JP6001361B2 - Electronic component mounting method, component mounting head, and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for improving the efficiency of mounting electronic components.

  2. Description of the Related Art Conventionally, in an electronic component mounting apparatus, a method and apparatus for recognizing an electronic component posture, suction failure, etc. before the electronic component supplied from the electronic component supply device is sucked by a suction nozzle of a mounting head and mounted on a circuit board There have been many reports.

  In the production of circuit boards, it is required to mount electronic components on the circuit board earlier in order to shorten the production time of the circuit board.

  Conventionally, an electronic component mounting head moves to an electronic component supply device, sucks the electronic component using a suction nozzle of the electronic component mounting head, and recognizes the posture of the sucked electronic component, thereby correctly positioning the electronic component. Is mounted on a circuit board. On the other hand, electronic components determined to have an inappropriate posture are discarded without being mounted.

  In Patent Document 1 (Japanese Patent No. 4234402), a plurality of front images of electronic circuit components sucked and held by a plurality of suction nozzles arranged on a mounting head as viewed from a direction parallel to the axis of the suction nozzles. And an apparatus using an optical system having a field of view capable of capturing a plurality of side images viewed from a direction perpendicular to the axis of the suction nozzle at a time.

  Japanese Patent Laid-Open No. 2009-164469 describes a configuration in which a component recognition device is mounted on a head unit.

Japanese Patent No. 4234402 JP 2009-164469 A

  Component mounting equipment is desired to shorten the time from the adsorption of electronic components to the placement of the adsorbed electronic components on the circuit board. By reducing the time from adsorption to mounting, the production efficiency of the substrate It is demanded to raise. Further, since the sucked electronic component may not be in the correct suction state, it is necessary to recognize the posture between the suction and mounting.

  In the mounting method according to Patent Document 1, the posture recognition of the electronic component is stopped above the image acquisition device while the mounting head receives the electronic circuit component from the component supply device and moves to the upper position of the circuit board. Therefore, it is necessary to move the mounting head to the imaging apparatus, and it is not considered to shorten the movement time.

  In the mounting method according to Patent Document 2, since the imaging device is mounted on the mounting head, movement of the electronic component to the imaging device is shortened. However, since the light source and detection system components exist between the circuit board and the suction nozzle, the operation stroke of the suction nozzle becomes longer in operations such as the suction and mounting of electronic components, and the operation of the suction nozzle increases. The increase in time is not considered.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a posture recognition method and apparatus for reducing the mounting time of an adsorbed electronic component on a circuit board in an apparatus for mounting an electronic component.

  In order to solve the above problems, for example, the configuration described in the claims is adopted.

  In an electronic component mounting apparatus that has a component mounting head and mounts an electronic component on a circuit board, the component mounting head includes a holding unit that holds the electronic component on a component holding surface, a light guide member, an illumination unit, The light guide member has an incident surface on which illumination light is incident, and an output surface from which illumination light is emitted. The illumination unit illuminates the incident surface, and the light guide member is disposed on the light guide member. The passing illumination light illuminates the surface facing the component holding surface of the held electronic component and the surface orthogonal to the component holding surface from the exit surface, and the imaging means faces the illuminated component holding surface. An electronic component mounting apparatus comprising: a surface for performing imaging; and means for capturing an image of a surface facing the orthogonal surface.

  In an electronic component mounting apparatus that has a component mounting head and mounts an electronic component on a circuit board, the component mounting head includes a holding unit that holds the electronic component on a component holding surface, a light guide member, an illumination unit, The light guide member has an incident surface on which illumination light is incident and an exit surface that emits illumination light, the illumination unit illuminates the incident surface, and the exit surface is An exit surface disposed at a position where a silhouette image of the surface of the electronic component facing the component holding surface can be captured, and an exit surface disposed at a position where a reflected image of the surface facing the component holding surface of the electronic component can be captured. And an electronic component mounting apparatus comprising: means for capturing the silhouette image and the reflection image of the electronic component.

  In an electronic component mounting apparatus that includes a component mounting head and mounts an electronic component on a circuit board, the component mounting head includes a holding unit that holds the component on a component holding surface, a light guide member, an illumination unit, and an imaging unit. The first light guide member is connected to the second light guide member, and the first light guide member is opposed to the component holding surface of the component holding means. And the second light guide member is disposed so as to face a surface orthogonal to the component holding surface, and the illuminating means illuminates the first light guide member, and the first light guide member Illuminates the bottom of the electronic component from the exit surface, and the second light guide plate is exposed to the side of the electronic component by light passing from the exit surface to the second light guide member. And imaging means for imaging the side and bottom of the electronic component. Which is an electronic component mounting apparatus to be.

According to the present invention, when producing a circuit board, it is possible to mount electronic components with high throughput.

