JP2016092094A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device that can simultaneously image a component and a board even when the downward stroke of the component during mounting of the component is small.SOLUTION: An imaging unit 13 that images a component 4 from the lower side and images a target site 3d from the upper side while the component 4 held by a mount head 12 is located at a pre-mounting position above the target site 3d has a tip portion 13B inserted between the component 4 and the target site 3d. The tip portion 13B is provided with an upper window 13J to which reflection light from the component 4 is incident, and a lower window 13K to which reflection light from the board 3 is incident. A light guide path 23 for illumination through which light emitted from an illumination light source 40 to the upper side of the upper window 13J and the lower side of the lower window 13K is disposed to be housed within the dimension d in the up-and-down direction of a light guide path 24 for imaging through which light incident from the upper window 13J and light incident from the lower window 13K are guided to an imaging unit 22.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a component mounting apparatus for mounting a component held by a mounting head on a target portion on a positioned substrate.

  In a component mounting apparatus such as a flip chip bonder used in a semiconductor assembly process, a mounting head holding a component is positioned at a pre-mounting position above a target portion on a positioned substrate, and then the component and the component portion After aligning, the part is lowered and the part is mounted on the target part.

  The alignment of the part and the target part is performed by inserting the imaging unit between the part located at the pre-mounting position and the target part, and imaging the part from the upper window provided in the imaging unit, and the target part from the lower window. Imaging is performed based on both images obtained thereby (for example, Patent Document 1). By simultaneously imaging the part and the target part using the imaging unit in this way, it is possible to perform alignment before mounting the part cost with high accuracy, and to improve the tact by shortening the time required for imaging. be able to.

Japanese Patent No. 5353840

  However, in recent years, higher component mounting accuracy has been demanded, and in accordance with this, the descending stroke of the component during component mounting has become smaller. For this reason, the imaging unit cannot be inserted between the part and the target part, and there is a problem in that separate imaging may be necessary because simultaneous imaging of the part and the target part cannot be performed.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting apparatus that can perform simultaneous imaging of a component and a board even when the component descending stroke during component mounting is small.

  The component mounting apparatus of the present invention includes a board positioning unit that positions a board, a mounting head that holds a component and is mounted on a target site on the board positioned by the board positioning unit, and is held by the mounting head An imaging unit that images the component with a first field of view and images the substrate with a second field of view, with the component positioned at a pre-mounting position above the target site, and an imaging result of the imaging unit And a correction value calculation unit that calculates a correction value for alignment between the component and the board based on the imaging unit, the imaging unit between the component located at the pre-mounting position and the target portion A tip portion having an upper window to which the reflected light from the component is incident and a lower window to which the reflected light from the substrate is incident; and light emitted from a light source for illumination is disposed above the upper window and the An illumination light guide that leads to a lower part of the window; and an imaging light guide that guides light incident from the upper window and light incident from the lower window to the imaging unit, and the illumination light guide is used for the imaging It arrange | positions so that it may be settled in the dimension of the up-down direction of a light guide.

  According to the present invention, simultaneous imaging of a component and a board can be performed even when the descending stroke of the component during component mounting is small.

The block diagram of the component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing of the component mounting apparatus in one embodiment of this invention The figure which shows the condition where the component mounting apparatus in one embodiment of this invention images a component and a target site | part with an imaging unit 1 is a partially exploded perspective view of an imaging unit provided in a component mounting apparatus according to an embodiment of the present invention. The perspective view of the imaging unit with which the component mounting apparatus in one embodiment of this invention is provided The partial side view of the component mounting apparatus in one embodiment of this invention (A) (b) The partial expansion perspective view of the imaging unit with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) The partial expansion perspective view of the imaging unit with which the component mounting apparatus in one embodiment of this invention is provided The partial expansion perspective view of the imaging unit with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) The partial expanded side view of the imaging unit with which the component mounting apparatus in one embodiment of this invention is provided

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is an apparatus that repeats a process of crimping (mounting) a component 4 to each target portion 3 d on each substrate 3 with respect to a plurality of substrates 3 held by the carrier 2. The component mounting apparatus 1 includes a board positioning unit 11, a mounting head 12, an imaging unit 13, and a component supply unit (not shown).

