this movement, the pickup head 15 holds the chip 14 at the pickup position [P2] with the active surface facing downward. The pickup head 15 and the pickup head drive section 16 constitute a chip transfer section 17 that transfers the chip 14 picked up from the chip supply section 2 at the pickup position [P1] to the pickup position [P2] by the optical head 30 .

Next, the structure of the board|substrate holding|maintenance part 3 is demonstrated. As shown in FIGS. 1 and 2, a substrate holding stage 21 holding a substrate 22 to be bonded is arranged on the upper surface of the second XY table 20 . By driving the second XY table 20, the substrate holding stage 21 moves in the X and Y directions. Thereby, the bonding position 22a (see FIG. 6) set on the substrate 22 can be positioned at the working position [P3]. The bonding tool 29 of the bonding mechanism 4 described below bonds the chip 14 to the bonding position 22a positioned at the working position [P3] in this manner.

A configuration of the bonding mechanism 4 will be described. As shown in FIGS. 1 and 2, a Y-axis frame 23 is arranged horizontally in the Y direction above the chip supply section 2 and the substrate holding section 3 . A linear motor 24 having two rows of guide rails 25 is arranged along the side of the Y-axis frame 23 . The guide rail 25 extends horizontally above the substrate holding stage 21 (stage). A first moving base 26a is attached to the guide rail 25 so as to be movable along the guide rail 25 via a slider 25a (FIG. 3). Further, the guide rail 25 is equipped with a second moving base 30a that can move along the guide rail 25 independently of the first moving base 26a.

A bonding head 26 is mounted on the first moving base 26a. The bonding head 26 has a configuration in which a bonding tool 29 is held by a bonding tool holding section 28 driven by a bonding tool driving section 27 . By driving the bonding tool driver 27 while the bonding tool 29 holds the chip 14, the bonding tool 29 descends and bonds the held chip 14 to the bonding position 22a of the substrate 22 (see FIG. 6). That is, in the bonding apparatus 1 shown in this embodiment, the bonding tool 29 holds the chip 14, and the bonding tool 29 is lowered in the direction of the substrate holding stage 21 on which the substrate 22 is placed so as to face the chip 14. , the work of bonding the chip 14 to the bonding position 22a of the substrate 22 is performed.

A light source box 31 is attached to the second moving base 30a. As shown in FIG. 2, a movable optical unit 32 incorporating a movable prism 32a (see FIG. 7), which is a movable light guide, is coupled to an arm portion 31a extending downward from the lower portion of the light source box 31. . Here, the arm portion 31a is bent toward the bonding head 26 side, and the movable prism 32a is offset from the center of the optical head 30 toward the bonding head 26 side.

By driving the linear motor 24, the first moving base 26a and the second moving base 30a move along the guide rails 25, thereby moving the bonding head 26 and the optical head 30 in the Y direction. Therefore, the linear motor 24 and the guide rail 25 serve as moving means for moving the bonding head 26 and the optical head 30 .

That is, this moving means moves the bonding head 26 between a pickup position [P2] where the bonding tool 29 picks up the chip 14 and a working position [P3] where the chip 14 is bonded, and a movable prism 32a is built in. The optical head 30 is moved to move the optical unit 32 into and out of the working position [P3].

By moving the optical head 30, the movable prism 32a, which is a movable light guide built in the movable optical unit 32, is moved into and out of the space between the chip 14 positioned above the bonding position 22a and the substrate 22. have a function. By configuring the bonding head 26 and the optical head 30 to operate by the same moving means in this way, it is possible to simplify the mechanism of the bonding apparatus and reduce the equipment cost.

As shown in FIG. 3, on the lower surfaces of the Y-axis frame 23 and the linear motor 24, the imaging unit 34 shown in FIG. It is mounted movably in the Y direction. The image pickup unit 34 has four image pickup sections each having a camera. 8 and 9, an upper left prism 45 (first light guide), an upper right prism 46 (third light guide), and a lower left prism 47 (second light guide). light guide) and a lower right prism 48 (fourth light guide). In this embodiment, by combining the imaging unit 34 with the movable optical unit 32 and the movable optical unit 32 that moves forward and backward between the chip 14 and the substrate 22, the imaging unit 34 can image the chip 14 and the substrate 22. I have to.

As shown in FIGS. 2 and 3, a pair of spotlights 36 are arranged above the Y-axis frame 23 so as to sandwich the work position [P3] from both sides. The spot illumination 36 is held at the tip of a holding bracket 36a extending from the Y-axis frame 23, and arranged with the irradiation direction directed toward the movable optical unit 32 located at the working position [P3]. The illumination light emitted from the spot illumination 36 is incident on the movable prism 32a in the movable optical unit 32, and is applied to the bonding position 22a of the substrate 22 (see FIG. 12). That is, the spot illumination 36 serves as illumination means for irradiating the substrate 22 with illumination light from above.

Next, with reference to FIGS. 4 and 5, the structure of the imaging unit 34 and the imaging unit moving mechanism 35 for moving the imaging unit 34 will be described. 4 shows the bottom surface of the imaging unit 34 shown in FIG. 3, and FIG. 5 shows the AA cross section in FIG. A base portion 35a shown in FIG. 4 is a rectangular base plate, and is attached to the lower surfaces of the Y-axis frame 23 and the linear motor 24 (see FIG. 3). That is, in this embodiment, the first imaging means and the second imaging means (see the description in FIG. 8) constituting the imaging unit 34 are moved by linear motors, which are moving means for moving the bonding head 26 and the optical head 30. 24 or the lower surface of the Y-axis frame 23 that supports this moving means.

The configuration of the imaging unit moving mechanism 35 will be described. A slider 37a fixed to a substantially rectangular X-direction moving table 35X is slidably fitted to a pair of guide rails 37 arranged in the X-direction at both ends of the base portion 35a in the Y-direction. An X-axis nut member 39X is arranged on an extension provided at one end of the X-direction moving table 35X in the Y direction. A feed screw 39Xa that is rotationally driven by the imaging unit X-axis motor 34X is screwed into the X-axis nut member 39X. By driving the imaging unit X-axis motor 34X forward and backward, the X-direction moving table 35X reciprocates in the X-direction. The imaging unit X-axis motor 34X, the X-axis nut member 39X, and the feed screw 39Xa constitute a first moving mechanism included in the imaging unit moving mechanism 35. As shown in FIG.