FIG. 1 is a diagram illustrating a system configuration of a posture recognition apparatus according to an embodiment of the present invention. FIG. 2 is a plan view and a side view when the posture recognition apparatus in the present embodiment is applied to a component mounting machine. FIG. 3A is a side view of the plate light guide plate in this embodiment. FIG. 3b is a view of the plate light guide plate in this embodiment as seen from above. FIG. 3c is a diagram showing the light emission characteristics from the plate light guide plate in this example. FIG. 4A is a diagram seen from the side in a state where the plate light guide plate and the upright light guide plate in this embodiment are combined. FIG. 4B is a view seen from above in a state in which the plate light guide plate and the upright light guide plate in this embodiment are combined. FIG. 4c is a view from A of FIG. 4a in a state where the plate light guide plate and the upright light guide plate in the present embodiment are combined. FIG. 4d is a diagram showing the light emission characteristics from the upright light guide plate in this example. FIG. 5 is a diagram showing a detection screen in the present embodiment. FIG. 6A is a detection screen when the focus of the electronic component is different in the posture recognition apparatus in the present embodiment. FIG. 6B is a diagram illustrating the brightness in the cross-section AA of FIG. 6A when the focus of the electronic component is different in the posture recognition device according to the present embodiment. FIG. 6c is a diagram showing the brightness in the cross section BB of FIG. 6a when the focus of the electronic component is different in the posture recognition device in the present embodiment. FIG. 7 is a calculation example of coordinates for performing posture detection and position detection from the shape of the electronic component detected by the posture recognition apparatus according to the present embodiment. FIG. 8 is a diagram showing an operation flow in the present embodiment. FIG. 9 is a plan view and a side view for explaining the operation when the posture recognition apparatus in the present embodiment is applied to a component mounting machine. FIG. 10 is a detection screen showing the suction state of the electronic component detected by the posture recognition apparatus in the present embodiment. FIG. 11 is a plan view and a side view illustrating the system configuration of the posture recognition apparatus in the second embodiment of the present embodiment. FIG. 12A is a view of the divided light guide plate in the second embodiment as viewed from above. FIG. 12b is a view of the divided light guide plate in the second embodiment viewed from the side. FIG. 12c is a view of the divided light guide plate in the second embodiment as viewed from the front. FIG. 12d is a diagram showing the light emission characteristics from the divided light guide plate in the second embodiment. FIG. 13 is a plan view and a side view for explaining the system configuration of the posture recognition apparatus in the third embodiment. FIG. 14A is a view of the rod-shaped light guide plate in the third embodiment as viewed from the front. FIG. 14 b is a view of the rod-shaped light guide plate in the third embodiment as viewed from the side. FIG. 14 c is a view from the bottom of the rod-shaped light guide plate in the third embodiment. FIG. 14d is a view as seen from the bottom when the rod-shaped light guide plate in the third embodiment is a cylinder. FIG. 14e is a diagram showing the light emission characteristics from the rod-shaped light guide plate in the third embodiment. FIG. 15 a is a view of the light guide plate in the fourth embodiment as seen from the side. FIG. 15 b is a view of the light guide plate in the fourth embodiment as viewed from above. FIG. 15c is a diagram showing the light emission characteristics from the light guide plate in the fourth embodiment. FIG. 16 is a plan view and a side view for explaining the system configuration of the posture recognition apparatus in the fifth embodiment. FIG. 17a is a diagram showing the transmission characteristics of the wavelength limiting filter in the fifth embodiment. FIG. 17b is a diagram showing the transmission characteristics of the wavelength selective filter in the fifth embodiment. FIG. 18 a is a diagram showing the light emission characteristics of the white LED in the fifth embodiment. FIG. 18b is a diagram showing the light emission characteristics after passing through the wavelength limiting filter in the fifth embodiment. FIG. 18c is a diagram showing the light emission characteristics of the LED used in the rod-shaped light guide plate in the fifth embodiment. FIG. 19 is a plan view and a side view for explaining the system configuration of the posture recognition apparatus in the sixth embodiment. FIG. 20a is a diagram showing the light emission characteristics of the three-color light emitting LED in the sixth embodiment. FIG. 20b is a diagram showing the light emission characteristics of the LEDs used for side illumination in the sixth embodiment. FIG. 20c is a diagram showing light emission characteristics when the three-color light emitting LED in the sixth embodiment is controlled.

  Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 10 show a first example of an embodiment of an electronic circuit component posture recognition apparatus according to the present invention.
FIG. 1 shows the overall configuration of the component mounting apparatus in the present embodiment. The component mounting apparatus 500 includes an attitude recognition device 501, a component mounting unit 502, a board transport unit 503, a component supply unit 504, a device control unit 505, a data input unit 508, a display unit 509, and a data output unit 510. The component mounting unit 502 is installed such that the mounting head 9 is movable, and the posture recognition device 501 is mounted on the mounting head 9.

  FIG. 2 shows a configuration block diagram of the posture recognition device. A plan view of the posture recognition device is shown in the upper half, and a side view and a block diagram of the component mounting device 500 are shown in the lower half, respectively.

  The posture recognition device 501 includes an illumination system 506 and a detection system 507. The illumination system 506 includes a plate light guide plate 1, an LED 2, a half mirror 3, an upright light guide plate 4, and a reflection mirror 5. When the LED 2 is brought close to or in contact with the end of the light guide plate 1 to emit light, the light is guided into the plate light guide plate 1. The plate light guide plate 1 is processed so that the light of the LED 2 is emitted from the half mirror 3 and the upright light guide plate 4.