  The substrate positioning portion 11 moves in one direction (front-rear direction) in the horizontal plane and in a horizontal plane direction (left-right direction) orthogonal to the carrier plane 2 while holding the carrier 2, and moves the carrier 2 (that is, the substrate 3) in the horizontal plane. Position.

  The mounting head 12 includes a head main body 12a and a nozzle portion 12b extending downward from the head main body 12a. The nozzle portion 12b is moved up and down and rotated about the vertical axis with respect to the head main body 12a by a nozzle portion driving mechanism 12c built in the head main body 12a. The mounting head 12 is moved in the front-rear direction and the left-right direction by the mounting head moving mechanism 14.

  As shown in FIGS. 1 and 2A, 2B, and 2C, the imaging unit 13 has a front end portion 13B that extends forward. The tip portion 13B has an upper window 13J that opens upward and a lower window 13K that opens downward. The imaging unit 13 captures an image of an object positioned above the upper window 13J through the upper window 13J with a first field of view corresponding to the upper window 13J, and the second image corresponding to the lower window 13K through the lower window 13K. The object located below the lower window 13K is imaged by the visual field. The imaging unit 13 is moved in the front-rear direction and the left-right direction by the imaging unit moving mechanism 15.

  The control device 16 controls the positioning of the carrier 2 (that is, the substrate 3) by the substrate positioning unit 11, the raising and lowering of the nozzle unit 12b relative to the head body 12a by the nozzle unit driving mechanism 12c, the rotation about the vertical axis, and the imaging by the imaging unit 13. To do. The control device 16 also controls movement control of the mounting head 12 by the mounting head moving mechanism 14 and movement control of the imaging unit 13 by the imaging unit moving mechanism 15.

  Next, the operation of each part until the component 4 in this embodiment is mounted on the substrate 3 will be described. The substrate positioning unit 11 receives and holds the carrier 2 loaded from the outside, and moves in a horizontal plane to position the carrier 2 at a predetermined work position. The mounting head 12 is moved by being driven by the mounting head moving mechanism 14, and the component 4 supplied by the component supply unit is held (sucked) by the nozzle unit 12 b. The mounting head 12 holding the component 4 moves above the substrate 3 and positions the component 4 at a position above the target portion 3d on the substrate 3 (pre-mounting position) (FIG. 2A). When the component 4 is located at the pre-mounting position, the imaging unit 13 is driven and moved by the imaging unit moving mechanism 15 to insert the tip 13B between the component 4 located at the pre-mounting position and the target portion 3d (FIG. 2). (B) The arrow A1), the upper window 13J is positioned below the component 4, and the lower window 13K is positioned above the target portion 3d (FIG. 2B).

  Next, the operation of the imaging unit 13 after the upper window 13J of the imaging unit 13 is positioned below the component 4 and the lower window 13K is positioned above the target portion 3d will be described. The illumination light source 40 illuminates the component 4 and the target portion 3 d through the illumination light guide 23. The imaging unit 13 images the component 4 from below through the upper window 13J, and simultaneously images the target portion 3d on the substrate 3 from above through the lower window 13K (imaging process). That is, the imaging unit 13 images the component 4 from below with the component 4 positioned at the pre-mounting position above the target portion 3d before the component 4 is mounted on the target portion 3d by the mounting head 12. 3d is imaged from above.

  Next, the flow of image correction after the imaging unit 13 images the component 4 and the target part 3d will be described. The correction value calculation unit 16a (FIG. 1) of the control device 16 calculates a necessary correction value based on both obtained images (an image of the component 4 viewed from below and an image of the target site 3d viewed from above). (Correction value calculation step). The correction value calculated here is component mounting necessary for correcting the positional deviation in the XYθ direction between the component 4 positioned at the pre-mounting position and the target portion 3d on the substrate 3 to be within a predetermined range. It is an operating parameter of the device 1. In other words, the component 4 is mounted on the target portion 3d of the board 3 with the positional deviation included in a predetermined range by correcting the relative positional relationship between the component 4 and the target portion 3d by this correction value. Can do. Here, the term “within a predetermined range” means that the positional deviation between the component 4 and the target portion 3d of the board 3 does not cause a problem.

