CN117650086B - Bonding auxiliary system and bonding machine - Google Patents

Bonding auxiliary system and bonding machine Download PDF

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Publication number
CN117650086B
CN117650086B CN202410116195.XA CN202410116195A CN117650086B CN 117650086 B CN117650086 B CN 117650086B CN 202410116195 A CN202410116195 A CN 202410116195A CN 117650086 B CN117650086 B CN 117650086B
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China
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light source
detection space
chamber
window
light beam
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CN117650086A (en
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盛龙
王建平
杨仕基
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Shenzhen Taida Intelligent Equipment Co ltd
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Shenzhen Taida Intelligent Equipment Co ltd
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Abstract

The application relates to a bonding auxiliary system, the bonding auxiliary system comprises a shell, a light source assembly and a receiving assembly, wherein the light source assembly is arranged on the shell, the light source assembly comprises a side light source and a bottom light source, the side light source is used for emitting a first light beam, the bottom light source is used for emitting a second light beam, the light source assembly is provided with a first state and a second state, a detection space for accommodating an operation structure is enclosed by the side light source and the bottom light source, when the light source assembly is in the first state, the side light source is in a light-emitting state, and the first light beam emitted by the side light source can irradiate the circumferential side surface of the operation structure in the detection space; when the light source assembly is in the second state, the bottom light source is in a light emitting state, and the second light beam emitted by the bottom light source can irradiate the bottom side surface of the operation structure positioned in the detection space; the receiving assembly at least comprises a receiver, the receiving assembly is arranged on one side of the light source assembly, the receiver is used for receiving the first light beam or the second light beam reflected by the operation structure, and whether the operation structure is deviated or not can be timely detected.

Description

Bonding auxiliary system and bonding machine
Technical Field
The present disclosure relates to semiconductor manufacturing technology, and more particularly, to a bonding assisting system and a bonding machine.
Background
The wafer is generally bonded by adopting a bonding machine, the bonding machine realizes bonding operation on the wafer through operation structures such as a chopper, a cutter, a wire guide nozzle and the like, and in the use process of the bonding machine, the operation structures such as the chopper, the cutter, the wire guide nozzle and the like are inevitably free from the condition of working position deviation, and the abnormal working condition of the operation structures can influence the bonding operation on the wafer.
However, the bonding machine in the related art is difficult to find out the abnormal working condition of the operation structure in time.
Disclosure of Invention
Based on this, it is necessary to provide a bonding assistance system and a bonding machine, which solve the problem that the bonding machine in the related art is difficult to find out the abnormal working condition of its operation structure in time.
A bond assist system, the bond assist system comprising:
a housing;
the light source assembly is arranged on the shell and comprises a side light source and a bottom light source, the side light source is used for emitting a first light beam, the bottom light source is used for emitting a second light beam, and the light source assembly is provided with a first state and a second state;
the side light source and the bottom light source enclose a detection space for accommodating an operation structure, when the light source assembly is in the first state, the side light source is in a light emitting state, and the first light beam emitted by the side light source can irradiate the circumferential side surface of the operation structure in the detection space; when the light source assembly is in the second state, the bottom light source is in a light-emitting state, and the second light beam emitted by the bottom light source can irradiate the bottom side surface of the operation structure in the detection space;
the receiving assembly at least comprises a receiver, the receiving assembly is arranged on one side of the light source assembly, and the receiver is used for receiving the first light beam or the second light beam reflected by the operation structure.
In one embodiment, the bonding assistance system includes a controller electrically connected to the side light source and the bottom light source, respectively, to control switching of the side light source and the bottom light source, respectively.
In one embodiment, the housing comprises an outer cover and a cover plate, the outer cover and the cover plate being connected to form a first chamber and a second chamber;
the first chamber and the second chamber are respectively arranged at two sides of the detection space along the first direction, and the side light source is arranged in the first chamber and the second chamber.
In one embodiment, the housing is provided with a first window and a second window, the first window is obliquely oriented to the detection space with respect to the first direction, and the first window is communicated with the detection space and the first chamber;
the second window faces the detection space and is communicated with the detection space and the second chamber.