  FIG. 3 a is a view of the plate light guide plate 1 as viewed from the side. The light of the LED 2 is guided while being refracted inside the plate light guide plate 1. FIG. 3B is a view of the plate light guide plate 1 as viewed from above. The scattering surface 100 has a roughened surface such as sandblast, and corresponds to the position of the half mirror 3 and the upright light guide plate 4 described above. Since the light guided by the LED 2 is scattered by the scattering surface 100, only this portion emits light and is emitted as scattered light 101.

  FIG. 3c shows a cross-sectional profile 102 of light at A-A of the plate light guide plate 1 shown in FIG. 2b. As described above, light is hardly emitted on the surface other than the scattering surface 100. In addition, light passes through the end face of the plate scattering plate 1 facing the LED 2 and the end face positioned perpendicular to the end face. For this reason, the light from the LED 2 can be confined in the plate light guide plate by providing a reflection surface such as aluminum vapor deposition at the end portion, so that the illuminance from the scattering surface 100 is increased. Moreover, the light leak of LED2 can be prevented by providing the surface other than the scattering surface 100 similarly with a reflective surface.

FIG. 4 a is a view of the upright light guide plate 4 as viewed from the side. Since the light from the LED 2 is scattered upward on the scattering surface 100, the light is guided into the upright light guide plate 4. FIG. 4 b is a view of the upright light guide plate 4 as viewed from above. The upright light guide plate 4 is fixed so as to cover the part of the scattering surface 100. FIG. 4c is a view of the light guide plate 1 shown in FIG. Since the scattering surface 103 is provided in the same manner as the scattering surface 100 of the plate light guide plate 1, the light from the LED 2 is emitted from the scattering surface 103 of the upright light guide plate 4. FIG. 4d shows the light cross-sectional profile 105 of the portion indicated by cross-section BB in FIG. 4c. In this way, light is hardly emitted on the surface other than the scattering surface 101. As in the case of the plate scattering plate 1, light is emitted from a surface other than the scattering surface 101 and the end surface. Therefore, it is possible to obtain efficient light by providing a reflecting surface such as an aluminum reflecting surface.

  Thus, the light emitted from the scattering surface 100 of the plate light guide plate 1 is guided to the half mirror 3 and the upright light guide plate 4. Light from the half mirror 3 is applied to the lower surface of the electronic component 11.

  The lower surface is a bottom surface of the electronic component when the electronic component is sucked by the component suction surface of the suction nozzle, and the electronic component is a surface facing the component suction surface. The electronic component holding method may be a chuck-type holding unit that holds the electronic component in addition to the suction nozzle that sucks and holds the electronic component. The holding means is not limited to the present embodiment, and the holding means is not limited to the suction nozzle and can be implemented by a chuck type. The bottom surface of the electronic component when the electronic component is held by the chuck type holding means is referred to as a lower surface. The lower surface is a surface facing the component holding surface.

  First, the reflected light from the lower surface of the electronic component 11 is reflected again by the reflecting surface of the half mirror 3 and guided to the reflecting mirror 5.

  Furthermore, since the emitted light from the upright light guide plate 4 is illuminated on the side surface of the electronic component 11, the light transmitted through the electronic component 11 is guided to the reflection surface of the reflection mirror 5. The side surface of the electronic component is a surface orthogonal to the bottom surface of the electronic component. The surface orthogonal to the bottom surface may include a mechanical error.

  The reflected light from the lower surface of the electronic component 11 reflected by the reflecting mirror 5 and the transmitted light from the side surface are collected by the lens 6 and imaged on the imaging surface of the image sensor 7. At this time, the focal position of the lens 6 is matched with the lower surface of the electronic component 11.

  The light guide plate used may be an inexpensive part such as a transparent acrylic resin. In the present embodiment, the half mirror 3 and the reflection mirror 5 are shown in a cube shape, but there is no problem even if plate-like components are used.

  The illumination system 506 and the detection system 507 described above are held by the optical system holding member 8 by a method (not shown), and the optical system holding member 8 is held by the head 9 by the head holding member 12 by a method not shown. That is, the mounting head 9 and the posture recognition device 500 can operate integrally.

  The component mounting unit 502 is held by the XY stage 25 in which the mounting head 9 can move in the XY direction, and is controlled by the XY stage unit control system 16. The mounting head 9 can move the suction nozzle 10 in the rotation direction, and can move independently in the vertical direction by a method not shown. The suction of the electronic component 11 of the suction nozzle 10 is controlled by the suction nozzle control system 17, and the rotation of the mounting head 9 and the vertical movement of the suction nozzle 10 are controlled by the mounting head control system 18.

  The image sensor 7 is controlled by the image sensor control system 14, and the captured image is processed by the image processing system 15 so that the attitude of the electronic component 11 and the positional deviation of the electronic component relative to the suction nozzle can be calculated. Further, the illumination control system 13 controls the light amount of the LED 2 and the irradiation time.

  In the substrate transport unit 503, the substrate 19 on which the electronic component 11 is mounted is mounted on the substrate transport stage 20 and can be moved to a predetermined position by the substrate control system 21.