  For example, as shown in FIG. 3, the component 4 is provided with a pair of component-side patterns M11 and M12 (reference portion on the component 4 side), and the target portion 3d has a pair corresponding to the component-side patterns M11 and M12. Target portion side patterns M21 and M22 (reference portion on the substrate 3 side) are provided. In this case, component-side patterns M11 and M12 appear in an image (first image) including at least a part of the component 4 obtained by imaging the component 4 from below, and the target part 3d is imaged from above. Target part side patterns M21 and M22 appear in an image (second image) including at least a part of the substrate 3 to be obtained. Therefore, based on the first image and the second image, the positional deviation between the component 4 and the target site 3d can be obtained.

  When the correction value calculation unit 16a calculates the correction value as described above, the imaging unit moving mechanism 15 causes the imaging unit 13 to extract the tip 13B from between the component 4 and the target part 3d (FIG. 2C). Arrow A2) shown in the figure. Then, position correction is performed based on the correction value calculated by the correction value calculation unit 16a, and the part 4 and the target part 3d are aligned (position correction process). The position correction by the correction value is performed by moving the carrier 2 (that is, the substrate 3) in the horizontal plane by the substrate positioning unit 11 for the correction in the horizontal plane direction, and the mounting head for correcting the rotation direction of the component 4 about the vertical axis. 12 by the rotation of the nozzle portion 12b (ie, the component 4). When the alignment (position correction) between the component 4 and the target portion 3d is completed, the mounting head 12 lowers the nozzle portion 12b with respect to the head main body 12a (arrow B shown in FIG. 2C), and the nozzle portion 12b. The component 4 held in step 1 is pressure-bonded (mounted) to the target portion 3d (FIG. 2C).

  Next, the configuration of the imaging unit 13 in the present embodiment will be described.

  4, 5, and 6, the imaging unit 13 includes a casing 20 that includes a main portion 20 </ b> A and an extending portion 20 </ b> B that extends in the horizontal direction (frontward) from the front end lower portion thereof. A light source unit 21 and an imaging unit 22 are externally provided on the rear surface of the main unit 20A. In FIG. 4, the casing 20 includes a casing body 20H that opens upward and a cover member 20K that covers the casing body 20H from above. An illumination light guide 23 and an imaging light guide 24 are accommodated in the casing body 20H. Here, the light guide 23 for illumination is a light guide that guides the light from the light source unit 21 to the upper window 13J and the lower window 13K and irradiates the component 4 and the target portion 3d simultaneously. The imaging light guide 24 guides the light incident from the upper window 13J that forms the first visual field to the imaging unit 22, and transmits the light incident from the lower window 13K that forms the second visual field to the imaging unit 22. It is a light guide to guide.

  4, 5, and 6, the main part 20 </ b> A of the casing 20 and a part of the optical system (the illumination light guide 23 and the imaging light guide 24) corresponding to the inside of the main part 20 </ b> A, the light source part 21 and the imaging part. 22 constitutes a main body 13A of the imaging unit 13. A part of the optical system (illumination light guide 23 and imaging light guide 24) corresponding to the extension 20B and the extension 20B of the casing 20 is partly extended from the main body 13A of the imaging unit 13. 13B is configured. As described above, in the present embodiment, the imaging light guide path 24 that guides the light incident from the upper window 13J and the light incident from the lower window 13K to the imaging unit 22 provided in the main body part 13A includes the distal end part 13B and the main body part 13A. It is the structure provided across.

  In FIG. 6, the main body 13 </ b> A of the imaging unit 13 has a vertical dimension D that is greater than the distance h between the component 4 located at the pre-mounting position and the target portion 3 d. On the other hand, the front end portion 13B of the imaging unit 13 has a vertical dimension d smaller than the distance h between the component 4 located at the pre-mounting position and the target portion 3d. For this reason, the main body portion 13A cannot be inserted between the component 4 located at the pre-mounting position and the target portion 3d, but the tip portion 13B can be inserted. The upper window 13J through which the reflected light from the component 4 enters is opened on the upper surface (that is, the tip portion 13B) of the extending portion 20B of the casing 20, and the substrate 3 (target site) is formed on the lower surface of the extending portion 20B. The above-described lower window 13K into which the reflected light from 3d) is incident is opened.