A plurality of sliders 38a fixed to a first Y-direction moving table 35Y1 and a second Y-direction moving table 35Y2 are slidably fitted to a pair of guide rails 38 arranged on the X-direction moving table 35X. In each of the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, a first Y-axis nut member 39Y1 and a second Y-axis nut member 39Y2 are attached to extension portions provided at one end in the X direction. are placed. A feed screw 39Ya rotationally driven by the imaging unit Y-axis motor 34Y is screwed into the first Y-axis nut member 39Y1 and the second Y-axis nut member 39Y2.

Here, the feed groove formed in the feed screw 39Ya has opposite pitch directions between the range where it is screwed with the first Y-axis nut member 39Y1 and the range where it is screwed with the second Y-axis nut member 39Y2. By driving the imaging unit Y-axis motor 34Y forward and backward, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 move toward or away from each other in the Y direction. The imaging unit Y-axis motor 34Y, the first Y-axis nut member 39Y1, the second Y-axis nut member 39Y2, and the feed screw 39Ya constitute a second moving mechanism included in the imaging unit moving mechanism 35. FIG.

In the above configuration, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 are fixed to the X-direction moving table 35X. The direction moving table 35Y1 and the second Y-direction moving table 35Y2 move in the same direction by the same distance. Further, by driving the above-described second moving mechanism, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 can be moved in opposite directions by the same distance.

On the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, an upper left imaging section 41 (first imaging section), an upper right imaging section 43 (third imaging section) and a lower A left imaging section 42 (second imaging section) and a lower right imaging section 44 (fourth imaging section) are arranged in the X direction.

Here, the configuration of the imaging section that constitutes the imaging unit 34 will be described. These imaging units are configured such that an incident part and a camera are attached to both ends of a cylindrical lens barrel, and a coaxial illumination is arranged on a side surface of the lens tube located between the incident part and the camera. In this configuration, the elephant of the object to be imaged enters the entrance portion in the vertical direction, passes through the lens barrel portion in the horizontal direction, and enters the camera, whereby an image of the object to be imaged is acquired. At this time, the illumination light from the coaxial illumination is emitted by the half mirror along the imaging optical axis in the direction toward the imaging target, and enters the imaging target from the coaxial direction.

Specifically, the upper left imaging unit 41 as the first imaging unit has an upper left barrel unit 41a, an upper left coaxial illumination unit 41b, an upper left camera 41c as a first camera, and an upper left incidence unit 41d. The upper right imaging section 43, which is the third imaging section, has an upper right lens barrel section 43a, an upper right coaxial illumination 43b, an upper right camera 43c, which is a third camera, and an upper right incidence section 43d. ing. Similarly, the lower left imaging section 42, which is the second imaging section, has a lower left barrel section 42a, a lower left coaxial illumination section 42b, a lower left camera 42c, which is a second camera, and a lower left incidence section 42d. The lower right imaging section 44 has a lens barrel section 44a, a lower right coaxial illumination section 44b, a lower right camera 44c as a fourth camera, and a lower right incident section 44d.

As shown in the example of the upper left imaging section 41 and the upper right imaging section 43 in FIG. 5, the upper left lens barrel section 41a and the upper right lens barrel section 43a are attached to a holding bracket coupled to the lower surface of the first Y-direction moving table 35Y1. 41e and 43e. A fixed optical unit 33 fixed to a base portion 35a is positioned above the upper left incidence portion 41d and the upper right incidence portion 43d. The fixed optical unit 33 has a configuration in which an upper left prism 45, an upper right prism 46, a lower left prism 47, and a lower right prism 48 are built in the housing portion 33a. The upper left prism 45, the upper right prism 46, the lower left prism 47, and the lower right prism 48 internally reflect the images incident from the entrance edges 45a, 46a, 47a, and 48a to form the exit edges 45b, 46b, 47b, It has a function of emitting downward from 48b (see FIG. 8).

The fixed optical unit 33 divides the two upper and lower field-of-view images of the chip 14 and the bonding position 22a captured by the movable optical unit 32, which will be described below, into two left and right chip images and two left and right bonding position images, and divides them into the above four images. It has a function to transmit to one imaging unit. That is, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are located below the output edge portions 45b, 47b, 46b, and 48b shown in FIG. The left imaging section 41, the lower left imaging section 42, the upper right imaging section 43, and the lower right imaging section 44 are aligned. This alignment is performed using the function of the imaging unit moving mechanism 35 described above.

That is, the imaging section moving mechanism 35, which is imaging section moving means, includes an upper left imaging section 41 (first imaging section), a lower left imaging section 42 (second imaging section), and an upper right imaging section 43 (third imaging section). The upper left prism 45 (first light guide), the lower left prism 47 (second light guide), and the upper right prism 46 ( third light guide) and the lower right prism 48 (fourth light guide). As a result, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are aligned with the output edge portions 45b, 47b, 46b, and 48b.

FIG. 6 shows the recognition of the upper and lower two directions in the bonding operation performed by the bonding apparatus 1 and the subsequent bonding operation. That is, prior to the bonding operation, the bonding tool 29 holding the chip 14 is positioned above the bonding position 22a, and the movable optical unit is positioned between the bonding position 22a and the chip 14, as shown in FIG. 6(a). 32 advance.

Here, since the movable optical unit 32 is offset toward the bonding head 26 with respect to the center of the optical head 30, the bonding position 22a can be moved without interference between the optical head 30 and the bonding head 26. and the chip 14, the movable optical unit 32 can be positioned. Imaging and position recognition of the chip 14 and the bonding position 22a by the imaging unit 34 are performed in this state. The image of the chip 14 and the bonding position 22a that has entered the movable optical unit 32 enters the imaging unit 34 via the fixed optical unit 33 fixed above (see FIG. 8).

After imaging and recognizing the position of one chip 14, the optical head 30 is moved in the retraction direction (arrow e) as shown in FIG. 6(b). As a result, the movable optical unit 32 is retracted from between the bonding position 22a and the chip 14 (arrow f), and the space between the bonding position 22a and the chip 14 becomes free. In this state, the bonding tool driver 27 is driven to lower the bonding tool 29 (arrow g), so that the bonding head 26 bonds the chip 14 held by the bonding tool 29 to the bonding position 22a of the substrate 22 .

At this time, the positioning of the chip 14 with respect to the bonding position 22a is performed by reflecting the position recognition result described above. In this position recognition, immediately before mounting the chip 14, the chip 14 and the bonding position 22a are simultaneously imaged to detect their relative positional deviation. As a result, it becomes possible to detect the positional deviation state with high accuracy, and it is possible to ensure a highly accurate bonding result.