In one embodiment, the side light source comprises a first side light source and a second side light source;
the first side light source comprises a first light emitting piece and a first diffuse reflection plate which are arranged in the first cavity, and the first diffuse reflection plate is arranged between the first window and the first light emitting piece;
the second side light source comprises a second light emitting piece and a second diffuse reflection plate which are arranged in the second cavity, and the second diffuse reflection plate is arranged between the second window and the second light emitting piece.
In one embodiment, the cover and the cover plate further form a third chamber, and the bottom light source is arranged in the first chamber and the third chamber;
the third chamber is located between the first chamber and the second chamber.
In one embodiment, the outer cover is further provided with a third window and a fourth window, the third window is communicated with the detection space and the third chamber, and the fourth window is communicated with the detection space and the first chamber;
the third window and the fourth window are both obliquely oriented to the detection space along the first direction, and the third window and the fourth window are oppositely arranged.
In one embodiment, the receiving component comprises a half-mirror, a first optical filter and a second optical filter, wherein the half-mirror is arranged between the detection space and the receiver, the half-mirror comprises a first side surface and a second side surface, and the plane of the first side surface is intersected with the plane of the second side surface;
the first filter is arranged on the first side surface, the first filter is used for enabling the first light beam to pass through the half-mirror and filtering out the rest of light rays outside the first light beam, the second filter is arranged on the second side surface, and the second filter is used for enabling the second light beam to pass through the half-mirror and filtering out the rest of light rays outside the second light beam;
the half mirror is configured to reflect the first light beam to the receiver and to transmit the second light beam to the receiver.
In one embodiment, the receiving assembly further comprises a first mirror and a second mirror;
the first reflecting mirror is arranged between the detection space and the first optical filter, and is used for receiving the first light beam reflected by the operation structure in the detection space and reflecting the received first light beam to the first optical filter;
the second reflecting mirror is arranged between the detection space and the second optical filter, and is used for receiving the second light beam reflected by the operation structure in the detection space and reflecting the received second light beam to the second optical filter.
According to another aspect of the present application, there is provided a bonding machine comprising a bonding assistance system as described above, the bonding machine further comprising a bonding system.
According to the bonding auxiliary system and the bonding machine, the first light beam emitted by the side light source and the second light beam emitted by the bottom light source are respectively irradiated to the periphery side and the bottom of the operation structure, and the first light beam or the second light beam reflected by the operation structure is received by the receiving assembly, so that the operation structure can be switched between the first state and the second state through adjusting the light source assembly, namely, one of the side light source and the bottom light source is controlled to emit light, and then the receiver is controlled to receive the first light beam or the second light beam reflected by the operation structure, so that the peripheral side or the bottom side of the operation structure is observed, and the display switching of the visual angle of the peripheral side or the bottom side of the operation structure is realized, so that the abnormal working condition of the operation structure can be found in time.
Drawings
Fig. 1 is an exploded view of the bond assist system of the present application.
FIG. 2 is a cross-sectional view of a bond assist system of the present application showing a circumferential side image of an operating structure.
FIG. 3 is a cross-sectional view of a bottom side image of a bond assist system of the present application showing an operating structure.
Reference numerals illustrate:
10. a bond assist system;
100. a housing; 110. an outer cover; 111. a first window; 112. a second window; 113. a third window; 114. a fourth window; 120. a cover plate; 130. a first chamber; 140. a second chamber; 150. a third chamber; 160. an optical path channel;
200. a light source assembly; 210. a side light source; 211. a first side light source; 2111. a first light emitting member; 2112. a first diffuse reflection plate; 212. a second side light source; 2121. a second light emitting member; 2122. a second diffuse reflection plate; 220. a bottom light source; 221. a first bottom light source; 222. a second bottom light source; 2221. a third diffuse reflection plate; 2222. a fourth light emitting member;
300. a receiving assembly; 310. a receiver; 320. a half-mirror; 330. a first filter; 340. a second filter; 350. a first mirror; 360. a second mirror;
400. an operating structure;
f1, first direction.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
When the bonding machine bonds the wafers, the position deviation of the operation structure is unavoidable, the operation structure deviation can cause bonding failure of the wafers, and if the bonding failure can not be adjusted in time, the material is obviously wasted, and the resources are wasted. However, the bonding machine in the related art is difficult to find out whether the position of the operation structure is offset in time, so that the homing adjustment of the operation structure with offset in time is also difficult.
