CN116520623A - Element identification device, identification mechanism, chip mounter and identification method - Google Patents
Element identification device, identification mechanism, chip mounter and identification method Download PDFInfo
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- CN116520623A CN116520623A CN202310423528.9A CN202310423528A CN116520623A CN 116520623 A CN116520623 A CN 116520623A CN 202310423528 A CN202310423528 A CN 202310423528A CN 116520623 A CN116520623 A CN 116520623A
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- reflector
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- 230000007246 mechanism Effects 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 22
- 230000009471 action Effects 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 description 17
- 230000007547 defect Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/17—Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses an element identification device, an identification mechanism, a chip mounter and an identification method, wherein the element identification device comprises a lens camera module, a reflector and a light source, wherein the light source is used for providing light for at least two surfaces of an element, and the reflector can reflect images of at least two surfaces of the element to the lens camera module and acquire graphic information of at least two surfaces of the element through the lens camera module; the identification mechanism comprises an element identification device; the chip mounter comprises an element identification device or an identification mechanism; the identification method mainly comprises the steps of reflecting images of at least two surfaces of an element to a lens camera module through a reflector and acquiring graphic information of the at least two surfaces of the element through the lens camera module. The element identification device, the identification mechanism, the chip mounter and the identification method have the advantages of low implementation cost and small occupied space, can avoid action interference when in application, effectively improve the definition and the accuracy of images, greatly improve the mounting quality, and have better universality.
Description
Technical Field
The invention relates to the field of element identification, in particular to an element identification device, an identification mechanism, a chip mounter and an identification method.
Background
In a chip mounter, in order to improve mounting efficiency, a plurality of suction nozzles with a specific pitch are generally arranged in parallel and mounted synchronously by using the plurality of suction nozzles. In order to accurately judge the state of the component after being absorbed by the suction nozzle, the mounting error is avoided, and the component needs to be subjected to multi-surface identification so as to ensure that the component is in a correct mounting state.
In the prior art, the component side recognition mechanism generally obtains the state information of the component by arranging two camera lens modules, so that the defects of high cost and large volume exist, and further, the normal mounting action of the component side recognition mechanism is interfered, so that the application experience is poor; in another scheme, a set of lens camera modules are adopted to sequentially collect front and side images, delay is generated when images are sequentially collected in the motion process of the device, meanwhile, a light source can interfere the images, imaging blurring is caused by optical path difference, universality is poor, information accuracy is affected, and mounting quality is affected.
In summary, the prior art has the technical defects of high equipment cost, huge volume, large action interference, blurred imaging, poor image accuracy, influence on mounting quality and the like, and the defects severely limit the further forward development and popularization and application in the field.
Accordingly, the present invention is directed to a new solution to solve the existing technical drawbacks.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the element identification device, the identification mechanism, the chip mounter and the identification method, which solve the technical defects of high equipment cost, huge volume, large action interference, blurred imaging, poor image accuracy, influence on mounting quality and the like in the prior art.
The technical scheme adopted for solving the technical problems is as follows:
the device comprises a lens camera module, a reflector and a light source, wherein the light source is used for providing light for at least two faces of a component, and the reflector can reflect images of at least two faces of the component to the lens camera module and acquire graphic information of at least two faces of the component through the lens camera module.
As an improvement of the above technical solution, the reflector includes a side reflector and a bottom reflector, where the side reflector is used to reflect an image of at least one side of the element to the lens camera module and obtain image information of at least one side of the element through the lens camera module; the bottom reflector is used for reflecting the image of the bottom surface of the element to the lens camera module and acquiring the image information of the bottom surface of the element through the lens camera module.
As a further improvement of the above technical solution, the side reflectors include a first side reflector and a second side reflector, and the reflected light of the element side may enter the lens camera module after being reflected by the first side reflector and the second side reflector sequentially.
As a further improvement of the above technical solution, the lens camera module includes a lens and a first photosensitive surface of the camera, and the light reflected by the first side reflector and the second side reflector can enter the lens and be sensitized by the first photosensitive surface of the camera.