  As described above, in the present embodiment, the imaging unit 13 includes the main body portion 13A having the vertical dimension D larger than the distance h between the component 4 located at the pre-mounting position and the target portion 3d, and the main body portion 13A. And a tip portion 13B that is inserted between the part 4 and the target portion 3d that are located at the pre-mounting position. The distal end portion 13B of the imaging unit 13 is provided with an upper window 13J through which reflected light from the component 4 enters and a lower window 13K through which reflected light from the substrate 3 enters.

  4 and 5, a multi-prism 30 is provided in the casing 20. As shown in FIGS. 7A and 7B, the multi-prism 30 has an elongated ring shape as a whole, and includes a front light guide portion 31, a left light guide portion 32 (first horizontal light guide portion), The right light guide 33 (second horizontal light guide), the rear light guide 34, and the rear mirror member 35 are integrally formed, and an accommodation space 30S is formed in them. A block member 30B is accommodated in the accommodating space 30S. The side surface of the block member 30 </ b> B is fixed to the multi-prism 30. The multi-prism 30 can be attached to the casing 20 by screwing the block member 30B to the bottom surface of the casing main body 20H with two fixing screws 30N (see also FIG. 4).

  As shown in FIGS. 7A and 7B, when the multi-prism 30 is attached to the casing 20, the front light guide 31 extends in the left-right direction between the upper window 13J and the lower window 13K. The left light guide portion 32 extends rearward from the left end of the front light guide portion 31, and the right light guide portion 33 extends rearward from the right end of the front light guide portion 31. The rear light guide 34 extends in the left-right direction so as to connect the rear ends of the left light guide 32 and the right light guide 33, and the rear mirror member 35 is located behind the rear light guide 34. It extends in the left-right direction.

  At a position between the upper window 13J and the lower window 13K of the front light guide section 31, a front central reflecting surface 31m is provided that is disposed at an angle of 45 degrees with respect to the direction in which the front light guide section 31 extends. . The front center reflecting surface 31m has reflecting surfaces on both upper and lower sides.

  In FIG. 5, the light source unit 21 includes four illumination light sources 40 that are arranged two above and below at positions sandwiching the imaging unit 22 from both left and right sides. The four illumination light sources 40 are arranged on the upper left side of the image pickup unit 22, the light source for oblique upper irradiation 41, the light source for oblique lower irradiation 42 arranged on the upper right side of the image pickup unit 22, and the lower left side of the image pickup unit 22. The light source 43 for direct upper irradiation and the light source 44 for direct lower irradiation disposed on the lower right side of the imaging unit 22 are configured. For each illumination light source 40, for example, an LED light source is used.

  4 and 5, the light guide 23 for illumination is directed to the vertical direction (the direction in which light travels during imaging) of the component 4 positioned above the upper window 13J and the target portion 3d positioned below the lower window 13K. A light guide for oblique illumination that illuminates from the front and rear oblique directions, and a light guide for coaxial illumination that illuminates the part 4 located above the upper window 13J and the target portion 3d located below the lower window 13K from the vertical direction, respectively. . The oblique illumination light guide path includes a front upper irradiation light guide path 51A, a rear upper irradiation light guide path 51B, a front lower irradiation light guide path 52A, and a rear lower irradiation light guide path 52B (FIGS. 4 and 5). The coaxial illumination light guide path includes a directly upper irradiation light guide path 53 and a directly lower irradiation light guide path 54 (FIGS. 8A and 8B).

  The front upper irradiation light guide path 51A includes a fiber light guide (front upper irradiation guide 61a) that guides light emitted from the obliquely upper irradiation light source 41 forward. The front upper irradiation guide 61a extends forward on the left side of the multi-prism 30 and turns 180 degrees in the front area of the multi-prism 30 and faces rearward. And the front-end | tip part of front upper irradiation light guide way 51A is supported by the front support part 55a formed in the casing main body 20H, is located in the front edge upper part of the front light guide part 31, and faces the upper window 13J (FIG. 9 and FIGS. 10 (a) and 10 (b)). For this reason, when the obliquely upward irradiation light source 41 is turned on with the component 4 positioned directly above the upper window 13J, the light emitted from the obliquely upward irradiation light source 41 is guided to the upper window 13J by the front upper irradiation light guide path 51A. The part 4 is irradiated from the front obliquely lower side. Here, FIG. 10B is an enlarged view of the region RR shown in FIG.