Next, referring to FIG. 7, the configuration and function of the movable prism 32a built in the movable optical unit 32 will be described. As described above, the movable optical unit 32 can move freely between the chip 14 and the substrate 22 . When the movable prism 32a is positioned between the chip 14 positioned above the bonding position 22a of the substrate 22 and the substrate 22, the movable prism 32a transmits the image of the chip 14 and the image of the bonding position 22a to the fixed optical unit 33 positioned above. It has the function of transmitting.

In FIG. 7, the movable prism 32a is a multifaceted reflecting prism made of a translucent member, and includes a pair of substantially rhomboidal first block 53 (first light guide) and second block 54 (second light guide). The main body is a prism body in which the acute-angled ends of the light guides are connected via a rectangular parallelepiped reflector 50 . The reflector 50 has a configuration in which the hypotenuse surfaces of a first light guide 51 and a second light guide 52 in the shape of a right-angled triangular prism are joined together. It functions as the first reflecting surface 71 and the fifth reflecting surface 75). The hypotenuse surfaces provided at the left and right ends of the first block 53 and the second block 54 are reflecting surfaces (the second reflecting surface 72, the third reflecting surface 73, the sixth reflecting surface) that reflect the light inside the members. 76, functioning as a seventh reflecting surface 77).

The upper surface of the first light guide 51 and the lower surface of the second light guide 52 are respectively a first light entrance 61 and a second light entrance 62 through which an image of an imaging target is incident. When the movable prism 32 a is positioned between the chip 14 and the substrate 22 , alignment is performed so that the reflector 50 is positioned between the chip 14 and the substrate 22 . In this state, the first entrance 61 and the second entrance 62 are positioned to face the bonding positions 22a (see FIG. 6) of the chip 14 and the substrate 22, respectively.

Right-angled triangular prism-shaped fifth and sixth light guides 55 and 56 are provided on the outer surfaces of the right end portions of the first block 53 and the second block 54, respectively. 1 block body 53 and the upper surface of the second block body 54 are flush with each other. The hypotenuse surfaces of the fifth light guide 55 and the sixth light guide 56 are reflecting surfaces (fourth reflecting surface 74, It functions as an eighth reflecting surface 78). The upper surfaces of the fifth light guide 55 and the sixth light guide 56 serve as a first exit port 63 and a second exit port 64 through which the reflected light is emitted. Here, the first exit port 63 and the second exit port 64 are provided at positions separated from the first entrance port 61 and the second entrance port 62 in the horizontal direction.

Further, a seventh light guide 57 and an eighth light guide 58 each having a right-angled triangular prism shape are provided on the outer surfaces of the left ends of the first block 53 and the second block 54, respectively. is flush with the lower surfaces of the first block 53 and the second block 54 . The seventh light guide 57 and the eighth light guide 58 have the function of guiding the illumination light emitted from the aforementioned spot illumination 36 to the bonding position 22a.

Details of the function of the movable prism 32a in imaging the chip 14 and the bonding position 22a will now be described. When the movable prism 32a is positioned between the chip 14 and the substrate 22, the image of the chip 14 is made to enter from the first incident port 61 facing the chip 14, and the image of the bonding position 22a is shifted to the bonding position 22a. The light is made incident from the opposing second incident port 62 .

Next, the image of the chip 14 incident from the first incident port 61 is reflected by the first reflecting surface 71 of the reflector 50 in the first horizontal direction (arrow h1). Along with this, the image of the bonding position 22a incident from the second incident port 62 is reflected by the fifth reflecting surface 75 of the reflector 50 in the second horizontal direction (arrow h2) opposite to the first horizontal direction. (See also FIG. 9(b)).

Next, the image of the chip 14 reflected in the first horizontal direction is sequentially reflected by a plurality of chip image reflecting surfaces (the second reflecting surface 72, the third reflecting surface 73, and the fourth reflecting surface 74) to form the first image. to the outlet 63 of the . Along with this, the image of the bonding position 22a reflected in the second horizontal direction is sequentially reflected by the plurality of substrate image reflecting surfaces (the sixth reflecting surface 76, the seventh reflecting surface 77, and the eighth reflecting surface 78) to form the second image. 2 exit port 64.

The plurality of chip image reflection surfaces provided on the first block body 53 are arranged directly below the first exit port 63 and serve as a first final mirror for reflecting the horizontally incident image of the chip 14 directly upward. Reflective surface (fourth reflective surface 74) and at least one first upright reflective surface (second reflective surface) that guides the image of chip 14 horizontally reflected by first reflective surface 71 to the first final reflective surface. It has a form including a surface 72 and a third reflecting surface 73).

The substrate image reflecting surface provided on the second block 54 is arranged directly below the second exit port 64, and serves as a second final reflection surface for reflecting the image of the horizontally incident bonding position 22a directly upward. Reflective surface (eighth reflective surface 78) and at least one second upright reflective surface (eighth reflective surface 78) and at least one second upright reflective surface (eighth reflective surface 78) that directs the image of bonding location 22a horizontally reflected by fifth reflective surface 75 to a second final reflective surface. It has a form including a reflecting surface 76 and a seventh reflecting surface 77).

In the movable prism 32a having the above configuration, the first block 53 and the second block 54, the first final reflection surface (fourth reflection surface 74) and the second final reflection surface (eighth reflection surface 78) , and the first upright reflective surface (second reflective surface 72, third reflective surface 73) and the second upright reflective surface (sixth reflective surface 76, seventh reflective surface 77) It is symmetrical with respect to a straight line (center line CL) passing through and orthogonal to the first horizontal direction (arrow h1) and the second horizontal direction (arrow h2) in the horizontal plane.

Summarizing the function of the movable prism 32a, the movable prism 32a moves the image of the chip 14 to the first position facing the chip 14 when positioned between the chip 14 positioned above the bonding position 22a and the substrate 22. , and is emitted upward from a first exit opening 63 horizontally spaced from the first entrance opening 61 . In addition, the movable prism 32a allows the image of the bonding position 22a of the substrate 22 to be incident from the second entrance 62 facing the bonding position 22a and from the second exit 64 horizontally spaced from the second entrance 62. It has the function of emitting upward.

In this way, as a movable light guide used for simultaneously recognizing two fields of view above and below by advancing and retreating between the chip 14 held by the bonding tool 29 and the bonding position 22a of the substrate 22, the present embodiment can be used. By using the movable prism 32a configured as shown, the following effects are obtained. First, since the movable prism 32a is configured by combining prisms such as the first block 53 and the second block 54, the thickness dimension of the overall shape of the movable optical unit 32 can be minimized and the weight can be reduced. weight reduction is possible.