As a further improvement of the technical scheme, the novel light source reflector further comprises a reflector mounting seat, wherein the reflector mounting seat is provided with a first side surface mounting plane and a second side surface mounting plane, the first side surface reflector is mounted on the first side surface mounting plane, and the second side surface reflector is mounted on the second side surface mounting plane.
As a further improvement of the above technical solution, the first side reflector and the second side reflector are parallel to each other, and the first side mounting plane and the second side mounting plane are parallel to each other.
As a further improvement of the above technical solution, the bottom surface reflector includes a first bottom surface reflector, a second bottom surface reflector and a third bottom surface reflector, and the image information of the bottom surface of the element may enter the lens camera module after being reflected by the first bottom surface reflector and the third bottom surface reflector sequentially or by the second bottom surface reflector and the third bottom surface reflector sequentially.
As a further improvement of the above technical solution, the lens camera module includes a lens and a second photosensitive surface of the camera, and the light reflected by the first bottom reflector and the third bottom reflector or reflected by the second bottom reflector and the third bottom reflector may enter the lens and be sensitized by the second photosensitive surface of the camera.
As a further improvement of the technical scheme, the novel solar energy reflector further comprises a reflector mounting seat, wherein the reflector mounting seat is provided with a first bottom surface mounting plane, a second bottom surface mounting plane and a third bottom surface mounting plane, the first bottom surface reflector is mounted on the first bottom surface mounting plane, the second bottom surface reflector is mounted on the second bottom surface mounting plane, and the third bottom surface reflector is mounted on the third bottom surface mounting plane.
As a further improvement of the above technical solution, the first bottom reflector is a semi-transparent and semi-reflective sheet.
As a further improvement of the technical scheme, a through groove matched with the first bottom surface reflector in position is formed in the mounting position corresponding to the first bottom surface reflector, and a coaxial light source component matched with the first bottom surface reflector is arranged at the bottom of the through groove.
As a further improvement of the above technical solution, the coaxial light source assembly includes a coaxial light source substrate and a plurality of coaxial light emitting sources uniformly distributed on the coaxial light source substrate.
As a further improvement of the above technical solution, the light source includes a bottom light source assembly for providing light to the bottom surface of the element and a side light source assembly for providing light to at least one side surface of the element.
As a further improvement of the above technical solution, the bottom light source assembly includes a bottom light source substrate and a plurality of bottom light emitting sources uniformly disposed on the bottom light source substrate.
As a further improvement of the technical scheme, the bottom light source substrate is a circular substrate, and the plurality of bottom light emitting sources are distributed on the circular substrate in a ring shape.
As a further improvement of the above technical solution, the side light source assembly includes a side light source substrate and a plurality of side light sources uniformly arranged on the side light source substrate.
The invention also provides:
the movable element identification mechanism comprises a movable module, wherein the output end of the movable module is provided with the element identification device.
As a further improvement of the technical scheme, the movable module comprises a movable guide rail, a movable driving assembly and a movable sliding seat, wherein the movable sliding seat is arranged on the movable guide rail, the element identification device is arranged at the bottom of the movable sliding seat, and the movable driving assembly is used for driving the movable sliding seat to slide on the movable guide rail and synchronously drive the element identification device to move.
The invention also provides:
the chip mounter comprises the element identification device or the movable element identification mechanism.
The invention also provides:
a component recognition method mainly reflects images of at least two faces of a component to a lens camera module through a reflector and acquires graphic information of the at least two faces of the component through the lens camera module.
As an improvement of the above technical solution, the reflector includes a side reflector and a bottom reflector, where the side reflector is used to reflect an image of at least one side of the element to the lens camera module and obtain image information of at least one side of the element through the lens camera module; the bottom reflector is used for reflecting the image of the bottom surface of the element to the lens camera module and acquiring the image information of the bottom surface of the element through the lens camera module.
The invention also provides:
the component identification method is to adopt the component identification device, the movable component identification mechanism or the chip mounter to identify the component and acquire the image information of at least two surfaces of the component.