  The rear upper irradiation light guide path 51B includes a fiber light guide (rear upper irradiation guide 61b) that guides light emitted from the oblique upper irradiation light source 41 forward. The rear upper irradiation guide 61b branches from the front upper irradiation guide 61a and extends forward in the accommodating space 30S of the multi-prism 30 (between the left light guide portion 32 and the right light guide portion 33) (FIG. 4 and FIG. 5). The front end portion of the rear upper irradiation light guide path 51B is supported by a rear support portion 55b formed on the casing body 20H, is located at the upper rear edge of the front light guide portion 31, and faces the upper window 13J (FIGS. 9 and 9). 10 (a), (b)). For this reason, when the light source 41 for obliquely upward irradiation is turned on with the component 4 positioned immediately above the upper window 13J, the light emitted from the obliquely upward irradiation light source 41 is guided to the upper window 13J by the rear upper irradiation light guide path 51B. The component 4 is irradiated obliquely from below and rearward.

  The front lower irradiation light guide path 52A includes a fiber light guide (front lower irradiation guide 62a) that guides light emitted from the oblique lower irradiation light source 42 forward. The front lower irradiation guide 62a extends forward on the right side of the multi-prism 30 and turns 180 degrees in the front area of the multi-prism 30 and faces rearward. And the front-end | tip part of the front lower irradiation light guide way 52A is supported by the above-mentioned front support part 55a, is located in the front edge lower part of the front light guide part 31, and faces the lower window 13K (FIG. 10 (a), ( b)). For this reason, when the oblique lower irradiation light source 42 is turned on with the target portion 3d positioned directly below the lower window 13K, the light emitted from the oblique lower irradiation light source 42 is guided to the lower window 13K by the front lower irradiation light guide path 52A. Then, the target part 3d is irradiated obliquely from the front upper side.

  The rear lower irradiation light guide path 52B includes a fiber light guide (rear lower irradiation guide 62b) that guides light emitted from the oblique lower irradiation light source 42 forward. The rear lower irradiation guide 62b branches from the front lower irradiation guide 62a and extends forward in the accommodation space 30S of the multi-prism 30 (FIGS. 4 and 5). The front end portion of the rear lower irradiation light guide path 52B is supported by the above-described rear support portion 55b, is located at the lower rear edge of the front light guide portion 31, and faces the lower window 13K (FIGS. 9 and 10A). (B)). For this reason, when the oblique lower irradiation light source 42 is turned on with the target portion 3d positioned directly below the lower window 13K, the light emitted from the oblique lower irradiation light source 42 is guided to the lower window 13K by the rear lower irradiation light guide path 52B. The target part 3d is irradiated from behind and obliquely upward.

  The directly upper irradiation light guide path 53 is located in front of the fiber light guide (directly upper irradiation guide 63a) for guiding the light emitted from the directly upper irradiation light source 43 forward and the front end portion of the directly upper irradiation guide 63a. It consists of a left front reflecting mirror 63m and a front central reflecting surface 31m of the multi-prism 30 (FIGS. 8A and 8B). The direct upper irradiation guide 63a extends forward on the left side of the multi-prism 30, and the left front reflection mirror 63m is located on the left side of the front light guide portion 31 of the multi-prism 30 (FIGS. 8A and 8B). b)). The light emitted from the light source 43 for direct upper illumination is guided to the guide 63a for direct upper illumination and emitted forward, then reflected to the right by the left front reflection mirror 63m, and incident on the multi-prism 30 to enter the front light guide section. After proceeding to the right in 31, the upper central reflecting surface 31 m reflects upward and the upper window 13 </ b> J is irradiated from below vertically. For this reason, when the light source 43 for direct upper irradiation is turned on with the component 4 positioned immediately above the upper window 13J, the light emitted from the light source 43 for direct upper irradiation is guided to the upper window 13J by the direct upper irradiation light guide path 53. The component 4 is irradiated from directly below.

