JPH09280824A - Alignment checking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment checking device capable of distinctly discriminating the images of two parts at the time of checking the misalignment between two parts. SOLUTION: This alignment checking device is used to check whether the two parts facing each other are aligned to each other or not. The device includes light sources 73, 74 which are inserted between the two parts and irradiate the two parts with illumination light rays of respectively different colors, a beam splitter 12 for receiving the reflected light of the different colors of the two parts, first optical systems 30, 32, 36, 38, 42 for imaging the reflected light rays from the two parts made incident on the beam splitter 12 to the same position and an image pickup element 44 for receiving the reflected light rays from the two parts imaged at the same position and for forming the image signals superposed with the images of the two parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment confirmation device capable of confirming a relative position and a relative inclination of each other in a step before joining two parts in order to join the two parts in an aligned state. is there.

[0002]

2. Description of the Related Art In the manufacture of LSIs and the like, it is extremely important to precisely align the integrated circuit chip and the pattern substrate when attaching the integrated circuit chip to the pattern substrate or the like. As a device for precisely aligning such an integrated circuit chip and a pattern substrate, for example, a device disclosed in Japanese Patent Laid-Open No. 2-244649 is known.

FIG. 14 is a diagram showing the configuration of the above-mentioned conventional alignment apparatus. This alignment device includes two parts, for example, an optical system for detecting the positions of the integrated circuit chip and the pattern substrate, and an optical system for detecting the relative inclination of these two parts. FIG. 14 is a plan view mainly showing an optical system for position detection, and the reference numeral 102 in the drawing shows illumination light to an integrated circuit chip and a pattern substrate which are objects to be aligned. It is an output / reception prism that emits and receives reflected light. For example, an integrated circuit chip is located on the front side of the paper surface of the emission / reception prism 102, and a pattern substrate is located on the other side.

Illumination light emitted from the light source 104 enters the emitting and receiving prism 102 through the lens system 106 and the triangular prism 108, the optical path of the emitting and receiving prism 102 is bent toward the front side of the drawing, and the integrated circuit chip is irradiated with the light. It The reflected light reflected by the integrated circuit chip follows the path opposite to the illumination light and enters the video camera 110, and the video image signal of the integrated circuit chip is input to the mixer 112.

On the other hand, the illumination light emitted from the light source 114 is made incident on the emitting / receiving prism 102 through the lens system 116 and the triangular prism 118, and the emitting / receiving prism 102 is formed.
As a result, the optical path is bent toward the other side of the paper and the pattern substrate is irradiated with the light. The reflected light reflected by the pattern substrate follows the path opposite to the illumination light and enters the video camera 120,
The video image signal of the pattern board is input to the mixer 112.

In the mixer 112, the image of the integrated circuit chip from the video camera 110 and the image of the pattern substrate from the video camera 120 are mixed, and the mixed image is displayed on the monitor 122. As a result, an image in which the integrated circuit chip and the pattern substrate are superposed on each other can be seen on one monitor screen, and the relative positions of the two can be confirmed at a glance.

FIG. 15 is a diagram mainly showing an optical system for detecting the relative inclination of two components. Reference numeral 132 in the figure denotes an emission / reception prism that emits illumination light and receives reflected light to the integrated circuit chip and the pattern substrate that are the objects for detecting the inclination, and is the same as in the case of FIG. Further, the integrated circuit chip is located on the front side with respect to the paper surface of the emission / reception prism 132 and the pattern substrate is located on the other side.

Illumination light including a crosshair pattern image is emitted from the light source 134, and the illumination light is emitted from the lens system 13.
6 and the triangular prism 138 to emit and receive the prism 13
It is incident on the integrated circuit chip 2, and the output light receiving prism 132 bends the optical path to the front side of the drawing. The reflected light reflected by the integrated circuit chip follows the path opposite to the illumination light and enters the video camera 110, and the video image signal of the cross hair is input to the mixer 112.