  The component supply unit 504 can supply electronic components continuously such as a tape feeder by the electronic component supply unit 22 and is controlled by the component supply control system 23. The overall control unit 24 performs these overall control systems.

  FIG. 5 shows an example of an image detected by the image sensor 7. As the image 106 detected by the image sensor 7, two images of an upper image 107 and a lower image 108 are displayed as one image. In the upper image 107, a silhouette image (shadow) 11a of the electronic component 11 and the suction nozzle 10 is detected. In the lower image 108, the reflected image 11b reflected from the lower surface of the electronic component 11 is detected. Note that the suction surface 10 'of the suction nozzle 10 is hidden under the reflected image 11b. The reflection mirror 5, the imaging lens 6, and the image sensor 7 are arranged so as to have such a field of view. In this embodiment, the image sensor 7 is described using an area sensor such as a CCD or a CMOS. However, the image recognition device 501 is mounted on a linear stage and configured with a scan type image sensor that acquires an image while scanning. It doesn't matter.

  FIG. 6A is a diagram illustrating a state in which the electronic component 11 detected by the image sensor 17 is out of focus, a state in which the electronic component 11 is in focus, and a state in which the side surface is in focus. As shown in FIG. 5, a silhouette image 11a from the side of the electronic component 11 and a reflected image 11b from the lower surface of the electronic component 11 are detected in the upper visual field 107 and the lower visual field 108, respectively. An image 300 shows a state in which both sides are out of focus, an image 301 shows a state in which the bottom surface is in focus, and an image 302 shows a state in which the bottom surface is out of focus and the side surface is in focus.

  FIG. 6b shows a cross-sectional waveform of the brightness at cross-section AA in the image of FIG. 6a. A waveform 303 indicates a state in which the focal points are shifted from each other, a waveform 304 indicates a state in which the lower surface is in focus, and a waveform 305 indicates a state in which the side surface is in focus. Thus, it can be seen that the silhouette image from the side surface of the electronic component 11 has a clear waveform regardless of the focus shift.

  FIG. 6c shows the cross-sectional waveform of the brightness at the cross section BB in the image of FIG. 6a. A waveform 306 indicates a state in which the focal points are shifted from each other, a waveform 307 indicates a state in which the lower surface is in focus, and a waveform 308 indicates a state in which the side surface is in focus. Thus, it can be seen that the reflected waveform from the lower surface of the electronic component 11 has different detection waveforms depending on the position of the focal point.

  Therefore, it is necessary to focus the detection optical system on the lower surface. In other words, even if the lens 6 installed in the detection optical system 507 is aligned with the lower surface of the electronic component 11, the performance is not affected even if a defocus occurs with respect to the side surface detection caused by a different detection optical path.

  FIG. 7 shows an example of a detected image posture determination method and posture recognition method. As the image 106 detected by the image sensor 7, two images of an upper image 107 and a lower image 108 are displayed as one image. First, in the upper image 107, the silhouette image 11a of the electronic component 11 and the suction nozzle 10 is detected, but the position of the suction nozzle 10 is unchanged. Therefore, the brightness of the upper image 107 is detected, and the position where the brightness has changed other than the suction nozzle 10 is specified. For example, since the electronic component 11 such as a chip resistor or a capacitor is rectangular, pixels at four corners (aX, aX to dX, dY) are obtained. The posture of the electronic component 11 may be determined from the coordinate position relationship between the suction nozzle 10 and the four corners.

Next, the lower surface of the electronic component 11 is detected in the lower image 108. Pixels at four corners (eX, eX to hX, hY) of the electronic component 11 are obtained by the method processed on the upper screen 107. The suction surface 10a of the suction nozzle 10 cannot be detected in the shadow when the electronic component 11 is sucked, but is previously obtained as the reference coordinates (X, Y) of the suction nozzle center without the electronic component 11. . A positional deviation and an angle from the center of the electronic component 11 are calculated from the calculated coordinates of the four corners and the center coordinates of the electronic component 11, and correction at the time of mounting the component is performed.
The operation in the above configuration will be described.

  FIG. 8 illustrates a component mounting measurement flow using the electronic circuit component orientation recognition apparatus of the present invention. The work is started (S1000), the mounting head is moved to the component supply system (S1001), the electronic component is sucked by the suction nozzle (S1002), and the mounting head is rotated by one nozzle (S1003). It is determined whether the suction nozzle is in the posture recognition position (S1004). If it is not the determination position, the next suction nozzle sucks equipment. In the case of the posture position, image acquisition (S1005) is performed, the posture of the component is confirmed with the side image, and the position of the component is calculated with the lower surface image (S1006). From the result, it is determined whether or not the part is normal (S1007). If the part is not normal, the part is discarded (S1008). If the component is normal, the suction position of the component is stored (S1009), and in order to determine the next component, the mounting head is rotated by one nozzle (S1010) to determine whether suction of all the suction nozzles is completed (S1011). And make repeated judgments. The position of all components is determined, the mounting head is moved onto the substrate (S1012), the component position is corrected (S1013) with all the suction nozzles, and the electronic components are mounted on the substrate by lowering the suction nozzles ( S1014). It is determined whether all nozzle parts are mounted (S1015), and if not completed, mounting on the substrate is repeated. It is determined whether there is a next mounted component (S1016), and if not, the mounting is completed (S1017).