The beneficial effects of the invention are as follows: the invention provides a component identification device, an identification mechanism, a chip mounter and an identification method, wherein the component identification device, the identification mechanism, the chip mounter and the identification method are provided with reflectors, images of at least two surfaces of a component can be reflected to a lens camera module through the reflectors, and graphic information of at least two surfaces of the component can be acquired through the lens camera module, so that two or more groups of camera lens modules are not required to be arranged, the equipment cost can be saved, the volume can be reduced, and the phenomenon of action interference can be avoided; in addition, after the reflector is arranged, the image information of at least two surfaces of the element can be simultaneously acquired through the camera lens module, image delay and interference cannot occur, the definition and the tightness of the image can be greatly improved, the universality is stronger, and the mounting quality can be improved when the camera lens module is applied.
In conclusion, the component identification device, the identification mechanism, the chip mounter and the identification method solve the technical defects of high equipment cost, huge volume, large action interference, blurred imaging, poor image accuracy, influence on mounting quality and the like in the prior art.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of an assembly of a component recognition device of the present invention;
FIG. 2 is a schematic view of an assembly of the component recognition device of the present invention at another angle;
FIG. 3 is a schematic view of an assembly of a component recognition device according to a third aspect of the present invention;
fig. 4 is a diagram showing the assembly of the mobile element identification mechanism according to the present invention.
Detailed Description
The conception, specific structure, and technical effects produced by the present invention will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present invention. It is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present invention based on the embodiments of the present invention. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the invention can be interactively combined on the premise of not contradicting and conflicting, and refer to figures 1-4.
Referring to fig. 1-3, a component recognition apparatus includes a lens camera module 1, a reflector, a light source, and a reflector mount 4.
In the above structure, the lens camera module 1 includes a camera, a lens 13, a first photosurface 11 and a second photosurface 12, and in other embodiments, the first photosurface 11 and the second photosurface 12 may be a common photosurface which is used at different use times, so as to realize the photosurface function of the first photosurface 11 and the second photosurface 12. The reflector is installed on the reflector mount pad 4, and in the specific implementation, the reflector mount pad 4 can be processed by adopting an integrated processing and forming mode, or the reflector mount pad 4 can be spliced by a plurality of small mount pads, and an implementation person can adopt different implementation modes according to different implementation environments, and the reflector mount pad 4 is a bearing mechanism of the reflector 4. In this solution, the light source is configured to provide light to at least two surfaces of the element 9, and the reflector may reflect images of at least two surfaces of the element 9 to the lens camera module 1 and obtain graphic information of at least two surfaces of the element 9 through the lens camera module 1.
The reflector comprises a side reflector and a bottom reflector, wherein the side reflector is used for reflecting an image of at least one side surface of the element 9 to the lens camera module 1 and acquiring image information of at least one side surface of the element 9 through the lens camera module 1; the bottom reflector is used for reflecting the image of the bottom surface of the element 9 to the lens camera module 1 and acquiring the image information of the bottom surface of the element 9 through the lens camera module 1.
The side reflectors include a first side reflector 21 and a second side reflector 22, in this embodiment, the first side reflector 21 and the second side reflector 22 are parallel to each other, and in some other embodiments, the first side reflector 21 and the second side reflector 22 may not be parallel to each other, which may be determined according to implementation conditions. The reflected light rays on the side surface of the element 9 can enter the lens camera module 11 after being reflected by the first side surface reflector 21 and the second side surface reflector 22 in sequence; the light reflected by the first side reflector 21 and the second side reflector 22 can enter the lens 13 and be sensed by the first photosensitive surface 11 of the camera.
In a specific application, after the light of the side surface of the element 9 is emitted to the first side surface reflector 21, the first side surface reflector 21 reflects the light to the second side surface reflector 22, the second side surface reflector 22 reflects the light and enters the upper area of the lens 13, and the reflected light is sensed by the first photosensitive surface 11 of the camera after passing through the lens 13, so that the camera finally obtains the image information of the side surface of the element 9. The light path of the image information on the side of the acquisition element 9 is the first light path.