On the other hand, from the light source 144, illumination light including another crosshair pattern image is emitted, and this illumination light is incident on the emission / reception prism 132 via the lens system 146 and the triangular prism 148, and this emission / reception is performed. Prism 1
The optical path is bent toward the other side of the paper by 32 and the pattern substrate is irradiated with the light. The reflected light reflected by the pattern substrate is
The video signal of the crosshairs is input to the mixer 112 after being incident on the video camera 120 along the path opposite to the illumination light.

In the mixer 112, the image of one crosshair from the video camera 110 and the image of the other crosshair from the video camera 120 are mixed, and the mixed image is displayed on the monitor 122. As a result, an image in which two crosshairs are overlapped can be seen on one monitor screen, and the relative inclination between the integrated circuit chip and the pattern substrate can be detected by checking the positional shift between the two. You can

With the above-described structure, in the conventional alignment apparatus, it is possible to detect the positional deviation and the relative inclination of the two components arranged to face each other.

[0012]

However, in the above-mentioned conventional example, since the colors of the lights radiated to the two parts are the same, when the images of the two parts are superposed, respectively. There is a problem that it is difficult to distinguish the images and it is difficult to adjust the position.

Further, in the above-mentioned conventional example, since the optical system for detecting the positional deviation between the two components and the optical system for detecting the inclination of the two components are independently provided,
There is a problem that the number of optical components forming the optical system is large and the cost is high. Further, in order to synthesize the images of the two parts, two video cameras and a video mixing means for synthesizing the video signals are required, which also causes the cost of the apparatus to increase.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object thereof is to provide an alignment confirmation device capable of clearly distinguishing images of two parts when confirming a positional deviation between the two parts. Is to provide.

Another object of the present invention is to detect the positional deviation and inclination of two parts,
It is to provide an alignment confirmation device that is low in cost.

[0016]

In order to solve the above-mentioned problems and to achieve the object, the alignment confirmation apparatus of the present invention confirms whether or not two parts facing each other are aligned with each other. An alignment confirmation device for irradiating the two parts, the irradiating means for irradiating the two parts with illumination light of different colors, and the irradiating means of different colors from the two parts. An optical member for receiving the reflected light,
A first optical system for imaging reflected light from the two components incident on the optical member at the same position; and receiving reflected light from the two components imaged at the same position. , And an image sensor for generating an image signal in which the images of the two parts are superimposed.

Further, in the alignment confirmation apparatus according to the present invention, the image signal output from the image pickup device, which is arranged in the first optical system, is obtained by watermarking the two components from the same direction. To this end, an optical prism for inverting one of the reflected lights from the two components is further provided.

Further, in the alignment confirmation apparatus according to the present invention, the irradiating means is provided with a light-emitting body which is arranged in the vicinity of the optical member and emits lights of different colors.

Further, in the alignment confirmation apparatus according to the present invention, the irradiation means includes a light emitter, a second optical system for guiding light from the light emitter to the optical member, the optical member and the two parts. And two filters for extracting light of different wavelengths from the light emitted from the optical member.

Further, in the alignment confirmation apparatus according to the present invention, first and second supports for respectively supporting the two parts, and two reflecting surfaces respectively provided on the surfaces of the supports, A chart having a predetermined pattern formed on a light-transmissive substrate arranged in the second optical system, and illuminating light including image information of the chart from the optical member to the two reflecting surfaces. The chart images reflected by the two reflecting surfaces are imaged on the image pickup device through the first optical system, and the chart images reflected by the two reflecting surfaces are deviated from the first and the second charts, respectively. The feature is that the relative inclination of the surface of the second support can be confirmed.

Further, in the alignment confirmation apparatus according to the present invention, depending on the light shielding means arranged in the first optical system for shielding the reflected light from the two components respectively, and the light shielding state by the light shielding means. And a switching means for switching the display color of the monitor that displays the image signal from the image pickup device.

[0022]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

(First Embodiment) FIGS. 1 and 2 are views showing a basic configuration of a first embodiment of an alignment confirmation apparatus of the present invention. This alignment confirmation device has a function of detecting the positions of two components, for example, an integrated circuit chip and a pattern substrate, and a function of detecting the relative inclination of these two components.