  FIG. 9 is a diagram illustrating the operation flow described in FIG. In FIG. 9, the upper half shows a plan view and the lower half shows a side view. First, the mounting head 9 is moved to the component receiving position of the component supply unit 22 by the XY stage 25. The electronic component 11 is sucked by the suction nozzle 10 of the suction head 9. The suction nozzle 10 sucks all types of the designated electronic component 11. If the position where the electronic component 11 is picked up is 300 and the rotation direction is counterclockwise, the posture detection device 501 is reached at the next position 301 after picking up. The LED 2 emits light by the illumination control system 13 at the moment when the position 301 is reached, and the image sensor 7 is controlled by the image sensor control system 14 to detect an image. The detected image is stored in the image processing system 15 by obtaining the posture and position of the electronic component 11 by the method described with reference to FIG. Sequentially, the suction head 9 rotates to store all postures and positions of the electronic components 11 of all the suction nozzles 10 in the image processing system 15. When the electronic component 11 is attracted to all the suction nozzles 10 of the suction head 9, the electronic component 11 is moved onto the substrate 19 mounted on the substrate transport stage 20 by the XY stage 25, and the suction nozzle 10 is lowered at a predetermined position. The electronic components 11 are sequentially mounted on the substrate 19.

  FIG. 10 shows an example of an image detected by the image sensor. As the image 106 detected by the image sensor 7, two images of an upper image 107 and a lower image 108 are displayed as one image. The upper part of the upper image 107 is the suction nozzle 10, and the center of the lower image is an image of the suction nozzle 10 as viewed from below. The image 400 shows a state in which the electronic component is not sucked, and the shadow on the side surface of the suction nozzle 10 and the suction portion of the suction nozzle 10 are detected. The image 401 is a state in which the electronic component 11 is detected in a standing state 11 a in which the end of the electronic component 11 is attracted to the suction portion of the suction nozzle 11 due to some trouble. The image 402 is a state in which the electronic component 11 is normally and accurately attracted to the suction nozzle 10. Images 403 to 406 are states when the position of the electronic component 11 is moved in the horizontal direction with respect to the suction nozzle 10. The image 407 shows a state in which the electronic component 11 is normally sucked but rotated. As described above, when the electronic component 11 is normally attracted, the horizontal position and the angle in the rotation direction can be determined from the lower image 108. When the electronic component 11 is in a poor posture such as standing, it can be determined by the upper image 107.

  FIGS. 11 and 12 show a second embodiment of the electronic circuit component posture recognition apparatus according to the present invention. Parts that perform the same operations as in the first embodiment are indicated by the same reference numerals. In the figure, the plate light guide plate 200 is the same as the plate light guide plate 1 described in the first embodiment, but the length is as short as the half mirror 4. When the second LED 202 is brought close to or in contact with the end portion of the second plate light guide plate 201 to emit light, light is guided into the second plate light guide plate 201. The LED 1 is controlled by the illumination control system 13, and the second LED 202 is controlled by the second illumination control system 13 a, and each is controlled by the overall control unit 24.

Figure 12a is a view of the second plate light guide plate 201 from the upper surface. The light of the second LED 202 is guided while being refracted inside the second plate light guide plate 201. The end facing the second LED 202 is cut at 45 degrees, and the guided light is bent at a right angle. The 45 degree angle may include a mechanical error. The end can be totally reflected by applying a reflective surface such as aluminum vapor deposition. The third plate light guide plate 203 is connected to the second plate light guide plate 201 and can guide the reflected light to the inside. A second upright light guide plate 204 is connected on the third plate light guide plate 203.

  FIG. 12b is a side view of FIG. 12a. The end of the third plate light guide plate 203 is cut at 45 degrees in order to bend the light upward. Similarly, it is possible to totally reflect the end by providing a reflection surface such as aluminum vapor deposition. The second upright light guide plate 204 is provided with a scattering surface 205 and corresponds to the position of the half mirror 3 and the upright light guide plate 4 described above.

  FIG. 12c is a diagram when FIG. 12a is viewed from the front. The light emitted from the second LED 202 is reflected at the end portion of the second plate light guide plate 201, guided to the third plate light guide plate 203, further reflected at the end portion, and the second upright light guide plate 204. Is guided to. On the scattering surface 205 of the second upright light guide plate 204, the light is emitted to the outside 206, and the light cross-sectional profile 207 in the cross-section AA of FIG. 12b as shown in FIG. 12d is obtained.

  In this configuration, since the light source for the side illumination and the illumination for the lower side is separately provided with respect to the electronic component, there is an effect that the light amount can be finely controlled.