In order to mount the first side reflector 21 and the second side reflector 22, the reflector mount 4 has a first side mounting plane 41 and a second side mounting plane 42, in this technical solution, the first side mounting plane 41 and the second side mounting plane 42 are parallel to each other, and when the first side reflector 21 and the second side reflector 22 are not parallel to each other, the first side mounting plane 41 and the second side mounting plane 42 are not parallel to each other. The first side reflector 21 is mounted on the first side mounting plane 41 and the second side reflector 22 is mounted on the second side mounting plane 42.
Similar to the side reflectors, the bottom reflectors include a first bottom reflector 31, a second bottom reflector 32 and a third bottom reflector 33, and the image information of the bottom surface of the element 9 may sequentially pass through the first bottom reflector 31 and the third bottom reflector 33 or sequentially pass through the second bottom reflector 32 and the third bottom reflector 33 and then be reflected and enter the lens camera module 1. The light reflected by the first bottom reflector 31 and the third bottom reflector 33 or the second bottom reflector 32 and the third bottom reflector 33 can enter the lens 13 and be sensed by the second photosensitive surface 12 of the camera.
In application, the light of the bottom surface of the element 9 is directly emitted to the first bottom surface reflector 31 and the second bottom surface reflector 32, the first bottom surface reflector 31 reflects the light to the third bottom surface reflector 33, synchronously, the second bottom surface reflector 32 reflects the light to the third bottom surface reflector 33, the third bottom surface reflector 33 reflects the light and enters the lower area of the lens 13, the reflected light is sensed by the second photosensitive surface 12 of the camera after passing through the lens 13, and finally the camera acquires the image information of the side surface of the element 9. The above-described light path for acquiring the image information of the bottom surface of the element 9 is a second light path.
In order to mount the first bottom reflector 31, the second bottom reflector 32, and the third bottom reflector 33, the reflector mount 4 has a first bottom mounting plane 43, a second bottom mounting plane 44, and a third bottom mounting plane 45, the first bottom reflector 31 is mounted on the first bottom mounting plane 43, the second bottom reflector 32 is mounted on the second bottom mounting plane 44, and the third bottom reflector 33 is mounted on the third bottom mounting plane 45.
In other embodiments, the second bottom reflector 32 and the third bottom reflector 33 may be disposed in a non-mounting mode, the second bottom reflector 32 and the third bottom reflector 33 may be integrally formed with the reflector mounting base 4, the second bottom reflector 32 and the third bottom reflector 33 are the same component as the reflector mounting base 4, and the reflector may be directly coated on the corresponding reflecting surface on the reflector mounting base 4 and formed.
In this embodiment, the first bottom reflector 31 is a semi-transparent and semi-reflective sheet (optical filter or light-splitting sheet), the transmittance and reflectance of the semi-transparent and semi-reflective sheet (optical filter or light-splitting sheet) are adjustable, and the environment is specifically adjustable according to the implementation conditions, and a through groove with a position matching the mounting position of the semi-transparent and semi-reflective first bottom reflector 31 is formed at the mounting position corresponding to the semi-transparent and semi-reflective first bottom reflector, and a coaxial light source assembly 51 matching the first bottom reflector 31 is provided at the bottom of the through groove. By arranging the coaxial light source assembly 51, more uniform illumination adjustment can be provided, the definition and accuracy of images are improved, and the mounting quality is further improved.
For the coaxial light source assembly 51, specifically, the coaxial light source assembly 51 includes a coaxial light source substrate and a plurality of coaxial light emitting sources uniformly distributed on the coaxial light source substrate, and in this embodiment, the coaxial light emitting sources are LED light sources, which has the advantages of low energy consumption, high brightness and long service life.
In addition, in the present embodiment, the light source includes a bottom light source assembly 52 and a side light source assembly 53, the bottom light source assembly 52 is configured to provide light to the bottom surface of the element 9, and the side light source assembly 53 is configured to provide light to at least one side surface of the element 9. Specifically, the bottom light source assembly 52 includes a bottom light source substrate and a plurality of bottom light emitting sources uniformly disposed on the bottom light source substrate, wherein the bottom light source substrate can be any shape, if the camera is a line scan, the bottom light source substrate has a plurality of square holes, and if the camera is a planar array, the light source holes can be circular or polygonal. In this embodiment, the bottom light source substrate is a circular substrate, and the plurality of bottom light emitting sources are distributed on the circular substrate in a ring shape; the side light source assembly 53 includes a side light source substrate and a plurality of side light sources uniformly arranged on the side light source substrate.