FIG. 1 is a diagram showing a path of light when the positions of two components are detected. Reference numeral 12 in the figure indicates an integrated circuit chip which is an object to be aligned and a pattern. It is an emitting / receiving unit that emits illumination light to the substrate and receives reflected light, and is composed of a mirror cube beam splitter. This beam splitter 12
For example, the integrated circuit chip is located on the front side with respect to the paper surface of, and the pattern substrate is located on the other side. That is, in this alignment confirmation device, as shown in FIG. 3, the beam splitter 12 is integrated into the integrated circuit chip C and the pattern substrate P.
It is inserted between the two parts to detect the relative position and relative inclination of these two parts.

First, the configuration of the alignment confirmation apparatus will be described with reference to FIG.

In FIG. 1, reference numeral 14 is a light source such as a cold light for illuminating the integrated circuit chip C and the pattern substrate P, and the illumination light from the light source 14 is an illumination lens for condensing the illumination light. It is incident on the system 16. The illumination light emitted from the illumination lens system 16 is filtered by the filter 18
Incident on. The filter 18 converts the illumination light into monochromatic light in order to improve the resolution of the images of the integrated circuit chip C and the pattern substrate P, which are the objects of position measurement. The illumination light converted into monochromatic light by the filter 18 passes through a cross hair (cross chart) 20 used for detecting the inclination of the integrated circuit chip C and the pattern substrate P as described later, and enters a collimator lens system 22. To do. In the collimator lens system 22, the illumination light is converted into parallel light, and the parallel light is incident on the half cube beam splitter 24.

The half cube beam splitter 24 is
It has a half mirror surface 24a, and the illumination light is partially transmitted and partially reflected by the half mirror surface 24a. The illumination light transmitted through the half mirror surface 24a is the triangular prism 2
The optical path is bent at a right angle by 8 and enters the half cube beam splitter 30. Further, the light reflected by the half mirror surface 24a is further reflected by the antireflection mirror 26 having a reflectance of about 20%, and again the half mirror surface 2
The illumination light that has entered the light source 4a and has been transmitted therethrough enters the half cube beam splitter 32. Then, this illumination light is reflected by the half mirror surface 32 a of the half cube beam splitter 32, and is imaged on the image pickup element 44 by the image forming lens 42 described later. In this way, the illumination light that enters the image pickup device 44 via the half-cube beam splitter 24, the half-cube beam splitter 32, and the imaging lens 42 is used to directly form the crosshair reference image on the image pickup device 44. It is a thing.

On the other hand, the half cube beam splitter 3
Reference numeral 0 has a half mirror surface 30a, and the illumination light from the triangular prism 28 is partially transmitted and partially reflected by the half mirror surface 30a. The illumination light reflected by the half mirror surface 30a is integrated into the integrated circuit chip C and the pattern substrate P.
Each of the light reflected by is incident on the dummy glass 34 for adjusting the optical path length. The illumination light emitted from the dummy glass 34 has its direction inverted by 180 ° by the triangular prism 36 and enters the mirror cube beam splitter 12.
The mirror cube beam splitter 12 has a reflecting surface 12a so as to reflect light on the front side and the other side with respect to the paper surface (see FIG. 3), and the illumination light from the triangular prism 36 is on the front side of the paper surface. Is reflected on the integrated circuit chip C and is irradiated onto the integrated circuit chip C.

Also, the half cube beam splitter 3
The illumination light transmitted through 0 enters the penta prism 38,
After being reflected by the reflecting surfaces 38 a and 38 b, the light enters the mirror cube beam splitter 12. Penta prism 38
The illumination light from the mirror cube beam splitter 12
Is reflected by the other side of the paper surface and is irradiated onto the pattern substrate P.

In this way, the illumination light from the light source 14 is
The integrated circuit chip C and the pattern substrate P are irradiated respectively.

Of the illumination light thus irradiated, the light reflected by the integrated circuit chip C enters the mirror cube beam splitter 12, is reflected in the direction of the triangular prism 36, and is reflected in the direction of 180 ° by the triangular prism 36. Is inverted and enters the dummy glass 34. The reflected light whose optical path length has been adjusted by the dummy glass 34 enters the half cube beam splitter 30, and the reflected light transmitted through the half mirror surface 30a enters the objective lens 40. Objective lens 40
The reflected light that has passed through is transmitted through the half mirror surface 32a of the half cube beam splitter 32, and the imaging lens 42
An image is formed on the image pickup element 44 by. That is, the image of the integrated circuit chip C is formed on the image pickup element 44.