Based on the defects of the prior art, the application provides a bonding auxiliary system and a bonding machine comprising the bonding auxiliary system, which aim to observe an operation structure 400 of the bonding machine from at least two angles, display structures and positions of different parts of the operation structure 400 in an all-around manner, and switch an observation image into images of different parts of the operation structure 400 by controlling the on and off of light sources irradiating the different parts of the operation structure 400, so that the structures and the positions of the different parts of the operation structure 400 can be observed through simple light source switching, and whether the operation structure 400 is deviated or not can be observed timely or quickly.
Referring to fig. 1, referring to fig. 2 and 3 in combination, the present application provides a bonding assistance system 10, where the bonding assistance system 10 includes a housing 100, a light source assembly 200 and a receiving assembly 300, the light source assembly 200 is disposed on the housing 100, and the light source assembly 200 includes a side light source 210 and a bottom light source 220, and light emitted by the side light source 210 and the bottom light source 220 can be respectively irradiated to different portions of the operation structure 400, such as to a circumferential side and a bottom side of the operation structure 400.
In some embodiments, the side light source 210 is configured to emit a first light beam, the bottom light source 220 is configured to emit a second light beam, and the side light source 210 and the bottom light source 220 enclose a detection space for accommodating the operation structure 400. The first light beam emitted from the side light source 210 is emitted toward the circumferential side surface of the operation structure 400 provided in the detection space, so that it can be irradiated to the circumferential side surface of the operation structure 400. The second light beam emitted from the bottom light source 220 is emitted toward the bottom side of the operation structure 400 provided in the detection space, so that it can be irradiated to the bottom side of the operation structure 400.
Referring to fig. 2 and 3, the light source assembly 200 has a first state and a second state, the side light source 210 is in a light emitting state when the light source assembly 200 is in the first state, and the bottom light source 220 is in a light emitting state when the light source assembly 200 is in the second state. In some embodiments, the bond assist system 10 includes a controller electrically connected to the side light source 210 and the bottom light source 220, respectively, to control the switching of the side light source 210 and the bottom light source 220, respectively.
It will be appreciated that when the light source assembly 200 is in the first state, the first light beam from the side light source 210 can illuminate the circumferential side of the operating structure 400 located in the detection space. When the light source assembly 200 is in the second state, the second light beam emitted by the bottom light source 220 can irradiate the bottom side of the operation structure 400 located in the detection space.
The side light 210 or the bottom light 220 can be controlled to be in a light emitting state by the controller, i.e., the light source assembly 200 is controlled to be switched between the first state and the second state by the controller. In other words, the light source assembly 200 is controlled by the controller to illuminate the circumferential side of the operation structure 400 in the detection space or the bottom side of the operation structure 400 in the detection space.
The bonding assistance system 10 further includes a receiving assembly 300, the receiving assembly 300 including at least a receiver 310, the receiving assembly 300 being disposed on one side of the light source assembly 200, the receiver 310 being configured to receive the first light beam or the second light beam reflected by the operation structure 400. If the controller switches the light source assembly 200 to be in the first state, the first light beam emitted by the side light source 210 irradiates the circumferential side surface of the operation structure 400 located in the detection space, the circumferential side surface of the operation structure 400 located in the detection space reflects the received first light beam to the receiver 310, and the receiver 310 correspondingly images according to the received first light beam, so as to display a graphical representation of the circumferential side surface of the operation structure 400. If the controller switches the light source assembly 200 to be in the second state, the second light beam emitted by the bottom light source 220 irradiates the bottom side surface of the operation structure 400 located in the detection space, the bottom side surface of the operation structure 400 located in the detection space reflects the second light beam received by the bottom side surface to the receiver 310, and the receiver 310 correspondingly images according to the received second light beam, so as to display a diagram of the bottom side surface of the operation structure 400.
The present application causes the receiver 310 to correspondingly receive light reflected from the circumferential side surface of the operation structure 400 or light reflected from the bottom side surface by controlling the turning on and off of the side light source 210 and the bottom light source 220 irradiated on the circumferential side surface of the operation structure 400, thereby displaying a graphic representation of the circumferential side surface or a graphic representation of the bottom side surface of the operation structure 400 correspondingly to imaging.