Therefore, in the imaging operation shown in FIG. 6A, it is possible to set the waiting height for the bonding tool 29 holding the chip 14 to be as low as possible. As a result, in the bonding operation shown in FIG. 6B, it is possible to reduce the bonding operation stroke in which the bonding tool 29 moves up and down, thereby shortening the operation tact time. In addition, since the weight of the movable optical unit 32 is reduced, high-speed operation becomes possible and the operation tact time is further shortened.

In this embodiment, an example is shown in which the movable prism 32a using a multifaceted reflecting prism is used as the movable light guide, but the present invention is not limited to the movable prism 32a. That is, the movable light guide may be configured by incorporating a reflector such as a mirror or an optical element such as a lens, as long as the above-described functions can be realized.

Further, in this embodiment, a configuration is adopted in which the first exit port 63 and the second exit port 64 are arranged at positions separated from the first entrance port 61 and the second entrance port 62 in the horizontal direction. However, the invention is not limited to such configurations. That is, the image of the chip 14 and the image of the bonding position 22a captured from the first entrance 61 and the second entrance 62 are captured by the upper left imaging unit 41 (first imaging unit) and the lower left imaging unit 42 ( 2nd imaging section), upper right imaging section 43 (third imaging section), and lower right imaging section 44 (fourth imaging section). It suffices if the interface with the unit 34 is set.

Next, referring to FIGS. 8 and 9, the imaging field and imaging path when imaging the chip 14 and the bonding position 22a by the imaging unit 34 using the combination of the movable prism 32a and the fixed optical unit 33 having the above configuration. and explain. In FIG. 8, an upper left image UL and an upper right image UR shown above the reflector 50 of the movable prism 32a show images of the chip 14 to be imaged, and a lower left image DL shown below the reflector 50. , and a lower right image DR show an image of the bonding position 22a to be imaged. C1 to C11 indicated by a thick dashed line indicate an imaging path through which an image of the chip 14 is guided to the imaging unit 34, and B1 to B11 indicated by a thick dashed line indicate an image of the bonding position 22a. It shows the path of the imaging guided to the imaging unit 34 .

Here, the upper left image UL corresponds to a first partial image that is a part (left half) of the image of the chip 14, and the upper right image UR corresponds to a part that is different from the first partial image of the image of the chip 14. This corresponds to the third partial image, which is the part (right half). The lower left image DL corresponds to a second partial image (left half) corresponding to the first partial image of the image of the bonding position 22a, and the lower right image DR corresponds to the second partial image of the image of the bonding position 22a. This corresponds to the fourth partial image, which is a part (right half) corresponding to the partial image of No. 3. Here, "corresponding" means that the imaging fields of view when acquiring these partial images overlap vertically.

An upper left image UL and an upper right image UR of the chip 14 enter the first incident port 61 on the upper surface of the reflector 50 (path C1), are guided through the first block 53, and are guided through the fifth light guide. It is emitted upward from the first emission port 63 on the upper surface of 55 (path C5). The lower left image DL and the lower right image DR of the bonding position 22a enter the second entrance 62 on the lower surface of the reflector 50 (path B1), are guided through the second block 54, and are guided through the sixth light guide. It is emitted upward from the second outlet 64 on the upper surface of the body 56 (path B5).

As shown in FIG. 9A, in the first block 53, the image of the chip 14 (path C2) incident from the reflector 50 is incident on the second reflecting surface 72 and reflected in the X direction ( Path C3), and further enters the third reflecting surface 73 and is reflected in the Y direction (path C4). Next, the light is incident on the fourth reflecting surface 74 of the fifth light guide 55 and reflected upward (FIG. 9B) to reach the first exit port 63 . In the second block body 54, the image of the bonding position 22a (path B2) incident from the reflector 50 is incident on the sixth reflecting surface 76, reflected in the X direction (path B3), and further reflected by the seventh reflecting surface. 77 and reflected in the Y direction (path B4). Then, the light enters the eighth reflecting surface 78 of the sixth light guide 56 and is reflected upward (FIG. 9B) to reach the second exit port 64 .

Above the fifth light guide 55, the incident edge 45a of the upper left prism 45 and the incident edge 46a of the upper right prism 46 are located. 47 and the entrance edge 48a of the lower right prism 48 are located (see FIG. 8). Here, the upper left prism 45 and the upper right prism 46 have an incident edge portion 45a and an incident edge portion 46a which divide the first exit port 63 on the upper surface of the fifth light guide 55 into two in the left-right direction. are positioned above the left outlet 63L and the first right outlet 63R. In the lower left prism 47 and the lower right prism 48, the incident edge portion 47a and the incident edge portion 48a divide the second exit port 64 on the upper surface of the sixth light guide 56 into two in the left-right direction. They are arranged so as to be positioned above the left outlet 64L and the second right outlet 64R.

With such a configuration, four partial images obtained by dividing the image of the chip 14 and the image of the bonding position 22a into two left and right parts can be captured by the four imaging units constituting the imaging unit 34, respectively. there is That is, of the images of the chip 14 emitted from the first exit 63, the upper left image UL emitted from the first left exit 63L and the upper right image UR emitted from the first right exit 63R are: , the incident edge 45a of the upper left prism 45 and the incident edge 46a of the upper right prism 46 (paths C6 and C7).

Then, the upper left image UL and the upper right image UR incident on the incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46, respectively, are emitted from the upper left prism 45 and the upper right prism 46, respectively. The light 45b is reflected toward the output edge 46b (see paths C8 and C10 shown in FIG. 9), where it is reflected downward and enters the upper left imaging section 41 and upper right imaging section 43 (paths C9 and C11).

Among the images of the bonding position 22a emitted from the second exit port 64, the lower left image DL emitted from the second left exit port 64L and the lower right image DR emitted from the second right exit port 64R. are incident on the incident edge 47a of the lower left prism 47 and the incident edge 48a of the lower right prism 48, respectively (paths B6 and B7). Then, the lower left image DL and the lower right image DR incident on the incident edge portion 47a of the lower left prism 47 and the incident edge portion 48a of the lower right prism 48, respectively, are emitted from the lower left prism 47 and the lower right prism 48, respectively. 47b is reflected toward the output edge 48b (see paths B8 and B10 shown in FIG. 9), where it is reflected downward and enters the lower left imaging section 42 and the lower right imaging section 44 (paths B9 and B11).

In the above configuration, the upper left imaging unit 41 captures a first partial image (upper left image UL) that is a part of the image of the chip 14 emitted from the first exit port 63, and the lower left imaging unit 42 captures a second partial image (lower left image DL) that is a part of the image of the bonding position 22a emitted from the second outlet 64 corresponding to the first partial image (upper left image UL). Further, the upper right imaging unit 43 captures a third partial image (upper right image UL) which is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63 . UR), and the lower right imaging unit 44 captures a fourth image corresponding to the third partial image (upper right image UR) of the image of the bonding position 22a emitted from the second outlet 64. A partial image (DR) is captured.