On the other hand, the reflected light reflected by the pattern substrate P enters the mirror cube beam splitter 12, is reflected in the direction of the penta prism 38, and is reflected by the penta prism 3.
Further reflected by the reflecting surfaces 38b and 38a of No. 8, the image (reflected light) of the pattern substrate P is inverted. Penta prism 3
The reflected light emitted from 8 enters the half cube beam splitter 30, and the reflected light reflected by the half mirror surface 30 a enters the objective lens 40. The reflected light transmitted through the objective lens 40 is reflected by the half cube beam splitter 3
The light passes through the second half mirror surface 32a and is imaged on the image sensor 44 by the imaging lens 42. That is, the image of the pattern substrate P is formed on the image pickup element 44 in a state of overlapping with the image of the integrated circuit chip C. At this time, since the image of the patterned substrate P is inverted by the pentaprism 38, the image of the integrated circuit chip C formed on the image pickup element 44 and the image of the patterned substrate P are as if they were the same. The image looks like it was seen through from the direction. Then, an image signal obtained by photoelectrically converting both images is output from the image pickup device and displayed on the monitor 46.

As shown in FIG. 3, supports 50 and 52 for supporting the integrated circuit chip C and the pattern substrate P are provided, and the surfaces of the supports 50 and 52 are mirror-finished. The image of the cross hair 20 is made to be reflected. The reflected image of the crosshair 20 is also formed on the image pickup element 44, and due to the shift between the crosshair image reflected from the support body 50 and the crosshair image reflected from the support body 52, the surfaces of the support body 50 and the support body 52 are relative to each other. The tilt can be detected. Since the integrated circuit chip C and the pattern substrate P are arranged in close contact with the supports 50 and 52, the support 5
Detecting the relative inclination between 0 and the support 52 substantially corresponds to detecting the relative inclination between the integrated circuit chip C and the pattern substrate P. In addition, the cross hair 20 is shown in FIG.
As shown in, a cross-shaped pattern is formed on the transparent substrate by printing or the like.

Further, shutters 58, 60, 62, 6 for closing each optical path are provided at each part of the optical path of the alignment confirmation device.
4 are provided. The operation of this shutter will be described later.

Next, FIG. 5 is an exploded perspective view of the alignment confirmation device constructed as described above. As shown in FIG. 5, the alignment confirmation device 10 is housed in the cases 70 and 72 and configured as one probe unit. Then, the probe unit-shaped alignment confirmation device 10 is inserted between the integrated circuit chip C and the pattern substrate P to detect the positional deviation between the two. In addition, around the opening 76 of the case 70, for example, red light (wavelength 6
A large number of LEDs 73 emitting 60 nm) are arranged, and the red light from the LEDs 73 illuminates the integrated circuit chip C. Also, the case 72
The green light (wavelength 560
A large number of LEDs 74 that emit light (nm) are arranged, and the pattern substrate P is illuminated with green light from the LEDs 74. The state of this illumination is shown in FIG. The wavelength distribution of the light emitted from the LEDs 73 and 74 is as shown in FIG. 8, and the imaging lens 42 is designed so that the chromatic aberration is minimized at these wavelengths.

Next, the alignment confirmation operation in the alignment confirmation device configured as described above will be described.

First, the integrated circuit chip C and the pattern substrate P
The operation of detecting the positional deviation of will be described.

Here, the alignment confirmation apparatus according to the present embodiment separately views the mode in which the image of the integrated circuit chip C and the image of the pattern substrate P are displayed on the monitor 46 in the same color, and the images of these two parts. Therefore, it has a mode of displaying on the monitor 46 in different colors.