  FIGS. 13 and 14 show a third embodiment of the embodiment of the electronic circuit component posture recognition apparatus of the present invention. Parts that perform the same operations as in the first embodiment are indicated by the same reference numerals. In the figure, the plate light guide plate 200 is the same as the plate light guide plate 1 described in the first embodiment, but the length is as short as the half mirror 4. When the third LED 209 is brought close to or in contact with the end of the central light guide plate 208 to emit light, the light is guided into the central light guide plate 208. LED 1 is controlled by the illumination control system 13, and the third LED 209 is controlled by the third illumination control system 13 b and is controlled by the overall control unit 24.

  14A is a view of the central light guide plate 208 as viewed from the front, FIG. 14B is a view as viewed from the side of FIG. 14A, and FIG. 14C is a view of FIG. The light of the third LED 209 is guided while being refracted inside the central light guide plate 208. A scattering surface 210 is provided below the central light guide plate 208. The light of the third LED 209 is the scattering surface 210, and the light is emitted to the outside 211. As shown in FIG. 14e, the light cross-sectional profile 212 in the cross-section AA of FIG. 14b is obtained. Although the central light guide plate 208 is disposed at the center of the mounting head 9, it may be rotated simultaneously or stationary. When rotating at the same time, the central light guide plate 208 may have a rod shape, and the scattering surface 210 may be provided in the periphery so that light is scattered in any direction. The figure seen from is shown. By providing a scattering surface 214 around the periphery, scattered light 215 is emitted all around. Its cross-sectional profile is similar to FIG. 14e. Note that the third LED 209 does not need to be rotated by fixing the third LED 209 in a non-contact state because the central light guide plate 208 rotates.

  In this configuration, the side illumination and the lower illumination light source are separated from the electronic component, and the side illumination is separated from the detection system, so that the configuration of the detection system can be simplified.

  In the present embodiment, the mounting head has been described by the rotation method. However, it is clear that the same effect can be obtained even if the posture detecting device is attached to the suction heads arranged linearly. Further, although the LED is directly used as the light source, the same effect can be obtained by installing the LED in another place and guiding the light source by an optical fiber or the like.

15a to 15b show a fourth example of the embodiment of the electronic circuit component posture recognition apparatus of the present invention. 15A is a view of the light guide plate 600 viewed from the side, FIG . 15B is a view of FIG . 15A viewed from the top, and FIG. 15C is a view showing the cross-sectional profile 102 of light in the cross-section AA of FIG. The light guide plate 600 is obtained by cutting the end surface 601 at an angle, and in this embodiment, the light guide plate 600 is cut at an angle of 45 degrees. The 45 degree angle may include a mechanical error. LED2 arrange | positions the light emission point in the upper part of the end surface 601, permeate | transmits the surface of the light-guide plate 600, reflects on the edge part 601, and is light-guided, refracting the inside. Similar to the first embodiment, the scattering surface 100 is provided on a part of the light guide plate 600. The guided light is scattered by the scattering surface 100 and becomes light emission 101 from the upper part of the light guide plate 600, and the cross-sectional profile 102 as shown in FIG. 15c is obtained. Note that the angle of the end is not limited to 45 degrees, and the amount of emitted light can be adjusted by changing the angle.

  Even if the light guide plate of this configuration is replaced with the light guide plate of Example 1, the same effect can be obtained. Furthermore, the effect that the optical system can be made thinner is also obtained by installing the LED used for illumination on the upper part of the light guide plate.

  A fifth example of the embodiment of the electronic circuit component posture recognition apparatus of the present invention will be described with reference to FIGS. Parts having the same operations as those in the first embodiment and the third embodiment are denoted by the same reference numerals. In FIG. 16, a wavelength limiting plate 701 is disposed immediately after the LED 700. The light guided to the plate light guide plate 200 is light having a wavelength limited by the wavelength limiting plate 701. The LED 700 is controlled by the illumination control system 13. When the fourth LED 703 is brought close to or in contact with the end of the central light guide plate 208 to emit light, the light is guided into the central light guide plate 208. The fourth LED 703 is controlled by the fourth illumination control system 800 and controlled by the overall control unit 24. Light from the side surface is guided to the lens 6 by the reflection mirror 5, and a wavelength selection filter 702 is disposed in the optical path.

  FIG. 17 a is a diagram illustrating the transmission characteristics of the wavelength limiting filter 701, and FIG. 17 b is a diagram illustrating the characteristics of the wavelength selection filter 702. In the figure, the horizontal axis indicates the wavelength, and the vertical axis indicates the transmittance.

  FIG. 18 a is a diagram showing the relative intensity with respect to the wavelength of the LED 700, and FIG. 18 b is a diagram showing the relative intensity after passing through the wavelength limiting filter 701. FIG. 18 c is a diagram showing the relative intensity with respect to the wavelength of the LED 703. In each case, the horizontal axis represents the wavelength, and the vertical axis represents the relative intensity. The relative intensity of the wavelength of the LED 703 that has passed through the wavelength selection filter 702 does not change.