More specifically, the fixed optical unit 33 included in the bonding apparatus 1 receives a first partial image (upper left image UL), which is a part of the image of the chip 14 emitted from the first exit port 63. A second partial image (lower left image DL), which is a part of the image of the bonding position 22a emitted from the second exit port 64, is incident on the first light guide (upper left prism 45) that causes the light to be emitted. The second light guide body (lower left prism 47) that causes the light to exit from the second light guide body (lower left prism 47) and the first partial image (upper left image UL) of the image of the chip 14 that is emitted from the first exit port 63 are different parts. A third light guide (upper right prism 46) into which a third partial image (upper right image UR) is incident and emitted, and a second portion of the image of the bonding position 22a emitted from the second outlet 64 A fourth light guide (lower right prism 48) for entering and emitting a fourth partial image (lower right image DR), which is a part different from the image (lower left image DL), is provided.

The upper left imaging unit 41 captures the first partial image (upper left image UL) emitted from the first light guide (upper left prism 45), and the lower left imaging unit 42 captures the second light guide. A second partial image (lower left image DL) emitted from the body (lower left prism 47) is captured. The upper right imaging unit 43 captures the third partial image (upper right image UR) emitted from the third light guide (upper right prism 46), and the lower right imaging unit 44 captures the fourth guide. A fourth partial image (lower right image DR) emitted from the light body (lower right prism 48) is captured.

In imaging the chip 14 and the bonding position 22a by the imaging unit 34 having the above configuration, it may be necessary to adjust the position of the imaging field of view depending on the shape and size of the chip 14 to be imaged and the bonding position 22a, the position of the recognition point, and the like. . In such a case, the imaging section moving mechanism 35 moves the upper left imaging section 41, lower left imaging section 42, upper right imaging section 43, and lower right imaging section 44 to upper left prism 45, lower left prism 47, and upper left imaging section 47. By moving it relative to the right prism 46 and the lower right prism 48, the position of the imaging field of each imaging unit is adjusted.

Here, as shown in FIG. 8, the field of view (upper left image UL) of the upper left imaging section 41 in the chip 14 and the field of view (lower left image DL) of the lower left imaging section 42 in the bonding position 22a are vertically overlapped. in a relationship. Similarly, the field of view (upper right image UR) of the upper right imaging section 43 in the chip 14 and the field of view (lower right image DR) of the lower right imaging section 44 in the bonding position 22a are vertically overlapped.

As described above, in the configuration of the imaging unit moving mechanism 35, the upper left imaging unit 41, the lower left imaging unit 42, the upper right imaging unit 43, and the lower right imaging unit 44 are moved in the X direction by the first moving mechanism. Move the same distance in the same direction. Then, the upper left imaging unit 41 and the upper right imaging unit 43 are moved in the same direction by the same distance by the second moving mechanism, and the lower left imaging unit 42 and the lower right imaging unit 44 are moved together with the upper left imaging unit 41. It can be moved by the same distance in the direction opposite to that of the upper right imaging section 43 .

By moving the upper-left imaging unit 41, the upper-right imaging unit 43, the lower-left imaging unit 42, and the lower-right imaging unit 44 under these conditions, the imaging unit moving mechanism 35 moves the field of view of the upper-left imaging unit 41 and the lower area. While maintaining the state in which the fields of view of the left imaging section 42 overlap and the state in which the fields of view of the upper right imaging section 43 and the fields of view of the lower right imaging section 44 overlap, the upper left imaging section 41, the lower left imaging section 42, and the upper right The imaging section 43 and the lower right imaging section 44 can be moved. As a result, it is possible to adjust the position of the imaging field of each imaging unit while maintaining the correct positional relationship between the four partial images that divide the two upper and lower imaging targets of the chip 14 and the bonding position 22a. ing.

Classifying the components used for imaging the chip 14 and the bonding position 22a described above for each imaging target, the first combination of the upper left prism 45 and the upper left imaging unit 41, or the upper right prism 46 and the upper right imaging. A third combination with the portion 43 constitutes first imaging means for capturing an image of the chip 14 emitted from the first emission port 63 of the movable prism 32a. A second combination of the lower left prism 47 and the lower left imaging section 42 or a fourth combination of the lower right prism 48 and the lower right imaging section 44 is emitted from the second outlet 64 of the movable prism 32a. This constitutes a second imaging means for imaging the image of the bonding position 22a.

In addition, in the first imaging means and the second imaging means, either one of the two combinations may be used, or both may be used. When only one combination is used, only a partial image on one side of the field of view is captured, such as when the first combination is used as the first imaging means and the second combination is used as the second imaging means. A case of taking an image is mentioned.

That is, when the object to be bonded is a small chip 14 and recognition at the time of bonding operation is sufficient for recognition of one point at the center of the chip, only the imaging section on one side is used. On the other hand, if the object to be bonded is a large-sized chip 14 and it is necessary to recognize two points such as the diagonal position of the chip in recognition during the bonding operation, both of the above two combinations are used. make it That is, both the chip 14 and the bonding position 22a are imaged by two imaging units. As described above, the bonding apparatus 1 according to the present embodiment is capable of handling various kinds of chips from small chips to large chips, and realizes a bonding apparatus excellent in versatility.

Based on the image of the chip 14 captured by the first imaging means and the image of the bonding position 22a captured by the second imaging means, the relative positional deviation between the chip 14 and the bonding position 22a is determined. , is detected by image recognition. This positional deviation detection by image recognition is executed by the processing function of the image recognition section 93 (FIG. 13) provided in the control section 5 . Therefore, the image recognition section 93 of the control section 5 serves as detection means for detecting relative positional deviation between the chip 14 and the bonding position 22a based on the image of the chip 14 and the image of the bonding position 22a.

The alignment processor 92 (FIG. 13) of the controller 5 controls the second XY table 20 based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detector in this manner. Thus, the bonding tool 29 holding the chip 14 and the substrate holding stage 21 holding the substrate 22 are moved relatively to perform an alignment process for aligning the chip 14 and the bonding position 22a. Therefore, the alignment processing section 92 of the control section 5 constitutes alignment means for relatively moving the bonding tool 29 and the substrate holding stage 21 .