First, the case where the images of two parts are displayed in the same color will be described. When detecting the positional deviation between the integrated circuit chip C and the pattern substrate P, the shutter 58 is closed as shown by the broken line in FIG. 1 so that the illumination image of the crosshair 20 does not directly enter the imaging lens 42. Like This prevents the images of the integrated circuit chip C and the pattern substrate P from being fogged by unnecessary light. In this state, the light source 14 is caused to emit light, and the images of the integrated circuit chip C and the pattern substrate P are formed on the image pickup element 44 along the optical path as described above. At this time, the images of the integrated circuit chip C and the pattern substrate P are displayed on the monitor 46 as if they were viewed from the same direction as already described, so that the positional deviation between the integrated circuit chip C and the pattern substrate P can be easily performed. You can check. FIG. 6 shows this state. In FIG. 6, a triangular member is used instead of the integrated circuit chip as the K
An example is shown in which a chart in which the letters “B” are printed is used, and a chart in which the letters “B” are printed is used instead of the pattern board. As shown in FIG. 6B, the two charts look as if they were viewed from the same direction.

In the operation for confirming the positional deviation between the integrated circuit chip C and the pattern substrate P, if it is necessary to see only one of the images, the shutter 6
It is possible to observe only the integrated circuit chip C or only the pattern substrate P by closing one of 2, 64. If necessary, neither image can be taken.

Next, the case where the image of the integrated circuit chip C and the image of the pattern substrate P are displayed in different colors on the monitor 46 will be described. In this case, the light source 14 is turned off and the images of the integrated circuit chip C and the pattern substrate P are illuminated by the LEDs 73 and 74 provided on the surfaces of the cases 70 and 72. By doing so, the image of the integrated circuit chip C is formed as a red image and the image of the pattern substrate P is formed as a green image on the color image pickup element 44. Therefore, on the monitor 46, the image of the integrated circuit chip C is displayed in red, the image of the pattern substrate P is displayed in green, and the observer can clearly distinguish the two images. Therefore,
The observer can more easily confirm the positional deviation between the integrated circuit chip C and the pattern substrate P.

Next, the integrated circuit chip C and the pattern substrate P
The operation of detecting the inclination of will be described.

When the tilt between the integrated circuit chip C and the pattern substrate P is detected, the shutter 60 is closed as shown in FIG. When the illumination light including the image of the cross hair 20 illuminated by the light source 14 enters the half cube beam splitter 24, a part of the illumination light is reflected by the half mirror surface 2.
It is reflected by 4a and the antireflection mirror 26, and enters the half cube beam splitter 32. This illumination light is transmitted to the half mirror surface 32 of the half cube beam splitter 32.
Reflected by a, the reference image of the cross hair 20 is formed on the image sensor 44.

On the other hand, the half cube beam splitter 2
The illumination light that has passed through 4 illuminates the integrated circuit chip C and the pattern substrate P along the optical path as described above. The irradiation light is reflected by the surfaces of the supports 50 and 52 supporting the integrated circuit chip C and the pattern substrate P, traces the original optical path, and is incident on the half cube beam splitter 24 again.
Then, this reflected light is reflected by the half mirror surface 24 a of the half cube beam splitter 24, and is imaged on the image pickup element 44 via the half cube beam splitter 32 and the imaging lens 42. Therefore, the image of the cross hair reflected by each of the support 50 and the support 52 is formed on the image pickup element 44. By confirming the deviation of these crosshair images on the monitor 46, the relative inclination between the support 50 and the support 52 can be detected. Further, as described above, the image pickup device 44 picks up the reference image of the crosshair 20 directly formed through the half-cube beam splitters 24 and 32 by bypassing the integrated circuit chip C and the pattern substrate P. Therefore, by confirming the deviation between this reference image and the crosshair image reflected by each of the supports 50, 52, the support 50,
It is also possible to detect each individual tilt of 52.

As described above, according to the alignment confirmation apparatus of this embodiment, it is possible to detect the positional deviation and relative inclination of two components, but at the same time, a low-cost alignment confirmation apparatus with a reduced number of components is provided. Provided. Further, since the images of the two parts can be displayed on the monitor in different colors, the images of the two parts can be clearly separated.