In this embodiment, the bottom light-emitting source and the side light-emitting source are both LED light sources, and have the advantages of low energy consumption, high brightness and long service life.
Based on the above component recognition device, the invention also provides:
referring to fig. 4, a mobile component recognition mechanism includes a mobile module 6, and the output end of the mobile module 6 is provided with the component recognition device.
In the above-mentioned mobile module 6, the mobile module 6 includes a mobile rail 61, a mobile driving assembly and a mobile carriage 62, the mobile carriage 62 is disposed on the mobile rail 61, the component recognition device is mounted at the bottom of the mobile carriage 62, and the mobile driving assembly is used for driving the mobile carriage 62 to slide on the mobile rail 61 and synchronously drive the component recognition device to move.
In the specific implementation, the movable driving component can be a driving component which can meet the control requirement, such as a motor screw rod module and a magnetic control motor.
When the device is applied, the moving module 6 drives the component recognition device to horizontally move to switch positions so as to adapt to the component recognition positions of different mounting heads, and the device has the advantages of flexible application and strong universality.
Based on the component recognition device and the movable component recognition mechanism, the invention further provides:
the chip mounter comprises the element identification device or the movable element identification mechanism.
The invention also provides:
a component recognition method mainly reflects images of at least two faces of a component 9 to a lens camera module 1 through a reflector and acquires graphic information of at least two faces of the component 9 through the lens camera module 1.
21. The component recognition method according to claim 20, wherein: the reflector comprises a side reflector and a bottom reflector, wherein the side reflector is used for reflecting an image of at least one side surface of the element 9 to the lens camera module 1 and acquiring image information of at least one side surface of the element 9 through the lens camera module 1; the bottom reflector is used for reflecting the image of the bottom surface of the element 9 to the lens camera module 1 and acquiring the image information of the bottom surface of the element 9 through the lens camera module 1.
Based on the element identification device, the movable element identification mechanism and the chip mounter, the invention further provides:
the component recognition method is to use the component recognition device or the movable component recognition mechanism or the chip mounter to recognize and acquire image information of at least two surfaces of the component 9 for the component 9.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
Claims (15)
1. A component recognition apparatus characterized in that: the device comprises a lens camera module (1), a reflector and a light source, wherein the light source is used for providing light for at least two surfaces of an element (9), and the reflector can reflect images of the at least two surfaces of the element (9) to the lens camera module (1) and acquire graphic information of the at least two surfaces of the element (9) through the lens camera module (1).
2. A component recognition apparatus according to claim 1, wherein: the reflector comprises a side reflector and a bottom reflector, wherein the side reflector is used for reflecting an image of at least one side surface of the element (9) to the lens camera module (1) and acquiring image information of at least one side surface of the element (9) through the lens camera module (1); the bottom reflector is used for reflecting an image of the bottom surface of the element (9) to the lens camera module (1) and acquiring image information of the bottom surface of the element (9) through the lens camera module (1).
3. A component recognition apparatus according to claim 2, wherein: the side reflectors comprise a first side reflector (21) and a second side reflector (22), and reflected light rays on the side surfaces of the element (9) can sequentially enter the lens camera module (11) after being reflected by the first side reflector (21) and the second side reflector (22).
4. A component recognition apparatus according to claim 3, wherein: the lens camera module (1) comprises a lens (13) and a first photosensitive surface (11) of the camera, and light rays reflected by the first side reflector (21) and the second side reflector (22) can enter the lens (13) and be sensitized by the first photosensitive surface (11) of the camera.
5. A component recognition apparatus according to claim 2, wherein: the bottom surface reflectors comprise a first bottom surface reflector (31), a second bottom surface reflector (32) and a third bottom surface reflector (33), and the image information of the bottom surface of the element (9) can sequentially pass through the first bottom surface reflector (31) and the third bottom surface reflector (33) or sequentially pass through the second bottom surface reflector (32) and the third bottom surface reflector (33) to be reflected and then enter the lens camera module (1).