  The directly below irradiation light guide path 54 is positioned in front of the front end of the fiber light guide (directly below irradiation guide 64a) that guides light emitted from the directly below irradiation light source 44 and the directly below irradiation guide 64a. It consists of a right front reflecting mirror 64m and a front central reflecting surface 31m of the multi-prism 30 (FIGS. 8A and 8B). The direct downward irradiation guide 64a extends forward on the right side of the multi-prism 30, and the right front reflection mirror 64m is positioned on the right side of the front light guide portion 31 of the multi-prism 30 (FIGS. 8A and 8B). b)). The light emitted from the light source 44 for direct downward irradiation is guided to the guide 64a for direct downward irradiation and emitted forward, then reflected to the left by the right front reflection mirror 64m, and incident on the multi-prism 30 to enter the front light guide section. After proceeding to the left in 31, the light is reflected downward by the front central reflecting surface 31 m to irradiate the lower part of the lower window 13 </ b> K from vertically above. For this reason, when the light source 44 for direct irradiation is turned on with the target portion 3d positioned directly below the lower window 13K, the light emitted from the light source 44 for direct downward irradiation is guided to the lower window 13K by the direct irradiation light guide path 54. The target part 3d is irradiated from directly above.

  As can be seen from the above description, the oblique upper irradiation light source 41 and the oblique lower irradiation light source 42 are turned on with the component 4 positioned above the upper window 13J and the target portion 3d positioned below the lower window 13K. Then, the component 4 is illuminated from the front lower side and the rear lower side, and the target portion 3d is illuminated from the front upper side and the rear upper direction (FIGS. 10A and 10B). For this reason, when the imaging unit 13 images the part 4 and the target part 3d located at the pre-mounting position by oblique illumination, the oblique upper illumination light source 41 and the oblique lower illumination light source 42 are turned on, and the direct illumination is performed. The light source 43 and the light source 44 for direct irradiation may be turned off.

  Further, when the component 4 is positioned above the upper window 13J and the target portion 3d is positioned below the lower window 13K, the component 4 is turned on when the light source 43 for direct upper irradiation and the light source 44 for direct lower irradiation are turned on. While being illuminated from directly below (FIG. 8 (a)), the target portion 3d is illuminated from directly above (FIG. 8 (b)). For this reason, when the imaging unit 13 images the component 4 and the target portion 3d located at the pre-mounting position by coaxial illumination, the light source 43 for direct upper irradiation and the light source 44 for direct lower irradiation are turned on to perform oblique upper irradiation. The light source 41 and the obliquely downward irradiation light source 42 may be turned off.

  Next, the imaging light guide 24 will be described. 4, 5, 6, and 7 (a) and 7 (b), the imaging light guide 24 is provided above the multi-prism 30 and the rear end of the multi-prism 30 (in the main body 13 </ b> A). The image pickup unit incident mirror member 70 is formed.

  The reflected light from the component 4 is incident from above through the upper window 13J (FIG. 7A). The reflected light from the component 4 incident on the upper window 13J is reflected leftward at the front central reflecting surface 31m of the multi-prism 30 (FIG. 7A), and is the left front reflecting surface located at the front end of the left light guide portion 32. After being reflected rearward at 32a, it is reflected rightward at the left rear reflecting surface 32b located at the rear end of the left light guide 32 (FIG. 7A). Then, the light is reflected backward on the left reflective surface 34a provided on the left side of the rear light guide 34 (FIG. 7A), and further reflected upward on the rear reflective surface 35m of the rear mirror member 35 (FIG. 7). (A) Reflected backward by the imaging unit incident mirror member 70 and imaged on the left side region of the imaging surface 22a of the imaging unit 22 (FIG. 7A). If it does, the image which looked at the component 4 from the downward direction will be projected on the left area | region of the imaging surface 22a of the imaging part 22. FIG.