(Second Embodiment) In the first embodiment, the LED is used to illuminate the integrated circuit chip C and the pattern substrate P with lights of different colors, but this second embodiment Then, the light source 14 guides the mirror cube beam splitter 12 to the integrated circuit chip C and the pattern substrate P.
An optical filter of a different color is applied to each of the irradiation lights applied to the integrated circuit chip C and the pattern substrate P to illuminate the light with a different color.

Specifically, as shown in FIGS. 9 and 10, a red filter is attached to the opening 76 of the case 70,
A green filter is attached to the opening 78 of the case 72, and the integrated circuit chip C and the pattern substrate P are illuminated with red light (wavelength 660 nm) and green light (wavelength 560 nm). In the case of the second embodiment, since the light from the light source 14 needs to have both wavelength components of 560 nm and 660 nm, the monochromatic filter 18 shown in FIG. 1 of the first embodiment is used. And a light source that emits white light such as a halogen lamp is used. The wavelength distribution of this light source is shown in FIG.

With the above-described structure, also in the second embodiment, the images of the integrated circuit chip C and the pattern substrate P are displayed in different colors on the monitor 46 as in the case of the first embodiment. The observer can clearly distinguish between the two and can easily discriminate the positional deviation.

(Third Embodiment) In the first and second embodiments described above, a color image pickup device is used as the image pickup device 44, but in the third embodiment, a monochrome image pickup device is used.

Specifically, as shown in FIG. 12, shutters 62 and 64 are alternately put in and out of the optical path, and images of the integrated circuit chip C and the pattern substrate P are alternately displayed on the monitor 46. At this time, the shutter 62 is closed to close the shutter 6.
When 4 is opened, the image signal of the image pickup device 44 (black and white in this embodiment) is input to the green signal input terminal of the monitor 46 as shown by the broken line in FIG. In this way, the shutter 62 blocks the reflected light from the integrated circuit chip C, and only the reflected light from the pattern substrate P is imaged on the image sensor 44. Therefore, only the image on the pattern substrate P is monitored 46. It is displayed in green above. On the other hand, when the shutter 64 is closed and the shutter 62 is opened, the image signal of the image sensor 44 is input to the red signal input terminal of the monitor 46 as shown by the solid line in FIG. By doing so, the reflected light from the pattern substrate P is blocked by the shutter 64, and only the reflected light from the integrated circuit chip C is imaged on the image pickup element 44, so that only the image of the integrated circuit chip C is monitored. It is displayed in red on 46.

When only one of the integrated circuit chip C and the pattern substrate P is displayed on the monitor 46 by the above-mentioned operation, both of them can be displayed in different colors even if a monochrome image pickup device is used. it can. Also, the shutters 62 and 6
By repeating the alternating in / out operation of 4 at high speed (for example, at a time interval which is an integral multiple of one field period of the television signal), the observer feels as if the red image of the integrated circuit chip C and the pattern substrate P. Since the green image and the green image appear to be displayed on the monitor 46 at the same time, it is possible to confirm the positional deviation between the two. Further, since the monochrome image pickup device is used, the cost of the device can be reduced.

As described above, according to the above-described embodiment, the two components to be aligned can be displayed on the monitor in different colors, so that the displacement of the two components can be more clearly defined. Can be observed.

The present invention can be applied to a modified or modified version of the above embodiment without departing from the spirit of the invention.

For example, in the above embodiment, the case where the positional shift and the relative tilt between the integrated circuit chip and the pattern substrate are detected has been described, but the device of the present invention is not limited to this, and two devices facing each other may be used. As long as the relative positions of the inner surfaces of the components are detected, the invention can be applied to any type.

Further, although red and green have been described as examples of the illumination lights of different colors, the present invention is not limited to this, and it goes without saying that other colors may be used as long as they are clearly distinguishable by visual observation. .

Further, in the above description, the LED is used as the illumination light source, but other kinds of light emitters may be used.

[0057]

As described above, according to the alignment confirmation apparatus of the present invention, the components to be aligned can be displayed in different colors on the monitor, so that the displacement of the two components can be observed more clearly. can do.

By forming the reflection images of the two parts at the same position, the optical system can be simplified and the number of parts of the optical parts can be reduced, and only one image pickup element is required. Since no means for synthesizing the video signals is required, the cost of the device can be reduced.