In some embodiments, the receiver 310 is configured as a camera, and the receiving assembly further includes a display electrically connected to the receiver 310 to display an image of the receiver 310 as a function of the first or second light beam it receives, or to display a graphical representation of the circumferential and bottom sides of the operating structure 400. The light source assembly 200 is controlled to switch between the first state and the second state, the operation structure 400 can be correspondingly displayed in the circumferential side and the bottom side, the operation is convenient and fast, the switching is quick, whether the position of the operation structure 400 is deviated or not can be timely and quickly observed, and excessive manpower is not required to be consumed.
Referring to fig. 1, 2 and 3 in combination, the housing 100 includes a housing 110 and a cover plate 120, the housing 110 and the cover plate 120 are connected to form a first chamber 130 and a second chamber 140, the first chamber 130 and the second chamber 140 are respectively disposed at two sides of the detection space along the first direction F1, and the side light source 210 is disposed in the first chamber 130 and the second chamber 140. It can be appreciated that the side light sources 210 are disposed on two sides of the detection space along the first direction F1, so that the circumferential side surface of the operation structure 400 located in the detection space can be comprehensively irradiated, the first light beam emitted by the side light sources 210 can be irradiated on the circumferential side surface of the operation structure 400 located in the detection space, and the circumferential side surface of the operation structure 400 diffusely reflects the first light beam to the receiving assembly 300, so that the circumferential side surface of the operation structure 400 is displayed.
The housing 110 is provided with a first window 111 and a second window 112, the first window 111 is obliquely oriented to the detection space with respect to the first direction F1, the first window 111 is communicated with the detection space and the first chamber 130, the light beam emitted by the side light source 210 disposed in the first chamber 130 irradiates the detection space through the first window 111, and the propagation direction of the light beam emitted by the side light source 210 disposed in the first chamber 130 intersects with the first direction F1, that is, the light beam emitted by the side light source 210 disposed in the first chamber 130 irradiates the detection space obliquely along the first direction F1, referring to the optical path in fig. 2, the light beam emitted by the side light source 210 disposed in the first chamber 130 can irradiate the operation structure 400 disposed in the detection space obliquely from the oblique side, so that the receiving assembly 300 can display images of the circumferential side surface of the operation structure 400 facing the direction of the first chamber 130 and at least a part of the bottom side surface.
It will be appreciated that if the portion of the operating member facing the direction of the first chamber 130 is configured as a diagonal side, the diagonal outgoing direction of the light beam emitted from the side light source 210 in the first chamber 130 can correspond to the diagonal side of the operating member. The operating components may be set to different shapes, and in other words, the first window 111 is set obliquely, so that the light beam emitted by the side light source 210 in the first chamber 130 obliquely irradiates from the oblique side to the operating structure 400 in the detection space, so that the operating structure 400 can be more comprehensively illuminated, and the operating component is suitable for illumination of the operating components with different shapes.
The second window 112 is oriented to the detection space and is communicated with the detection space and the second chamber 140, and the second light beam emitted by the side light source 210 arranged in the second chamber 140 irradiates the detection space through the second window 112, so that the side surface of the operation structure 400 arranged in the detection space, which is away from the first chamber 130, is illuminated, and an image of the side surface of the operation structure 400, which is away from the first chamber 130, is displayed.
With continued reference to fig. 2, the side light source 210 includes a first side light source 211 and a second side light source 212, where the first side light source 211 includes a first light emitting element 2111 and a first diffuse reflection plate 2112 disposed in the first chamber 130, and the first diffuse reflection plate 2112 is disposed between the first window 111 and the first light emitting element 2111, that is, light emitted from the first light emitting element 2111 passes through the first diffuse reflection plate 2112 and then irradiates the detection space through the first window 111. The second side light source 212 includes a second light emitting member 2121 and a second diffuse reflection plate 2122 disposed in the second chamber 140, the second diffuse reflection plate 2122 is disposed between the second window 112 and the second light emitting member 2121, and light emitted from the second light emitting member 2121 passes through the second window 112 after passing through the second diffuse reflection plate 2122 and irradiates the detection space.
In some embodiments, the first luminescent member 2111 and the second luminescent member 2121 are each configured to emit red light having a wavelength in the range of 600-660nm, i.e., the present application irradiates the circumferential side of the operation structure 400 disposed in the detection space with red light, and the receiving assembly 300 receives the red light reflected from the circumferential side of the operation structure 400 and displays an image of the circumferential side of the operation structure 400.