6. A component recognition apparatus according to claim 5, wherein: the lens camera module (1) comprises a lens (13) and a second photosensitive surface (12) of the camera, and light rays reflected by the first bottom surface reflector (31) and the third bottom surface reflector (33) or reflected by the second bottom surface reflector (32) and the third bottom surface reflector (33) can enter the lens (13) and be sensitized by the second photosensitive surface (12) of the camera.
7. A component recognition apparatus according to claim 5, wherein: the first bottom reflector (31) is a semi-transparent and semi-reflective sheet.
8. A component recognition apparatus according to claim 7, wherein: a through groove matched with the first bottom surface reflector (31) is formed in a corresponding mounting position of the first bottom surface reflector, and a coaxial light source assembly (51) matched with the first bottom surface reflector (31) is arranged at the bottom of the through groove.
9. A component recognition apparatus according to claim 8, wherein: the coaxial light source assembly (51) comprises a coaxial light source substrate and a plurality of coaxial light emitting sources uniformly distributed on the coaxial light source substrate.
10. A component recognition apparatus according to claim 1, wherein: the light source comprises a bottom light source assembly (52) and a side light source assembly (53), wherein the bottom light source assembly (52) is used for providing light to the bottom surface of the element (9), and the side light source assembly (53) is used for providing light to at least one side surface of the element (9).
11. A mobile component identification mechanism, characterized by: comprising a mobile module (6), the output of the mobile module (6) being provided with the component identification device according to any one of claims 1-11.
12. A mobile component identification mechanism as claimed in claim 11, wherein: the mobile module (6) comprises a mobile guide rail (61), a mobile driving assembly and a mobile sliding seat (62), wherein the mobile sliding seat (62) is arranged on the mobile guide rail (61), the element identification device is arranged at the bottom of the mobile sliding seat (62), and the mobile driving assembly is used for driving the mobile sliding seat (62) to slide on the mobile guide rail (61) and synchronously drive the element identification device to move.
13. The utility model provides a chip mounter which characterized in that: the chip mounter includes the component recognition apparatus according to any one of claims 1 to 10 or includes the mobile component recognition mechanism according to any one of claims 11 to 12.
14. A method of component identification, characterized by: the component identification method mainly comprises the steps of reflecting images of at least two surfaces of a component (9) to a lens camera module (1) through a reflector and acquiring graphic information of at least two surfaces of the component (9) through the lens camera module (1);
the reflector comprises a side reflector and a bottom reflector, wherein the side reflector is used for reflecting an image of at least one side surface of the element (9) to the lens camera module (1) and acquiring image information of at least one side surface of the element (9) through the lens camera module (1); the bottom reflector is used for reflecting an image of the bottom surface of the element (9) to the lens camera module (1) and acquiring image information of the bottom surface of the element (9) through the lens camera module (1).
15. A method of component identification, characterized by: the component identification method is to identify and acquire image information of at least two surfaces of the component (9) by adopting the component identification device according to any one of claims 1 to 10 or adopting the movable component identification mechanism according to any one of claims 11 to 12 or adopting the chip mounter according to claim 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310423528.9A CN116520623A (en) | 2023-04-19 | 2023-04-19 | Element identification device, identification mechanism, chip mounter and identification method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310423528.9A CN116520623A (en) | 2023-04-19 | 2023-04-19 | Element identification device, identification mechanism, chip mounter and identification method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116520623A true CN116520623A (en) | 2023-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310423528.9A Pending CN116520623A (en) | 2023-04-19 | 2023-04-19 | Element identification device, identification mechanism, chip mounter and identification method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650086A (en) * | 2024-01-29 | 2024-03-05 | 深圳市泰达智能装备有限公司 | Bonding auxiliary system and bonding machine |
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2023
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650086A (en) * | 2024-01-29 | 2024-03-05 | 深圳市泰达智能装备有限公司 | Bonding auxiliary system and bonding machine |
| CN117650086B (en) * | 2024-01-29 | 2024-04-05 | 深圳市泰达智能装备有限公司 | Bonding auxiliary system and bonding machine |
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