  On the other hand, the reflected light from the substrate 3 (target site 3d) enters from below vertically through the lower window 13K (FIG. 7B). The reflected light from the substrate 3 that has entered the lower window 13K is reflected rightward on the front central reflecting surface 31m of the multiprism 30 (FIG. 7B), and the right front reflecting surface located at the front end of the right light guide 33. After being reflected rearward at 33a (FIG. 7B), it is reflected leftward at the right rear reflecting surface 33b located at the rear end of the right light guide 33 (FIG. 7B). Then, the light is reflected backward on the right reflecting surface 34b provided on the right side of the rear light guide 34 (FIG. 7B) and further reflected upward on the rear reflecting surface 35m of the rear mirror member 35 (FIG. 7). (B)), it is reflected backward by the imaging unit incident mirror member 70 and forms an image on the right region of the imaging surface 22a of the imaging unit 22 (FIG. 7B). For this reason, when the imaging of the target part 3d is performed by the imaging unit 13, an image of the target part 3d as viewed from above is displayed in the right region of the imaging surface 22a of the imaging unit 22.

  As described above, the image (first image GZ1) of the component 4 as viewed from below is displayed on the left region of the imaging surface 22a of the imaging unit 22 (FIG. 7A), and the right side of the imaging surface 22a. In this area, an image (second image GZ2) of the target site 3d as viewed from above is displayed (FIG. 7B). For this reason, the imaging unit 22 images the component 4 from below through the upper window 13J and simultaneously images the target portion 3d on the substrate 3 from above through the lower window 13K (the above-described imaging step). The image GZ1 and the second image GZ2 can be acquired as one image (master image) in which the images do not overlap (image acquisition process).

  When the imaging unit 22 acquires the first image GZ1 and the second image GZ2 as one image in which the respective images do not overlap as described above, the correction value calculation unit 16a of the control device 16 performs as described above. Based on both the obtained images (first image GZ1 and second image GZ2), a correction value necessary for correcting the position of the component 4 with respect to the substrate 3 is calculated (the above-described correction value calculating step). Specifically, the obtained images (the first image GZ1 and the second image GZ2) are subjected to image processing and compared, and based on the comparison result, both images are misaligned (that is, the component 4 and the target image). The correction value is calculated by calculating the positional deviation from the part 3d. Specifically, the correction value calculation unit 16a corrects from a deviation amount between the component side patterns M11 and M12 shown in the first image GZ1 and the target part side patterns M21 and M22 shown in the second image GZ2. Calculate the value. As described above, in the present embodiment, the first image in which the component 4 is viewed from below through the upper window 13J and the second image in which the target site 3d is viewed from above through the lower window 13K are not overlapped with each other. Since the images are obtained as one image, only one imaging surface 22a is required, and therefore, only one imaging unit 22 is provided.

  When the correction value of the mounting head 12 with respect to the substrate 3 is obtained as described above, the imaging unit moving mechanism 15 causes the imaging unit 13 to extract the tip portion 13B from between the component 4 and the target portion 3d, and then calculates the correction value. Position correction is performed based on the correction value calculated by the unit 16a, and the part 4 and the target part 3d are aligned (the above-described position correction step). Specifically, as described above, the position correction is performed by moving the substrate 3 in the horizontal plane by moving the substrate positioning unit 11 in the front-rear direction and the left-right direction with respect to the positional deviation in the horizontal plane direction. The positional deviation is performed by the mounting head 12 rotating the nozzle portion 12b about the vertical axis. When the alignment (position correction) is completed, as described above, the mounting head 12 lowers the nozzle portion 12b with respect to the head main body 12a, and the component 4 held in the nozzle portion 12b is pressure-bonded (mounted) to the target portion 3d. )

  As described above, in the component mounting apparatus 1 according to the present embodiment, the imaging unit 13 has the distal end portion 13B inserted between the component 4 located at the pre-mounting position and the target site 3d. The distal end portion 13 </ b> B has a first visual field for imaging the component 4 and a second visual field for imaging the component 4. Then, a portion (front upper irradiation guide 61a, front upper irradiation guide 61a) of the illumination light guide 23 that guides the light emitted from the illumination light source 40 to above the upper window 13J and below the lower window 13K. A rear upper irradiation guide 61b, a front lower irradiation guide 62a, a rear lower irradiation guide 62b, a direct upper irradiation guide 63a, a direct lower irradiation guide 64a, a left front reflection mirror 63m and a right front reflection mirror 64m) The vertical dimension of the portion (multiprism 30) provided in the distal end portion 13B of the imaging light guide 24 that guides the light incident from the window 13J and the light incident from the lower window 13K to the imaging unit 22 (imaging unit). Since it arrange | positions so that it may fit in d (FIG. 10 (a)), the vertical direction dimension of the front-end | tip part 13B can be made into a very small thing. For this reason, even when the descending stroke of the component 4 at the time of component mounting is small, the component 4 and the board 3 (target part 3d) can be simultaneously imaged, and highly accurate component mounting is possible.