Referring to fig. 2 and 3, the cover 110 and the cover plate 120 are further formed with a third chamber 150, the bottom light 220 is disposed in the first chamber 130 and the third chamber 150, and the third chamber 150 is disposed between the first chamber 130 and the second chamber 140. The housing 110 is further provided with a third window 113 and a fourth window 114, the third window 113 is communicated with the detection space and the third chamber 150, the light beam emitted by the bottom light source 220 arranged in the third chamber 150 irradiates the detection space through the third window 113, the fourth window 114 is communicated with the detection space and the first chamber 130, and the light beam emitted by the bottom light source 220 arranged in the first chamber 130 irradiates the detection space through the fourth window 114.
The third window 113 and the fourth window 114 are both obliquely oriented toward the detection space along the first direction F1, and the third window 113 and the fourth window 114 are disposed opposite to each other. That is, the propagation directions of the light beam emitted from the bottom light source 220 disposed in the first chamber 130 and the light beam emitted from the bottom light source 220 disposed in the third chamber 150 are both obliquely irradiated to the detection space along the first direction F1, and are relatively irradiated to the bottom side surface of the operation structure 400 disposed in the detection space, so that the bottom side surface of the operation structure 400 can be comprehensively illuminated, and thus, the bottom side surface image of the complete operation structure 400 can be displayed.
Referring to fig. 1-3, the bottom light source 220 includes a first bottom light source 221 and a second bottom light source 222, the first bottom light source 221 includes a third light emitting element disposed in the first chamber 130, the third light emitting element is disposed on a side of the first diffuse reflection plate 2112 facing away from the fourth window 114, it is understood that the first light emitting element 2111 of the side light source 210 and the third light emitting element of the bottom light source 220 are both disposed in the first chamber 130, the first window 111 and the fourth window 114 are disposed at positions of the housing 110 corresponding to the first chamber 130, and correspondingly, light emitted by the first light emitting element 2111 propagates to the detection space through the first diffuse reflection plate 2112 and the first window 111, and light emitted by the third light emitting element propagates to the detection space through the first diffuse reflection plate 2112 and the fourth window 114.
The second bottom light source 222 includes a fourth light emitting element 2222 and a third diffuse reflection plate 2221 disposed in the second chamber 140, the third diffuse reflection plate 2221 is disposed between the third window 113 and the fourth light emitting element 2222, and light emitted from the fourth light emitting element 2222 propagates to the detection space through the third diffuse reflection plate 2221 and the third window 113. The bottom light source 220 can illuminate the bottom side surface of the operation structure 400 located in the detection space from the two sides of the bottom in the first direction F1 through the third window 113 and the fourth window 114 which are correspondingly arranged, the image of the bottom side surface of the complete operation structure 400 can be displayed by combining the receiving component 300, and whether the position of the operation structure 400 is offset or not can be accurately observed.
Referring to fig. 1 to 3, the receiving assembly 300 includes a half mirror 320, a first filter 330 and a second filter 340 disposed between the detection space and the receiver 310, the half mirror 320 includes a first side and a second side, a plane where the first side is located intersects with a plane where the second side is located, the half mirror 320 further includes a half mirror film, a first light beam reflected by the operation structure 400 disposed in the detection space propagates onto the half mirror film through the first side, propagates to the receiving assembly 300 after being reflected by the half mirror film, and correspondingly, a second light beam reflected by the operation structure 400 disposed in the detection space propagates onto the half mirror film through the second side and passes through the half mirror film to the receiving assembly 300. In other words, the half mirror 320 is configured to reflect the first light beam to the receiver 310 and to transmit the second light beam to the receiver 310. The setting of half mirror for the light path after the first light beam passes through half mirror and the light path after the second light beam passes through half mirror are all in same passageway, have saved the space relatively, are convenient for realize the miniaturized design of bonding auxiliary system 10. As shown in fig. 2 and 3, the housing 100 and the outer cover 110 further form an optical path channel 160 between the half mirror and the receiver 310, and the first light beam and the second light beam are transmitted to the receiver 310 through the optical path channel 160 after passing through the half mirror, without providing an additional channel. And in realizing the miniaturized design of bonding auxiliary system 10, the setting of half-transparent half-reflecting mirror still is favorable to saving the cost, and the maintenance of being convenient for need not to set up lenses such as other speculums, can realize all propagating the first light beam and the second light beam of operation structure 400 reflection to receiver 310 in, easy maintenance, simple to operate saves the cost.