A plurality of definitions are possible for the imaging means in the bonding apparatus 1, and the following definitions may be used. That is, the combination of the upper left prism 45 and the upper left imaging section 41 is used as the first partial image (upper left image UL) that is a part of the image of the chip 14 emitted from the first exit port 63 . 1, and the combination of the lower left prism 47 and the lower left imaging unit 42 is a first partial image (upper left image UL) of the image of the bonding position 22a emitted from the second outlet 64. is defined as a second imaging means for imaging a second partial image (lower left image DL) which is a part corresponding to .

Also, the combination of the upper right prism 46 and the upper right imaging unit 43 is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first outlet 63 . 3 (upper right image UR). is defined as fourth imaging means for capturing a fourth partial image (lower right image DR) that is a part corresponding to the third partial image (upper right image UR) of the image of .

Then, the first partial image (upper left image UL) captured by the first imaging means, the second partial image (lower left image DL) captured by the second imaging means, and the third Based on the third partial image (upper right image UR) captured by the imaging means and the fourth partial image (lower right image DR) captured by the fourth imaging means, the chip 14 and the bonding position A relative displacement of 22a is detected by the aforementioned detection means. Based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detecting means in this manner, the bonding tool 29 and the substrate holding stage 21 are relatively moved by the above-described alignment means. , an alignment process is performed to align the chip 14 and the bonding position 22a.

Next, referring to FIG. 10, the configuration of the optical head 30 will be described. In FIG. 10, a light source box 31 is attached to a second moving base 30a that moves along a guide rail 25 (see FIG. 2). The second moving base 30a moves in the Y direction by means of moving means described in FIG. The light source box 31 accommodates the upper light source 81 and the lower light source 82 that constitute the upper lighting section 85 and the lower lighting section 86 shown in FIG. 11 .

An upper optical fiber cable 83 and a lower optical fiber cable 84 configured by bundling a plurality of optical fibers extend from the upper light source 81 and the lower light source 82, respectively. The upper optical fiber cable 83 and the lower optical fiber cable 84 are connected to the movable optical unit 32 via the inside of the arm portion 31a. By operating the upper light source 81 and the lower light source 82 , illumination light is emitted inside the movable optical unit 32 via the upper optical fiber cable 83 and the lower optical fiber cable 84 .

FIG. 11 shows the movable prism 32a housed inside the movable optical unit 32 and the upper illumination section 85 and the lower illumination section 86 provided with the movable prism 32a. An upper illumination section 85 is provided on the upper surface side of the movable prism 32a, which is a movable light guide, and a lower illumination section 86 is provided on the lower surface side of the movable prism 32a. Both the upper illumination section 85 and the lower illumination section 86 are moved together with the movable prism 32a by the aforementioned moving means (linear motor 24 and guide rail 25). The upper illumination section 85 illuminates the chip 14 when the movable prism 32 a is positioned between the chip 14 and the substrate 22 . Further, the lower illumination section 86 illuminates the substrate 22 when the movable prism 32a is positioned between the chip 14 and the substrate 22. FIG.

The upper optical fiber cable 83 and the lower optical fiber cable 84 have their optical fibers unbound inside the movable optical unit 32 so that their terminal ends are flattened, and the end faces are linearly aligned in the irradiating portions 83a and 84a. to form An upper light source 81 and a lower light source 82 emit light from the open end surfaces of the optical fibers constituting the upper optical fiber cable 83 and the lower optical fiber cable 84, respectively. An upper light-emitting portion 83b and a lower light-emitting portion 84b irradiate the upper and lower surfaces of the reflector 50 with the illumination light guided by.

That is, the upper illumination section 85 has an upper light source 81 and an upper optical fiber cable 83 which is a bundle of a plurality of optical fibers and guides the light from the upper light source 81 to the chip 14, and the lower illumination section 86 includes the lower light source 82. and a lower optical fiber cable 84 which is a bundle of a plurality of optical fibers and guides the light from the lower light source 82 to the substrate 22 .

The end portion of the upper optical fiber cable 83 is formed flat so that the end faces of the plurality of optical fibers forming the upper optical fiber cable 83 surround the first entrance 61 on the upper surface of the reflector 50, and the irradiation portion 83a is formed. It has become. In addition, the end portion of the lower optical fiber cable 84 is formed flat so that the end faces of the plurality of optical fibers constituting the lower optical fiber cable 84 surround the second entrance 62 on the lower surface of the reflector 50, and the irradiating portion is formed. 84a.

On the outer surfaces of the first block 53 and the second block 54 forming the movable prism 32a, a seventh light guide 57 and a third light guide 57, which are triangular prism-shaped light guides, are provided at positions sandwiching the reflector 50, respectively. 8 light guides 58 extend outward and are provided integrally with the movable prism 32a. A seventh light guide 57 and an eighth light guide 58 provided with the movable prism 32a interposed therebetween are illumination means provided above the movable prism 32a when the movable prism 32a is positioned between the chip 14 and the substrate 22. It functions as a condensing section that guides the illumination light emitted downward from two different directions by the pair of spot illuminations 36 (see FIGS. 2 and 3) to the bonding position 22a of the substrate 22. FIG.

FIG. 12 shows the illumination state of the chip 14 and the substrate 22 when the movable optical unit 32 is positioned between the chip 14 and the substrate 22 held by the bonding tool 29 and the chip 14 and the substrate 22 are imaged. ing. First, by activating the spot illumination 36, the seventh light guide 57 and the eighth light guide 58 are illuminated from above on both sides of the movable optical unit 32 from two different obliquely upward directions. (Arrows i, j). The irradiated illumination light is condensed by the seventh light guide 57 and the eighth light guide 58 and enters the bonding position 22a on the upper surface of the substrate 22 to illuminate it.

By activating the upper illumination section 85 and the lower illumination section 86, the illumination light from the upper light source 81 and the lower light source 82 is emitted through the upper optical fiber cable 83 and the lower optical fiber cable 84 to the irradiation sections 83a and 84a. is guided to The illumination light is emitted from the upper light emitting portion 83b and the lower light emitting portion 84b to the chip 14 and the substrate 22, respectively, as indirect illumination light (arrow k, arrow m). Further, illumination light from a coaxial illumination provided in each imaging unit is applied to the imaging region.

That is, the illumination light from the coaxial illumination of the upper left imaging unit 41 and the upper right imaging unit 43 is incident on the first light guide 51 of the reflector 50 (arrow n), and the first reflecting surface 71 (see FIG. 7). is reflected upward by and enters the chip 14 in the coaxial direction (arrow o). Illumination light from the coaxial illumination of the lower left imaging unit 42 and the lower right imaging unit 44 is incident on the second light guide 52 of the reflector 50 (arrow p), and is reflected on the fifth reflecting surface 75 (see FIG. 7). is reflected downward by the substrate 22 and enters the substrate 22 from the same direction (arrow q).