Further, since the prism for inverting one of the images of the two parts is provided, the finally obtained video image is in a state as if the two parts were seen through. The visibility of the positional deviation between the two parts is significantly improved.

Furthermore, since the optical system for detecting the positional deviation between the two parts and the optical system for detecting the inclination are common, the number of parts can be further reduced.

[0061]

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an embodiment of an alignment confirmation device of the present invention.

FIG. 2 is a diagram showing a configuration of an embodiment of an alignment confirmation device of the present invention.

FIG. 3 is a view showing a state in which an alignment confirmation device is inserted between two parts.

FIG. 4 is a diagram showing a pattern of cross hairs.

FIG. 5 is an exploded perspective view of the alignment confirmation device according to the first embodiment.

FIG. 6 is a diagram showing how two parts are viewed when observed by an alignment confirmation device.

FIG. 7 is a diagram showing a state in which two parts are illuminated with illuminations of different colors.

FIG. 8 is a diagram showing wavelength distributions of illumination lights of different colors.

FIG. 9 is an exploded perspective view of an alignment confirmation device according to a second embodiment.

FIG. 10 is a diagram showing an arrangement of optical filters of different colors.

FIG. 11 is a diagram showing wavelength distributions of illumination lights of different colors.

FIG. 12 is a diagram showing a state in which images of two components are switched by a shutter.

FIG. 13 is a diagram showing switching of monitors according to the movement of the shutter.

FIG. 14 is a diagram showing a conventional example.

FIG. 15 is a diagram showing a conventional example.

[Explanation of symbols]

 12 mirror cube beam splitter 14 light source 16 illumination lens system 18 filter 20 crosshair 22 collimating lens 24 half cube beam splitter 28 triangular prism 30, 32 half cube beam splitter 34 dummy glass 36 triangular prism 38 pentaprism 40 objective lens 42 imaging lens 44 Image sensor 46 Monitor 50,52 Support 54,56 Illumination 58,60,62,64 Shutter 70,72 Case 73,74 LED 76,78 Opening 80,82 Optical filter

Claims (6)

[Claims] 1. An alignment confirmation device for confirming whether two parts facing each other are aligned with each other, wherein the alignment verification device is inserted between the two parts, and the two parts are respectively inserted into the two parts. Irradiating means for irradiating illumination light of different colors, an optical member for receiving reflected light of different colors from the two parts, and reflected light from the two parts incident on the optical member. A first optical system for forming an image at the same position, and receiving reflected light from the two parts formed at the same position to generate an image signal in which the images of the two parts are superimposed. An alignment confirmation device, comprising: 2. In order to make an image signal output from the image pickup device, which is arranged in the first optical system, look as if the two components were viewed from the same direction, the two components are separated from each other. The alignment confirmation apparatus according to claim 1, further comprising an optical prism for inverting one of the reflected lights of the above. 3. The alignment confirmation apparatus according to claim 1, wherein the irradiation unit includes a light-emitting body which is arranged in the vicinity of the optical member and emits light of different colors. 4. The irradiation means is arranged between the optical member and the two parts, a light emitting body, a second optical system for guiding light from the light emitting body to the optical member, and the optical member. Extracts light of different wavelengths from the light emitted from 2
The alignment confirmation apparatus according to claim 1, further comprising one filter. 5. A first and a second support for respectively supporting the two components, two reflecting surfaces respectively provided on the surface of the support, and an arrangement in the second optical system. And a chart having a predetermined pattern formed on a light-transmissive substrate, and illuminating the two reflection surfaces from the optical member with illumination light including information of an image of the chart, and the two reflection surfaces. The chart image reflected from the first optical system is imaged on the image pickup device, and the relative deviation of the surfaces of the first and second supports from the deviation of the chart images reflected by the two reflecting surfaces. 5. The alignment confirmation device according to claim 4, wherein a proper inclination can be confirmed. 6. The second optical system is arranged in the first optical system,
It further comprises light-shielding means for respectively shielding the reflected light from the one component, and switching means for switching the display color of the monitor for displaying the image signal from the image pickup device according to the light-shielding state by the light-shielding means. The alignment confirmation device according to claim 1.