The operation of the above configuration will be described. The light of the LED 700 is guided by the light guide plate 200 and the lower surface of the electronic component 11 is illuminated by the prism 4. The light from the LED 703 is guided by the central light guide plate 208 and illuminates the side surface of the electronic component 11. The light reflected from the lower surface of the electronic component 11 is reflected by the reflection mirror 5 and forms an image on the camera 7 by the lens 6. The silhouette illuminated from the side of the electronic component 11 is
The light is reflected by the reflection mirror 5 and formed on the camera 7 by the lens 6. Since the wavelength characteristics of the light reflected from the lower surface by the wavelength limiting filter 701 and the wavelength characteristics of the silhouette light transmitted from the side surface by the wavelength selection filter 702 are different, they do not interfere with each other. , Can be detected as transmitted light of the silhouette of the side. Therefore, each detected image can obtain an image with less noise, and there is an effect that image detection with higher accuracy is possible.

  FIGS. 19 to 20 illustrate a sixth embodiment of the electronic circuit component posture recognition apparatus of the present invention. Parts having the same operations as those in the first embodiment and the third embodiment are denoted by the same reference numerals. In FIG. 19, an LED 704 having three-color light emission characteristics is used. The bottom illumination control system 800 controls three-color light emission. The light guided to the plate light guide plate 200 is light having a wavelength controlled by the lower surface illumination control system 800. When the fifth LED 705 is brought close to or in contact with the end of the central light guide plate 208 to emit light, the light is guided into the central light guide plate 208. The fifth LED 705 is controlled by the side illumination control system 801 and is controlled by the overall control unit 24.

  20a to 20c are diagrams showing the light emission characteristics of the LED 704 and the LED 705, in which the horizontal axis represents wavelength and the vertical axis represents relative intensity. FIG. 20 a is a diagram showing the relative intensity with respect to the wavelength of the LED 704. Since three-color light emission is possible, the wavelength 709, the wavelength 710, and the wavelength 711 can each emit light alone or in combination and can emit light simultaneously. FIG. 20 b is a diagram showing the relative intensity with respect to the wavelength of the LED 705. It has light emission characteristics of wavelength 711. FIG. 20c is a diagram showing the relative intensity with respect to the wavelength when the wavelength 709 and the wavelength 710 are simultaneously emitted by the lower surface illumination control system 800.

  The operation of the above configuration will be described. The light of the LED 704 emits two wavelengths simultaneously as shown in FIG. 20c. The light is guided by the light guide plate 200 and the lower surface of the electronic component 11 is illuminated by the prism 4. Further, the light of the LED 705 emits light at the wavelength shown in FIG. 20B, is guided by the central light guide plate 208, and illuminates the side surface of the electronic component 11. The light reflected from the lower surface of the electronic component 11 is reflected by the reflection mirror 5 and forms an image on the camera 7 by the lens 6. The silhouette illuminated from the side surface of the electronic component 11 is reflected by the reflecting mirror 5 and imaged on the camera 7 by the lens 6. Since the wavelength characteristics of the light from the LED 704 and the wavelength characteristics of the light from the LED 705 are different, they do not interfere with each other, and can be detected purely as reflected light on the bottom surface and transmitted light on the side silhouette.

  Although the same effect as that of the fifth embodiment is obtained, since there is no need to arrange a wavelength limiting filter and a wavelength selection filter, the number of parts is reduced and an inexpensive device can be provided.

  DESCRIPTION OF SYMBOLS 1 ... Plate light-guide plate, 2 ... LED, 3 ... Half mirror, 4 ... Upright light guide plate, 5 ... Reflection mirror, 6 ... Imaging lens, 7 ... Imaging element , 8 ... Installation, 9 ... Mounting head, 10 ... Suction nozzle, 11 ... Electronic component, 19 ... Substrate, 20 ... Substrate stage, 25 ... XY stage 100 ... -Scattering surface, 106 ... detection screen, 107 ... upper screen, 108 ... lower screen, 201 ... second plate light guide plate, 202 ... second LED, 203 ... third plate Light guide plate, 204 ... second upright light guide plate, 205 ... scattering surface, 208 ... center light guide plate, 209 ... third LED, 210 ... scattering surface, 214 ... scattering surface

Claims (23)