The first side is provided with a first optical filter 330, the first optical filter 330 is used for enabling the first light beam to pass through the half-mirror 320 and filtering out the rest of light rays outside the first light beam so as to improve the imaging quality of the receiving element, the second optical filter 340 is arranged on the second side, and the second optical filter 340 is used for enabling the second light beam to pass through the half-mirror 320 and filtering out the rest of light rays outside the second light beam so as to improve the imaging quality of the receiving element. That is, the arrangement of the first filter 330 and the second filter 340 can improve the quality of the light transmitted from the half mirror 320 to the receiver 310, thereby improving the clarity of the imaged image, and facilitating accurate observation of whether the position of the operation structure 400 is shifted.
As shown in fig. 2 and 3, the receiving assembly 300 further includes a first reflecting mirror 350 and a second reflecting mirror 360, the first reflecting mirror 350 is disposed between the detection space and the first optical filter 330, the first reflecting mirror 350 is configured to receive the first light beam reflected by the operation structure 400 located in the detection space and reflect the received first light beam to the first optical filter 330, the second reflecting mirror 360 is disposed between the detection space and the second optical filter 340, and the second reflecting mirror 360 is configured to receive the second light beam reflected by the operation structure 400 located in the detection space and reflect the received second light beam to the second optical filter 340. That is, the first reflecting mirror 350 is disposed with respect to the circumferential side of the operation structure 400 located in the detection space, the second reflecting mirror 360 is disposed with respect to the bottom side of the operation structure 400 located in the detection space, and the above-mentioned disposition of the first reflecting mirror 350 and the second reflecting mirror 360 can comprehensively receive the light beams reflected by the circumferential side and the bottom side of the operation structure 400, thereby forming a more complete image, improving the image display range and the image quality, and facilitating the observation and inspection.
The present application further provides a bonding machine, including the bonding auxiliary system 10, where the bonding machine further includes a bonding system, and the bonding system is used for bonding a wafer, and it can be understood that the bonding system at least includes an operation structure 400, and bonds the wafer through the operation structure 400. The bonding assistance system 10 may be provided at one side of the operation structure 400 and the operation structure 400 may be positioned in a detection space of the bonding assistance system 10, so that images of the circumferential side and the bottom side of the operation structure 400 are displayed through the bonding assistance system 10 and whether the position of the operation structure 400 is shifted is detected in time.
The bonding auxiliary system 10 and the bonding machine of the present application switch between the first state and the second state by adjusting the light source assembly 200, and the control receiver 310 receives the first light beam or the second light beam reflected by the operation structure 400, so as to observe the circumferential side or the bottom side of the operation structure 400, and realize display switching of the visual angle of the circumferential side or the bottom side of the operation structure 400, so as to discover the abnormal working condition of the operation structure 400 in time.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (8)

1. A bond assist system, the bond assist system comprising:
a housing;
the light source assembly is arranged on the shell and comprises a side light source and a bottom light source, the side light source is used for emitting a first light beam, the bottom light source is used for emitting a second light beam, and the light source assembly is provided with a first state and a second state;
the side light source and the bottom light source enclose a detection space for accommodating an operation structure, when the light source assembly is in the first state, the side light source is in a light emitting state, and the first light beam emitted by the side light source can irradiate the circumferential side surface of the operation structure in the detection space; when the light source assembly is in the second state, the bottom light source is in a light-emitting state, and the second light beam emitted by the bottom light source can irradiate the bottom side surface of the operation structure in the detection space;
the receiving assembly at least comprises a receiver, the receiving assembly is arranged on one side of the light source assembly, and the receiver is used for receiving the first light beam or the second light beam reflected by the operation structure;
the receiving assembly comprises a half-mirror, a first optical filter and a second optical filter, wherein the half-mirror, the first optical filter and the second optical filter are arranged between the detection space and the receiver, the half-mirror comprises a first side surface and a second side surface, and the plane where the first side surface is located is intersected with the plane where the second side surface is located;
the first filter is arranged on the first side surface, the first filter is used for enabling the first light beam to pass through the half-mirror and filtering out the rest of light rays outside the first light beam, the second filter is arranged on the second side surface, and the second filter is used for enabling the second light beam to pass through the half-mirror and filtering out the rest of light rays outside the second light beam;
the half mirror is configured to reflect the first light beam to the receiver and to transmit the second light beam to the receiver;
the receiving assembly further comprises a first mirror and a second mirror;
the first reflecting mirror is arranged between the detection space and the first optical filter, and is used for receiving the first light beam reflected by the operation structure in the detection space and reflecting the received first light beam to the first optical filter;
the second reflecting mirror is arranged between the detection space and the second optical filter, and is used for receiving the second light beam reflected by the operation structure in the detection space and reflecting the received second light beam to the second optical filter.