  Further, in the component mounting apparatus 1 according to the present embodiment, in the imaging unit 13, at least a part of the portion of the illumination light guide path 23 positioned at the distal end portion 13B of the imaging unit 13 (specifically, a rear upper irradiation guide). 61b and rear lower irradiation guide 62b) between the left light guide portion 32 (first horizontal light guide portion) and the right light guide portion 33 (second horizontal light guide portion) constituting the multi prism 30 ( In the housing space 30S), an efficient light guide path arrangement is realized in the narrow space of the distal end portion 13B of the imaging unit 13.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the left light guide portion 32 as the first horizontal light guide portion that guides light incident from the upper window 13J (reflected light from the component 4) in the horizontal direction within the tip portion 13B; The right light guide 33 serving as a second horizontal light guide that guides light incident from the lower window 13K (reflected light from the substrate 3) in the horizontal direction within the tip portion 13B is a part of the multi prism 30. The first horizontal light guide unit and the second horizontal light guide unit are integrally formed. For this reason, the arrangement of the first horizontal light guide and the second horizontal light guide in the casing 20 is easy, but the first horizontal light guide and the second horizontal light guide are not necessarily made of multi-prisms. It does not have to be a part, and may be configured by optical systems independent of each other.

  In the above-described embodiment, each of the directly upper irradiation light guide 53 and the lower irradiation light guide 54 constituting the illumination light guide 23 uses a reflection mirror (a left front reflection mirror 63m and a right front reflection mirror 64m). Alternatively, the light may be guided to the front central reflecting surface 31m by bending the fiber light guide (directly upward irradiation guide 63a, direct downward irradiation guide 64a). Furthermore, in the above-described embodiment, an LED light source is shown as an illumination light source, and a fiber light guide is shown as a means for guiding light from the LED light source. However, an LED light source or a fiber light guide is an illumination light source and its illumination light source. It is only an example of a means for guiding light from the light source, and other means instead of these can be used.

  Provided is a component mounting apparatus capable of performing simultaneous imaging of a component and a board even when the descending stroke of the component during component mounting is small.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Board | substrate 3d Target site | part 4 Component 11 Board | substrate positioning part 12 Mounting head 13 Imaging unit 13B Tip part 13J Upper window 13K Lower window 16a Correction value calculation part 23 Light guide for illumination 24 Light guide for imaging 32 Left light guide (First horizontal light guide)
33 Right light guide (second horizontal light guide)
40 Light source for illumination d Vertical dimension

Claims (3)

A substrate positioning unit for positioning the substrate;
A mounting head for holding a component and mounting the target portion on the substrate positioned by the substrate positioning unit;
An imaging unit that images the component with a first field of view and images the substrate with a second field of view, with the component held by the mounting head positioned at a pre-mounting position above the target site; ,
A correction value calculation unit that calculates a correction value for alignment between the component and the substrate based on an imaging result of the imaging unit;
The imaging unit is
Inserted between the component located at the pre-mounting position and the target portion, a tip having an upper window on which reflected light from the component is incident and a lower window on which reflected light from the substrate is incident,
A light guide for illumination that guides light emitted from a light source for illumination to above the upper window and below the lower window;
An imaging light guide that guides light incident from the upper window and light incident from the lower window to an imaging unit;
The component mounting apparatus, wherein the illumination light guide is disposed so as to be within a vertical dimension of the imaging light guide.   The imaging light guide path includes a first horizontal light guide portion that guides light incident from the upper window in the horizontal direction within the tip portion and a second horizontal guide member that guides light incident from the lower window in the horizontal direction within the tip portion. 2. The light guide for illumination according to claim 1, further comprising a horizontal light guide, wherein the illumination light guide is disposed between the first horizontal light guide and the second horizontal light guide. Component mounting equipment.   The component mounting apparatus according to claim 1, wherein the first horizontal light guide unit and the second horizontal light guide unit are integrally formed.

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