As described above, in the bonding apparatus 1 of the present embodiment, the movable optical unit 32 containing the movable prism 32a having the configuration shown in FIG. The system is provided with a plurality of illumination means described below.

First, the chip 14 and the substrate 22 are irradiated with illumination light from the coaxial direction by the coaxial illumination provided in each imaging section of the imaging unit 34 . As indirect illumination for illuminating the chip 14 and the substrate 22 from the surroundings, an upper illumination section 85 and a lower illumination section 86 are provided, which are arranged above and below the movable prism 32a and emit illumination light guided by an optical fiber cable. ing. In addition, illumination light emitted downward by a pair of spot illuminations 36 provided above is converged by a seventh light guide 57 and an eighth light guide 58 to provide a bonding position on the upper surface of the substrate 22. 22a is illuminated. By providing a plurality of illumination means in this way, even if there is an obstacle such as a substrate holding member that interferes with normal illumination on the substrate 22 to be bonded, appropriate illumination conditions necessary for good imaging can be obtained. can satisfy

Next, referring to FIG. 13, the configuration of the control system will be described. 13, the control unit 5 includes a bonding operation control unit 91, an alignment processing unit 92, an image recognition unit 93, a visual field position setting unit 94, and a storage unit 95 as internal processing function units. The control unit 5 also includes a linear motor 24, a first XY table 10, a second XY table 20, a bonding head 26, a pickup head 15, an imaging unit X-axis motor 34X, an imaging unit Y-axis motor 34Y, and an upper left camera. 41c, lower left camera 42c, upper right camera 43c, lower right camera 44c, upper light source 81, lower light source 82, spot lighting 36, upper left coaxial lighting 41b, lower left coaxial lighting 42b, upper right coaxial lighting 43b, lower right A coaxial illumination 44b and a touch panel 96 are connected. The touch panel 96 displays a recognition screen by the image recognition unit 93, an operation screen for operation input to the control unit 5, data input, and the like.

The bonding operation control unit 91 controls the linear motor 24 , the first XY table 10 , the second XY table 20 , the bonding head 26 and the pickup head 15 to pick up the chip picked out from the chip supply unit 2 by the pickup head 15 . 14 to the substrate 22 by the bonding head 26 is controlled.

The image recognition unit 93 performs recognition processing on images obtained by imaging the chip 14 and the bonding position 22a with the upper left camera 41c, the lower left camera 42c, the upper right camera 43c, and the lower right camera 44c. Positional deviation from the bonding position 22a is detected. That is, the image recognition section 93 serves as detection means for detecting relative positional deviation between the chip 14 and the bonding position 22a. When images are captured by the upper left camera 41c, lower left camera 42c, upper right camera 43c, and lower right camera 44c, the illumination control function of the image recognition unit 93 controls the upper light source 81, lower light source 82, spot illumination 36, and upper left coaxial light. Lighting of the illumination 41b, the lower left coaxial illumination 42b, the upper right coaxial illumination 43b, and the lower right coaxial illumination 44b is controlled.

The visual field position setting section 94 moves the imaging unit 34 by controlling the driving of the imaging unit X-axis motor 34X and the imaging unit Y-axis motor 34Y. Thereby, the positions of the imaging fields of the upper left imaging unit 41, the lower left imaging unit 42, the upper right imaging unit 43, and the lower right imaging unit 44 are set according to the object to be imaged. The storage unit 95 stores bonding data used for controlling the bonding operation by the bonding operation control unit 91, recognition data used for recognition processing by the image recognition unit 93, and an imaging visual field used for setting the visual field position by the visual field position setting unit 94. Store data such as data.

As described above, in this embodiment, when the bonding apparatus 1 for bonding the chip 14 held by the bonding tool 29 to the bonding position 22a of the substrate 22 is advanced between the chip 14 and the substrate 22, the chip 14 and the image of the bonding position 22a are respectively incident from a first entrance port 61 and a second entrance port 62 and emitted upward from a first exit port 63 and a second exit port 64. An image pickup unit 34 that picks up an emitted image of the chip and an image of the bonding position with four image pickup units via a fixed optical unit 33 having four prisms that function as two-time reflecting mirrors. A movable prism 32a made of a thin multifaceted reflecting prism is used as the movable light guide. As a result, high productivity can be achieved while ensuring high positional accuracy in the bonding work.

Then, by the fixed optical unit 33, an upper left image UL and an upper right image UR of the chip 14 emitted from the first outlet 63, and a lower left image of the chip 14 at the bonding position 22a emitted from the second outlet 64. DL, lower right image DR is reflected downward by four prisms. In the configuration in which these reflected images are made incident on the four imaging sections of the imaging unit 34 to capture images, the four imaging sections are moved relative to the four prisms of the fixed optical unit 33 by the imaging section moving means. By doing so, the positions of the imaging fields of view of the four imaging units are adjusted. This makes it possible to target a wide variety of chips 14 having different sizes and positions of recognition points.

In the bonding mechanism 4 of the bonding apparatus 1 configured as described above, a bonding tool 29 is provided on a first moving base 26a and a second moving base 30a which are driven by a common linear motor 24 to move along a guide rail 25. A bonding head 26 and an optical head 30 with a movable optical unit 32 are mounted. With the optical head 30 moved to position the movable optical unit 32 between the chip 14 and the substrate 22, the imaging unit 34 captures an image of the chip 14 and an image of the bonding position 22a. This makes it possible to simplify the mechanism of the bonding apparatus and reduce the equipment cost.

The movable prism 32a provided in the movable optical unit 32 includes an upper illumination section that guides the illumination light from the upper light source to the illumination section 83a through the upper optical fiber cable 83 and emits the light from the upper light emitting section 83b to illuminate the chip 14. 85 and a lower illumination section 86 for guiding the illumination light from the lower light source to the illumination section 84a through the lower optical fiber cable 84 and emitting it from the lower light emitting section 84b to illuminate the bonding position 22a of the substrate 22. ing. With this configuration, it is possible to illuminate the chip 14 and the bonding position 22a under appropriate lighting conditions and perform highly accurate position recognition.

Furthermore, in the bonding apparatus 1 according to the present embodiment, the illumination light from the pair of spot illuminations 36 arranged on the Y-axis frame 23 of the bonding mechanism 4 is directed to the movable optical system positioned between the chip 14 and the substrate 22 . The unit 32 is irradiated, and the irradiated light is condensed by the seventh light guide 57 and the eighth light guide 58 provided on the side surface of the movable prism 32a and guided to the bonding position of the substrate 22. FIG. As a result, even if an interfering object exists on the substrate 22, the bonding position 22a of the substrate 22 can be illuminated under proper illumination conditions.