2. The bonding assistance system of claim 1, comprising a controller electrically connected to the side light source and the bottom light source, respectively, to control switching of the side light source and the bottom light source, respectively.
3. The bonding aid system according to claim 1, wherein the housing comprises an outer cover and a cover plate connected to form a first chamber and a second chamber;
the first chamber and the second chamber are respectively arranged at two sides of the detection space along the first direction, and the side light source is arranged in the first chamber and the second chamber.
4. A bonding assistance system according to claim 3, wherein said housing defines a first window and a second window, said first window being oriented obliquely to said first direction toward said detection space and said first window being in communication with said detection space and said first chamber;
the second window faces the detection space and is communicated with the detection space and the second chamber.
5. The bonding assistance system of claim 4, wherein the side light source comprises a first side light source and a second side light source;
the first side light source comprises a first light emitting piece and a first diffuse reflection plate which are arranged in the first cavity, and the first diffuse reflection plate is arranged between the first window and the first light emitting piece;
the second side light source comprises a second light emitting piece and a second diffuse reflection plate which are arranged in the second cavity, and the second diffuse reflection plate is arranged between the second window and the second light emitting piece.
6. The bonding aid system according to claim 5, wherein the housing and the cover plate further form a third chamber, the bottom light source being disposed within the first chamber and the third chamber;
the third chamber is located between the first chamber and the second chamber.
7. The bonding assistance system of claim 6, wherein the housing is further provided with a third window and a fourth window, the third window being in communication with the detection space and the third chamber, the fourth window being in communication with the detection space and the first chamber;
the third window and the fourth window are both obliquely oriented to the detection space along the first direction, and the third window and the fourth window are oppositely arranged.
8. A bonding machine comprising a bonding assist system according to any of claims 1-7, the bonding machine further comprising a bonding system.
CN202410116195.XA 2024-01-29 2024-01-29 Bonding auxiliary system and bonding machine Active CN117650086B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000194277A (en) * 1998-12-28 2000-07-14 Toshiba Corp Bonding device
CN110752164A (en) * 2019-11-20 2020-02-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Chip and base plate counterpoint and fine leveling's micro laser system
CN114695229A (en) * 2022-03-31 2022-07-01 深圳市联得自动化装备股份有限公司 Bonding alignment device, flip chip bonding machine and bonding method
CN115714103A (en) * 2022-11-25 2023-02-24 拓荆键科(海宁)半导体设备有限公司 Apparatus and method for wafer bonding alignment and detection
CN116520623A (en) * 2023-04-19 2023-08-01 苏州市路远智能装备有限公司 Element identification device, identification mechanism, chip mounter and identification method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000194277A (en) * 1998-12-28 2000-07-14 Toshiba Corp Bonding device
CN110752164A (en) * 2019-11-20 2020-02-04 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Chip and base plate counterpoint and fine leveling's micro laser system
CN114695229A (en) * 2022-03-31 2022-07-01 深圳市联得自动化装备股份有限公司 Bonding alignment device, flip chip bonding machine and bonding method
CN115714103A (en) * 2022-11-25 2023-02-24 拓荆键科(海宁)半导体设备有限公司 Apparatus and method for wafer bonding alignment and detection
CN116520623A (en) * 2023-04-19 2023-08-01 苏州市路远智能装备有限公司 Element identification device, identification mechanism, chip mounter and identification method

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