In an electronic component mounting apparatus that has a component mounting head and mounts electronic components on a substrate,
The component mounting head includes a holding unit that holds the electronic component, a light guide member, an illumination unit, and an imaging unit.
The light guide member has an incident surface on which illumination light is incident and an exit surface from which illumination light is emitted,
The illumination means illuminates the incident surface;
The illumination light that has passed through the light guide member illuminates the lower surface of the held electronic component and the side surface of the held electronic component from the emission surface,
The imaging means is means for imaging the lower surface and a surface facing the side surface;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 1,
The electronic component mounting apparatus, wherein the illumination unit and the imaging unit are arranged at a position higher than the light guide member. In the electronic component mounting apparatus according to claim 2,
The electronic component mounting apparatus, wherein the emission surface is a scattering surface. The electronic component mounting apparatus according to any one of claims 1 to 3,
The electronic component mounting apparatus characterized in that the means for imaging the surface facing the side surface captures a silhouette image of the electronic component. The electronic component mounting apparatus according to any one of claims 1 to 3,
The electronic component mounting apparatus, wherein the light guide member is formed of a scattering member that scatters light. The electronic component mounting apparatus according to any one of claims 1 to 3,
The electronic component mounting apparatus, wherein the illumination means is an LED. In an electronic component mounting apparatus that has a component mounting head and mounts electronic components on a substrate,
The component mounting head includes a holding unit that holds the electronic component, a light guide member, an illumination unit, and an imaging unit.
The light guide member has an incident surface on which illumination light is incident and an exit surface from which illumination light is emitted,
The illumination means illuminates the incident surface;
The exit surface has an exit surface disposed at a position where a silhouette image of the side surface of the held electronic component can be captured, and an exit surface disposed at a position where a reflected image of the lower surface of the retained electronic component can be captured. And
Means for capturing the silhouette image and the reflection image of the electronic component;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 7,
The electronic component mounting apparatus, wherein the illumination unit and the imaging unit are arranged at a position higher than the light guide member. In the electronic component mounting apparatus according to claim 7 or 8,
The electronic component mounting apparatus, wherein the emission surface is a scattering surface. In an electronic component mounting apparatus that has a component mounting head and mounts electronic components on a substrate,
The component mounting head includes a holding unit that holds the electronic component, a light guide member, an illumination unit, and an imaging unit.
The light guide member is connected to a first light guide member and a second light guide member,
The first light guide member is disposed to face the lower surface of the component holding means, the second light guide member is disposed on a surface orthogonal to the lower surface,
The illuminating means illuminates the first light guide member, the first light guide member illuminates the bottom of the electronic component from the exit surface, and the second light guide plate transmits the first light guide member from the exit surface. Illuminating the side of the electronic component with light passing from the light guide member to the second light guide member,
The imaging means for imaging the side and bottom of the electronic component;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 10,
The electronic component mounting apparatus, wherein the illumination unit and the imaging unit are arranged at a position higher than the light guide member. The electronic component mounting apparatus according to claim 10 or 11,
The electronic component mounting apparatus, wherein the emission surface is a scattering surface. A component mounting head for mounting electronic components on a substrate,
The component mounting head includes a holding unit that holds the electronic component, a light guide member, an illumination unit, and an imaging unit.
The light guide member has an incident surface on which illumination light is incident and an exit surface from which illumination light is emitted,
The illumination means illuminates the incident surface;
The illumination light that has passed through the light guide member illuminates the lower surface of the held electronic component and the surface orthogonal to the lower surface from the emission surface,
The imaging means is means for imaging the illuminated lower surface and a surface facing the orthogonal surface;
A component mounting head characterized by comprising: The component mounting head according to claim 13,
The component mounting head, wherein the illumination unit and the imaging unit are arranged at a position higher than the light guide member. The component mounting head according to claim 13 or 14,
The component mounting head, wherein the exit surface is a scattering surface. In an electronic component mounting method for mounting an electronic component on a substrate,
The component mounting head includes a holding unit that holds the electronic component, a light guide member, an illumination unit, and an imaging unit.
Holding the electronic component by the holding means;
The light guide member has an incident surface on which illumination light is incident and an exit surface from which illumination light is emitted,
The illuminating means illuminates the incident surface, so that the illumination light that has passed through the light guide member is orthogonal to the surface facing the upper part of the held electronic component and the surface facing the upper part from the exit surface. Illuminating the surface;
The imaging means captures an image of a surface facing the illuminated upper portion and a surface facing the orthogonal surface;
A posture determination step of recognizing a posture of the electronic component held using the imaged surface and determining a posture state of the electronic component;
An electronic component mounting method comprising: an electronic component mounting step of performing a process of mounting the held electronic component on the substrate or discarding the held electronic component in accordance with the determined state. The electronic component mounting method according to claim 16,
The step of recognizing the posture recognizes the posture using an image of a surface facing the upper portion and recognizes the positional relationship with the holding head using an image of the surface facing the orthogonal surface. Electronic component mounting method. In an electronic component mounting apparatus that has a component mounting head and mounts electronic components on a circuit board,
The component mounting head includes a suction nozzle that sucks the electronic component on the component suction surface, a light guide member, an illumination unit, and an imaging unit.
The light guide member has an incident surface on which illumination light is incident and an exit surface from which illumination light is emitted,
The illumination means illuminates the incident surface;
The illumination light that has passed through the light guide member illuminates a surface facing the component suction surface of the sucked electronic component and a surface orthogonal to the component suction surface from the emission surface,
The imaging means is means for imaging a surface facing the illuminated component suction surface and a surface facing the orthogonal surface;
An electronic component mounting apparatus comprising: The electronic component mounting apparatus according to claim 18,
The electronic component mounting apparatus, wherein the illumination unit and the imaging unit are arranged at a position higher than the light guide member. In the electronic component mounting apparatus according to claim 19,
The electronic component mounting apparatus, wherein the emission surface is a scattering surface. The electronic component mounting apparatus according to any one of claims 18 to 20,
The electronic component mounting apparatus, wherein the means for imaging the surface facing the orthogonal surface captures a silhouette image of the electronic component. The electronic component mounting apparatus according to any one of claims 18 to 20,
The electronic component mounting apparatus, wherein the light guide member is formed of a scattering member that scatters light. The electronic component mounting apparatus according to any one of claims 18 to 20,
The electronic component mounting apparatus, wherein the illumination means is an LED.

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