In addition, in the bonding apparatus 1 shown in the present embodiment, the pair of spotlights 36 are arranged on the Y-axis frame 23 , but they may be arranged on a member different from the Y-axis frame 23 .

INDUSTRIAL APPLICABILITY The bonding apparatus of the present invention has the effect of achieving high productivity while ensuring high positional accuracy, and is useful in the technical field of bonding chips to bonding positions on substrates.

1 bonding device 2 chip supply unit 3 substrate holding unit 4 bonding mechanism 14 chip 21 substrate holding stage 22 substrate 22a bonding position 24 linear motor 25 guide rail 26 bonding head 26a first movement base 29 bonding tool 30 optical head 30a second Moving base 31 Light source box 32 Movable optical unit 32a Movable prism 33 Fixed optical unit 34 Imaging unit 35 Imaging unit moving mechanism 36 Spot illumination 41 Upper left imaging unit 41c Upper left camera 42 Lower left imaging unit 42c Lower left camera 43 Upper right imaging unit 43c upper right camera 44 lower right imaging unit 44c lower right camera 45 upper left prism 46 upper right prism 47 lower left prism 48 lower right prism 50 reflector 53 first block 54 second block 61 first inlet 62 second entrance 63 first exit 64 second exit 81 upper light source 82 lower light source 83 upper optical fiber cable 84 lower optical fiber cable 85 upper lighting section 86 lower lighting section UL upper left image UR Upper right image DL Lower left image DR Lower right image [P1] Pick up position [P2] Pick up position [P3] Work position

Claims (8)

A bonding apparatus in which a bonding tool holds a chip and lowers the bonding tool in the direction of a stage on which a substrate is placed so as to face the chip to bond the chip to a bonding position of the substrate,
When positioned between the chip positioned above the bonding position and the substrate, an image of the chip is incident from a first incident port facing the chip and is horizontally directed from the first incident port. The image of the bonding position of the substrate is made to enter from a second entrance facing the bonding position, and a second entrance horizontally spaced from the second entrance. a movable prism that emits upward from the exit port of 2;
a first imaging means for imaging an image of the chip emitted from the first exit;
a second imaging means for imaging the image of the bonding position emitted from the second outlet;
Detection for detecting a relative positional deviation between the chip and the bonding position based on the image of the chip captured by the first imaging means and the image of the bonding position captured by the second imaging means. means and
alignment means for relatively moving the bonding tool and the stage based on the positional deviation detected by the detection means;
moving means for advancing and retracting the movable prism in a space between the chip and the substrate located above the bonding position without moving the first imaging means and the second imaging means ;
A bonding apparatus. The movable prism is
The image of the chip incident from the first incident port is reflected in a first horizontal direction, and the image of the bonding position incident from the second incident port is reflected in a second horizontal direction opposite to the first horizontal direction. a reflector that reflects in the horizontal direction of
a first block having a plurality of chip image reflecting surfaces for guiding the image of the chip reflected in the first horizontal direction to the first exit;
a second block having a plurality of substrate image reflecting surfaces for guiding the image of the bonding position reflected in the second horizontal direction to the second exit;
2. The bonding apparatus of claim 1, comprising: The first block body is
a first final reflection surface arranged directly below the first exit port for reflecting the image of the chip incident horizontally upwardly;
at least one first upright reflective surface directing the first horizontally reflected chip image to the first final reflective surface;
The second block body is
a second final reflection surface arranged directly below the second exit port for reflecting the horizontally incident image of the bonding position directly upward;
at least one second upright reflective surface directing the second horizontally reflected image of the bonding location to the second final reflective surface;
3. The bonding apparatus of claim 2, comprising: The first block and the second block are symmetrical with respect to a straight line passing through the center of the reflector and orthogonal to the first horizontal direction and the second horizontal direction in the horizontal plane. 4. The bonding apparatus of claim 3, wherein: A bonding apparatus in which a bonding tool holds a chip and lowers the bonding tool in the direction of a stage on which a substrate is placed so as to face the chip to bond the chip to a bonding position of the substrate,
When positioned between the chip positioned above the bonding position and the substrate, an image of the chip is incident from a first incident port facing the chip and is horizontally directed from the first incident port. The image of the bonding position of the substrate is made to enter from a second entrance facing the bonding position, and a second entrance horizontally spaced from the first entrance. a movable prism that emits upward from the exit port of 2;
a first imaging means for imaging a first partial image that is a part of the image of the chip emitted from the first exit;
a second imaging means for imaging a second partial image corresponding to the first partial image of the image of the bonding position emitted from the second outlet;
a third image pickup means for picking up a third partial image that is a part of the image of the chip emitted from the first exit opening, the third partial image being different from the first partial image;
a fourth imaging means for imaging a fourth partial image that is a part of the image of the bonding position emitted from the second outlet and corresponding to the third partial image;
the first partial image captured by the first imaging means, the second partial image captured by the second imaging means, and the third partial image captured by the third imaging means and detection means for detecting a relative displacement between the chip and the bonding position based on the fourth partial image captured by the fourth imaging means;
alignment means for relatively moving the bonding tool and the stage based on the positional deviation detected by the detection means;
moving means for advancing and retracting the movable prism in a space between the chip and the substrate located above the bonding position;
A bonding apparatus. The movable prism is
The image of the chip incident from the first incident port is reflected in a first horizontal direction, and the image of the bonding position incident from the second incident port is reflected in a second horizontal direction opposite to the first horizontal direction. a reflector that reflects in the horizontal direction of
a first block having a plurality of chip image reflecting surfaces for guiding the image of the chip reflected in the first horizontal direction to the first exit;
a second block having a plurality of substrate image reflecting surfaces for guiding the image of the bonding position reflected in the second horizontal direction to the second exit;
6. The bonding apparatus of claim 5, comprising: The first block body is
a first final reflection surface arranged directly below the first exit port for reflecting the image of the chip incident horizontally upwardly;
at least one first upright reflective surface directing the first horizontally reflected chip image to the first final reflective surface;
The second block body is
a second final reflection surface arranged directly below the second exit port for reflecting the horizontally incident image of the bonding position directly upward;
at least one second upright reflective surface directing the second horizontally reflected image of the bonding location to the second final reflective surface;
7. The bonding apparatus of claim 6, comprising: The first block and the second block are symmetrical with respect to a straight line passing through the center of the reflector and orthogonal to the first horizontal direction and the second horizontal direction in the horizontal plane. 8. The bonding apparatus of claim 7, wherein:

Images